CN107508950B - Housing assembly, sealing method thereof and electronic device - Google Patents

Housing assembly, sealing method thereof and electronic device Download PDF

Info

Publication number
CN107508950B
CN107508950B CN201710703790.3A CN201710703790A CN107508950B CN 107508950 B CN107508950 B CN 107508950B CN 201710703790 A CN201710703790 A CN 201710703790A CN 107508950 B CN107508950 B CN 107508950B
Authority
CN
China
Prior art keywords
adhesive layer
sealing element
release film
shell
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710703790.3A
Other languages
Chinese (zh)
Other versions
CN107508950A (en
Inventor
李飞飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201710703790.3A priority Critical patent/CN107508950B/en
Publication of CN107508950A publication Critical patent/CN107508950A/en
Application granted granted Critical
Publication of CN107508950B publication Critical patent/CN107508950B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/18Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0266Details of the structure or mounting of specific components for a display module assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • H05K5/061Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M2250/00Details of telephonic subscriber devices
    • H04M2250/22Details of telephonic subscriber devices including a touch pad, a touch sensor or a touch detector

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)

Abstract

The invention discloses a shell assembly, a sealing method thereof and electronic equipment, wherein the shell assembly comprises a release film, a shell and a sealing element, the outer periphery of the shell is bent to form a supporting part, the sealing element is clamped between the release film and the supporting part, one side of the sealing element, facing the release film, is provided with a first adhesive layer, one side of the sealing element, facing the supporting part, is provided with a second adhesive layer, and the viscosity of the first adhesive layer is smaller than that of the second adhesive layer. According to the shell assembly, the first adhesive layer and the second adhesive layer are arranged on the sealing element, so that the sealing element can be formed on or placed on the release film through the first adhesive layer, the sealing element is close to the shell through moving the release film, or the shell is directly moved to be close to the sealing element, the sealing element is connected to the shell through the second adhesive layer, and the sealing element can be fixed on the shell due to the fact that the viscosity of the first adhesive layer is smaller than that of the second adhesive layer, and the situation that the sealing element is deformed due to the fact that a hand directly contacts the sealing element is avoided.

Description

Housing assembly, sealing method thereof and electronic device
Technical Field
The invention relates to the technical field of communication equipment, in particular to a shell assembly, a sealing method of the shell assembly and electronic equipment.
Background
The sealing member is a component for preventing fluid or solid particles from leaking from adjacent joint surfaces and preventing external impurities (such as dust, moisture and the like) from invading into the interior of machine equipment, and is widely applied to the fields of machinery, equipment, pipelines and the like, in particular to the technical field of electronic equipment. Once water enters the electronic equipment, internal components are basically damaged, the electronic equipment cannot be used, money and money are lost, data in the electronic equipment are lost, and inestimable loss is caused for users. Therefore, a large number of sealing assemblies are used in the production and manufacturing processes of the electronic equipment to ensure the sealing performance and the use safety of the electronic equipment, so that the quality of the electronic equipment is improved.
In the related art, the manufacturing process of the sealing member of the electronic device is to separately form the housing and the sealing member, and then the sealing member is mounted on the housing to achieve the waterproof of the electronic device, but this method is easy to cause the deformation of the sealing member, so that the sealing effect of the sealing member is not ideal, and the product requirement cannot be met.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the shell assembly of the electronic equipment, which has the advantages of simple sealing and good sealing effect.
The invention also provides an electronic device, which is provided with the shell assembly of the electronic device.
The invention also provides a sealing method of the shell assembly, which has the advantages of simple operation and good sealing effect.
According to the shell assembly of the electronic equipment, the shell assembly comprises: a release film; the outer periphery of the shell is bent to form a supporting part; the sealing element is clamped between the release film and the supporting part, a first adhesive layer is arranged on one side, facing the release film, of the sealing element, a second adhesive layer is arranged on one side, facing the supporting part, of the sealing element, and the viscosity of the first adhesive layer is smaller than that of the second adhesive layer.
According to the housing assembly provided by the embodiment of the invention, the first adhesive layer and the second adhesive layer are arranged on the sealing element, so that the sealing element can be formed on or arranged on the release film through the first adhesive layer, the sealing element is close to the housing through moving the release film, or the housing is directly moved to be close to the sealing element, the sealing element is connected to the housing through the second adhesive layer, and the viscosity of the first adhesive layer is smaller than that of the second adhesive layer, so that the release film and the sealing element can be separated, the sealing element can be fixed on the housing, and the situation that the sealing element is deformed due to the fact that a hand directly contacts the sealing element is avoided.
An electronic device according to an embodiment of the present invention includes the housing assembly of the electronic device as described in any one of the above.
According to the electronic equipment provided by the embodiment of the invention, the first adhesive layer and the second adhesive layer are arranged on the sealing element, so that the sealing element can be formed on or arranged on the release film through the first adhesive layer, the sealing element is close to the shell by moving the release film, or the shell is directly moved to be close to the sealing element, the sealing element is connected to the shell through the second adhesive layer, and the viscosity of the first adhesive layer is smaller than that of the second adhesive layer, so that the release film and the sealing element can be separated, the sealing element can be fixed on the shell, and the situation that the sealing element is deformed due to the fact that a hand directly contacts the sealing element is avoided.
According to the sealing method of the housing assembly of the embodiment of the invention, the housing assembly comprises: a release film; the outer periphery of the shell is bent to form a supporting part; the sealing element is characterized in that a first adhesive layer and a second adhesive layer are arranged on two sides of the sealing element, and the viscosity of the first adhesive layer is smaller than that of the second adhesive layer; the sealing method comprises the following steps: bonding the sealing element with the release film through a first adhesive layer; bonding the sealing element with the supporting part of the shell through a second adhesive layer; applying an external force to at least one of the release film and the case such that the release film is separated from the sealing member.
According to the sealing method of the shell assembly, the first adhesive layer and the second adhesive layer are arranged on the sealing element, so that the sealing element can be formed on or placed on the release film through the first adhesive layer, the sealing element is close to the shell through moving the release film, or the shell is directly moved to be close to the sealing element, the sealing element is connected to the shell through the second adhesive layer, and the viscosity of the first adhesive layer is smaller than that of the second adhesive layer, so that the release film can be separated from the sealing element, the sealing element can be fixed on the shell, and the situation that the sealing element is deformed due to the fact that a hand directly contacts the sealing element is avoided.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural view of a housing assembly according to an embodiment of the present invention;
FIG. 2 is a schematic illustration of a sealing process of a housing assembly utilizing an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Reference numerals:
the housing assembly 1 is provided with a plurality of grooves,
the combination of the seal 10, the first adhesive layer 110,
the shell 20, the support portion 210, the second adhesive layer 211, the arc-shaped surface 212,
a release film (30) is provided,
the mobile phone 2, the shooting unit 3 and the rear cover 4.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
A housing assembly 1 according to an embodiment of the present invention is described below with reference to fig. 1-2.
As shown in fig. 1 to 2, a housing assembly 1 of an electronic device according to an embodiment of the present invention includes a release film 30, a sealing member 10, and a housing 20.
Specifically, as shown in fig. 1-2, the outer periphery of the housing 20 may be bent to form a support portion 210, the sealing element 10 may be interposed between the release film 30 and the support portion 210, a side of the sealing element 10 facing the release film 30 may have a first adhesive layer 110, a side of the sealing element 10 facing the support portion 210 may have a second adhesive layer 211, and the viscosity of the first adhesive layer 110 may be smaller than that of the second adhesive layer 211.
It is understood that as shown in fig. 1-2, the sealing member 10 may be provided with a first adhesive layer 110 and a second adhesive layer 211, and the first adhesive layer 110 and the second adhesive layer 211 are spaced apart. The sealing member 10 may be disposed on or formed on the release film 30 and connected to the release film 30 by the first adhesive layer 110. The sealing element 10 can be close to the housing 20 by moving the release film 30, or the housing 20 can be directly moved close to the sealing element 10, so that one end of the sealing element 10 having the second adhesive layer 211 can be placed on the end surface of the free end of the supporting portion 210, so that the sealing element 10 can be connected to the housing 20, the sealing element 10 is clamped between the housing 20 and the release film 30, an external force is applied to the release film 30, and since the viscosity of the first adhesive layer 110 is smaller than that of the second adhesive layer 211, the release film 30 can be separated from the sealing element 10, so that the sealing element 10 is fixed on the housing 20.
According to the housing assembly 1 of the embodiment of the invention, the first adhesive layer 110 and the second adhesive layer 211 are disposed on the sealing element 10, and the viscosity of the first adhesive layer 110 is smaller than that of the second adhesive layer 211, so that the sealing element 10 can be molded on or placed on the release film 30 through the first adhesive layer 110, and the sealing element 10 is close to the housing 20 by moving the release film 30, or the housing 20 is directly moved close to the sealing element 10, the sealing element 10 is connected to the housing 20 through the second adhesive layer 211, and since the viscosity of the first adhesive layer 110 is smaller than that of the second adhesive layer 211, the release film 30 can be separated from the sealing element 10, so that the sealing element 10 can be fixed on the housing 20, and the situation that the sealing element 10 is deformed due to direct contact of the sealing element 10 with a hand is avoided.
As shown in fig. 1-2, in some embodiments of the invention, the support portion 210 may be angled with respect to the housing 20, thereby facilitating the encapsulation of the housing 20 by the seal 10. Further, the supporting portion 210 may be perpendicular to the housing 20. It should be noted that, there is no limitation on the specific positions of the first adhesive layer 110 and the second adhesive layer 211 on the sealing member 10, for example, the first adhesive layer 110 and the second adhesive layer 211 may be symmetrical with respect to the center of the sealing member 10, thereby facilitating the sealing member 10 to encapsulate the housing 20.
As shown in fig. 1-2, according to some embodiments of the present invention, the end surface of the free end of the supporting portion 210 may be an arc-shaped surface 212 protruding in a direction away from the release film 30. It is understood that the end face is formed as an arc-shaped face 212, the longitudinal section of the arc-shaped face 212 may be an arc-shaped line segment, and the curvature center of the arc-shaped line segment may be located on one side of the end face close to the release film 30. Thereby, the arc-shaped surface 212 formed on the end surface of the supporting portion 210 can be embedded in part of the sealing member 10, so that the connection stability of the sealing member 10 and the housing 20 can be improved.
In other embodiments of the present invention, the end face may have a groove into which the second adhesive layer 211 is adapted to fit. The shape of the groove is not particularly limited, and for example, the groove may be a rectangular parallelepiped, a square, or a U-shaped groove, and the second adhesive layer 211 may be attached to an inner wall surface of the groove. Thereby, the sealing member 10 can be confined in the groove formed at the end surface of the supporting portion 210, so that the coupling stability of the sealing member 10 and the housing 20 can be improved.
Further, the inner bottom wall of the recess may be an arcuate surface 212. It will be appreciated that the recess has an inner side wall and an inner bottom wall, which may be formed as an arcuate surface 212. Thereby, the area of the inner bottom wall of the groove can be enlarged. Further, the inner bottom wall of the groove may be an arc-shaped surface 212 that is convex toward a direction away from the release film 30. It will be appreciated that the depth of the groove decreases progressively from the centre of the groove towards the periphery of the groove. Thus, a portion of the sealing member 10 can be disposed in the arc surface 212 formed at the inner bottom wall, so that the disposition stability of the sealing member 10 can be improved, and the disposition of the sealing member 10 can be facilitated.
According to some examples of the invention, the support 210 may be an annular support. It is understood that the supporter 20 may be formed in a ring shape and the supporter 210 may form one chamber with the housing 20. This can improve the range of action between the seal 10 and the housing 20. Further, the support portion 210 may extend toward the circumferential direction of the housing 20 to form an annular support portion, and the support portion 210 may be perpendicular to the housing 20.
According to one embodiment of the invention, the seal 10 may be a gasket. It will be appreciated that the seal 10 may be annular, thereby improving the sealing effect of the seal 10.
According to yet another embodiment of the invention, the seal 10 may be a rubber seal. The rubber sealing member has elasticity, and when utilizing the rubber sealing member to seal casing 20, casing 20 can form pressure to the rubber sealing member, and the rubber sealing member can form reaction force to casing 20 because the elasticity performance for the rubber sealing member can offset with casing 20. Thereby, the sealing effect of the sealing member 10 can be improved by the elastic deformation of the sealing member 10.
According to some embodiments of the invention, the cross-section of the seal 10 may be circular or polygonal. For example, the cross-section of the sealing member 10 may be rectangular, whereby the first adhesive layer 110 and the second adhesive layer 211 may be adhered to two symmetric planes of a square, so that the adhesion property of the first adhesive layer 110 and the second adhesive layer 211 to the sealing member 10 may be improved.
An electronic apparatus according to an embodiment of the present invention includes the housing assembly 1 of the electronic apparatus as described in any one of the above.
As used herein, "electronic equipment" includes, but is not limited to, devices that are configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). The electronic device may include a radiotelephone, pager, PDA that has internet/intranet access, Web browser, notepad, calendar, and/or Global Positioning System (GPS) receiver; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver.
According to the electronic device of the embodiment of the invention, the first adhesive layer 110 and the second adhesive layer 211 are arranged on the sealing element 10, and the viscosity of the first adhesive layer 110 is smaller than that of the second adhesive layer 211, so that the sealing element 10 can be molded on or placed on the release film 30 through the first adhesive layer 110, the sealing element 10 is close to the housing 20 by moving the release film 30, or the housing 20 is directly moved to be close to the sealing element 10, the sealing element 10 is connected to the housing 20 through the second adhesive layer 211, and the first adhesive layer 110 is smaller than the viscosity of the second adhesive layer 211, so that the release film 30 can be separated from the sealing element 10, the sealing element 10 can be fixed on the housing 20, and the situation that the sealing element 10 is deformed due to direct contact of the sealing element 10 with a hand is avoided.
According to the sealing method of the shell assembly, the shell assembly comprises the release film, the shell and the sealing piece. The outer peripheral edges of the shell are bent to form supporting portions, a first adhesive layer and a second adhesive layer are arranged on two sides of the sealing piece, and the viscosity of the first adhesive layer is smaller than that of the second adhesive layer. The sealing method may include: bonding the sealing element with the release film through the first adhesive layer; bonding the sealing element with the supporting part of the shell through a second adhesive layer; an external force is applied to at least one of the release film and the case so that the release film can be separated from the sealing member.
Particularly, the sealing member can be arranged on the release film and fixed on the release film through the first adhesive layer, the sealing member can be moved through moving the release film, one end of the sealing member with the second adhesive layer can be arranged on the end face of the supporting part, so that the sealing member can be connected onto the shell, the sealing member is clamped between the shell and the release film, external force is applied to at least one of the release film and the shell, slight viscosity is formed after the release film is contacted with the sealing member, the viscosity of the first adhesive layer is smaller than that of the second adhesive layer, namely the viscosity between the release film and the sealing member is smaller than that between the shell and the sealing member, the release film can be separated from the sealing member, and the sealing member is fixed on the shell.
According to the sealing method of the shell assembly, the first adhesive layer and the second adhesive layer are arranged on the sealing element, the viscosity of the first adhesive layer is smaller than that of the second adhesive layer, so that the sealing element can be formed on or placed on the release film through the first adhesive layer, the sealing element is close to the shell through moving the release film, or the shell is directly moved to be close to the sealing element, the sealing element is connected to the shell through the second adhesive layer, and the viscosity of the first adhesive layer is smaller than that of the second adhesive layer, so that the release film can be separated from the sealing element, the sealing element can be fixed on the shell, and the situation that the sealing element is deformed due to the fact that a hand directly contacts the sealing element is avoided.
The electronic device of the embodiments of the present invention is discussed in detail below with reference to fig. 1-3.
In the embodiment of the present invention, the electronic device may be various devices that can acquire and process data from the outside, or the electronic device may be various devices that have a built-in battery and can acquire and charge the battery from the outside, such as a mobile phone 2, a tablet computer, a computing device, an information display device, or the like.
An electronic device to which the present invention is applied will be described with reference to the mobile phone 2. In the embodiment of the present invention, the mobile phone 2 may include components such as a radio frequency circuit, a memory, an input unit, a wireless fidelity (WiFi) module, a display unit, a sensor, an audio circuit, a processor, a projection unit, a shooting unit 3, a battery, a rear cover 4, and a housing assembly 1.
Specifically, as shown in fig. 1-2, the housing assembly 1 may include a release film 30, a seal 10, and a housing 20. The seal 10 may be made of rubber, the seal 10 may be annular, and the cross-sectional shape of the seal 10 may be rectangular. The outer periphery of the housing 20 is bent to form a supporting portion 210, the supporting portion 210 is annular, the supporting portion 210 may be perpendicular to the housing 20, and one end of the supporting portion 210 away from the housing 20 is a free end. The end surface of the free end is formed into an arc surface 212, that is, the cross section of the arc surface 212 is an arc line segment, and the curvature center of the arc line segment is located on the side of the end surface far away from the shell 20.
As shown in fig. 1-2, a first adhesive layer 110 and a second adhesive layer 211 are disposed on the sealing member 10, the sealing member 10 can be disposed on the release film 30 and fixed to the release film 30 through the first adhesive layer 110, the sealing member 10 can be moved by moving the release film 30, and one end of the sealing member 10 having the second adhesive layer 211 can be disposed on the arc-shaped surface 212 of the supporting portion 210, so that the sealing member 10 can be connected to the housing 20, the sealing member 10 is sandwiched between the housing 20 and the release film 30, and an external force is applied to the release film 30, since the release film 30 does not have viscosity or has slight viscosity after contacting the sealing member 10, that is, the viscosity between the release film 30 and the sealing member 10 is smaller than the viscosity between the housing 20 and the sealing member 10, the release film 30 can be separated from the sealing member 10, so that the sealing member 10 is fixed.
The case 20 may be attached to the rear cover 4 by moving the rear cover 4 of the case 20 and pressing the end of the sealing member 10 provided with the first adhesive layer 110 against the non-exterior surface of the rear cover 4 such that the sealing member 10 is attached to the rear cover 4 by the first adhesive layer 110. The housing 20, the seal 10 and the rear cover 4 form a closed cavity so that the electronic device can be placed in the cavity.
The radio frequency circuit can be used for receiving and sending signals in the process of receiving and sending information or calling, and particularly, the radio frequency circuit receives the downlink information of the base station and then processes the downlink information; in addition, the uplink data of the mobile phone 2 is sent to the base station. Typically, the radio frequency circuitry includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. In addition, the radio frequency circuitry may also communicate with networks and other devices via wireless communications. The wireless communication may use any communication standard or protocol, including but not limited to Global System for mobile communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Message Service (SMS), and the like.
The memory may be used to store software programs and modules, and the processor executes various functional applications and data processing of the mobile phone 2 by operating the software programs and modules stored in the memory. The memory can mainly comprise a program storage area and a data storage area, wherein the program storage area can store an operating system, application programs (such as a sound playing function and an image playing function) required by at least one function and the like; the storage data area may store data (e.g., audio data, a phonebook, etc.) created according to the use of the cellular phone 2, and the like. Further, the memory may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
The input unit may be used to receive input numeric or character information and generate key signals related to user settings and function control of the handset 2. Specifically, the input unit may include a touch panel and other input devices. The touch panel, also called a touch screen, may collect touch operations of a user (for example, operations of the user on or near the touch panel using any suitable object or accessory such as a finger, a stylus, etc.) and drive the corresponding connection device according to a preset program. Alternatively, the touch panel may include two parts, a touch detection device and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor, and can receive and execute commands sent by the processor. In addition, the touch panel may be implemented in various types such as a resistive type, a capacitive type, an infrared ray, and a surface acoustic wave. The input unit may include other input devices in addition to the touch panel. In particular, other input devices may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like.
The display unit may be used to display information input by the user or information provided to the user, and various menus of the mobile phone 2. The display unit may include a display panel, and optionally, the display panel may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like. Further, the touch panel may cover the display panel, and when the touch panel detects a touch operation thereon or nearby, the touch panel transmits the touch operation to the processor to determine the type of the touch event, and then the processor provides a corresponding visual output on the display panel according to the type of the touch event.
The position in the visual output external display panel that can be recognized by the human eye may be referred to as a "display region" as described below. The touch panel and the display panel may be used as two independent components to implement the input and output functions of the mobile phone 2, or the touch panel and the display panel may be integrated to implement the input and output functions of the mobile phone 2.
In addition, the handset 2 may also include at least one sensor, such as an attitude sensor, a light sensor, and other sensors.
Specifically, the attitude sensor may also be referred to as a motion sensor, and as one of the motion sensors, a gravity sensor may be cited, which uses an elastic sensing element to make a cantilever-type displacer and uses an energy storage spring made of the elastic sensing element to drive an electrical contact, thereby realizing conversion of a change in gravity into a change in an electrical signal.
Another example of the motion sensor is an accelerometer sensor, which can detect the acceleration in each direction (generally three axes), detect the gravity when stationary, and can be used for applications (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), and the like, for recognizing the posture of the mobile phone 2.
In the embodiment of the present invention, the motion sensor listed above may be used as an element for obtaining the "attitude parameter" described later, but the present invention is not limited thereto, and other sensors capable of obtaining the "attitude parameter" fall within the protection scope of the present invention, for example, a gyroscope, etc., and the operation principle and the data processing procedure of the gyroscope may be similar to those of the prior art, and the detailed description thereof is omitted here for avoiding redundancy.
In addition, in the embodiment of the present invention, as the sensor, other sensors such as a barometer, a hygrometer, a thermometer, and an infrared sensor may be further configured, which are not described herein again.
The light sensor may include an ambient light sensor that adjusts the brightness of the display panel according to the brightness of ambient light, and a proximity sensor that turns off the display panel and/or backlight when the mobile phone 2 is moved to the ear.
The audio circuitry, speaker and microphone may provide an audio interface between the user and the handset 2. The audio circuit can transmit the electric signal converted from the received audio data to the loudspeaker, and the electric signal is converted into a sound signal by the loudspeaker to be output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit and converted into audio data, which is then output to the processor for processing and then transmitted to, for example, another mobile phone 2 via the radio frequency circuit, or the audio data is output to the memory for further processing.
WiFi belongs to short-distance wireless transmission technology, and the cell phone 2 can help a user to receive and send e-mails, browse webpages, access streaming media and the like through a WiFi module, and provides wireless broadband internet access for the user.
The processor is a control center of the mobile phone 2, connects each part of the whole mobile phone 2 by using various interfaces and lines, and executes various functions and processes data of the mobile phone 2 by running or executing software programs and/or modules stored in the memory and calling data stored in the memory, thereby integrally monitoring the mobile phone 2. Alternatively, the processor may include one or more processing units; preferably, the processor may integrate an application processor, which mainly handles operating systems, user interfaces, application programs, etc., and a modem processor, which mainly handles wireless communications.
It will be appreciated that the modem processor described above may not be integrated into the processor.
Also, the processor may perform the same or similar functions as the processing unit as the implementation elements of the processing unit.
The handset 2 also includes a power supply (such as a battery) for powering the various components.
It should be noted that the mobile phone 2 is only an example of a terminal device, and the present invention is not particularly limited, and the present invention may be applied to electronic devices such as the mobile phone 2 and a tablet computer, and the present invention is not limited thereto.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (9)

1. A housing assembly for an electronic device, comprising:
a release film;
the outer periphery of the shell is bent to form a supporting part, the end face of the free end of the supporting part is in an arc shape protruding towards the direction far away from the release film, and the end face is provided with a groove;
the sealing element is clamped between the release film and the supporting part, a first adhesive layer is arranged on one side, facing the release film, of the sealing element, a second adhesive layer is arranged on one side, facing the supporting part, of the sealing element, the second adhesive layer is suitable for being matched into the groove, the viscosity of the first adhesive layer is smaller than that of the second adhesive layer, and the first adhesive layer and the second adhesive layer are symmetrical relative to the center of the sealing element.
2. A housing assembly for an electronic device in accordance with claim 1 wherein said inner bottom wall of said recess is arcuate.
3. The housing assembly of the electronic device as claimed in claim 2, wherein the inner bottom wall of the groove is an arc-shaped surface protruding in a direction away from the release film.
4. The housing assembly of an electronic device as recited in claim 1, wherein the support portion is an annular support portion.
5. A housing assembly for an electronic device in accordance with claim 1 wherein said seal is a gasket.
6. A housing assembly for an electronic device in accordance with claim 1 wherein said seal is a rubber seal.
7. A housing assembly for an electronic device in accordance with claim 1, wherein said seal is circular or polygonal in cross-section.
8. An electronic device comprising a housing assembly of the electronic device according to any one of claims 1-7.
9. A method of sealing a housing assembly, the housing assembly comprising:
a release film;
the outer periphery of the shell is bent to form a supporting part, the end face of the free end of the supporting part is in an arc shape protruding towards the direction far away from the release film, and the end face is provided with a groove;
the sealing element is characterized in that a first adhesive layer and a second adhesive layer are arranged on two sides of the sealing element, the second adhesive layer is suitable for being matched into the groove, the viscosity of the first adhesive layer is smaller than that of the second adhesive layer, and the first adhesive layer and the second adhesive layer are symmetrical relative to the center of the sealing element;
the sealing method comprises the following steps:
bonding the sealing element with the release film through a first adhesive layer;
bonding the sealing element with the supporting part of the shell through a second adhesive layer;
applying an external force to at least one of the release film and the case such that the release film is separated from the sealing member.
CN201710703790.3A 2017-08-16 2017-08-16 Housing assembly, sealing method thereof and electronic device Active CN107508950B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710703790.3A CN107508950B (en) 2017-08-16 2017-08-16 Housing assembly, sealing method thereof and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710703790.3A CN107508950B (en) 2017-08-16 2017-08-16 Housing assembly, sealing method thereof and electronic device

Publications (2)

Publication Number Publication Date
CN107508950A CN107508950A (en) 2017-12-22
CN107508950B true CN107508950B (en) 2020-08-25

Family

ID=60692245

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710703790.3A Active CN107508950B (en) 2017-08-16 2017-08-16 Housing assembly, sealing method thereof and electronic device

Country Status (1)

Country Link
CN (1) CN107508950B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI709795B (en) * 2019-09-27 2020-11-11 友達光電股份有限公司 System frame sealing structure and display device including the same
CN114038324A (en) * 2021-11-24 2022-02-11 武汉华星光电半导体显示技术有限公司 Supporting assembly and flexible display device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1416573A (en) * 2000-09-01 2003-05-07 Nok株式会社 Cover gasket for disk device
CN101588687A (en) * 2008-05-23 2009-11-25 深圳富泰宏精密工业有限公司 Display screen component
CN103331985A (en) * 2013-06-14 2013-10-02 业成光电(深圳)有限公司 Electronic device and buffering foam module thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8169786B2 (en) * 2008-05-16 2012-05-01 Psion Teklogix Inc. Ruggedized housing and components for a handled device
CN102653333B (en) * 2011-03-03 2016-03-30 富泰华工业(深圳)有限公司 The attaching method of damper element and this damper element and other elements combinations
CN103273705B (en) * 2013-04-19 2015-07-29 业成光电(深圳)有限公司 Bonded structure
CN206385068U (en) * 2016-11-24 2017-08-08 宁波科莱恩新材料科技有限公司 A kind of sealing foam adhesive tape

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1416573A (en) * 2000-09-01 2003-05-07 Nok株式会社 Cover gasket for disk device
CN101588687A (en) * 2008-05-23 2009-11-25 深圳富泰宏精密工业有限公司 Display screen component
CN103331985A (en) * 2013-06-14 2013-10-02 业成光电(深圳)有限公司 Electronic device and buffering foam module thereof

Also Published As

Publication number Publication date
CN107508950A (en) 2017-12-22

Similar Documents

Publication Publication Date Title
CN107682485B (en) Shell assembly of terminal, terminal and control method of terminal
US10397382B2 (en) Electronic device with screen protector
CN208723945U (en) Electronic equipment
CN107508950B (en) Housing assembly, sealing method thereof and electronic device
CN107908224B (en) Shell assembly of electronic equipment and electronic equipment
CN107864238B (en) Shell assembly of terminal, terminal and control method of terminal
CN107864258B (en) Shell assembly of electronic equipment and electronic equipment
CN108229374B (en) Fingerprint module, manufacturing method of fingerprint module and electronic device
CN108259647B (en) Light sensor assembly and electronic device with same
CN107666803B (en) Shell assembly of terminal and terminal with same
CN107911519B (en) The housing unit and electronic equipment of electronic equipment
CN107371348B (en) Housing assembly, sealing method thereof and electronic device
CN107566573B (en) Teflon component and mobile terminal with same
CN213781880U (en) Middle frame assembly of electronic equipment and electronic equipment
CN107911963B (en) Shell assembly of electronic equipment and electronic equipment
CN208723946U (en) Electronic equipment
CN107932415A (en) For the tool for stitching being pressure bonded to fingerprint module on housing
CN107707709B (en) Shell assembly of terminal and terminal with same
CN107708353B (en) Shell assembly of terminal and terminal with same
CN208445624U (en) Electronic equipment
CN108111721B (en) Bracket component, chip component, camera and electronic equipment of camera
CN107124485B (en) Fixing assembly for connector, shell assembly of terminal and terminal
RU2774298C2 (en) Case node for terminal and terminal with case node
CN107911518B (en) Shell assembly of terminal and terminal
EP3462717B1 (en) Housing assembly for terminal and termninal with housing assembly

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information
CB02 Change of applicant information

Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong

Applicant after: OPPO Guangdong Mobile Communications Co., Ltd.

Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong

Applicant before: Guangdong OPPO Mobile Communications Co., Ltd.

GR01 Patent grant
GR01 Patent grant