TWI534439B - Electronic components testing and classification equipment - Google Patents
Electronic components testing and classification equipment Download PDFInfo
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- TWI534439B TWI534439B TW104103261A TW104103261A TWI534439B TW I534439 B TWI534439 B TW I534439B TW 104103261 A TW104103261 A TW 104103261A TW 104103261 A TW104103261 A TW 104103261A TW I534439 B TWI534439 B TW I534439B
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Description
本發明尤指其提供一種利用電子元件電性接點朝上移載及測試的方式，以有效簡化輸送路徑，並達到有效降低設備成本及提升測試產能之電子元件測試分類設備。 In particular, the present invention provides an electronic component test and classification device that utilizes an electrical contact of an electronic component to move up and test upwards to effectively simplify the transport path and achieve an effective reduction in equipment cost and test throughput.
按，現今科技在不斷研發與創新下，以往必需由許多大型電子電路結合才能完成之工作已完全由積體電路(integrated circuit，簡稱IC)所取代，由於IC在生產過程中乃經過多道的加工程序，因此為了確保產品品質，業者於IC製作完成後，均會進行電路測試作業，以檢測出IC於製作過程中，是否遭受損壞，進而檢測出不良品。 According to the current research and development and innovation, the work that must be completed by many large-scale electronic circuits has been completely replaced by integrated circuits (ICs), because ICs are multi-channel in the production process. In order to ensure the quality of the product, the manufacturer will perform a circuit test after the IC is completed to detect whether the IC has been damaged during the manufacturing process and detect the defective product.
請參閱第1圖，其係為本申請人先前申請之台灣發明第I 468329號『電子元件拾料單元及其應用之測試設備』專利案，其測試設備係於機台10上配置有供料裝置11、收料裝置12、測試裝置13及輸送裝置14，該供料裝置11係容納複數個電性接點朝下之待測電子元件，收料裝置12係容納複數個不同等級之完測電子元件，測試裝置13係設於測試區的下方，以對電性接點朝下之電子元件執行測試作業，該輸送裝置14係設有一可作X-Y-Z三軸向移動之入料移載臂141及出料移載臂142，以分別於上方移載供料裝置11之待測電子元件以及將完測電子元件移載至收料裝置12分類放置，另於測試裝置13的二惻分別設有Y-Z二軸向移動之第一下壓臂143及第二下壓臂144，以分別將待測電子元件移入測試裝置 13，並下壓執行測試作業，為了使入料移載臂141上電性接點朝下之待測電子元件可轉交給第一下壓臂143或第二下壓臂144移入至測試裝置13，輸送裝置14另設有第一入料載台145及第二入料載台146，而供入料移載臂141自上方置入待測電子元件後，第一入料載台145及第二入料載台146再分別作X軸向移動至第一下壓臂143及第二下壓臂144的側方，第一下壓臂143及第二下壓臂144接著分別作Y-Z二軸向移動，而可分別自上方將第一入料載台145及第二入料載台146上的待測電子元件取出並移入至測試裝置13下壓執行測試作業；另為了使第一下壓臂143及第二下壓臂144上電性接點朝下之完測電子元件可轉交給出料移載臂142移載至收料裝置12分類放置，輸送裝置14另設有第一出料載台147及第二出料載台148，而於第一出料載台147及第二出料載台148分別作X軸向移動至第一下壓臂143及第二下壓臂144的側方後，供第一下壓臂143及第二下壓臂144自上方置入完測電子元件，第一出料載台147及第二出料載台148再分別作X軸向移動，以供出料移載臂142自上方將第一出料載台147及第二出料載台148上的完測電子元件移載至收料裝置12分類放置。該設計由於入料移載臂141、第一下壓臂143、第二下壓臂144及出料移載臂142都是自上方吸取移載電子元件，因此當入料移載臂141上的待測電子元件要轉交給第一下壓臂143或第二下壓臂144移入測試裝置13時，或者是第一下壓臂143或第二下壓臂144上的完測電子元件要轉交給出料移載臂142移載至收料裝置12時，都必須透過第一入料載台145及第二入料載台146，或者是第一出料載台147及第二出料載台148所提供轉乘的作用，才能作電子元件的交換移載；然而，由於該輸送裝置14必須設有第一入料載台145、第二入料載台146、 第一出料載台147及第二出料載台148，因此出現以下的問題： Please refer to FIG. 1 , which is a patent application of Taiwan Invention No. I 468329 "Testing device for electronic component picking unit and its application" which is previously applied by the applicant. The test equipment is provided on the machine 10 with a feeding device. The device 11 , the receiving device 12 , the testing device 13 and the conveying device 14 , the feeding device 11 is configured to accommodate a plurality of electronic components to be tested with the electrical contacts facing downward, and the receiving device 12 is configured to accommodate a plurality of different levels of testing. The electronic component, the test device 13 is disposed under the test area to perform a test operation on the electronic component with the electrical contact downward, and the transport device 14 is provided with a feed transfer arm 141 capable of XYZ triaxial movement. And the discharging transfer arm 142 is configured to respectively transfer the electronic components to be tested of the feeding device 11 and transfer the completed electronic components to the receiving device 12, and separately set on the two sides of the testing device 13 YZ two axially moving first lower pressing arm 143 and second lower pressing arm 144 to respectively move the electronic component to be tested into the testing device And performing the test operation under pressure, in order to make the electronic component to be tested with the electrical contact point of the feed transfer arm 141 facing down, the electronic component to be tested can be transferred to the first lower pressing arm 143 or the second lower pressing arm 144 to be moved to the testing device 13 . The conveying device 14 is further provided with a first feeding stage 145 and a second feeding stage 146, and after the feeding transfer arm 141 is placed into the electronic component to be tested from above, the first loading stage 145 and the The two loading stages 146 are further moved X-axis to the side of the first lower pressing arm 143 and the second lower pressing arm 144, respectively, and the first lower pressing arm 143 and the second lower pressing arm 144 are respectively used as the YZ two-axis. Moving forward, the electronic components to be tested on the first loading stage 145 and the second loading stage 146 can be taken out from above and moved into the testing device 13 to perform the testing operation; and in order to make the first pressing The arm 143 and the second lower pressing arm 144 are electrically connected to the lower end of the measuring electronic component and can be transferred to the material transfer arm 142 for transfer to the receiving device 12 for sorting. The conveying device 14 is further provided with the first discharging. The stage 147 and the second discharge stage 148 are moved to the first lower pressure arm 143 and the first discharge stage 147 and the second discharge stage 148, respectively. After the side of the lower pressing arm 144, the first lower pressing arm 143 and the second lower pressing arm 144 are placed into the measuring electronic component from above, and the first discharging stage 147 and the second discharging stage 148 are separately made. The X moves axially for the discharge transfer arm 142 to transfer the finished electronic components on the first discharge stage 147 and the second discharge stage 148 to the receiving device 12 for sorting from above. In this design, since the loading transfer arm 141, the first lower pressing arm 143, the second lower pressing arm 144, and the discharging transfer arm 142 are all sucking the transfer electronic components from above, when the feeding transfer arm 141 is When the electronic component to be tested is transferred to the first lower pressing arm 143 or the second lower pressing arm 144 is moved into the testing device 13, or the completed electronic component on the first lower pressing arm 143 or the second lower pressing arm 144 is transferred to When the discharge transfer arm 142 is transferred to the receiving device 12, it must pass through the first loading stage 145 and the second feeding stage 146, or the first discharging stage 147 and the second discharging stage. The effect of the transfer provided by 148 can be used for the exchange transfer of electronic components; however, since the transport device 14 must be provided with a first loading stage 145, a second loading stage 146, The first discharge stage 147 and the second discharge stage 148 thus cause the following problems:
1．機構及輸送路徑較為複雜：該輸送裝置14由於必須設有可作X軸向移動的第一入料載台145、第二入料載台146、第一出料載台147及第二出料載台148，因此不僅機構較為複雜，且必須透過第一入料載台145、第二入料載台146、第一出料載台147及第二出料載台148作X軸向移動的移載，而增加輸送路徑的複雜度，而影響設備的成本。 1. The mechanism and the conveying path are complicated: the conveying device 14 must have a first loading stage 145, a second feeding stage 146, a first discharging stage 147 and a second discharging which can be moved in the X-axis direction. The stage 148 is not only complicated, but must be X-axis moved through the first loading stage 145, the second loading stage 146, the first discharging stage 147 and the second discharging stage 148. Transferring increases the complexity of the transport path and affects the cost of the equipment.
2．交換移載的次數及時間較多：該輸送裝置14之入料移載臂141由於必須透過第一入料載台145及第二入料載台146的移載，才能將待測電子元件轉交給第一下壓臂143或第二下壓臂144移入測試裝置13，以及第一下壓臂143及第二下壓臂144必須透過第一出料載台147或第二出料載台148的移載，才能將完測電子元件轉交給出料移載臂142移載至收料裝置12，因此不僅交換移載的次數較多，且造成交換移載的時間過長，而影響測試的產能。 2. The number of exchanges and the time of the transfer are large: the feed transfer arm 141 of the transport device 14 must be transferred through the first loading stage 145 and the second loading stage 146 to transfer the electronic component to be tested. The first lower pressing arm 143 or the second lower pressing arm 144 is moved into the testing device 13, and the first lower pressing arm 143 and the second lower pressing arm 144 must pass through the first discharging stage 147 or the second discharging stage 148. The transfer can be carried out to transfer the finished electronic component to the material transfer arm 142 to the receiving device 12, so that not only the number of exchanges is more frequent, but also the exchange transfer time is too long, which affects the test. Capacity.
有鑑於此，本發明人遂以其多年從事相關行業的研發與製作經驗，針對目前所面臨之問題深入研究，經過長期努力之研究與試作，終究研創出一種不僅可有效降低設備成本，且可有效提升測試產能之測試分類設備，以有效改善先前技術之缺點，此即為本發明之設計宗旨。 In view of this, the inventor has been engaged in research and development and production experience of related industries for many years, and has conducted in-depth research on the problems currently faced. After long-term efforts and trials, the inventors have finally developed a kind of not only effective reduction of equipment costs, but also The test classification equipment that effectively improves the test capacity to effectively improve the shortcomings of the prior art is the design tenet of the present invention.
本發明之目的一，係提供一種電子元件測試分類設備，其係利用入料移載臂自上方將供料裝置處電性接點朝上之電子元件交換移載至位於第一交換區之測試移載臂，該測試移載臂自下方承載電子元件並移載至測試區，將電子元件以電性接點朝上的方式與設於測試區上方之測試裝置電性連接並執行測試作業，於完測後再將電子 元件移載至第二交換區，由出料移載臂自上方將電子元件交換移載至收料裝置，並執行分類作業；藉此，利用電子元件電性接點朝上移載及測試的方式，即可不須設置提供轉乘作用的入料載台及出料載台，進而可有效簡化機構及輸送路徑，達到有效降低設備成本之實用效益。 A first object of the present invention is to provide an electronic component test and sorting device, which utilizes a loading transfer arm to transfer and transfer electronic components of an electrical contact point upward from a feeding device to a test located in a first exchange area. a transfer arm, the test transfer arm carries the electronic component from below and is transferred to the test area, and electrically connects the electronic component to the test device disposed above the test area with the electrical contact point upward, and performs a test operation, After the test, the electronics will be The component is transferred to the second exchange area, and the electronic component exchange is transferred from the upper to the receiving device by the discharging transfer arm, and the sorting operation is performed; thereby, the electrical contact of the electronic component is transferred upward and tested. In this way, it is not necessary to provide a loading stage and a discharging stage for providing a transfer function, thereby effectively simplifying the mechanism and the conveying path, and achieving the practical benefit of effectively reducing the equipment cost.
本發明之目的二，係提供一種電子元件測試分類設備，其係利用入料移載臂自上方將供料裝置處電性接點朝上之電子元件移載至位於第一交換區之測試移載臂，該測試移載臂自下方承載電子元件並移載至測試區，將電子元件以電性接點朝上的方式與設於測試區上方之測試裝置電性連接並執行測試作業，於完測後再將電子元件移載至第二交換區，由出料移載臂自上方將電子元件交換移載至收料裝置，並執行分類作業；藉此，利用電子元件電性接點朝上移載及測試的方式，即可不須透過入料載台及出料載台所提供轉乘作用，進而可有效簡化交換移載的次數及縮減交換移載的時間，達到有效提升測試產能之實用效益。 A second object of the present invention is to provide an electronic component test and classification device, which utilizes a loading transfer arm to transfer an electronic component with an electrical contact point upward from a feeding device to a test shift located in a first exchange area from above. The load carrying arm carries the electronic component from below and is transferred to the test area, and electrically connects the electronic component to the test device disposed above the test area with the electrical contact point upward and performs the test operation. After the measurement is completed, the electronic component is transferred to the second exchange area, and the electronic component exchange is transferred from the upper to the receiving device by the discharging transfer arm, and the sorting operation is performed; thereby, the electrical contact of the electronic component is used The method of transferring and testing can eliminate the need for the transfer function provided by the loading stage and the discharge stage, thereby simplifying the number of exchange transfer times and reducing the time of exchange transfer, and effectively improving the test capacity. benefit.
習知部份： Conventional part:
10‧‧‧機台 10‧‧‧ machine
11‧‧‧供料裝置 11‧‧‧Feeding device
12‧‧‧收料裝置 12‧‧‧ Receiving device
13‧‧‧測試裝置 13‧‧‧Testing device
14‧‧‧輸送裝置 14‧‧‧Conveyor
141‧‧‧入料移載臂 141‧‧‧Feed transfer arm
142‧‧‧出料移載臂 142‧‧‧Drawing transfer arm
143‧‧‧第一下壓臂 143‧‧‧First lower arm
144‧‧‧第二下壓臂 144‧‧‧Second lower arm
145‧‧‧第一入料載台 145‧‧‧First feeding platform
146‧‧‧第二入料載台 146‧‧‧Second feeding platform
147‧‧‧第一出料載台 147‧‧‧First discharge stage
148‧‧‧第二出料載台 148‧‧‧Second discharge platform
本發明部份： Part of the invention:
20‧‧‧機台 20‧‧‧ machine
21‧‧‧供料裝置 21‧‧‧Feeding device
22‧‧‧收料裝置 22‧‧‧Receiving device
23‧‧‧測試裝置 23‧‧‧Testing device
231‧‧‧測試板 231‧‧‧Test board
232‧‧‧探針 232‧‧‧ probe
24‧‧‧空盤裝置 24‧‧‧ empty disk device
241‧‧‧移盤器 241‧‧‧Shifter
25‧‧‧輸送裝置 25‧‧‧Conveyor
251‧‧‧入料移載臂 251‧‧‧Feeding transfer arm
2511‧‧‧第一取放吸嘴 2511‧‧‧First pick and place nozzle
252‧‧‧出料移載臂 252‧‧‧Drawing transfer arm
2521‧‧‧第二取放吸嘴 2521‧‧‧Second pick and place nozzle
253‧‧‧第一測試移載臂 253‧‧‧First test transfer arm
2531‧‧‧第一承座 2531‧‧‧first seat
254‧‧‧第二測試移載臂 254‧‧‧Second test transfer arm
2541‧‧‧第二承座 2541‧‧‧Second seat
26‧‧‧對位裝置 26‧‧‧ Alignment device
261‧‧‧容置孔 261‧‧‧ accommodating holes
262‧‧‧推移件 262‧‧‧Pushing pieces
30‧‧‧測試區 30‧‧‧Test area
31‧‧‧第一交換區 31‧‧‧First exchange area
32‧‧‧第二交換區 32‧‧‧Second exchange area
33‧‧‧第三交換區 33‧‧‧ Third exchange area
34‧‧‧第四交換區 34‧‧‧ fourth exchange area
40‧‧‧電子元件 40‧‧‧Electronic components
第1圖：台灣發明第I 468329號專利案之測試設備的示意圖。 Figure 1: Schematic diagram of the test equipment of Taiwan Patent No. I 468329.
第2圖：本發明第一實施例之架構示意圖。 Figure 2 is a block diagram showing the structure of the first embodiment of the present invention.
第3圖：本發明第一實施例之作動示意圖(一)。 Fig. 3 is a schematic view (1) of the operation of the first embodiment of the present invention.
第4圖：本發明第一實施例之作動示意圖(二)。 Fig. 4 is a schematic view showing the operation of the first embodiment of the present invention (2).
第5圖：第4圖之部分側視示意圖。 Figure 5: A side view of a portion of Figure 4.
第6圖：本發明第一實施例之作動示意圖(三)。 Figure 6 is a schematic view (3) of the operation of the first embodiment of the present invention.
第7圖：第6圖之部分側視示意圖。 Figure 7: A side view of a portion of Figure 6.
第8圖：本發明第一實施例之作動示意圖(四)。 Fig. 8 is a schematic view showing the operation of the first embodiment of the present invention (4).
第9圖：第8圖之部分側視示意圖。 Figure 9: A side view of a portion of Figure 8.
第10圖：本發明第一實施例之作動示意圖(五)。 Fig. 10 is a schematic view showing the operation of the first embodiment of the present invention (5).
第11圖：第10圖之部分側視示意圖。 Figure 11: A side view of a portion of Figure 10.
第12圖：本發明第一實施例之作動示意圖(六)。 Fig. 12 is a schematic view showing the operation of the first embodiment of the present invention (6).
第13圖：本發明第二實施例之架構示意圖。 Figure 13 is a block diagram showing the structure of a second embodiment of the present invention.
第14圖：本發明第二實施例之作動示意圖(一)。 Figure 14 is a schematic view (1) of the operation of the second embodiment of the present invention.
第15圖：本發明第二實施例之作動示意圖(二)。 Figure 15 is a schematic view showing the operation of the second embodiment of the present invention (2).
第16圖：第15圖之部分側視示意圖。 Figure 16: A partial side view of Figure 15.
第17圖：本發明第二實施例之作動示意圖(三)。 Figure 17 is a schematic view showing the operation of the second embodiment of the present invention (3).
第18圖：第17圖之部分側視示意圖。 Figure 18: A side view of a portion of Figure 17.
第19圖：本發明第二實施例之作動示意圖(四)。 Figure 19 is a schematic view showing the operation of the second embodiment of the present invention (4).
第20圖：第19圖之部分側視示意圖。 Figure 20: A side view of a portion of Figure 19.
第21圖：本發明第二實施例之作動示意圖(五)。 Figure 21 is a schematic view showing the operation of the second embodiment of the present invention (5).
第22圖：第21圖之部分側視示意圖。 Figure 22: A side view of a portion of Figure 21.
第23圖：本發明第二實施例之作動示意圖(六)。 Figure 23 is a schematic view showing the operation of the second embodiment of the present invention (6).
第24圖：本發明第二實施例之作動示意圖(七)。 Figure 24 is a schematic view showing the operation of the second embodiment of the present invention (7).
第25圖：第24圖之部分側視示意圖。 Figure 25: A partial side view of Figure 24.
為使 貴審查委員對本發明作更進一步之瞭解，茲舉較佳實施例並配合圖式，詳述如后：請參閱第2圖，本發明第一實施例之測試分類設備，其係於機台20上配置有供料裝置21、收料裝置22、測試裝置23、空盤裝置24、輸送裝置25及對位裝置26，另以區域空間而言，該機台20設有測試區30、位於測試區30第一側之第一交換區31，以及位於測試區30第二側之第二交換區32，該供料裝置21係容納複數個電性接點朝上之待測電子元件，收料裝置22係容納複數個不同等級之完測電子元件，測試裝置23係架設於機台20 之測試區30的上方，主要設有測試板231及複數個探針232，以對電性接點朝上之電子元件執行測試作業，該空盤裝置24係供收納複數個空料盤，並利用移盤器241將供料裝置21上的空料盤移載至該空盤裝置24收納，或將空盤裝置24上的空料盤移載至收料裝置22，該輸送裝置25係設有至少一入料移載臂251、至少一出料移載臂252及至少一測試移載臂，於本實施例中，該輸送裝置25係設有第一測試移載臂253及第二測試移載臂254，該入料移載臂251係設有至少一第一取放吸嘴2511，並可自上方作X-Y-Z三軸向移動，將供料裝置21處電性接點朝上之待測電子元件移載至位於測試區30第一側之第一交換區31處，該第一測試移載臂253及第二測試移載臂254係分別設有至少一取放吸嘴或承座，於本實施例中，該第一測試移載臂253及第二測試移載臂254係分別設有至少一第一承座2531及第二承座2541，該第一測試移載臂253及第二測試移載臂254可分別自下方承載電子元件，並作X-Y-Z三軸向移動於第一交換區31、測試區30以及位於測試區30第二側之第二交換區32，而於第一交換區31位置自下方承載來自入料移載臂251之待測電子元件，並將待測電子元件移載至測試區30，使待測電子元件以電性接點朝上的方式與測試裝置23之探針232電性連接並執行測試作業，於完成測試測後，再將完測電子元件移載至第二交換區32處，該出料移載臂252係設有至少一第二取放吸嘴2521，並可自上方作X-Y-Z三軸向移動，將第一測試移載臂253或第二測試移載臂254上的完測電子元件交換移載至收料裝置22，並執行分類作業；另由於供料裝置21處之待測電子元件是有可能無法準確承置於料盤內的位置上，而使入料移載臂251之第一取放吸嘴2511在吸取待測電子元件時，該待測電子元件無法準確的定位於第一取放吸嘴2511上，因此於機 台20上可以設有一對位裝置26，該對位裝置26係設有複數個容置孔261，並於各容置孔261的一側設有推移件262，該入料移載臂251於供料裝置21處吸取待測電子元件後，係可先將該待測電子元件移載至對位裝置26之容置孔261處，並以第一取放吸嘴2511保持吸附待測電子元件的狀態下，由各推移件262單側頂推待測電子元件，使各待測電子元件移動抵靠於各容置孔261的另一側，而使各待測電子元件準確對位於第一取放吸嘴2511上，再繼續由入料移載臂251將對位後的待測電子元件移載至第一交換區31處，即可準確的進行後續的測試作業。 In order to make the present invention more fully understood by the reviewing committee, the preferred embodiment and the drawings are described in detail as follows: Please refer to FIG. 2, the test classification device of the first embodiment of the present invention is attached to the machine. The table 20 is provided with a feeding device 21, a receiving device 22, a testing device 23, an empty disk device 24, a conveying device 25 and a positioning device 26, and in addition to the regional space, the machine 20 is provided with a test area 30, a first exchange area 31 on the first side of the test area 30, and a second exchange area 32 on the second side of the test area 30. The supply unit 21 accommodates a plurality of electronic components to be tested with the electrical contacts facing upward. The receiving device 22 is configured to accommodate a plurality of different levels of the completed electronic components, and the testing device 23 is mounted on the machine 20 Above the test area 30, a test board 231 and a plurality of probes 232 are mainly provided to perform a test operation on the electronic components with the electrical contacts facing upwards, and the empty disc device 24 is for storing a plurality of empty trays, and The empty tray on the feeding device 21 is transferred to the empty tray device 24 by the tray 241, or the empty tray on the empty tray device 24 is transferred to the receiving device 22, and the conveying device 25 is provided. There are at least one loading transfer arm 251, at least one discharge transfer arm 252 and at least one test transfer arm. In this embodiment, the conveying device 25 is provided with a first test transfer arm 253 and a second test. The transfer arm 254 is provided with at least one first pick-and-place nozzle 2511, and can perform XYZ three-axis movement from above, and the electrical contact point of the feeding device 21 is upward. The electronic component is transferred to the first exchange area 31 on the first side of the test area 30. The first test transfer arm 253 and the second test transfer arm 254 are respectively provided with at least one pick-and-place nozzle or socket. In this embodiment, the first test transfer arm 253 and the second test transfer arm 254 are respectively provided with at least one first socket 2531 and a second The first test transfer arm 253 and the second test transfer arm 254 can respectively carry electronic components from below, and perform XYZ triaxial movement on the first exchange area 31, the test area 30, and the test area 30. The second exchange area 32 on the two sides, and the electronic component to be tested from the loading transfer arm 251 is carried from below at the position of the first exchange area 31, and the electronic component to be tested is transferred to the test area 30, so that the electronic device to be tested The component is electrically connected to the probe 232 of the testing device 23 in an electrical contact point upward manner and performs a test operation. After the test is completed, the completed electronic component is transferred to the second exchange area 32. The material transfer arm 252 is provided with at least one second pick-and-place nozzle 2521, and can perform XYZ three-axis movement from above, and the completed test electrons on the first test transfer arm 253 or the second test transfer arm 254 The component exchange is transferred to the receiving device 22, and the sorting operation is performed; and because the electronic component to be tested at the feeding device 21 is likely to be accurately placed in the position of the tray, the loading transfer arm 251 is caused. The first pick-and-place nozzle 2511 is the electronic component to be tested when the electronic component to be tested is sucked Cannot be accurately positioned on the first pick-and-place nozzle 2511, so the machine A plurality of receiving holes 261 are disposed on the table 20, and a plurality of receiving holes 261 are disposed on one side of the receiving holes 261, and a loading member 262 is disposed on one side of each of the receiving holes 261. After the electronic component to be tested is sucked from the feeding device 21, the electronic component to be tested can be transferred to the receiving hole 261 of the alignment device 26, and the electronic component to be tested is held by the first pick-and-place nozzle 2511. In each state, the electronic components to be tested are pushed by one side of each of the pushing members 262, so that the electronic components to be tested are moved against the other side of each of the receiving holes 261, so that the electronic components to be tested are accurately positioned first. After the nozzle 2511 is taken up and lowered, and the electronic component to be tested after the alignment is transferred to the first exchange area 31 by the loading transfer arm 251, the subsequent testing operation can be accurately performed.
請參閱第3圖，本發明之測試分類設備其開始作動時，其第一測試移載臂253及第二測試移載臂254係分別位於第一交換區31及第二交換區32，而入料移載臂251則於供料裝置21處自上方吸取電性接點朝上之待測電子元件40。 Referring to FIG. 3, when the test classification device of the present invention starts to operate, the first test transfer arm 253 and the second test transfer arm 254 are located in the first exchange area 31 and the second exchange area 32, respectively. The material transfer arm 251 sucks the electronic component 40 to be tested with the electrical contact point upward from the feeding device 21 at the feeding device 21.
請參閱第4、5圖，接著入料移載臂251將電性接點朝上之待測電子元件40移載至對位裝置26之容置孔261處，並以保持吸附待測電子元件的狀態下，由各推移件262單側頂推待測電子元件40，使各待測電子元件40移動抵靠於各容置孔261的另一側，而使各待測電子元件40準確對位於入料移載臂251之第一取放吸嘴2511上。 Referring to FIG. 4 and FIG. 5 , the loading transfer arm 251 then transfers the electronic component 40 with the electrical contact point upward to the receiving hole 261 of the alignment device 26 to keep the electronic component to be tested. The electronic component 40 to be tested is pushed by the pusher 262 on one side, and the electronic component 40 to be tested is moved against the other side of each of the receiving holes 261, so that the electronic components 40 to be tested are accurately aligned. It is located on the first pick-and-place nozzle 2511 of the loading transfer arm 251.
請參閱第5、6圖，接著入料移載臂251將電性接點朝上之待測電子元件40移載至第一交換區31處，由於第一測試移載臂253位於該第一交換區31處，因此第一測試移載臂253上之第一承座2531可自下方承載來自入料移載臂251之待測電子元件40，並使待測電子元件40保持電性接點朝上的方向。 Referring to FIGS. 5 and 6, the loading transfer arm 251 then transfers the electronic component 40 with the electrical contact point upward to the first exchange area 31, since the first test transfer arm 253 is located at the first At the exchange area 31, the first socket 2531 on the first test transfer arm 253 can carry the electronic component 40 to be tested from the load transfer arm 251 from below, and maintain the electronic component 40 to be tested. Upward direction.
請參閱第8、9圖，接著第一測試移載臂253將待測電子元件40移載至測試區30，並頂升使待測電子元件40以電性 接點朝上的方式與測試裝置23之探針232電性連接並執行測試作業。在第一測試移載臂253將待測電子元件40移載至測試區30的同時，入料移載臂251將會再移動至供料裝置21處，自上方吸取下一批次電性接點朝上之待測電子元件40，而位於第二交換區32之第二測試移載臂254則會移動至第一交換區31處，承載由入料移載臂251移載之下一批次電性接點朝上的待測電子元件40。 Referring to FIGS. 8 and 9, the first test transfer arm 253 transfers the electronic component 40 to be tested to the test area 30, and lifts up to make the electronic component 40 to be tested electrically. The probes 232 of the test device 23 are electrically connected in a contact-up manner and perform a test operation. While the first test transfer arm 253 transfers the electronic component 40 to be tested to the test area 30, the feed transfer arm 251 will move to the feeding device 21 again, and the next batch of electrical connections are taken from above. The electronic component 40 to be tested is turned up, and the second test transfer arm 254 located in the second exchange area 32 is moved to the first exchange area 31, and the load is transferred by the loading transfer arm 251. The electronic component 40 to be tested with the secondary electrical contact facing upward.
請參閱第10、11圖，第一測試移載臂253上之電子元件40完成測試測後，第一測試移載臂253會將完測電子元件40移載至第二交換區32處，而出料移載臂252則移動至第二交換區32處，並自上方吸取第一測試移載臂253上之完測電子元件40。在此同時，第二測試移載臂254於承載下一批次電性接點朝上之待測電子元件40後，將會移載至測試區30，並頂升使該批次之待測電子元件40以電性接點朝上的方式與測試裝置23之探針232電性連接並執行測試作業。 Referring to FIGS. 10 and 11, after the electronic component 40 on the first test transfer arm 253 completes the test, the first test transfer arm 253 transfers the test electronic component 40 to the second exchange area 32. The discharge transfer arm 252 is then moved to the second exchange zone 32 and the finished electronic component 40 on the first test transfer arm 253 is drawn from above. At the same time, after the second test transfer arm 254 carries the electronic component 40 to be tested with the next batch of electrical contacts facing upward, it will be transferred to the test area 30 and lifted up to make the batch to be tested. The electronic component 40 is electrically connected to the probe 232 of the test device 23 in an electrical contact-up manner and performs a test operation.
請參閱第12圖，接著出料移載臂252將完測電子元件40交換移載至收料裝置22，並執行分類作業。在此同時，位於第二交換區32之第一測試移載臂253則會移動至第一交換區31處，承載下一批次電性接點朝上之待測電子元件40，進而與第二測試移載臂254交替的於第一交換區31、測試區30以及第二交換區32之間移載電子元件。 Referring to Fig. 12, the discharge transfer arm 252 then transfers the finished electronic component 40 to the receiving device 22 and performs the sorting operation. At the same time, the first test transfer arm 253 located in the second exchange area 32 is moved to the first exchange area 31, carrying the next batch of electronic components 40 with the electrical contacts facing upward, and thus The second test transfer arm 254 alternately transfers electronic components between the first exchange zone 31, the test zone 30, and the second exchange zone 32.
請參閱第13圖，本發明第二實施例之測試分類設備，其於機台20上配置之供料裝置21、收料裝置22、測試裝置23、空盤裝置24、對位裝置26、輸送裝置25之入料移載臂251及出料移載臂252係相同於第一實施例，因此不予贅述。第二實施例之測試分類設備差異在於該機台20之第一交換區31及第二 交換區32係分別設於測試區30之第一側下方及第二側下方，並於該測試區30之第一側上方及第二側上方分別設有第三交換區33及第四交換區34，而該輸送裝置25之第一測試移載臂253係作X-Y-Z三軸向移動於第一交換區31、測試區30及第二交換區32之間，該輸送裝置25之第二測試移載臂254則作X-Y-Z三軸向移動於第三交換區33、測試區30以及第四交換區34之間，以交替的移載電子元件。 Referring to FIG. 13 , a test classification device according to a second embodiment of the present invention, the feeding device 21, the receiving device 22, the testing device 23, the empty disk device 24, the alignment device 26, and the conveying device configured on the machine table 20 The material transfer arm 251 and the discharge transfer arm 252 of the device 25 are the same as those of the first embodiment, and therefore will not be described again. The test classification device of the second embodiment differs in the first exchange area 31 and the second of the machine 20. The exchange area 32 is respectively disposed below the first side of the test area 30 and below the second side, and a third exchange area 33 and a fourth exchange area are respectively disposed above the first side and above the second side of the test area 30. 34, and the first test transfer arm 253 of the transport device 25 is XYZ triaxially moved between the first exchange zone 31, the test zone 30 and the second exchange zone 32, and the second test shift of the transport device 25 The carrier arm 254 is XYZ triaxially moved between the third exchange zone 33, the test zone 30 and the fourth exchange zone 34 to alternately transfer electronic components.
請參閱第14圖，本發明第二實施例之測試分類設備其開始作動時，其第一測試移載臂253及第二測試移載臂254係分別位於第一交換區31及第四交換區34，而入料移載臂251則於供料裝置21處自上方吸取電性接點朝上之待測電子元件40。 Referring to FIG. 14, when the test classification device of the second embodiment of the present invention starts to operate, the first test transfer arm 253 and the second test transfer arm 254 are located in the first exchange area 31 and the fourth exchange area, respectively. 34, and the feeding transfer arm 251 sucks the electronic component 40 to be tested with the electrical contact facing upward from the feeding device 21 at the feeding device 21.
請參閱第15、16圖，接著入料移載臂251將電性接點朝上之待測電子元件40移載至對位裝置26之容置孔261處，並以保持吸附待測電子元件的狀態下，由各推移件262單側頂推待測電子元件40，使各待測電子元件40移動抵靠於各容置孔261的另一側，而使各待測電子元件40準確對位於入料移載臂251之第一取放吸嘴2511上。 Referring to FIGS. 15 and 16 , the loading transfer arm 251 then transfers the electronic component 40 with the electrical contact point upward to the receiving hole 261 of the alignment device 26 to maintain the adsorption of the electronic component to be tested. The electronic component 40 to be tested is pushed by the pusher 262 on one side, and the electronic component 40 to be tested is moved against the other side of each of the receiving holes 261, so that the electronic components 40 to be tested are accurately aligned. It is located on the first pick-and-place nozzle 2511 of the loading transfer arm 251.
請參閱第17、18圖，接著入料移載臂251將電性接點朝上之待測電子元件40移載至第一交換區31處，由於第一測試移載臂253位於該第一交換區31處，因此第一測試移載臂253上之第一承座2531可自下方承載來自入料移載臂251之待測電子元件40，並使待測電子元件40保持電性接點朝上的方向。 Referring to FIGS. 17 and 18, the loading transfer arm 251 then transfers the electronic component 40 with the electrical contact point upward to the first exchange area 31, since the first test transfer arm 253 is located at the first At the exchange area 31, the first socket 2531 on the first test transfer arm 253 can carry the electronic component 40 to be tested from the load transfer arm 251 from below, and maintain the electronic component 40 to be tested. Upward direction.
請參閱第19、20圖，接著第一測試移載臂253將待測電子元件40移載至測試區30，並頂升使待測電子元件40以電性接點朝上的方式與測試裝置23之探針232電性連接並執行測試作業。在第一測試移載臂253將待測電子元件40移載至測試 區30的同時，入料移載臂251將會再移動至供料裝置21處，自上方吸取下一批次電性接點朝上之待測電子元件40，而位於第四交換區34之第二測試移載臂254則會移動至第三交換區33處，承載由入料移載臂251移載並完成對位之下一批次電性接點朝上的待測電子元件40。 Referring to FIGS. 19 and 20, the first test transfer arm 253 then transfers the electronic component 40 to be tested to the test area 30, and lifts up the electronic component 40 to be tested with the electrical contact point up and the test device. The probe 232 of 23 is electrically connected and performs a test operation. Transferring the electronic component 40 to be tested to the test at the first test transfer arm 253 At the same time as the zone 30, the feed transfer arm 251 will be moved to the feeding device 21, and the next batch of electronic components 40 with the electrical contacts facing upward will be sucked from above, and located in the fourth exchange zone 34. The second test transfer arm 254 is then moved to the third exchange zone 33 to carry the electronic component 40 to be tested that is transferred by the load transfer arm 251 and completes a batch of electrical contacts upside down.
請參閱第21、22圖，第一測試移載臂253上之電子元件40完成測試測後，第一測試移載臂253會將完測電子元件40移載至第二交換區32處，而出料移載臂252則移動至第二交換區32處，並自上方吸取第一測試移載臂253上之完測電子元件40。在此同時，第二測試移載臂254於第三交換區33處承載下一批次電性接點朝上之待測電子元件40後，將會移載至測試區30，並頂升使該批次之待測電子元件40以電性接點朝上的方式與測試裝置23之探針232電性連接並執行測試作業。 Referring to FIGS. 21 and 22, after the electronic component 40 on the first test transfer arm 253 completes the test, the first test transfer arm 253 transfers the test electronic component 40 to the second exchange area 32. The discharge transfer arm 252 is then moved to the second exchange zone 32 and the finished electronic component 40 on the first test transfer arm 253 is drawn from above. At the same time, after the second test transfer arm 254 carries the next batch of electronic components 40 with the electrical contacts facing up at the third exchange area 33, it will be transferred to the test area 30 and lifted up. The electronic component 40 to be tested of the batch is electrically connected to the probe 232 of the testing device 23 in an electrical contact point upward and performs a test operation.
請參閱第23圖，接著出料移載臂252將完測電子元件40交換移載至收料裝置22，並執行分類作業。在此同時，位於第二交換區32之第一測試移載臂253則會移動至第一交換區31處，承載由入料移載臂251移載並完成對位之下一批次電性接點朝上的待測電子元件40。 Referring to Figure 23, the discharge transfer arm 252 then transfers the finished electronic component 40 to the receiving device 22 and performs the sorting operation. At the same time, the first test transfer arm 253 located in the second exchange area 32 is moved to the first exchange area 31, and the load is transferred by the load transfer arm 251 and completes a batch of electrical properties under the alignment. The electronic component 40 to be tested is connected to the contact point.
請參閱第24、25圖，當第二測試移載臂254上之電子元件40完成測試測後，第二測試移載臂254會將完測電子元件40移載至第四交換區34處，而出料移載臂252則移動至第四交換區34處，並自上方吸取第二測試移載臂254上之完測電子元件40。在此同時，第一測試移載臂253將會移載至測試區30，並頂升使該批次之待測電子元件40以電性接點朝上的方式與測試裝置23之探針232電性連接並執行測試作業，進而與第二測試移載臂254交替的移載電子元件。 Referring to FIGS. 24 and 25, after the electronic component 40 on the second test transfer arm 254 completes the test, the second test transfer arm 254 transfers the test electronic component 40 to the fourth exchange area 34. The discharge transfer arm 252 then moves to the fourth exchange zone 34 and draws the finished electronic component 40 on the second test transfer arm 254 from above. At the same time, the first test transfer arm 253 will be transferred to the test area 30, and lifted up so that the batch of electronic components 40 to be tested are electrically contacted upward with the probe 232 of the test device 23. Electrically connecting and performing a test operation, thereby transferring electronic components alternately with the second test transfer arm 254.
綜上說明，本發明利用電子元件電性接點朝上移載及測試的方式，即可不須設置提供轉乘作用的入料載台及出料載台，進而可有效簡化機構及輸送路徑，並簡化交換移載的次數及縮減交換移載的時間，達到有效降低設備成本及提升測試產能之實用效益。據此，本發明實為一深具實用性及進步性之設計，然未見有相同之產品及刊物公開，從而允符發明專利申請要件，爰依法提出申請。 In summary, the present invention utilizes the way that the electrical contacts of the electronic components are moved upwards and tested upwards, so that the loading stage and the discharging stage for providing the transfer function can be eliminated, thereby simplifying the mechanism and the conveying path. It also simplifies the number of exchanges and reduces the time of exchange transfer, achieving the practical benefits of effectively reducing equipment costs and increasing test throughput. Accordingly, the present invention is a practical and progressive design, but it has not been disclosed that the same products and publications are disclosed, thereby permitting the invention patent application requirements, and applying in accordance with the law.
20‧‧‧機台 20‧‧‧ machine
21‧‧‧供料裝置 21‧‧‧Feeding device
22‧‧‧收料裝置 22‧‧‧Receiving device
23‧‧‧測試裝置 23‧‧‧Testing device
231‧‧‧測試板 231‧‧‧Test board
232‧‧‧探針 232‧‧‧ probe
24‧‧‧空盤裝置 24‧‧‧ empty disk device
241‧‧‧移盤器 241‧‧‧Shifter
25‧‧‧輸送裝置 25‧‧‧Conveyor
251‧‧‧入料移載臂 251‧‧‧Feeding transfer arm
2511‧‧‧第一取放吸嘴 2511‧‧‧First pick and place nozzle
252‧‧‧出料移載臂 252‧‧‧Drawing transfer arm
2521‧‧‧第二取放吸嘴 2521‧‧‧Second pick and place nozzle
253‧‧‧第一測試移載臂 253‧‧‧First test transfer arm
2531‧‧‧第一承座 2531‧‧‧first seat
254‧‧‧第二測試移載臂 254‧‧‧Second test transfer arm
2541‧‧‧第二承座 2541‧‧‧Second seat
26‧‧‧對位裝置 26‧‧‧ Alignment device
261‧‧‧容置孔 261‧‧‧ accommodating holes
262‧‧‧推移件 262‧‧‧Pushing pieces
30‧‧‧測試區 30‧‧‧Test area
31‧‧‧第一交換區 31‧‧‧First exchange area
32‧‧‧第二交換區 32‧‧‧Second exchange area
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104103261A TWI534439B (en) | 2015-01-30 | 2015-01-30 | Electronic components testing and classification equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104103261A TWI534439B (en) | 2015-01-30 | 2015-01-30 | Electronic components testing and classification equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI534439B true TWI534439B (en) | 2016-05-21 |
| TW201627679A TW201627679A (en) | 2016-08-01 |
Family
ID=56509352
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104103261A TWI534439B (en) | 2015-01-30 | 2015-01-30 | Electronic components testing and classification equipment |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI534439B (en) |
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2015
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| TW201627679A (en) | 2016-08-01 |
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