TWI527691B - 多層板及其製作方法 - Google Patents
多層板及其製作方法 Download PDFInfo
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- TWI527691B TWI527691B TW100115353A TW100115353A TWI527691B TW I527691 B TWI527691 B TW I527691B TW 100115353 A TW100115353 A TW 100115353A TW 100115353 A TW100115353 A TW 100115353A TW I527691 B TWI527691 B TW I527691B
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- fluorine
- based resin
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- polymer
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Description
相互參照之相關申請案本案主張2010年5月6日、2010年8月13日與2011年4月29日分別向韓國智慧財產局申請之韓國專利申請書編號2010-0042531、2010-0078389與2011-0040739之優先權,並且其內容完全併入本發明中,以供參酌。
本發明係關於一多層板、一用於光電池(photovolatic cell)之背板、一光電模組(photovolatic module)及其製備方法。
最近,因為全球環境問題和化石燃料耗盡,人們越來越關注可再生能源,潔淨能源。其中,太陽能已引起人們的重視,其可作為無污染能源之代表,並可以解決環境污染和化石燃料耗盡之問題。
光電池之光電動力原理係應用一裝置將太陽光轉換成電能。由於光電池必須長期暴露在戶外環境以促進吸收太陽光,其係藉由執行一些封裝程序製成單位以保護電池,該單位係稱為光電模組。
一般來說,光電模組係採用具有優異耐候性和耐久性之背板,以穩定保護在長期暴露於戶外環境之光電模組。該背板一般包括在其中包括氟基聚合物之樹脂層之背板,如聚氟乙烯(PVF)堆疊於基板上。
然而,由於典型使用聚對苯二甲酸乙二酯(PET)作背板之基板,PVF樹脂係使用藉由使用聚氨酯基膠黏劑在基板上擠壓或鑄造而得到之層壓氟基聚合物薄膜其附著力差。然而,對於此技術,高價位之薄膜製備設備、黏合劑和附加的黏合塗佈和層壓程序係必要的。此外,對此技術,比起為了處理薄膜之需要,使用較厚薄膜係必須的,各種添加劑和填充劑之使用係有所限制,且高加工溫度係需要的。
另一方面,當由懸浮或溶液形式之樹脂製備之氟基聚合物薄膜係塗佈和乾燥於基板上,該溶劑一般使用具有高沸點和200℃或以上之高乾燥溫度是必要的。
大量能源之使用以提供PVF樹脂溶液在高乾燥溫度之需求。這增加了光電模組背板之生產成本,和造成基板之熱衝擊(thermal shock)或熱變形(thermal deformation)。因此,產品品質(機械特性等)下降,其機械性質在戶外長期使用後迅速惡化。
因此,有持續需求之光電池背板材料其具有優異之耐久性和耐候性,且可在低溫下乾燥,從而降低其生產成本和提高光電模組之產率和品質。
本發明係關於提供一多層板、一用於光電池之背板、一光電模組及其製備方法。
在一方面,係提供一多層板,該板片包括一基板和一氟基樹脂層。多層板包括一相容於氟基樹脂之聚合物塗佈層,其在基板和氟基樹脂層之間。氟基樹脂層包括一具有非結晶區域和少於60%結晶度之氟基樹脂。
在另一方面,係提供一種製備多層板之方法,該方法包括:提供一基板;形成一聚合物塗佈層,係藉由塗佈一相容於氟基樹脂之聚合物組成物於基板上;塗佈一包括氟基樹脂之塗佈溶液於聚合物塗佈層上,其具有非結晶區域和少於60%結晶度,且溶劑具有200℃或更低之沸點。
多層板可以用作如各種光電模組背板。
本發明之前述和其它目的,態樣和優點將藉由下述實施例之描述及隨附圖式參考之一般技藝而更加清楚,其中:圖1和2係根據本發明一具體實施例之多層板橫斷面示意圖。
在下文中,本發明之具體實施例將詳細描述並參考隨附圖式。為了清晰和簡潔之目的,其完全理解之眾所周知之普通技藝內容是沒有必要的,具體化之發明被描述和附圖所忽略。該圖式為示意圖,並未按比例,而層和區域之厚度係為了清晰而擴大或增大。因此,本發明之範疇並不侷限於圖式內表示之厚度、尺寸、比例。
在本發明一具體實施例,多層板包括基板和氟基樹脂。該多層板包括一相容於氟基樹脂之聚合物塗佈層,其在基板和氟基樹脂層間。氟基樹脂層包括一具有非結晶區域和少於60%結晶度之氟基樹脂。
具體之基板種類包括本發明之多層板,並沒有特別的限制,且在已知技藝之各種材料均可以選用,並根據所需之功能和目的使用。
在本發明一具體實施例,基板可以是金屬或聚合物板。金屬可以鋁或鐵,而聚合物之例子可包括聚酯基板、聚醯胺基板或聚亞醯胺基板。其這些板片中,一般使用聚酯基板,但本發明不限於此。聚酯基板之實施例,包括單一板片、堆疊板片,以及聚對苯二甲酸乙二酯(PET)、聚對萘二甲酸乙二酯(PEN)或聚對苯二甲酸丁二酯(PBT)之共擠壓成形品,但不侷限於此。
基板之厚度在約50至500微米之範圍,較佳為100至300微米。基材之厚度可控制在上述範圍內,從而維持電氣絕緣性、水阻隔性、機械特性,和多層板之搬運。同時,本發明之基板厚度並不限制於上述描述之範圍,因此在必要時可適當的控制。
在本發明,高頻火花放電處理,如電暈或電漿處理,熱處理,火焰處理,偶合劑處理,黏固劑(anchoring agent)處理,或採用氣相路易斯酸(如BF3),硫酸或高溫氫氧化鈉之化學活化處理。可執行在基材上。
此外,無機氧化物,如氧化矽或鋁氧化物,可沉積於基板上,以進一步提高水阻隔性。這時,上面描述的火花放電處理,火焰處理,偶合劑處理,黏固劑處理或化學活化處理也可以執行在沉積層上,以進一步增強附著力。
本發明之多層板可包括一聚合物塗佈層,其在基板和氟基樹脂層之間。聚合物塗佈層形成於基板上,係相容於氟基樹脂,並確保基板和氟基樹脂層之間的附著力。
聚合物塗佈層之聚合物包括一相容於氟基樹脂之主鏈骨架,且氟基樹脂層係形成在聚合物塗佈層上。
在本發明中,“B係相容於A”之用語,係指如果A和B存在於單一系統中,在A和B相互混合或擴散而產生之吉布斯自由能係低於在A和B不相互混合或擴散而產生之吉布斯自由能。
在本發明中,包括於聚合物塗佈層之主鏈骨架,可相容於氟基樹脂,特別是,相容於氟基樹脂或氟基樹脂和非晶形樹脂之混合物。因此,主鏈骨架一般可高度相容於氟基樹脂層。
在本發明中,包括於聚合物塗佈層之主鏈骨架並沒有特別限制,只要聚合物塗佈層表現出以上描述之特徵。主鏈骨架之實施例包括,至少一選自由(甲基)丙烯((meth)acryl)基之主鏈骨架、胺甲酸乙酯(urethane)基之主鏈骨架、醚碸基之主鏈骨架、醚亞胺基之主鏈骨架、醯胺基之主鏈骨架、聚酯基之主鏈骨架、脂肪族聚酯基之主鏈骨架、聚酯胺甲酸乙酯基之主鏈骨架、(甲基)丙烯醯胺基之主鏈骨架、尿素(urea)基之主鏈骨架、聚碳酸酯基之主鏈骨架組成之群組;以及一從單體混合物誘導形成之自由基附加聚合物之主鏈骨架,包括(甲基)丙烯基單體、(甲基)丙烯醯胺基單體或乙烯基單體為主要成分,較佳為,至少一選自由丙烯(acryl)基之主鏈骨架、聚酯基之主鏈骨架、脂肪族聚酯基之主鏈骨架、(甲基)丙烯醯胺基之主鏈骨架;以及一單體混合物誘導形成之自由基附加聚合物之主鏈骨架,包括丙烯基單體或(甲基)丙烯醯胺基單體為主要成分,但不限於此。
用於此處術語“含有特定單體作為主要成分之單體混合物”係指基於特定單體之總重量,該特定單體含有大於50重量百分比之含量,較佳為70重量百分比或以上,及更佳為90重量百分比或以上。
聚合物塗佈層具有相容性,使其在氟基樹脂層之氟基樹脂間表現出足夠之附著力,如之後描述,或一氟基樹脂和非晶形樹脂之混合物,和在前面所述之基板。因此,在多層板形成期間,一在聚合物塗佈層和氟基樹脂層之間界面,在包含於氟基樹脂層之氟基樹脂和/或包含於聚合物塗佈層之非晶形樹脂和材料之間發生相互擴散。因此,由於在氟基樹脂層和聚合物塗佈層間之分子鏈間之鏈纏結和凡德瓦作用力,其發生物理作用力是可預期的,因而增強附著力。
此外,由於偶極-偶極相互作用力使凡德瓦可進一步增加。因此,在本發明之一實施例,聚合物塗佈層更包括一官能基,其可以導入聚合物之內部、側鏈或主鏈末端。也就是說,聚合物塗佈層可包括:一相容於氟基樹脂之主鏈骨架和一官能基導入主鏈骨架之內部、側鏈或主鏈末端之聚合物;或包括一相容於氟基樹脂之主鏈骨架和能提供官能基之化合物交聯之聚合物;或包括一相容於氟基樹脂之主鏈骨架和一官能基或能提供官能基之化合物之聚合物混合物。
在本發明,該官能基的種類並沒有特別限制,但能包括有高偶極矩,透過氟基樹脂具有C-F2鍵結之偶極作用力,因而提高氟基樹脂層之附著力。因此,由於在氟基樹脂層之氟基樹脂含有之C-F2鍵結偶極和聚合物塗佈層之官能基偶極之間作用力,使凡德瓦作用力可能進一步增加。也就是說,在適當地擴散至另一個時,由於優異之相容性和偶極作用力,氟基樹脂層和聚合物塗佈層之物理和化學之相互作用力增加是可預期的,從而提高附著力。
在本發明中,該官能基可包括至少一個選自由羧基、磺酸基、氮丙啶基(aziridine)、酸酐基、胺基、異氰酸基、三聚氰胺基(cyanuramide)、環氧基、羥基、酯官能基、胺甲酸酯官能基(carbamate)、醯胺基、尿素基、醯亞胺基、磷酸鹽基、磷酸基、氰基、氰酸鹽基和亞胺基組成之群組,但不限於此。較佳為,至少一個選自由羧基、磺酸基、酸酐基、胺基、環氧基、羥基、氰基和酯官能基組成之群組。
在本發明中,該能夠誘導或提供官能基至主鏈骨架之材料種類並沒有特別限制,且可為技藝中可以誘導相對應之官能基之廣為人知之許多化合物之任何一種。此類的化合物例子,包括:環氧丙基(甲基)丙烯酸酯(glycidyl(meth)acrylate)、環氧丙基烷基(甲基)丙烯酸酯(glycidyl alkyl(meth)acrylate)、(甲基)丙烯酸、異氰酸酯烷基(甲基)丙烯酸酯、羥烷基(甲基)丙烯酸、馬來酸酐、對-甲苯磺酸、磷酸、(甲基)丙烯醯胺、(甲基)丙烯腈和烷基胺基烷基(甲基)丙烯酸酯。官能基可藉由聚合方法誘導,此類的化合物係與聚合物之主鏈一起聚合,或在適合的加成反應條件下接枝到側鏈或主鏈之末端,或一種使用化合物交聯聚合物之方法。在某些情況下,在聚合物塗佈層之化合物可包括單獨聚合物或混合聚合物。在技藝中,已揭露各種能夠誘導所需官能基至聚合物之方法,且全部可應用到本發明。
在本發明仍有之另一實施例,一聚合物塗佈層可包括,例如,聚酯多元醇、丙烯基多元醇或聚碳酸酯多元醇,或聚合物和聚異氰酸酯之反應產物。在此實例,聚異氰酸酯之種類可包括已知技藝之具有至少兩個異氰酸酯基之脂肪族、環脂肪族和芳香族聚異氰酸酯,但並沒有特別限制。此外,聚異氰酸酯的反應條件不特別限制。
此外,本發明之聚合物塗佈層可進一步包括一聚合物,如,丙烯基樹脂、聚酯基樹脂、胺甲酸乙酯基樹脂、尿素基樹脂、醯胺基樹脂、環氧基樹脂、醚碸基樹脂、醚亞胺基樹脂或矽基樹脂。
在本發明聚合物塗佈層含有之官能基含量並沒有特別限制,但在聚合物塗佈層之官能基當量數可以在800至30000之範圍內。本文使用的術語“官能基當量數”係指由對應的官能基數除以聚合物塗佈層內含有之官能基總分子量而得到之數值,且可以由已知技藝之一般化學滴定法測定。然而,官能基之當量數只是一個例子,如此可根據黏接強度之需求或包括在樹脂層之氟基樹脂種類而適當的變化。
本發明之聚合物塗佈層可具有約10至5000奈米之厚度,較佳為50至2000奈米,更佳為約150至2000奈米,而聚合物塗佈層之厚度可根據黏接強度之需求和樹脂層之氟基樹脂種類而適當的變化。
如下所述,化學或物理作用力,如凡德瓦作用力、氫鍵、離子鍵或共價鍵,其形成在包括於氟基樹脂或非晶形樹脂之官能基、包括於樹脂層之填料或分散劑,和聚合物塗佈層之官能基之間,也可增強附著力。
本發明之多層板包括一氟基樹脂層形成於聚合物塗佈層。本發明之氟基樹脂層包括一具有非結晶區域和少於60%結晶度之氟基樹脂。在包括氟基樹脂之樹脂層塗覆時,其與聚合物塗佈層之相互擴散係有效地進行,因而使附著力增加至最大。此外,在氟基樹脂使用時,一具有低沸點之溶劑可用於在形成氟基樹脂層期間,如之後描述。因此,乾燥程序可在低溫下實施或進行,因而提高產率和確保優異之產品品質。
在本發明中,氟基樹脂層具有一非結晶區域,結晶度少於55%,較佳為50%或更少,更佳為10至50%。在此術語”結晶”係指包括於整個樹脂內之結晶區域百分比(根據重量),且可由已知方法測定,如示差掃描熱量分析儀。特別是,結晶度可以由以下描述之本發明具體實施例之方法測定。
具有以上描述結晶度之氟基樹脂,可由氟基樹脂之規則排列原子之分解而製備,或藉由在氟基樹脂製備期間共聚合適合的單體或聚合在分枝聚合物之聚合物而製備。
一具有非晶形區域之氟基樹脂具體種類可以為均聚物、共聚物或其混合物,其包括至少一單體選自由聚合物型式之偏氟乙烯(VDF)、氟乙烯(VF)、四氟乙烯(TFE)、六氟丙烯(HFP)、三氟氯乙烯(CTFE)、三氟乙烯、六氟異丁烯、全氟丁基乙烯、全氟(甲基乙烯醚)(PMVE)、全氟(乙基乙烯醚)(PEVE)、全氟丙基乙烯醚(PPVE)、全氟甲基乙烯醚(PMVE)、全氟-2,2-二甲基-1,3-二氧雜環戊烯(perfluoro-2,2-dimethyl-1,3-dioxol)(PDD)和全氟-2-亞甲基-4-甲基-1,3-二氧戊環(perfluoro-2-methylene-1,3-dioxolane)(PMD)組成之群組,但並沒有特定之限制。
在本發明中,氟基樹脂較佳為一包括氟乙烯均聚物或共聚物之聚合物型式;或一包括偏氟乙烯均聚物或共聚物之聚合物型式;或一包括彼等至少兩種之混合物,更佳為一包括偏氟乙烯共聚物之聚合物型式。
一種共聚單體,其包括共聚物之聚合物型式,且可包括:六氟丙烯(HFP)、三氟氯乙烯(CTFE)、四氟乙烯(TFE)、三氟乙烯、六氟異丁烯、全氟丁基乙烯、全氟(甲基乙烯醚)(PMVE)、全氟-2,2-二甲基-1,3-二氧雜環戊烯(PDD)和全氟-2-亞甲基-4-甲基-1,3-二氧戊環(PMD)之至少一種或兩種,並沒有特別限制。較佳為一種共聚單體,其包括六氟丙烯和三氟氯乙烯之至少一種,但並不限制於此。共聚物之共聚單體含量可以為基於共聚物總重量,約0.5至50重量百分比,較佳為1至40重量百分比,更佳為7至40重量百分比,甚至更佳為10至30重量百分比,最佳為10至20重量百分比。在上述描述之共聚單體含量,可以確保多層板之耐久性和耐候性,並可有效地引起相互擴散反應和低溫乾燥。
在本發明中,氟基樹脂可具有50000至1000000之重量平均分子量。在此使用之重量平均分子量係藉由凝膠滲透層析儀(GPC)測定之標準聚苯乙烯轉換值。在本發明中,樹脂之重量平均分子量可控制在上述範圍,因而確保優異之溶解性及其它物理性質。
在本發明中,氟基樹脂可具有80至175℃之熔點,較佳為120至165℃。在本發明中,當樹脂之熔點控制在80℃或以上時,它可以防止多層板在使用中變形。當樹脂之熔點控制在175℃或更低時,溶劑之溶解度可能得到控制,而且可增強塗層表面之光澤。
本發明之氟基樹脂層在必要時可進一步包括非結晶樹脂搭配以上描述之氟基樹脂。同樣,當氟基樹脂摻混非結晶樹脂,其加工性能(例如,與上面所述之聚合物塗佈層相互作用,並溶解於低沸點溶劑)可進一步最大化。在此使用之術語”非結晶樹脂”包括一具有完全非結晶結構之樹脂,以及其具有一較少之結晶區域和顯著非結晶區域之樹脂,使樹脂為完全非結晶。
一種本發明使用之非結晶樹脂,可以為丙烯基樹脂、聚碳酸酯、聚氯乙烯、苯乙烯-(甲基)丙烯腈共聚物、苯乙烯-馬來酸酐共聚物、環烯烴聚合物、聚丙烯腈、聚苯乙烯、聚碸、聚醚碸、聚芳基酯(polyarylate),或彼等至少一種或兩種之混合物,並沒有特別的限制。其中,較佳為丙烯基樹脂,但本發明並不限於此。
一個丙烯基樹脂之實例,係為一均聚物或共聚物,包括至少一種或兩種之(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸和(甲基)丙烯酸異莰酯(isobornyl(meth)acrylate)之聚合物型式。在一些實例,可使用丙烯基樹脂控制玻璃化轉變溫度和分子量分佈,其包括以上描述之至少一種單體或兩種上述單體和至少一環己基順丁烯二醯亞胺、甲基苯乙烯和(甲基)丙烯腈共聚單體之聚合物型式。
在本發明中,當非結晶樹脂係藉由至少兩種單體形成之共聚物時,該共聚單體之種類和內容並沒有特別的限制,因而可根據所需之結晶度控制。
在本發明中,當樹脂層包括一非結晶樹脂時,該樹脂層包括50重量分或以上之氟基樹脂,和50重量分或以下之非結晶樹脂。具體而言,樹脂層可包括70至97重量分之氟基樹脂和3至30重量分之非結晶樹脂。當樹脂間之重量比例係控制在上述描述之範圍內,該包含氟基樹脂層之組成份可具有適合之結晶度,其相互擴散至聚合物塗佈層可有效地進行,且該多層板可顯現物理性質,如優異之耐久性和
耐候性。
在本發明中,除非另有特別地定義,該“重量分(parts by weight)”係指一組成份對其它全部組成份總重量之重量比。
本發明之氟基樹脂層可進一步包括顏料或填充劑以控制樹脂層之顏色或不透明性(或作其它用途)。在此處使用之顏料或填充劑可以為金屬氧化物,如二氧化鈦(TiO2),氧化矽或氧化鋁,碳酸鈣,硫酸鋇或黑色顏料(如,碳黑),或呈現出不同顏色之顏料組成,但本發明不限於此。在相互擴散期間,藉由包含於每一組成份之原有官能基,連同控制氟基礎樹脂層之顏色或不透明性之原有效應,顏料或填充劑可進一步提高在氟基樹脂層和聚合物塗佈層間之界面附著力。顏料含量基於氟基樹脂層之固含量可為60重量百分比或更少,但本發明並不限於此。
本發明之氟基樹脂層可進一步包括一共同組成份,如紫外線安定劑、熱安定劑或障壁粒子。
在本發明中,氟基樹脂層係包括上述描述組成份,可具有約3至50微米之厚度,較佳為10到30微米,其可根據不同之目的變化。
本發明之氟基樹脂層之整體結晶度可低於60%,較佳為55%或更少,更佳為10至50%,甚至更佳為10至40%,最佳為10至35%。在本發明中,術語“氟基樹脂層之結晶度”係指包括於氟基樹脂層內之全部樹脂組成份之結晶區域之百分比(根據重量),即一氟基樹脂或一氟基樹脂和一非結晶樹脂之混合樹脂,且可由已知方法測定,如示差掃描熱量分析儀。此外,在本發明中,當氟基樹脂層包括至少兩種樹脂組成份,該結晶度係指每一成分之結晶區域之重量平均百分比。氟基樹脂層之結晶度可以為之透過控制如上所述之具有非結晶區域之氟基樹脂而達到之結晶度,至少兩種氟基樹脂之混合物,或一氟基樹脂和一非結晶樹脂之混合物。
在本發明中,氟基樹脂層可為一塗佈層。該術語“塗佈層”在此係指一由塗佈形成之樹脂層。尤其是,該塗佈層係藉由塗佈一塗佈溶液而形成於一基板或聚合物塗佈層上,其藉由將構成樹脂層之組成份溶解於一溶劑而製成,較佳為具有低沸點之溶劑,並非藉由鑄造或擠壓製備壓合板於使用黏合劑之基板或聚合物塗佈層上。
伴隨之圖1和圖2說明本發明之多層板。也就是說,在圖1所示,本發明之多層板10,包括:一基板11;一聚合物塗佈層12,形成於基板之一表面;以及一氟基樹脂層13,形成於聚合物塗佈層12之上。另外,如圖2所示,多層板可包括形成一個基板11之兩側表面之聚合物塗佈層12a和12b,以及分別形成於聚合物塗佈層12a和12b上之氟基樹脂層13a和13b。
本發明之多層板,在必要時,可進一步包括已知技藝之不同功能層。該功能層可以是黏合層或絕緣層,例如,在本發明之多層板,該聚合物塗佈層和氟基樹脂層可如上描述形成於基板之一表面,黏合層和絕緣層可依序形成於其它表面。黏合層或絕緣層可由已知技藝之各種方法形成,例如,絕緣層可以為乙烯基醋酸乙酯鹽(EVA)或低密度線性聚乙烯(LDPE)層。EVA或LDPE層可作為絕緣層,並同時有助於提高密封之黏附性,降低生產成本,且保持優異之再加工性。
此外,本發明係關於一種製備多層板之方法,包括:準備一板片,藉由塗佈一相容於氟基樹脂之聚合物組成物於基板上,形成一聚合物塗佈層;以及塗佈一塗佈溶液於聚合物塗佈層之上,其溶液包括具有一非結晶區域和結晶度低於60%之氟基樹脂和具有200℃或更低沸點之溶劑。
在本發明中,聚合物塗佈層形成於基板之方法並沒有特別的限制,例如,根據已知技藝之各種方法,聚合物塗佈層可藉由塗佈一相容於氟基樹脂之聚合物組成物於基板上而形成,且在預定條件下乾燥其塗佈組成物。在此,塗佈方法並沒有特別的限制,因此可以使用任何能夠形成一均勻塗層之方法,如膠印塗佈(offset coating),凹印塗佈(gravure coating),滾輪塗佈(roll coating)或刀刃塗佈(knife edge coating)。
一聚合物組成物之聚合物可以為具有以上所述之主鏈骨架和一官能基誘導至主鏈骨架之聚合物,或具有以上所述之主鏈骨架之聚合物,以及一具有官能基之組成物。該塗佈溶液可藉由將聚合物溶解或分散於一個適合之有機溶劑或水性溶劑而製成。
除了以上所述之方法,已知技藝之各種其它方法係可應用於本發明,在必要時,塗佈溶液可進一步包括各種添加劑。
一種具體之基板,其可使用於如以上所述相同之本發明步驟,且基板可進一步利用適當沉積、電漿、電暈、底漆、黏固劑,偶合劑或熱處理劑而處理。
在本發明中,氟基樹脂層係如以上所述方法形成,藉由塗佈聚合物塗佈層形成。在本發明中,塗佈溶液形成之氟基樹脂層可藉由將形成以上所述之氟基樹脂層之組成份溶解或分散於相對較低沸點之溶劑而製備,其沸點特別為200℃或更低。也就是說,在本發明中,如同氟基樹脂具有一非結晶區域或與一非結晶樹脂混合,該氟基樹脂可有效地溶解於一相對較低沸點之溶劑。因此,本發明在製備期間不需要高溫乾燥程序。因此,生產成本可降低,而基板在高溫乾燥過程中引起之熱變形或熱衝擊是可以預防的,因而提高產品之品質。
本發明使用之溶劑可以為丙酮、甲基乙基酮(MEK)、二甲基甲醯胺(DMF)、二甲基乙醯胺(DMAC),或至少一種或兩種之混合物,但不限制於此。
在本發明中,應用塗佈溶液形成之氟基樹脂層,除了氟基樹脂和/或非結晶樹脂,可進一步包括各種添加劑,如顏料、填充劑,紫外線安定劑和熱安定劑。每一添加劑可與氟基樹脂一起溶解於溶劑中,或製備成研磨基料(mill base),從以上所述之組成物分離,然後混入包含氟基樹脂或非結晶樹脂之溶劑。
在本發明中,一種製備塗佈溶液之方法或包含於塗佈溶液之各成份比例並沒有特別的限制,因此已知技藝之各種方法均可適當地利用。
在本發明中,使用塗佈溶液之塗佈方法並沒有特別的限制,但可根據形成以上所述之聚合物塗佈層之塗佈方法完成。特別是,在塗層過程中,塗佈溶液之溶劑可有助於聚合物塗佈層在成形之前之表面膨脹,因而促使聚合物塗佈層和樹脂層間之相互擴散。
在本發明中,塗佈程序之後,可進一步進行一乾燥已塗佈之塗佈溶液步驟。乾燥塗佈層可在如200℃或以下之條件下進行,較佳為約100至180℃,約30秒至30分鐘,較佳為約1至10分鐘,但本發明不限於此。關於如上所述之乾燥條件控制,可防止生產成本增加,並也避免熱變形或熱衝擊而引起產品品質下降。
此外,本發明係關於一含有多層板之光電池之背板,以及一含有光電池背板之光電模組。
本發明之光電模組結構並沒有特別限制,只要包含有多層板作為背板。因此,本發明之光電模組可具有已知技藝之各種結構。
一般而言,光電模組可包括:一透明的頂部發光基板、一背板、一光電池模組,藉由在頂部發光基板和背板間之封裝劑封裝,或一光電陣列以串聯或並聯排列。
一活化層構成光電池或光電陣列之代表例,可包括一結晶或非結晶矽晶圓,一半導體組成物,如CIGS或CTS。
本發明之多層板可包括具有以上所述活化層之模組,且可應用於已知技藝之各種光電模組,並沒有限制。在這種情況下,構成模組之方法和其它種類之材料並沒有特別的限制。
如下文所述,本發明將詳細描述根據本發明之參考範例和未根據本發明之比較例。然而,本發明之範籌並不侷限於以下之例子。
在實施例和比較例中,每個表格中的性質係由下列方法測定。
剝離強度根據ASTM D1897,將樣品切割成10毫米寬度而測定,且將產生之樣品在4.2毫米/秒之速度和180度剝離角度下剝離。
一種根據橫切測試標準ASTM D3002/D3359進行之橫切測試。具體而言,使用小刀在樣品之水平和垂直方向藉由11個直欄和橫列切成1毫米之間隔,並形成100個1毫米長度和寬度之方形網格。經由Nichiban生產的CT-24膠貼附於網格表面,然後分離,膠帶表面脫落之狀態根據下列標準而測定和評估。
5B:沒有表面脫落
4B:脫落區域不超過基於表面總面積之5%
3B:脫落區域為基於表面總面積之5至15%
2B:脫落區域為基於表面總面積之15至35%
1B:脫落區域為基於表面總面積之35至65%
0B:幾乎全部的表面脫落
觀察每個實施例或比較例之多層板在85℃和85% RH(相對濕度)之烤箱烘烤1000、2000或3000小時後,黏著強度之變化。
觀察每個實施例或比較例之多層板在2大氣壓(atm),121℃和100% RH之烤箱烘烤50、75或100小時後,黏著強度之變化。
氟樹脂之結晶度係藉由示差掃描熱量分析儀測定。這時,其加熱速率設定為每分鐘10℃,並在第二次加熱程序中,測定熔解熱(△Hr)。基於具有100%結晶度之聚偏氟乙烯(△Hf=105焦耳/克)之熔解熱,每一樹脂之結晶度係可計算。此外,含有至少兩種氟樹脂之樹脂層,或一氟樹脂和一非結晶樹脂,樹脂層之結晶度可基於具有100%結晶度之聚偏氟乙烯(△Hr=105焦耳/克)而計算。
一種塗佈溶液(丙烯基改質聚酯),包括一聚對苯二甲酸乙二酯(PET)、甲基丙烯酸縮水甘油酯(GMA)、甲基甲基丙烯酸酯(MMA)和甲基甲基丙烯酸(MAA)在莫耳比為1:0.5:1:0.2(PET:GMA:MMA:MAA)之分散水溶液,係塗覆於電暈處理過之聚對苯二甲酸乙二酯(PET;厚度:250微米)。該塗覆係使用線棒(mayer bar)形成具有約500奈米厚度之塗佈層。在塗佈後,塗佈層在約230℃乾燥約30秒,因而形成聚合物塗佈層(丙烯基改質聚酯層)。
第一塗佈溶液,係藉由溶解130克之共聚物,其中偏氟乙烯(VDF)和三氟氯乙烯(CTFE)係由85:15(VDF:CTFE)之重量比例聚合;50克之共聚物,其中VDF和六氟丙烯(HFP)係由88:12(VDF:HFP)之重量比例聚合;以及20克之聚甲基甲基丙烯酸酯(PMMA)溶於800克之N,N-二甲基甲醯胺(DMF)而製備。
除了以上描述之溶液之外,研磨基料製備係藉由4.8克之顏料分散劑(BYK W9010,BYK生產)和240克之二氧化鈦(TiPure TS6200,杜邦生產)溶解於100克之二甲基甲醯胺(DMF),加入之具有0.3毫米直徑之100克氧化鋯珠,在每1小時1000轉(rpm)下攪拌該產生之混合物,且完全地去除氧化鋯珠。
研磨基料之製備,係放入事先配製之第一塗佈溶液,然後攪拌,因而製備一氟基樹脂層之塗佈溶液。在此,在考量氧化鋯珠移除過程中引起之研磨基料損失,研磨基料係為實際放入樹脂層之1.5倍數量而製備。
氟基樹脂層之塗佈溶液係藉由間隔塗佈方式(comma reverse method)塗覆於製備基板之聚合物塗佈層。該已塗佈之塗佈溶液在乾燥後具有約20至30微米之厚度,然後將塗佈基材依序通過三個烤箱,其具有2米之長度,且分別控制溫度為80、170和170℃,在速度為1米/分,因而形成氟基樹脂層。隨後,以同樣方式在氟基樹脂層之相對表面進行塗佈,因而製備成一多層板,其中氟基樹脂層係經由丙烯基改質聚酯層形成於PET板之兩側表面。
根據實施例1之方法製備之多層板,除了氟基樹脂和丙烯基樹脂之種類和混合比例,包括製備樹脂層之塗佈溶液係如以下表1和表2所列而變化。
比較例1之性質,評估Isovolta生產之Icosolar 2442作為光電模組之背板。該Icosolar 2442產品係藉由層壓聚(氟乙烯)(PVF)板(厚度:38微米)製備之多層板,並藉由擠壓使用黏合劑之PET板兩側表面而製備。
比較例2之性質,評估Isovolta生產之Icosolar 3469作為光電模組之背板。該Icosolar 3459產品係藉由層壓聚(氟乙烯)(PVF)板(厚度:25微米)製備之多層板,並藉由鑄造使用黏合劑之PET板兩側表面而製備。
實施例1至18與比較例1和2之每一多層板在完成壓力鍋測試(PCT)、180度剝離強度和百格測試後。具體來說,每一多層板經過包括,2大氣壓(atm),121℃和100% RH之50、75或100小時之狀態,和完成180度剝離強度和百格測試以評估剝離強度之改變。評估結果列於下列表3。
如表3所示,本發明之多層板實例,氟基樹脂層表現出初期強固黏附於基板(PET)和100小時PCT後之優異黏附。此外,經過100小時PCT後,在氟基樹脂層並沒有觀察到外部之變化,如黃化、界面剝離和銷孔(pin hole)之形成。然而,觀察商業上使用之多層板Icosolar 2442和3469,在PCT繼續進行時,其對基板之附著力顯著地減少。
實施例1至18與比較例1和2之每一多層板在完成濕熱試驗、180度剝離強度和百格測試後。具體來說,每一多層板在85℃和85% RH之烤箱烘烤1000、2000或3000小時後,然後進行180度剝離強度和百格測試以評估剝離強度之改變。評估結果列於下列表4。
如表4所示,本發明之多層板實例,氟基樹脂層表現出初期強固黏附於基板(PET)和3000小時濕熱試驗後之優異黏附。此外,經過3000小時濕熱試驗後,在氟基樹脂層並沒有觀察到外部之變化,如黃化、界面剝離和銷孔之形成。然而,觀察商業上使用之多層板Icosolar 2442和3469,在濕熱試驗繼續進行時,其對基板之附著強度顯著地減少。
如實施例1之相同方法製備之多層板,除了甲基甲基丙烯酸酯(MMA)和環己基馬來亞醯胺(CHMI)之共聚物(重量比:MMA:CHMI=9:1)代替PMMA用於塗佈溶液之製備。
如實施例1之相同方法製備之多層板,除了甲基甲基丙烯酸酯(MMA)和丙烯酸乙酯(EA)之共聚物(重量比:MMA:EA=6:4)代替PMMA用於塗佈溶液之製備。
如實施例1之相同方法製備之多層板,除了甲基甲基丙烯酸酯(MMA)、丙烯酸乙酯(EA)和甲基丙烯腈(MAN)之共聚物(重量比:MMA:EA:MAN=6:3:1)代替PMMA用於塗佈溶液之製備。
如實施例1之相同方法製備之多層板,除了甲基甲基丙烯酸酯(MMA)、丙烯酸乙酯(EA)、丙烯腈(AN)和苯乙烯(ST)之共聚物(重量比:MMA:EA:AN:ST=5:3:1:1)代替PMMA用於塗佈溶液之製備。
如實施例1之相同方法製備之多層板,除了甲基甲基丙烯酸酯(MMA)和甲基丙烯酸丁酯(BMA)之共聚物(重量比:MMA:BMA=8:2)代替PMMA用於塗佈溶液之製備。
實施例19至23之每一多層板,在如同實施例1之相同方法之壓力鍋測試(PCT),並完成180度剝離強度和百格測試後,然後結果列於下列表5。
如表5所示,本發明之多層板實例,氟基樹脂層表現出初期強固黏附於基板(PET)和100小時PCT後之優異黏附。此外,經過100小時PCT後,在氟基樹脂層並沒有觀察到外部之變化,如黃化、界面剝離和銷孔之形成。
在下列實施例24至43,如實施例1或2相同設計之氟基樹脂層組成物,而檢測基板之表面處理條件,聚合物塗佈層之構成,以及塗佈厚度之變化。
如實施例1之相同方法製備之多層板,除了未經過電暈處理之PET用於基板之製備,且控制塗覆條件,使聚合物塗佈層(丙烯基改質聚酯層)在乾燥後具有500奈米之厚度。
如實施例2之相同方法製備之多層板,除了未經過電暈處理之PET用於基板之製備,且控制塗覆條件,使聚合物塗佈層(丙烯基改質聚酯層)在乾燥後具有300奈米之厚度。
分別如實施例1和2之相同方法製備之多層板,除了未經過電暈處理之PET用於基板之製備,且控制塗覆條件,使聚合物塗佈層(丙烯基改質聚酯層)在乾燥後具有1000奈米之厚度。
分別如實施例1和2之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,且控制塗覆條件,使聚合物塗佈層(丙烯基改質聚酯層)在乾燥後具有100奈米之厚度。
分別如實施例1和2之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,且控制塗覆條件,使聚合物塗佈層(丙烯基改質聚酯層)在乾燥後具有500或300奈米之厚度。
分別如實施例1和2之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,且控制塗覆條件,使聚合物塗佈層(丙烯基改質聚酯層)在乾燥後具有1000奈米之厚度。
如實施例1之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,其聚合物塗佈層藉由塗覆溶解於甲苯之丙烯腈(AN)、甲基丙烯酸甲酯(MMA)、苯乙烯(ST)、丙烯酸丁酯(BA)和α-甲基苯乙烯(AMST)共聚物(重量比:15:5:28:50:2(AN:MMA:ST:BA:AMST))而製備之溶液,經電漿處理表面和乾燥該塗覆溶液,形成具有500奈米之厚度。
如實施例2之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,其聚合物塗佈層藉由塗覆溶解於甲苯之丙烯腈(AN)、甲基丙烯酸甲酯(MMA)、苯乙烯(ST)、丙烯酸丁酯(BA)和α-甲基苯乙烯(AMST)共聚物(重量比:15:5:28:50:2(AN:MMA:ST:BA:AMST))而製備之溶液,經電漿處理表面和乾燥該塗覆溶液,形成具有100或300奈米之厚度。
分別如實施例34和35之相同方法製備之多層板,除了聚合物塗佈層乾燥後之厚度控制在1000奈米。
如實施例1之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,其聚合物塗佈層藉由塗覆溶解於甲苯之甲基丙烯腈(MAN)、甲基丙烯酸甲酯(MMA)、和丙烯酸乙酯(EA)共聚物(重量比:35:25:40(MAN:MMA:EA))和1重量分之交聯劑,對甲苯磺酸(p-TSA)而製備之溶液,經電漿處理表面和乾燥該塗覆溶液,形成具有500奈米之厚度。
如實施例2之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,其聚合物塗佈層藉由塗覆溶解於甲苯之甲基丙烯腈(MAN)、甲基丙烯酸甲酯(MMA)、和丙烯酸乙酯(EA)共聚物(重量比:35:25:40(MAN:MMA:EA))和1重量分之交聯劑,對甲苯磺酸(p-TSA)而製備之溶液,經電漿處理表面和乾燥該塗覆溶液,形成具有100或300奈米之厚度。
分別如實施例39和40之相同方法製備之多層板,除了聚合物塗佈層乾燥後之厚度控制在1000奈米。
實施例24至43之每一多層板,在完成如同實施例1之相同方法之PCT測試,並完成180度剝離強度和百格測試後,然後結果列於下列表6。
如表6所示,本發明之多層板實例,氟基樹脂層表現出初期強固黏附於基板(PET)和100小時PCT後之優異黏附。此外,經過100小時PCT後,在氟基樹脂層並沒有觀察到外部之變化,如黃化、界面剝離和銷孔之形成。
分別如實施例1和2之相同方法製備之多層板,除了聚合物塗佈層(丙烯基改質聚酯層)並未形成於基板之製備。
分別如實施例1和2之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,且並未形成聚合物塗佈層(丙烯基改質聚酯層)。
分別如實施例1和2之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,並未形成聚合物塗佈層(丙烯基改質聚酯層),但一矽烷偶聯劑(γ-環氧丙烷丙基三甲氧基矽烷)溶液被塗覆,在乾燥後具有600奈米之厚度。
分別如實施例1和2之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,並未形成聚合物塗佈層(丙烯基改質聚酯層),但一矽烷偶聯劑(甲基丙烯基氧丙基三乙氧基矽烷)溶液被塗覆,在乾燥後具有600奈米之厚度。
分別如實施例1和2之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,並未形成聚合物塗佈層(丙烯基改質聚酯層),但一矽烷偶聯劑(N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷)溶液被塗覆,在乾燥後具有600奈米之厚度。
分別如實施例1和2之相同方法製備之多層板,除了未經過電暈處理之PET用於基板之製備,100克具有結晶度約60%之PVDF單獨溶解於1600充之二甲基甲醯胺(DMF),以製備氟基樹脂層之塗佈溶液。
如實施例1之相同方法製備之多層板,除了100克具有結晶度約60%之PVDF和20克之PMMA溶解於1600克之DMF,以製備氟基樹脂層之塗佈溶液。
如實施例2之相同方法製備之多層板,除了100克具有結晶度約60%之PVDF溶解於1600克之DMF,以製備氟基樹脂層之塗佈溶液。
如實施例1之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,而100克具有結晶度約60%之PVDF和20克之PMMA溶解於1600克之DMF,以製備氟基樹脂層之塗佈溶液。
如實施例2之相同方法製備之多層板,除了已經過電漿處理之PET用於基板之製備,而100克具有結晶度約60%之PVDF溶解於1600克之DMF,以製備氟基樹脂層之塗佈溶液。
比較例3至18之多層板,在完成如同實施例2之相同方法之25小時濕熱測試,並完成180度剝離強度和百格測試後,然後結果列於下列表7。
如表7所示,它是證實在沒有形成聚合物塗佈層,或有形成但因為高結晶度而無法相互擴散時,其濕熱試驗後之黏接強度將下降。
本發明提供一多層板,其中含有氟樹脂之樹脂層具有優異之耐久性和耐候性,同時也對基板或聚合物塗層呈現出高黏合強度。此外,在本發明中,多層板可使用低沸點溶劑,在低成本之低乾燥溫度製備。此外,其產能可以提高,並預防熱變形或熱衝擊造成產品品質下降。由於此多層板可有效地被使用為,例如,光電池之背板,光電模組,在長期暴露於戶外環境時,可提供具有優異之耐用性。
雖然本發明已被參考之具體實施例所顯示和描述,應該被瞭解的是,在不悖離如依附申請專利範圍所定義之本發明之範籌下,技藝中之各種變化形式和細節之技術是可以被使用。
10‧‧‧多層版
11‧‧‧基板
12,12a,12b‧‧‧聚合物塗佈層
13,13a,13b‧‧‧氟基樹脂層
圖1係根據本發明一具體實施例之多層板橫斷面示意圖。
圖2係根據本發明一具體實施例之多層板橫斷面示意圖。
10...多層板
11...基板
12...聚合物塗佈層
13...氟基樹脂層
Claims (28)
- 一種多層板,包括:一基板;一氟基樹脂層,其包括一具有非結晶區域和少於60%結晶度之氟基樹脂;以及一聚合物塗佈層,其相容於該氟基樹脂,並形成於該基板和該氟基樹脂層之間;其中,該氟基樹脂包括一均聚物、共聚物或其混合物,包括至少一單體選自由聚合物型式之偏氟乙烯(VDF)、氟乙烯(VF)、四氟乙烯(TFE)、六氟丙烯(HFP)、三氟氯乙烯(CTFE)、三氟乙烯、六氟異丁烯、全氟丁基乙烯、全氟(甲基乙烯醚)(PMVE)、全氟(乙基乙烯醚)(PEVE)、全氟丙基乙烯醚(PPVE)、全氟甲基乙烯醚(PMVE)、全氟-2,2-二甲基-1,3-二氧雜環戊烯(PDD)和全氟-2-亞甲基-4-甲基-1,3-二氧戊環(PMD)組成之群組,其中該聚合物塗佈層係形成於該基板上,該聚合物塗佈層之聚合物包括相容於該氟基樹脂之主鏈骨架,且該氟基樹脂層係形成於該聚合物塗佈層之上,以及其中,該主鏈骨架包括至少一選自由(甲基)丙烯基、胺甲酸乙酯基、醚碸基、醚亞胺基、醯胺基、聚酯基、脂肪族聚酯基、聚酯胺甲酸乙酯基、(甲基)丙烯醯胺基、尿素基和聚碳酸酯基之主鏈骨架組成之群組;以及一單體混合物誘導形成之自由基加成聚合物之主鏈骨架,該單體混合物包括(甲基)丙烯基單體、(甲基)丙烯醯胺基單體或乙烯 基單體為主要成分。
- 如申請專利範圍第1項所述之多層板,其中該聚合物塗佈層更包括一官能基,該官能基可包括至少一個選自由羧基、磺酸基、氮丙啶基、酸酐基、胺基、異氰酸基、三聚氰胺基、環氧基、羥基、酯官能基、胺甲酸酯官能基、醯胺基、尿素基、醯亞胺基、磷酸鹽基、磷酸基、氰基、氰酸鹽基和亞胺基組成之群組。
- 如申請專利範圍第1項所述之多層板,其中該聚合物塗佈層包括一具有當量數為800至30000之官能基。
- 如申請專利範圍第1項所述之多層板,其中該聚合物塗佈層具有10至5000奈米之厚度。
- 如申請專利範圍第1項所述之多層板,其中該具有非結晶區域之氟基樹脂具有結晶度為55%或更低。
- 如申請專利範圍第1項所述之多層板,其中該氟基樹脂為一包括氟乙烯均聚物或共聚物之聚合物型式;或一包括偏氟乙烯均聚物或共聚物之聚合物型式。
- 如申請專利範圍第1項所述之多層板,其中該氟基樹脂包括偏氟乙烯之聚合物型式,且更進一步包括至少一種共聚單體,該共聚單體係選自由:六氟丙烯(HFP)、三氟氯乙烯(CTFE)、四氟乙烯(TFE)、三氟乙烯、六氟異丁烯、全氟丁基乙烯、全氟(甲基乙烯醚)(PMVE)、全氟-2,2-二甲基-1,3-二氧雜環戊烯(PDD)和全氟-2-亞甲基-4-甲基-1,3-二氧戊環(PMD)組成之群組。
- 如申請專利範圍第6至7項之任一項所述之多層 板,其中該氟基樹脂具有50,000至1,000,000之重量平均分子量。
- 如申請專利範圍第1項所述之多層板,其中該氟基樹脂具有80至175℃之熔點。
- 如申請專利範圍第7項所述之多層板,其中該共聚單體之含量為0.5至50重量百分比。
- 如申請專利範圍第7項所述之多層板,其中該共聚單體之含量為10至30重量百分比。
- 如申請專利範圍第1項所述之多層板,其中該氟基樹脂層進一步包括一非結晶樹脂。
- 如申請專利範圍第12項所述之多層板,其中該非結晶樹脂為丙烯基樹脂、聚碳酸酯、聚氯乙烯、苯乙烯-(甲基)丙烯腈共聚物、苯乙烯-馬來酸酐共聚物、環烯烴聚合物、聚丙烯腈、聚苯乙烯、聚碸、聚醚碸和聚丙烯酸酯。
- 如申請專利範圍第12項所述之多層板,其中該非結晶樹脂係為一均聚物或共聚物,包括至少一種單體選自由:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸和(甲基)丙烯酸異莰酯組成之群組之聚合物型式。
- 如申請專利範圍第14項所述之多層板,其中該共聚物進一步包括至少一種單體選自由環己基順丁烯二醯亞胺、甲基苯乙烯和(甲基)丙烯腈組成之群組之聚合物型式。
- 如申請專利範圍第1項所述之多層板,其中該氟基樹脂層進一步包括一顏料、填充劑、紫外線安定劑、熱安 定劑或障壁粒子。
- 如申請專利範圍第1項所述之多層板,其中該氟基樹脂層具有3至50微米之厚度。
- 如申請專利範圍第1項所述之多層板,其中該基板為鋁、鐵;或單一板片、堆疊板片,或聚對苯二甲酸乙二酯(PET)、聚對萘二甲酸乙二酯(PEN)或聚對苯二甲酸丁二酯(PBT)之共擠壓成形品。
- 如申請專利範圍第1項所述之多層板,其中該基板之至少一表面受到至少一選自由電漿處理、電暈處理、底漆處理、黏固劑處理,偶合劑處理和熱處理之表面處理。
- 如申請專利範圍第1項所述之多層板,其中該基板具有50至500微米之厚度。
- 一種製備如申請專利範圍第1項所述之多層板之方法,包括:提供一基板;形成一聚合物塗佈層,係藉由塗佈一相容於氟基樹脂之聚合物組成物於該基板上;以及形成一氟基樹脂層,係藉由塗佈一包括該氟基樹脂以及溶劑之塗佈溶液於該聚合物塗佈層上,其具有非結晶區域且少於60%結晶度,且該溶劑具有200℃或更低之沸點;其中,該氟基樹脂包括一均聚物、共聚物或其混合物,包括至少一單體選自由聚合物型式之偏氟乙烯(VDF)、氟乙烯(VF)、四氟乙烯(TFE)、六氟丙烯(HFP)、三氟氯乙烯(CTFE)、三氟乙烯、六氟異丁烯、全氟丁基乙烯、全氟(甲 基乙烯醚)(PMVE)、全氟(乙基乙烯醚)(PEVE)、全氟丙基乙烯醚(PPVE)、全氟甲基乙烯醚(PMVE)、全氟-2,2-二甲基-1,3-二氧雜環戊烯(PDD)和全氟-2-亞甲基-4-甲基-1,3-二氧戊環(PMD)組成之群組,其中該聚合物塗佈層係形成於該基板上,該聚合物塗佈層之該聚合物組成物包括相容於該氟基樹脂之主鏈骨架,且該氟基樹脂層係形成於該聚合物塗佈層之上,以及其中,該主鏈骨架包括至少一選自由(甲基)丙烯基、胺甲酸乙酯基、醚碸基、醚亞胺基、醯胺基、聚酯基、脂肪族聚酯基、聚酯胺甲酸乙酯基、(甲基)丙烯醯胺基、尿素基和聚碳酸酯基之主鏈骨架組成之群組;以及一單體混合物誘導形成之自由基加成聚合物之主鏈骨架,該單體混合物包括(甲基)丙烯基單體、(甲基)丙烯醯胺基單體或乙烯基單體為主要成分。
- 如申請專利範圍第21項所述之方法,其中該聚合物組成物之聚合物包括一官能基。
- 如申請專利範圍第21項所述之方法,其中該溶劑具有200℃或更低之沸點,並包括至少一選自由丙酮、甲基乙基酮、二甲基甲醯胺、二甲基乙醯胺組成之群組。
- 如申請專利範圍第21項所述之方法,更進一步包括塗佈後之塗佈層乾燥。
- 如申請專利範圍第24項所述之方法,其中乾燥係在200℃或以下進行30秒至30分鐘。
- 如申請專利範圍第21項所述之方法,其中該基板 之至少一表面進一步受到至少一選自由電漿處理、電暈處理、底漆處理、黏固劑處理、偶合劑處理和熱處理之表面處理。
- 一種光電池之背板,其包括根據申請專利範圍第1項所述之多層板。
- 一種光電模組,其包括根據申請專利範圍第27項所述之光電池之背板。
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EP2567813A2 (en) | 2013-03-13 |
CN103038061A (zh) | 2013-04-10 |
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CN103038061B (zh) | 2016-09-28 |
US20130171447A1 (en) | 2013-07-04 |
KR101519183B1 (ko) | 2015-05-11 |
EP2567813A4 (en) | 2017-03-08 |
KR20110123212A (ko) | 2011-11-14 |
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US9312415B2 (en) | 2016-04-12 |
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