TWI495515B - Substrate double - sided spraying method - Google Patents

Substrate double - sided spraying method Download PDF

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TWI495515B
TWI495515B TW102127382A TW102127382A TWI495515B TW I495515 B TWI495515 B TW I495515B TW 102127382 A TW102127382 A TW 102127382A TW 102127382 A TW102127382 A TW 102127382A TW I495515 B TWI495515 B TW I495515B
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substrate
double
spraying
path
end surface
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TW102127382A
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TW201503963A (en
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Feng Jeng Lin
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Asia Neo Tech Ind Co Ltd
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Description

基板雙面噴塗方法Substrate double-sided spraying method

本發明涉及噴塗技術領域,特別有關一種基板雙面噴塗方法。The invention relates to the technical field of spraying, and particularly relates to a double-sided spraying method for a substrate.

一般通稱的基板(substrate board),概指平面的板狀物件,例如是載置有印刷電路、觸控電路或是太陽能導電線路的基板等,均屬之。這些基板在產製過程中,為了電路、線路或電子元件之間的絕緣、或是為了焊渣的清除、亦或是為了清洗基板板體,通常需要噴塗某種特定溶液,來達成所述絕緣、清除或清洗的目的,而且這些工序通常必須在基板的雙面都要進行。其中:以絕緣目的而論,所述溶液通常是呈膠體狀的油墨溶液。特別地,例如是在印刷電路基板的產製過程中,當基板上的印刷電路蝕刻形成後,必須附加一絕緣層於該印刷電路上,使裸露於基板雙端板面上的電路或線路之間產生相互絕緣的作用。其中,該絕緣層即便可以是由油墨溶液構成,並且使用例如是滾輪將油墨塗附於基板雙面上,或者使用油墨噴槍將油墨溶液噴塗於基板雙面上,進而防止線路或電路之間發生短路。Generally speaking, a substrate board refers to a planar board member, such as a substrate on which a printed circuit, a touch circuit, or a solar conductive line is placed, and the like. In the production process, in order to insulate between circuits, lines or electronic components, or to remove slag, or to clean the substrate, it is usually necessary to spray a specific solution to achieve the insulation. The purpose of cleaning, cleaning, or cleaning, and these processes usually have to be performed on both sides of the substrate. Wherein: for the purpose of insulation, the solution is usually a colloidal ink solution. In particular, for example, in the production process of a printed circuit board, after the printed circuit on the substrate is etched, an insulating layer must be added to the printed circuit to expose the circuit or the line exposed on the double-end board surface of the substrate. They create mutual insulation. Wherein, the insulating layer may be composed of an ink solution, and the ink may be applied to both sides of the substrate by using, for example, a roller, or the ink solution may be sprayed on both sides of the substrate using an ink spray gun, thereby preventing occurrence of a line or circuit. Short circuit.

進一步的說,列舉在油墨噴塗的技術領域中,為了大量生產、提高產能,已具備連續噴塗印刷電路基板雙面的工藝。Further, in the technical field of ink spraying, in order to mass-produce and increase productivity, a process of continuously spraying both sides of a printed circuit board has been provided.

請參閱圖1,揭露傳統連續噴塗實例一的俯視解說示意圖,說明實例一的連續噴塗設備具有單一供料線1,該 供料線1上串列形成若干個相對交錯的Ω型噴塗區2,每一噴塗區2中配置有單一個可上、下移動並作360度旋動的旋碟式噴槍3,供料線1上吊掛有若干個基板4,各基板4經由供料線1的傳動而逐一的移動到各個噴塗區2中接受噴槍3的噴塗,由於各基板4帶有負電荷,會吸引帶正電荷的噴塗溶液,使得噴槍3中的溶液能均勻的噴附於基板4的雙面;其中,由於各相鄰的Ω型噴塗區2之間呈相對交錯串列,使得各基板4的雙端面41、42能各自分別地顯露於相鄰的Ω型噴塗區2中接受噴槍3的噴塗。Referring to FIG. 1 , a schematic plan view of a conventional continuous spraying example 1 is disclosed, illustrating that the continuous spraying device of the first example has a single feeding line 1 . The feeding line 1 is arranged in series to form a plurality of relatively staggered Ω-type spraying zones 2, and each spraying zone 2 is provided with a single rotating disc type gun 3 which can be moved up and down and rotated 360 degrees, and the feeding line A plurality of substrates 4 are suspended from each other, and each of the substrates 4 is moved one by one to the respective spraying zones 2 via the transmission of the feeding line 1 to receive the spraying of the spray gun 3. Since each substrate 4 has a negative charge, it attracts a positively charged one. Spraying the solution so that the solution in the spray gun 3 can be uniformly sprayed on both sides of the substrate 4; wherein, due to the relatively staggered arrangement between the adjacent Ω-type sprayed areas 2, the double end faces 41 of the substrates 4 are 42 can be separately exposed to the spray coating of the spray gun 3 in the adjacent Ω-type spray zone 2.

上述圖1所示實例的缺點在於,由多個Ω型噴塗區2串列形成的供料線1,其路徑距離較長,造成基板4移動繞行所需消耗時間相對較久,阻礙產率的提升,且建構具有Ω型噴塗區2的供料線設備的佔置空間大,設備成本也較高。A disadvantage of the above-described example shown in FIG. 1 is that the supply line 1 formed by a plurality of Ω-type spray coating zones 2 has a long path distance, which causes the substrate 4 to move around for a relatively long time, hindering the yield. The improvement of the supply line device having the Ω type spraying zone 2 has a large occupation space and a high equipment cost.

接著請參閱圖2,揭露傳統連續噴塗實例二的俯視解說示意圖,說明實例二的連續噴塗設備具有單一供料線10,該供料線10是建構成U字型路徑,並且由U字型供料線10圍繞形成單一U字型空間的噴塗區20,該噴塗區20中間隔配置有多個可上、下移動的旋碟式噴槍30、31、32,所述噴槍30、31、32可事先設定好輸出相同的溶液噴塗霧化率,或者依序輸出由稀至厚、由厚至稀、或稀與厚交錯配置的溶液噴塗霧化率,且供料線10上吊掛有若干個基板4,各基板4經由供料線10的傳動而逐一的移動到各個噴塗區20中接受噴槍30、31、32的噴塗,使噴槍30、31、32中的溶液能均勻噴附於基板4的雙面;其中,由於供料線10的U字型路徑中間設有一翻轉區5,使得移動至翻轉區5的各基板4的雙端面41、42能夠在U字型路徑移動過程中分別地顯露於U型噴塗區2的相對端上接受雙頭式噴槍30、31、32逐次的噴塗。Next, referring to FIG. 2, a schematic plan view of a conventional continuous spraying example 2 is disclosed. The continuous spraying device of the second embodiment has a single feeding line 10, and the feeding line 10 is constructed as a U-shaped path and is provided by a U-shaped type. The material line 10 surrounds the spray area 20 forming a single U-shaped space, and the spray area 20 is spaced apart from the plurality of rotary disc type lances 30, 31, 32 which can be moved up and down. The spray guns 30, 31, 32 can be The spray rate of the same solution is set in advance, or the spray atomization rate is diluted from thick to thick, from thick to thin, or thin and thick, and a plurality of substrates are suspended on the supply line 10. 4. The substrates 4 are moved one by one through the transmission line 10 to the respective spraying zones 20 to receive the spraying of the lances 30, 31, 32, so that the solutions in the lances 30, 31, 32 can be uniformly sprayed on the substrate 4. Double-sided; wherein, since the inversion region 5 is provided in the middle of the U-shaped path of the supply line 10, the double end faces 41, 42 of the substrates 4 moved to the inversion region 5 can be separately exposed during the movement of the U-shaped path Receiving a double-headed spray gun 30, 31 on the opposite end of the U-shaped spray zone 2, 32 successive spraying.

上述圖2所示實例的問題點在於,在U字型供料路徑上移動的基板4,其第一端面41先接受雙頭式噴槍30、 31、32噴塗的順序為(a)→(b)→(c),續經翻轉區5的翻板動作之後,使得基板4之第二端面42接受雙頭式噴槍30、31、32的噴塗順序倒置成為(c)→(b)→(a),如此一來,當所述噴槍30、31、32之間依序設定好欲噴塗之溶液的不同噴塗霧化率時,例如由稀至厚、由厚至稀、或稀與厚交錯設定等不同噴塗霧化率時,便會造成基板雙端面41、42在噴塗時的溶液霧化率被倒置,因而造成基板雙端面41、42噴塗溶液的密實度不一致的現象,乃至於影響噴塗品質,況且U字型供料路徑可供傳遞基板4的移動速率不宜太高,有礙產率的提升,且建構U字型供料線10的設備成本也較高。The problem of the above example shown in FIG. 2 is that the first end face 41 of the substrate 4 moving on the U-shaped feeding path first receives the double-headed spray gun 30, 31, 32 is sprayed in the order of (a) → (b) → (c), and after the flapping operation of the reversing zone 5 is performed, the second end surface 42 of the substrate 4 is subjected to spraying by the double-headed spray guns 30, 31, 32. The sequence is inverted to become (c) → (b) → (a), so that when the spray guns 30, 31, 32 are sequentially set with different spray atomization rates of the solution to be sprayed, for example, from thin to When the spray atomization rate is thick, thick to thin, or thin and thick, the solution atomization rate of the double end faces 41 and 42 of the substrate during spraying is reversed, thus spraying the double end faces 41 and 42 of the substrate. The phenomenon that the compactness of the solution is inconsistent, and even affects the quality of the spray, and the U-shaped feed path is not suitable for the transfer rate of the transfer substrate 4, which hinders the improvement of the yield, and the U-shaped feed line 10 is constructed. Equipment costs are also higher.

上述兩種傳統的連續雙面噴塗實例中,該基板4並不受限於是印刷電路基板,舉凡具有雙端面的觸控電路基板或是太陽能基板等亦適用之,且所述溶液除了絕緣作用的油墨溶液之外,還包括清除焊渣或清洗板體用的清洗液或水等亦屬之。In the above two conventional continuous double-side spraying examples, the substrate 4 is not limited to a printed circuit substrate, and a touch circuit substrate having a double end surface or a solar substrate is also applicable, and the solution is insulated. In addition to the ink solution, cleaning liquid or water for cleaning the slag or the cleaning plate body is also included.

除此之外,傳統連續噴塗的技術,還包括在生產汽車等組裝廠中所常見的,其利用具有三維移動能力的機械手臂(robot)上附掛噴槍,對行進中或停止的立體物件表面進行連續噴塗漆料溶液的自動化作業。惟,對於僅具雙端表面的基板而言,待以噴塗的雙端表面積的向量變化並不大,因此殺雞焉用牛刀,並無需耗費高額成本建構配置有機械手臂(robot)的生產線來實施噴塗作業。In addition, the traditional continuous spraying technology, which is also commonly used in assembly plants such as automobile production, utilizes a robot attached to a robot with three-dimensional movement capability to attach or hang a three-dimensional object surface. Automate the continuous spraying of the paint solution. However, for a substrate with only a double-ended surface, the vector of the double-end surface area to be sprayed does not change much, so the chicken knives are used, and the production line equipped with a robot is not required to be costly. Perform spraying operations.

本發明之目的,旨在解決傳統連續噴塗技術中,為了實施基板的雙面噴塗,導致基板供料線的路徑距離較長,基板移動繞行的時間較久,以及在供料路徑上不利於依序設定多個雙頭式噴槍由稀至厚的溶液噴塗霧化率所造成的阻礙產率提升及影響噴塗品質的問題。The object of the present invention is to solve the problem that in the conventional continuous spraying technology, in order to implement double-sided spraying of the substrate, the path distance of the substrate feeding line is long, the substrate moves around for a long time, and the feeding path is disadvantageous. Sequentially setting the spray rate of a double-headed spray gun from a thin to thick solution hinders the increase in yield and affects the quality of the spray.

為了解決上述問題,本發明之一實施例,係在提 供一種基板雙面噴塗方法,其技術手段包括:佈建雙列式路徑分別掛置多個基板,並平行移動所述基板的第一端面相對的接受第一道雙向噴塗,接續翻轉所述基板的第一端面成為相互平行的第二端面,並平行移動所述第二端面相對的接受第二道雙向噴塗。In order to solve the above problems, an embodiment of the present invention is The invention provides a double-sided spraying method for a substrate, the technical means comprising: constructing a double-row path to respectively suspend a plurality of substrates, and moving the first end surface of the substrate in parallel to receive the first two-way spraying, and successively flipping the substrate The first end faces become parallel second end faces, and the second end faces are parallelly moved to receive the second pass bidirectional spray.

根據上述第一種實施例的技術手段,可作出貢獻的功效在於:採雙列式路徑供應基板雙面依序接受雙向噴塗,能夠在不增加噴塗設備的情況下增加產能,且雙列式路徑供應基板雙面噴塗的過程中,不存在利用同一組多個旋碟式噴槍的排組順序,來反覆噴塗同一個基板的不同端面,因此有利於預先設定好同一組多個雙頭式噴槍各自獨立的溶液噴塗霧化率,因此有助於提升自動噴塗的品質。According to the technical means of the first embodiment, the contribution can be made in that the double-sided path supply substrate is sequentially subjected to two-way spraying on both sides, and the productivity can be increased without increasing the spraying equipment, and the double-row path In the process of double-sided spraying of the supply substrate, there is no order of the same group of multiple rotary disc spray guns to repeatedly spray different end faces of the same substrate, so it is advantageous to pre-set the same set of multiple double-headed spray guns. The independent solution sprays the atomization rate, thus helping to improve the quality of the automatic spray.

為了產生相同於上述功效的貢獻,本發明之另一實施例,還提供有一種基板雙面噴塗方法,包括:佈建雙列式前段路徑分別掛置多個基板,並平行移動所述基板的第一端面相對的接受第一道雙向噴塗,接續以正Z字形與反Z字形的交叉軌跡分別延伸所述雙列式前段路徑銜接雙列式後段路徑,進而移動所述基板的第一端面換位成相互平行的第二端面,並平行移動所述第二端面相對的接受第二道雙向噴塗。In order to generate the same contribution to the above-mentioned effects, another embodiment of the present invention provides a double-sided spraying method for a substrate, comprising: constructing a double-row front-end path to respectively suspend a plurality of substrates, and moving the substrate in parallel The first end face is oppositely received by the first two-way spraying, and the intersecting trajectory of the positive zigzag and the reverse zigzag respectively extends to extend the double-column anterior path to connect the double-row rear-end path, thereby moving the first end face of the substrate The second end faces are parallel to each other, and the second end faces are moved in parallel to receive the second pass of the two-way spraying.

在進一步實施中,所述雙列式路徑,或是雙列式前段路徑與雙列式後段路徑,分別是由兩相互平行的直線路徑構成。依此,可縮短基板移動路徑的距離,避免基板移動繞行時間的耗損,以增加噴塗產能。In a further implementation, the double-row path, or the double-column front-end path and the double-column rear-end path, respectively, are formed by two parallel straight paths. Accordingly, the distance of the substrate moving path can be shortened, and the wear time of the substrate moving around time can be avoided to increase the spraying capacity.

在進一步實施中,上述平行移動所述基板的第一端面與第二端面的方向相同。依此,利於同一組多個雙頭式噴槍由稀至厚的溶液噴塗霧化率的設定,且同一基板的雙面能夠同時實施由稀至厚的溶液噴塗,以提升噴塗品質。In a further implementation, the parallel movement of the first end surface of the substrate is the same as the direction of the second end surface. Accordingly, the same group of double-headed spray guns can be set from a thin to thick solution spray atomization rate, and the double sides of the same substrate can be simultaneously sprayed from a thin to thick solution to improve the spray quality.

在進一步實施中,所述基板是在移動中翻轉。其中,翻轉所述基板的角度可為180度。依此,便於將前、後 段雙列式路徑並建成同一直線軌跡,以利於噴塗設備在既定的佔地面積下提升噴塗產能。In a further implementation, the substrate is flipped over during movement. Wherein, the angle of flipping the substrate may be 180 degrees. According to this, it is convenient to be before and after The segment double-column path and the same straight track are constructed to facilitate the spraying equipment to increase the spraying capacity under the given floor space.

在進一步實施中,所述正Z字形與反Z字形的交叉軌跡分別以不同時間差方式交錯移動所述基板的第一端面換位成第二端面。依此,可使所述交叉軌跡利於被實施,且達成在雙列式路徑中變換基板受噴塗端面的效用。In a further implementation, the intersecting trajectories of the positive zigzag and the inverse zigzag are respectively shifted in a different time difference manner to the first end face of the substrate to be transposed into the second end face. Accordingly, the intersecting trajectory can be advantageously implemented, and the effect of transforming the substrate to the painted end face in the double-row path can be achieved.

在進一步實施中,所述基板為印刷電路基板,所述雙向噴塗為油墨溶液的噴塗。除此之外,所述基板還可以替換成觸控電路基板或是太陽能基板,並對應所述雙向噴塗為油墨溶液的噴塗,皆屬本發明所思及的應用範疇。In a further implementation, the substrate is a printed circuit substrate and the two-way spraying is spraying of an ink solution. In addition, the substrate can also be replaced by a touch circuit substrate or a solar substrate, and corresponding to the two-dimensional spraying as the ink solution spraying, are all applicable areas of the present invention.

1、10‧‧‧供料線1, 10‧‧‧ Feeding line

2、20‧‧‧噴塗區2, 20‧‧‧ spraying area

200‧‧‧第一噴塗區200‧‧‧First spraying area

201‧‧‧第二噴塗區201‧‧‧Second spraying area

3、30、31、32、300、301、310、311、320、321‧‧‧噴槍3, 30, 31, 32, 300, 301, 310, 311, 320, 321‧‧ ‧ spray gun

4‧‧‧基板4‧‧‧Substrate

41‧‧‧第一端面41‧‧‧ first end face

42‧‧‧第二端面42‧‧‧second end face

5、50‧‧‧翻轉區5, 50‧‧‧ flip area

6‧‧‧吊架6‧‧‧ hanger

L1‧‧‧第一列路徑L1‧‧‧ first column path

L2‧‧‧第二列路徑L2‧‧‧Second column path

L10‧‧‧第一列前段路徑L10‧‧‧The first column of the first paragraph

L11‧‧‧第一列後段路徑L11‧‧‧The first column of the first paragraph

L20‧‧‧第二列前段路徑L20‧‧‧second stage front path

L21‧‧‧第二列後段路徑L21‧‧‧second stage rear path

S1至S5‧‧‧第一種實施例之步驟說明S1 to S5‧‧‧ Description of the steps of the first embodiment

S10至S50‧‧‧第二種實施例之步驟說明S10 to S50‧‧‧ Description of the steps of the second embodiment

圖1是傳統連續噴塗實例一的解說示意圖。1 is a schematic diagram of an example of a conventional continuous spraying example 1.

圖2是傳統連續噴塗實例二的解說示意圖。2 is a schematic diagram of an example of a conventional continuous spraying example 2.

圖3是本發明第一種實施例的程序方塊圖。Figure 3 is a block diagram of a program of the first embodiment of the present invention.

圖4是圖3所示實施例的解說示意圖。Figure 4 is a schematic illustration of the embodiment of Figure 3.

圖5是本發明第二種實施例的程序方塊圖。Figure 5 is a block diagram of a second embodiment of the present invention.

圖6是圖5所示實施例的解說示意圖。Figure 6 is a schematic illustration of the embodiment of Figure 5.

請參閱圖3,說明本發明第一種實施例所提供的基板雙面噴塗方法,包括實施下列步驟S1至步驟S5:步驟S1:佈建雙列式路徑。本發明為了載運及移動基板接受噴塗,可利用配置有鍊條的軌道,來佈建形成該雙列式路徑,所述雙列式路徑包括第一列路徑L1及第二列路徑L2。在較佳實施中,第一列與第二列路徑L1、L2可以是相互平行的被佈建形成。此外,為了可縮短基板移動路徑的距離,避免基板移動繞行時間的耗損,相互平行的第一列與第二列路徑L1、L2還可以是由直線路徑構成。Referring to FIG. 3, a double-sided spraying method for a substrate according to a first embodiment of the present invention is provided, which includes the following steps S1 to S5: Step S1: Deploying a dual-row path. In order to carry and spray the substrate, the present invention can form a double-row path by using a rail provided with a chain, and the double-row path includes a first column path L1 and a second column path L2. In a preferred implementation, the first and second columns of paths L1, L2 may be formed parallel to each other. Further, in order to shorten the distance of the substrate moving path and avoid the wear of the substrate moving around time, the first and second column paths L1, L2 which are parallel to each other may be constituted by a straight path.

請配合圖4所示,說明在實施步驟S1時,可逐 一的利用吊架6來夾持每一片基板4,並且利用吊架6將基板4掛置於由鍊條及軌道配置而成的第一列與第二列路徑L1、L2上,使得雙列式路徑上的每一片基板4的第一端面41相互的平行對應。Please cooperate with FIG. 4 to explain that when step S1 is implemented, One of the substrates 4 is clamped by the hanger 6, and the substrate 4 is hung on the first and second column paths L1 and L2 which are arranged by the chain and the rail by the hanger 6, so that the double row The first end faces 41 of each of the substrates 4 on the path correspond to each other in parallel.

步驟S2:平行移動基板。實施上,如圖4所示,第一列與第二列路徑L1、L2上鍊條附加有例如是鍊輪與馬達等組成的驅動器,以便在軌道上驅動鍊條,使雙列式路徑上的每一片基板4的第一端面41能平行且相對的移動。在較佳實施中,每一片基板4的第一端面41的移動方向可以是相同的;換句話說,第一列與第二列路徑L1、L2上的鍊條,可以同步帶動多個夾持有基板4的吊架6朝相同路徑方向同步平行移動。Step S2: moving the substrate in parallel. In practice, as shown in FIG. 4, the chain of the first column and the second column path L1, L2 is attached with a driver composed of, for example, a sprocket and a motor, so as to drive the chain on the track so that each of the double-row paths The first end faces 41 of one of the substrates 4 are movable in parallel and in opposite directions. In a preferred implementation, the moving direction of the first end surface 41 of each of the substrates 4 may be the same; in other words, the chains on the first and second columns of paths L1, L2 may simultaneously drive a plurality of clamping The hangers 6 of the substrate 4 move in parallel in the same path direction.

步驟S3:基板第一端面雙向噴塗。實施上,如圖4所示,第一列與第二列路徑L1、L2之間依序設置有第一與第二噴塗區200、201,該第一與第二噴塗區200、201中分別間隔配置有多個可上、下移動並作360度旋動的旋碟式式噴槍300、310、320、301、311、321,所述噴槍300、310、320、301、311、321可事先設定好輸出相同的溶液噴塗霧化率,或者依序輸出例如是由稀至厚、由厚至稀、或者是稀與厚交錯配置的溶液噴塗霧化率,所述多個基板4可相互對應地吊掛於第一列與第二列路徑L1、L2上,並使各基板4帶有負電荷,同時各基板4的第一端面41經由第一列與第二列路徑L1、L2的傳動而逐一的移動到第一噴塗區200中接受噴槍300、310、320的噴塗,由於噴槍300、310、320中的溶液帶有正電荷,能受到帶負電荷的基板4的吸引而均勻的噴附於第一端面41上。Step S3: The first end surface of the substrate is sprayed bidirectionally. In practice, as shown in FIG. 4, the first and second spray zones 200, 201 are sequentially disposed between the first column and the second column path L1, L2, and the first and second spray zones 200, 201 respectively A plurality of rotary disc type spray guns 300, 310, 320, 301, 311, and 321 capable of moving up and down and rotating 360 degrees are disposed at intervals, and the spray guns 300, 310, 320, 301, 311, and 321 may be previously Setting the same solution spray atomization rate, or sequentially outputting the spray atomization rate, for example, from lean to thick, from thick to thin, or in a thin and thick staggered configuration, the plurality of substrates 4 may correspond to each other. Hanging on the first column and the second column path L1, L2, and causing each substrate 4 to carry a negative charge, while the first end surface 41 of each substrate 4 is transmitted through the first column and the second column path L1, L2 And moving one by one to the first spraying zone 200 to receive the spraying of the spray guns 300, 310, 320, since the solution in the spray guns 300, 310, 320 has a positive charge, can be uniformly sucked by the negatively charged substrate 4 Attached to the first end face 41.

步驟S4:翻轉基板。實施上,如圖4所示,第一列與第二列路徑L1、L2中間設有一翻轉區50,且該翻轉區50是介設於第一與第二噴塗區200、201之間,各基板4 經由移動至翻轉區50而翻轉180度,使得各基板4由第一噴塗區200移動至第二噴塗區201時,由原本平行且相對的移動的第一端面41翻轉為第二端面42。Step S4: Flip the substrate. In an implementation, as shown in FIG. 4, a flip region 50 is disposed between the first column and the second column path L1, L2, and the flip region 50 is interposed between the first and second spray regions 200, 201, respectively. Substrate 4 The first end face 41 that is originally parallel and oppositely moved is turned over to the second end face 42 when it is moved 180 degrees by moving to the inversion zone 50 so that each of the substrates 4 is moved from the first spray zone 200 to the second spray zone 201.

步驟S5:基板第二端面雙向噴塗。實施上,如圖4所示,各基板4的第二端面42經由第一列與第二列路徑L1、L2的傳動而逐一的移動到第二噴塗區201中接受噴槍301、311、321的噴塗,使噴槍301、311、321中帶有正電荷的溶液能均勻噴附於帶有負電荷的基板4的第二端面42上。Step S5: the second end surface of the substrate is sprayed bidirectionally. In practice, as shown in FIG. 4, the second end surface 42 of each substrate 4 is moved one by one to the second spray coating area 201 to receive the spray guns 301, 311, 321 via the transmission of the first column and the second column path L1, L2. Spraying causes a positively charged solution in the lances 301, 311, 321 to be uniformly sprayed onto the second end face 42 of the negatively charged substrate 4.

請參閱圖5,說明本發明第二種實施例所提供的基板雙面噴塗方法,包括實施下列步驟S10至步驟S50:Referring to FIG. 5, a method for double-sided spraying a substrate according to a second embodiment of the present invention is provided, including performing the following steps S10 to S50:

步驟S10:佈建雙列式雙段路徑。本發明為了載運及移動基板接受噴塗,可利用配置有鍊條的軌道,來佈建形成該雙列式雙段路徑,所述雙列式雙段路徑包括第一列前段路徑L10、第一列後段路徑L11、第二列前段路徑L20及第二列後段路徑L21,而第一列前段路徑L10與第二列前段路徑L20是分別以正Z字形與反Z字形的交叉軌跡而延伸銜接第二列後段路徑L21與第一列後段路徑L11。在較佳實施中,第一列與第二列前段路徑L10、L20及第一列與第二列後段路徑L11、L21可以是相互平行的被佈建形成。此外,為了可縮短基板移動路徑的距離,避免基板移動繞行時間的耗損,相互平行的第一列與第二列前段路徑L10、L20及第一列與第二列後段路徑L11、L21還可以是由直線路徑構成。Step S10: Deploy a dual-column two-segment path. In order to carry and spray the substrate for spraying, the double-column two-segment path may be formed by using a track provided with a chain, and the double-row double-segment path includes a first column front segment path L10 and a first column rear segment The path L11, the second column front segment path L20 and the second column back segment path L21, and the first column front segment path L10 and the second column front segment path L20 are respectively connected to the second column by a cross-track of a positive zigzag shape and an inverse zigzag shape. The rear segment path L21 and the first column rear segment path L11. In a preferred implementation, the first column and the second column front segment paths L10, L20 and the first column and the second column rear segment paths L11, L21 may be formed in parallel with each other. In addition, in order to shorten the distance of the substrate moving path and avoid the wear and tear of the substrate moving around time, the first column and the second column front segment paths L10 and L20 and the first column and the second column rear segment paths L11 and L21 may be parallel to each other. It consists of a straight path.

請配合圖6所示,說明在實施步驟S10時,可逐一的利用吊架6來夾持每一片基板4,並且利用吊架6將基板4掛置於由鍊條及軌道配置而成的第一列與第二列前段路徑L10、L20上,使得雙列式前段路徑上的每一片基板4的第一端面41相互的平行對應,且雙列式前段路徑並傳導電流而使每一片基板4帶有負電荷。Referring to FIG. 6 , when step S10 is performed, each of the substrates 4 can be clamped one by one by the hanger 6 , and the substrate 4 can be hung by the hanger 6 to be placed first by the chain and the rail. The columns and the second column front segment paths L10, L20 are such that the first end faces 41 of each of the substrate 4 on the double-column front path correspond to each other in parallel, and the double-column front path conducts current to cause each substrate 4 to be stripped There is a negative charge.

步驟S20:平行移動基板。實施上,如圖6所示, 第一列與第二列前段路徑L10、L20上鍊條附加有例如是鍊輪與馬達等組成的驅動器,以便在軌道上驅動鍊條,使雙列式前段路徑上的每一片基板4的第一端面41能平行且相對的移動。在較佳實施中,每一片基板4的第一端面41的移動方向可以是相同的;換句話說,第一列與第二列前段路徑L10、L20上的鍊,可以同步帶動多個夾持有基板4的吊架6朝相同路徑方向同步平行移動。Step S20: The substrate is moved in parallel. Implementation, as shown in Figure 6, The first column and the second column front segment paths L10, L20 are attached with a driver such as a sprocket and a motor to drive the chain on the track so that the first end face of each substrate 4 on the double-row front path 41 can move in parallel and relative. In a preferred implementation, the moving direction of the first end surface 41 of each of the substrates 4 may be the same; in other words, the chains on the first and second columns of the front path L10, L20 may simultaneously drive the plurality of clamping The hanger 6 having the substrate 4 moves in parallel in the same path direction.

步驟S30:基板第一端面雙向噴塗。實施上,如圖6所示,第一列與第二列前段路徑L10、L20之間設置有第一與第二噴塗區200、201,該第一與第二噴塗區200、201中間隔配置有多個可上、下移動的旋碟式噴槍300、310、320、301、311、321,所述噴槍300、310、320、301、311、321可事先設定好輸出相同的溶液噴塗霧化率,或者依序輸出例如是由稀至厚、由厚至稀、或者是稀與厚交錯配置的溶液噴塗霧化率,各基板4的第一端面41經由第一列與第二列前段路徑L10、L20的傳動而逐一的移動到第一噴塗區200中接受噴槍300、310、320的噴塗,使噴槍300、310、320中帶有正電荷的溶液能均勻噴附於第一端面41上。Step S30: The first end surface of the substrate is sprayed bidirectionally. In practice, as shown in FIG. 6, between the first column and the second column front segment paths L10, L20, first and second spray coating regions 200, 201 are disposed, and the first and second spray regions 200, 201 are spaced apart. There are a plurality of rotary disc type lances 300, 310, 320, 301, 311, 321 which can be moved up and down. The spray guns 300, 310, 320, 301, 311, 321 can be set to output the same solution spray atomization in advance. Rate, or sequential output, for example, from a thin to thick, from thick to thin, or a solution spray atomization rate of a thin and thick staggered configuration, the first end surface 41 of each substrate 4 via the first column and the second column front path The transmissions of L10 and L20 are moved one by one to the first spraying zone 200 to receive the spraying of the spray guns 300, 310, 320, so that the positively charged solution in the spray guns 300, 310, 320 can be uniformly sprayed on the first end face 41. .

步驟S40:交叉移動基板。實施上,如圖6所示,各基板4沿正Z字形與反Z字形的交叉軌跡而移動至第一列與第二列後段路徑L11、L21;在具體實施上,正Z字形與反Z字形的交叉軌跡之間具有一交錯區,該交錯區能提供正Z字形與反Z字形的交叉軌跡分別以不同時間差方式交錯移動所述基板的第一端面換位成第二端面,使得各基板4由第一噴塗區200移動至第二噴塗區201時,由原本平行且相對的移動的第一端面41換位成第二端面42。其中,雙列式後段路徑同樣傳導有電流而使每一片基板4帶有負電荷。Step S40: Cross-moving the substrate. In practice, as shown in FIG. 6, each substrate 4 moves along the intersecting trajectory of the positive zigzag and the inverse zigzag to the first column and the second column rear path L11, L21; in specific implementation, the positive zigzag and the inverse Z There is an interlaced area between the intersecting tracks of the glyphs, and the interlaced area can provide a cross-track of the positive zigzag and the anti-Z-shape, respectively, and the first end faces of the substrate are alternately shifted into the second end faces in different time difference manners, so that the substrates are 4 When moving from the first spray zone 200 to the second spray zone 201, the first end face 41 that is originally parallel and oppositely moved is indexed into the second end face 42. Among them, the double-column rear-end path also conducts current so that each substrate 4 has a negative charge.

步驟S50:基板第二端面雙向噴塗。實施上,如圖6所示,各基板4的第二端面42經由第一列與第二列後段 路徑L11、L21的傳動而逐一的移動到第二噴塗區201中接受噴槍301、311、321的噴塗,使噴槍301、311、321中帶有正電荷的溶液能均勻噴附於帶有負電荷之基板4的第二端面42上。Step S50: The second end surface of the substrate is sprayed bidirectionally. In practice, as shown in FIG. 6, the second end surface 42 of each substrate 4 passes through the first column and the second column rear segment. The transmission of the paths L11, L21 is moved one by one to the second spray zone 201 to receive the spray of the spray guns 301, 311, 321 so that the positively charged solution in the spray guns 301, 311, 321 can be uniformly sprayed with a negative charge. On the second end face 42 of the substrate 4.

根據以上實施例之說明,本發明之基板雙面噴塗方法是先將基板沿雙列式路徑進行移動,並利用翻轉或交叉換位的方式來使基板雙面依序接受雙向噴塗,進而能夠在不增加噴塗設備的情況下增加產能,且有利於基板依序接受由一組多個雙頭式噴槍分別設定出各自獨立的溶液噴塗霧化率進行噴塗,以提升自動噴塗的品質。According to the description of the above embodiments, the double-sided spraying method of the substrate of the present invention firstly moves the substrate along the double-row path, and adopts the method of flipping or cross-displacement to sequentially receive the two-sided coating on both sides of the substrate, thereby enabling The production capacity is increased without increasing the spraying equipment, and the substrate is sequentially received by a plurality of double-headed spray guns to set separate spray spray atomization rates for spraying to improve the quality of the automatic spraying.

以上實施例僅為表達了本發明的較佳實施方式,但並不能因此而理解為對本發明專利範圍的限制。應當指出的是,對於本發明所屬技術領域中具有通常知識者而言,在不脫離本發明構思的前提下,還可以做出複數變形和改進,這些都屬於本發明的保護範圍。因此,本發明應以申請專利範圍中限定的請求項內容為準。The above embodiments are merely illustrative of preferred embodiments of the invention, but are not to be construed as limiting the scope of the invention. It should be noted that various modifications and improvements may be made without departing from the spirit and scope of the invention. Therefore, the present invention should be based on the content of the claims defined in the scope of the patent application.

S1至S5‧‧‧第一種實施例之步驟說明S1 to S5‧‧‧ Description of the steps of the first embodiment

Claims (11)

一種基板雙面噴塗方法,包括:佈建雙列式路徑分別掛置多個基板,並平行移動所述基板的第一端面相對的接受第一道雙向噴塗,接續翻轉所述基板的第一端面成為相互平行的第二端面,並平行移動所述第二端面相對的接受第二道雙向噴塗。A double-sided spraying method for a substrate, comprising: constructing a double-row path to respectively suspend a plurality of substrates, and moving the first end surface of the substrate in parallel to receive a first two-way spraying, and subsequently flipping the first end surface of the substrate And forming a second end surface parallel to each other, and moving the second end surface in parallel to receive the second two-way spraying. 如申請專利範圍第1項所述之基板雙面噴塗方法,其中所述雙列式路徑分別是由兩相互平行的直線路徑構成。The double-sided spraying method of the substrate according to claim 1, wherein the double-row path is composed of two parallel straight paths. 如申請專利範圍第1項所述之基板雙面噴塗方法,其中平行移動所述基板的第一端面與第二端面的方向相同。The substrate double-side spraying method of claim 1, wherein the first end surface parallel to the substrate is oriented in the same direction as the second end surface. 如申請專利範圍第1項所述之基板雙面噴塗方法,其中所述基板是在移動中翻轉。The substrate double-side spraying method of claim 1, wherein the substrate is flipped over during movement. 如申請專利範圍第1或4項所述之基板雙面噴塗方法,其中翻轉所述基板的角度為180度。The double-sided coating method of the substrate according to claim 1 or 4, wherein the angle at which the substrate is turned over is 180 degrees. 如申請專利範圍第1項所述之基板雙面噴塗方法,其中所述基板為印刷電路基板,所述雙向噴塗為油墨溶液的噴塗。The substrate double-side spraying method according to claim 1, wherein the substrate is a printed circuit substrate, and the two-way spraying is spraying of an ink solution. 一種基板雙面噴塗方法,包括:佈建雙列式前段路徑分別掛置多個基板,並平行移動所述基板的第一端面相對的接受第一道雙向噴塗,接續以正Z字形與反Z字形的交叉軌跡分別延伸所述雙列式前段路徑銜接雙列式後段路徑,進而移動所述基板的第一端面換位成相互平行的第二端面,並平行移動所述第二端面相對的接受第二道雙向噴塗。A double-sided spraying method for a substrate comprises: constructing a double-row front-end path to respectively suspend a plurality of substrates, and parallelly moving the first end surface of the substrate to receive the first two-way spraying, followed by a positive zigzag and an anti-Z The intersecting trajectories of the glyphs respectively extend the double-column anterior path to engage the double-column rear-end path, thereby moving the first end surface of the substrate to be transposed into parallel second end faces, and moving the second end faces in parallel to receive The second two-way spray. 如申請專利範圍第7項所述之基板雙面噴塗方法,其中所述雙列式前段路徑與雙列式後段路徑分別是由兩相互平行的直線路徑構成。The double-sided spraying method of the substrate according to claim 7, wherein the double-row front path and the double-row rear path are respectively formed by two parallel straight paths. 如申請專利範圍第7項所述之基板雙面噴塗方法,其中平行移動所述基板的第一端面與第二端面的方向相同。The double-sided spraying method of a substrate according to claim 7, wherein the first end surface parallel to the substrate is oriented in the same direction as the second end surface. 如申請專利範圍第7項所述之基板雙面噴塗方法,其中所述正Z字形與反Z字形的交叉軌跡分別以不同時間差 方式交錯移動所述基板的第一端面換位成第二端面。The double-sided spraying method for a substrate according to claim 7, wherein the intersecting trajectories of the positive zigzag and the reverse zigzag have different time differences respectively. The method alternately shifts the first end surface of the substrate into a second end surface. 如申請專利範圍第7項所述之基板雙面噴塗方法,其中所述基板為印刷電路基板,所述雙向噴塗為油墨溶液的噴塗。The substrate double-side spraying method according to claim 7, wherein the substrate is a printed circuit substrate, and the two-way spraying is spraying of an ink solution.
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