TWI504713B - 感光性接著劑組成物、感光性接著劑片及使用其之半導體裝置 - Google Patents
感光性接著劑組成物、感光性接著劑片及使用其之半導體裝置 Download PDFInfo
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- TWI504713B TWI504713B TW099135414A TW99135414A TWI504713B TW I504713 B TWI504713 B TW I504713B TW 099135414 A TW099135414 A TW 099135414A TW 99135414 A TW99135414 A TW 99135414A TW I504713 B TWI504713 B TW I504713B
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- Prior art keywords
- photosensitive adhesive
- adhesive composition
- compound
- residue
- soluble
- Prior art date
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- 150000004060 quinone imines Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 150000003304 ruthenium compounds Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 229950000244 sulfanilic acid Drugs 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical group 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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Description
本發明係關於感光性接著劑組成物、感光性接著劑片及使用該等之半導體裝置。
近年來,隨著電子構件的高性能化要求,半導體裝置的小型化、動作速度的高速化及佈線的高密度化演進的同時,有對應此等之各式各樣的組件形態被提案。例如,有在半導體晶片上設置貫通電極、在半導體晶片的正反兩面上設置與該貫通電極電連接的襯墊或凸塊等之電極結構、積層此般的半導體晶片而確保晶片間的導通的3次元結構之半導體組件被提案。在此般的結構的組件中,在很多情況下,於積層晶片時會使用接著劑。對於此處所使用的接著劑,追求低應力性、接著性、絕緣可靠度及耐焊料再熔流性。而且除此之外,在半導體晶片上形成接著劑塗膜的步驟中,為了確保僅有覆蓋電極的接著劑部分除去,使電極露出而導通,可進行光造成之圖案化,即接著劑具有感光性乃為有效。
又,除了上述之外,已知為了形成如影像感測器或MEMS般的中空狀組件,而以具有接著性的樹脂間隔物包圍元件周圍,在上方的面貼著玻璃等的基板而形成中空結構的方法(參照專利文獻1)。即使在如此的用途中,仍追求兼具各種裝配可靠度與感光性的接著劑。
就具有感光性的機能的接著劑而言,有提案以聚醯亞胺樹脂前驅物為基底的材料(參照專利文獻2)。但是這些材料因係醯亞胺閉環反應,需要在300℃以上的高溫進行熱硬化,而有冷卻時的熱應力變大或對周邊構件的嚴重損害的問題。對於此等課題,有提案以可溶性聚醯亞胺為基底樹脂,而降低硬化溫度的材料(參照專利文獻3~5)。
[專利文獻1]特開2008-286877號公報
[專利文獻2]特開平04-337380號公報
[專利文獻3]特開2008-281597號公報
[專利文獻4]特開2008-88403號公報
[專利文獻5]特開2009-221453號公報
但是如專利文獻3所記載之樹脂設計中,可溶性聚醯亞胺的熱應力大,有對於矽晶圓或玻璃基板等的基板的熱壓接性不充分的情形。又,如專利文獻4及5所記載之導入如脂肪族醚二胺之高柔軟性的骨架的情形下,有聚醯亞胺對鹼顯影液的溶解性變低,顯影時的解析度變差的問題以及因交聯密度變低而使接著強度變低的問題。又在含有羧酸基的聚醯亞胺方面,雖提升對鹼顯影液的溶解性,但有因樹脂的極性變高而使親水性變高、絕緣可靠度變差的問題。
本發明目的為提供一種曝光後可藉由鹼顯影液顯影、在基板上熱壓接時的接著強度高、而且絕緣可靠度優良的感光性接著劑組成物。
本發明係含有(A)環氧化合物、(B)可溶性聚醯亞胺、(C)光聚合性化合物及(D)光聚合起始劑的感光性接著劑組成物,其中(A)環氧化合物含有以通式(1)表示之環氧化合物,而且(B)可溶性聚醯亞胺含有以通式(2)表示之二胺的殘基。
上述通式(1)中,m及n係滿足1≦m+n≦10之0以上的整數。
上述通式(2)中,R1
~R6
可各自相同或不同,係選自由氫原子、碳數1~30的烷基、碳數1~30的烷氧基、鹵素、磺酸基、硝基及氰基所構成的群組。
又,本發明包含上述之感光性接著劑組成物的塗膜在支撐體上所形成之感光性接著劑片。
又,本發明包含透過上述之感光性接著劑組成物的硬化物,接著多個基板或基板與其他構件的半導體裝置。
藉由本發明,可獲得曝光後可藉由鹼顯影液進行顯影、在基板上熱壓接時的接著強度高、而且絕緣可靠度優良的感光性接著劑組成物。
本發明之中的感光性接著劑組成物係意指可藉由微影法而形成圖案,而且可藉由進行熱壓接而與其他構件接著的組成物。硬化前的感光性接著劑組成物的形狀並無限定,例如可列舉液狀或薄膜狀、塗布在支撐體上的片狀等。
本發明的感光性接著劑組成物係包含(A)環氧化合物、(B)可溶性聚醯亞胺、(C)光聚合性化合物及(D)光聚合起始劑。
(A)環氧化合物包含以通式(1)表示之環氧化合物。
上述通式(1)中,m及n係滿足1≦m+n≦10之0以上的整數。
以通式(1)表示之環氧化合物係分子內具有2個環氧基和1個以上的環氧丙烷基(-C3
H6
O-)單元的化合物。就如此的環氧化合物而言,可列舉“ADEKA RESIN(註冊商標)”EP-4000S、EP-4003S(ADEKA股份有限公司製)等。
以通式(1)表示之環氧化合物,藉由具有環氧基而可提升感光性接著劑組成物之硬化後的交聯密度、而且可提升接著強度。又,該環氧化合物因含有之環氧丙烷基單元具有適度的親水性,可升高感光性接著劑組成物之對鹼水溶液的溶解速度,此外還具有提升顯影時的解析度之效果。此外,藉由使環氧丙烷基單元的重複數目m+n為1以上且更佳為3以上,環氧化合物的親水性變大,感光性接著劑組成物之對於鹼水溶液的顯影性變為良好。相對於此,使用不具環氧丙烷基單元的環氧化合物(通式(1)中,m=n=0的化合物)時,因為感光性接著劑組成物的顯影性變低、需要非常多的時間來進行顯影、解析度變差所以不佳。又,環氧丙烷基單元的重複數目若過長,因與交聯密度的降低造成之接著強度的降低有牽連,故使m+n為10以下較佳,使其為7以下更佳。如以上所述,為了兼具顯影性與接著強度,使環氧丙烷基單元的重複數目m+n為1以上10以下、更佳為3以上7以下較理想。
相對於(A)~(C)成分的總量而言,(A)環氧化合物的含量以15重量%以上且50重量%以下較理想。藉由使環氧化合物的含量為15重量%以上且更佳為20重量%以上,在將顯影後的感光性接著劑組成物塗膜與基板熱壓接時,組成物的黏度降低、熱流量變多,即使是對於有高低差的基板,密著性亦提升。於此,熱流量係加熱加壓感光性接著劑組成物時,表示感光性接著劑組成物以怎樣的程度流動的參數。其測定方法於之後敘述。又從耐熱性及顯影性的觀點來看,相對於(A)~(C)成分的總量而言,(A)環氧化合物的含量以50重量%以下、更佳以40重量%以下較佳。
另外,本發明的感光性接著劑組成物中,可含有1種以上的上述通式(1)以外的環氧化合物。此時,(A)環氧化合物的含量,係以通式(1)表示之環氧化合物及通式(1)以外的環氧化合物的合計之含量當作(A)成分的含量來計算,該含量以在上述之範圍內為較佳。另外,含有通式(1)以外的環氧化合物時,以通式(1)表示之環氧化合物的含量,以全部環氧化合物中之30~99重量%為較佳、更佳為50~99重量%。
就通式(1)以外的環氧化合物而言,並無特別限制,例如可列舉商品名EPIKOTE 828、834、1001、1002、1003、1004、1005、1007、1010、1100L(油化Shell股份有限公司)等的雙酚A型環氧化合物;商品名EPIKOTE ESCN-220L、220F、220H、220HH、180H65(油化Shell股份有限公司)等的鄰甲酚酚醛清漆型環氧化合物;商品名EPIKOTE 1032H60(油化Shell股份有限公司)或EPPN-502H(日本化藥股份有限公司)等的酚醛清漆型環氧化合物;商品名ESN-375、ESN-185(新日鐵化學股份有限公司)等的萘芳烷基酚醛清漆型環氧化合物;商品名YX4000H(油化Shell股份有限公司)等的聯苯酚型環氧化合物。又,除上述之外,還可列舉雙酚A縮水甘油醚型環氧化合物、雙酚F縮水甘油醚型環氧化合物、酚醛清漆縮水甘油醚型環氧化合物、縮水甘油酯型環氧化合物、縮水甘油基胺型環氧化合物、環狀脂肪族環氧化合物、及芳香族型環氧化合物。
本發明之中的(B)可溶性聚醯亞胺係意指對於N-甲基-2-吡咯啶酮、N,N-二甲基乙醯胺、N,N-二甲基甲醯胺、N-乙烯基吡咯啶酮、N,N-二乙基甲醯胺等的醯胺系溶劑;γ-丁內酯;甲基單甘二甲醚、甲基二甘二甲醚、甲基三甘二甲醚、乙基單甘二甲醚、乙基二甘二甲醚、乙二醇單甲醚、乙二醇單***、丙二醇單甲醚、丙二醇單***、乙二醇二甲醚、乙二醇二***等的醚系溶劑的任一有機溶劑100g,在25℃下溶解1g以上者。
又,(B)可溶性聚醯亞胺以可溶於鹼為較佳。可溶於鹼係意指對於氫氧化四甲銨的2.38%水溶液100g,在25℃下溶解0.1g以上者。
(B)可溶性聚醯亞胺係藉由四甲酸二酐與二胺的反應而製得,其具有四甲酸二酐的殘基與二胺的殘基。本發明之中,四甲酸二酐的殘基與二胺的殘基係以1)苯環少、2)分子量大且體積大、而且3)醚鍵結等的彎曲部位多的結構為較佳。藉由具有如此的結構,分子鏈間的相互作用變弱、提升可溶性聚醯亞胺在有機溶劑之中的溶解性。又,(B)可溶性聚醯亞胺為了在鹼水溶液中顯影,以具有鹼可溶性的官能基較為理想。鹼可溶性的官能基係具有酸性的官能基,具體而言,可列舉酚性羥基、羧基等。從硬化後可獲得高絕緣可靠度的觀點來看,以含有低極性的羥基為更佳。
由以上所述,本發明中的(B)可溶性聚醯亞胺含有以通式(2)表示之二胺殘基。
上述通式(2)中,R1
~R8
可各自相同或不同,係選自由氫原子、碳數1~30的烷基、碳數1~30的烷氧基、鹵素、磺酸基、硝基及氰基所構成的群組。從聚醯亞胺的有機溶劑可溶性、及鹼可溶性的觀點來看,R1
~R8
以選自氫原子及磺酸基為較佳。
因為六氟亞異丙基的分子量大且體積大,又因為聚醯亞胺的凝聚能變小,感光性接著劑組成物的表面張力變小。藉此將塗布在支撐體上之感光性接著劑組成物在矽晶圓上積層而貼著後,支撐體變為容易剝下,而提升對矽晶圓的貼著性。從提升對矽晶圓的貼著性的觀點來看,在全部二胺殘基中,以含有20mol%以上以前述通式(2)表示之二胺的殘基為較佳。又,從柔軟性或密著性的觀點來看,含量以95mol%以下為較佳。
(B)可溶性聚醯亞胺可含有以下列通式(5)表示之二胺的殘基。
上述通式(5)中,Y係表示-CO-、-SO2
-、-O-、-S-、-CH2
-、-NHCO-、-C(CH3
)2
-、-COO-或單鍵,P及Q係各自表示羥基或羧基。
就以通式(5)表示之二胺化合物而言,可列舉3,3’-二胺基-4,4’-二羥基聯苯、4,4’-二胺基-3,3’-二羥基聯苯、4,4’-二胺基-2,2’-二羥基聯苯等之羥基聯苯化合物;3,3’-二胺基-4,4’-二羥基二苯基甲烷、4,4’-二胺基-3,3’-二羥基二苯基甲烷、4,4’-二胺基-2,2’-二羥基二苯基甲烷、2,2-雙[3-胺基-4-羥基苯基]丙烷、2,2-雙[4-胺基-3-羥基苯基]丙烷、2,2-雙[3-胺基-4-羥基苯基]六氟丙烷等之羥基二苯基烷化合物;3,3’-二胺基-4,4’-二羥基二苯基醚、4,4’-二胺基-3,3’-二羥基二苯基醚、4,4’-二胺基-2,2’-二羥基二苯基醚等之羥基二苯基醚化合物;3,3’-二胺基-4,4’-二羥基二苯基碸、4,4’-二胺基-3,3’-二羥基二苯基碸、4,4’-二胺基-2,2’-二羥基二苯基碸等之羥基二苯基碸化合物;等之在分子中具有酚性羥基的二胺化合物;或3,3’-二羧基-4,4’-二胺基-二苯基甲烷等之在分子中含有羧基的二胺化合物。
又,含有以通式(5)表示之二胺的殘基時,從使硬化後的耐藥品性變高的觀點或防止吸水導致之可靠度降低的觀點來看,全部二胺殘基中,以通式(2)表示之二胺的殘基和以通式(5)表示之二胺的殘基的含量的合計以95mol%以下為較佳。
(B)可溶性聚醯亞胺,從降低玻璃轉移溫度而使熱壓接性提升的觀點來看,就二胺殘基而言,以進一步含有以通式(4)表示之二胺的殘基為較佳。
通式(4)之中的a係在2~10的範圍內。a若為2以上,可提升醚鍵結造成之柔軟化效果、降低玻璃轉移溫度,熱壓接性提升。另一方面,a若為10以下,不會對顯影有不佳的影響,解析度提升。又,a若在此範圍內,因亞胺基間的分子鏈長成為適當的範圍,而分子鏈的規則性可提升、提高硬化後的耐藥品性或耐熱性。從得到高解析度的觀點來看,更佳係a為4以下。又,從樹脂的配向性不會顯著降低、防止以鹼水溶液顯影時的曝光部分的剝離、不使接著強度降低的觀點來看,全部二胺殘基中,以通式(4)表示之二胺的殘基的含量以50mol%以下、更佳為40mol%以下為較佳。
(B)可溶性聚醯亞胺,除了上述二胺殘基以外,在不損及本發明的效果的程度下,可含有其他二胺殘基。例如可列舉1,4-二胺基苯、1,3-二胺基苯、2,4-二胺基甲苯、1,4-二胺基-2,5-二鹵苯等的含有1個苯環的二胺;雙(4-胺基苯基)醚、雙(3-胺基苯基)醚、雙(4-胺基苯基)碸、雙(3-胺基苯基)碸、雙(4-胺基苯基)甲烷、雙(3-胺基苯基)甲烷、雙(4-胺基苯基)硫醚、雙(3-胺基苯基)硫醚、2,2-雙(4-胺基苯基)丙烷、2,2-雙(3-胺基苯基)丙烷、2,2-雙(4-胺基苯基)六氟丙烷、鄰大茴香胺、鄰聯甲苯胺、聯甲苯胺磺酸等的含有2個苯環的二胺;1,4-雙(4-胺基苯氧基)苯、1,4-雙(3-胺基苯氧基)苯、1,4-雙(4-胺基苯基)苯、1,4-雙(3-胺基苯基)苯、α,α’-雙(4-胺基苯基)-1,4-二異丙苯、α,α’-雙(4-胺基苯基)-1,3-二異丙苯等的含有3個苯環的二胺;2,2-雙[4-(4-胺基苯氧基)苯基]丙烷、2,2-雙[4-(4-胺基苯氧基)苯基]六氟丙烷、2,2-雙[4-(4-胺基苯氧基)苯基]碸、4,4’-(4-胺基苯氧基)聯苯、9,9-雙(4-胺基苯基)茀、5,10-雙(4-胺基苯基)蒽等的含有4個以上苯環的二胺;等之二胺化合物的殘基。
(B)可溶性聚醯亞胺係較佳為具有以通式(3)表示之酸酐的殘基。
因為六氟亞異丙基的分子量大且體積大,又因為可溶性聚醯亞胺的凝聚能變小,感光性接著劑組成物的表面張力變小。藉此將塗布在支撐體上之感光性接著劑組成物在矽晶圓上積層而貼著後,支撐體變為容易剝下,而提升對矽晶圓的貼著性。從使對矽晶圓的貼著性良好的觀點來看,在全部二胺殘基中,含有20mol%以上以前述通式(3)表示之酸酐的殘基為較佳。又,從柔軟性或密著性的觀點來看,含量以95mol%以下為較佳。
(B)可溶性聚醯亞胺,除了上述酸二酐殘基以外,在不損及本發明的效果的程度下,可含有其他酸二酐殘基。就其他酸二酐而言,例如可列舉焦蜜石酸酐(PMDA)、氧二酞酸二酐(ODPA)、3,3’,4,4’-二苯基酮四甲酸二酐(BTDA)、3,3’,4,4’-聯苯四甲酸二酐(BPDA)、3,3’,4,4’-二苯基碸四甲酸二酐(DSDA)、2,2’-雙[(二羧基苯氧基)苯基]丙烷二酐(BSAA)等。
又,(B)可溶性聚醯亞胺的末端的至少一部分係以苯胺衍生物或二羧酸酐所封止為較佳。藉此可溶性聚醯亞胺的重量平均分子量可容易地調整到適當的範圍內。又,可期待藉由末端官能基的交聯而抑制黏度的上昇。就苯胺衍生物而言,以2-胺基-苯甲酸、3-胺基-苯甲酸、4-胺基-苯甲酸、4-胺基-柳酸、5-胺基-柳酸、6-胺基-柳酸、2-胺基-苯磺酸、3-胺基-苯磺酸、4-胺基-苯磺酸、2-胺基-酚、3-胺基-酚、4-胺基-酚、2-胺基-硫酚、3-胺基-硫酚、4-胺基-硫酚等為較佳。就二羧酸酐而言,可較佳地使用順丁烯二酸酐、酞酸酐、納狄克酸(nadic acid)酐、環己烷二羧酸酐、5-降莰烯-2,3-二羧酸酐、1,2-二羧基萘酐、3-羥基酞酸酐等。
(B)可溶性聚醯亞胺的重量平均分子量以10,000以上且100,000以下為較佳。當含有2種以上可溶性聚醯亞胺時,只要其中的至少1種的重量平均分子量在上述範圍內即可。若重量平均分子量未達10,000時,有時候機械強度會降低而接著強度變低。重量平均分子量較佳為12,000以上。另一方面,重量平均分子量若超過100,000,有時候鹼水溶液中的顯影性會降低而發生顯影殘渣。重量平均分子量較佳為50,000以下。另外,本發明之中的重量平均分子量係藉由凝膠滲透層析法(GPC法)測定,以聚苯乙烯換算算出。
另外,本發明的感光性接著劑組成物中,可含有不含通式(2)的二胺的可溶性聚醯亞胺。此時,以全部的可溶性聚醯亞胺的合計的含量當作(B)成分的含量來計算。另外,當含有其他可溶性聚醯亞胺時,全部可溶性聚醯亞胺中,含有通式(2)的二胺的可溶性聚醯亞胺的含量以30~99重量%為較佳、更佳為50~99重量%。
(B)可溶性聚醯亞胺的合成方法並無特別限定,可使用二胺和四甲酸二酐,以周知的方法來合成。利用例如在低溫中,使四甲酸二酐和二胺化合物(一部分可以被苯胺衍生物取代)反應的方法、藉由四甲酸二酐和醇的反應製得二酯,之後與二胺(一部分可以被苯胺衍生物取代)在縮合劑的存在下反應的方法、藉由四甲酸二酐和醇的反應製得二酯,之後將殘餘的2個羧基氧氯化、與二胺(一部分可以被苯胺衍生物取代)反應的方法等的方法,製得聚醯亞胺前驅物,其可利用周知的醯亞胺化方法來合成。
本發明的感光性接著劑組成物係含有(C)光聚合性化合物及(D)光聚合起始劑。(C)光聚合性化合物以分子內至少有1個不飽和雙鍵的化合物為較佳。例如可列舉具有選自乙烯基、丙烯醯基及甲基丙烯醯基的基的化合物。
就(C)光聚合性化合物而言,例如可列舉二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、四乙二醇二丙烯酸酯、二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、四乙二醇二甲基丙烯酸酯、三羥甲基丙烷二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、三羥甲基丙烷二甲基丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、苯乙烯、α-甲基苯乙烯、1,2-二氫萘、1,3-二異丙烯基苯、3-甲基苯乙烯、4-甲基苯乙烯、2-乙烯基萘、丙烯酸丁酯、甲基丙烯酸丁酯、丙烯酸異丁酯、丙烯酸己酯、丙烯酸異辛酯、丙烯酸異茨酯、甲基丙烯酸異茨酯、甲基丙烯酸環己酯、1,3-丁二醇二丙烯酸酯、1,3-丁二醇二甲基丙烯酸酯、新戊二醇二丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,4-丁二醇二甲基丙烯酸酯、1,6-己二醇二丙烯酸酯、1,6-己二醇二甲基丙烯酸酯、1,9-壬二醇二甲基丙烯酸酯、1,10-癸二醇二甲基丙烯酸酯、二羥甲基-三環癸烷二丙烯酸酯、新戊四醇三丙烯酸酯、新戊四醇四丙烯酸酯、新戊四醇三甲基丙烯酸酯、新戊四醇四甲基丙烯酸酯、二新戊四醇六丙烯酸酯、二新戊四醇六甲基丙烯酸酯、2-羥基乙基丙烯酸酯、2-羥基乙基甲基丙烯酸酯、1,3-二丙烯醯氧基-2-羥基丙烷、1,3-二甲基丙烯醯氧基-2-羥基丙烷、亞甲雙丙烯醯胺、N,N-二甲基丙烯醯胺、N-羥甲基丙烯醯胺、2,2,6,6-四甲基哌啶基甲基丙烯酸酯、2,2,6,6-四甲基哌啶基丙烯酸酯、N-甲基-2,2,6,6-四甲基哌啶基甲基丙烯酸酯、N-甲基-2,2,6,6-四甲基哌啶基丙烯酸酯、環氧乙烷改質雙酚A二丙烯酸酯、環氧乙烷改質雙酚A二甲基丙烯酸酯、環氧丙烷改質雙酚A二丙烯酸酯、環氧丙烷改質雙酚A甲基丙烯酸酯、丙氧基化乙氧基化雙酚A二丙烯酸酯、丙氧基化乙氧基化雙酚A二甲基丙烯酸酯、N-乙烯基吡咯啶酮、N-乙烯基己內醯胺等。此等可單獨或組合2種以上使用。
此等之中,就特佳者而言,可列舉1,9-壬二醇二甲基丙烯酸酯、1,10-癸二醇二甲基丙烯酸酯、二羥甲基-三環癸烷二丙烯酸酯、丙烯酸異茨酯、甲基丙烯酸異茨酯、新戊四醇三丙烯酸酯、新戊四醇四丙烯酸酯、新戊四醇三甲基丙烯酸酯、新戊四醇四甲基丙烯酸酯、二新戊四醇六丙烯酸酯、二新戊四醇六甲基丙烯酸酯、亞甲雙丙烯醯胺、N,N-二甲基丙烯醯胺、N-羥甲基丙烯醯胺、2,2,6,6-四甲基哌啶基甲基丙烯酸酯、2,2,6,6-四甲基哌啶基丙烯酸酯、N-甲基-2,2,6,6-四甲基哌啶基甲基丙烯酸酯、N-甲基-2,2,6,6-四甲基哌啶基丙烯酸酯、環氧乙烷改質雙酚A二丙烯酸酯、環氧乙烷改質雙酚A二甲基丙烯酸酯、環氧丙烷改質雙酚A二丙烯酸酯、環氧丙烷改質雙酚A甲基丙烯酸酯、丙氧基化乙氧基化雙酚A二丙烯酸酯、丙氧基化乙氧基化雙酚A二甲基丙烯酸酯、N-乙烯基吡咯啶酮、N-乙烯基己內醯胺等。
從顯影後可獲得充分的殘膜的點來看,相對於(B)的可溶性聚醯亞胺100重量份而言,感光性接著劑組成物之中的(C)光聚合性化合物的含量以20重量份以上為較佳、進一步較佳為40重量份以上。另一方面,從硬化膜的耐熱性提升的點來看,(C)光聚合性化合物的含量以150重量份以下為較佳、進一步較佳為100重量份以下。
就(D)光聚合起始劑而言,例如可列舉二苯基酮、米其勒酮4,4,-雙(二乙基胺基-)二苯基酮、3,3,4,4,-四(第三丁基過氧羰基)二苯基酮等的二苯基酮化合物;3,5-雙(二乙基胺基-亞苄基)-N-甲基-4-哌啶酮、3,5-雙(二乙基胺基-亞苄基)-N-乙基-4-哌啶酮等的亞苄基化合物;7-二乙基胺基-3-壬基香豆素、4,6-二甲基-3-乙基胺基-香豆素、3,3-羰基雙(7-二乙基胺基-香豆素)、7-二乙基胺基-3-(1-甲基甲基苯并咪唑基)香豆素、3-(2-苯并噻唑基)-7-二乙基胺基-香豆素等的香豆素化合物;2-第三丁基蒽醌、2-乙基蒽醌、1,2-苯并蒽醌等的蒽醌化合物;安息香甲醚、安息香***、安息香異丙醚等的安息香化合物;2,4-二甲基噻噸酮、2,4-二乙基噻噸酮、2,4-二異丙基噻噸酮、2-異丙基噻噸酮等的噻噸酮化合物;乙二醇二(3-丙酸巰酯)、2-巰基苯并噻唑、2-巰基苯并唑、2-巰基苯并咪唑等的巰基化合物;N-苯基甘胺酸、N-甲基-N-苯基甘胺酸、N-乙基-N-(對氯苯基)甘胺酸、N-(4-氰基苯基)甘胺酸等的甘胺酸化合物;1-苯基-1,2-丁二酮-2-(鄰甲氧基羰基)肟、1-苯基-1,2-丙二酮-2-(鄰甲氧基羰基)肟、1-苯基-1,2-丙二酮-2-(鄰乙氧基羰基)肟、1-苯基-1,2-丙二酮-2-(鄰苯甲醯基)肟、雙(α-異亞硝基丙醯苯肟)異酞酸酯、1,2-辛二酮-1-[4-(苯硫基)苯基]-2-(鄰苯甲醯基肟)等的肟化合物;2-苄基-2-二甲基胺基-1-(4-啉苯基)-丁-1-酮、2-甲基-1[4-(甲硫基)苯基]-2-啉丙烷-1-酮等的α-胺基-烷基苯酮化合物;2,2’-雙(鄰氯苯基)-4,4’,5,5’-四苯基聯咪唑等。此等之中,選自上述之二苯基酮化合物、甘胺酸化合物、巰基化合物、肟化合物、α-胺基-烷基苯酮化合物及2,2’-雙(鄰氯苯基)-4,4’,5,5’-四苯基聯咪唑的化合物從光反應方面看來為合適。此等的光聚合起始劑可單獨或組合二種以上使用。就光聚合起始劑而言,肟化合物為更佳、特佳為選自1-苯基-1,2-丙二酮-2-(鄰乙氧基羰基)肟、1-苯基-1,2-丙二酮-2-(鄰苯甲醯基)肟、雙(α-異亞硝基丙醯苯肟)異酞酸酯、OXE01、OXE02(商品名,Ciba Specialty Chemicals公司製)及NCI-831(商品名,ADEKA公司製)的化合物。
相對於(B)可溶性聚醯亞胺100重量份而言,(D)光聚合起始劑的較佳含量係0.1~40重量份。當組合二種以上光聚合起始劑使用時,其總量在此範圍內為較佳。若(D)光聚合起始劑的含量為0.1重量份以上,曝光時的聚合性化合物的聚合反應可充分進行。又,若為40重量份以下,即使是厚膜仍可保持充分的光線穿透率,圖案形成係為可能。又,(D)光聚合起始劑的含量係在上述之範圍內,根據選擇的光聚合起始劑的種類而適當選擇。
此外,以使感光性接著劑組成物與基板的密著性提升的目的,感光性接著劑組成物可視需求而含有界面活性劑。又,感光性接著劑組成物中亦可含有二氧化矽、二氧化鈦等的無機粒子、或聚醯亞胺的粉末等。又,為了提高與矽晶圓等的基板的接著性,感光性接著劑組成物可含有矽烷偶合劑、鈦螯合劑等。
此外,感光性樹脂組成物可視需求而含有交聯劑、交聯促進劑、增感劑、溶解調整劑、安定劑、消泡劑等的添加劑。
本發明的感光性接著劑片係感光性接著劑組成物的塗膜於支撐體上所形成之物。支撐體並無特別限制,可使用聚對苯二甲酸乙二酯(PET)薄膜、聚苯硫薄膜、聚醯亞胺薄膜等、市售之各種的薄膜。為了於支撐體和感光性接著劑組成物塗膜的接合面,使密著性和剝離性提升,可以聚矽氧、矽烷偶合劑、鋁螯合劑、聚脲等施予表面處理。又,支撐體的厚度並無特別限制,但從作業性的觀點來看,在10~100μm的範圍內為較佳。
又,感光性接著劑片為了保護表面,於感光性接著劑組成物塗膜上可具有保護薄膜。藉此,可保護感光性接著劑片表面隔絕大氣中的廢物或灰塵等的汚染物質。
就保護薄膜而言,可列舉聚乙烯薄膜、聚丙烯(PP)薄膜、聚酯薄膜等。保護薄膜係以與感光性接著劑組成物塗膜的接著力為小者較佳。
接下來,說明關於製作本發明的感光性接著劑片的方法。本發明的感光性接著劑片係藉由將感光性接著劑組成物清漆塗布於支撐體上,接著視需要乾燥而製得。感光性樹脂組成物清漆係將有機溶劑添加於感光性樹脂組成物而製得。又,製造步驟中所使用之含有有機溶劑的感光性樹脂組成物,可直接當作感光性樹脂組成物清漆來使用。就有機溶劑而言,只要是能溶解感光性樹脂組成物者即可。
就有機溶劑而言,具體而言,可列舉乙二醇單甲醚、乙二醇單***、丙二醇單甲醚、丙二醇單***、乙二醇二甲醚、乙二醇二***、乙二醇二丁醚等的醚;乙二醇單***乙酸酯、丙二醇單甲醚乙酸酯、乙酸丙酯、乙酸丁酯、乙酸異丁酯、3-甲氧基丁基乙酸酯、3-甲基-3-甲氧基丁基乙酸酯、乳酸甲酯、乳酸乙酯、乳酸丁酯等的乙酸酯;丙酮、甲基乙基酮、乙醯基丙酮、甲基丙基酮、甲基丁基酮、甲基異丁基酮、環戊酮、2-庚酮等的酮;丁醇、異丁醇、戊醇、4-甲基-2-戊醇、3-甲基-2-丁醇、3-甲基-3-甲氧基丁醇、二丙酮醇等的醇;甲苯、二甲苯等的芳香族烴;其他,N-甲基-2-吡咯啶酮、N-環己基-2-吡咯啶酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、二甲基亞碸、γ-丁內酯等。
又,可使用濾紙或過濾器來過濾感光性接著劑組成物清漆。過濾方法並無特別限制,但以使用保留粒徑0.4μm~10μm的過濾器來加壓過濾為較佳。
就將感光性接著劑組成物清漆塗布於支撐體的方法而言,可列舉使用旋轉器的旋轉塗布、噴灑塗布、輥塗、網版印刷、或使用刮刀塗布機、壓鑄模塗布機(die coater)、壓延塗布機、彎月形塗布機(meniscus coater)、棒塗布機、輥塗布機、間歇輥塗布機(comma roll coater)、凹版塗布機(gravure coater)、網版塗布機、狹縫壓鑄模塗布機等的塗布方法。又,塗布膜厚雖因塗布手法、清漆的固體成分濃度、黏度等而不同,但以使乾燥後的膜厚成為0.5μm以上且100μm以下為較佳。
可使用烘箱、加熱板、紅外線加熱器等來進行乾燥。乾燥溫度及乾燥時間,只要是在可使有機溶劑揮發的範圍內即可,以適當設定在使感光性樹脂組成物塗膜成為未硬化或半硬化狀態的範圍內為較佳。具體而言,在40℃至120℃的溫度範圍下,乾燥1分鐘至數十分鐘為較佳。又,可組合此等的溫度而階段性地昇溫,例如可在70℃、80℃、90℃下各進行1分鐘的熱處理。
接下來,說明關於本發明的感光性接著劑組成物及感光性接著劑片的用途之半導體裝置。本發明的半導體裝置係各個基板、或基板與其他構件材料透過感光性接著劑組成物的硬化物所接著者。
就基板而言,雖可列舉半導體基板、有機系基板、無機系基板、及在此等的基板上配置電路的半導體元件或電路基板,但不限定於此等。就半導體基板的例子而言,可列舉矽或砷化鎵等的半導體晶圓或該等經切斷者。就有機系基板的例子而言,可列舉玻璃布‧環氧敷銅層板等的玻璃基材敷銅層板;玻璃不織布‧環氧敷銅層板等的合成敷銅層板;聚醚醯亞胺樹脂基板、聚醚酮樹脂基板、聚碸系樹脂基板等的耐熱‧熱塑性基板;聚酯敷銅薄膜基板、聚醯亞胺敷銅薄膜基板等的撓性基板。又,就無機系基板的例子而言,可列舉氧化鋁基板、氮化鋁基板、碳化矽基板等的陶瓷基板;鋁基底基板、鐵基底基板等的金屬系基板;玻璃基板。電路的構成材料的例子可列舉含有銀、金、銅等的金屬的導體、含有無機系氧化物等的電阻、含有玻璃系材料及/或樹脂等的弱介電質、含有樹脂或高介電常數無機粒子等的強介電質、含有玻璃系材料等的絕緣體等。
以下,說明關於本發明的半導體裝置之具體的例子。另外,近年來有各式各樣的結構的半導體裝置被提案,本發明的感光性接著劑組成物的用途並非為以下的例子所限定者。
在形成電路及凸塊之矽晶圓上貼著感光性接著劑片、或塗布感光性接著劑組成物的清漆,而形成感光性接著劑組成物塗膜。之後,為了在覆蓋凸塊部分的感光性接著劑組成物塗膜上設置開口部,將感光性接著劑組成物塗膜曝光及顯影而進行圖案化。將如此所製得之具備感光性接著劑組成物塗膜的矽晶圓和別的矽晶圓,透過凸塊以可電連接的方式積層並熱壓接。將此加熱而使感光性接著劑組成物塗膜硬化。藉由如此地重複透過感光性接著劑組成物塗膜的硬化物來接著矽晶圓,可製得3度空間多層結構的半導體組件。
又,說明關於半導體裝置的另一個例子。在形成影像感測器元件之半導體晶圓上貼著感光性接著劑片、或塗布感光性接著劑組成物的清漆、而形成感光性接著劑組成物塗膜。將感光性接著劑組成物塗膜曝光及顯影、除去感測器部分的上方的塗膜,留下周圍的塗膜。在殘留的感光性接著劑組成物塗膜之上積層玻璃基板並熱壓接。將此加熱而使感光性接著劑組成物塗膜硬化。如此一來,可將被圖案化的感光性接著劑組成物塗膜的硬化物當作隔壁,透過該隔壁來接著半導體晶圓與玻璃基板,而製得中空結構的影像感測器晶圓。
接下來,舉例說明關於圖案加工感光性接著劑組成物、及感光性接著劑片的方法、及將該等在其他構件上熱壓接的方法。
首先,說明關於使用感光性接著劑組成物清漆,在基板上形成感光性接著劑組成物塗膜的方法。將感光性接著劑組成物清漆塗布基板上。就塗布方法而言,可列舉使用旋轉器的旋轉塗布、噴灑塗布、輥塗、網版印刷等的方法。又,塗布膜厚雖因塗布手法、清漆的固體成分濃度及黏度等而不同,但以使乾燥後的膜厚成為0.5μm以上且100μm以下而進行塗布為較佳。接下來,將經塗布感光性接著劑組成物清漆的基板乾燥,而製得感光性接著劑組成物塗膜。可使用烘箱、加熱板、紅外線加熱器等來進行乾燥。乾燥溫度及乾燥時間,只要是在可使有機溶劑揮發的範圍內即可,以適當設定在使感光性樹脂組成物塗膜成為未硬化或半硬化狀態的範圍內為較佳。具體而言,在50~150℃的溫度範圍下進行1分鐘至數小時為較佳。
另一方面,使用感光性接著劑片時,在具有保護薄膜情形下將此剝離,以感光性接著劑片與基板以對向的方式,藉由熱壓接而貼合。熱壓接可藉由熱壓處理、熱積層處理、熱真空積層處理等來進行。熱壓接溫度,從對基板的密著性及埋入性方面來看,以40℃以上為較佳。又,為了防止熱壓接時感光性接著劑片硬化,而曝光‧顯影步驟之中的圖案形成的解析度變差,熱壓接溫度以150℃以下為較佳。熱壓接後若剝除支撐體薄膜,則感光性接著劑塗膜殘留在基板上。
接下來,在藉由上述方法所形成之感光性接著劑組成物塗膜上,通過具有所希望的圖案的光罩來照射光化射線而曝光。就曝光所使用的光化射線而言,有紫外線、可見光線、電子束、X射線等。在本發明則以使用水銀燈的i線(365nm)、h線(405nm)或g線(436nm)為較佳。感光性接著劑片之中,當支撐體對於此等的光線而言為透明的材質時,亦可不從感光性接著劑片將支撐體剝離而進行曝光。
在形成圖案方面,曝光後,使用顯影液將未曝光部分除去。就顯影液而言,以四甲基銨、二乙醇胺、二乙基胺基乙醇、氫氧化鈉、氫氧化鉀、碳酸鈉、碳酸鉀、三乙胺、二乙胺、甲胺、二甲胺、乙酸二甲基胺基乙酯、二甲基胺基乙醇、二甲基胺基乙基甲基丙烯酸酯、環己胺、乙二胺、己二胺等的顯示鹼性的化合物的水溶液為較佳。又,視情況不同,此等的鹼水溶液中亦可含有選自N-甲基-2-吡咯啶酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、二甲基亞碸、γ-丁內酯、二甲基丙烯醯胺等的極性溶劑;甲醇、乙醇、異丙醇等的醇;乳酸乙酯、丙二醇單甲醚乙酸酯等的酯;環戊酮、環己酮、異丁基酮、甲基異丁基酮等的酮等之一個或數種。
顯影可藉由將上述之顯影液噴灑於基板的塗膜面、將塗膜連同基板一起浸漬在顯影液中等的方法來進行。亦可一面將基板浸漬於顯影液中,一面施加超音波。又,亦可一面使基板旋轉,一面將顯影液噴灑於塗膜面。顯影時間、顯影步驟、顯影液的溫度之顯影時條件,只要是能將未曝光部分除去的條件即可。為了加工細微的圖案、除去圖案間的殘渣,以在除去未曝光部分後進一步進行顯影為較佳。
顯影後亦可以水進行潤洗處理。亦可將乙醇、異丙基醇等的醇;乳酸乙酯、丙二醇單甲醚乙酸酯等的酯等加入水中而進行潤洗處理。
當顯影時的圖案的解析度提升、顯影條件的容許寬度增大時,即使在顯影前導入烘烤處理的步驟也不會有妨礙。就烘烤處理的溫度而言,以在50~180℃的範圍內為較佳、60~120℃的範圍內為更佳。烘烤處理的時間以5秒鐘~數小時為較佳。
從圖案形成後,減少感光性接著劑組成物塗膜中所殘存的溶劑、揮發成分、水等的觀點來看,以在60~200℃的範圍下加熱乾燥為較佳。加熱乾燥時間以1分鐘~數小時為較佳。
將如此所製得之經圖案化加工的感光性接著劑組成物塗膜所形成之基板,熱壓接在其他基板或其他構件上。熱壓接溫度,只要是在形成塗膜的樹脂的玻璃轉移溫度以上即可,以在100~400℃的溫度範圍內為較佳。又,壓接時的壓力以在0.01~10MPa的範圍內為較佳。時間以1秒鐘~數分鐘為較佳。
熱壓接後,加以120℃至400℃的溫度,使感光性接著劑組成物塗膜成為硬化膜。加熱溫度以150℃以上且300℃以下的溫度為較佳,180℃以上且250℃以下則為進一步更佳。加熱處理在指定的溫度範圍內,可階段性昇溫、亦可連續性昇溫。加熱處理時間以5分鐘至5小時為較佳。就一個例子而言,可列舉在130℃、200℃各進行熱處理30分鐘、或從室溫至250℃,花費2小時進行直線性昇溫等的條件。
如此地熱壓接而製得的接著體,其接著強度,從接著可靠度的觀點來看,以40MPa以上為理想。更理想為50MPa以上。
雖可任意地設定硬化膜的膜厚,但以0.5μm以上且100μm以下為較佳。
以下基於實施例具體地說明本發明,但本發明並非以此限定者。另外,在以下表示各實施例之中以省略代號所表示之原料的詳細內容。
ODPA:4,4’一氧雙酞酸二酐(MANAC股份有限公司製)
6FDA:4,4’一(六氟亞異丙基)二酞酸二酐(DAIKIN工業股份有限公司製)
BAHF:2,2-雙(3-胺基-4-羥基苯基)六氟丙烷(AZ ELECTRONIC MATERIALS股份有限公司製)
MBAA:[雙(4-胺基-3-羧基)苯基]甲烷(和歌山精化工業股份有限公司製)
SiDA:雙(3-胺基-丙基)四甲基二矽氧烷(信越化學股份有限公司製)
MAP:3-胺基-酚(東京化成股份有限公司製)
D-230:聚丙烯醚二胺(MITSUI FINE CHEMICAL股份有限公司製,商品名“JEFFAMINE”D-230通式(4)的a=2~3)
D-400:聚丙烯醚二胺(MITSUI FINE CHEMICAL股份有限公司製,商品名“JEFFAMINE”D-400通式(4)的a=5~7)。
BP-6EM:環氧乙烷改質雙酚A二甲基丙烯酸酯(共榮社化學股份有限公司製,商品名“BP-6EM”)
DCP-A:三環癸烷二甲醇二丙烯酸酯(共榮社化學股份有限公司製,商品名“DCP-A”)
MOI-BP:2-異氰酸酯甲基丙烯酸乙酯嵌段體(昭和電工股份有限公司製“Karenz(註冊商標)”MOI-BP)
DPE-6A:二新戊四醇六丙烯酸酯(共榮社化學股份有限公司製,商品名“DPE-6A”)
EP4003S:環氧丙烷基改質BisA型環氧樹脂(股份有限公司ADEKA製,商品名“ADEKA RESIN(註冊商標)”EP-4003S、通式(1)之中的m+n=5~6
EP4000S:環氧丙烷基改質BisA型環氧樹脂(股份有限公司ADEKA製,商品名“ADEKA RESIN(註冊商標)”EP-4000S,通式(1)之中的m+n=1~2
EP4010S:環氧丙烷基改質BisA型環氧樹脂(股份有限公司ADEKA製,商品名“ADEKA RESIN(註冊商標)”EP-4010S,通式(1)之中的m+n=1~2者之二聚物(亦即,以下列式(6)表示之化合物)
850S:BisA型環氧樹脂(DIC股份有限公司製,商品名“EPICLON(註冊商標)”850S,通式(1)之中的m+n=0)。
NCI831:光自由基聚合起始劑(ADEKA股份有限公司製,商品名“NCI-831”)
L1980:“DISPARLON(註冊商標)”L1980(楠本化成股份有限公司製)
γBL:γ丁內酯。
以下表示各實施例及比較例之中的評價方法。
使用將聚醯亞胺溶解於NMP(N-甲基吡咯啶酮)的固體成分濃度0.1重量%的溶液,藉由以下表示的構成之GPC裝置Waters2690(Waters股份有限公司製)測定,算出聚苯乙烯換算的重量平均分子量。GPC測定條件係將移動相設定為LiCl和磷酸各自以濃度0.05mol/L溶解之NMP溶液,展開速度設定為0.4ml/分鐘。
檢測器:Waters996
系統控制器:Waters2690
管柱烘箱:Waters HTR-B
熱控制器:Waters TCM
管柱:TOSOH grard comn
管柱:TOSOH TSK-GEL α-4000
管柱:TOSOH TSK-GEL α-2500。
首先,測定聚合物的紅外線吸收光譜,確認來自於聚醯亞胺的醯亞胺結構的吸收波峰(1780cm-1
附近、1377cm-1
附近)的存在。接下來,對於該聚合物,在350℃下熱處理1小時後,再度測定紅外線吸收光譜,比較熱處理前和熱處理後的1377cm-1
附近的波峰強度。將熱處理後的聚合物的醯亞胺化率當作100%,從波峰強度比,求得熱處理前的聚合物的醯亞胺化率。
使用間歇輥塗布機(comma roll coater),將各實施例及比較例中製作的感光性接著劑組成物清漆塗布於厚度38μm的PET薄膜上,在100℃下進行15分鐘乾燥後,積層作為保護薄膜的厚度10μm的PP薄膜,而製得感光性接著劑片。以感光性接著劑組成物塗膜的膜厚成為25μm的方式進行塗布作業。之後剝離保護薄膜,在矽晶圓上,使用積層裝置(Takatori股份有限公司製,VTM-200M),以載台溫度80℃、輥溫度80℃、壓力150Pa、黏貼速度5mm/秒、黏貼壓力0.2MPa的條件積層該剝離面。然後,剝下支撐體薄膜時,將感光性接著劑組成物塗膜未殘留於支撐體薄膜、貼著於矽晶圓者當作A,一部分貼著者當作B、無法貼著而殘留於支撐體薄膜上者當作C。
將以上述同樣的方法所製得之感光性接著劑片的保護薄膜剝離,在矽晶圓上,使用積層裝置(Takatori股份有限公司製,VTM-200M),以載台溫度80℃、輥溫度80℃、壓力150Pa、黏貼速度5mm/秒、黏貼壓力0.2MPa的條件積層該剝離面。然後,剝下支撐體薄膜後,在以超高壓水銀燈為光源之曝光裝置中設置具有L/S(LINE‧AND‧SPACE)=75/75、50/50、40/40、30/30、25/25μm的圖案的光罩,以曝光量400mJ/cm2
(h線換算)進行曝光。曝光後,以浸漬(dip)顯影使用氫氧化四甲銨的2.38%水溶液除去未曝光部分,以水中進行潤洗處理。將顯影時間設定為未曝光部分完全地溶解的時間的2倍時間。以光學顯微鏡觀察如此所製得之圖案,以圖案的線上沒有阻塞等的異常之最小的圖案的尺寸作為解析度的評價。
將以上述同樣的方法所製得之感光性接著劑片的保護薄膜剝離,在矽晶圓上,使用積層裝置(Takatori股份有限公司製,VTM-200M),以載台溫度80℃、輥溫度80℃、壓力150Pa、黏貼速度5mm/秒、黏貼壓力0.2MPa的條件積層該剝離面。然後,剝下支撐體薄膜後,使用以超高壓水銀燈為光源之曝光裝置以曝光量400mJ/cm2
(h線換算)進行曝光。將在上述中製得之具備曝光後的感光性接著劑組成物塗膜的矽晶圓切斷成50×50mm,將感光性接著劑組成物塗膜朝上放置在加熱板上保持1分鐘。1分鐘後,將2×2mm的矽晶圓置於其上,從100℃開始每次各上升10℃的溫度進行試驗。將感光性接著劑組成物塗膜上產生黏著性、與矽晶圓接著的最低的溫度當作熱壓接溫度。在更低溫下產生黏著性者為優良。
將以上述同樣的方法所製得之感光性接著劑片的保護薄膜剝離,使用以超高壓水銀燈為光源之曝光裝置,以曝光量400mJ/cm2
(h線換算)進行曝光。將曝光後的感光性接著劑片切斷成5×5mm。將切斷的試樣在以150℃的加熱板上加熱的玻璃板上,以玻璃板和感光性接著劑組成物塗膜連接的方式貼合,從支撐體薄膜的上方放置500g份量的銅並加壓。30秒後,以光學顯微鏡觀察接著於玻璃板上的感光性接著劑片,計算測量超出支撐體薄膜的感光性接著劑組成物的最長的部分的長度。將(超出支撐體薄膜的長度)/(壓接前的長度(5mm))當作熱流量而算出。
將以上述同樣的方法所製得之感光性接著劑片的保護薄膜剝離,在矽晶圓上,使用積層裝置(Takatori股份有限公司製,VTM-200M),以載台溫度80℃、輥溫度80℃、壓力150Pa、黏貼速度5mm/秒、黏貼壓力0.2MPa的條件積層該剝離面。然後,剝下支撐體薄膜後,使用以超高壓水銀燈為光源之曝光裝置以曝光量400mJ/cm2
(h線換算)進行曝光。將曝光後的具備感光性接著劑組成物塗膜的矽晶圓切斷成50×50mm,將感光性接著劑組成物塗膜朝上放置在150℃的加熱板上保持1分鐘。1分後,將2×2mm的矽晶圓置於其上,以壓力0.2MPa、時間30秒進行熱壓接。之後,在250℃的惰性烘箱氮氣氣體環境下加熱60分鐘使其硬化,製得矽晶圓彼此間接著之試樣。之後,使用晶片抗剪測試機(Die Shear Tester)(Dage series4000),在溫度30℃下評價接著力。
試樣尺寸 2mm×2mm
測試速度 200μm/s
測試高度 300μm
在L/S=10μm/10μm的銅梳齒電極上,使用鑷子的前端部分,塗布各實施例及比較例中所製作之感光性樹脂組成物,在大氣中100℃下使其乾燥15分鐘。接下來,使用超高壓水銀燈,以曝光量400mJ/cm2
(h線換算)進行曝光處理後,使用惰性烘箱,於N2
氣體環境下,在200℃下熱處理60分鐘,製作評價用試樣。在製得之評價用試樣的電極間,於溫度85℃、相對濕度85%的氣體環境下,持續施加20V電壓1000小時,進行絕緣可靠度試驗。將1000小時後線間絕緣抵抗值為1×104
Ω以上的情況當作絕緣可靠度為1000小時。試驗途中線間絕緣抵抗值未達1×104
Ω的情況,將此時的試驗時間當作絕緣可靠度之值。銅梳齒電極係使用經圖案加工的在矽基板上以厚度0.4μm的熱氧化膜、厚度0.8μm的氮化矽膜、厚度0.08μm的鉻基底電極及厚度10μm的銅電極的順序所積層者。
於300ml的4口燒瓶設置攪拌機、溫度計、氮氣導入管及滴下漏斗,在氮氣氣體環境下置入γBL 92.60g及ODPA 31.02g,在60℃下攪拌使其溶解。之後,在60℃下一面攪拌、一面添加MAP 2.18g、SiDA 1.24g、D-230 7.14g及BAHF 20.14g,攪拌1小時。之後昇溫至180℃,攪拌2小時後,冷卻至室溫製得可溶性聚醯亞胺溶液A(固體成分濃度40.0重量%)。製得之可溶性聚醯亞胺的重量平均分子量為20,050、醯亞胺化率為95%。又,可溶性聚醯亞胺係於氫氧化四甲銨的2.38%水溶液100g中,在25℃下溶解0.1g以上,為可溶於鹼。
在藉由上述記載的方法而製得之可溶性聚醯亞胺溶液A 8.8g中,添加1.8g BP-6EM、0.2g DPE-6A、0.2g NCI831、2.5g EP4003S、及0.02g L1980而混合攪拌,得到係黏性液體之感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價。
在300ml的4口燒瓶上設置攪拌機、溫度計、氮氣導入管及滴下漏斗,在氮氣氣體環境下,置入γBL 98.37g及ODPA 31.02g,在60℃下攪拌使其溶解。之後,在60℃下一面攪拌、一面添加MAP 2.18g、SiDA 1.24g及BAHF 31.13g,攪拌1小時。之後昇溫至180℃,攪拌2小時後,冷卻至室溫製得可溶性聚醯亞胺溶液B(固體成分濃度40.0重量%)。製得之可溶性聚醯亞胺的重量平均分子量為28,500、醯亞胺化率為99%。又,可溶性聚醯亞胺係於氫氧化四甲銨的2.38%水溶液100g中,在25℃下溶解0.1g以上,可溶於鹼。對於如此所製得之可溶性聚醯亞胺溶液B,與實施例1同樣地和各成分混合,得到感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性及接著強度的評價。
在實施例1製得之可溶性聚醯亞胺溶液A 8.8g中,添加1.8g BP-6EM、0.2g DPE-6A、0.2g NCI831、1.5g EP4003S及0.02g L1980而混合攪拌,得到係黏性液體之感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價。
在實施例1製得之可溶性聚醯亞胺溶液A 8.8g中,添加1.8g BP-6EM、0.2g DPE-6A、0.2g NCI831、1.0g EP4003S及0.02g L1980而混合攪拌,得到係黏性液體之感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價。
在實施例1製得之可溶性聚醯亞胺溶液A 8.8g中,添加1.8g BP-6EM、0.2g DPE-6A、0.2g NCI831、1.0g EP4000S及0.02g L1980而混合攪拌,得到係黏性液體之感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價。
在實施例1製得之可溶性聚醯亞胺溶液A 8.8g中,添加1.8g BP-6EM、0.2g DPE-6A、0.2g NCI831、0.8g EP4003S及0.02g L1980而混合攪拌,得到係黏性液體之感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價。
於300ml的4口燒瓶設置攪拌機、溫度計、氮氣導入管及滴下漏斗,在氮氣氣體環境下,置入γBL 88.75g及ODPA 31.02g,在60℃下攪拌使其溶解。之後,在60℃下一面攪拌、一面添加MAP 2.18g、SiDA 1.24g、D-230 11.9g及BAHF 12.82g,攪拌1小時。之後,昇溫至180℃,攪拌2小時後,冷卻至室溫製得可溶性聚醯亞胺溶液C(固體成分濃度40.0重量%)。製得之可溶性聚醯亞胺係於氫氧化四甲銨的2.38%水溶液100g中,在25℃下溶解0.1g以上,可溶於鹼。製得之可溶性聚醯亞胺的重量平均分子量為19,000、醯亞胺化率為98%。對於如此所製得之可溶性聚醯亞胺溶液C,與實施例6同樣地和各成分混合,得到感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價。
在300ml的4口燒瓶上設置攪拌機、溫度計、氮氣導入管及滴下漏斗,在氮氣氣體環境下,置入γBL 101.46g及ODPA 31.02g,在60℃下攪拌使其溶解。之後,在60℃下一面攪拌、一面添加MAP 2.18g、SiDA 1.24g、D-40013.05g及BAHF 20.14g,攪拌1小時。之後,昇溫至180℃,攪拌2小時後,冷卻至室溫製得可溶性聚醯亞胺溶液D(固體成分濃度40.0重量%)。製得之可溶性聚醯亞胺的重量平均分子量為19,950、醯亞胺化率為99%。又,可溶性聚醯亞胺係在氫氧化四甲銨的2.38%水溶液100g中,在25℃下溶解0.1g以上,可溶於鹼。對於如此所製得之可溶性聚醯亞胺溶液D,與實施例6同樣地和各成分混合,得到感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價。進行解析度評價的結果,75μm間距以下的細微的圖案中,有一部分剝離。
在300ml的4口燒瓶上設置攪拌機、溫度計、氮氣導入管及滴下漏斗,在氮氣氣體環境下,置入γBL 96.06g、ODPA 15.51g及6FDA 22.21g,在60℃下攪拌使其溶解。之後,在60℃下一面攪拌、一面添加MAP 2.18g、SiDA 1.24g、D-230 7.14g及BAHF 20.14g,攪拌1小時。之後,昇溫至180℃,攪拌2小時後,冷卻至室溫製得可溶性聚醯亞胺溶液E(固體成分濃度40.0重量%)。製得之可溶性聚醯亞胺的重量平均分子量為22,100、醯亞胺化率為96%。又,可溶性聚醯亞胺係在氫氧化四甲銨的2.38%水溶液100g中,在25℃下溶解0.1g以上,可溶於鹼。對於如此所製得之可溶性聚醯亞胺溶液E,與實施例4同樣地和各成分混合,得到感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價。
在實施例1中製得之可溶性聚醯亞胺溶液A 8.8g中,添加1.8g BP-6EM、0.2g DPE-6A、0.2g NCI831及0.02g L1980而混合攪拌,得到係黏性液體之感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價。
於300ml的4口燒瓶設置攪拌機、溫度計、氮氣導入管及滴下漏斗,在氮氣氣體環境下,置入γBL 86.89g及ODPA 31.02g,在60℃下攪拌使其溶解。之後,在60℃下一面攪拌、一面添加MAP 2.18g、SiDA 17.40g及BAHF 7.33g,攪拌1小時。之後,昇溫至180℃,攪拌2小時後,冷卻至室溫製得可溶性聚醯亞胺溶液F(固體成分濃度40.0重量%)。製得之溶性聚醯亞胺的重量平均分子量為17,200、醯亞胺化率為96%。又,可溶性聚醯亞胺係在氫氧化四甲銨的2.38%水溶液100g中,在25℃下未溶解0.1g以上,非可溶於鹼性。對於可溶性聚醯亞胺溶液F,與比較例1同樣地和各成分混合,得到感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價。因為聚醯亞胺F非為鹼可溶性,無法形成圖案。
於300ml的4口燒瓶設置攪拌機、溫度計、氮氣導入管及滴下漏斗,在氮氣氣體環境下,置入γBL 99.04g及ODPA 31.02g,在60℃下攪拌使其溶解。之後,在60℃下一面攪拌、一面添加MAP 2.18g、SiDA 2.49g、MBAA 8.59g及D-400 21.75g,攪拌1小時。之後,昇溫至180℃,攪拌2小時後,冷卻至室溫製得可溶性聚醯亞胺溶液G(固體成分濃度40.0重量%)。製得之可溶性聚醯亞胺的重量平均分子量為16,800、醯亞胺化率為99%。又,可溶性聚醯亞胺係在氫氧化四甲銨的2.38%水溶液100g中,在25℃下溶解0.1g以上,可溶於鹼。對於如此所製得之可溶性聚醯亞胺溶液G,與比較例1同樣地和各成分混合,得到感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,雖欲以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價,但是無法對矽晶圓貼著。
因此,將得到的感光性接著劑組成物清漆於矽晶圓上直接進行旋轉塗布,再於加熱板上在100℃下乾燥5分鐘。以乾燥後的厚度成為25μm的方式塗布。用以上述為標準的方法,對此進行解析度、熱壓接性、熱流量、接著強度及絕緣可靠度的評價。
在實施例2中製得之可溶性聚醯亞胺溶液B 8.8g中,添加1.8g BP-6EM、0.2g DPE-6A、0.2g NCI831、0.8g EP4010S及0.02g L1980而混合攪拌,得到係黏性液體之感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性及接著強度的評價。因為EP4010S係環氧化合物的二聚物,其重複長度長,故顯影性降低,而無法形成圖案。
在實施例2中製得之可溶性聚醯亞胺溶液B 8.8g中,添加1.8g BP-6EM、0.2g DPE-6A、0.2g NCI831、0.8g 850S及0.02g L1980而混合攪拌,得到係黏性液體之感光性接著劑組成物清漆。對於製得之感光性接著劑組成物,以上述之方法,進行對矽晶圓的貼著性、解析度、熱壓接性及接著強度的評價。因為850S的環氧化合物的親水性低,顯影性降低而無法形成圖案。
於表1~2表示各實施例及比較例中製得之感光性接著劑組成物的組成、於表3~4表示評價結果。
實施例6~8僅為參考例。
藉由本發明,可製得曝光後可藉由鹼顯影液進行顯影、於基板上熱壓接時接著強度高、而且絕緣可靠性優良的感光性接著劑組成物。
本發明的感光性接著劑組成物,及使用其之感光性接著片,可較佳地使用於製造3度空間結構的半導體組件或如影像感測器般的中空狀組件。
Claims (6)
- 一種感光性接著劑組成物,其係含有(A)環氧化合物、(B)可溶性聚醯亞胺、(C)光聚合性化合物及(D)光聚合起始劑,其中(A)環氧化合物係含有以通式(1)表示之環氧化合物,而且(B)可溶性聚醯亞胺係含有以通式(2)所表示之二胺的殘基,且其中相對於(A)~(C)成分的總量,該(A)環氧化合物的含量係15重量%以上且50重量%以下;
- 如申請專利範圍第1項之感光性接著劑組成物,其中該(B)可溶性聚醯亞胺係含有以通式(3)表示之酸酐的殘基
- 如申請專利範圍第1或2項之感光性接著劑組成物,其中該(B)可溶性聚醯亞胺係進一步含有以通式(4)表示之二胺的殘基;
- 如申請專利範圍第3項之感光性接著劑組成物,其中以通式(4)所表示之二胺的殘基,在全部二胺殘基中所佔的量係50mol%以下。
- 一種感光性接著劑片,其係如申請專利範圍第1至4項中任一項之感光性接著劑組成物的被覆膜於支撐體上所形成者。
- 一種半導體裝置,其係透過如申請專利範圍第1至4項中任一項之感光性接著劑組成物的硬化物,接著多個基板或基板與其他的構件。
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KR101640143B1 (ko) * | 2007-04-02 | 2016-07-18 | 닛산 가가쿠 고교 가부시키 가이샤 | 포지티브형 감광성 수지 조성물, 이의 경화막 및 표시소자 |
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2010
- 2010-10-15 KR KR1020127012839A patent/KR101791710B1/ko active IP Right Grant
- 2010-10-15 JP JP2010544914A patent/JP5887693B2/ja active Active
- 2010-10-15 CN CN201080046229.9A patent/CN102575139B/zh active Active
- 2010-10-15 US US13/499,187 patent/US20120181709A1/en not_active Abandoned
- 2010-10-15 WO PCT/JP2010/068133 patent/WO2011049011A1/ja active Application Filing
- 2010-10-15 EP EP10824860.0A patent/EP2492331B1/en not_active Not-in-force
- 2010-10-15 MY MYPI2012001709A patent/MY178933A/en unknown
- 2010-10-18 TW TW099135414A patent/TWI504713B/zh active
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TW200704737A (en) * | 2005-06-06 | 2007-02-01 | Toray Industries | Adhesive composition for semiconductor, semiconductor device using it, and process for semiconductor device |
TW200916959A (en) * | 2007-06-06 | 2009-04-16 | Hitachi Chemical Co Ltd | Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
MY178933A (en) | 2020-10-23 |
EP2492331A1 (en) | 2012-08-29 |
KR20130026524A (ko) | 2013-03-13 |
EP2492331A4 (en) | 2016-09-07 |
JPWO2011049011A1 (ja) | 2013-03-14 |
US20120181709A1 (en) | 2012-07-19 |
WO2011049011A1 (ja) | 2011-04-28 |
CN102575139B (zh) | 2014-02-19 |
KR101791710B1 (ko) | 2017-10-30 |
EP2492331B1 (en) | 2017-07-12 |
CN102575139A (zh) | 2012-07-11 |
JP5887693B2 (ja) | 2016-03-16 |
TW201122074A (en) | 2011-07-01 |
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