TWI501708B

TWI501708B - Shielded printed circuit boards

Info

Publication number: TWI501708B
Application number: TW100113141A
Authority: TW
Inventors: Syohei Morimoto; Hiroshi Tajima; Kenji Kamino
Original assignee: Tatsuta Densen Kk
Priority date: 2011-01-28
Filing date: 2011-04-15
Publication date: 2015-09-21
Also published as: TW201233262A; JP2012156457A; KR101776711B1; CN202085399U; JP5308465B2; CN102625564A; CN102625564B; KR20120087753A

Description

屏蔽印刷電路板Shielded printed circuit board

本發明有關於用於攜帶型電話、電腦等的屏蔽印刷電路板。The present invention relates to a shielded printed circuit board for a portable telephone, a computer, or the like.

以往，攜帶型電話、電腦等電子設備由於小型化和高速處理化等原因，容易受到來自主板或者外部的電磁波等的雜訊影響。因此，對具有屏蔽電磁波等雜訊的屏蔽膜的印刷電路板的需求在增加。另外，這種印刷電路板與攜帶型電話、電腦等中使用的電子部件連接在一起進行使用，由於使用時的彎曲等，有時安裝電子部件的安裝部位會發生扭曲變形。因此，通過在與安裝電子部件的安裝部位相對的位置處設置加強部件來解決上述問題。In the past, electronic devices such as mobile phones and computers have been affected by noise such as electromagnetic waves from the main board or the outside due to miniaturization and high-speed processing. Therefore, there is an increasing demand for a printed circuit board having a shielding film that shields noise such as electromagnetic waves. Further, such a printed circuit board is connected to an electronic component used in a portable telephone, a computer, or the like, and may be twisted and deformed at a mounting portion where an electronic component is mounted due to bending during use or the like. Therefore, the above problem is solved by providing the reinforcing member at a position opposite to the mounting portion where the electronic component is mounted.

例如，圖5是現有的屏蔽印刷電路板100的示意圖。如圖5所示，屏蔽印刷電路板100包括印刷電路板110，印刷電路板110包括：基底部件112，形成有接地用電路圖案114、115；絕緣膜111，通過接合劑層113設置在基底部件112上並覆蓋接地用電路圖案114、115。另外，在屏蔽印刷電路板100的絕緣膜111上設置有依次包括導電材料123、導電層122及絕緣層121而成的屏蔽膜120。在此，印刷電路板110的絕緣膜111及接合劑層113中形成有供接地用電路圖案114露出的孔部140。由於屏蔽膜120的導電材料123填充于該孔部140中，因而導電層122和接地用電路圖案114導通，使雙方保持等電位。由此，可以通過屏蔽膜120屏蔽對印刷電路板110輻射的電磁波90a。並且，電子部件150與設置於印刷電路板110的下表面的安裝部位連接。而且，在印刷電路板110上與電子部件150的安裝部位相對的位置處設置有加強部件135。For example, FIG. 5 is a schematic diagram of a conventional shielded printed circuit board 100. As shown in FIG. 5, the shield printed circuit board 100 includes a printed circuit board 110 including: a base member 112 formed with grounding circuit patterns 114, 115; and an insulating film 111 disposed on the base member through the bonding layer 113 The grounding circuit patterns 114, 115 are covered on 112. Further, a shielding film 120 including a conductive material 123, a conductive layer 122, and an insulating layer 121 in this order is provided on the insulating film 111 of the shield printed circuit board 100. Here, the hole portion 140 through which the ground circuit pattern 114 is exposed is formed in the insulating film 111 and the bonding layer 113 of the printed circuit board 110. Since the conductive material 123 of the shielding film 120 is filled in the hole portion 140, the conductive layer 122 and the grounding circuit pattern 114 are turned on to maintain both potentials. Thereby, the electromagnetic wave 90a radiated to the printed circuit board 110 can be shielded by the shielding film 120. Further, the electronic component 150 is connected to a mounting portion provided on the lower surface of the printed circuit board 110. Further, a reinforcing member 135 is provided at a position on the printed circuit board 110 opposite to the mounting portion of the electronic component 150.

在此，印刷電路板110和與其連接的電子部件150可能會受到來自外部的電磁波90b等的雜訊影響，因此，安裝該電子部件150的部位也需要具有屏蔽效果。因此，在加強部件135中使用具有導電性的材料以使得加強部件135具有屏蔽效果，從而使加強部件135實現加強效果和屏蔽效果這兩種功能。Here, the printed circuit board 110 and the electronic component 150 connected thereto may be affected by noise from the external electromagnetic wave 90b or the like, and therefore, the portion where the electronic component 150 is mounted also needs to have a shielding effect. Therefore, a material having conductivity is used in the reinforcing member 135 so that the reinforcing member 135 has a shielding effect, so that the reinforcing member 135 achieves both the reinforcing effect and the shielding effect.

在此，為了使加強部件135具有充分的屏蔽效果，需要使加強部件135與接地用電路圖案114、115保持等電位。為此，現有技術中，在屏蔽印刷電路板100的外部另外設置了未圖示的接地用部件，通過該接地用部件使加強部件135與接地用電路圖案114、115保持等電位。然而，在屏蔽印刷電路板100的外部設置接地用部件時，例如，將產生如下的問題，即，由於需要設置用於連接加強部件135和接地用部件的佈線等，屏蔽印刷電路板的面積就會相應地增加，從而導致設計自由度受限。Here, in order to provide the reinforcing member 135 with a sufficient shielding effect, it is necessary to maintain the reinforcing member 135 and the grounding circuit patterns 114 and 115 at the same potential. For this reason, in the prior art, a grounding member (not shown) is separately provided outside the shield printed circuit board 100, and the reinforcing member 135 and the grounding circuit patterns 114 and 115 are held at the same potential by the grounding member. However, when the grounding member is provided outside the shield printed circuit board 100, for example, there is a problem in that the area for shielding the printed circuit board is required because wiring or the like for connecting the reinforcing member 135 and the grounding member needs to be provided. It will increase accordingly, resulting in limited design freedom.

因此，在現有的屏蔽印刷電路板100中，通過在加強部件135的正下方配置接地用電路圖案115，在絕緣膜111及接合劑層113形成孔部160以暴露該接地用電路圖案115，並在該孔部160中填充樹枝形狀的導電性接合劑130，從而使加強部件135和接地用電路圖案115保持等電位。Therefore, in the conventional shield printed circuit board 100, the grounding circuit pattern 115 is disposed directly under the reinforcing member 135, and the hole portion 160 is formed in the insulating film 111 and the bonding layer 113 to expose the grounding circuit pattern 115, and The hole portion 160 is filled with a branch-shaped conductive bonding agent 130 to maintain the reinforcing member 135 and the grounding circuit pattern 115 at the same potential.

例如，專利文獻1中公開了一種通過上述方法使加強部件和接地用電路圖案保持等電位的柔性印刷電路板。在該柔性印刷電路板中，通過在用於暴露接地電路的開口中填充導電性接合劑，使金屬加強板和接地電路保持等電位，從而使金屬加強板具有屏蔽效果。For example, Patent Document 1 discloses a flexible printed circuit board in which a reinforcing member and a grounding circuit pattern are maintained at the same potential by the above method. In the flexible printed circuit board, the metal reinforcing plate and the grounding circuit are kept at the same potential by filling the opening for exposing the grounding circuit with the conductive bonding agent, thereby providing the metal reinforcing plate with a shielding effect.

專利文獻1：日本國專利申請公開公報“特開2009-218443號”Patent Document 1: Japanese Patent Application Publication No. 2009-218443

然而，如上所述，如果將導電性接合劑130填充于孔部160，有時在導電性接合劑130和接地用電路圖案115的連接部會產生空隙160a、160b。出現這種情況的原因在於，導電性接合劑130與接地用電路圖案115的連接部由諸如加強部件135和基底部件112等的硬質材料上下夾住，在貼裝加強部件135時導電性接合劑130未充分迎合孔部160的臺階。在這種情況下，在攜帶型電話、電腦等的主板上安裝屏蔽印刷電路板100的回流步驟中，空隙160a、空隙160b受熱而發生膨脹，從而導致導電性接合劑130和接地用電路圖案115之間不能實現充分的電連接。其結果產生如下的問題，例如，導致不良外觀，不能將加強部件135保持為接地電位，難以確保充分的屏蔽效果等。However, as described above, when the conductive bonding agent 130 is filled in the hole portion 160, voids 160a and 160b may be formed in the connection portion between the conductive bonding agent 130 and the grounding circuit pattern 115. The reason for this is that the connection portion of the conductive bonding agent 130 and the grounding circuit pattern 115 is sandwiched by a hard material such as the reinforcing member 135 and the base member 112, and the conductive bonding agent is applied when the reinforcing member 135 is attached. 130 does not fully meet the steps of the hole portion 160. In this case, in the reflow step of mounting the shield printed circuit board 100 on the main board of the portable telephone, the computer or the like, the gap 160a and the gap 160b are heated and expanded, thereby causing the conductive bonding agent 130 and the grounding circuit pattern 115. A sufficient electrical connection cannot be achieved between. As a result, there arises a problem that, for example, a defective appearance is caused, the reinforcing member 135 cannot be maintained at the ground potential, and it is difficult to secure a sufficient shielding effect or the like.

另外，為了使導電性接合劑130和接地用電路圖案115之間的連接部不產生空隙160a、空隙160b，需要盡可能加厚導電性接合劑130的厚度，在這種情況下，為了保持導電性，需要提高導電性接合劑130中含有的導電性粒子的比例，這將導致成本相應上升，效率不佳。並且，如果採用上述方法，還需要在配置有加強部件135的正下方配置接地用電路圖案115，存在設計自由度受限的問題。Further, in order to prevent the gaps 160a and 160b from being formed in the connection portion between the conductive bonding agent 130 and the grounding circuit pattern 115, it is necessary to thicken the thickness of the conductive bonding agent 130 as much as possible. In this case, in order to maintain conductivity The ratio of the conductive particles contained in the conductive bonding agent 130 needs to be increased, which leads to a corresponding increase in cost and inefficiency. Further, according to the above method, it is necessary to arrange the grounding circuit pattern 115 directly under the reinforcing member 135, and there is a problem that the degree of freedom in design is limited.

本發明是鑒於上述問題而作出的，其目的在於提供一種即使在連接有電子部件的印刷電路板中在與電子部件相對的位置處設置有加強部件的情況下也能夠既確保設計自由度又可對電子部件的安裝部位保持屏蔽效果的屏蔽印刷電路板。The present invention has been made in view of the above problems, and an object thereof is to provide a design that can ensure design freedom even when a reinforcing member is provided at a position facing an electronic component in a printed circuit board to which an electronic component is connected. A shielded printed circuit board that maintains a shielding effect on the mounting portion of an electronic component.

本發明的屏蔽印刷電路板包括：印刷電路板、屏蔽膜以及加強部件，其中，上述印刷電路板包括：基底部件，形成有接地用電路圖案；以及絕緣膜，設置於該基底部件上並覆蓋上述接地用電路圖案，並且，在設置於基底部件的下表面的安裝部位連接有電子部件；上述屏蔽膜設置於上述印刷電路板上，並包括：導電層，與上述接地用電路圖案等電位，被配置於上述印刷電路板的上表面並且覆蓋與上述安裝部位相對的區域的一部分或全部；以及絕緣層，設置於上述導電層上；上述加強部件具有導電性，並且設置在上述屏蔽膜上與上述安裝部位相對的區域；本發明的屏蔽印刷電路板的特徵在於：上述加強部件通過包含球狀導電性粒子的導電性接合劑接合於上述絕緣層上；上述絕緣層的層厚小於上述導電性粒子在上述導電性接合劑與上述絕緣層接合的狀態下從上述導電性接合劑突出的突出長度，上述導電性粒子在上述導電性接合劑與上述絕緣層接合的狀態下與上述導電層接觸。The shielded printed circuit board of the present invention comprises: a printed circuit board, a shielding film, and a reinforcing member, wherein the printed circuit board includes: a base member formed with a grounding circuit pattern; and an insulating film disposed on the base member and covering the above a circuit pattern for grounding, wherein an electronic component is connected to a mounting portion provided on a lower surface of the base member; the shielding film is provided on the printed circuit board, and includes a conductive layer that is equipotential to the grounding circuit pattern a part or all of a region disposed on the upper surface of the printed circuit board and covering the mounting portion; and an insulating layer disposed on the conductive layer; the reinforcing member having electrical conductivity and disposed on the shielding film and The shield printed circuit board according to the present invention is characterized in that the reinforcing member is bonded to the insulating layer by a conductive bonding agent containing spherical conductive particles; the insulating layer has a layer thickness smaller than the conductive particles. a state in which the conductive bonding agent is bonded to the insulating layer The conductive adhesive from protruding length, the conductive particles are in contact with the conductive layer in a state where the conductive adhesive and bonded to the insulating layer.

根據如上的構成，在印刷電路板上配置與接地用電路圖案等電位的導電層並且該導電層覆蓋與電子部件的安裝部位相對的區域的一部分或全部。由此，可以通過具有導電層的屏蔽膜屏蔽由外部對電子部件的安裝部位輻射的電磁波。另外，通過設置於屏蔽膜上的加強部件來加固與電子部件的安裝部位相對的區域。由此，通過加強部件可以防止因彎曲等原因而在安裝部位產生變形等。另外，加強部件通過導電性接合劑接合於屏蔽膜的絕緣層上，且導電性接合劑包含的導電性粒子在導電性接合劑與絕緣層接合的狀態下與屏蔽膜的導電層接觸，因此可以將具有導電性的加強部件的電位和導電層的電位變成等電位，這樣還可以使加強部件具有屏蔽效果。由此，可以通過雙重效果更可靠地對電子部件的安裝部位提供屏蔽效果，上述雙重效果包括屏蔽膜的屏蔽效果和加強部件的屏蔽效果。因此，無需象現有技術那樣為使加強部件的電位等於接地電位而暴露接地用電路圖案並通過導電性接合劑將加強部件和接地用電路圖案連接在一起，所以，也就不需要根據加強部件的配置位置來形成接地用電路圖案，從而提高了設計自由度。另外，由於不需要通過導電性接合劑將加強部件和接地用電路圖案連接在一起，因此，也不會發生因在該連接部分中發生的空隙所引起的回流時的缺陷。如以上那樣，既可以確保設計自由度又可以保持屏蔽效果。另外，由於導電性粒子為球狀，因此，在導電性接合劑中，無論導電性粒子向哪個方向傾斜，從導電性接合劑突出的長度在層厚方向上大致一定。由此，例如，較之於薄片狀或者樹枝狀，球狀導電性粒子更易於突破絕緣層、容易與導電層接觸。其結果，可以更可靠地使加強部件和導電層保持等電位。According to the above configuration, the conductive layer having the same potential as the grounding circuit pattern is disposed on the printed circuit board, and the conductive layer covers a part or all of the region facing the mounting portion of the electronic component. Thereby, electromagnetic waves radiated from the external mounting portion of the electronic component can be shielded by the shielding film having the conductive layer. Further, a region opposed to the mounting portion of the electronic component is reinforced by the reinforcing member provided on the shielding film. Thereby, deformation or the like at the mounting portion due to bending or the like can be prevented by the reinforcing member. Further, the reinforcing member is bonded to the insulating layer of the shielding film by the conductive bonding agent, and the conductive particles included in the conductive bonding agent are in contact with the conductive layer of the shielding film in a state where the conductive bonding agent is bonded to the insulating layer, and thus The potential of the reinforcing member having conductivity and the potential of the conductive layer are brought to the same potential, so that the reinforcing member can also have a shielding effect. Thereby, it is possible to more reliably provide a shielding effect to the mounting portion of the electronic component by the double effect, which includes the shielding effect of the shielding film and the shielding effect of the reinforcing member. Therefore, it is not necessary to expose the grounding circuit pattern for the potential of the reinforcing member to be equal to the ground potential as in the prior art and to connect the reinforcing member and the grounding circuit pattern together by the conductive bonding agent, so that it is not necessary to The position is configured to form a circuit pattern for grounding, thereby increasing design freedom. Further, since it is not necessary to connect the reinforcing member and the grounding circuit pattern by the conductive bonding agent, defects at the time of reflow due to the voids occurring in the connecting portion do not occur. As described above, both the design freedom and the shielding effect can be ensured. In addition, since the conductive particles are spherical, the length of the conductive bonding agent protruding from the conductive bonding agent is substantially constant in the layer thickness direction regardless of the direction in which the conductive particles are inclined. Thus, for example, the spherical conductive particles are more likely to break through the insulating layer and are more likely to come into contact with the conductive layer than the flake or dendritic shape. As a result, the reinforcing member and the conductive layer can be more reliably maintained at the same potential.

另外，在本發明的屏蔽印刷電路板中，上述加強部件還可以與外部的接地用部件連接，其中，上述外部的接地用部件與上述接地用電路圖案保持等電位。Further, in the shield printed wiring board of the present invention, the reinforcing member may be connected to an external grounding member, wherein the external grounding member and the grounding circuit pattern are kept at the same potential.

根據上述的構成，加強部件通過導電性接合劑包含的導電性粒子在內部與接地用電路圖案保持等電位，並且，還通過外部的接地用部件與接地用電路圖案保持等電位，因此，可以進一步提高屏蔽效果。According to the configuration described above, the reinforcing member is held at the same potential as the grounding circuit pattern by the conductive particles contained in the conductive bonding agent, and the external grounding member and the grounding circuit pattern are kept at the same potential. Improve the shielding effect.

另外，本發明的屏蔽印刷電路板中，上述屏蔽膜的上述絕緣層塗布於上述導電層上。Further, in the shield printed wiring board of the present invention, the insulating layer of the shielding film is coated on the conductive layer.

根據上述的構成，由於屏蔽膜的絕緣層塗布於導電層上，因此，例如，較之於膜狀的絕緣層，上述屏蔽膜的絕緣層更薄，從而從導電性接合劑突出的導電性粒子容易突破絕緣層與導電層接觸。According to the above configuration, since the insulating layer of the shielding film is applied to the conductive layer, for example, the insulating layer of the shielding film is thinner than the film-shaped insulating layer, and the conductive particles protruding from the conductive bonding agent are formed. It is easy to break through the contact of the insulating layer with the conductive layer.

另外，本發明的屏蔽印刷電路板中，上述加強部件由不銹鋼材料形成。Further, in the shield printed wiring board of the present invention, the reinforcing member is formed of a stainless steel material.

根據上述的構成，由於不銹鋼材料具有適合加固的硬度且耐蝕性優秀，因此，可以更有效地既加固電子部件的安裝部位又對安裝部位提供屏蔽效果。According to the above configuration, since the stainless steel material has hardness suitable for reinforcement and excellent corrosion resistance, it is possible to more effectively reinforce the mounting portion of the electronic component and provide a shielding effect to the mounting portion.

根據本發明的屏蔽印刷電路板，可以通過具有導電性的屏蔽膜屏蔽由外部對電子部件的安裝部位輻射的電磁波。另外，可以通過加強部件防止由彎曲等原因而在安裝部位發生的變形等。另外，可以使具有導電性的加強部件的電位和導電層的電位處於等電位，可以使加強部件也具有屏蔽效果。由此，根據雙重效果可以更可靠地對電子部件的安裝部位提供屏蔽效果，上述雙重效果包括屏蔽膜的屏蔽效果和加強部件的屏蔽效果。所以，不需要象現有技術那樣為使加強部件處於接地電位而暴露接地用電路圖案並通過導電性接合劑將加強部件和接地用電路圖案連接在一起，因此，不需要根據加強部件的配置位置來形成接地用電路圖案，從而提高了設計自由度。另外，由於不需要通過導電性接合劑將加強部件和接地用電路圖案連接在一起，因此也不會發生因在該連接部分中發生的空隙所引起的回流時的缺陷。如以上那樣，既可以確保設計自由度又可以保持屏蔽效果。另外，例如，較之於薄片狀或者樹枝狀，球狀的導電性粒子將更易於突破絕緣層、容易與導電層22接觸。其結果，可以更可靠地使加強部件和導電層保持等電位。According to the shield printed circuit board of the present invention, electromagnetic waves radiated from the external mounting portion of the electronic component can be shielded by the conductive shielding film. Further, deformation or the like occurring at the mounting portion due to bending or the like can be prevented by the reinforcing member. Further, the potential of the conductive reinforcing member and the potential of the conductive layer can be at the same potential, and the reinforcing member can also have a shielding effect. Thereby, it is possible to more reliably provide a shielding effect to the mounting portion of the electronic component according to the double effect, which includes the shielding effect of the shielding film and the shielding effect of the reinforcing member. Therefore, it is not necessary to expose the grounding circuit pattern for the reinforcing member at the ground potential as in the prior art and to connect the reinforcing member and the grounding circuit pattern by the conductive bonding agent, and therefore, it is not necessary to follow the arrangement position of the reinforcing member. A circuit pattern for grounding is formed, thereby increasing design freedom. Further, since it is not necessary to connect the reinforcing member and the grounding circuit pattern by the conductive bonding agent, defects at the time of reflow due to the voids occurring in the connecting portion do not occur. As described above, both the design freedom and the shielding effect can be ensured. Further, for example, spherical conductive particles are more likely to break through the insulating layer and are more likely to come into contact with the conductive layer 22 than in the form of flakes or dendrites. As a result, the reinforcing member and the conductive layer can be more reliably maintained at the same potential.

下面，參考附圖說明本發明的優選實施例。Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

(屏蔽印刷電路板1的整體結構)(Shielding the overall structure of the printed circuit board 1)

首先，使用圖1說明本實施例的屏蔽印刷電路板1。如圖1所示，屏蔽印刷電路板1包括印刷電路板10、屏蔽膜20以及加強部件35。而且，設置於印刷電路板10的下表面的安裝部位連接有電子部件50。另外，屏蔽膜20設置在印刷電路板10上並且覆蓋與連接電子部件50的安裝部位相對的區域的一部分或全部。由此，利用屏蔽膜20屏蔽由外部對電子部件50的安裝部位輻射的電磁波90b等的雜訊。First, the shield printed circuit board 1 of the present embodiment will be described using FIG. As shown in FIG. 1, the shield printed circuit board 1 includes a printed circuit board 10, a shielding film 20, and a reinforcing member 35. Further, an electronic component 50 is connected to a mounting portion provided on the lower surface of the printed circuit board 10. In addition, the shielding film 20 is disposed on the printed circuit board 10 and covers a part or all of a region opposing the mounting portion where the electronic component 50 is attached. Thereby, noise of the electromagnetic wave 90b or the like radiated from the externally mounted portion of the electronic component 50 is shielded by the shielding film 20.

而且，加強部件35設置於屏蔽膜20上，且其設置位置與連接電子部件50的安裝部位相對。加強部件35以接觸狀態與導電性接合劑30接合，且通過該導電性接合劑30貼裝在屏蔽膜20的絕緣層21上。在此，圖1的放大部a是對導電性接合劑30與屏蔽膜20的絕緣層21之間的接合狀態進行放大表示的圖，其中，導電性接合劑30以接觸狀態與加強部件35接合。如放大部a所示，導電性接合劑30包含導電性粒子32和接合劑31，導電性粒子32從接合劑31中突出。而且，以接觸狀態與導電性接合劑30的上表面接合的加強部件35與導電性粒子32接觸。另一方面，從導電性接合劑30的下表面突出的導電性粒子32突破屏蔽膜20的絕緣層21，並與其下的導電層22接觸。由此，加強部件35與屏蔽膜20的導電層22通過導電性接合劑30的導電性粒子32而處於導通狀態，從而可以使具有導電性的加強部件35與導電層22處於等電位。因此，可以使具有導電性的加強部件35提供屏蔽效果。Further, the reinforcing member 35 is provided on the shielding film 20, and is disposed at a position opposite to the mounting portion where the electronic component 50 is attached. The reinforcing member 35 is bonded to the conductive bonding agent 30 in a contact state, and is attached to the insulating layer 21 of the shielding film 20 by the conductive bonding agent 30. Here, the enlarged portion a of FIG. 1 is an enlarged view showing a state of bonding between the conductive bonding agent 30 and the insulating layer 21 of the shielding film 20, wherein the conductive bonding agent 30 is bonded to the reinforcing member 35 in a contact state. . As shown in the enlarged portion a, the conductive bonding agent 30 includes the conductive particles 32 and the bonding agent 31, and the conductive particles 32 protrude from the bonding agent 31. Further, the reinforcing member 35 joined to the upper surface of the conductive bonding agent 30 in a contact state is in contact with the conductive particles 32. On the other hand, the conductive particles 32 protruding from the lower surface of the conductive bonding agent 30 break through the insulating layer 21 of the shielding film 20 and are in contact with the conductive layer 22 therebelow. Thereby, the reinforcing member 35 and the conductive layer 22 of the shielding film 20 are electrically connected by the conductive particles 32 of the conductive bonding agent 30, so that the reinforcing member 35 having conductivity and the conductive layer 22 can be at the same potential. Therefore, the reinforcing member 35 having conductivity can be provided with a shielding effect.

由此，屏蔽印刷電路板1的加強部件35將至少可以具有下述雙重作用，即，對電子部件50的安裝部位進行加強的作用以及屏蔽由外部對電子部件50的安裝部位輻射的電磁波90b等的雜訊。Thereby, the reinforcing member 35 for shielding the printed circuit board 1 can at least have a dual function of reinforcing the mounting portion of the electronic component 50 and shielding the electromagnetic wave 90b radiated from the mounting portion of the electronic component 50 from the outside. The noise.

下面，具體說明各結構。Hereinafter, each structure will be specifically described.

(印刷電路板10)(printed circuit board 10)

印刷電路板10包括：基底部件12，形成有多個電路圖案，如未圖示的信號用電路圖案和接地用電路圖案14等；接合劑層13，設置於基底部件12上；以及絕緣膜11，與接合劑層13接合。The printed circuit board 10 includes a base member 12 formed with a plurality of circuit patterns such as a signal circuit pattern (not shown) and a ground circuit pattern 14 and the like; an adhesive layer 13 disposed on the base member 12; and an insulating film 11 Engaged with the bonding layer 13.

未圖示的信號用電路圖案和接地用電路圖案14等形成於基底部件12的上表面。這些電路圖案通過對導電性材料實施蝕刻處理而形成。另外，其中的接地用電路圖案14是指保持接地電位的圖案。A signal circuit pattern (not shown), a ground circuit pattern 14 and the like are formed on the upper surface of the base member 12. These circuit patterns are formed by performing an etching treatment on the conductive material. Further, the grounding circuit pattern 14 therein refers to a pattern that maintains a ground potential.

接合劑層13是處於信號用電路圖案和接地用電路圖案14等與絕緣膜11之間的接合劑，具有保持絕緣性且使絕緣膜11和基底部件12相互接合的作用。另外，接合劑層13的厚度為10μm至40μm，可以適當地設置而不需要作特別的限定。The bonding agent layer 13 is a bonding agent between the signal circuit pattern and the grounding circuit pattern 14 and the like and the insulating film 11, and has an effect of maintaining insulation and bonding the insulating film 11 and the base member 12 to each other. Further, the thickness of the bonding layer 13 is from 10 μm to 40 μm, and may be appropriately set without particular limitation.

基底部件12和絕緣膜11兩者都由工程塑料製成。例如，可以為聚對苯二甲酸乙二酯、聚丙烯、交聯聚乙烯、聚酯、聚苯並咪唑、聚酰亞胺、聚酰亞胺酰胺、聚醚酰亞胺、聚苯硫醚等樹脂。在不太要求耐熱性的情況下優選廉價的聚酯膜。在要求難燃性的情況下優選聚苯硫醚膜，在還要求耐熱性的情況下優選聚酰亞胺膜。另外，基底部件12的厚度為10μm至40μm，絕緣膜11的厚度為10μm至30μm，可以適當地設置而不需要作特別的限定。Both the base member 12 and the insulating film 11 are made of engineering plastic. For example, it may be polyethylene terephthalate, polypropylene, crosslinked polyethylene, polyester, polybenzimidazole, polyimide, polyimide amide, polyetherimide, polyphenylene sulfide Resin. An inexpensive polyester film is preferred in the case where heat resistance is not required. When a flame retardancy is required, a polyphenylene sulfide film is preferable, and when heat resistance is also required, a polyimide film is preferable. Further, the base member 12 has a thickness of 10 μm to 40 μm, and the insulating film 11 has a thickness of 10 μm to 30 μm, which can be appropriately set without particular limitation.

另外，在上述絕緣膜11以及接合劑層13中，通過鐳射加工等方式形成有孔部40。孔部40用於使選自多個接地用電路圖案和信號用電路圖案的電路圖案的部分區域露出。本實施例中，在絕緣膜11及接合劑層13中沿著層疊方向形成有孔部40，以使接地用電路圖案14的部分區域暴露在外。另外，孔部40設有適當的孔徑以使鄰近的其他電路圖案不暴露。Further, in the insulating film 11 and the bonding layer 13, the hole portion 40 is formed by laser processing or the like. The hole portion 40 is for exposing a partial region of the circuit pattern selected from the plurality of grounding circuit patterns and signal circuit patterns. In the present embodiment, the hole portion 40 is formed in the insulating film 11 and the bonding layer 13 along the laminating direction so that a partial region of the grounding circuit pattern 14 is exposed. In addition, the hole portion 40 is provided with an appropriate aperture so that adjacent other circuit patterns are not exposed.

(加強部件35)(reinforcing part 35)

加強部件35由具有導電性的材料形成，例如不銹鋼材料。另外，加強部件35設置在屏蔽膜20上與電子部件50的安裝部位相對的位置，通過對電子部件50的安裝部位進行加強以防止由於彎曲等原因而在安裝部位產生扭曲變形等。另外，加強部件35並不限於不銹鋼材料，可以使用能夠加強安裝部位且具有導電性的任何材料，但由於不銹鋼材料具有適於加固的硬度且耐蝕性優良，因此使用不銹鋼材料能更有效地加固電子部件50的安裝部位且可以對安裝部位提供屏蔽效果。而且，為了提高電子部件50的電連接性，優選為在不銹鋼材料的表面實施鍍鎳。另外，加強部件35的厚度為0.05mm至1mm，可以根據構成適當地設定。The reinforcing member 35 is formed of a material having electrical conductivity, such as a stainless steel material. Further, the reinforcing member 35 is provided at a position facing the mounting portion of the electronic component 50 on the shielding film 20, and the mounting portion of the electronic component 50 is reinforced to prevent distortion or the like from occurring at the mounting portion due to bending or the like. Further, the reinforcing member 35 is not limited to a stainless steel material, and any material capable of reinforcing the mounting portion and having electrical conductivity may be used. However, since the stainless steel material has hardness suitable for reinforcement and excellent corrosion resistance, the use of the stainless steel material can more effectively reinforce the electron. The mounting location of the component 50 can provide a shielding effect to the mounting location. Further, in order to improve the electrical connectivity of the electronic component 50, it is preferable to perform nickel plating on the surface of the stainless steel material. Further, the thickness of the reinforcing member 35 is 0.05 mm to 1 mm, and can be appropriately set depending on the configuration.

(導電性接合劑30)(conductive bonding agent 30)

導電性接合劑30由各向同性導電性接合劑和各向異性導電性接合劑中的任一種形成。各向同性導電性接合劑具有與現有焊料相同的電氣性質。因此，以各向同性導電性接合劑形成導電性接合劑30的情況下，可以確保在厚度方向及寬度方向、長度方向構成的三維空間的全部方向上處於導電狀態。另一方面，以各向異性導電性接合劑形成導電性接合劑30的情況下，可以確保僅在由厚度方向構成的二維方向上處於導電狀態。The conductive bonding agent 30 is formed of any one of an isotropic conductive bonding agent and an anisotropic conductive bonding agent. Isotropic conductive bonding agents have the same electrical properties as existing solders. Therefore, when the conductive bonding agent 30 is formed of an isotropic conductive bonding agent, it is possible to ensure a conductive state in all directions of the three-dimensional space formed in the thickness direction, the width direction, and the longitudinal direction. On the other hand, when the conductive bonding agent 30 is formed of an anisotropic conductive bonding agent, it can be ensured that it is in a conductive state only in a two-dimensional direction constituted by the thickness direction.

另外，導電性接合劑30還可以由混合以軟磁性材料作為主成分的導電性粒子32和接合劑31所得到的導電性接合劑形成。這種情況下，通過導電性粒子32發揮高磁化作用，即使對於高頻率電磁波也可以抑制磁導率的下降，從而可以吸收電波。由此，通過其與加強部件35的組合，除了具有屏蔽效果的功能之外，還具有吸收電波的功能。Further, the conductive bonding agent 30 may be formed of a conductive bonding agent obtained by mixing the conductive particles 32 having a soft magnetic material as a main component and the bonding agent 31. In this case, the conductive particles 32 exhibit a high magnetization, and even for high-frequency electromagnetic waves, the decrease in magnetic permeability can be suppressed, and the radio waves can be absorbed. Thereby, the combination with the reinforcing member 35 has a function of absorbing electric waves in addition to the function of shielding effect.

具體地，導電性接合劑30形成為導電性粒子32和接合劑31的混合體。即，導電性接合劑30是通過使導電性粒子32分散於接合劑31來構成的。導電性接合劑30的電連接是通過接合劑31內的一個或者多個導電性粒子32在導電性接合劑30的厚度方向連續接觸來實現的，且通過接合劑31的接合力保持。Specifically, the conductive bonding agent 30 is formed as a mixture of the conductive particles 32 and the bonding agent 31. That is, the conductive bonding agent 30 is configured by dispersing the conductive particles 32 in the bonding agent 31. The electrical connection of the conductive bonding agent 30 is achieved by continuously contacting one or a plurality of conductive particles 32 in the bonding agent 31 in the thickness direction of the conductive bonding agent 30, and is held by the bonding force of the bonding agent 31.

導電性接合劑30包含的接合劑31例如可以列舉丙烯酸類樹脂、環氧類樹脂、矽樹脂、熱塑性彈性體類樹脂、橡膠類樹脂、聚酯類樹脂、氨基甲酸酯類樹脂等。另外，接合劑31可以是上述樹脂的單體，還可以是上述樹脂的混合物。另外，接合劑31還可以包含增粘劑。作為增粘劑，例如，可以列舉脂肪酸烴類樹脂、C5/C9混合樹脂、松香、松香衍生物、萜烯樹脂、芳香族烴類樹脂、熱反應性樹脂等增粘劑。Examples of the bonding agent 31 included in the conductive bonding agent 30 include an acrylic resin, an epoxy resin, an anthracene resin, a thermoplastic elastomer resin, a rubber resin, a polyester resin, and a urethane resin. Further, the bonding agent 31 may be a monomer of the above resin, or may be a mixture of the above resins. In addition, the bonding agent 31 may further contain a tackifier. Examples of the tackifier include a thickener such as a fatty acid hydrocarbon resin, a C5/C9 mixed resin, a rosin, a rosin derivative, a terpene resin, an aromatic hydrocarbon resin, and a heat-reactive resin.

導電性接合劑30包含的導電性粒子32的一部分或者全部由金屬材料形成。例如，導電性粒子32有銅粉、銀粉、鎳粉、覆銀銅粉、覆金銅粉、覆銀鎳粉、覆金鎳粉，這些金屬粉可以通過霧化(atomization)法、羰基化(carbonylation)法來製備。另外，除了以上所述之外，還可以使用由樹脂包覆金屬粉所獲得的粒子、由金屬粉包覆樹脂所獲得的粒子。另外，導電性粒子32優選為覆銀銅粉或者覆銀鎳粉。其原因是因為可以由廉價的材料獲得導電性穩定的導電性粒子32。另外，導電性粒子32的形狀並不限於球狀，例如還可以以球狀作為基礎，在球面上形成有凸起。在這種情況下，導電性粒子32將更易於突破絕緣層21。另外，在導電性粒子32的形狀為球狀的情況下，在導電性接合劑30中，無論導電性粒子向哪個方向傾斜，導電性粒子從導電性接合劑30突出的長度在層厚方向上大致一定。由此，例如與薄片形狀或者樹枝形狀相比，導電性粒子32將更易於突破絕緣層21，易於與導電層22接觸。A part or all of the conductive particles 32 included in the conductive bonding agent 30 are formed of a metal material. For example, the conductive particles 32 are copper powder, silver powder, nickel powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, and gold-coated nickel powder. These metal powders can be subjected to atomization or carbonylation. ) to prepare. Further, in addition to the above, particles obtained by coating a metal powder with a resin or particles obtained by coating a resin with a metal powder may be used. Further, the conductive particles 32 are preferably silver-coated copper powder or silver-coated nickel powder. The reason for this is because the conductive particles 32 having stable conductivity can be obtained from an inexpensive material. Further, the shape of the conductive particles 32 is not limited to a spherical shape, and for example, a convex shape may be formed on the spherical surface based on a spherical shape. In this case, the conductive particles 32 will more easily break through the insulating layer 21. In the case where the conductive particles 32 have a spherical shape, the conductive particles 30 are inclined in any direction regardless of the direction in which the conductive particles are inclined, and the length of the conductive particles protruding from the conductive bonding agent 30 is in the layer thickness direction. It is roughly certain. Thereby, for example, the conductive particles 32 will be more likely to break through the insulating layer 21 than the sheet shape or the branch shape, and are easily brought into contact with the conductive layer 22.

在具有如上所述結構的導電性接合劑30中，接合劑31的厚度為5μm至40μm，導電性粒子32的平均粒徑為10μm至100μm。另外，導電性粒子32的平均粒徑為接合劑31厚度的1.5倍至3倍。因此，導電性粒子32的一部分從導電性接合劑30的接合劑31突出。另外，導電性粒子32的平均粒徑的偏差優選為±5μm以內。在這種情況下，由於從導電性接合劑30突出的導電性粒子32的突出長度不存在大的偏差，因此與導電層22之間的連接電阻穩定。由此，能夠穩定地將加強部件35和導電層22保持等電位。並且，導電性粒子32相對於接合劑31的混合量為30wt%至70wt%，從接合力以及導電性角度來看，優選為50wt%。In the conductive bonding agent 30 having the structure as described above, the thickness of the bonding agent 31 is 5 μm to 40 μm, and the average particle diameter of the conductive particles 32 is 10 μm to 100 μm. Further, the average particle diameter of the conductive particles 32 is 1.5 to 3 times the thickness of the bonding agent 31. Therefore, a part of the conductive particles 32 protrudes from the bonding agent 31 of the conductive bonding agent 30. Further, the variation in the average particle diameter of the conductive particles 32 is preferably within ±5 μm. In this case, since the protruding length of the conductive particles 32 protruding from the conductive bonding agent 30 does not largely vary, the connection resistance with the conductive layer 22 is stabilized. Thereby, the reinforcing member 35 and the conductive layer 22 can be stably maintained at the same potential. Further, the amount of the conductive particles 32 to be mixed with the bonding agent 31 is 30% by weight to 70% by weight, and is preferably 50% by weight from the viewpoint of bonding strength and conductivity.

(屏蔽膜20)(Shielding film 20)

屏蔽膜20包括：導電層22，以接觸狀態接合於導電材料23；以及絕緣層21，設置於導電層22上。The shielding film 20 includes a conductive layer 22 bonded to the conductive material 23 in a contact state, and an insulating layer 21 disposed on the conductive layer 22.

導電材料23由各向同性導電性接合劑或者各向異性導電性接合劑形成。各向同性導電性接合劑具有與現有焊料相同的電氣性質。因此，以各向同性導電性接合劑形成導電材料23的情況下，可以確保在由厚度方向及寬度方向、長度方向構成的三維空間的全部方向上處於導電狀態。另一方面，以各向異性導電性接合劑形成導電材料23的情況下，可以確保僅在由厚度方向構成的二維方向上處於導電狀態。另外，導電材料23由各向同性導電性接合劑形成的情況下，由於導電材料23可以具有導電層22的功能，因此有時也可以不設置導電層22。The conductive material 23 is formed of an isotropic conductive bonding agent or an anisotropic conductive bonding agent. Isotropic conductive bonding agents have the same electrical properties as existing solders. Therefore, when the conductive material 23 is formed of an isotropic conductive bonding agent, it is ensured that the conductive state is in all directions in the three-dimensional space composed of the thickness direction, the width direction, and the longitudinal direction. On the other hand, in the case where the conductive material 23 is formed of an anisotropic conductive bonding agent, it is ensured that it is in a conductive state only in a two-dimensional direction constituted by the thickness direction. Further, when the conductive material 23 is formed of an isotropic conductive bonding agent, since the conductive material 23 may have the function of the conductive layer 22, the conductive layer 22 may not be provided.

另外，導電材料23由絕緣性接合劑以及分散於絕緣性接合劑中的導電性粒子構成。具體地，絕緣性接合劑可以由以下作為接合性樹脂的材料構成：聚苯乙烯類、醋酸乙烯類、聚酯類、聚乙烯類、聚丙烯類、聚酰胺類、橡膠類、丙烯酸類等熱塑性樹脂，或者，酚類、環氧類、氨基甲酸酯類、三聚氰胺類、醇酸類等熱固性樹脂。另外，向這些接合性樹脂中混合金屬、碳等導電性粒子從而形成具有導電性的導電性接合劑。在不特別要求耐熱性的情況下優選採用不受保管條件等限制的聚酯類熱塑性樹脂，在要求耐熱性或者較出色的可撓性的情況下優選採用可靠性高的環氧類熱固性樹脂。另外，在任何一種情況下，熱壓時滲出(resin flow，樹脂流量)小的材料為優選。另外，導電材料23的厚度為3μm至30μm，但可以適當地設置而不需要作特別的限定。Further, the conductive material 23 is composed of an insulating bonding agent and conductive particles dispersed in an insulating bonding agent. Specifically, the insulating bonding agent may be composed of the following materials as a bonding resin: thermoplastics such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, and acrylic. Resins, or thermosetting resins such as phenols, epoxies, urethanes, melamines, and alkyds. Further, conductive particles such as a metal or carbon are mixed into these conjugate resins to form a conductive conductive adhesive. When the heat resistance is not particularly required, a polyester-based thermoplastic resin which is not restricted by storage conditions or the like is preferably used. When heat resistance or excellent flexibility is required, it is preferable to use a highly reliable epoxy-based thermosetting resin. Further, in either case, a material having a small resin flow at the time of hot pressing is preferable. In addition, the thickness of the conductive material 23 is from 3 μm to 30 μm, but may be appropriately set without particular limitation.

另外，導電材料23包含的導電性粒子具有比孔部40的孔徑小的平均粒徑以使得導電性粒子進入上述孔部40內。而且，部分或者全部導電性粒子由金屬材料形成。例如，導電性粒子有銅粉、銀粉、鎳粉、覆銀銅粉、覆金銅粉、覆銀鎳粉、覆金鎳粉，這些金屬粉可以通過霧化法、羰基化法等來製備。另外，除了以上所述之外，還可以使用由樹脂包覆金屬粉所獲得的粒子、由金屬粉包覆樹脂所獲得的粒子。另外，導電性粒子優選為覆銀銅粉或者覆銀鎳粉。其原因是因為可以由廉價的材料獲得導電性穩定的導電性粒子。另外，導電材料23的導電性粒子的形狀不必限於球狀，例如也可以是薄片狀或者樹枝狀。Further, the conductive particles included in the conductive material 23 have an average particle diameter smaller than the pore diameter of the hole portion 40 so that the conductive particles enter the hole portion 40. Further, some or all of the conductive particles are formed of a metal material. For example, the conductive particles are copper powder, silver powder, nickel powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, and gold-coated nickel powder. These metal powders can be prepared by an atomization method, a carbonylation method, or the like. Further, in addition to the above, particles obtained by coating a metal powder with a resin or particles obtained by coating a resin with a metal powder may be used. Further, the conductive particles are preferably silver-coated copper powder or silver-coated nickel powder. The reason for this is because conductively stable conductive particles can be obtained from inexpensive materials. Further, the shape of the conductive particles of the conductive material 23 is not necessarily limited to a spherical shape, and may be, for example, a sheet shape or a dendritic shape.

導電層22具有屏蔽效果，即，屏蔽由主板送出的電信號中的不必要的輻射以及來自外部的電磁波等的雜訊。導電層22是金屬層，該金屬層由鎳、銅、銀、錫、金、鈀、鋁、鉻、鈦或鋅形成，或者，由含有這些材料中的任一種材料的合金形成，或者，由含有這些材料中的兩種以上材料的合金形成。另外，作為金屬材料，根據所需的屏蔽效果進行適當選擇即可，然而，銅存在當與大氣接觸時容易發生氧化的問題，金的價格昂貴，因此廉價的鋁或者可靠性高的銀為優選。另外，對於膜的厚度，根據所需的屏蔽效果以及對反復彎曲、滑動的耐受性進行適當選擇即可，但厚度優選為0.01μm至10μm。厚度小於0.01μm時不能得到充分的屏蔽效果，超過10μm時彎曲性將成為問題。另外，導電層22的形成方法有真空沉積法、濺射法、CVD法、MO(金屬有機法)法、鍍敷法、薄片法等，如果考慮到批量生產，則真空沉積法為優選，可以得到廉價且穩定的導電層22。另外，如上所述，導電材料23由各向同性導電性接合劑形成的情況下，有時也可以不設置導電層22。The conductive layer 22 has a shielding effect, that is, shielding unnecessary radiation in an electric signal sent from the main board and noise from an external electromagnetic wave or the like. The conductive layer 22 is a metal layer formed of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium or zinc, or formed of an alloy containing any of these materials, or An alloy containing two or more of these materials is formed. Further, as the metal material, it may be appropriately selected depending on the desired shielding effect. However, copper has a problem that oxidation tends to occur when it comes into contact with the atmosphere, and gold is expensive, so inexpensive aluminum or highly reliable silver is preferable. . Further, the thickness of the film may be appropriately selected depending on the desired shielding effect and resistance to repeated bending and sliding, but the thickness is preferably from 0.01 μm to 10 μm. When the thickness is less than 0.01 μm, a sufficient shielding effect cannot be obtained, and when it exceeds 10 μm, flexibility is a problem. In addition, the method of forming the conductive layer 22 includes a vacuum deposition method, a sputtering method, a CVD method, an MO (metal organic method) method, a plating method, a sheet method, etc., and if mass production is considered, a vacuum deposition method is preferable, and An inexpensive and stable conductive layer 22 is obtained. Further, as described above, when the conductive material 23 is formed of an isotropic conductive bonding agent, the conductive layer 22 may not be provided.

絕緣層21由環氧類、聚酯類、丙烯酸類、酚類以及氨基甲酸酯類等樹脂或者這些樹脂的混合物形成，起到保持絕緣性並且進行覆蓋以使導電層22不直接暴露在外的作用。另外，絕緣層21的厚度為1μm至10μm，通過直接塗布於導電層22來形成絕緣層21，這種方式例如較之於膜狀能形成得更薄，從而可使導電性粒子32更易於突破絕緣層21。The insulating layer 21 is formed of a resin such as epoxy, polyester, acrylic, phenol, or urethane or a mixture of these resins, and functions to maintain insulation and cover so that the conductive layer 22 is not directly exposed. . Further, the insulating layer 21 has a thickness of 1 μm to 10 μm, and the insulating layer 21 is formed by directly coating the conductive layer 22, which is formed thinner than the film shape, for example, so that the conductive particles 32 can be more easily broken. Insulation layer 21.

另外，加強部件35通過導電性接合劑30設置於屏蔽膜20上時，導電性接合劑30接合於屏蔽膜20內的絕緣層21上。在進行上述接合時，從加強部件35側對絕緣層21進行加熱使其軟化。如此，通過加熱來軟化絕緣層21，導電性接合劑30的導電性粒子32將易於突破絕緣層21。因此，形成絕緣層21的環氧類等樹脂由能夠在絕緣層21上設置加強部件35時的加熱溫度下發生軟化的樹脂形成。Further, when the reinforcing member 35 is provided on the shielding film 20 by the conductive bonding agent 30, the conductive bonding agent 30 is bonded to the insulating layer 21 in the shielding film 20. At the time of the above bonding, the insulating layer 21 is heated from the reinforcing member 35 side to be softened. Thus, the insulating layer 21 is softened by heating, and the conductive particles 32 of the conductive bonding agent 30 are likely to break through the insulating layer 21. Therefore, the resin such as epoxy which forms the insulating layer 21 is formed of a resin which can be softened at a heating temperature when the reinforcing member 35 is provided on the insulating layer 21.

在此，如圖1的放大部a所示，接合導電性接合劑30和絕緣層21時，導電性接合劑30包含的導電性粒子32的一部分從接合劑31的下表面突出，該導電性粒子32的突出部突破絕緣層21並與導電層22接觸。因此，絕緣層21的層厚L1被設定為小於導電性粒子32從導電性接合劑30突出的突出長度L2。具體地，在導電性接合劑30的接合劑31的厚度為5μm至15μm、導電性粒子32的平均粒徑為10μm至20μm的情況下，導電性粒子32的突出長度L2為5μm至15μm，因此，絕緣層21的厚度處於2μm至12μm的範圍。另外，如圖1所示，導電性粒子32被逐一配置在導電性接合劑30的層厚方向上並且在與上述層厚方向正交的方向上排成一列。例如，也可以在導電性接合劑30的層厚方向上疊加兩列或三列導電性粒子32。即，本實施例中，在導電性接合劑30的層厚方向上，加強部件35和導電層22通過一個導電性粒子32實現電連接，但並不限於此，也可以在導電性接合劑30的層厚方向上疊加配置多個導電性粒子32，通過該多個導電性粒子32使加強部件35和導電層22電連接。只要絕緣層21的層厚被設置為比導電性粒子32從導電性接合劑30突出的突出長度小即可。Here, when the conductive bonding agent 30 and the insulating layer 21 are bonded as shown in the enlarged portion a of FIG. 1, a part of the conductive particles 32 included in the conductive bonding agent 30 protrudes from the lower surface of the bonding agent 31, and the conductivity The protrusion of the particle 32 breaks through the insulating layer 21 and is in contact with the conductive layer 22. Therefore, the layer thickness L1 of the insulating layer 21 is set to be smaller than the protruding length L2 of the conductive particles 32 protruding from the conductive bonding agent 30. Specifically, in the case where the thickness of the bonding agent 31 of the conductive bonding agent 30 is 5 μm to 15 μm and the average particle diameter of the conductive particles 32 is 10 μm to 20 μm, the protruding length L2 of the conductive particles 32 is 5 μm to 15 μm, The thickness of the insulating layer 21 is in the range of 2 μm to 12 μm. Further, as shown in FIG. 1, the conductive particles 32 are arranged one by one in the layer thickness direction of the conductive bonding agent 30 and arranged in a line in a direction orthogonal to the layer thickness direction. For example, two or three rows of conductive particles 32 may be stacked in the layer thickness direction of the conductive bonding agent 30. That is, in the present embodiment, the reinforcing member 35 and the conductive layer 22 are electrically connected by one conductive particle 32 in the layer thickness direction of the conductive bonding agent 30, but the present invention is not limited thereto, and the conductive bonding agent 30 may be used. A plurality of conductive particles 32 are superposed on each other in the layer thickness direction, and the reinforcing member 35 and the conductive layer 22 are electrically connected by the plurality of conductive particles 32. The layer thickness of the insulating layer 21 may be set to be smaller than the protruding length of the conductive particles 32 protruding from the conductive bonding agent 30.

具有如上所述構成的屏蔽膜20中，導電材料23進入孔部40內並與暴露在外的接地用電路圖案14接觸。由此，導電層22通過以接觸狀態接合的導電材料23與接地用電路圖案14導通並與其保持等電位。由此，屏蔽膜20具有屏蔽效果，從而可以屏蔽來自外部的電磁波90a等雜訊。In the shield film 20 having the above configuration, the conductive material 23 enters the hole portion 40 and comes into contact with the grounding circuit pattern 14 that is exposed. Thereby, the conductive layer 22 is electrically connected to the grounding circuit pattern 14 by the conductive material 23 joined in the contact state and is kept at the same potential. Thereby, the shielding film 20 has a shielding effect, so that noise such as electromagnetic waves 90a from the outside can be shielded.

另外，對屏蔽膜20進行配置使其覆蓋與電子部件的安裝部位相對的區域的一部分或全部，上述電子部件在上述安裝部位連接印刷電路板10。由此，可以利用屏蔽膜20屏蔽由外部對電子部件50的安裝部位輻射的電磁波90b等的雜訊。Further, the shielding film 20 is disposed so as to cover a part or all of a region facing the mounting portion of the electronic component, and the electronic component is connected to the printed circuit board 10 at the mounting portion. Thereby, the noise of the electromagnetic wave 90b or the like radiated from the externally mounted portion of the electronic component 50 can be shielded by the shielding film 20.

另外，從導電性接合劑30的下表面突出的導電性粒子32可以突破屏蔽膜20的絕緣層21並與其下的導電層22接觸。由此，加強部件35和屏蔽膜20的導電層22通過導電性接合劑30的導電性粒子32而成為導通狀態，從而可以使具有導電性的加強部件35和導電層22處於等電位。Further, the conductive particles 32 protruding from the lower surface of the conductive bonding agent 30 can break through the insulating layer 21 of the shielding film 20 and come into contact with the conductive layer 22 therebelow. Thereby, the reinforcing member 35 and the conductive layer 22 of the shielding film 20 are electrically connected by the conductive particles 32 of the conductive bonding agent 30, so that the reinforcing member 35 having the conductivity and the conductive layer 22 can be at the same potential.

如上所述，本實施例的屏蔽印刷電路板1包括：印刷電路板10、屏蔽膜20和加強部件35，其中，印刷電路板10包括形成有接地用電路圖案14的基底部件12以及設置於基底部件12上並覆蓋接地用電路圖案14的絕緣膜11，並且在設置於基底部件12的下表面的安裝部位連接有電子部件50；屏蔽膜20設置於印刷電路板10上，包括：與接地用電路圖案14處於等電位且覆蓋與安裝部位相對的區域的一部分或全部的導電層22、以及設置於導電層22上的絕緣層21；加強部件35配置於屏蔽膜20上與安裝部位相對的區域並具有導電性；在該屏蔽印刷電路板1中，加強部件35通過包含球狀導電性粒子32的導電性接合劑30接合於絕緣層21上，絕緣層21的層厚小於導電性粒子32在導電性接合劑30與絕緣層21接合的狀態下從導電性接合劑30突出的突出長度，導電性粒子32在導電性接合劑30與絕緣層21接合的狀態下與導電層22接觸。As described above, the shield printed circuit board 1 of the present embodiment includes the printed circuit board 10, the shielding film 20, and the reinforcing member 35, wherein the printed circuit board 10 includes the base member 12 on which the grounding circuit pattern 14 is formed, and is provided on the substrate. The insulating film 11 of the grounding circuit pattern 14 is covered on the member 12, and the electronic component 50 is connected to the mounting portion provided on the lower surface of the base member 12. The shielding film 20 is disposed on the printed circuit board 10, including: for grounding The circuit pattern 14 is at a potential potential and covers a part or all of the conductive layer 22 of the region opposite to the mounting portion, and the insulating layer 21 disposed on the conductive layer 22; the reinforcing member 35 is disposed on the shielding film 20 opposite to the mounting portion. Further, in the shield printed circuit board 1, the reinforcing member 35 is bonded to the insulating layer 21 by the conductive bonding agent 30 containing the spherical conductive particles 32, and the layer thickness of the insulating layer 21 is smaller than that of the conductive particles 32. The protruding length from the conductive bonding agent 30 in a state where the conductive bonding agent 30 is bonded to the insulating layer 21, and the conductive particles 32 are bonded to the insulating layer 30 at the conductive bonding agent 30. In contact with the conductive layer 22 in the state.

根據上述結構，在印刷電路板10上配置有與接地用電路圖案14處於等電位的導電層22並且該導電層22覆蓋與電子部件50的安裝部位相對的區域的一部分或全部。由此，通過具有導電層22的屏蔽膜20可以屏蔽由外部對電子部件50的安裝部位輻射的電磁波90a。另外，與電子部件50的安裝部位相對的區域通過設置於屏蔽膜20上的加強部件35得以加強。由此，通過加強部件35可以防止由彎曲等所導致的產生於安裝部位的變形等。並且，導電性接合劑30包含的導電性粒子32在導電性接合劑30與絕緣層21接合的狀態下與屏蔽膜20的導電層22接觸，其中，上述導電性接合劑30用於將加強部件35接合於屏蔽膜20的絕緣層21上。因此，可以使具有導電性的加強部件35的電位和導電層22的電位處於等電位，能夠使加強部件35也具有屏蔽效果。由此，通過屏蔽膜20的屏蔽效果和加強部件35的屏蔽效果這雙重效果可以更可靠地對電子部件50的安裝部位提供屏蔽效果。因此，不需要象現有技術那樣為了使加強部件35處於接地電位而暴露接地用電路圖案14並通過導電性接合劑使加強部件35和接地用電路圖案14連接，因此，不需要根據加強部件35的配置位置來形成接地用電路圖案14，從而提高了設計自由度。另外，由於不需要通過導電性接合劑使加強部件35和接地用電路圖案14連接，因此也不會發生因在該連接部分中出現空隙所引起的回流時的缺陷。如上所述，既可以確保設計自由度又可以保持屏蔽效果。另外，由於導電性粒子32為球狀，因此在導電性接合劑30中無論導電性粒子32向哪個方向傾斜，導電性粒子32從導電性接合劑30突出的長度在層厚方向上大致一定。由此，例如，較之於薄片狀或者樹枝狀，導電性粒子32將更易於突破絕緣層21從而易於與導電層22接觸。其結果，可以更可靠地將加強部件35和導電層22保持在等電位。According to the above configuration, the conductive layer 22 having the same potential as the grounding circuit pattern 14 is disposed on the printed circuit board 10, and the conductive layer 22 covers a part or all of the region facing the mounting portion of the electronic component 50. Thereby, the electromagnetic wave 90a radiated from the mounting portion of the electronic component 50 by the outside can be shielded by the shielding film 20 having the conductive layer 22. Further, a region opposed to the mounting portion of the electronic component 50 is reinforced by the reinforcing member 35 provided on the shielding film 20. Thereby, deformation or the like which occurs in the mounting portion due to bending or the like can be prevented by the reinforcing member 35. Further, the conductive particles 32 included in the conductive bonding agent 30 are in contact with the conductive layer 22 of the shielding film 20 in a state where the conductive bonding agent 30 is bonded to the insulating layer 21, wherein the conductive bonding agent 30 is used for the reinforcing member. 35 is bonded to the insulating layer 21 of the shielding film 20. Therefore, the potential of the conductive reinforcing member 35 and the potential of the conductive layer 22 can be at the same potential, and the reinforcing member 35 can also have a shielding effect. Thereby, the double effect of the shielding effect of the shielding film 20 and the shielding effect of the reinforcing member 35 can more reliably provide a shielding effect to the mounting portion of the electronic component 50. Therefore, it is not necessary to expose the grounding circuit pattern 14 and connect the reinforcing member 35 and the grounding circuit pattern 14 by the conductive bonding agent in order to make the reinforcing member 35 at the ground potential as in the prior art, and therefore, it is not necessary to follow the reinforcing member 35. The position is arranged to form the grounding circuit pattern 14, thereby increasing the degree of design freedom. Further, since it is not necessary to connect the reinforcing member 35 and the grounding circuit pattern 14 by the conductive bonding agent, defects at the time of reflow due to the occurrence of voids in the connecting portion do not occur. As mentioned above, both design freedom and shielding effectiveness can be ensured. In addition, since the conductive particles 32 are spherical in the conductive bonding agent 30, the length of the conductive particles 32 protruding from the conductive bonding agent 30 is substantially constant in the layer thickness direction. Thus, for example, the conductive particles 32 will more easily break through the insulating layer 21 to be more easily in contact with the conductive layer 22 than in the form of flakes or dendrites. As a result, the reinforcing member 35 and the conductive layer 22 can be more reliably maintained at the same potential.

另外，本實施例的屏蔽印刷電路板1中，印刷電路板10還包括：形成有接地用電路圖案14的基底部件12、以及設置於基底部件12上並覆蓋接地用電路圖案14的絕緣膜11，在絕緣膜11中形成有供部分接地用電路圖案14露出的孔部40，屏蔽膜20的導電層22設置於導電材料23上並接觸該導電材料23，其中，導電材料23設置於絕緣層11上並且填充于孔部40中。Further, in the shield printed circuit board 1 of the present embodiment, the printed circuit board 10 further includes: a base member 12 on which the grounding circuit pattern 14 is formed, and an insulating film 11 which is provided on the base member 12 and covers the grounding circuit pattern 14. A hole portion 40 for exposing the partial grounding circuit pattern 14 is formed in the insulating film 11. The conductive layer 22 of the shielding film 20 is disposed on the conductive material 23 and contacts the conductive material 23, wherein the conductive material 23 is disposed on the insulating layer. 11 is filled in and filled in the hole portion 40.

根據上述構成，可以通過導電材料23將屏蔽膜20的導電層22的電位與接地用電路圖案14的電位變成等電位，其中，上述導電材料23填充在形成於絕緣膜11的孔部40中。由此，不需要為了使導電層22的電位處於接地電位而特意連接外部接地用部件。According to the above configuration, the potential of the conductive layer 22 of the shield film 20 and the potential of the ground circuit pattern 14 can be made equal by the conductive material 23, and the conductive material 23 can be filled in the hole portion 40 formed in the insulating film 11. Therefore, it is not necessary to intentionally connect the external grounding member in order to make the potential of the conductive layer 22 at the ground potential.

另外，本實施例的屏蔽印刷電路板1中，屏蔽膜20的絕緣層21塗布於導電層22上。Further, in the shield printed circuit board 1 of the present embodiment, the insulating layer 21 of the shielding film 20 is applied onto the conductive layer 22.

根據上述構成，由於屏蔽膜20的絕緣層21塗布於導電層上，因此，例如可以使其比膜狀的絕緣層21更薄，從而從導電性接合劑30突出的導電性粒子32將易於突破絕緣層21並與導電層22接觸。According to the above configuration, since the insulating layer 21 of the shielding film 20 is applied to the conductive layer, it can be made thinner than the film-shaped insulating layer 21, for example, and the conductive particles 32 protruding from the conductive bonding agent 30 can be easily broken. The insulating layer 21 is in contact with the conductive layer 22.

另外，本實施例的屏蔽印刷電路板1中，加強部件35由不銹鋼材料形成。Further, in the shield printed circuit board 1 of the present embodiment, the reinforcing member 35 is formed of a stainless steel material.

根據上述構成，由於不銹鋼材料具有適合於加固的硬度且耐蝕性優秀，因此可以更有效地既加固電子部件50的安裝部位又對安裝部位提供屏蔽效果。According to the above configuration, since the stainless steel material has hardness suitable for reinforcement and excellent corrosion resistance, it is possible to more effectively reinforce the mounting portion of the electronic component 50 and provide a shielding effect to the mounting portion.

另外，在本實施例中，加強部件35還可以進一步連接與接地用電路圖案14保持等電位的外部接地用部件。即，也可以構成為，在外部另行準備與接地用電路圖案14處於等電位的接地用部件，使用佈線等進一步將加強部件35與接地用部件連接。據此，加強部件35通過導電性接合劑30包含的導電性粒子32在內部與接地用電路圖案14保持等電位，並且，還可通過外部的接地用部件與接地用電路圖案14保持等電位，因此可以進一步提高屏蔽效果。Further, in the present embodiment, the reinforcing member 35 may be further connected to an external grounding member that maintains the same potential as the grounding circuit pattern 14. In other words, the grounding member having the same potential as the grounding circuit pattern 14 may be separately prepared externally, and the reinforcing member 35 may be further connected to the grounding member by using a wiring or the like. According to this, the reinforcing member 32 is kept at the same potential as the grounding circuit pattern 14 by the conductive particles 32 included in the conductive bonding agent 30, and can be held at the same potential by the external grounding member and the grounding circuit pattern 14. Therefore, the shielding effect can be further improved.

(屏蔽印刷電路板1的製造方法)(Manufacturing method of shield printed circuit board 1)

接下來，使用圖2以及圖3說明本實施例的屏蔽印刷電路板1的製造方法。如圖2以及圖3所示，本實施例的屏蔽印刷電路板1的製造方法包括：孔部形成步驟，在印刷電路板10的絕緣膜11中形成孔部40；屏蔽膜接合步驟，在印刷電路板10的上表面設置屏蔽膜20；剝離層剝離步驟，剝離位於屏蔽膜20的最上面的剝離層28；導電性接合劑接合步驟，在屏蔽膜20的絕緣層21的上表面接合導電性接合劑30；加強部件接合步驟，將加強部件35接合於導電性接合劑30上；以及電子部件連接步驟，在印刷電路板10的下表面上與加強部件35相對的位置處連接電子部件50。Next, a method of manufacturing the shield printed circuit board 1 of the present embodiment will be described with reference to FIGS. 2 and 3. As shown in FIG. 2 and FIG. 3, the manufacturing method of the shield printed circuit board 1 of the present embodiment includes a hole forming step of forming a hole portion 40 in the insulating film 11 of the printed circuit board 10; a shielding film bonding step in printing A shielding film 20 is disposed on the upper surface of the circuit board 10; a peeling layer peeling step is performed to peel off the uppermost peeling layer 28 located on the shielding film 20; and a conductive bonding agent bonding step is performed to bond the conductive property on the upper surface of the insulating layer 21 of the shielding film 20. The bonding agent 30; the reinforcing member bonding step of bonding the reinforcing member 35 to the conductive bonding agent 30; and the electronic component connecting step of connecting the electronic component 50 at a position opposite to the reinforcing member 35 on the lower surface of the printed circuit board 10.

下面，具體說明各個步驟。如圖2(a)所示，在孔部形成步驟中，首先準備印刷電路板10。然後，通過對印刷電路板10的絕緣膜11以及接合劑層13進行鐳射加工等方式來形成孔部40。通過該步驟，選自多個信號用電路圖案和接地用電路圖案等的接地用電路圖案14的部分區域通過孔部40暴露在外。Hereinafter, each step will be specifically described. As shown in FIG. 2(a), in the hole forming step, the printed circuit board 10 is first prepared. Then, the hole portion 40 is formed by laser processing the insulating film 11 of the printed circuit board 10 and the bonding layer 13. By this step, a partial region of the grounding circuit pattern 14 selected from a plurality of signal circuit patterns and a grounding circuit pattern or the like is exposed through the hole portion 40.

接下來，如圖2(b)所示，在屏蔽膜接合步驟中，在印刷電路板10的絕緣膜11上接合屏蔽膜20。該接合過程中，一邊通過加熱器h加熱屏蔽膜20的導電材料23一邊通過壓力機P在上下方向上壓合印刷電路板10和屏蔽膜20。由此，屏蔽膜20的導電材料23通過加熱器h的加熱而變軟，並通過壓力機P所施加的壓力接合於絕緣膜11上，並且填充于孔部40中。然後，填充于孔部40中的導電材料23很快與接地用電路圖案14接觸。通過該步驟，在印刷電路板10的絕緣膜11上設置屏蔽膜20，並且，屏蔽膜20的導電層22和接地用電路圖案14通過導電材料23導通。由此，屏蔽膜20的導電層22和接地用電路圖案14保持等電位，可以通過屏蔽膜20屏蔽來自外部的電磁波90a等雜訊。Next, as shown in FIG. 2(b), in the mask film bonding step, the shielding film 20 is bonded on the insulating film 11 of the printed circuit board 10. In the bonding process, the printed circuit board 10 and the shielding film 20 are press-bonded in the vertical direction by the press P while the conductive material 23 of the shielding film 20 is heated by the heater h. Thereby, the conductive material 23 of the shielding film 20 is softened by the heating of the heater h, and is bonded to the insulating film 11 by the pressure applied by the press P, and is filled in the hole portion 40. Then, the conductive material 23 filled in the hole portion 40 is quickly brought into contact with the ground circuit pattern 14. By this step, the shielding film 20 is provided on the insulating film 11 of the printed circuit board 10, and the conductive layer 22 of the shielding film 20 and the grounding circuit pattern 14 are electrically connected by the conductive material 23. Thereby, the conductive layer 22 of the shielding film 20 and the grounding circuit pattern 14 are kept at the same potential, and noise such as electromagnetic waves 90a from the outside can be shielded by the shielding film 20.

接下來，如圖2(c)所示，在剝離層剝離步驟中剝離預先設置於屏蔽膜20的最上面的剝離層28。Next, as shown in FIG. 2(c), the uppermost peeling layer 28 previously provided on the shielding film 20 is peeled off in the peeling layer peeling step.

接下來，如圖3(d)所示，在導電性接合劑接合步驟中，導電性接合劑30接合於屏蔽膜20的絕緣層21上。另外，在該步驟中，導電性接合劑30臨時接合於絕緣層21上。Next, as shown in FIG. 3(d), in the conductive bonding agent bonding step, the conductive bonding agent 30 is bonded to the insulating layer 21 of the shielding film 20. Further, in this step, the conductive bonding agent 30 is temporarily bonded to the insulating layer 21.

接下來，如圖3(e)所示，在加強部件接合步驟中，在導電性接合劑30上接合加強部件35。該接合過程中，一邊通過加熱器h加熱導電性接合劑30一邊由壓力機P通過緩衝材料60在上下方向將設置於印刷電路板10的屏蔽膜20和加強部件35壓合。由此，導電性接合劑30的接合劑31通過加熱器h的加熱而變軟，導電性粒子32通過壓力機P所施加的壓力從接合劑31突出。而且，從導電性接合劑30突出的導電性粒子32通過壓力機P所施加的壓力突破因加熱器h的加熱而變軟的絕緣層21，並且很快與導電層22接觸。另外，加熱器h的加熱溫度為150℃至190℃，壓力機P的壓力為2MPa至5MPa。另外，壓力機P進行加壓的時間為5分鐘至60分鐘。通過該步驟，在屏蔽膜20上設置加強部件35且加強部件35與屏蔽膜20的導電層22通過導電性粒子32被導通。由此，加強部件35與導電層22以及接地用電路圖案14保持等電位，可以使加強部件35也具有屏蔽效果。Next, as shown in FIG. 3(e), in the reinforcing member joining step, the reinforcing member 35 is joined to the conductive bonding agent 30. In the bonding process, while the conductive bonding agent 30 is heated by the heater h, the shielding film 20 and the reinforcing member 35 provided on the printed circuit board 10 are pressed by the presser P through the cushioning material 60 in the vertical direction. Thereby, the bonding agent 31 of the conductive bonding agent 30 is softened by the heating of the heater h, and the conductive particles 32 protrude from the bonding agent 31 by the pressure applied by the press P. Further, the conductive particles 32 protruding from the conductive bonding agent 30 break through the insulating layer 21 which is softened by the heating of the heater h by the pressure applied by the press P, and are quickly brought into contact with the conductive layer 22. Further, the heating temperature of the heater h is 150 ° C to 190 ° C, and the pressure of the press P is 2 MPa to 5 MPa. Further, the press P is pressurized for 5 minutes to 60 minutes. By this step, the reinforcing member 35 is provided on the shielding film 20, and the reinforcing member 35 and the conductive layer 22 of the shielding film 20 are electrically connected by the conductive particles 32. Thereby, the reinforcing member 35 and the conductive layer 22 and the grounding circuit pattern 14 are kept at the same potential, and the reinforcing member 35 can also have a shielding effect.

最後，如圖3(f)所示，在電子部件連接步驟中，在印刷電路板10下表面(圖中的下側表面)的安裝部位連接電子部件50。此時，在印刷電路板10的上表面(圖中的上側表面)配置屏蔽膜20的導電層22並且該導電層22覆蓋與電子部件50的安裝部位相對的區域的一部分或全部。由此，可以利用屏蔽膜20屏蔽由外部對電子部件50的安裝部位輻射的電磁波90b。另外，在屏蔽膜20的上表面(附圖中的上側表面)設置加強部件35並且其設置位置與電子部件50的安裝部位相對。由此，通過加強部件35的屏蔽效果可以更可靠地屏蔽由外部對電子部件50的安裝部位輻射的電磁波90b。Finally, as shown in FIG. 3(f), in the electronic component connecting step, the electronic component 50 is connected to the mounting portion of the lower surface (the lower surface in the drawing) of the printed circuit board 10. At this time, the conductive layer 22 of the shield film 20 is disposed on the upper surface (upper side surface in the drawing) of the printed circuit board 10 and the conductive layer 22 covers a part or all of the region opposed to the mounting portion of the electronic component 50. Thereby, the electromagnetic wave 90b radiated from the mounting portion of the electronic component 50 from the outside can be shielded by the shielding film 20. In addition, a reinforcing member 35 is provided on the upper surface (upper side surface in the drawing) of the shielding film 20 and is disposed at a position opposite to the mounting portion of the electronic component 50. Thereby, the electromagnetic wave 90b radiated from the mounting portion of the electronic component 50 by the outside can be more reliably shielded by the shielding effect of the reinforcing member 35.

另外，圖3(d)所示的導電性接合劑接合步驟以及圖3(e)所示的加強部件接合步驟中，先將導電性接合劑30貼於絕緣層21上，然後使加強部件35接合於導電性接合劑30。也可以先將加強部件35和導電性接合劑30接合，然後將接合體貼於絕緣層21上。但是，較之於使導電性接合劑30接合于加強部件35，使導電性接合劑30接合於絕緣層21時的密合性更好，因此，本實施例的製造方法的操作性好，易於製造。Further, in the conductive bonding agent bonding step shown in FIG. 3(d) and the reinforcing member bonding step shown in FIG. 3(e), the conductive bonding agent 30 is first attached to the insulating layer 21, and then the reinforcing member 35 is applied. Bonded to the conductive bonding agent 30. It is also possible to bond the reinforcing member 35 and the conductive bonding agent 30 first, and then attach the bonding body to the insulating layer 21. However, the adhesion of the conductive bonding agent 30 to the insulating layer 21 is better than that of bonding the conductive bonding agent 30 to the reinforcing member 35. Therefore, the manufacturing method of the present embodiment is easy to handle and easy to handle. Manufacturing.

(實施例和比較例)(Examples and Comparative Examples)

接下來，使用本實施例的屏蔽印刷電路板1的實施例和比較例來具體說明本發明。實施例以及比較例的詳細內容以及實驗結果示於圖4中。Next, the present invention will be specifically described using the embodiment and comparative example of the shielded printed circuit board 1 of the present embodiment. The details of the examples and comparative examples and the experimental results are shown in FIG.

如圖4所示，實施例1至5以及比較例1和2中使用具有與圖1所示的本發明實施例的屏蔽印刷電路板1相同結構的屏蔽印刷電路板，比較例3中使用具有與圖5所示的現有屏蔽印刷電路板100相同結構的屏蔽印刷電路板。更具體而言，對於加強部件和接地用電路圖案之間的連接形態，實施例1至5以及比較例1和2具有與本實施例的屏蔽印刷電路板1相同的連接形態，只有比較例3具有與現有屏蔽印刷電路板100相同的連接形態。在此，用於實施例以及比較例的印刷電路板10、110中，基底部件12、112的厚度為25μm，接地用電路圖案14、114、115的厚度為18μm，接合劑層13、113的厚度為25μm，絕緣膜11、111的厚度為12μm。另外，用於實施例以及比較例的屏蔽膜20、120中，導電材料23、123的厚度為10μm，導電層22、122的厚度為0.1μm，絕緣層21、121的厚度為5μm。另外，加強部件35、135使用具有導電性的被鍍鎳的不銹鋼材料，其厚度為0.2mm。As shown in FIG. 4, in Embodiments 1 to 5 and Comparative Examples 1 and 2, a shield printed circuit board having the same structure as that of the shield printed circuit board 1 of the embodiment of the present invention shown in FIG. 1 was used, and the use in Comparative Example 3 was used. A shield printed circuit board having the same structure as the conventional shield printed circuit board 100 shown in FIG. More specifically, in the connection form between the reinforcing member and the grounding circuit pattern, the first to fifth embodiments and the comparative examples 1 and 2 have the same connection form as the shield printed circuit board 1 of the present embodiment, and only the comparative example 3 It has the same connection form as the conventional shield printed circuit board 100. Here, in the printed circuit boards 10 and 110 used in the embodiments and the comparative examples, the thickness of the base members 12 and 112 is 25 μm, and the thickness of the ground circuit patterns 14, 114 and 115 is 18 μm, and the bonding layers 13 and 113 are formed. The thickness was 25 μm, and the thickness of the insulating films 11, 111 was 12 μm. Further, in the shielding films 20 and 120 used in the examples and the comparative examples, the thickness of the conductive materials 23 and 123 was 10 μm, the thickness of the conductive layers 22 and 122 was 0.1 μm, and the thickness of the insulating layers 21 and 121 was 5 μm. Further, the reinforcing members 35, 135 were made of a nickel-plated stainless steel material having conductivity and a thickness of 0.2 mm.

另外，實施例1至5以及比較例1、2中，使加強部件35接合於絕緣層21的導電性接合劑30的厚度為10μm，並如圖4所示那樣分別設置導電性粒子32的平均粒徑。另外，實施例的導電性粒子32的平均粒徑偏差為±5μm以內。例如，在實施例1中，導電性粒子32的平均粒徑為5μm，在加強部件35與絕緣層21接合的狀態下導電性接合劑30及導電性粒子32的厚度為10μm。在該實施例1中，由於導電性粒子32的平均粒徑(5μm)比導電性接合劑30的厚度(10μm)小，因此，導電性粒子32以埋於導電性接合劑30中的形式存在，接合狀態下的厚度(10μm)也與導電性接合劑30的厚度相同。另外，在實施例1中，由於即使考慮偏差，導電性粒子32的粒徑最大也是10μm，因此，導電性粒子32以埋於導電性接合劑30的形式存在。另外，例如，在實施例2中，導電性粒子32的平均粒徑為10μm，在加強部件35與絕緣層21接合的狀態下導電性接合劑30及導電性粒子32的厚度為10μm。在該實施例2中，導電性粒子32的平均粒徑(如果考慮偏差，則為15μm)比導電性接合劑30的厚度(10μm)大，導電性粒子32從導電性接合劑30突出的突出長度(5μm)與絕緣層21的厚度(5μm)相同。因此，如果考慮導電性粒子32的平均粒徑的偏差，則從導電性接合劑30突出的導電性粒子32恰好突破絕緣層21，並與其下的導電層22接觸。Further, in Examples 1 to 5 and Comparative Examples 1 and 2, the thickness of the conductive bonding agent 30 in which the reinforcing member 35 was bonded to the insulating layer 21 was 10 μm, and the average of the conductive particles 32 was separately provided as shown in FIG. 4 . Particle size. Further, the average particle diameter variation of the conductive particles 32 of the examples was within ±5 μm. For example, in the first embodiment, the average particle diameter of the conductive particles 32 is 5 μm, and the thickness of the conductive bonding agent 30 and the conductive particles 32 in the state where the reinforcing member 35 and the insulating layer 21 are joined is 10 μm. In the first embodiment, since the average particle diameter (5 μm) of the conductive particles 32 is smaller than the thickness (10 μm) of the conductive bonding agent 30, the conductive particles 32 exist in the form of being buried in the conductive bonding agent 30. The thickness (10 μm) in the joined state is also the same as the thickness of the conductive bonding agent 30. Further, in the first embodiment, since the particle diameter of the conductive particles 32 is at most 10 μm even when the variation is considered, the conductive particles 32 are present in the form of the conductive bonding agent 30. In the second embodiment, the conductive particles 32 have an average particle diameter of 10 μm, and the conductive bonding agent 30 and the conductive particles 32 have a thickness of 10 μm in a state where the reinforcing member 35 and the insulating layer 21 are joined to each other. In the second embodiment, the average particle diameter of the conductive particles 32 (15 μm in consideration of the variation) is larger than the thickness (10 μm) of the conductive bonding agent 30, and the conductive particles 32 protrude from the conductive bonding agent 30. The length (5 μm) is the same as the thickness (5 μm) of the insulating layer 21. Therefore, when the variation in the average particle diameter of the conductive particles 32 is considered, the conductive particles 32 protruding from the conductive bonding agent 30 just break through the insulating layer 21 and come into contact with the conductive layer 22 therebelow.

此外，如圖4所示，實施例1至5中導電性接合劑30的導電性粒子32的形狀為球狀。並且，比較例1中導電性接合劑30的導電性粒子32的形狀為薄片狀，比較例2中導電性接合劑30的導電性粒子32的形狀為樹枝狀。另外，比較例3中導電性接合劑130的導電性粒子的形狀被設定為樹枝狀。另外，所有實施例以及比較例中導電性粒子的混合量統一為50wt%。Further, as shown in FIG. 4, the conductive particles 32 of the conductive bonding agent 30 in the first to fifth embodiments have a spherical shape. Further, in Comparative Example 1, the shape of the conductive particles 32 of the conductive bonding agent 30 was a sheet shape, and in the comparative example 2, the shape of the conductive particles 32 of the conductive bonding agent 30 was a dendritic shape. Further, in Comparative Example 3, the shape of the conductive particles of the conductive bonding agent 130 was set to be dendritic. Further, the amounts of the conductive particles in all of the examples and the comparative examples were uniformly 50% by weight.

使用如上那樣設定的實施例以及比較例，測定加強部件和接地用電路圖案之間的連接電阻。此外，結合測定到的連接電阻的測量值和對回流步驟中耐回流性進行判斷所獲得的結果來作出綜合評價，在上述回流步驟中加熱溫度約為260℃。在此，對於加強部件和接地用電路圖案之間的連接電阻的測定值設立了如下的判定標準，即，小於0.5Ω時為“○”，大於等於0.5Ω且小於10.0Ω時為“△”，大於等於10.0Ω時為“×”。另外，關於耐回流性，根據安裝後的外觀檢測、屏蔽檢測等的電氣檢測，對合格與否進行判定並分別標示為“○”、“△”及“×”。The connection resistance between the reinforcing member and the grounding circuit pattern was measured using the examples and comparative examples set as described above. Further, a comprehensive evaluation was made in conjunction with the measured value of the measured connection resistance and the result of judging the reflow resistance in the reflow step, in which the heating temperature was about 260 °C. Here, the measurement value of the connection resistance between the reinforcing member and the grounding circuit pattern is set to a value of "○" when it is less than 0.5 Ω, and "△" when it is 0.5 Ω or more and less than 10.0 Ω. When it is greater than or equal to 10.0 Ω, it is “×”. In addition, regarding the reflow resistance, it is judged whether it is "○", "△", and "X" according to electrical detection such as appearance inspection and shielding detection after mounting.

其結果，關於耐回流性，在比較例3中由於產生了空隙而引起膨脹，通過外觀檢測等判定為不合格，即“×”。作為其理由可以認為：對於加強部件和接地用電路圖案之間的連接形態，由於比較例3具有與圖5所示的現有屏蔽印刷電路板100相同的連接形態，因此，在導電性接合劑130和接地用電路圖案115之間的連接部中產生了空隙。即，可以認為，現有的屏蔽印刷電路板100中，由於加強部件135與接地用電路圖案115之間的連接部上下用硬質材料夾住，因此，在貼附加強部件135時，導電性接合劑130未充分迎合孔部160的臺階。其結果，導致在導電性接合劑130和接地用電路圖案115之間的連接部發生了空隙160a、160b，該空隙因回流步驟的加熱而膨脹，從而發生如外觀不良、未保持屏蔽效果等缺陷。另外，關於實施例5，由於發生了若干空隙，導致在外觀檢測等中被判定為“△”。作為其理由可以認為：在實施例5的情況下，由於導電性粒子32的平均粒徑為30μm，導電性粒子32的平均粒徑相對於導電性接合劑30及絕緣層21的厚度過大，因此，導電性接合劑30和絕緣層21之間的間隙較大，從而可能導致發生若干空隙。As a result, in the comparative example 3, in the case of the reflow resistance, expansion occurred due to the occurrence of voids, and it was judged to be unacceptable by the appearance inspection or the like, that is, "x". The reason for this is considered to be that the connection form between the reinforcing member and the grounding circuit pattern is the same as that of the conventional shield printed wiring board 100 shown in FIG. 5, and therefore, the conductive bonding agent 130 is used. A gap is formed in the connection portion with the grounding circuit pattern 115. In other words, in the conventional shield printed wiring board 100, since the connection portion between the reinforcing member 135 and the grounding circuit pattern 115 is sandwiched by a hard material, the conductive bonding agent is applied when the strong member 135 is attached. 130 does not fully meet the steps of the hole portion 160. As a result, voids 160a and 160b are formed in the joint portion between the conductive bonding agent 130 and the grounding circuit pattern 115, and the void is expanded by the heating of the reflow step, thereby causing defects such as poor appearance and lack of shielding effect. . Further, in the fifth embodiment, since a certain number of voids occurred, it was judged as "Δ" in the appearance detection or the like. In the case of the fifth embodiment, the average particle diameter of the conductive particles 32 is 30 μm, and the average particle diameter of the conductive particles 32 is excessively large with respect to the thickness of the conductive bonding agent 30 and the insulating layer 21, so that it is considered that the average particle diameter of the conductive particles 32 is too large. The gap between the conductive bonding agent 30 and the insulating layer 21 is large, so that some voids may occur.

另一方面，實施例1至4以及比較例1、2中，由於加強部件和接地用電路圖案之間的連接形態是與本實施例的屏蔽印刷電路板1相同的連接形態，且也不存在導電性粒子32的平均粒徑過大的情況，因此，不存在如比較例3或者實施例5那樣的缺陷，耐回流性滿足標記為“○”的合格標準。On the other hand, in the first to fourth embodiments and the first and second embodiments, the connection form between the reinforcing member and the grounding circuit pattern is the same as that of the shielded printed circuit board 1 of the present embodiment, and does not exist. When the average particle diameter of the conductive particles 32 is too large, defects such as Comparative Example 3 or Example 5 do not exist, and the reflow resistance satisfies the acceptance criteria marked "○".

另外，關於加強部件和接地用電路圖案之間的連接電阻，實施例2至5以及比較例3滿足“○”標準，實施例1為“△”，比較例1、2為“×”。作為其理由可以認為：由於比較例1、2中導電性粒子為薄片狀或者樹枝狀，因此，由於導電性粒子的傾斜狀態而導致不能突破絕緣層21，不能將加強部件35保持為接地電位。另外，在實施例1中，導電性粒子32的平均粒徑即使考慮其存在的偏差也和導電性接合劑30的厚度相同或者比導電性接合劑30的厚度小，因此，導電性粒子32從導電性接合劑30突出得少，因而很難與導電層22接觸。Further, in the connection resistance between the reinforcing member and the grounding circuit pattern, Examples 2 to 5 and Comparative Example 3 satisfy the "○" standard, Example 1 is "Δ", and Comparative Examples 1 and 2 are "X". The reason for this is considered to be that the conductive particles in the comparative examples 1 and 2 have a sheet shape or a dendritic shape. Therefore, the insulating layer 21 cannot be broken due to the inclined state of the conductive particles, and the reinforcing member 35 cannot be maintained at the ground potential. Further, in the first embodiment, the average particle diameter of the conductive particles 32 is the same as or smaller than the thickness of the conductive bonding agent 30 in consideration of variations in the presence of the conductive particles 32. Therefore, the conductive particles 32 are The conductive bonding agent 30 protrudes less, and thus it is difficult to contact the conductive layer 22.

另一方面，在實施例2至5中，相對於導電性接合劑30的厚度與絕緣層21的厚度，導電性粒子32的平均粒徑適當，因此，加強部件35與導電層22的導通狀態穩定。其結果，加強部件35與接地用電路圖案14的連接電阻能夠維持在0.5Ω以下。另外，比較例3中，雖然在導電性接合劑130和接地用電路圖案115的連接部產生了空隙160a、160b，但是，加強部件135與接地用電路圖案115的導通狀態通過樹枝狀的導電性接合劑130而被保持，從而可以將加強部件135與接地用電路圖案115的連接電阻維持在0.5Ω以下。On the other hand, in the second to fifth embodiments, the average particle diameter of the conductive particles 32 is appropriate with respect to the thickness of the conductive bonding agent 30 and the thickness of the insulating layer 21, and therefore, the conduction state of the reinforcing member 35 and the conductive layer 22 is made. stable. As a result, the connection resistance between the reinforcing member 35 and the grounding circuit pattern 14 can be maintained at 0.5 Ω or less. Further, in the comparative example 3, the gaps 160a and 160b are formed in the connection portion between the conductive bonding agent 130 and the grounding circuit pattern 115, but the conduction state of the reinforcing member 135 and the grounding circuit pattern 115 passes through the dendritic conductivity. The bonding agent 130 is held, so that the connection resistance between the reinforcing member 135 and the grounding circuit pattern 115 can be maintained at 0.5 Ω or less.

根據以上的實驗結果，如果以“○”、“△”、“×”對加強部件和接地用電路圖案的連接電阻的判定以及耐回流性的判定進行綜合評價，則評價結果如下：實施例2至4為“○”，實施例1、5為“△”，比較例1至3為“×”。根據該結果可知，如果使用本實施例的屏蔽印刷電路板1中的加強部件35與接地用電路圖案14的連接形態，則耐回流性滿足“△”以上的合格標準。而且，根據該結果可知，在本實施例的屏蔽印刷電路板1中，如果從導電性接合劑30突出的導電性粒子32與導電層22接觸，那麼加強部件與接地用電路圖案的連接電阻滿足“△”以上的合格標準。另外，根據該結果還可知，如果與導電性接合劑30以及絕緣層21的厚度相比導電性粒子32的平均粒徑適當並且導電性接合劑30和絕緣層21之間產生的縫隙即使考慮偏差的情況下也不會超過10μm(實施例4中的情況)，那麼，連接電阻和耐回流性也都為良好的結果，綜合評價中滿足“○”的合格標準。According to the above experimental results, if the determination of the connection resistance of the reinforcing member and the grounding circuit pattern and the determination of the backflow resistance are comprehensively evaluated by "○", "△", and "X", the evaluation results are as follows: Example 2 4 to "○", Examples 1 and 5 are "Δ", and Comparative Examples 1 to 3 are "X". According to the results, when the connection form of the reinforcing member 35 and the grounding circuit pattern 14 in the shield printed wiring board 1 of the present embodiment is used, the reflow resistance satisfies the acceptance criteria of "Δ" or more. Further, according to the results, in the shield printed circuit board 1 of the present embodiment, when the conductive particles 32 protruding from the conductive bonding agent 30 are in contact with the conductive layer 22, the connection resistance of the reinforcing member and the grounding circuit pattern is satisfied. Eligibility criteria above "△". Further, according to the results, it is understood that the average particle diameter of the conductive particles 32 is appropriate as compared with the thickness of the conductive bonding agent 30 and the insulating layer 21, and the gap generated between the conductive bonding agent 30 and the insulating layer 21 is considered even if the deviation is considered. In the case of not exceeding 10 μm (in the case of Example 4), the connection resistance and the reflow resistance were also good results, and the acceptance criteria of "○" were satisfied in the comprehensive evaluation.

以上，說明了本發明的實施例。另外，本發明並不限於上述實施例。The embodiments of the present invention have been described above. Further, the present invention is not limited to the above embodiment.

例如，本實施例的屏蔽印刷電路板1中，通過從導電性接合劑30突出的導電性粒子32的突出部突破絕緣層21，使得加強部件35接觸與接地用電路圖案14等電位的導電層22。也可以使用其他方法使加強部件35和導電層22保持等電位。例如，可以使用鐳射等在絕緣層21的表面形成用於使導電層22暴露在外的多個孔部，在其上貼附包含樹枝狀導電性粒子的導電性接合劑，由此，使導電性粒子流入該孔部，使導電性粒子和導電層22接觸。由此，可以通過導電性接合劑使加強部件35和導電層22保持等電位，上述導電性接合劑包含填充于孔部的樹枝狀導電性粒子。For example, in the shield printed circuit board 1 of the present embodiment, the protruding portion of the conductive particles 32 protruding from the conductive bonding agent 30 breaks through the insulating layer 21, so that the reinforcing member 35 contacts the conductive layer having the same potential as the grounding circuit pattern 14. twenty two. Other methods can also be used to maintain the stiffening member 35 and the conductive layer 22 at an equal potential. For example, a plurality of holes for exposing the conductive layer 22 to the surface of the insulating layer 21 may be formed by laser or the like, and a conductive bonding agent containing dendritic conductive particles may be attached thereto, thereby making conductivity The particles flow into the hole portion to bring the conductive particles into contact with the conductive layer 22. Thereby, the reinforcing member 35 and the conductive layer 22 can be held at the same potential by the conductive bonding agent, and the conductive bonding agent includes the dendritic conductive particles filled in the hole portion.

以上，對本發明的實施例進行了說明，然而這僅僅是對實施例進行示例性說明，並不是對本發明的特別限制，對於具體的構成等可以進行適當的設計變更。另外，實施例中描述的作用及效果僅僅列舉了由本發明產生的最優作用及效果，本發明所產生的作用及效果並不限於實施例的描述。The embodiments of the present invention have been described above, but the embodiments are merely illustrative, and the present invention is not particularly limited, and appropriate design changes can be made to specific configurations and the like. In addition, the functions and effects described in the embodiments are merely illustrative of the optimal effects and effects produced by the present invention, and the actions and effects produced by the present invention are not limited to the description of the embodiments.

工業可利用性Industrial availability

本發明可以適用於攜帶型電話、電腦等電子設備所使用的屏蔽印刷電路板。The invention can be applied to a shielded printed circuit board used in electronic devices such as portable telephones and computers.

1．．．屏蔽印刷電路板1. . . Shielded printed circuit board

10．．．印刷電路板10. . . A printed circuit board

11．．．絕緣膜11. . . Insulating film

12．．．基底部件12. . . Base part

13．．．接合劑層13. . . Adhesive layer

14．．．接地用電路圖案14. . . Grounding circuit pattern

20．．．屏蔽膜20. . . Shielding film

21．．．絕緣層twenty one. . . Insulation

22．．．導電層twenty two. . . Conductive layer

23．．．導電材料twenty three. . . Conductive material

30．．．導電性接合劑30. . . Conductive bonding agent

31．．．接合劑31. . . Adhesive

32．．．導電性粒子32. . . Conductive particles

35．．．加強部件35. . . Reinforcement

40．．．孔部40. . . Hole

50．．．電子部件50. . . Electronic components

90a．．．電磁波90a. . . Electromagnetic wave

90b．．．電磁波90b. . . Electromagnetic wave

圖1是本實施例的屏蔽印刷電路板的局部剖面圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a partial cross-sectional view showing a shield printed circuit board of the present embodiment.

圖2(a)是表示本實施例的屏蔽印刷電路板的製造方法中孔部形成步驟的圖。圖2(b)是表示本實施例的屏蔽印刷電路板的製造方法中屏蔽膜接合步驟的圖。圖2(c)是表示本實施例的屏蔽印刷電路板的製造方法中屏蔽膜的剝離層剝離步驟的圖。Fig. 2 (a) is a view showing a step of forming a hole portion in the method of manufacturing the shield printed wiring board of the embodiment. Fig. 2 (b) is a view showing a step of joining the shielding films in the method of manufacturing the shield printed wiring board of the present embodiment. Fig. 2 (c) is a view showing a peeling layer peeling step of the shielding film in the method of manufacturing the shield printed wiring board of the embodiment.

圖3(d)是表示本實施例的屏蔽印刷電路板的製造方法中導電性接合劑接合步驟的圖。圖3(e)是表示本實施例的屏蔽印刷電路板的製造方法中加強部件接合步驟的圖。圖3(f)是表示在本實施例的屏蔽印刷電路板上連接電子部件的電子部件連接步驟的圖。Fig. 3 (d) is a view showing a step of bonding a conductive bonding agent in the method of manufacturing a shield printed wiring board of the present embodiment. Fig. 3 (e) is a view showing a step of joining the reinforcing members in the method of manufacturing the shield printed wiring board of the embodiment. Fig. 3 (f) is a view showing a step of connecting electronic components to which electronic components are connected in the shield printed circuit board of the embodiment.

圖4是表示使用本實施例的屏蔽印刷電路板的實施例以及比較例所獲得的實驗結果的圖。Fig. 4 is a view showing experimental results obtained by using the examples and comparative examples of the shield printed circuit board of the present embodiment.

圖5是現有屏蔽印刷電路板的局部剖面圖。Figure 5 is a partial cross-sectional view showing a conventional shield printed circuit board.

1．．．屏蔽印刷電路板1. . . Shielded printed circuit board

10．．．印刷電路板10. . . A printed circuit board

11．．．絕緣膜11. . . Insulating film

12．．．基底部件12. . . Base part

13．．．接合劑層13. . . Adhesive layer

14．．．接地用電路圖案14. . . Grounding circuit pattern

20．．．屏蔽膜20. . . Shielding film

21．．．絕緣層twenty one. . . Insulation

22．．．導電層twenty two. . . Conductive layer

23．．．導電材料twenty three. . . Conductive material

30．．．導電性接合劑30. . . Conductive bonding agent

31．．．接合劑31. . . Adhesive

32．．．導電性粒子32. . . Conductive particles

35．．．加強部件35. . . Reinforcement

40．．．孔部40. . . Hole

50．．．電子部件50. . . Electronic components

90a．．．電磁波90a. . . Electromagnetic wave

90b．．．電磁波90b. . . Electromagnetic wave

Claims

一種屏蔽印刷電路板，包括：印刷電路板，包括：基底部件，形成有接地用電路圖案；以及絕緣膜，設置於上述基底部件上並覆蓋上述接地用電路圖案，並且，在設置於上述基底部件的下表面的安裝部位連接有電子部件；屏蔽膜，設置於上述印刷電路板上，上述屏蔽膜包括：導電層，與上述接地用電路圖案等電位，被配置於上述印刷電路板的上表面並且覆蓋與上述安裝部位相對的區域的一部分或全部；以及絕緣層，設置於上述導電層上；以及加強部件，具有導電性，並設置於上述屏蔽膜上與上述安裝部位相對的區域，其特徵在於：上述加強部件通過導電性接合劑接合於上述絕緣層上，上述導電性接合劑包含球狀的導電性粒子，上述絕緣層的層厚小於上述導電性粒子在上述導電性接合劑與上述絕緣層接合的狀態下從上述導電性接合劑突出的突出長度，上述導電性粒子在上述導電性接合劑與上述絕緣層接合的狀態下與上述導電層接觸。A shield printed circuit board comprising: a printed circuit board comprising: a base member formed with a grounding circuit pattern; and an insulating film disposed on the base member and covering the grounding circuit pattern, and disposed on the base member An electronic component is connected to the mounting portion of the lower surface; the shielding film is disposed on the printed circuit board, and the shielding film includes a conductive layer disposed on the upper surface of the printed circuit board at a potential equal to the grounding circuit pattern and Covering a part or all of a region facing the mounting portion; and an insulating layer disposed on the conductive layer; and a reinforcing member having electrical conductivity and disposed on the shielding film at a region opposing the mounting portion, wherein The reinforcing member is bonded to the insulating layer by a conductive bonding agent, wherein the conductive bonding agent includes spherical conductive particles, and the insulating layer has a layer thickness smaller than that of the conductive particles in the conductive bonding agent and the insulating layer. The protruding length protruding from the above-mentioned conductive bonding agent in the joined state The conductive particles are in contact with the conductive layer in a state where the conductive adhesive and bonded to the insulating layer.

如申請專利範圍第1項所述的屏蔽印刷電路板，其中，上述加強部件還與外部的接地用部件連接，其中，上述外部的接地用部件與上述接地用電路圖案保持等電位。The shield printed circuit board according to claim 1, wherein the reinforcing member is further connected to an external grounding member, wherein the external grounding member and the grounding circuit pattern are kept at the same potential.

如申請專利範圍第1項所述的屏蔽印刷電路板，其中，上述屏蔽膜的上述絕緣層塗布於上述導電層上。The shield printed circuit board according to claim 1, wherein the insulating layer of the shielding film is coated on the conductive layer.

如申請專利範圍第2項所述的屏蔽印刷電路板，其中，上述屏蔽膜的上述絕緣層塗布於上述導電層上。The shield printed circuit board according to claim 2, wherein the insulating layer of the shielding film is coated on the conductive layer.

如申請專利範圍第1至4項中任一項所述的屏蔽印刷電路板，其中，上述加強部件由不銹鋼材料形成。The shield printed circuit board according to any one of claims 1 to 4, wherein the reinforcing member is formed of a stainless steel material.