TWI504885B - Pattern inspection apparatus and pattern inspection method - Google Patents
Pattern inspection apparatus and pattern inspection method Download PDFInfo
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- TWI504885B TWI504885B TW102148142A TW102148142A TWI504885B TW I504885 B TWI504885 B TW I504885B TW 102148142 A TW102148142 A TW 102148142A TW 102148142 A TW102148142 A TW 102148142A TW I504885 B TWI504885 B TW I504885B
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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Description
本發明係關於一種檢查透明基材上之圖案之圖案檢查裝置及圖案檢查方法。The present invention relates to a pattern inspection device and a pattern inspection method for inspecting a pattern on a transparent substrate.
於智慧型手機等所利用之觸控面板之製造中，於PET(聚對苯二甲酸乙二酯)薄膜等之透明薄膜上形成有金屬配線圖案。作為引線之金屬配線圖案，係形成於觸控面板之外緣部，且連接於形成在中央部之透明電極圖案，其中該中央部即觸控面板之畫面。近年來，為了增大觸控面板之畫面，進行將外緣部之金屬配線圖案之圖案要素製作得更細窄之方法。此情況下，為了以與先前相同之條件使相同大小之電流流動於金屬配線圖案，將金屬配線圖案之厚度作成比習知之構成更大(增加長寬比)，以維持圖案要素之截面面積。In the manufacture of a touch panel used in a smart phone or the like, a metal wiring pattern is formed on a transparent film such as a PET (polyethylene terephthalate) film. The metal wiring pattern as the lead is formed on the outer edge portion of the touch panel, and is connected to the transparent electrode pattern formed at the central portion, wherein the central portion is the screen of the touch panel. In recent years, in order to increase the screen of the touch panel, a method of making the pattern elements of the metal wiring pattern at the outer edge portion thinner is performed. In this case, in order to flow a current of the same magnitude to the metal wiring pattern under the same conditions as before, the thickness of the metal wiring pattern is made larger than the conventional configuration (increasing the aspect ratio) to maintain the cross-sectional area of the pattern element.
又，於日本專利特開昭62-119444號公報(文獻1)、特開2006-72147號公報(文獻2)及特開2006-105816號公報(文獻3)中揭示一種方法，其藉由取得根據照射在透明之基材之一側之主表面之光線的反射光之反射圖像、及根據照射在基材之另一側之主表面之光線的穿透光之穿透圖像，來檢查基材上之圖案。Further, a method is disclosed in Japanese Patent Laid-Open Publication No. SHO-62-119444 (Document 1), JP-A-2006-72147 (Document 2), and JP-A-2006-105816 (Document 3). A reflection image of the reflected light of the light illuminating the main surface on one side of the transparent substrate, and a penetration image of the transmitted light according to the light illuminating the main surface on the other side of the substrate The pattern on the substrate.
但是，金屬配線圖案例如藉由對金屬薄膜進行局部蝕刻而形成。此時，根據蝕刻條件會有成為圖案要素之上面變得粗糙之狀 態、或圖案要素未被清晰、精確地蝕刻之情形。因此，對圖案要素之上面及圖案要素之末端(下部)之雙方進行檢查之要求提高。並且，於藉由印刷電子技術形成金屬配線圖案之情況下，由於圖案要素之末端容易擴展，因此更增加了對金屬配線圖案之末端進行檢查之必要性。However, the metal wiring pattern is formed, for example, by locally etching the metal thin film. At this time, depending on the etching conditions, the upper surface of the pattern element may become rough. State, or pattern elements are not etched clearly and accurately. Therefore, the demand for inspection of both the upper surface of the pattern element and the end (lower portion) of the pattern element is increased. Further, in the case where the metal wiring pattern is formed by the printed electronic technique, since the end of the pattern element is easily spread, the necessity of inspecting the end of the metal wiring pattern is further increased.
此情況下，可考慮應用文獻1至文獻3之方法，以取得顯示圖案要素之上面之反射圖像、及顯示圖案要素之末端之穿透圖像。然而，於文獻1至文獻3之裝置中，需要有分別取得反射圖像及穿透圖像之2個攝影部。藉此，會造成圖案檢查裝置之零件數量增多，並且會增加裝置之製造成本。In this case, it is conceivable to apply the methods of Documents 1 to 3 to obtain a reflection image of the upper surface of the display pattern element and a penetration image of the end of the display pattern element. However, in the apparatuses of Documents 1 to 3, it is necessary to have two imaging units that respectively acquire a reflection image and a penetration image. As a result, the number of parts of the pattern inspection device is increased, and the manufacturing cost of the device is increased.
本發明係適合於檢查透明基材上之圖案之圖案檢查裝置，其目的在於削減可取得反射圖像及穿透圖像之圖案檢查裝置之零件數量。The present invention is a pattern inspection apparatus suitable for inspecting a pattern on a transparent substrate, and an object thereof is to reduce the number of parts of a pattern inspection apparatus that can obtain a reflection image and penetrate an image.
本發明之圖案檢查裝置，其具備有：第一光源部，其對在板狀或薄膜狀之透明基材上形成有圖案之一側之主表面照射光線；第二光源部，其對上述透明基材之另一側之主表面照射光線；一個受光部，其可接受來自上述第一光源部之光線之自上述圖案之反射光、與來自上述第二光源部之光線之自上述透明基材之穿透光；移動機構，其使上述透明基材相對於上述第一光源部、上述第二光源部及上述受光部向沿著上述一側之主表面之移動方向以相對之方式移動；控制部，其一方面藉由上述移動機構使上述透明基材以連續或間斷之方式相對移動，一方面使上述第一光源部與上述第二光源部以交替之方式點燈，藉此並使用上述受光部加以取得根據上述反射光之反射圖像與根據上述穿透光之穿透圖像；及檢查部，其根據上述反射圖像與上 述穿透圖像，取得上述圖案之檢查結果。根據本發明，可以一個受光部取得反射圖像及穿透圖像，從而可削減圖案檢查裝置之零件數量。A pattern inspection device according to the present invention includes: a first light source unit that illuminates a main surface on a side of a pattern formed on a plate-shaped or film-shaped transparent substrate; and a second light source unit that is transparent to the surface The main surface of the other side of the substrate is irradiated with light; a light receiving portion that receives the reflected light from the pattern from the first light source portion and the light from the second light source portion from the transparent substrate a light-transmitting mechanism that moves the transparent substrate relative to the first light source portion, the second light source portion, and the light-receiving portion in a moving direction along a main surface of the one side; a portion of the transparent substrate that is relatively moved in a continuous or intermittent manner by the moving mechanism, wherein the first light source portion and the second light source portion are alternately lit, thereby using the above The light receiving unit obtains a reflection image according to the reflected light and a penetration image according to the transmitted light; and an inspection unit according to the reflection image and the upper The penetrating image is obtained, and the inspection result of the above pattern is obtained. According to the present invention, it is possible to obtain a reflection image and a penetration image by one light receiving unit, and it is possible to reduce the number of parts of the pattern inspection device.
本發明之一較佳形態中，上述受光部係為取得在上述透明基材上與上述移動方向呈交叉之線狀區域之圖像的線感測器，藉由上述線感測器以交替之方式取得上述反射圖像之線圖像與上述穿透圖像之線圖像。藉此可效率良好地取得反射圖像及穿透圖像。In a preferred aspect of the present invention, the light receiving unit is a line sensor that obtains an image of a linear region that intersects the moving direction on the transparent substrate, and the line sensor is alternated by the line sensor. The method obtains a line image of the reflected image and a line image of the through image. Thereby, the reflected image and the transmitted image can be efficiently obtained.
本發明之另一較佳形態中，圖案檢查裝置更具備有另一個受光部，而該另一個受光部係接受來自上述第二光源部之光線中之自接觸於上述一側之主表面之上述圖案之下面的反射光，而取得另一個反射圖像。藉此，可容易地檢查圖案要素之末端之粗大或細小。In another preferred embodiment of the present invention, the pattern inspection device further includes another light receiving portion, and the other light receiving portion receives the light from the second light source portion from the main surface of the one side. The reflected light below the pattern is taken to obtain another reflected image. Thereby, it is possible to easily check the thickness or the size of the end of the pattern element.
以上述圖案係由金屬形成為較佳。It is preferable that the above pattern is formed of a metal.
本發明也適合於使用圖案檢查裝置對透明基材上之圖案進行檢查之圖案檢查方法。The present invention is also suitable for a pattern inspection method for inspecting a pattern on a transparent substrate using a pattern inspection device.
上述之目的及其他目的、特徵、態樣及有利點，參照所附之圖式且根據以下進行之本發明之詳細說明，自可明瞭。The above and other objects, features, aspects and advantages of the invention are apparent from the accompanying drawings.
1‧‧‧圖案檢查裝置1‧‧‧ pattern inspection device
2‧‧‧移動機構2‧‧‧Mobile agencies
3、3a‧‧‧圖像取得單元3, 3a‧‧‧ image acquisition unit
9‧‧‧透明基材9‧‧‧Transparent substrate
11‧‧‧控制部11‧‧‧Control Department
12‧‧‧檢查部12‧‧‧ Inspection Department
21‧‧‧輥21‧‧‧ Roll
22‧‧‧供給部22‧‧‧Supply Department
23‧‧‧捲繞部23‧‧‧Winding Department
31‧‧‧第一光學系統31‧‧‧First optical system
32‧‧‧第二光學系統32‧‧‧Second optical system
81‧‧‧圖案81‧‧‧ pattern
91‧‧‧第一主表面91‧‧‧ first major surface
92‧‧‧第二主表面92‧‧‧Second major surface
311‧‧‧準直透鏡311‧‧‧ Collimating lens
312‧‧‧半反射鏡312‧‧‧ half mirror
313‧‧‧對物透鏡313‧‧‧object lens
314‧‧‧成像透鏡314‧‧‧ imaging lens
320‧‧‧透鏡320‧‧‧ lens
321‧‧‧準直透鏡321‧‧‧ collimating lens
322‧‧‧半反射鏡322‧‧‧half mirror
323‧‧‧對物透鏡323‧‧‧object lens
324‧‧‧成像透鏡324‧‧‧ imaging lens
331‧‧‧第一光源部331‧‧‧First Light Source Department
332‧‧‧第二光源部332‧‧‧Second light source department
341‧‧‧受光部341‧‧‧Receiving Department
342‧‧‧受光部342‧‧‧Receiving Department
811‧‧‧圖案要素811‧‧‧pattern elements
812‧‧‧碟形下陷區域812‧‧‧ dish-shaped depression area
W1‧‧‧細小量W1‧‧‧Small amount
W2‧‧‧粗大量W2‧‧‧
圖1為顯示圖案檢查裝置之構成之圖。Fig. 1 is a view showing the configuration of a pattern inspection device.
圖2為顯示圖像取得單元之內部構成之圖。Fig. 2 is a view showing the internal configuration of an image acquisition unit.
圖3為顯示檢查透明基材上之圖案之動作流程之圖。Fig. 3 is a view showing an operation flow for inspecting a pattern on a transparent substrate.
圖4為顯示透明基材上之圖案之剖視圖。Figure 4 is a cross-sectional view showing a pattern on a transparent substrate.
圖5為顯示上面反射圖像及穿透圖像中之亮度值之變化之圖。Fig. 5 is a graph showing changes in luminance values in the above-mentioned reflected image and transmitted image.
圖6為顯示圖案要素之俯視圖。Fig. 6 is a plan view showing a pattern element.
圖7為顯示穿透圖像之圖。Fig. 7 is a view showing a penetration image.
圖8為顯示上面反射圖像之圖。Figure 8 is a diagram showing the above reflected image.
圖9為顯示透明基材上之圖案之剖視圖。Figure 9 is a cross-sectional view showing a pattern on a transparent substrate.
圖10為顯示其他實施形態之圖案檢查裝置之圖像取得單元之構成之圖。Fig. 10 is a view showing the configuration of an image acquisition unit of the pattern inspection device according to another embodiment.
圖11為顯示上面反射圖像及下面反射圖像中之亮度值之變化之圖。Fig. 11 is a view showing changes in luminance values in the upper reflection image and the lower reflection image.
圖1為顯示本發明之一實施形態之圖案檢查裝置1之構成之圖。圖案檢查裝置1係檢查以金屬形成於樹脂製之透明基材9(例如，PET薄膜)上之圖案的裝置。圖案檢查裝置1具備：使連續薄膜即透明基材9之連續的部位朝圖1中之Y方向(以下，稱為「移動方向」。)連續地移動之移動機構2；圖像取得單元3，其取得移動途中之透明基材9之圖像；及控制部11，其擔負圖案檢查裝置1之整體控制。控制部11係具有根據所取得之圖像進行圖案之檢查之檢查部12。又，檢查部12也可自控制部11分開設置。Fig. 1 is a view showing the configuration of a pattern inspection device 1 according to an embodiment of the present invention. The pattern inspection device 1 is a device for inspecting a pattern formed of a metal on a resin-made transparent substrate 9 (for example, a PET film). The pattern inspection device 1 includes a moving mechanism 2 that continuously moves a continuous portion of the transparent substrate 9 in the Y direction (hereinafter referred to as a "moving direction" in FIG. 1; the image acquisition unit 3; The image of the transparent substrate 9 in the middle of the movement is obtained, and the control unit 11 is responsible for the overall control of the pattern inspection device 1. The control unit 11 has an inspection unit 12 that performs inspection of a pattern based on the acquired image. Further, the inspection unit 12 may be provided separately from the control unit 11.
移動機構2係具有圖1中之X方向(垂直於移動方向之方向)上較長之2個輥21，2個輥21係隔著圖像取得單元3而排列於移動方向。於2個輥21之(-Y)側設置有保持檢查前之透明基材9之輥同時並自該輥將透明基材9之各部位送出之供給部22。於2個輥21之(+Y)側設置有將進行了透明基材9之檢查之部位捲繞成輥狀而予保持之捲繞部23。以下之說明中，只稱為透明基材9之情況係指朝移動方向之移動途中之透明基材9之部位(亦即，2個輥21之間的透明基材9之部位)。如圖1所示，配置於2個輥21之間的圖像取得單元3中，透明基材9係垂直於圖1中之Z方向(亦即，朝X方向及Y方向)而伸 展。The moving mechanism 2 has two rollers 21 that are long in the X direction (the direction perpendicular to the moving direction) in FIG. 1, and the two rollers 21 are arranged in the moving direction via the image acquiring unit 3. On the (-Y) side of the two rolls 21, a supply portion 22 that holds the rolls of the transparent substrate 9 before inspection and simultaneously feeds the respective portions of the transparent substrate 9 from the rolls is provided. A winding portion 23 that winds a portion where the inspection of the transparent substrate 9 is performed in a roll shape and holds it is provided on the (+Y) side of the two rolls 21. In the following description, the case where only the transparent substrate 9 is referred to means a portion of the transparent substrate 9 in the middle of the movement in the moving direction (that is, a portion of the transparent substrate 9 between the two rolls 21). As shown in FIG. 1, in the image obtaining unit 3 disposed between the two rollers 21, the transparent substrate 9 is stretched perpendicularly to the Z direction in FIG. 1 (that is, toward the X direction and the Y direction). exhibition.
圖2為顯示圖像取得單元3之內部構成之圖。圖像取得單元3係具備配置於透明基材9之(+Z)側之第一光源部331、第一光學系統31及受光部341、暨配置於透明基材9之(-Z)側之第二光源部332及第二光學系統32。詳細而言，第一光源部331係將複數個發光二極體(LED)排列成一列之LED陣列，各LED射出例如藍色波長帶之光線。來自第一光源部331之光線係藉由第一光學系統31之準直透鏡311被取直(平行)，且由半反射鏡312反射而射入對物透鏡313。通過對物透鏡313之光線，被照射於透明基材9之一方之((+Z)側之)主表面即第一主表面91上。照射有來自第一光源部331之光線之透明基材9上之區域，係與移動方向交差之(較佳為，與移動方向正交之)線狀區域。於透明基材9之第一主表面91上以銅等之金屬形成有圖案，來自對物透鏡313之光線中的照射於圖案上之光線，由該圖案所反射，照射於其他區域之光線則穿透透明基材9(參照後述之圖4)。FIG. 2 is a view showing the internal configuration of the image acquisition unit 3. The image acquisition unit 3 includes a first light source unit 331 disposed on the (+Z) side of the transparent substrate 9 , a first optical system 31 and a light receiving unit 341 , and is disposed on the (-Z) side of the transparent substrate 9 . The second light source unit 332 and the second optical system 32. Specifically, the first light source unit 331 is an array of LEDs in which a plurality of light emitting diodes (LEDs) are arranged in a row, and each of the LEDs emits light of, for example, a blue wavelength band. The light from the first light source portion 331 is taken straight (parallel) by the collimator lens 311 of the first optical system 31, and is reflected by the half mirror 312 to be incident on the objective lens 313. The light passing through the object lens 313 is irradiated onto the main surface (the (+Z) side) which is one of the transparent substrates 9 on the first main surface 91. The region on the transparent substrate 9 on which the light from the first light source portion 331 is irradiated is a linear region which is intersected with the moving direction (preferably, orthogonal to the moving direction). A pattern is formed on the first main surface 91 of the transparent substrate 9 with a metal such as copper, and the light from the light incident on the lens 313 is reflected by the pattern, and the light is irradiated to other regions. The transparent substrate 9 is penetrated (refer to FIG. 4 described later).
由圖案之表面所反射之光線(主要以向圖案之(+Z)方向之面所反射之光線)射入對物透鏡313，通過對物透鏡313之光線，則經由半反射鏡312及成像透鏡314被導向受光部341。受光部341係將複數個受光元件排列成一列之線感測器，其於複數之受光元件之受光面、即線狀之受光區域形成有透明基材9上之線狀區域之藍色光的像。藉此，於第一光源部331為點燈狀態且第二光源部332為熄燈狀態之情況下，由受光部341取得根據來自圖案之上面(即向圖案之(+Z)方向之面)之反射光之線圖像(像素排成一列之圖像)。線圖像依序輸出至控制部11。The light reflected by the surface of the pattern (mainly reflected by the surface in the (+Z) direction of the pattern) is incident on the objective lens 313, and the light passing through the objective lens 313 passes through the half mirror 312 and the imaging lens. 314 is guided to the light receiving unit 341. The light receiving unit 341 is a line sensor in which a plurality of light receiving elements are arranged in a line, and an image of blue light in a linear region on the transparent substrate 9 is formed on a light receiving surface of a plurality of light receiving elements, that is, a linear light receiving region. . Thereby, when the first light source unit 331 is in the lighting state and the second light source unit 332 is in the light-off state, the light receiving unit 341 acquires the surface from the upper side of the pattern (that is, the surface in the (+Z) direction of the pattern). A line of reflected light (pixels arranged in a row). The line images are sequentially output to the control unit 11.
第二光源部332也為與第一光源部331同樣之LED陣 列，各LED射出紅色波長帶之光線。來自第二光源部332之光線係經由第二光學系統32之透鏡320照射於透明基材9之另一方之((-Z)側之)主表面即第二主表面92上。照射有來自第二光源部332之光線之透明基材9上之區域，係與移動方向交差之(較佳為，與移動方向正交之)線狀區域，且於Z方向上與來自第一光源部331之光線所照射之線狀區域大致重疊。來自第二光學系統32之光線中的照射於接觸(附著)於第一主表面91之圖案下面以外之區域之光線，係穿透透明基材9(參照後述之圖4)。The second light source unit 332 is also the same LED array as the first light source unit 331 Columns, each LED emits light in a red wavelength band. The light from the second light source portion 332 is irradiated onto the other main surface (of the (-Z) side) of the transparent substrate 9 via the lens 320 of the second optical system 32, that is, the second main surface 92. The region on the transparent substrate 9 irradiated with the light from the second light source portion 332 is a linear region (which is preferably orthogonal to the moving direction) that intersects the moving direction, and is in the Z direction from the first The linear regions irradiated by the light of the light source portion 331 substantially overlap each other. Light rays from the light of the second optical system 32 that are irradiated to the region other than the lower surface of the pattern of the first main surface 91 are transmitted through the transparent substrate 9 (see FIG. 4 described later).
穿透透明基材9之紅色光，係與由透明基材9反射之藍色光同樣，經由對物透鏡313、半反射鏡312及成像透鏡314被導向受光部314。藉此，於第二光源部332為點燈狀態且第一光源部331為熄燈狀態之情況下，由受光部341取得根據紅色之穿透光之線圖像。線圖像依序輸出至控制部11。The red light that has penetrated the transparent substrate 9 is guided to the light receiving portion 314 via the objective lens 313, the half mirror 312, and the imaging lens 314, similarly to the blue light reflected by the transparent substrate 9. Thereby, when the second light source unit 332 is in the lighting state and the first light source unit 331 is in the light-off state, the light receiving unit 341 acquires the line image of the transmitted light according to the red light. The line images are sequentially output to the control unit 11.
如上述，於受光部341中，可接受來自第一光源部331之光線之自圖案之反射光、及來自第二光源部332之光線之自透明基材9之穿透光。又，圖案中之上面及下面，也可不是顯示重力方向之上下方向者，而是根據圖案檢查裝置1中之圖像取得單元3之配置，使圖案之上面朝向鉛直方向之下方或朝向水平方向。As described above, in the light receiving portion 341, the reflected light from the pattern of the light from the first light source portion 331 and the transmitted light from the transparent substrate 9 of the light from the second light source portion 332 can be received. Further, the upper and lower sides of the pattern may not be the upper and lower directions of the gravity direction, but may be arranged such that the upper surface of the pattern faces downward or in the horizontal direction according to the arrangement of the image obtaining unit 3 in the pattern inspection device 1. .
圖3為顯示圖案檢查裝置1檢查透明基材9上之圖案之動作流程之圖。於圖案之檢查中，首先，藉由移動機構2開始使透明基材9朝移動方向連續地移動(步驟S11)。接著，藉由控制部11之控制交替地將第一光源部331及第二光源部332反複點燈。亦即，高速地反複進行第一光源部331之點燈及第二光源部332之熄燈、與第一光源部331之熄燈及第二光源部332之點燈。藉此，與透明基材9之 連續移動同步，於受光部341中交替地取得根據來自第一光源部331之光線之自圖案之反射光之線圖像、及根據來自第二光源部332之光線之自透明基材9之穿透光之線圖像。亦即，取得根據來自圖案之上面之反射光之二維圖像(以下，稱為「上面反射圖像」。)、及根據自透明基材9穿透之穿透光之二維圖像(以下，稱為「穿透圖像」。)(步驟S12)。FIG. 3 is a view showing an operation flow of the pattern inspection device 1 for inspecting the pattern on the transparent substrate 9. In the inspection of the pattern, first, the moving substrate 2 starts to continuously move the transparent substrate 9 in the moving direction (step S11). Next, the first light source unit 331 and the second light source unit 332 are alternately turned on by the control of the control unit 11. In other words, the lighting of the first light source unit 331 and the turning off of the second light source unit 332, the turning off of the first light source unit 331, and the lighting of the second light source unit 332 are repeated at high speed. Thereby, with the transparent substrate 9 In the continuous movement synchronization, the line image of the reflected light according to the self-pattern of the light from the first light source unit 331 is alternately obtained in the light receiving unit 341, and the light is transmitted from the transparent substrate 9 according to the light from the second light source unit 332. Light line image. That is, a two-dimensional image based on the reflected light from the upper surface of the pattern (hereinafter referred to as "upper reflected image") and a two-dimensional image based on the transmitted light penetrating from the transparent substrate 9 are obtained ( Hereinafter, it is referred to as "penetrating image" (step S12).
如已述之，於圖案檢查裝置1中，一面連續地使透明基材9移動，一面交替地取得上面反射圖像之線圖像及穿透圖像之線圖像。因此，若將相當於一個線圖像之透明基材9上之區域稱為線圖像區域，則上面反射圖像及穿透圖像之各個成為顯示各間隔一個之線圖像區域之圖像(亦即，交差式圖像)。As described above, in the pattern inspection apparatus 1, the transparent substrate 9 is continuously moved while the line image of the above-described reflected image and the line image of the transmitted image are alternately obtained. Therefore, if a region on the transparent substrate 9 corresponding to one line image is referred to as a line image region, each of the above-described reflected image and the penetrating image becomes an image showing a line image region of each interval. (ie, cross-sectional image).
例如，於作為線感測器之受光部341具有16000個受光元件，且該線感測器之時脈頻率為640兆赫(MHz)之情況下，為了取得受光部341中之一個線圖像，需要25微秒(μs)，因此以25μs之間隔交替地進行第一光源部331及第二光源部332之點燈。此情況下，例如，於以掃描方向上之線圖像區域之寬度為2微米(μm)而取得線圖像時，透明基材9朝移動方向之移動速度被設定為每秒80毫米(80mm/s)。又，於透明基材9之移動速度為40mm/s之情況下，以線圖像區域之寬度為1μm，同樣可取得交差之上面反射圖像及穿透圖像。For example, when the light receiving unit 341 as the line sensor has 16000 light receiving elements and the clock frequency of the line sensor is 640 megahertz (MHz), in order to obtain one line image in the light receiving unit 341, Since it takes 25 microseconds (μs), the lighting of the first light source unit 331 and the second light source unit 332 is alternately performed at intervals of 25 μs. In this case, for example, when the line image is obtained with the width of the line image area in the scanning direction being 2 micrometers (μm), the moving speed of the transparent substrate 9 in the moving direction is set to 80 mm per second (80 mm). /s). Further, when the moving speed of the transparent substrate 9 is 40 mm/s, the width of the line image region is 1 μm, and the upper reflection image and the penetration image of the intersection can be obtained in the same manner.
圖4為顯示透明基材9上之圖案81之一例之剖視圖。本實施形態中之圖案81係由金屬所形成之配線圖案。於使用於觸控面板之透明基材9中，圖案81係形成於相當於該觸控面板之外緣部之區域，且與由ITO等形成於相當於中央部之區域之透明電極圖案連接。亦即，圖案81係與透明電極圖連接之不透明圖案。圖案81具有複數 個圖案要素811。各圖案要素811之寬度例如為10~30μm。於圖4及後述之圖5之上段，以二點鏈結線顯示理想之圖案要素811之外形於(後述之圖9及圖11之上段中也同樣)。圖4之圖案要素811中，末端較粗大(底端變寬)。4 is a cross-sectional view showing an example of a pattern 81 on the transparent substrate 9. The pattern 81 in the present embodiment is a wiring pattern formed of a metal. In the transparent substrate 9 used for the touch panel, the pattern 81 is formed in a region corresponding to the outer edge portion of the touch panel, and is connected to a transparent electrode pattern formed in a region corresponding to the central portion by ITO or the like. That is, the pattern 81 is an opaque pattern that is connected to the transparent electrode pattern. Pattern 81 has a plurality Pattern elements 811. The width of each of the pattern elements 811 is, for example, 10 to 30 μm. In the upper part of FIG. 4 and FIG. 5 which will be described later, the ideal pattern element 811 is formed by a two-dot chain line (the same applies to the upper part of FIG. 9 and FIG. 11 which will be described later). In the pattern element 811 of Fig. 4, the end is thicker (the bottom end is wider).
圖5為顯示上面反射圖像及穿透圖像中之亮度值之變化之圖。圖5之上段顯示圖4之一部分的圖案要素811，中段顯示於顯示該圖案要素811之上面反射圖像中排列於X方向(對應於此之方向)之像素之亮度值之變化，下段顯示於顯示該圖案要素811之穿透圖像中排列於X方向之像素之亮度值之變化。Fig. 5 is a graph showing changes in luminance values in the above-mentioned reflected image and transmitted image. The upper part of FIG. 5 shows the pattern element 811 of one part of FIG. 4 , and the middle part shows the change of the brightness value of the pixel arranged in the X direction (corresponding to the direction) in the upper reflection image of the pattern element 811, and the lower part is displayed in the lower part. The change in the luminance value of the pixels arranged in the X direction in the through image of the pattern element 811 is displayed.
檢查部12中，根據上面反射圖像及穿透圖像，取得圖案之檢查結果(步驟S13)。詳細而言，作為一個檢查處理，對上面反射圖像及穿透圖像進行比較。於圖案要素811之末端較粗大之圖5上段之例子中，在中段所示之上面反射圖像中與圖案要素811之上面(即，朝向與透明基材9相反側之面)對應之範圍內所含之像素之亮度值增高。另一方面，下段所示之穿透圖像中與圖案要素811之下面(即，與透明基材9接觸之面)對應之範圍內所含之像素之亮度值變低。因此，於檢查部12中，藉由取得上面反射圖像所示之圖案要素811之上面之邊緣位置與穿透圖像所示之圖案要素811之下面之邊緣位置之差，可求得圖案要素811之末端中之粗大量W2。The inspection unit 12 acquires the inspection result of the pattern based on the above-described reflected image and the transmitted image (step S13). In detail, as a check process, the above-mentioned reflected image and the penetrated image are compared. In the example of the upper stage of FIG. 5 where the end of the pattern element 811 is thicker, the upper reflection image shown in the middle section corresponds to the upper surface of the pattern element 811 (that is, the surface opposite to the side opposite to the transparent substrate 9). The brightness value of the included pixels is increased. On the other hand, in the penetration image shown in the lower stage, the luminance value of the pixel included in the range corresponding to the lower surface of the pattern element 811 (that is, the surface in contact with the transparent substrate 9) becomes lower. Therefore, in the inspection unit 12, the pattern element can be obtained by obtaining the difference between the edge position of the upper surface of the pattern element 811 indicated by the upper reflection image and the edge position of the lower surface of the pattern element 811 indicated by the penetration image. A large amount of W2 in the end of 811.
將粗大量W2與規定之臨界值比較，於其為該臨界值以上之情況下，則將圖案要素811之末端中有產生超過容許範圍之粗大之旨意，作為圖案之檢查結果被顯示於顯示部(省略圖示)。實際上，上面反射圖像也顯示於顯示部，操作者藉由參照上面反射圖像，可確認圖案要素811之上面之狀態(上面之粗糙程度等)。When the rough amount W2 is compared with the predetermined critical value, when the threshold value is equal to or greater than the critical value, the end of the pattern element 811 has a coarseness exceeding the allowable range, and is displayed on the display portion as a result of the inspection of the pattern. (The illustration is omitted). Actually, the above-described reflected image is also displayed on the display portion, and the operator can confirm the state of the upper surface of the pattern element 811 (the roughness of the upper surface, etc.) by referring to the above-described reflected image.
於檢查部12中之其他檢查處理中，根據穿透圖像檢測圖案要素811之上面有無凹陷。其中，圖案要素811之上面之凹陷亦被稱為碟形下陷，於產生凹陷之部分，圖案要素811之厚度變小。於數百奈米(nm)之厚度之圖案要素811中，產生凹陷之部分中之圖案要素811之厚度，例如為70nm以下，於來自第二光源部332之紅色光中，相對於數百nm之厚度之金屬膜之穿透率大致為0，而70nm以下之厚度之金屬膜之穿透率則較高。In the other inspection processing in the inspection unit 12, the presence or absence of the depression on the upper surface of the pattern element 811 is detected based on the penetration image. Here, the depression on the upper side of the pattern element 811 is also referred to as a dish-shaped depression, and the thickness of the pattern element 811 becomes small at the portion where the depression is generated. In the pattern element 811 having a thickness of several hundred nanometers (nm), the thickness of the pattern element 811 in the portion where the recess is generated is, for example, 70 nm or less, and the red light from the second light source portion 332 is relative to several hundreds of nm. The penetration rate of the metal film of the thickness is approximately 0, and the transmittance of the metal film having a thickness of 70 nm or less is higher.
例如，於在圖6所示之圖案要素811中於由細線所圍成之區域812(以下，稱為「碟形下陷區域812」。)產生有凹陷之情況下，如圖7所示，於穿透圖像中顯示圖案要素811之區域之大部分區域中，亮度值降低(變暗)，但於顯示碟形下陷區域812之區域中，亮度值則比周圍增高(變亮)。圖7中，藉由改變平行斜線之間隔，以顯示亮度值之差異，平行斜線之間隔越窄，則表示亮度值越低。For example, in the pattern element 811 shown in FIG. 6, in the case where a region 812 surrounded by a thin line (hereinafter referred to as "dish-shaped depressed region 812") is formed with a depression, as shown in FIG. In most of the area of the area where the pattern element 811 is displayed in the penetrating image, the luminance value is lowered (darkened), but in the area where the dish-shaped depressed area 812 is displayed, the luminance value is increased (brightened) than the surrounding area. In Fig. 7, by changing the interval of the parallel oblique lines to show the difference in luminance values, the narrower the interval between the parallel oblique lines, the lower the luminance value.
此外，於來自第一光源部331之藍色光中，數百nm之厚度之金屬膜(例如，Cu、Ag等)及70nm以下之厚度之金屬膜之穿透率均大致為0，但由於反射光之方向因碟形下陷而變化，因此碟形下陷區域略微變暗。如圖8所示，於上面反射圖像中，顯示圖案要素811之上面之區域的大致整體之亮度值增高(變亮)，但碟形下陷區域略微變暗。因此，檢查部12中，藉由以規定之方法將穿透圖像及上面反射圖像合成，以取得顯示碟形下陷區域812之圖像、亦即可使檢測碟形下陷區域812變得容易。於檢測出規定之面積以上之碟形下陷區域812之情況下，將於圖案要素811之上面產生凹陷之旨意，作為圖案之檢查結果顯示於顯示部。又，也可於顯示部顯示碟形下陷區域812之圖像。Further, among the blue light from the first light source unit 331, the transmittance of a metal film (for example, Cu, Ag, etc.) having a thickness of several hundred nm and a metal film having a thickness of 70 nm or less are substantially 0, but due to reflection The direction of the light changes due to dishing, so the dished area is slightly darkened. As shown in FIG. 8, in the above-described reflected image, the luminance value of substantially the entire area of the upper surface of the display pattern element 811 is increased (brightened), but the dish-shaped depressed area is slightly darkened. Therefore, in the inspection unit 12, by detecting the penetration image and the above-described reflection image by a predetermined method to obtain an image showing the dish-shaped depressed region 812, it is possible to easily detect the dish-shaped depressed region 812. . When the dish-shaped depressed region 812 having a predetermined area or more is detected, a depression is formed on the upper surface of the pattern element 811, and the result of inspection as a pattern is displayed on the display portion. Further, an image of the dish-shaped depressed region 812 may be displayed on the display portion.
如上述，根據上面反射圖像及穿透圖像，取得圖案之檢查結果。步驟S12、S13之處理係每當透明基材9移動一定距離就被反複執行。當對於透明基材9整體之檢查完成時，使第一光源部331及第二光源部332之亮暗停止，同時並停止透明基材9之移動，而結束檢查(步驟S14)。又，檢查部12中，粗大量W2或碟形下陷區域812之面積等，亦可作為圖案之檢查結果使用。換言之，圖案檢查裝置1亦可用作為測量圖案之粗大量、碟形下陷區域812之面積等之測量裝置。As described above, the inspection result of the pattern is obtained based on the above-described reflected image and the transmitted image. The processing of steps S12 and S13 is repeatedly performed each time the transparent substrate 9 is moved by a certain distance. When the inspection of the entire transparent substrate 9 is completed, the light source of the first light source unit 331 and the second light source unit 332 is stopped, and the movement of the transparent substrate 9 is stopped, and the inspection is terminated (step S14). Further, in the inspection unit 12, the area of the thick amount W2 or the dish-shaped depressed area 812 may be used as a result of inspection of the pattern. In other words, the pattern inspection device 1 can also be used as a measuring device for measuring a large number of patterns, an area of the dish-shaped depressed region 812, and the like.
如以上說明，於圖案檢查裝置1中設置有，於(僅)在第一主表面91形成有圖案81之透明基材9上將光照射於第一主表面91之第一光源部331、將光照射於第二主表面92之第二光源部332、及可接受來自第一光源部331之光線之自圖案81之反射光與來自第二光源部332之光線之自透明基材9之穿透光之一個受光部341。並且，藉由一面使透明基材9連續地移動一面交替地將第一光源部331及第二光源部332點燈，從而實現可使用一個受光部341取得根據反射光之反射圖像及根據穿透光之穿透圖像。藉此，可削減圖案檢查裝置1之零件數量，並可削減圖案檢查裝置1之製造成本。As described above, in the pattern inspection apparatus 1, the first light source unit 331 that irradiates light onto the first main surface 91 on the transparent substrate 9 on which the pattern 81 is formed on the first main surface 91 is provided. The second light source portion 332 that illuminates the second main surface 92, and the reflected light from the pattern 81 that can receive the light from the first light source portion 331 and the light from the second light source portion 332 are worn from the transparent substrate 9. One light receiving portion 341 that transmits light. Further, by alternately moving the first light source unit 331 and the second light source unit 332 while continuously moving the transparent substrate 9, it is possible to obtain a reflection image according to the reflected light using one light receiving unit 341 and to wear it. Penetrating image of light transmission. Thereby, the number of parts of the pattern inspection apparatus 1 can be reduced, and the manufacturing cost of the pattern inspection apparatus 1 can be reduced.
此外，圖案檢查裝置1中，藉由第二光源部332射出紅色之波長帶之光線，從而實現根據穿透圖像對圖案要素811上面之凹陷進行檢測。又，受光部341係取得透明基材9上與移動方向交叉之線狀區域之圖像之線感測器，藉由該線感測器交替地取得上面反射圖像之線圖像及穿透圖像之線圖像。藉此，可效率良好地取得上面反射圖像及穿透圖像。Further, in the pattern inspection apparatus 1, the light of the red wavelength band is emitted by the second light source unit 332, thereby detecting the depression of the pattern element 811 from the penetration image. Further, the light receiving unit 341 is a line sensor that obtains an image of a linear region on the transparent substrate 9 that intersects the moving direction, and the line sensor alternately obtains a line image and penetration of the above-mentioned reflected image. Line image of the image. Thereby, the above-described reflected image and transmitted image can be efficiently obtained.
然而，如圖9所示，於圖案要素811之末端較細小(底端 變窄)之情況下，以受光部341所取得之穿透圖像，因圖案要素811之上部之影響，無法作為顯示圖案要素811之末端者，而無法取得末端之細小量。以下，對可取得圖案要素811之末端之細小量之圖案檢查裝置1進行說明。However, as shown in FIG. 9, the end of the pattern element 811 is fine (bottom end) In the case of the narrowed image, the transmitted image obtained by the light receiving unit 341 cannot be the end of the display pattern element 811 due to the influence of the upper portion of the pattern element 811, and the end portion cannot be obtained in a small amount. Hereinafter, a small amount of the pattern inspection device 1 that can obtain the end of the pattern element 811 will be described.
圖10為顯示本發明之其他實施形態之圖案檢查裝置1之圖像取得單元3a之構成之圖。於圖10之圖像取得單元3a中，相對於圖2之圖像取得單元3，其第二光學系統32之構成相異，並進一步於透明基材9之(-Z)側追加另一個受光部342。其他構成係與圖2之圖像取得單元3同樣，且對相同之構成賦予相同之符號。Fig. 10 is a view showing the configuration of an image acquisition unit 3a of the pattern inspection device 1 according to another embodiment of the present invention. In the image acquisition unit 3a of FIG. 10, the second optical system 32 is different in composition from the image acquisition unit 3 of FIG. 2, and further another light is added to the (-Z) side of the transparent substrate 9. Part 342. The other configurations are the same as those of the image acquisition unit 3 of Fig. 2, and the same components are denoted by the same reference numerals.
圖10之圖像取得單元3a中，來自第二光源部332之光線，由第二光學系統32之準直透鏡321取直(平行)後，經由半反射鏡322射入對物透鏡323。通過對物透鏡323之光線照射於透明基材9之第二主表面92上。照射有該光之透明基材9上之區域，係與移動方向交差之線狀區域。來自對物透鏡323之光線中之照射於與第一主表面91接觸之圖案81之下面之光線，則在該下面被反射，而照射於其他區域之光線則穿透透明基材9。由圖案81下面所反射之光射入對物透鏡323。通過對物透鏡323之光由半反射鏡322反射後，經由成像透鏡324被導向受光部342。受光部342係與受光部341同樣之線感測器，來自透明基材9上之線狀區域之紅色光，係由線狀之受光區域所接受。In the image acquisition unit 3a of FIG. 10, the light from the second light source unit 332 is taken straight (parallel) by the collimator lens 321 of the second optical system 32, and then incident on the objective lens 323 via the half mirror 322. The light passing through the object lens 323 is irradiated onto the second main surface 92 of the transparent substrate 9. The region on the transparent substrate 9 on which the light is irradiated is a linear region that intersects the moving direction. Light rays from the light rays of the object lens 323 which are irradiated on the lower surface of the pattern 81 in contact with the first main surface 91 are reflected under the light, and light rays irradiated to other regions penetrate the transparent substrate 9. Light reflected from under the pattern 81 is incident on the objective lens 323. The light passing through the objective lens 323 is reflected by the half mirror 322, and then guided to the light receiving portion 342 via the imaging lens 324. The light receiving unit 342 is a line sensor similar to the light receiving unit 341, and the red light from the linear region on the transparent substrate 9 is received by the linear light receiving region.
此外，藉由第一光源部331照射於第一主表面91上之光線中之自透明基材9之穿透光，經由對物透鏡323、半反射鏡322及成像透鏡324被導向受光部342。如此，受光部342中，可接受來自第二光源部332之光線之自圖案81之反射光、及來自第一光源部331之光線之自透明基材9之穿透光。因此，於第二光源部332為點燈狀 態且第一光源部331為熄燈狀態之情況下，取得根據來自圖案81之下面之反射光之線圖像，於第一光源部331為點燈狀態且第二光源部332為熄燈狀態之情況下，取得根據來自透明基材9之穿透光之線圖像。Further, the light transmitted from the transparent substrate 9 in the light irradiated onto the first main surface 91 by the first light source portion 331 is guided to the light receiving portion 342 via the objective lens 323, the half mirror 322, and the imaging lens 324. . In this manner, in the light receiving portion 342, the reflected light from the pattern 81 and the light from the first light source portion 331 from the transparent substrate 9 can be received by the light from the second light source portion 332. Therefore, the second light source unit 332 is lit. When the first light source unit 331 is in the light-off state, the line image based on the reflected light from the lower surface of the pattern 81 is obtained, and the first light source unit 331 is turned on and the second light source unit 332 is turned off. Next, a line image based on the transmitted light from the transparent substrate 9 is obtained.
於具有圖像取得單元3a之圖案檢查裝置1中，一面藉由移動機構2使透明基材9朝移動方向連續地移動，一面藉由控制部11(參照圖1)，交替地將第一光源部331及第二光源部332點燈。藉此，於受光部341中，交替地取得根據來自圖案81之上面之反射光之上面反射圖像之線圖像、及根據來自透明基材9之穿透光之第一穿透圖像之線圖像。此外，於受光部342中，交替地取得根據來自圖案81之下面之反射光之下面反射圖像之線圖像、及根據來自透明基材9之穿透光之第二穿透圖像之線圖像。又，於受光部342中，不必一定要取得第二穿透圖像。In the pattern inspection device 1 having the image acquisition unit 3a, the first substrate is alternately moved by the control unit 11 (see FIG. 1) while the transparent substrate 9 is continuously moved in the moving direction by the moving mechanism 2. The portion 331 and the second light source unit 332 are turned on. Thereby, in the light receiving portion 341, a line image based on the upper surface of the reflected light from the upper surface of the pattern 81 and a first through image based on the transmitted light from the transparent substrate 9 are alternately obtained. Line image. Further, in the light receiving portion 342, a line image based on the downward reflection image of the reflected light from the lower surface of the pattern 81 and a line of the second penetration image according to the transmitted light from the transparent substrate 9 are alternately obtained. image. Further, in the light receiving unit 342, it is not necessary to obtain the second through image.
圖11為顯示上面反射圖像及下面反射圖像中之亮度值之變化之圖。圖11之上段顯示圖9之一部分的圖案要素811，中段顯示於顯示該圖案要素811之上面反射圖像中排列於X方向(對應於此之方向)之像素之亮度值之變化，下段顯示於顯示該圖案要素811之下面反射圖像中排列於X方向之像素之亮度值之變化。Fig. 11 is a view showing changes in luminance values in the upper reflection image and the lower reflection image. The upper part of FIG. 11 shows the pattern element 811 of one part of FIG. 9 , and the middle part shows the change of the brightness value of the pixel arranged in the X direction (corresponding to the direction) in the upper reflection image of the pattern element 811, and the lower part is displayed in the lower part. The change in the luminance value of the pixels arranged in the X direction in the reflected image below the pattern element 811 is displayed.
檢查部12中，除了上述之檢查處理，並且還根據上面反射圖像及下面反射圖像進行檢查處理。詳細而言，於圖案要素811之末端較細小之圖11上段之例子中，相對於在中段所示之上面反射圖像中與圖案要素811之上面對應之範圍內所含之像素之亮度值增高，而下段所示之下面反射圖像中與圖案要素811之下面對應之範圍內所含之像素之亮度值增高。因此，於檢查部12中，藉由取得上面反射圖像所示之圖案要素811之上面之邊緣位置與下面反射圖像所示之圖案 要素811之下面之邊緣位置之差，可求得圖案要素811之末端中之細小量W1。本實施形態中，藉由求得上面反射圖像及下面反射圖像之差分圖像，以取得細小量W1。將細小量W1與規定之臨界值比較，於其為該臨界值以上之情況下，則將圖案要素811之末端中有產生超過容許範圍之細小之旨意，作為圖案之檢查結果被顯示於顯示部。又，也可根據上面反射圖像及下面反射圖像來求取圖案要素811之末端的粗大量W2。In addition to the above-described inspection processing, the inspection unit 12 performs inspection processing based on the above-described reflected image and the under-reflected image. In detail, in the example of the upper stage of FIG. 11 in which the end of the pattern element 811 is thin, the luminance value of the pixel included in the range corresponding to the upper surface of the pattern element 811 in the upper reflection image shown in the middle section is increased. The luminance value of the pixel included in the range corresponding to the lower surface of the pattern element 811 in the lower reflection image shown in the lower stage is increased. Therefore, in the inspection unit 12, the edge position of the upper surface of the pattern element 811 shown by the upper reflection image and the pattern shown by the reflection image below are obtained. A small amount W1 of the end of the pattern element 811 can be obtained by the difference between the edge positions of the elements 811 below. In the present embodiment, a small amount W1 is obtained by obtaining a difference image between the upper reflection image and the lower reflection image. When the small amount W1 is compared with the predetermined critical value, when the threshold value is equal to or greater than the critical value, the end of the pattern element 811 has a fineness exceeding the allowable range, and is displayed on the display portion as a result of the inspection of the pattern. . Further, a large amount W2 of the end of the pattern element 811 may be obtained from the above-described reflected image and the downward reflected image.
如以上說明，於具有圖像取得單元3a之圖案檢查裝置1中，設置另一個受光部342，其接受自第二光源部332照射於第二主表面92之光線中之由圖案81之下面所反射之反射光，以取得下面反射圖像。並且，於檢查部12中，使用根據來自圖案81上面之反射光之上面反射圖像、及根據來自圖案81下面之反射光之下面反射圖像，輸出圖案81之檢查結果。藉此，可容易地檢查圖案要素811之末端之細小(及粗大)。此外，由於與圖像取得單元3同樣，使用一個受光部341來取得上面反射圖像及穿透圖像，因此可削減圖案檢查裝置1之零件數量。As described above, in the pattern inspection device 1 having the image acquisition unit 3a, another light receiving portion 342 is provided which receives the light from the second light source portion 332 which is irradiated onto the light of the second main surface 92 by the lower surface of the pattern 81. The reflected light is reflected to obtain the reflected image below. Further, in the inspection unit 12, an inspection result of the output pattern 81 is output using an image reflected from the upper surface of the reflected light from the upper surface of the pattern 81 and a reflection image from the lower surface of the reflected light from the lower surface of the pattern 81. Thereby, the size (and coarseness) of the end of the pattern element 811 can be easily checked. Further, similarly to the image acquisition unit 3, since the upper reflection image and the penetration image are obtained by using one light receiving unit 341, the number of parts of the pattern inspection apparatus 1 can be reduced.
上述圖案檢查裝置1係可作各種之變形。於上述實施形態中，第二光源部332係射出紅色波長帶之光線，但也可射出自紅色至紅外之波長範圍內所含之任意波長帶(例如，近紅外波長帶)之光線。藉此，可容易檢測圖案要素811上面之凹陷。此外，也可藉由於圖10之圖案檢查裝置1中由第一光源部331射出上述波長範圍內所含之任意波長帶之光線，根據以受光部342取得之第二穿透圖像來檢測碟形下陷區域。根據圖案檢查裝置1中之檢查對象之圖案種類，第一光源部331及第二光源部332也可射出其他波長帶之光線。第一光源部331 及第二光源部332也可具有LED以外之發光元件及燈作為光源。The pattern inspection device 1 described above can be variously modified. In the above embodiment, the second light source unit 332 emits light of a red wavelength band, but may emit light of an arbitrary wavelength band (for example, a near-infrared wavelength band) included in a wavelength range from red to infrared. Thereby, the depression on the pattern element 811 can be easily detected. Further, in the pattern inspection device 1 of FIG. 10, the first light source unit 331 emits light of an arbitrary wavelength band included in the wavelength range, and the dish can be detected based on the second penetration image obtained by the light receiving unit 342. Shaped depression area. The first light source unit 331 and the second light source unit 332 can emit light of other wavelength bands in accordance with the pattern type of the inspection target in the pattern inspection device 1. First light source part 331 The second light source unit 332 may have a light-emitting element other than the LED and a lamp as a light source.
受光部341、342也可為二維地配置有受光元件之區域感測器。此外，於圖案檢查裝置1中，也可藉由一面使透明基材9斷續地相對移動一面於透明基材9之各停止位置交替地將第一光源部331及第二光源部332點燈，而高精度地取得上面反射圖像及穿透圖像。The light receiving units 341 and 342 may be area sensors in which the light receiving elements are two-dimensionally arranged. Further, in the pattern inspection apparatus 1, the first light source unit 331 and the second light source unit 332 may be alternately turned on at the respective stop positions of the transparent substrate 9 while the transparent substrate 9 is intermittently moved relative to each other. The above-mentioned reflected image and the transmitted image are obtained with high precision.
第一光源部331及第二光源部332之配置、暨受光部341、342之配置，也可配合第一光學系統31及第二光學系統32之構成而適宜變更。The arrangement of the first light source unit 331 and the second light source unit 332 and the arrangement of the light receiving units 341 and 342 may be appropriately changed in accordance with the configuration of the first optical system 31 and the second optical system 32.
檢查部12中，也可藉由將例如下面反射圖像與規定之基準圖像比較，以取得圖案要素811之末端之細小量或粗大量。The inspection unit 12 may obtain a small amount or a large amount of the end of the pattern element 811 by comparing, for example, the reflected image below with a predetermined reference image.
圖案檢查裝置1中，也可設置使圖像取得單元3、3a相對於透明基材9朝移動方向移動之移動機構。亦即，藉由設置使透明基材9相對於第一光源部331、第二光源部332及受光部341朝沿第一主表面91之移動方向相對地移動之移動機構，可取得橫跨於透明基材9上之廣範圍之上面反射圖像及穿透圖像。此外，也可藉由於透明之工作台上載置透明基材9，且使該工作台相對於圖像取得單元朝移動方向相對地移動，以取得上面反射圖像及穿透圖像。In the pattern inspection device 1, a moving mechanism that moves the image acquisition units 3 and 3a in the moving direction with respect to the transparent substrate 9 may be provided. In other words, by providing a moving mechanism for relatively moving the transparent substrate 9 relative to the first light source portion 331, the second light source portion 332, and the light receiving portion 341 in the moving direction of the first main surface 91, it is possible to A wide range of reflected images and penetrating images on the transparent substrate 9 are provided. Further, the transparent substrate 9 may be placed on the transparent table, and the table may be relatively moved in the moving direction with respect to the image capturing unit to obtain the above-mentioned reflected image and the transmitted image.
圖案檢查裝置1中之檢查的對象物，除形成於薄膜狀之透明基材9之圖案以外，也可為形成於玻璃等之板狀透明基材之圖案。透明基材也可使用於觸控面板以外之用途。此外，透明基材上之圖案如果不透明，也可為例如由光阻形成之圖案等。The object to be inspected in the pattern inspection device 1 may be a pattern formed on a plate-shaped transparent substrate such as glass, in addition to the pattern formed on the film-form transparent substrate 9. Transparent substrates can also be used for applications other than touch panels. Further, the pattern on the transparent substrate may be, for example, a pattern formed of a photoresist if it is opaque.
上述實施形態及各變形例之構成，只要不相互矛盾，即可適宜地組合使用。The configurations of the above-described embodiments and modifications may be used in combination as appropriate without any contradiction.
以上，對發明詳細地進行了描述及說明，惟已述之發明僅為例示而已，非用來限制本發明。因此，只要未超出本發明之範圍，皆可作成各種之變形及態樣。The invention has been described and illustrated in detail hereinabove. Therefore, various modifications and aspects can be made without departing from the scope of the invention.
3‧‧‧圖像取得單元3‧‧‧Image acquisition unit
9‧‧‧透明基材9‧‧‧Transparent substrate
31‧‧‧第一光學系統31‧‧‧First optical system
32‧‧‧第二光學系統32‧‧‧Second optical system
91‧‧‧第一主表面91‧‧‧ first major surface
92‧‧‧第二主表面92‧‧‧Second major surface
311‧‧‧準直透鏡311‧‧‧ Collimating lens
312‧‧‧半反射鏡312‧‧‧ half mirror
313‧‧‧對物透鏡313‧‧‧object lens
314‧‧‧成像透鏡314‧‧‧ imaging lens
320‧‧‧透鏡320‧‧‧ lens
331‧‧‧第一光源部331‧‧‧First Light Source Department
332‧‧‧第二光源部332‧‧‧Second light source department
341‧‧‧受光部341‧‧‧Receiving Department
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| JP3418054B2 (en) * | 1996-02-16 | 2003-06-16 | 三井金属鉱業株式会社 | Wiring pattern line width measurement device |
| IL118872A (en) * | 1996-07-16 | 2000-06-01 | Orbot Instr Ltd | Optical inspection method and apparatus |
| JP3378795B2 (en) * | 1998-03-27 | 2003-02-17 | シャープ株式会社 | Display device inspection apparatus and inspection method |
| JP2001305074A (en) * | 2000-04-19 | 2001-10-31 | Dainippon Printing Co Ltd | Method and device for inspecting plate-like workpiece |
| JP4304690B2 (en) * | 2002-12-27 | 2009-07-29 | 国際技術開発株式会社 | Tape member inspection device |
| JP2005024386A (en) * | 2003-07-02 | 2005-01-27 | Ushio Inc | Wiring pattern inspection apparatus |
| JP4403777B2 (en) * | 2003-11-07 | 2010-01-27 | ウシオ電機株式会社 | Wiring pattern inspection apparatus and method |
| KR20070048034A (en) * | 2005-11-03 | 2007-05-08 | 엘지전자 주식회사 | Inspecting apparatus for tape substrate |
| JP2008267851A (en) * | 2007-04-17 | 2008-11-06 | Ushio Inc | Pattern inspection device and method |
| JP2010048745A (en) * | 2008-08-25 | 2010-03-04 | Asahi Glass Co Ltd | Defect inspection system and defect inspection method |
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- 2013-12-23 KR KR1020130161434A patent/KR101588937B1/en not_active IP Right Cessation
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| TW402686B (en) * | 1998-01-22 | 2000-08-21 | Applied Materials Inc | Optical inspection method and apparatus |
| TWI349772B (en) * | 2007-11-08 | 2011-10-01 | Chunghwa Picture Tubes Ltd | Testing method |
| CN101887030A (en) * | 2009-05-15 | 2010-11-17 | 圣戈本玻璃法国公司 | Method and system for detecting defects of surface and/or interior of transparent substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014157086A (en) | 2014-08-28 |
| KR20140103027A (en) | 2014-08-25 |
| KR101588937B1 (en) | 2016-01-26 |
| CN103995003B (en) | 2017-04-19 |
| TW201439523A (en) | 2014-10-16 |
| CN103995003A (en) | 2014-08-20 |
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