TWI501161B - 支援混合卡之射頻辨識裝置及其製造方法 - Google Patents
支援混合卡之射頻辨識裝置及其製造方法 Download PDFInfo
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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Description
本發明係關於被設計成內建在傳通物件中的射頻辨識裝置,並且係明確地關於一種用於混合卡之射頻辨識裝置支座以及其製造方法。
非接觸式射頻辨識裝置(RFID)係已經逐漸用於辨識在管制出入區附近移動的人或是用來辨識從一區移動至另一區的人。一非接觸式射頻辨識裝置係為一由一天線及被連接至該天線之終端的一晶片所組成的裝置。該晶片通常不會被供電,而且係藉由讀取器的天線與射頻辨識裝置的天線之間的電磁耦合來接收其能量。資訊係在該射頻辨識裝置與該讀取器之間進行交換,並且該晶片中所儲存之資訊特別係關於辨識其上設置著該射頻辨識裝置之物件的持有人、以及關於他/她進入一管制出入區的授權。
混合型接觸-非接觸式智慧卡係含有此一RFID,除了與讀取器之資料交換係亦能藉由該卡上所連接至晶片的齊平(flush)和傳導接觸銲墊而發生。該晶片因此係被整合至一電路中,該電路之外表面的特徵係在於齊平式接點群。該晶片係亦被連接至該電路之內表面,經設計以連接至該卡的天線。因此,該晶片係被連接至一雙面電路之兩側以在經過囊封時形成一雙面積體電路模組。一般來說,用於製作接觸-非接觸混合型智慧卡之方法係包含下述步驟:
-該天線在一支座上的一製作步驟;
-用於將卡片本體層疊至該天線之支座上的步驟,其係包含在該支座之各側上藉由一熱壓塑模技術予以銲接於形成該等卡片本體之至少兩張塑膠材料薄片;
-一空腔銑削步驟,其係包含在該等卡片本體之一者中穿透一空腔以外罩由該晶片和該雙面電路所組成的模組,該空腔係包含用以容納該晶片之一較小內部部分和用以容納該雙面電路之一較大內部部分和,此銑削作用係使該等接點能被移動離開該晶片;以及
-一模組***步驟,其係包含使用一黏膠以牢固該模組和使用一傳導黏膠以將該模組連接至該等接點,且予以置放在為此目的所提供之空腔中。
然而,因為該模組之連接在最後的製作步驟過程業已完成,所此製作步驟係未提供所配備有經連接一起之模組和天線的一半完成品。所配備有經連接一起之模組和天線的此半完成品係將允許不是電子專精之製造商藉由完成該些產品來製造且客製化混合型智慧卡。
再者,該模組銑削和***步驟係一次一次被實行在單一卡片上,其係代表相對效率的不利因素。
存有多種用於產生RFID之方法,該RFID係包含在一支座上經連接一起的一天線合一晶片,所取得之組件一般係被稱為鑲嵌件(inlay)。亦為已知的是:此等鑲嵌件係針對具有一銅質天線之混合型接觸-非接觸式智慧卡而藉由包含下述步驟之一方法來產生:
-該天線在一支座上的一製作步驟,該支座係在該天線的接點之間處設有一凹部;
-將該模組引入該支座中相對來支撐該天線之側面上的凹部內的一步驟;
-將該模組連接至該天線之接點的一步驟;
-將一疊層膠黏在該天線上以便將該天線埋置於該鑲嵌件的一步驟。
上述製程之不利因素係存在於該天線和該晶片之間的連接之複雜實施例。實際上,該方法之此步驟係包括一組次要步驟,其係包含:在該天線之支座的厚度中產生與該天線之接點一致的一連接凹痕;以一傳導材料來填充該些井部,以便在該天線的接點和該雙面電路的內部接點之間製作穿過該支座之厚度的一可靠電氣連接。再者,依據此方法所製作之鑲嵌件係包含至少兩層剛性層,其間係被該天線所***。
這就是為何本發明之目的係在於藉由提供一RFID支座或可撓性「鑲嵌件」來對抗前述不利因素,其中該RFID支座或可撓性「鑲嵌件」之特徵在於經連接至一天線的一雙面積體電路。
本發明之另一目的係在於提供整合有此一支座之混合型接觸-非接觸式智慧卡。
本發明之一目的因此係為一種用於製造一射頻辨識裝置(RFID)支座的方法,該RFID支座之特徵在於一天線和一雙面積體電路模組,該雙面積體電路模組之特徵在於內部接點和外部接點,其中經連接至一模組中所殼裝之一晶片,該方法係包含下述步驟:
-將具有接點之天線印刷在一支座上;
-在該天線的接點之間產生一凹部;
-將一膠黏薄膜黏貼在該模組之內表面上,藉由將在該等內部接點之位置處的兩個凹部予以穿透;
-將該模組置放在該支座之天線側上,且使得該模組之內部接點相對該天線之接點,且該晶片之囊封體係位於該凹部中;
-將該支座層和該模組層疊一起,以至於膠黏該模組且藉由使該天線之接點發生變形來將該模組連接至該天線,其中係以該膠黏薄膜來填充該等凹部且抵靠該模組之內部接點。
根據圖1,一雙面積體電路模組10係包括一晶片15,其係被置放在非導電性的支座11。該晶片係被連接至兩個內部接點13和14且至外部接點12,以行成日後與卡片之表面齊平的接點。該等內部接點13、14和外部接點12係位於該支座11的任一側面上。在該晶片與該群內部和外部接點之間的連接係藉由傳導性銲線或連接纜線16和17(被稱作為「銲線接合」)所製成。該晶片15及該等銲線係被殼裝在一電阻材料型保護樹脂18,其係不傳導電力。囊封體18在某種程度上係為包圍該晶片及其配線之一硬固殼層,以為使該晶片較不脆弱且易於處理。該囊裝體係具有介於200和240微米(μm)之間的一厚度。該模組因而在其上部面部上係呈現一對應於該囊裝體18之上部部分的平坦表面,且在該囊裝體18之基底處,該等接點13和14係經設計成連接至一電路該天線的接點。該等接點13和14係由傳導性材料製成,且它們的厚度係介於70和100微米之間。
一天線係被製作在一支座層40上。該天線42之特徵係在於一或更多線圈集合和至少兩個接點43和44。該等線圈和該等接點係藉由以裝載有傳導性粒子(諸如:例如銀質或金質)之環氧樹脂型傳導性油墨或以一傳導性聚合物進行網板印刷(screen printing)、彈性凸板印刷(flexography)、輪轉凹板印刷(rotogravure)、平板印刷(offset printing)或噴墨印刷(inkjet printing)而被製成。依據一個實施例,用於該天線之接點的油墨係由一可撓性油墨所製作。該支座層40較佳係由一非潛變材料(亦即:不會在溫度之效應下發生變形的一材料)或可行的其它材料所製成,該非潛變材料係諸如紙張或合成紙張(Teslin型),而該其它材料係諸如聚碳酸酯(polycarbonate)、PET或聚氯乙烯(PVC)。該支座層40之特徵係一凹部41,該凹部41之維度係對應該模組10之囊封體18的維度。在製造方法的此步驟中,構成該天線之油墨係未被烘烤,亦即:該油墨並未經過加熱或加壓處理。然而,該油墨係乾燥的。
該模組之膠黏步驟係被同時實行。根據圖3,該模組一般係以一捲狀物100之形式被封裝附接一起,其之一部分被呈現在圖3中。呈現薄膜形式之黏膠的一捲狀物100係被展開成該模組10之內表面,其中黏膠的寬度係等效於該模組之捲狀物。一膠黏薄膜係被孔洞113和114所穿透,該等孔洞113和114係對應該模組之內部接點13和14的位置。該膠黏薄膜係一種非可逆的可熱熔接型(thermofusible)黏膠,其意謂一旦於某一溫度處予以硬化,則該膠黏薄膜之狀態係即使再次遭遇到相同溫度也不會發生改變。該膠黏薄膜係藉由在低於其聚合作用溫度之一溫度處以一預先層疊步驟來施加至該模組,該聚合作用溫度係不可逆地硬化該黏膠。該模組之內表面係因而被覆蓋著一膠黏薄膜,然而該等內部接點13和14之位置(其中薄膜被兩個孔洞113和114所穿透)除外。
該模組接著係被置放在該支座40之一凹部41中,使得該等內部接點13和14係位於相對該天線之接點43和44的位置處。該等接點之厚度係介於5和10微米之間。
為促進該模組相對該支座40上之預知位置的置放且予以保護,由一硬性且抗壓材料所製成之一平板80係具有一凹部81,該凹部81係對應該模組之印痕,該印痕係被置放在該模組之外表面上、因而在該模組之齊平接點上且寬度係對應該模組中於該等內部接點13和14之位置處的高度。介於200和240微米之間的此厚度係取決於模組類型。在該等外部接點12上之模組係被置放在該凹部81中,使得該模組之內部接點13和14係可見且可存取。該平板80係一種工具且在後隨層疊步驟過程中使用作為一下部層疊平板。該平板80係能含有複數個凹部81,以供一次產生數張卡片。在此案例中,以一大型薄片之形式的支座層40係亦含有相同數量的天線。依據一個實施例,在該下部層疊平板中之凹部81係設有一磁體,該磁體係經設計以在實施該方法期間保持該模組。
該方法之下述步驟係包含一初步層疊,以允許該模組能被連接至該天線。
依據一第一實施範例,該RFID支座係具有單一疊層40之形式。該層疊步驟係在於使所有疊層遭受高達150度的一溫度增加及從0.5巴至高達數巴(其係對應近似10 N/m2
)的一壓力增加、而隨之在後為減少溫度和壓力,其中整體係依據限定期間的一組循環。在層疊期間,一上部層疊平板90係亦被置放在該疊層40和該模組的上部。依此方式且由於層疊平板80和90,該壓力係被均勻散佈且被施加在整個疊層40上。由於壓力和溫度的增加,該天線之接點43和44係變形且填充該膠黏薄膜之空腔113和114,直到抵靠該模組之內部接點13和14。因此,由於該天線之接點的油墨發生變形和擠壓且其接合至該模組之接點13和14,所以在該模組的內部接點13和14與接點43和44的傳導性油墨之間的一最大接觸表面上係存有一緊密接觸。在該模組和該天線之間的電氣連接係被製成。再者,在溫度和壓力增加期間,該膠黏薄膜110係些許軟化以便相符於在該天線的接點和該模組的內部接點之間所製作的連接。由於溫度減低,所以該膠黏薄膜係硬化且維持該模組和該天線的接點之間的連接。所達到之溫度係使得該黏膠達到其非可逆性的臨界,亦即:此黏膠係即使在被加熱到一對等或較高溫度時也不會發生軟化。依據一個實施範例,該上部層平板90係被設有突出部93和94。該些突出部係位於平板90上,使得在該第一層疊步驟過程中,該些突出部係垂直對齊於該天線之接點43和44及該膠黏薄膜中的凹部113和114。在該第一層疊步驟過程中,該等突出部係透過疊層50和40來按壓該等接點43和44,以便使該等接點發生變形且被壓印入該膠黏薄膜中的凹部113和114。
該等接點之傳導性油墨係可變形卻不具彈性,該天線之接點即使在釋放該壓力時仍然不傾向回歸它們原來的形狀。一混合型接觸-非接觸式智慧卡之鑲嵌件係如此取得,其中該模組相對該天線支座係為突顯。
依據一第二實施範例,一PVC層50係在該第一層疊步驟之前先被置放在該支座層40中相對其上印刷有該天線之表面的表面上。在該層疊期間,此疊層係軟化且將本身銲接至該天線的支座層40。
所產生之射頻辨識裝置支座或鑲嵌件52係具有570微米之一總厚度(+/- 10%),其中的220微米係對應該模組相對該天線之支座層的突出部分。
該混合型接觸-非接觸式智慧卡係在一第二層疊步驟之後而被完成,該第二層疊步驟係包含施加壓力且加熱。兩疊層60和70係被置放在依據前述製造方法中任一者所取得之鑲嵌件52的任一側面上。兩個卡片本體60和70之外表面係事先被印刷有對該卡片客制化的圖形影像。所置放在該天線上且該模組10之外表面上的卡片本體70係被一凹部71所穿透,該凹部71係對應該模組之外部接點12的尺寸。該凹部71之形狀係使得可匹配該模組10之外表面的邊緣。一熱壓鑄模技術係被用來將兩個卡片本體60和70銲接至該鑲嵌件52之兩個表面上,其中兩個卡片本體60和70係具有等於大約160微米之一厚度。此步驟係更像是膠黏作用而非銲接作用。據此,在此階段中所需之壓力和溫度係遠低於該第一層疊步驟所使用之壓力和溫度。此層疊步驟所需之溫度和壓力係分別不超過大約120度和150巴。再者,加壓和溫度循環之期間係亦被降低。
各個卡片本體60和70係由一疊層或更多疊層所組成。當超過卡片本體具有超過一層的疊層時,該些疊層係能在層疊製程期間被膠黏一起在該鑲嵌件上。
所使用於該等疊層40、50、60及70的材料係可為聚氯乙烯(PVC)、聚酯(聚对苯二甲酸乙二酯(PET)、二醇類改質聚对苯二甲酸乙二酯(PETG))、聚丙烯(PP)、聚碳酸酯(polycarbonate,PC)、丙烯腈-丁二烯-苯乙烯共聚物(acrylonitrile-butadiene-styrene,ABS)或一聚胺甲酸酯(polyurethane,PU)薄膜、諸如Teslin之一紙張或合成紙張。
10...雙面積體電路模組
11...非導電性的支座
12...外部接點
13,14...內部接點
15...晶片
16,17...傳導性銲線/連接纜線
18...電阻材料型保護樹脂/囊封體
40...支座層
41...凹部
42...天線
43,44...(天線)接點
50...疊層
52...鑲嵌件/RFID支座
60,70...疊層/卡片本體
71,81...凹部
80,90...層疊平板
93,94...突出部
100...捲狀物
110...捲狀物/膠黏薄膜
113,114...孔洞/空腔
從上文說明在配合後附圖式時,本發明之目的、目標以及特徵係業已變為更加顯明,其中:
圖1係代表依據本發明一第一實施例中用於第一層疊之「鑲嵌件」和工具的各種構件之一橫截面視圖;
圖2係代表依據本發明一第二實施例中用於第一層疊之「鑲嵌件」和工具的各種構件之一橫截面視圖;
圖3係代表該模組所置放在一條帶上的黏貼圖;
圖4係代表依據本發明中組成混合型接觸-非接觸式智慧卡之各種層的一橫截面視圖。
在前述說明中,被稱作為「鑲嵌件」之裝置係指稱在現階段能藉由接觸或位在遠端而與適當讀取器進行通訊之混合型接觸-非接觸式智慧卡的射頻辨識裝置(RFID)支座。
10...雙面積體電路模組
11...非導電性的支座
12...外部接點
13,14...內部接點
15...晶片
16,17...傳導性銲線/連接纜線
18...電阻材料型保護樹脂/囊封體
40...支座層
41...凹部
42...天線
43,44...(天線)接點
80,90...層疊平板
81...凹部
93,94...突出部
Claims (14)
- 一種用於製造一射頻辨識裝置(RFID)支座(52)的方法,該RFID支座(52)之特徵在於一天線(42)和一雙面積體電路模組(10),該雙面積體電路模組之特徵在於連接至一殼裝於該雙面積體電路模組中之晶片(15)的內部接點(13,14)和外部接點(12),該方法包含下述步驟:- 將具有接點(43和44)之該天線(42)印刷在一支座層(40)上;- 在該天線的該等接點(43和44)之間產生一凹部(41);- 將一膠黏薄膜(110)黏貼在該雙面積體電路模組之內表面上,其藉由在該雙面積體電路模組之該等內部接點(13,14)的位置的兩個凹部(113,114)穿透;- 將該雙面積體電路模組置放在該支座層(40)之該天線側上,且使得該雙面積體電路模組之該等內部接點對著該天線之該等接點,且使得該晶片之囊封體(18)係位於該凹部中;以及- 將該支座層(40)和該雙面積體電路模組層疊在一起以膠黏該雙面積體電路模組,且藉由使該等天線接點(43,44)發生變形來將該雙面積體電路模組連接至該天線,其中該等接點(43,44)係填充該等凹部(113,114)且抵靠該雙面積體電路模組之該等內部接點(13,14);- 將該射頻辨識裝置支座(52)***一包含兩個疊層 (60和70)的卡片本體內,該卡片本體中位於該天線的側面上的一個疊層(70)係被一凹部(71)所穿透,該凹部(71)係對應於該雙面積體電路模組之該外部接點(12)的尺寸;以及- 使所有疊層(60、52、和70)遭受一包含施加壓力及熱力之另一層疊製程,以至於將該等疊層膠黏一起。
- 如申請專利範圍第1項之方法,其中所黏貼在該雙面積體電路模組上之該膠黏薄膜(110)係非可逆的可熱熔接型(thermofusible)黏膠。
- 如申請專利範圍第1項之方法,其中該支座層(40)係由一不發生潛變之材料來製作,亦即其在溫度增加時不會發生變形。
- 如申請專利範圍第1項之方法,其中該天線42係使用傳導性油墨進行網板型印刷來製作。
- 如申請專利範圍第1項之方法,其中在該層疊步驟過程中所使用之一工具係包含一設有一凹部(81)之層疊平板(80),其中該雙面積體電路模組之外表面係被置放為抵靠該層疊平板,並且使得該雙面積體電路模組之該等內部接點為可見且可存取。
- 如申請專利範圍第5項之方法,其中該凹部(81)具有一厚度係對應該雙面積體電路模組在該等內部接點(13和14)之位置處的厚度。
- 如申請專利範圍第5項之方法,其中在該層疊步驟過程中所使用之一工具係包含一設有突出部(93,94)之上 部層疊平板(90),該些突出部係在該第一層疊步驟過程中垂直位於該天線之接點(43,44)及該膠黏薄膜的凹部(113,114)上方。
- 一種用於製造一射頻辨識裝置(RFID)支座(52)的方法,該RFID支座(52)之特徵在於一天線(42)和一雙面積體電路模組(10),該雙面積體電路模組之特徵在於連接至一殼裝於該雙面積體電路模組中之晶片(15)的內部接點(13,14)和外部接點(12),該方法係包含下述步驟:- 將具有接點(43和44)之該天線(42)印刷在一支座層(40)上;- 在該天線的該等接點(43和44)之間產生一凹部(41);- 將一膠黏薄膜(110)黏貼在該雙面積體電路模組之內表面上,其藉由在該雙面積體電路模組之該等內部接點(13,14)的位置的兩個凹部(113,114)穿透;- 將該雙面積體電路模組置放在該支座層(40)之該天線側上,且使得該雙面積體電路模組之該等內部接點相對著該天線之該等接點,且使得該晶片之囊封體(18)係位於該凹部中;- 將一疊層(50)置放在該支座層上印刷有該天線之一面的反面上;- 將該疊層(50)、該支座層(40)和該雙面積體電路模組層疊一起,以至於膠黏該雙面積體電路模組,並且 藉由使填充該等凹部(113,114)且抵靠該雙面積體電路模組之內部接點(13,14)的天線接點(43,44)發生變形來將該雙面積體電路模組連接至該天線;- 將該射頻辨識裝置支座(52)***一包含兩個疊層(60和70)的卡片本體內,該卡片本體中位於該天線的側面上的一個疊層(70)係被一凹部(71)所穿透,該凹部(71)係對應於該雙面積體電路模組之該外部接點(12)的尺寸;以及- 使所有疊層(60、52、和70)遭受一包含施加壓力及熱力之另一層疊製程,以至於將該等疊層膠黏一起。
- 如申請專利範圍第8項之方法,其中該黏貼在該雙面積體電路模組上之膠黏薄膜(110)係非可逆的可熱熔接型黏膠。
- 如申請專利範圍第8項之方法,其中該支座層(40)係由一不發生潛變之材料來製作,亦即其在溫度增加時不會發生變形。
- 如申請專利範圍第8項之方法,其中該天線42係使用傳導性油墨進行網板型印刷來製作。
- 如申請專利範圍第8項之方法,其中在該層疊步驟過程中所使用之一工具係包含一設有一凹部(81)之層疊平板(80),其中該雙面積體電路模組之外表面係被置放為抵靠該平板,並且使得該雙面積體電路模組之該等內部接點為可見且可存取。
- 如申請專利範圍第12項之方法,其中該凹部(81) 具有一厚度係對應該雙面積體電路模組在該等內部接點(13和14)之位置處的厚度。
- 如申請專利範圍第12項之方法,其中在該層疊步驟過程中所使用之一工具係包含一設有突出部(93,94)之上部層疊平板(90),該些突出部係在該第一層疊步驟過程中垂直位於該天線之接點(43,44)及該膠黏薄膜的凹部(113,114)上方。
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US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
WO2018022755A1 (en) * | 2016-07-27 | 2018-02-01 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
FR3063555B1 (fr) * | 2017-03-03 | 2021-07-09 | Linxens Holding | Carte a puce et procede de fabrication d’une carte a puce |
MX2020002661A (es) | 2017-09-07 | 2021-10-19 | Composecure Llc | Tarjeta de transacción con componentes electrónicos incorporados y procedimiento para su fabricación. |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
AU2018351954B2 (en) | 2017-10-18 | 2021-04-15 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
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- 2009-07-28 FR FR0903703A patent/FR2948796A1/fr not_active Withdrawn
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- 2010-07-27 WO PCT/FR2010/000540 patent/WO2011015721A1/fr active Application Filing
- 2010-07-27 US US12/844,504 patent/US20110024036A1/en not_active Abandoned
- 2010-07-28 TW TW099124875A patent/TWI501161B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
TW201137760A (en) | 2011-11-01 |
WO2011015721A1 (fr) | 2011-02-10 |
FR2948796A1 (fr) | 2011-02-04 |
US20110024036A1 (en) | 2011-02-03 |
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