TWI508121B - 彈性元件基板與其製造方法 - Google Patents
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Description
本發明是有關於一種彈性元件基板的結構與其製造方法。
鍵盤是經過系統安排操作機器或設備的一種裝置,主要的功能為輸入資料,並可應用於各種電子設備中,如家用電腦、筆記型電腦、個人行動裝置或其他類似電子設備。與傳統機械式鍵盤相比,薄膜式鍵盤由於按壓按鍵時產生的聲音較小、無機械式鍵盤的機械磨損、並且所需價格成本較低,故已為大眾廣泛地使用。
在薄膜式鍵盤的按鍵製造過程中,會於一彈性元件底面塗抹黏合膠並黏合至有一印刷電路的一基板上。在此黏合過程中,基板與彈性元件一同經過高溫烘烤處理,使彈性元件底面之黏合膠受熱固化於基板上,確保彈性元件與基板間的密合度。但由於基板有較佳的塑性,在經過高溫烘烤處理後容易因受熱而發生變形或彎曲,若此變形彎曲情形過大將嚴重影響彈性元件基板之尺寸準度。
因此本發明揭露一種彈性元件與基板間的黏合製程。用以解決傳統彈性元件基板製造方法之缺失,能有效減少基板變形彎曲之情形發生。
本發明之一態樣在於提供了一種製造彈性元件基板的方法。首先提供一彈性元件,並對此彈性元件進行一熱處理程序。接著塗布一光硬化黏合膠層於彈性元件之一底面上,其中光硬化黏合膠層之肖式A級硬度值低於90,並放置此彈性元件之底面於一基板之一表面上。最後照射光於光硬化黏合膠層使此光硬化黏合膠層硬化,將彈性元件固著於基板之表面上。
根據本發明之一實施方式,其中此彈性元件材質為矽膠。
根據本發明之一實施方式,其中此熱處理程序使用一火焰處理機。
根據本發明之一實施方式,其中此基板為一高分子薄膜。
根據本發明之一實施方式,其中此高分子薄膜材質為聚對苯二甲酸乙二醇酯(PET)或聚碳酸酯(PC)。
根據本發明之一實施方式,其中此基板為一空白基板或為包含一印刷電路之基板。
根據本發明之一實施方式,其中光為紫外光。
本發明之另一態樣在於提供了一種彈性元件基
板,包含一基板、一光硬化黏合膠層與一彈性元件。其中光硬化黏合膠層之肖式A級硬度值低於90。彈性元件的一底面藉由光硬化黏合膠層黏合至基板之一表面上。其中此底面包含一底部貼面層,內部填滿一光硬化黏合膠並與光硬化黏合膠層接觸。
根據本發明之一實施方式,其中此基板為一高分子薄膜。
根據本發明之一實施方式,其中此高分子薄膜材質為聚對苯二甲酸乙二醇酯(PET)或聚碳酸酯(PC)。
根據本發明之一實施方式,其中此基板為一空白基板或為包含一印刷電路之基板。
根據本發明之一實施方式,其中此彈性元件材質為矽膠。
根據本發明之一實施方式,其中此彈性元件包含一內部區,底部貼面層介於此內部區與光硬化黏合膠層之間。
根據本發明之一實施方式,其中此光硬化黏合膠層為紫外光硬化黏合膠層。
100‧‧‧彈性元件基板
120‧‧‧基板
122‧‧‧印刷電路
122A‧‧‧第一導電部分
122B‧‧‧第二導電部分
140‧‧‧彈性元件
142‧‧‧內部區
144‧‧‧底部貼面層
146‧‧‧接觸部分
160‧‧‧光硬化黏合膠層
410‧‧‧步驟
420‧‧‧步驟
430‧‧‧步驟
440‧‧‧步驟
450‧‧‧步驟
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之詳細說明如下:
第1圖繪示根據本發明一實施方式之一種彈性元件基板之組裝分解透視圖。
第2圖繪示根據本發明一實施方式之一種彈性元件基板
之剖面圖。
第3圖繪示根據本發明一實施方式之一種彈性元件基板接合處之剖面放大圖。
第4圖繪示根據本發明一實施方式之一種彈性元件基板之製造方法流程圖。
以下將以圖式及詳細說明清楚說明本發明之精神,任何所屬技術領域中具有通常知識者在瞭解本發明之較佳實施例後,當可由本發明所教示之技術,加以改變及修飾,其並不脫離本發明之精神與範圍。並為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,熟悉本領域之技術人員應當瞭解到,在本發明部分實施方式中,這些實務上的細節並非必要的,因此不應用以限制本發明。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。
請參閱第1圖,第1圖繪示本發明一實施例的一種彈性元件基板的組裝分解透視圖。如第1圖所示,彈性元件基板100包含一基板120、一彈性元件140與一光硬化黏合膠層160。更詳細的說,此彈性元件基板100具有基板120,此基板120之一表面上有一印刷電路122。此印刷電路122包含一第一導電部分122A以及一第二導電部分122B。由於第一導電部分122A與第二導電部分122B間為分離且無電性連接,故此時印刷電路122處於關閉狀態。在本發明之一實施例中,此基板120為一高分子薄膜。在本發明之另一實施例中,此高分子薄膜之材質為聚對苯
二甲酸乙二醇酯(polyethylene terephthalate,PET)或聚碳酸酯(polycarbonate,PC)。
請繼續參閱第1圖,彈性元件140之一底面上有一光硬化黏合膠層160,其中光硬化黏合膠層160之肖式A級硬度值低於90。因光硬化黏合膠層160之硬度較傳統光硬化黏合膠柔軟甚多,當黏合彈性元件140以及基板120時,光硬化黏合膠層160能減少應力,並使彈性元件140在黏合後仍能符合規格。此大幅增加了彈性元件基板100之規格穩定性。藉由此光硬化黏合膠層160,彈性元件140能固著黏合於基板120表面印刷電路122之第一導電部分122A及第二導電部分122B上方。其中彈性元件140包含一內部區142與一底部貼面層144,此底部貼面層144內部填滿光硬化黏合膠,並位於內部區142與光硬化黏合膠層160之間。在本發明之一實施例中,此彈性元件140之材質為矽膠。在本發明之其他部分實施例中,基板120為一空白基板,其表面不具有印刷電路122。
接著請參照第2圖,並可與第1圖一同對照以更清楚的了解本發明。第2圖為第1圖之彈性元件基板100之剖面圖。如第2圖所示,彈性元件140藉由底面上之光硬化黏合膠層160固著於基板120表面印刷電路122之第一導電部分122A及第二導電部分122B上方。其中此彈性元件140內部更具有一導電材質之接觸部分146,當受到一向下外力按壓時,彈性元件140將會變形,因彈性元件140位於第一導電部分122A及第二導電部分122B上方,此時彈性元件140中導電材質之接觸部分146會與印刷電路122之第一導電部分122A及第二導電部分122B接
觸,進而觸發印刷電路122。更詳細的說,隨著彈性元件140回應外力移動被垂直壓下,此時接觸部分146朝下移動並同時接觸印刷電路122之第一導電部分122A與第二導電部分122B並形成電性連接,使此印刷電路122接通產生作動。當外力消失時彈性元件140回復原狀,接觸部分146和第一導電部分122A與第二導電部分122B之間無接觸,此時此印刷電路122斷開。
請繼續參照第3圖,第3圖為第2圖中彈性元件140與基板120接合處之剖面放大圖。如第3圖所示,彈性元件140藉由底面之光硬化黏合膠層160黏合於基板120之表面上。部分光硬化黏合膠流入與此光硬化黏合膠層160接觸之彈性元件140之底部貼面層144中,並填滿此底部貼面層144中之空隙。而彈性元件140內部未被光硬化黏合膠填滿處則形成內部區142。
接著請參照第4圖,並且一併參閱第1-3圖,第4圖為第1圖中彈性元件基板100的製作方法流程圖。首先執行步驟410,提供一彈性元件140。此彈性元件140能經由外力按壓產生變形,當外力消失時彈性元件140將回復原狀。在本發明之一實施例中,此彈性元件140之材質為矽膠。
接著執行步驟420,對彈性元件140之一底面進行一熱處理程序。於此熱處理程序下,彈性元件140底面之油脂被燃燒掉,於此底面暫時形成未含有油脂之一底部貼面層144。其中此熱處理程序之溫度為1000-1200℃,時間為2-3秒。在本發明之一實施例中,此熱處理程序使用一火焰處理機。其中火焰處理機是利用瓦斯與空氣混合燃燒在火焰噴嘴上產生火焰,瞬間產生高溫將彈性元件140底面之油脂快速燃燒掉。
繼續執行步驟430,塗布一光硬化黏合膠層160於彈性元件140之底面上,其中光硬化黏合膠層160之肖式A級硬度值低於90。在本發明之一實施例中,此光硬化黏合膠層160為紫外光硬化黏合膠層。由於彈性元件140之底面經熱處理後油脂將被燃燒,於彈性元件140底面暫時形成未含有油脂之底部貼面層144。塗布光硬化黏合膠層160於彈性元件140之底面上時,液態的光硬化黏合膠流入彈性元件140底面暫時未含有油脂之底部貼面層144中,形成內部填滿光硬化黏合膠之底部貼面層144。此底部貼面層144中之光硬化黏合膠與熱處理後之彈性元件140底面形成鍵價結合,光硬化黏合膠與彈性元件140間之黏接強度將達最高。
然後執行步驟440,放置彈性元件140之底面於一基板120之一表面上。基板120之表面上包含一印刷電路122,將此彈性元件140置於基板120上之印刷電路122上方。此印刷電路122包含一第一導電部分122A以及一第二導電部分122B。彈性元件140內部更具有一導電材質之接觸部分146,在彈性元件140回應垂直外力按壓時,此接觸部分146向下移動並同時接觸第一導電部分122A與第二導電部分122B,使印刷電路122形成通路。在本發明之一實施例中,此基板120為一高分子薄膜。在本發明之另一實施例中,此高分子薄膜之材質為聚對苯二甲酸乙二醇酯(polyethylene terephthalate,PET)或聚碳酸酯(polycarbonate,PC)。在本發明之其他部分實施例中,基板120為一空白基板,其表面不具有印刷電路122。
最後執行步驟450,照射光於光硬化黏合膠層160使光
硬化黏合膠層160硬化,將彈性元件140固著於基板120之表面上。此黏合過程中透過照光使光硬化黏合膠層160硬化並增強彈性元件140與基板120間之黏接強度,不需經過高溫烘烤處理。本發明之特徵在於照光過程中,具有較佳塑性的基板120能避免於高溫處理中產生變形或彎曲,以確保彈性元件基板100之尺寸準度。透過照射光於光硬化黏合膠層160更能縮短彈性元件140固著至基板120所需時間,並達到較高之黏接強度。在本發明之一實施例中,使用的照射光為紫外光,照光時間10-30秒即可黏接完成。此外,因光硬化黏合膠層160之硬度較傳統光硬化黏合膠柔軟甚多,當黏合彈性元件140以及基板120時,光硬化黏合膠層160能減少應力,並使彈性元件140在黏合後仍能符合規格。此大幅增加了彈性元件基板100之規格穩定性。
由上述本發明實施例可知,本發明具有下列優點。在彈性元件基板100製造過程中,表面經熱處理程序後之彈性元件140能利用光硬化黏合膠之液態性,讓光硬化黏合膠流入彈性元件140底面暫時未含有油脂之底部貼面層144中,形成內部填滿光硬化黏合膠之底部貼面層144。此時光硬化黏合膠與彈性元件140之底面形成鍵價結合,進而增強兩者間黏接強度。且使用光硬化黏合膠層160作為彈性元件140與基板120間之黏合劑,透過照射紫外光即能使此光硬化黏合膠層160固化,不需經過高溫烘烤,能避免高溫下基板120發生收縮變形而影響彈性元件基板100原有之尺寸準度。光硬化黏合膠更具有固化速度快與黏接強度高之特性,且光硬化黏合膠層160之肖式A級硬度值
低於90,大幅增加了彈性元件基板100之規格穩定性,使用於彈性元件基板100之製程上更能增加產線效率。
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
100‧‧‧彈性元件基板
120‧‧‧基板
122‧‧‧印刷電路
122A‧‧‧第一導電部分
122B‧‧‧第二導電部分
140‧‧‧彈性元件
142‧‧‧內部區
144‧‧‧底部貼面層
146‧‧‧接觸部分
160‧‧‧光硬化黏合膠層
Claims (14)
- 一種製造彈性元件基板的方法,包含:提供一彈性元件;對該彈性元件進行一熱處理程序,以在該彈性元件之一底面形成一底部貼面層;塗布一光硬化黏合膠層於該彈性元件之該底面上,且部分的光硬化黏合膠流入該底部貼面層中,其中該光硬化黏合膠層之肖式A級硬度值低於90;放置該彈性元件之該底面於一基板之一表面上;以及照射光於該光硬化黏合膠層使該光硬化黏合膠層硬化,將該彈性元件固著於該基板之該表面上。
- 如請求項1所述之方法,其中該彈性元件材質為矽膠。
- 如請求項1所述之方法,其中該熱處理程序使用一火焰處理機。
- 如請求項1所述之方法,其中該基板為一高分子薄膜。
- 如請求項4所述之方法,其中該高分子薄膜材質為聚對苯二甲酸乙二醇酯(PET)或聚碳酸酯(PC)。
- 如請求項1所述之方法,其中該基板為一空白基板或為包含一印刷電路之基板。
- 如請求項1所述之方法,其中該光為紫外光。
- 一種彈性元件基板,包含:一基板;一光硬化黏合膠層,其中該光硬化黏合膠層之肖式A級硬度值低於90;以及一彈性元件,該彈性元件的一底面藉由該光硬化黏合膠層黏合至該基板之一表面上,其中該底面包含:一底部貼面層,內部填滿一光硬化黏合膠並與該光硬化黏合膠層接觸。
- 如請求項8所述之彈性元件基板,其中該基板為一高分子薄膜。
- 如請求項9所述之彈性元件基板,其中該高分子薄膜材質為聚對苯二甲酸乙二醇酯(PET)或聚碳酸酯(PC)。
- 如請求項8所述之彈性元件基板,其中該基板為一空白基板或為包含一印刷電路之基板。
- 如請求項8所述之彈性元件基板,其中該彈性元 件材質為矽膠。
- 如請求項8所述之彈性元件基板,其中該彈性元件包含一內部區,而該底部貼面層介於該內部區與該光硬化黏合膠層之間。
- 如請求項8所述之彈性元件基板,其中該光硬化黏合膠層為紫外光硬化黏合膠層。
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TWI382793B (zh) * | 2009-01-23 | 2013-01-11 | Chicony Electronics Co Ltd | Self-luminous circuit board structure |
TWI420556B (zh) * | 2009-12-18 | 2013-12-21 | Primax Electronics Ltd | 薄型發光鍵盤 |
TW201406904A (zh) * | 2012-05-22 | 2014-02-16 | Henkel China Co Ltd | 透明液態光學光硬化黏著劑 |
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