TWI510364B - Adhesive component - Google Patents
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- TWI510364B TWI510364B TW102124091A TW102124091A TWI510364B TW I510364 B TWI510364 B TW I510364B TW 102124091 A TW102124091 A TW 102124091A TW 102124091 A TW102124091 A TW 102124091A TW I510364 B TWI510364 B TW I510364B
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Description
本發明係關於一種應用於觸摸顯示裝置中的黏接結構。 The present invention relates to a bonding structure applied to a touch display device.
現有之觸控顯示裝置,例如具觸控功能的手機、平板電腦等,為使得接收觸控操作的觸控模組與顯示模組的有效貼合,均需要採用黏接結構進行連接,以達到貼合、密封等功效。然,在實際應用中,將觸控模組與顯示模組組裝後,經常會發現該黏接結構中的黏性物質會黏附或者轉印至觸控模組或顯示模組的表面上,例如黏接結構中的離型劑會轉印至觸控模組的感測基板上,造成觸控模組在外觀及品質上的瑕疵。 The existing touch display device, such as a mobile phone with a touch function, a tablet computer, etc., is required to be connected by a bonding structure in order to make an effective fit between the touch module and the display module. Fit, seal and other effects. However, in practical applications, after the touch module and the display module are assembled, it is often found that the adhesive substance in the adhesive structure is adhered or transferred to the surface of the touch module or the display module, for example, The release agent in the bonding structure is transferred to the sensing substrate of the touch module, causing flaws in the appearance and quality of the touch module.
有鑑於此,提供一種能夠防止對待黏貼的裝置產生污染或者轉印缺陷的黏接結構。 In view of the above, there is provided an adhesive structure capable of preventing contamination or transfer defects of a device to be pasted.
一種黏接結構,包括承載膜、具有開口的緩衝層、第一黏貼層以及離型膜,該承載膜與該第一黏貼層設置於該緩衝層兩個相對的表面,該承載膜鄰近該第一黏帖層的表面附有一第一保護膜,且該第一保護膜設置於該緩衝層的開口處,該離型膜設置於該第一黏貼層遠離該緩衝層的表面,該黏接結構還包括一第二保護膜,該第二保護膜設置於該離型膜鄰近該第一黏貼層的表面,阻隔該離型膜與該第一保護膜的相互接觸。 An adhesive structure comprising a carrier film, a buffer layer having an opening, a first adhesive layer, and a release film, wherein the carrier film and the first adhesive layer are disposed on two opposite surfaces of the buffer layer, and the carrier film is adjacent to the first a first protective film is disposed on the surface of the adhesive layer, and the first protective film is disposed at an opening of the buffer layer, and the release film is disposed on a surface of the first adhesive layer away from the buffer layer, the adhesive structure The second protective film is disposed on the surface of the release film adjacent to the first adhesive layer to block mutual contact between the release film and the first protective film.
相較於先前技術,本發明的黏接結構中,該離型膜與第一黏貼層之間還設置有第二保護膜,由此,在應用過程中,該第二保護膜能夠有效防止離型膜上的物質黏附或者轉印至待貼合模組之一,如觸控模組上,避免觸摸模組外觀不良、品質不佳。 Compared with the prior art, in the bonding structure of the present invention, a second protective film is disposed between the release film and the first adhesive layer, thereby preventing the second protective film from being effectively prevented during application. The substance on the film adheres or is transferred to one of the modules to be attached, such as a touch module, to avoid the poor appearance and poor quality of the touch module.
10‧‧‧黏接結構 10‧‧‧bonding structure
100‧‧‧承載膜 100‧‧‧ carrying film
200‧‧‧第一保護膜 200‧‧‧First protective film
300‧‧‧緩衝層 300‧‧‧buffer layer
400‧‧‧第一黏貼層 400‧‧‧First adhesive layer
500‧‧‧第二保護膜 500‧‧‧Second protective film
600‧‧‧第二黏貼層 600‧‧‧Second adhesive layer
700‧‧‧離型膜 700‧‧‧ release film
710‧‧‧主體部 710‧‧‧ Main body
720‧‧‧延伸部 720‧‧‧Extension
20‧‧‧觸控顯示裝置 20‧‧‧Touch display device
210‧‧‧觸控模組 210‧‧‧Touch Module
220‧‧‧顯示模組 220‧‧‧ display module
圖1係本發明黏接結構的分解示意圖。 Figure 1 is an exploded perspective view of the bonded structure of the present invention.
圖2係本發明黏接結構組合後的平面結構示意圖。 2 is a schematic view showing the planar structure of the bonded structure of the present invention.
圖3係圖2中黏接結構沿III-IIII線的剖面結構示意圖。 3 is a schematic cross-sectional view of the bonding structure of FIG. 2 taken along line III-IIII.
圖4係本發明黏接結應用於觸控顯示裝置的剖面結構示意圖。 4 is a schematic cross-sectional view showing the structure of the adhesive junction of the present invention applied to a touch display device.
下面將結合附圖,對本發明實施例作進一步之詳細說明。 The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.
請一併參閱圖1至3,其中,圖1為本發明黏接結構的分解示意圖,圖2為本發明黏接結構的組合示意圖,圖3為圖2中黏接結構沿III-III線的剖面結構示意圖。本實施方式中,黏接結構10優選地應用於一觸控顯示裝置,例如觸控手機或者平板電腦,用於將觸控顯示裝置中的觸控模組與其他模組,如顯示模組進行貼合連接。可以理解,該黏接結構10也可應用其他待貼合的模組中,並不以觸控顯示裝置為限。 1 to 3, wherein FIG. 1 is an exploded view of the bonding structure of the present invention, FIG. 2 is a schematic view of the bonding structure of the present invention, and FIG. 3 is a third embodiment of the bonding structure of FIG. Schematic diagram of the section structure. In this embodiment, the bonding structure 10 is preferably applied to a touch display device, such as a touch mobile phone or a tablet computer, for performing the touch module in the touch display device with other modules, such as a display module. Fit the connection. It can be understood that the bonding structure 10 can also be applied to other modules to be attached, and is not limited to the touch display device.
該黏接結構10包括承載膜100、第一保護膜200、緩衝層300、第一黏貼層400、第二保護膜500、第二黏貼層600以及離型膜700。其中,承載膜100、緩衝層300、第一黏貼層400以及離型膜700依次層疊設置,第一保護膜200設置於承載膜100與緩衝層300之間,第二保護膜500設置於第一黏貼層400與離型膜700之間。第二 黏貼層600設置於第二保護膜500與離型膜700之間。 The bonding structure 10 includes a carrier film 100 , a first protective film 200 , a buffer layer 300 , a first adhesive layer 400 , a second protective film 500 , a second adhesive layer 600 , and a release film 700 . The carrier film 100, the buffer layer 300, the first adhesive layer 400, and the release film 700 are sequentially stacked, the first protective film 200 is disposed between the carrier film 100 and the buffer layer 300, and the second protective film 500 is disposed at the first The adhesive layer 400 is between the adhesive film 700 and the release film 700. second The adhesive layer 600 is disposed between the second protective film 500 and the release film 700.
緩衝層300具有一定彈性,在本實施方式中,緩衝層300為丙烯酸類泡沫或者泡棉。 The buffer layer 300 has a certain elasticity. In the present embodiment, the buffer layer 300 is an acrylic foam or foam.
需要說明的是,為不影響觸控模組的正常工作,在觸控顯示模組中,黏接結構10中具備緩衝及黏性的緩衝層300設置於觸控顯示模組的邊緣部分,而並不對應觸控顯示裝置接收觸控操作以及顯示圖像的部分設置。故,本實施方式中緩衝層300與第一黏貼層400均為具有一中空開口的框形。 It should be noted that, in order to not affect the normal operation of the touch module, in the touch display module, the buffer layer 300 having the buffering and adhesiveness in the bonding structure 10 is disposed on the edge portion of the touch display module, and It does not correspond to the touch display device receiving the touch operation and the partial setting of displaying the image. Therefore, in the present embodiment, both the buffer layer 300 and the first adhesive layer 400 have a frame shape with a hollow opening.
承載膜100黏貼於該緩衝層300上,並覆蓋該緩衝層300及其中空的開口的區域,用於防止緩衝層300變形或者被污染。承載膜100可以選用PET材質,且具有一定黏性的透明薄膜。 The carrier film 100 is adhered to the buffer layer 300 and covers the buffer layer 300 and a region of the hollow opening thereof for preventing the buffer layer 300 from being deformed or contaminated. The carrier film 100 can be made of a PET material and has a certain viscosity of a transparent film.
第一保護膜200對應緩衝層300中空開口的位置設置,並且該第一保護膜200的面積略小於緩衝層300中空開口的面積。當該黏接結構10組合後,如圖3所示,該第一保護膜200嵌入該緩衝層300中空的開口內。且該第一保護膜200在承載膜100的黏性作用下貼附於承載膜100鄰近該緩衝層300的表面上。 The first protective film 200 is disposed corresponding to the position of the hollow opening of the buffer layer 300, and the area of the first protective film 200 is slightly smaller than the area of the hollow opening of the buffer layer 300. After the bonding structure 10 is combined, as shown in FIG. 3, the first protective film 200 is embedded in the hollow opening of the buffer layer 300. The first protective film 200 is attached to the surface of the carrier film 100 adjacent to the buffer layer 300 under the adhesive action of the carrier film 100.
優選地,第一保護膜200的外邊緣與緩衝層300的內邊緣之間的距離不大於1毫米。 Preferably, the distance between the outer edge of the first protective film 200 and the inner edge of the buffer layer 300 is not more than 1 mm.
第一保護膜200可以為PET材質透明薄膜。該第一保護膜200也可依據緩衝層300的形狀不同而相應變化。 The first protective film 200 may be a transparent film made of PET. The first protective film 200 may also vary according to the shape of the buffer layer 300.
第一黏貼層400設置於緩衝層300的下表面,用於為一待貼合模組,如觸控模組提供與其他模組,如顯示模組進行貼合所需的貼合力。 The first adhesive layer 400 is disposed on the lower surface of the buffer layer 300 for providing a bonding force for a module to be attached, such as a touch module, for bonding with other modules, such as a display module.
離型膜700設置於第一黏貼層400遠離緩衝層300的表面上,且整體覆蓋該第一黏貼層400及其中空開口的區域,該離型膜700能夠防止緩衝層300變形,以及防止灰塵等黏附至第一黏貼層400。本實施方式中,離型膜700為在PET材質的基底上塗覆離型劑或者矽油而形成。 The release film 700 is disposed on a surface of the first adhesive layer 400 away from the buffer layer 300 and integrally covers the first adhesive layer 400 and a region of the hollow opening thereof. The release film 700 can prevent the buffer layer 300 from being deformed and prevent dust. And the like is adhered to the first adhesive layer 400. In the present embodiment, the release film 700 is formed by applying a release agent or eucalyptus oil to a substrate made of PET.
離型膜700包括主體部710與延伸部720,該主體部710覆蓋緩衝層300及其中空開口區域。延伸部720為自主體部710邊緣部分進行延伸的部分,以便於用戶夾持該離型膜700。 The release film 700 includes a body portion 710 and an extension portion 720 that covers the buffer layer 300 and its hollow opening region. The extension portion 720 is a portion that extends from the edge portion of the main body portion 710 to facilitate the user to grip the release film 700.
第二保護膜500設置於離型膜700鄰近第一黏貼層400的表面,且對應第一黏貼層400中空開口的位置,用於阻隔第一保護膜200與離型膜700,防止離型膜700直接與第一保護膜200接觸,該第二保護膜500的面積小於第一黏貼層400中空開口的面積。 The second protective film 500 is disposed on the surface of the release film 700 adjacent to the first adhesive layer 400 and corresponding to the hollow opening of the first adhesive layer 400 for blocking the first protective film 200 and the release film 700 to prevent the release film. The 700 is directly in contact with the first protective film 200, and the area of the second protective film 500 is smaller than the area of the hollow opening of the first adhesive layer 400.
優選地,第二保護膜500的外邊緣與第一黏貼層400中空開口的內邊緣的距離不大於1毫米。 Preferably, the outer edge of the second protective film 500 is spaced from the inner edge of the hollow opening of the first adhesive layer 400 by no more than 1 mm.
第二黏貼層600設置於第二保護膜500與離型膜700之間,用於將該第二保護膜500與離型膜700進行黏貼。 The second adhesive layer 600 is disposed between the second protective film 500 and the release film 700 for bonding the second protective film 500 and the release film 700.
優選地,第二黏貼層600為具有黏性的矽膠,且第二黏貼層600的橫截面積為3mm*6mm,並設置於對應主體部710鄰近延伸部720的位置。在本名發明其他實施方式中,第二黏貼層600並不限制於1個。 Preferably, the second adhesive layer 600 is a viscous silicone, and the second adhesive layer 600 has a cross-sectional area of 3 mm*6 mm and is disposed at a position corresponding to the main body portion 710 adjacent to the extending portion 720. In other embodiments of the present invention, the second adhesive layer 600 is not limited to one.
優選地,承載膜100與該緩衝層300之間的黏著力大於該離型膜700與第一黏貼層400之間的黏著力,以便於在將離型膜700自該第一黏貼層400撕離並與待貼合的模組,例如觸控模組貼合後, 觸控模組與該黏接結構10的剩餘部分整體進行運輸時能夠有效防止承載膜100自緩衝層300上脫離而觸控模組被污染或者損壞。其中,承載膜100與離型膜700可以為相同性質及材質的薄膜。 Preferably, the adhesion between the carrier film 100 and the buffer layer 300 is greater than the adhesion between the release film 700 and the first adhesive layer 400, so as to tear the release film 700 from the first adhesive layer 400. After being attached to a module to be attached, such as a touch module, When the touch module is transported integrally with the remaining portion of the bonding structure 10, the carrier film 100 can be effectively prevented from being detached from the buffer layer 300 and the touch module is contaminated or damaged. The carrier film 100 and the release film 700 may be films of the same nature and material.
可變更地,當離型膜700具有一定的黏性時,黏接結構10可以省去第二黏貼層600。 Alternatively, when the release film 700 has a certain viscosity, the adhesive structure 10 can omit the second adhesive layer 600.
另外,第二保護膜500還可以延伸並覆蓋整個第一黏貼層400,此時,第二保護膜500與離型膜700之間的黏著力大於第二保護膜500與第一黏貼層400之間的黏著力,且該第二保護膜500鄰近該第一黏貼層400的表面為光滑表面。 In addition, the second protective film 500 can also extend and cover the entire first adhesive layer 400. At this time, the adhesion between the second protective film 500 and the release film 700 is greater than that of the second protective film 500 and the first adhesive layer 400. The adhesion between the second protective film 500 and the surface of the first adhesive layer 400 is a smooth surface.
請參閱圖4,為應用於觸控顯示裝置20時的剖面結構示意圖。 Please refer to FIG. 4 , which is a schematic cross-sectional view of the touch display device 20 .
觸控顯示裝置20包括觸控模組210與顯示模組220,觸控模組210用於接收使用者的觸摸操作,並確定接收該觸摸操作的位置,觸控模組210包括有觸摸感測基板(圖未示)以及其他輔助結構。顯示模組220用於顯示圖像,包括有顯示面板以及背光模組等。黏接結構10設置於觸控模組210與顯示模組220之間,用於黏貼該二模組210、220。 The touch display device 20 includes a touch module 210 and a display module 220. The touch module 210 is configured to receive a touch operation of the user and determine a location for receiving the touch operation. The touch module 210 includes touch sensing. Substrate (not shown) and other auxiliary structures. The display module 220 is configured to display an image, including a display panel, a backlight module, and the like. The bonding structure 10 is disposed between the touch module 210 and the display module 220 for bonding the two modules 210 and 220.
在黏貼該觸控模組210與顯示模組220時,首先,該黏接結構10中的第二保護膜500、第二黏貼層600以及離型膜700整體自第一黏貼層400被撕離;然後第一黏貼層400、緩衝層300、第一保護膜200以及承載膜100固定於治具上;接著,觸控模組210與第一黏貼層400對位後進行黏合;最後,承載膜100及第一保護膜200自緩衝層300撕離,顯示模組220與緩衝層300對位後結合。 When the touch module 210 and the display module 220 are pasted, first, the second protective film 500, the second adhesive layer 600, and the release film 700 in the adhesive structure 10 are completely peeled off from the first adhesive layer 400. Then, the first adhesive layer 400, the buffer layer 300, the first protective film 200, and the carrier film 100 are fixed on the jig; then, the touch module 210 is bonded to the first adhesive layer 400, and finally, the carrier film is bonded; The first protective film 200 is peeled off from the buffer layer 300, and the display module 220 is bonded to the buffer layer 300.
相較於先前技術,離型膜700與第一黏貼層400之間還設置有第二 保護膜500,由此,在應用過程中,能夠有效防止離型膜700上的物質透過第一保護膜200黏附或者轉印至觸控模組210上,也即是防止離型膜700上的矽油通過第一保護膜200轉印至觸控感測基板211,導致觸控模組210外觀不良、品質不佳。 Compared with the prior art, a second is disposed between the release film 700 and the first adhesive layer 400. The protective film 500 can thereby effectively prevent the substance on the release film 700 from adhering or transferring to the touch module 210 through the first protective film 200, that is, preventing the release film 700 from being on the release film 700. The oil is transferred to the touch sensing substrate 211 through the first protective film 200, resulting in poor appearance and poor quality of the touch module 210.
可變更地,第一保護膜200與緩衝層300之間還可以進一步相應設置有黏貼層,以便於更佳地與顯示模組220進行貼合。 Optionally, an adhesive layer may be further disposed between the first protective film 200 and the buffer layer 300 to better fit the display module 220.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10‧‧‧黏接結構 10‧‧‧bonding structure
100‧‧‧承載膜 100‧‧‧ carrying film
200‧‧‧第一保護膜 200‧‧‧First protective film
300‧‧‧緩衝層 300‧‧‧buffer layer
400‧‧‧第一黏貼層 400‧‧‧First adhesive layer
500‧‧‧第二保護膜 500‧‧‧Second protective film
600‧‧‧第二黏貼層 600‧‧‧Second adhesive layer
700‧‧‧離型膜 700‧‧‧ release film
710‧‧‧主體部 710‧‧‧ Main body
720‧‧‧延伸部 720‧‧‧Extension
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CN201310137622.4A CN103273705B (en) | 2013-04-19 | 2013-04-19 | Bonded structure |
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TW201500194A TW201500194A (en) | 2015-01-01 |
TWI510364B true TWI510364B (en) | 2015-12-01 |
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TW102124091A TWI510364B (en) | 2013-04-19 | 2013-07-04 | Adhesive component |
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CN (1) | CN103273705B (en) |
TW (1) | TWI510364B (en) |
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CN108061986A (en) * | 2017-12-11 | 2018-05-22 | 业成科技(成都)有限公司 | Backlight module, its preparation method and liquid crystal display device |
CN110948956A (en) * | 2018-09-27 | 2020-04-03 | 三赢科技(深圳)有限公司 | Lens protective film |
CN109375308B (en) * | 2018-11-27 | 2021-05-25 | 上海天马微电子有限公司 | Polarizer film and display panel manufacturing method |
CN109705750A (en) * | 2018-12-29 | 2019-05-03 | 业成科技(成都)有限公司 | The production method of membrane material and preparation method thereof, coat peeling unit and method and mask |
CN113160705A (en) * | 2021-03-16 | 2021-07-23 | 京东方科技集团股份有限公司 | Structural support of flexible display panel and use method thereof |
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CN103273705A (en) | 2013-09-04 |
TW201500194A (en) | 2015-01-01 |
CN103273705B (en) | 2015-07-29 |
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