TWI517293B - Method and apparatus of picking and placing dies for increasing production capacity - Google Patents
Method and apparatus of picking and placing dies for increasing production capacity Download PDFInfo
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Description
本發明係一種提高產能之晶粒取放方法及其裝置，其係提供一種能夠提高取放晶粒的數量，以提升產能的裝置與方法。 The invention relates to a grain pick-and-place method and a device thereof for improving productivity, and provides a device and a method capable of increasing the number of pick-and-place crystal grains to increase productivity.
於半導體製程中，速度是往往是非常重要的考量因素，所以如何在最短的時間內，生產出最多的產品，一直都是業界所追求的目標。 In the semiconductor manufacturing process, speed is often a very important consideration, so how to produce the most products in the shortest time has always been the goal pursued by the industry.
而於半導體後段製程當中，晶片，亦稱晶粒，往往需要不斷地傳輸運送，故晶粒的挑檢是相當關鍵的技術。 In the semiconductor back-end process, wafers, also known as dies, often need to be transported continuously, so the picking of the die is a fairly critical technology.
為了確保晶粒挑撿時的精度與穩定性，因此每個晶粒在挑撿前需先以視覺系統個別定位，以利逐顆挑撿，逐顆置放，也使得一般的取放應用系統產出速度受限。 In order to ensure the precision and stability of the crystal provocation, each crystal grain needs to be individually positioned by the visual system before provocation, so as to facilitate the picking and arranging one by one, and also make the general pick and place application system. The output speed is limited.
因受限於晶圓平台與置放載具尺寸與載具移動平台之機構空間的限制，吸取單元需要經過一較長的行程，方能使單一晶粒由晶圓平台移至晶粒置放載具，故產能(Unit Per Hour，UPH)的效能不佳，所以業界係研究如何縮短吸取單元的行程，以及吸取單元能夠吸取多個晶粒，藉以提升產能的課題。 Due to the limitation of the size of the wafer platform and the placement of the carrier and the space of the mobile platform of the carrier, the suction unit needs a long stroke to move a single die from the wafer platform to the die placement. The performance of the Unit Per Hour (UPH) is not good, so the industry is studying how to shorten the stroke of the suction unit and the problem that the suction unit can absorb a plurality of crystal grains to increase the production capacity.
有鑑於上述之課題，本發明之目的在於提供一種提高產能之晶粒取放方法及其裝置，其係將晶粒的行程分為數段，以縮短晶粒所需移動的行程，並於各段分別使用具有相同或不同數量的吸取頭之吸取單元，藉以提升產能。 In view of the above problems, an object of the present invention is to provide a die pick-and-place method and apparatus for improving productivity, which divides the stroke of a die into several segments to shorten the travel of the die, and in each segment The suction unit with the same or different number of suction heads is used separately to increase the production capacity.
為了達到上述之目的，本發明之技術手段在於提供一種提高 產能之晶粒取放方法，其包含有：提供一具有複數個晶粒的晶圓，並且依序吸取一晶粒，並將該晶粒放置於一中載台；該中載台係將該些晶粒予以定位；以及吸取該些已定位之晶粒，並將其置放於一晶粒承載台。 In order to achieve the above object, the technical means of the present invention is to provide an improvement A method for accommodating a granule of a capacity, comprising: providing a wafer having a plurality of dies, and sequentially absorbing a die and placing the die on a middle stage; the middle stage The dies are positioned; and the positioned dies are taken up and placed on a die stage.
本發明復提供一種提高產能之晶粒取放裝置，其包含有：一能夠置放一具有複數個晶粒的晶圓之晶圓承載台；一能夠放置該些晶粒之晶粒承載台；一能夠定位該些晶粒之中載台，其係設於該晶粒承載台與該晶圓承載台之間；一能夠吸取至少一位於該晶圓承載台的晶粒，且將該晶粒放置於該中載台之第一吸取單元，其係設於該晶圓承載台的上方，並於該晶圓承載台與該中載台之間呈往復運動；以及一能夠吸取至少一個位於該中載台的晶粒，且將該些晶粒放置於該晶粒承載台上的載具之第二吸取單元，其係設於該晶粒承載台的上方，並於該晶粒承載台與該中載台之間呈往復運動。 The present invention provides a chip pick-and-place device for improving productivity, comprising: a wafer carrier capable of placing a wafer having a plurality of crystal grains; and a die carrier capable of placing the crystal grains; Locating a stage in the plurality of dies, which is disposed between the die pad and the wafer carrier; and capable of absorbing at least one die on the wafer carrier, and the die a first suction unit disposed on the middle stage, disposed above the wafer carrier and reciprocating between the wafer carrier and the middle stage; and capable of sucking at least one of the a second pick-up unit of the carrier of the middle stage, and the plurality of carriers for placing the dies on the die stage, is disposed above the die stage, and is mounted on the die stage The medium stage reciprocates between the stages.
如上所述，第一吸取單元與第二吸取單元的行程較現有的吸取單元為短，所以第一吸取單元與第二吸取單元於同樣的時間下相較於現有的吸取單元，第一吸取單元與第二吸取單元能夠達到較多的往復次數，故能取放更多的晶粒，所以能夠提升產能。 As described above, the strokes of the first suction unit and the second suction unit are shorter than those of the existing suction unit, so the first suction unit and the second suction unit are compared with the existing suction unit at the same time, and the first suction unit Since the second suction unit can achieve a large number of reciprocating times, more crystal grains can be taken and removed, so that the productivity can be improved.
再者，中繼台可以設置於晶圓承載台上方，以縮短第一吸取單元取放的行程，其餘的行程雖然可能較長，可由第二吸取單元一次吸取多顆晶粒，進行同步或不同步置放，以即時將中繼台的多顆晶粒移送至晶粒承載台上，如此以大幅提昇晶粒取放的效率。 Furthermore, the relay station can be disposed above the wafer carrier to shorten the stroke of the first pick-up unit. Although the remaining strokes may be long, the second pick-up unit can pick up multiple dies at a time for synchronization or not. Simultaneous placement to instantly transfer multiple dies of the repeater to the die carrier, thus greatly improving the efficiency of die pick-and-place.
10‧‧‧晶圓承載台 10‧‧‧ Wafer Carrier
11‧‧‧頂針 11‧‧‧ thimble
20‧‧‧晶粒承載台 20‧‧‧Grade carrier
30‧‧‧中載台 30‧‧‧中台
31‧‧‧定位單元 31‧‧‧ Positioning unit
32‧‧‧定位空間 32‧‧‧Location space
40‧‧‧第一視覺定位單元 40‧‧‧First visual positioning unit
50‧‧‧第二視覺定位單元 50‧‧‧Second visual positioning unit
60‧‧‧第一吸取單元 60‧‧‧First suction unit
70‧‧‧第二吸取單元 70‧‧‧Second suction unit
8‧‧‧晶圓 8‧‧‧ wafer
80‧‧‧晶粒 80‧‧‧ grain
90‧‧‧第三視覺定位單元 90‧‧‧ Third visual positioning unit
S1~S3‧‧‧步驟 S1~S3‧‧‧ steps
圖1為本發明之一種提高產能之晶粒取放裝置之動作示意圖。 FIG. 1 is a schematic view showing the operation of a die pick-and-place device for improving productivity according to the present invention.
圖2為複數個晶粒位於複數個定位空間之示意圖。 2 is a schematic diagram of a plurality of dies in a plurality of locating spaces.
圖3為晶粒之定位後示意圖。 Figure 3 is a schematic view of the positioning of the crystal grains.
圖4為本發明之一種提高產能之晶粒取放方法之流程示意圖。 FIG. 4 is a schematic flow chart of a method for picking and placing a die for improving productivity according to the present invention.
圖5為本發明之一種提高產能之晶粒取放裝置之另一動作示 意圖。 FIG. 5 is another action diagram of a die pick-and-place device for improving productivity according to the present invention; FIG. intention.
以下係藉由特定的具體實施例說明本發明之實施方式，所屬技術領域中具有通常知識者可由本說明書所揭示之內容，輕易地瞭解本發明之其他優點與功效。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily understand the other advantages and advantages of the present invention.
請配合參考圖1所示，本發明係一種提高產能之晶粒取放裝置，其具有一晶圓承載台10、一晶粒承載台20、一中載台30、一第一視覺定位單元40、一第二視覺定位單元50、一第一吸取單元60、一第二吸取單元70與一選擇性第三視覺定位單元90。 Referring to FIG. 1 , the present invention is a chip pick-and-place device for improving productivity, which has a wafer carrier 10 , a die carrier 20 , a middle carrier 30 , and a first visual positioning unit 40 . A second visual positioning unit 50, a first suction unit 60, a second suction unit 70 and a selective third visual positioning unit 90.
晶圓承載台10的底端具有一頂針11，頂針11係能夠呈一縱向移動，即一Z軸方向移動，晶圓承載台10的上方具有一晶圓8，晶圓8具有複數個晶粒80，晶圓承載台10係能夠呈一橫向移動與一前後移動，晶圓承載台10能夠設置具有多顆晶粒的晶圓環、拖盤(tray盤)或其他載具，或者為膠捲。 The bottom end of the wafer carrier 10 has a ejector pin 11 which is movable in a longitudinal direction, that is, in a Z-axis direction. The wafer carrier 10 has a wafer 8 above it, and the wafer 8 has a plurality of crystal grains. 80. The wafer carrier 10 can be moved in a lateral direction and back and forth. The wafer carrier 10 can be provided with a wafer ring having a plurality of crystal grains, a tray or other carrier, or a film.
晶粒承載台20的頂端係能夠承載複數個晶粒80，晶粒承載台20係能夠呈一橫向移動與一前後移動，即如圖所示之一X軸向移動與一Y軸向移動，晶粒承載台20能夠設有一載具、一托盤或一具有膠膜之晶圓環，或者一裝置複數個晶粒的捲帶。 The top end of the die stage 20 can carry a plurality of crystal grains 80, and the crystal stage 20 can move in a lateral direction and a back and forth movement, that is, one X-axis movement and one Y-axis movement as shown in the figure. The die stage 20 can be provided with a carrier, a tray or a wafer ring with a film, or a tape of a plurality of dies.
中載台30係設於晶圓承載台10與晶粒承載台20之間，中載台30係能夠呈一前後移動，即如圖所示之一Y軸向移動，請配合參考圖2所示，中載台30的頂端進一步具有一定位單元31，定位單元31係能夠呈一橫向移動與一前後移動，即如圖所示之一X軸向移動與一Y軸向移動，定位單元31具有複數個定位空間32，舉例而言，定位空間32的數量能夠為二、三、四、五、六或以上，於本實施例的圖式中係僅以四個為代表，但不限制於該數量。 The intermediate stage 30 is disposed between the wafer carrier 10 and the die carrier 20, and the middle stage 30 is movable back and forth, that is, one of the Y-axis movements as shown in the drawing. It is shown that the top end of the intermediate stage 30 further has a positioning unit 31, and the positioning unit 31 can be moved in a lateral direction and a forward and backward movement, that is, one of the X-axis movement and the Y-axis movement as shown in the figure, the positioning unit 31 With a plurality of positioning spaces 32, for example, the number of the positioning spaces 32 can be two, three, four, five, six or more. In the figure of the embodiment, only four are represented, but not limited to The number.
如圖1及圖2所示，定位單元31係沿著X軸向移動，故晶粒80係平行X軸向，同理，下述之第一吸取單元60，若為複數個，該複數個第一吸取單元60亦平行X軸向。 As shown in FIG. 1 and FIG. 2, the positioning unit 31 moves along the X-axis, so that the crystal grains 80 are parallel to the X-axis, and similarly, the first suction unit 60 described below, if plural, is plural. The first suction unit 60 is also parallel to the X-axis.
請配合參考圖5所示，若定位單元31係沿著Y軸向移動，晶粒80係平行Y軸向，該複數個第一吸取單元60亦平行Y軸向。 Referring to FIG. 5, if the positioning unit 31 moves along the Y-axis, the die 80 is parallel to the Y-axis, and the plurality of first suction units 60 are also parallel to the Y-axis.
第一視覺定位單元40係設於晶圓承載台10的上方。 The first visual positioning unit 40 is disposed above the wafer carrier 10 .
第二視覺定位單元50係設於晶粒承載台20的上方。 The second visual positioning unit 50 is disposed above the die stage 20 .
第一吸取單元60係設於第一視覺定位單元40與晶圓承載台10之間，並且第一吸取單元60具有至少一吸取頭，舉例而言，如圖1所示，於本實施例中，第一吸取單元60僅具有單一吸取頭，但吸取頭的數量係可依實際需求而增加或減少，故吸取頭的數量非限定於本實施例所揭露的內容，第一吸取單元60係能夠於晶圓承載台10與中載台30之間往復運動。 The first suction unit 60 is disposed between the first visual positioning unit 40 and the wafer carrier 10, and the first suction unit 60 has at least one suction head. For example, as shown in FIG. 1, in this embodiment, The first pick-up unit 60 has only a single pick-up head, but the number of pick-up heads can be increased or decreased according to actual needs. Therefore, the number of pick-up heads is not limited to the content disclosed in the embodiment, and the first pick-up unit 60 is capable of Reciprocating between the wafer carrier 10 and the intermediate stage 30.
第二吸取單元70係設於第二視覺定位單元50與晶粒承載台20之間，並且第二吸取單元70具有複數個吸取頭，並且吸取頭的數量係等同定位空間32的數量，吸取頭的數量亦可依實際需求而增加或減少，第二吸取單元70係能夠於晶粒承載台20與中載台30之間往復運動。 The second suction unit 70 is disposed between the second visual positioning unit 50 and the die carrying platform 20, and the second suction unit 70 has a plurality of suction heads, and the number of the suction heads is equivalent to the number of the positioning spaces 32, and the suction head The number of the suction units 70 can also be increased or decreased according to actual needs, and the second suction unit 70 can reciprocate between the die stage 20 and the middle stage 30.
第三視覺定位單元90係設於中載台30的上方，第三視覺定位單元90能夠對位於中載台30上的晶粒80進行定位，以提高第二吸取單元70置放晶粒80的精準度。 The third visual positioning unit 90 is disposed above the middle stage 30. The third visual positioning unit 90 can position the die 80 located on the middle stage 30 to improve the placement of the die 80 by the second suction unit 70. Precision.
如上所述，若第一吸取單元60欲吸取更多的晶粒80，則可增加吸取頭的數量，而第二吸取單元70之吸取頭的數量與定位空間32的數量則可隨之調整，所以第二吸取單元70之吸取頭的數量與定位空間32的排列方向係可不同，亦可呈矩陣方式。 As described above, if the first pick-up unit 60 is to suck more of the die 80, the number of the pick-up heads can be increased, and the number of the pick-up heads of the second pick-up unit 70 and the number of the positioning spaces 32 can be adjusted accordingly. Therefore, the number of the suction heads of the second suction unit 70 and the arrangement direction of the positioning space 32 may be different, or may be in a matrix manner.
請配合參考圖4所示，本發明係一種提高產能之晶粒取放方法，其包含有： Referring to FIG. 4, the present invention is a method for improving the throughput of a crystal chip, which comprises:
S1：如圖1所示，一具有複數個晶粒80之晶圓8係設於一晶圓承載台10，一第一視覺定位單元40係定位一欲吸取之晶粒80，一頂針11係由下往上推抵，以將欲吸取之晶粒80推離晶圓承載台10，一第一吸取單元60依據第一視覺定位單元40所提供的定位資訊，第一吸取單元60移動至欲吸取之晶粒80的上方，並以一真空吸力吸附晶粒80，再將其移動且放置於一中載台30的定位單元31之定位空間32中，第一吸取單元60係往復多次，以吸取更多的晶粒80，直至各晶粒80佈滿各定位空間32。 S1: As shown in FIG. 1, a wafer 8 having a plurality of dies 80 is disposed on a wafer carrier 10. A first visual positioning unit 40 is positioned to receive a die 80 and a thimble 11 The first suction unit 60 moves to the desired position according to the positioning information provided by the first visual positioning unit 40, and the first suction unit 60 moves to the desired position. The upper portion of the die 80 is sucked, and the die 80 is adsorbed by a vacuum suction, and then moved and placed in the positioning space 32 of the positioning unit 31 of the middle stage 30. The first suction unit 60 is reciprocated a plurality of times. To absorb more of the crystal grains 80 until each of the crystal grains 80 fills each of the positioning spaces 32.
S2：請配合參考圖3所示，一定位單元31係呈至少一次橫向移動或至少一次前後移動，直至各晶粒80的邊緣貼齊各定位空間32的角落，如此方完成晶粒80的定位。 S2: Please refer to FIG. 3, a positioning unit 31 is moved at least once laterally or at least once, until the edges of the dies 80 are aligned with the corners of the positioning spaces 32, so that the positioning of the dies 80 is completed. .
若定位單元31無法完成晶粒80的定位，第三視覺定位單元90係擷取位於定位空間32之晶粒80的影像，該影像係提供給第二吸取單元70，以作為第二吸取單元70於吸取位於定位空間32之晶粒80的定位資訊。 If the positioning unit 31 is unable to complete the positioning of the die 80, the third visual positioning unit 90 captures the image of the die 80 located in the positioning space 32, and the image is provided to the second picking unit 70 as the second picking unit 70. The positioning information of the die 80 located in the positioning space 32 is extracted.
S3：第二吸取單元70係移動至已定位之晶粒80的上方，第二吸取單元70的各吸取頭係對應各晶粒80，並以一真空吸力吸附晶粒80，一第二視覺定位單元50係提供一定位資訊給第二吸取單元70，以使第二吸取單元70得以將晶粒80移動至且放置於一晶粒承載台20，待晶粒80放置完成後，第二吸取單元70回復至最初位置，直至S1與S2的步驟完成後，再次重複S3的步驟。 S3: the second suction unit 70 moves to the top of the positioned die 80, and each of the suction heads of the second suction unit 70 corresponds to each die 80, and absorbs the die 80 by a vacuum suction, and a second visual positioning The unit 50 provides a positioning information to the second pick-up unit 70, so that the second pick-up unit 70 can move the die 80 to and be placed on a die carrier 20. After the die 80 is placed, the second pick-up unit 70 returns to the original position until the steps of S1 and S2 are completed, and the steps of S3 are repeated again.
如前所述之定位資訊，若以第三視覺定位單元90論述，第三視覺定位單元90係擷取位於定位空間32之晶粒80的影像，該影像係為第三視覺定位單元90提供給第二吸取單元70的定位資訊，假若以第二視覺定單元50論述，第二視覺定位單元50係擷取位於第二吸取單元70之晶粒80與晶粒承載台20的影像，該影像為第二視覺定位單元50提供給第二吸取單元70的定位資訊。 As described above, the third visual positioning unit 90 captures an image of the die 80 located in the positioning space 32, which is provided by the third visual positioning unit 90. The second visual positioning unit 50 captures the image of the die 80 and the die carrier 20 of the second pick-up unit 70, which is the image of the second pick-up unit 70. The second visual positioning unit 50 provides positioning information to the second suction unit 70.
綜合上述，晶粒的行程係被分為段落式，各段係分別由第一吸取單元與第二吸取單元傳送至少一晶粒或多個晶粒，並且由中載台定位晶粒，以使第二吸取單元能夠準確地吸取晶粒，並將晶粒置放於晶粒承載台上的預定位置，因晶粒的行程已縮短，而且第一吸取單元與第二吸取單元的行程亦隨之縮短，如使能夠有效地提升產能。 In summary, the stroke of the die is divided into paragraphs, and each segment transmits at least one die or a plurality of die by the first suction unit and the second suction unit, respectively, and the die is positioned by the middle stage so that The second pick-up unit can accurately pick up the die and place the die on a predetermined position on the die stage, since the stroke of the die has been shortened, and the travel of the first pick-up unit and the second pick-up unit is also followed. Shorten, such as to effectively increase production capacity.
惟以上所述之具體實施例，僅係用於例釋本發明之特點及功效，而非用於限定本發明之可實施範疇，於未脫離本發明上揭之精神與技術範疇下，任何運用本發明所揭示內容而完成之等效改變及修飾，均仍應為下述之申請專利範圍所涵蓋。 However, the specific embodiments described above are merely used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and may be applied without departing from the spirit and scope of the present invention. Equivalent changes and modifications made to the disclosure of the present invention are still covered by the scope of the following claims.
10‧‧‧晶圓承載台 10‧‧‧ Wafer Carrier
11‧‧‧頂針 11‧‧‧ thimble
20‧‧‧晶粒承載台 20‧‧‧Grade carrier
30‧‧‧中載台 30‧‧‧中台
40‧‧‧第一視覺定位單元 40‧‧‧First visual positioning unit
50‧‧‧第二視覺定位單元 50‧‧‧Second visual positioning unit
60‧‧‧第一吸取單元 60‧‧‧First suction unit
70‧‧‧第二吸取單元 70‧‧‧Second suction unit
8‧‧‧晶圓 8‧‧‧ wafer
80‧‧‧晶粒 80‧‧‧ grain
90‧‧‧第三視覺定位單元 90‧‧‧ Third visual positioning unit
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102101113A TWI517293B (en) | 2013-01-11 | 2013-01-11 | Method and apparatus of picking and placing dies for increasing production capacity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102101113A TWI517293B (en) | 2013-01-11 | 2013-01-11 | Method and apparatus of picking and placing dies for increasing production capacity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201428883A TW201428883A (en) | 2014-07-16 |
| TWI517293B true TWI517293B (en) | 2016-01-11 |
Family
ID=51726171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102101113A TWI517293B (en) | 2013-01-11 | 2013-01-11 | Method and apparatus of picking and placing dies for increasing production capacity |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI517293B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI780424B (en) * | 2020-04-07 | 2022-10-11 | 均華精密工業股份有限公司 | Improving accuracy and speed of bonding apparatus |
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2013
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201428883A (en) | 2014-07-16 |
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