TWI494410B - 膠帶 - Google Patents

膠帶 Download PDF

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Publication number
TWI494410B
TWI494410B TW102112762A TW102112762A TWI494410B TW I494410 B TWI494410 B TW I494410B TW 102112762 A TW102112762 A TW 102112762A TW 102112762 A TW102112762 A TW 102112762A TW I494410 B TWI494410 B TW I494410B
Authority
TW
Taiwan
Prior art keywords
light
substrate
tape
layer
adhesive
Prior art date
Application number
TW102112762A
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English (en)
Other versions
TW201439270A (zh
Inventor
Ming Jen Chang
Chang Chin Wu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW102112762A priority Critical patent/TWI494410B/zh
Priority to US13/942,702 priority patent/US20140308515A1/en
Publication of TW201439270A publication Critical patent/TW201439270A/zh
Application granted granted Critical
Publication of TWI494410B publication Critical patent/TWI494410B/zh

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848Three or more layers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)

Description

膠帶
本發明涉及一種膠帶,尤其涉及一種光輻射失效膠帶。
光輻射失效膠帶係指經光輻射後其黏性會降低之一類膠帶。目前光輻射失效膠帶,如紫外光(UV)輻射失效膠帶,一般用於在加工過程中黏結透光性之元件,當需要將膠帶從元件上撕離下來,只需採用UV光輻射膠帶使其黏性降低,再將膠帶撕離。然,當光輻射失效膠帶用於其他非透光性之元件時,由於光不能透過元件輻射膠帶,而不能使膠帶失效,因此不適用。
鑒於上述狀況,有必要提供一種適用於黏結非透光性元件之膠帶。
一膠帶,其包括基底、第一膠層及第二膠層。基底由導光材料製成,基底包括入光面及二出光面,光線能夠從入光面進入基底並從二出光面射出。第一膠層與第二膠層分別設置在二出光面上。第一膠層由紫外光輻射失效膠製成,第二膠層由紫外光輻射失效膠製成。
另一膠帶,其包括基底、膠層及塗覆層,膠層由紫外光輻射失效膠製成。基底設置於膠層與塗覆層之間。基底由導光材料製成,基底包括入光面、出光面及側面。入光面連接出光面及側面。膠 層設置在出光面上,塗覆層設置在該側面上。光線能夠從該入光面進入該基底並從該出光面射出。
由於上述膠帶之基底由導光材料製成,當需要將黏結工件從膠帶上撕離,即使黏結工件為非透光性之,亦可使光線從基底之入光面進入基底,繼而光線從出光面射出輻射膠層,使膠層失效,從而將黏結工件撕離。
10,20,40‧‧‧膠帶
11,21,41‧‧‧基底
112,212,412‧‧‧入光面
114,214,414‧‧‧出光面
215‧‧‧側面
116,216‧‧‧端面
13‧‧‧第一膠層
15‧‧‧第二膠層
23‧‧‧膠層
25‧‧‧塗覆層
410‧‧‧連接面
30‧‧‧第一工件
50‧‧‧第二工件
圖1係本發明實施方式一之膠帶之剖面示意圖。
圖2係本發明實施方式一之膠帶之使用狀態示意圖。
圖3係本發明實施方式二之膠帶之剖面示意圖。
圖4係本發明實施方式三之膠帶之剖面示意圖。
請參閱圖1,本發明實施方式一之膠帶10包括基底11、第一膠層13及第二膠層15。基底11由導光材料製成,其包括入光面112、二相對設置之出光面114及端面116。入光面112與端面116相對設置,二出光面114相互平行,位於入光面112之二側,且入光面112連接二出光面114。光線可從入光面112進入基底11並從二出光面114射出。第一膠層13及第二膠層15分別設置在二出光面114上。第一膠層13及第二膠層15均由光輻射失效膠製成。在本發明實施方式一中,基底11為導光板。第一膠層13及第二膠層15均由UV光輻射失效膠製成。可理解,基底11亦可為其他導光元件,如導光膜。
請一併參閱圖2,使用時,膠帶10之第一膠層13黏結第一工件30 ,第二膠層15黏結第二工件50,當需要將第一工件30及第二工件50撕離時,即使第一工件30、第二工件50為非透光性之材料製成,亦可使光線從基底11之入光面112進入基底11,繼而光線從二出光面114射出,使光線照射到第一膠層13及第二膠層15,使得第一膠層13及第二膠層15失效,從而將第一工件30與第二工件50撕離。
請參閱圖3,本發明實施方式二之膠帶20包括基底21、膠層23及塗覆層25。基底21由導光材料製成,其包括入光面212、出光面214、側面215及端面216。入光面212與端面216相對設置,出光面214與側面215相互平行,並分別位於入光面212之二側,且入光面212連接出光面214與側面215。光線可從入光面212進入基底21並從出光面214射出。膠層23設置在出光面214上,塗覆層25設置在側面215上。膠層23由UV光輻射失效膠製成。塗覆層25可為膠層,亦可為其他塗覆層,如遮光層、保護層等。
使用時,膠帶20之膠層23黏結第一工件30,即使第一工件30為非透光性之材料製成,亦可使光線從基底21之入光面212進入基底21,繼而光線從出光面214射出,使光線照射到膠層23,使得膠層23失效,從而將第一工件30撕離。
請參閱圖4,本發明實施方式三之膠帶40結構與本發實施方式一之膠帶10相似,其不同在於:基底41還包括二連接面410,每一連接面410連接入光面412與一出光面414。
可以理解,出光面亦可依膠帶之使用需求呈其他位置關係,只要光線可從入光面進入基底並從出光面射出即可。
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之如申請專利範圍內。
11‧‧‧基底
112‧‧‧入光面
114‧‧‧出光面
13‧‧‧第一膠層
15‧‧‧第二膠層
30‧‧‧第一工件
50‧‧‧第二工件

Claims (8)

  1. 一膠帶,其包括第一膠層及第二膠層,該第一膠層由紫外光輻射失效膠製成,該第二膠層由紫外光輻射失效膠製成,其改良在於:該膠帶還包括設置於該第一膠層與該第二膠層之間之基底,該基底由導光材料製成,該基底包括入光面及二出光面,該第一膠層與該第二膠層分別設置在該二出光面上,光線能夠從該入光面進入該基底並從該二出光面射出。
  2. 如申請專利範圍第1項所述之膠帶,其中該基底為導光板或導光膜。
  3. 如申請專利範圍第1項所述之膠帶,其中該入光面連接該二出光面,且該二出光面相互平行。
  4. 如申請專利範圍第1項所述之膠帶,其中該基底還包括二連接面,該二連接面連接該入光面與該二出光面。
  5. 一膠帶,其包括膠層及塗覆層,該膠層由紫外光輻射失效膠製成,其中該膠帶還包括設置於該膠層與該塗覆層之間之基底,該基底由導光材料製成,該基底包括入光面、出光面及側面,該入光面連接該出光面及該側面,該膠層設置在該出光面上,該塗覆層設置在該側面上,光線能夠從該入光面進入該基底並從該出光面射出。
  6. 如申請專利範圍第5項所述之膠帶,其中該出光面與該側面相互平行。
  7. 如申請專利範圍第5項所述之膠帶,其中該基底為導光板或導光膜。
  8. 如申請專利範圍第5項所述之膠帶,其中該塗覆層為膠層、保護層或遮光層。
TW102112762A 2013-04-10 2013-04-10 膠帶 TWI494410B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW102112762A TWI494410B (zh) 2013-04-10 2013-04-10 膠帶
US13/942,702 US20140308515A1 (en) 2013-04-10 2013-07-16 Adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102112762A TWI494410B (zh) 2013-04-10 2013-04-10 膠帶

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TW201439270A TW201439270A (zh) 2014-10-16
TWI494410B true TWI494410B (zh) 2015-08-01

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WO2017115485A1 (ja) * 2015-12-29 2017-07-06 鴻海精密工業股▲ふん▼有限公司 樹脂フィルムの剥離方法、フレキシブル基板を有する電子デバイスの製造方法および有機el表示装置の製造方法ならびに樹脂フィルムの剥離装置
US20200130342A1 (en) * 2018-10-31 2020-04-30 Microsoft Technology Licensing, Llc Bonding and de-bonding system and process

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Publication number Priority date Publication date Assignee Title
CN102099431A (zh) * 2008-03-31 2011-06-15 汉高有限公司 多层紫外线可固化粘合膜
US20130178585A1 (en) * 2010-12-20 2013-07-11 Henkel Corporation Photocurable dicing die bonding tape
US20130122689A1 (en) * 2011-11-16 2013-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for De-Bonding Carriers
CN202847016U (zh) * 2012-10-16 2013-04-03 山太士股份有限公司 Uv减黏保护膜

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US20140308515A1 (en) 2014-10-16

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