TWI491804B - Dry vacuum pump apparatus and method of cooling the same - Google Patents

Dry vacuum pump apparatus and method of cooling the same Download PDF

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Publication number
TWI491804B
TWI491804B TW100113116A TW100113116A TWI491804B TW I491804 B TWI491804 B TW I491804B TW 100113116 A TW100113116 A TW 100113116A TW 100113116 A TW100113116 A TW 100113116A TW I491804 B TWI491804 B TW I491804B
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Taiwan
Prior art keywords
dry vacuum
vacuum pump
cooling
housing
pump
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TW100113116A
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Chinese (zh)
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TW201202555A (en
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Kazuma Ito
Atsushi Oyama
Katsuaki Usui
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Ebara Corp
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Priority claimed from JP2010096539A external-priority patent/JP2011226364A/en
Priority claimed from JP2010096540A external-priority patent/JP5373691B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW201202555A publication Critical patent/TW201202555A/en
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Publication of TWI491804B publication Critical patent/TWI491804B/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C25/00—Adaptations of pumps for special use of pumps for elastic fluids
    • F04C25/02—Adaptations of pumps for special use of pumps for elastic fluids for producing high vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01C—ROTARY-PISTON OR OSCILLATING-PISTON MACHINES OR ENGINES
    • F01C21/00—Component parts, details or accessories not provided for in groups F01C1/00 - F01C20/00
    • F01C21/007—General arrangements of parts; Frames and supporting elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C15/00—Component parts, details or accessories of machines, pumps or pumping installations, not provided for in groups F04C2/00 - F04C14/00
    • F04C15/06—Arrangements for admission or discharge of the working fluid, e.g. constructional features of the inlet or outlet
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C28/00—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids
    • F04C28/08—Control of, monitoring of, or safety arrangements for, pumps or pumping installations specially adapted for elastic fluids characterised by varying the rotational speed
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • F04C29/02—Lubrication; Lubricant separation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • F04C29/02—Lubrication; Lubricant separation
    • F04C29/025—Lubrication; Lubricant separation using a lubricant pump
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • F04C29/04—Heating; Cooling; Heat insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • F04C29/04—Heating; Cooling; Heat insulation
    • F04C29/045—Heating; Cooling; Heat insulation of the electric motor in hermetic pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • F04C29/04—Heating; Cooling; Heat insulation
    • F04C29/047—Cooling of electronic devices installed inside the pump housing, e.g. inverters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • F04C29/06—Silencing
    • F04C29/068—Silencing the silencing means being arranged inside the pump housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2220/00—Application
    • F04C2220/10—Vacuum
    • F04C2220/12—Dry running
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2240/00—Components
    • F04C2240/30—Casings or housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2240/00—Components
    • F04C2240/40—Electric motor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2240/00—Components
    • F04C2240/40—Electric motor
    • F04C2240/403—Electric motor with inverter for speed control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2240/00—Components
    • F04C2240/80—Other components
    • F04C2240/808—Electronic circuits (e.g. inverters) installed inside the machine

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Compressor (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)

Description

乾真空泵裝置及該乾真空泵裝置之冷卻方法Dry vacuum pump device and cooling method of the dry vacuum pump device

本發明係有關一種乾真空泵裝置及該乾真空泵裝置之冷卻方法，尤其是有關一種體積小且具有高效率冷卻結構的乾真空泵裝置以及一種將該乾真空泵裝置冷卻之方法。The present invention relates to a dry vacuum pump device and a method of cooling the dry vacuum pump device, and more particularly to a dry vacuum pump device having a small volume and a high efficiency cooling structure and a method of cooling the dry vacuum pump device.

近幾年來，可易於在大氣壓力下操作來產生真空環境的乾真空泵裝置，已被使用於包括半導體製造設備之廣泛應用。該乾真空泵裝置具有泵單元，其係由馬達所驅動。供應電力至馬達以便驅動該乾真空泵裝置之泵單元之供電裝置，經常為了各種原因而併合反相器(inverter，有稱為反向器、換流器等情形)。其中一種理由是，反相器可使得供應至馬達之電力之頻率高於商用頻率，因而增加了馬達之轉速，提高真空泵之排氣能力。由反相器控制之乾真空泵裝置，能夠使用較小之馬達而達到滿意之真空度。In recent years, dry vacuum pumping devices that can be easily operated under atmospheric pressure to create a vacuum environment have been used in a wide range of applications including semiconductor manufacturing equipment. The dry vacuum pump device has a pump unit that is driven by a motor. A power supply device that supplies electric power to the motor to drive the pump unit of the dry vacuum pump device often incorporates an inverter (in the case of an inverter, an inverter, etc.) for various reasons. One of the reasons is that the inverter can make the frequency of the power supplied to the motor higher than the commercial frequency, thereby increasing the rotational speed of the motor and improving the exhaust capability of the vacuum pump. A dry vacuum pump unit controlled by an inverter can achieve a satisfactory degree of vacuum using a smaller motor.

根據另一種理由，當氣室或類似者藉著操作乾真空泵裝置，而已被排氣至滿意之真空度時，且該乾真空泵裝置已經達到非常輕負荷之操作時，該反相器使得控制其輸出端電壓(output terminal voltage)變得容易，且亦能夠控制馬達之轉速，以便高效率地操作馬達。For another reason, when the air chamber or the like is exhausted to a satisfactory degree of vacuum by operating the dry vacuum pump device, and the dry vacuum pump device has reached a very light load operation, the inverter controls the The output terminal voltage becomes easy, and the rotational speed of the motor can also be controlled to operate the motor with high efficiency.

該反相器配合著其內之半導體開關裝置，而能夠於不同於經由AC/DC/AC轉換電路所應用之輸入電壓之頻率輸出電壓。該反相器需要組合適當之冷卻裝置，以便將該用 來改變頻率之半導體開關裝置加以冷卻，此乃因半導體開關裝置被其內部產生之損失所加熱。The inverter is coupled to the semiconductor switching device therein to output a voltage different from the frequency of the input voltage applied via the AC/DC/AC conversion circuit. The inverter needs to be combined with a suitable cooling device to use the The semiconductor switching device that changes the frequency is cooled, because the semiconductor switching device is heated by the loss generated inside thereof.

習知之乾真空泵裝置，其係與包括反相器之供電裝置組合，具有利用自然空氣循環或強制空氣循環之空氣冷卻結構，用以將該反相器之半導體開關裝置加以冷卻。習知之乾真空泵裝置亦有利用水冷式結構，以冷卻乾真空泵者，其係將冷卻劑循環經過安裝在乾真空泵之馬達外殼固定段下方之冷卻劑管，致使在該乾真空泵內之基板，能夠有效地被冷卻(參日本特許公開公告號2003-269369)。A conventional dry vacuum pump unit, in combination with a power supply unit including an inverter, has an air cooling structure utilizing natural air circulation or forced air circulation for cooling the semiconductor switching device of the inverter. The conventional dry vacuum pump device is also advantageous for the water-cooled structure to cool the dry vacuum pump, which circulates the coolant through the coolant tube installed under the fixed section of the motor casing of the dry vacuum pump, so that the substrate in the dry vacuum pump can It is effectively cooled (refer to Japanese Laid-Open Patent Publication No. 2003-269369).

在各種真空泵中，併合著空氣冷卻結構之真空泵馬達及殼體，是需要有相當大之冷卻區域。因此一些真空泵具有併合著冷卻劑循環結構之水冷式真空泵馬達及殼體(參PC(WO)專利申請案2006-520873以及日本特許公開公告號8-21392)。In various vacuum pumps, the vacuum pump motor and the housing in combination with the air cooling structure require a relatively large cooling area. Therefore, some of the vacuum pumps have a water-cooled vacuum pump motor and a housing in which a coolant circulation structure is incorporated (see PC (WO) Patent Application No. 2006-520873 and Japanese Patent Laid-Open Publication No. 8-21392).

在習知技術之利用自然空氣循環或強制空氣循環之空氣冷卻結構中，為了冷卻該反相器之半導體開關裝置，該空氣冷卻結構因冷卻效率低而有必要是大體積者，使得它本身成為為了減少乾真空泵裝置整體體積所作努力之障礙者。而該水冷式結構則僅能冷卻部分之乾真空泵，整體上無法有效地冷卻該乾真空泵裝置。In the air cooling structure using natural air circulation or forced air circulation in the prior art, in order to cool the semiconductor switching device of the inverter, the air cooling structure is required to be large in size due to low cooling efficiency, so that it becomes itself In order to reduce the overall volume of the dry vacuum pump device, the obstacles are made. The water-cooled structure can only cool part of the dry vacuum pump, and the dry vacuum pump unit cannot be effectively cooled as a whole.

鑒於上述習之技術之缺憾，本發明之目的在提供一種乾真空泵裝置，其包括反相器以供應交流電力於馬達，而驅動泵單元，以及高效率冷卻單元，以冷卻高自熱值大電 流電路元件單元，例如反相器之開關裝置，因而能夠使乾真空泵裝置之體積減少。另外，本發明並提供一種將該乾真空泵裝置冷卻之方法。In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide a dry vacuum pump apparatus including an inverter to supply alternating current power to a motor, a pump unit, and a high efficiency cooling unit to cool a high self-heating value. The flow circuit component unit, such as the switching device of the inverter, can thereby reduce the volume of the dry vacuum pump device. Additionally, the present invention provides a method of cooling the dry vacuum pump unit.

為了達到上述之目的，本發明提供一種乾真空泵裝置，包括：乾真空泵、反相器、電器設備殼體、泵殼體、液體冷卻隔壁(liquid cooled partition)、以及外殼。該乾真空泵具有泵單元及用於驅動該泵單元之馬達；該反相器將交流電源之交流電轉換為具有預定頻率之交流電並將之供應給該馬達；該電器設備殼體容納包括該反相器之控制電子電路總成；該泵殼體容納該乾真空泵以及該乾真空泵之操作監控感測器；該液體冷卻隔壁係介於該電器設備殼體及該泵殼體之間，且具有循環於其內之冷卻劑；而該外殼將該電器設備殼體、該泵殼體、以及該液體冷卻隔壁包容在其內，而形成整體結構。In order to achieve the above object, the present invention provides a dry vacuum pump apparatus comprising: a dry vacuum pump, an inverter, an electrical equipment housing, a pump housing, a liquid cooling partition, and an outer casing. The dry vacuum pump has a pump unit and a motor for driving the pump unit; the inverter converts an alternating current of an alternating current power source into an alternating current having a predetermined frequency and supplies the same to the motor; the electrical equipment housing housing includes the reverse phase a control electronic circuit assembly; the pump housing houses the dry vacuum pump and an operation monitoring sensor of the dry vacuum pump; the liquid cooling partition is interposed between the electrical device housing and the pump housing, and has a circulation a coolant therein; and the outer casing houses the electrical device casing, the pump casing, and the liquid cooling partition wall therein to form a unitary structure.

在本發明之較佳態樣中，該外殼具有界定於其內之冷卻劑通道，以供應冷卻劑起初至該液體冷卻隔壁，接著從該液體冷卻隔壁至該馬達，然後至該泵單元，以便陸續地冷卻該液體冷卻隔壁、該馬達、及該泵單元。In a preferred aspect of the invention, the outer casing has a coolant passage defined therein for supplying a coolant initially to the liquid cooling partition wall, and then cooling the partition wall from the liquid to the motor and then to the pump unit so that The liquid cooling partition, the motor, and the pump unit are successively cooled.

在本發明之較佳態樣中，該控制電子電路總成具有會產生熱之各電子元件，而各電子元件包括該反相器之開關裝置，而該液體冷卻隔壁提供冷卻結構，可將各電子元件冷卻。In a preferred aspect of the invention, the control electronics circuit assembly has electronic components that generate heat, and each of the electronic components includes a switching device of the inverter, and the liquid cooling partition provides a cooling structure. Electronic components are cooled.

在本發明之較佳態樣中，該液體冷卻隔壁係被固持而不與該乾真空泵之泵單元直接接觸，且被固定於由該泵單 元外牆延伸之框架上。In a preferred aspect of the invention, the liquid cooling partition is held without direct contact with the pump unit of the dry vacuum pump and is fixed by the pump On the framework of the extension of the Yuan exterior wall.

藉著上述之設置，該電器設備殼體將該具有反相器之控制電子電路總成容納於其內；而該泵殼體將該乾真空泵以及該乾真空泵之操作監控感測器容納於其內；且該液體冷卻隔壁係介於該電器設備殼體及該泵殼體之間，並具有循環於其內之冷卻劑；該外殼並將該電器設備殼體、該泵殼體、以及該液體冷卻隔壁包容在其內，而形成整體結構。循環於該液體冷卻隔壁內之冷卻劑可有效地將該電器設備殼體內之控制電子電路總成所產生之熱吸收，使得該電器設備殼體內之控制電子電路總成被極有效率地冷卻。此之所以乾真空泵裝置能夠僅具有小冷卻結構，且之所以其本身能夠為小體積之裝置。With the above arrangement, the electrical device housing houses the control electronic circuit assembly having the inverter therein; and the pump housing houses the dry vacuum pump and the operation monitoring sensor of the dry vacuum pump therein And the liquid cooling partition is interposed between the electrical equipment housing and the pump housing and has a coolant circulating therein; the housing and the electrical equipment housing, the pump housing, and the The liquid cooling partition is contained therein to form a unitary structure. The coolant circulating in the liquid cooling partition effectively absorbs the heat generated by the control electronics assembly within the electrical device housing such that the control electronics assembly within the electrical device housing is cooled extremely efficiently. The reason why the dry vacuum pump device can have only a small cooling structure, and it can itself be a small-volume device.

當其內界定有冷卻劑通道之該外殼供應冷卻劑起初至該液體冷卻隔壁，接著從該液體冷卻隔壁至該馬達，然後至該泵單元，以便陸續地冷卻該液體冷卻隔壁、該馬達、及該泵單元時，該包括有反相器之控制電子電路總成，即能夠起初地被冷卻劑所冷卻，接著該馬達及該泵單元陸續地被冷卻劑所冷卻。此之所以能夠減少該乾真空泵裝置之體積，且有效率地作整體上之冷卻。The housing, in which the coolant passage is defined, supplies coolant to the liquid cooling partition, and then cools the partition from the liquid to the motor, and then to the pump unit to successively cool the liquid cooling partition, the motor, and In the case of the pump unit, the control electronic circuit assembly including the inverter can be initially cooled by the coolant, and then the motor and the pump unit are successively cooled by the coolant. This makes it possible to reduce the volume of the dry vacuum pump unit and efficiently cool it as a whole.

用以冷卻容納於該電器設備殼體內之反相器開關裝置且會產生熱之各電子元件之該冷卻結構，可由該液體冷卻隔壁提供循環其內之冷卻劑。因此，各電子元件可藉由循環於該液體冷卻隔壁內之冷卻劑而有效率地被冷卻。The cooling structure for cooling the electronic switching elements of the inverter switching device housed in the housing of the electrical device and generating heat can be supplied with the coolant circulating therein by the liquid cooling partition. Therefore, each electronic component can be efficiently cooled by the coolant circulating in the liquid cooling partition.

該液體冷卻隔壁可設成不與該乾真空泵之泵單元直 接接觸，且固定於由該泵單元外牆延伸之框架上。因而能夠促使從該泵單元之熱吸收成為最小，並減少該乾真空泵之泵單元內牆表面之沉積。The liquid cooling partition wall can be set not to be straight with the pump unit of the dry vacuum pump Contact and fixed to the frame extending from the outer wall of the pump unit. It is thus possible to minimize the heat absorption from the pump unit and to reduce the deposition of the inner wall surface of the pump unit of the dry vacuum pump.

本發明亦提供一種乾真空泵裝置，其包括：乾真空泵、反相器、第一電器設備殼體、第二電器設備殼體、外殼、冷卻單元、以及空氣冷卻結構，其中該乾真空泵包括泵單元及用於驅動該泵單元之馬達；該反相器將交流電源之交流電轉換為具有預定頻率之交流電並將之供應給該馬達；該第一電器設備殼體將作為產生熱之大電流電路之反相器容納於其內；該第二電器設備殼體容納包括中央處理器(CPU)之控制電子電路，以控制該乾真空泵之運作；該外殼可容納該第一電器設備殼體及該第二電器設備殼體，而形成整體結構。該冷卻單元利用冷卻劑，以將該第一電器設備殼體予以冷卻；且該空氣冷卻結構，係利用自然空氣循環或者是強制空氣循環，以便將該第二電器設備殼體予以冷卻。The present invention also provides a dry vacuum pump apparatus comprising: a dry vacuum pump, an inverter, a first electrical equipment housing, a second electrical equipment housing, a housing, a cooling unit, and an air cooling structure, wherein the dry vacuum pump includes a pump unit And a motor for driving the pump unit; the inverter converts an alternating current of an alternating current power source into an alternating current having a predetermined frequency and supplies the same to the motor; the first electrical equipment housing is to be a high current circuit for generating heat An inverter is housed therein; the second electrical device housing houses a control electronic circuit including a central processing unit (CPU) to control operation of the dry vacuum pump; the housing can accommodate the first electrical device housing and the first The second electrical device housing forms an integral structure. The cooling unit utilizes a coolant to cool the first electrical equipment housing; and the air cooling structure utilizes natural air circulation or forced air circulation to cool the second electrical equipment housing.

在本發明之較佳態樣中，該乾真空泵包括齒輪單元(gear unit)，而該冷卻單元包含利用冷卻水作為冷卻劑之可供冷卻該馬達或該乾真空泵齒輪單元之冷卻單元。In a preferred aspect of the invention, the dry vacuum pump includes a gear unit, and the cooling unit includes a cooling unit for cooling the motor or the dry vacuum pump gear unit using cooling water as a coolant.

本發明進一步提供一種冷卻乾真空泵裝置之方法，其中該乾真空泵裝置包括乾真空泵、反相器、第一電器設備殼體、第二電器設備殼體、外殼、以及冷卻單元，其中該乾真空泵包括泵單元及用於驅動該泵單元之馬達；該反相器將交流電源之交流電轉換為具有預定頻率之交流電並將 之供應給該馬達；該第一電器設備殼體將作為熱產生之高自熱值大電流電路之反相器容納於其內；該第二電器設備殼體容納包括中央處理器之控制電子電路，以控制該乾真空泵之運作；該外殼可容納該第一電器設備殼體及該第二電器設備殼體，而形成整體結構。該冷卻方法包含：利用冷卻劑，以將該第一電器設備殼體予以冷卻；且利用自然空氣循環或者是強制空氣循環，以便將該第二電器設備殼體予以冷卻。The present invention further provides a method of cooling a dry vacuum pump device, wherein the dry vacuum pump device comprises a dry vacuum pump, an inverter, a first electrical equipment housing, a second electrical equipment housing, a housing, and a cooling unit, wherein the dry vacuum pump comprises a pump unit and a motor for driving the pump unit; the inverter converts an alternating current of an alternating current power source into an alternating current having a predetermined frequency and Provided to the motor; the first electrical device housing houses therein an inverter that is a thermally generated high self-heating value high current circuit; the second electrical device housing houses a control electronic circuit including a central processing unit To control the operation of the dry vacuum pump; the outer casing can accommodate the first electrical equipment housing and the second electrical equipment housing to form a unitary structure. The cooling method includes: utilizing a coolant to cool the first electrical device housing; and utilizing natural air circulation or forced air circulation to cool the second electrical equipment housing.

由於該第一電器設備殼體容納其內之作為熱產生之高自熱值大電流電路之反相器該冷卻單元利用冷卻劑予以高效率地冷卻，該乾真空泵裝置能夠僅具有小的冷卻結構，且因而其自身能夠為小體積之裝置。The dry vacuum pump device can have only a small cooling structure because the first electrical device housing houses an inverter therein as a heat-generating high self-heating value high current circuit that is efficiently cooled by a coolant And thus it can itself be a small volume device.

本發明各較佳實施例將參照圖式詳述於後，各視圖中相同或對應之組件將以相同或對應之元件符號標示，而其等之纍贅敘述將為了簡潔之緣故而盡可能地避免。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE INVENTION The same or corresponding components will be denoted by the same or corresponding component symbols in the various views, and the cumbersome description thereof will be avoided as much as possible for the sake of brevity. .

第1圖係根據本發明之一種乾真空泵裝置之系統配置圖之方塊圖，其顯示該乾真空泵裝置包括含有整流器13之供電器10、具有濾波電容器(smoothing capacitor)14、直流/直流轉換電路16及反相器17之直流電路15、含有馬達12a及泵單元12b之乾真空泵12，以及控制電路18。該供電器10及該控制電路18可被稱為「控制電子電路總成」。該整流器13係連接至交流電供電器19。該交流電供電器19供應交流電至該乾真空泵12，以便將該交流電轉 換成直流電。在該控制電路18之控制下，該直流/直流轉換電路16將來自該整流器13之直流電轉換成具有預定電壓之直流電而供應至該反相器17。而在該控制電路18之控制下，該反相器17將來自該直流/直流轉換電路16之直流電轉換成具有預定頻率之交流電而供應至該乾真空泵12之馬達12a，而馬達12a被通電後即驅動該泵單元12b，藉以操作該乾真空泵12。1 is a block diagram of a system configuration diagram of a dry vacuum pump apparatus according to the present invention, which shows that the dry vacuum pump apparatus includes a power supply 10 including a rectifier 13, a smoothing capacitor 14, and a DC/DC conversion circuit 16 And a DC circuit 15 of the inverter 17, a dry vacuum pump 12 including a motor 12a and a pump unit 12b, and a control circuit 18. The power supply 10 and the control circuit 18 may be referred to as "control electronic circuit assemblies." The rectifier 13 is connected to an alternating current power supply 19. The alternating current power supply 19 supplies alternating current power to the dry vacuum pump 12 to turn the alternating current Switch to DC. Under the control of the control circuit 18, the DC/DC conversion circuit 16 converts the direct current from the rectifier 13 into a direct current having a predetermined voltage and supplies it to the inverter 17. Under the control of the control circuit 18, the inverter 17 converts the direct current from the DC/DC conversion circuit 16 into an alternating current having a predetermined frequency and supplies it to the motor 12a of the dry vacuum pump 12, and after the motor 12a is energized. That is, the pump unit 12b is driven to operate the dry vacuum pump 12.

在具有上述系統配置之乾真空泵裝置中，當操作該乾真空泵12時，該整流器13之整流裝置、該直流電路15之濾波電容器14、該直流/直流轉換電路16之開關裝置、以及該反相器17之開關裝置等在輸出電力以通電該馬達12a時，會產生熱。且該乾真空泵12之馬達12a及泵單元12b亦會產生熱。根據本發明之乾真空泵裝置併合著小體積之冷卻結構，以便有效率地吸收由上述各開關及乾真空泵裝置之電子元件與電子裝置所產生之熱，俾將該乾真空泵裝置予以冷卻。該併合小體積冷卻結構之乾真空泵裝置亦為小體積之裝置。In the dry vacuum pump device having the above system configuration, when the dry vacuum pump 12 is operated, the rectifying device of the rectifier 13, the filter capacitor 14 of the DC circuit 15, the switching device of the DC/DC converting circuit 16, and the inverting When the switching device or the like of the device 17 outputs electric power to energize the motor 12a, heat is generated. The motor 12a and the pump unit 12b of the dry vacuum pump 12 also generate heat. The dry vacuum pump device according to the present invention incorporates a small-volume cooling structure to efficiently absorb the heat generated by the electronic components and electronic devices of the switches and dry vacuum pump devices described above, and to cool the dry vacuum pump device. The dry vacuum pump device incorporating the small volume cooling structure is also a small volume device.

第2圖係根據本發明之一實施例之乾真空泵裝置20之結構配置示意圖，其顯示該乾真空泵裝置20包括電器設備殼體21、泵殼體22、以及介於該電器設備殼體21及該泵殼體22之間的液體冷卻隔壁23。有外殼22將該電器設備殼體21、該泵殼體22、以及該液體冷卻隔壁23包容在其內，而形成整體結構。2 is a schematic structural view of a dry vacuum pump device 20 according to an embodiment of the present invention, which shows that the dry vacuum pump device 20 includes an electrical equipment housing 21, a pump housing 22, and an electrical equipment housing 21 and The liquid between the pump housings 22 cools the partition walls 23. A housing 22 houses the electrical device housing 21, the pump housing 22, and the liquid cooling partition 23 therein to form a unitary structure.

該電器設備殼體21將會產生熱之各種電子元件及電 子裝置容納於其內，其等係包括該整流器13之整流裝置、該直流電路15之濾波電容器14、該直流/直流轉換電路16之開關裝置、該反相器17之開關裝置、以及該控制電路18之電子元件。而該泵殼體22則將二個乾真空泵12-1、12-2以及該等乾真空泵12-1、12-2之操作監視感測器(未圖示)容納於其內。因為容納於該電器設備殼體21之各電子元件及電子裝置會產生熱，他們係被設置於二個乾真空泵12-1、12-2之上方。而該液體冷卻隔壁23則被設置於各電子元件及電子裝置以及二個乾真空泵12-1、12-2之間，俾隔離由二個乾真空泵12-1、12-2所產生之熱，使不致傳遞至該電器設備殼體21內之各電子元件及電子裝置。The electrical device housing 21 will generate various electronic components and electricity for heat The sub-device is housed therein, and includes a rectifying device of the rectifier 13, a filter capacitor 14 of the DC circuit 15, a switching device of the DC/DC converting circuit 16, a switching device of the inverter 17, and the control The electronic components of circuit 18. The pump housing 22 houses the two dry vacuum pumps 12-1, 12-2 and the operational monitoring sensors (not shown) of the dry vacuum pumps 12-1, 12-2 therein. Since the electronic components and electronic devices housed in the electrical device casing 21 generate heat, they are disposed above the two dry vacuum pumps 12-1, 12-2. The liquid cooling partition 23 is disposed between each of the electronic components and the electronic device and the two dry vacuum pumps 12-1 and 12-2 to isolate the heat generated by the two dry vacuum pumps 12-1 and 12-2. It is not transmitted to the electronic components and electronic devices in the electrical device casing 21.

該乾真空泵12-1包含馬達12-1a、泵單元12-1b、以及齒輪單元12-1c。同樣地，該乾真空泵12-2也包含馬達12-2a、泵單元12-2b、以及齒輪單元12-2c。於操作該等乾真空泵12-1、12-2之馬達12-1a、12-2a、泵單元12-1b、12-2b以及齒輪單元12-1c、12-2c時亦會產生熱。該乾真空泵12-1具有殼體，其包含進氣口27，而該真空泵12-2則包含具有排氣口28之殼體。The dry vacuum pump 12-1 includes a motor 12-1a, a pump unit 12-1b, and a gear unit 12-1c. Similarly, the dry vacuum pump 12-2 also includes a motor 12-2a, a pump unit 12-2b, and a gear unit 12-2c. Heat is also generated when the motors 12-1a, 12-2a, the pump units 12-1b, 12-2b, and the gear units 12-1c, 12-2c of the dry vacuum pumps 12-1, 12-2 are operated. The dry vacuum pump 12-1 has a housing that includes an intake port 27, and the vacuum pump 12-2 includes a housing having an exhaust port 28.

該液體冷卻隔壁23係被設成不與該等乾真空泵12-1、12-2之泵單元12--1b、12-2b直接接觸，且被固定於由該等泵單元12-1b、12-2b之外牆延伸之框架上。The liquid cooling partition 23 is disposed not in direct contact with the pump units 12-1b, 12-2b of the dry vacuum pumps 12-1, 12-2, and is fixed to the pump units 12-1b, 12 by the pumps -2b on the outer wall of the frame.

該外殼24，或者更具體地說是該液體冷卻隔壁23及該泵殼體22具有界定於其內之冷卻劑通道25，以讓例如冷卻水(亦即冷水)之冷卻劑流過。該冷卻劑經安排以供應 冷卻水W起初至該液體冷卻隔壁23，接著從該液體冷卻隔壁23至該等乾真空泵12-1、12-2之馬達12-1a、12-2a，然後至該等乾真空泵12-1、12-2之泵單元12-1b、12-2b，以便在冷卻水W流過時，陸續地冷卻會產生熱之各電子元件及電子裝置。The outer casing 24, or more specifically the liquid cooling partition 23 and the pump casing 22, has a coolant passage 25 defined therein for allowing a coolant such as cooling water (i.e., cold water) to flow therethrough. The coolant is arranged to supply The cooling water W initially reaches the liquid cooling partition 23, and then the liquid cooling partition 23 is supplied to the motors 12-1a, 12-2a of the dry vacuum pumps 12-1, 12-2, and then to the dry vacuum pumps 12-1, The pump units 12-1b, 12-2b of 12-2 are used to successively cool the electronic components and electronic devices that generate heat when the cooling water W flows.

如上所述，該液體冷卻隔壁23係介於該電器設備殼體21及該泵殼體22之間，且該冷卻劑通道25經安排以供應冷卻水W起初至該液體冷卻隔壁23，接著從該液體冷卻隔壁23至該等乾真空泵12-1、12-2之馬達12-1a、12-2a，然後至該等泵單元12-1b、12-2b。如此將能夠有效率地冷卻傾向產生相當熱而導致故障之各電子元件及電子裝置。而且亦能使容納著該整流器13、該直流電路15、該直流/直流轉換電路16、該反相器17、以及該控制電路18之電器設備殼體21有效地熱隔絕容納著乾真空泵12-1、12-2之該泵殼體22。因此，使得併合著冷卻劑通道25之該乾真空泵裝置20在整個體積上減至最小，而尺寸大小亦為之減少。As described above, the liquid cooling partition 23 is interposed between the electrical equipment housing 21 and the pump housing 22, and the coolant passage 25 is arranged to supply cooling water W to the liquid cooling partition 23, and then from The liquid cools the partition 23 to the motors 12-1a, 12-2a of the dry vacuum pumps 12-1, 12-2 and then to the pump units 12-1b, 12-2b. In this way, it is possible to efficiently cool the electronic components and electronic devices that tend to generate considerable heat and cause malfunction. Moreover, the electrical equipment housing 21 housing the rectifier 13, the DC circuit 15, the DC/DC conversion circuit 16, the inverter 17, and the control circuit 18 can be effectively thermally insulated to accommodate the dry vacuum pump 12-1. The pump housing 22 of 12-2. Therefore, the dry vacuum pump unit 20 that causes the coolant passage 25 to be combined is minimized over the entire volume, and the size is also reduced.

第3A圖係冷卻結構之側視圖，該冷卻結構係供冷卻容納於該電器設備殼體21內之該整流器13之整流裝置、該直流電路15之濾波電容器14、該直流/直流轉換電路16之開關裝置、該反相器17之開關裝置、以及該控制電路18之電子元件。第3B圖係第3A圖之平面圖。如第3A、3B圖所示，屬於該整流器13、該直流電路15、該直流/直流轉換電路16、該反相器17、以及該控制電路18而會產生 熱之電子元件及電子裝置，係安裝於該其內有冷卻水循環之液體冷卻隔壁23。3A is a side view of a cooling structure for cooling a rectifier of the rectifier 13 housed in the electrical device housing 21, a filter capacitor 14 of the DC circuit 15, and a DC/DC conversion circuit 16 A switching device, a switching device of the inverter 17, and electronic components of the control circuit 18. Figure 3B is a plan view of Figure 3A. As shown in FIGS. 3A and 3B, the rectifier 13, the DC circuit 15, the DC/DC conversion circuit 16, the inverter 17, and the control circuit 18 are generated. The thermal electronic component and the electronic device are mounted on the liquid cooling partition 23 in which the cooling water is circulated.

該液體冷卻隔壁23內部界定著該冷卻劑通道25，其內有作為冷卻劑之冷卻水W循環著。該冷卻水是供應至該冷卻劑通道25。該液體冷卻隔壁23係由高熱導率(high thermal conductivity)材料製成，例如金屬，譬如鋁。依照此種配置，容納於電器設備殼體21內之電子元件及電子裝置所產生之熱被傳遞至該液體冷卻隔壁23，且被流經該冷卻劑通道25之冷卻水有效地吸收。The inside of the liquid cooling partition 23 defines the coolant passage 25 in which the cooling water W as a coolant circulates. This cooling water is supplied to the coolant passage 25. The liquid cooling partition 23 is made of a high thermal conductivity material such as a metal such as aluminum. According to this configuration, heat generated by the electronic components and electronic devices housed in the electrical device casing 21 is transferred to the liquid cooling partition 23, and is efficiently absorbed by the cooling water flowing through the coolant passage 25.

在此一實施例中，該泵殼體22內容納著二個乾真空泵12--1、12-2。然而，該泵殼體22內亦可容納著單一乾真空泵、或三個或更多個乾真空泵。In this embodiment, the pump housing 22 houses two dry vacuum pumps 12-1, 12-2. However, the pump housing 22 can also house a single dry vacuum pump, or three or more dry vacuum pumps.

如上所述，根據本實施例之乾真空泵裝置20包括該電器設備殼體21，其內容納著控制電子電路總成(control electronic circuit assembly)，即該整流器13、該直流電路15、該直流/直流轉換電路16、該反相器17、以及該控制電路18。而該泵殼體22將二個乾真空泵12-1、12-2以及乾真空泵12-1、12-2之操作監視感測器容納於其內。且該液體冷卻隔壁23係介於該電器設備殼體21及該泵殼體22之間，且具有冷卻劑通道25以便循環冷卻劑。外殼24將該電器設備殼體21、該泵殼體22、以及該液體冷卻隔壁23包容在其內，而形成整體結構。冷卻劑係被循環經過設於該液體冷卻隔壁23內之冷卻劑通道25，以便吸收由容納於電器設備殼體21內之電子元件及電子裝置所產 生之熱，因而能夠有效率地冷卻容納於電器設備殼體21內之電子元件及電子裝置。該包括有液體冷卻隔壁23之冷卻結構之體積很小，因此該併合著冷卻結構之乾真空泵裝置20亦為小體積之裝置。As described above, the dry vacuum pump device 20 according to the present embodiment includes the electric device housing 21, which houses a control electronic circuit assembly, that is, the rectifier 13, the direct current circuit 15, the direct current / A DC conversion circuit 16, the inverter 17, and the control circuit 18. The pump housing 22 houses the two dry vacuum pumps 12-1, 12-2 and the operation monitoring sensors of the dry vacuum pumps 12-1, 12-2 therein. And the liquid cooling partition 23 is interposed between the electrical equipment housing 21 and the pump housing 22, and has a coolant passage 25 for circulating a coolant. The outer casing 24 houses the electrical device casing 21, the pump casing 22, and the liquid cooling partition 23 therein to form a unitary structure. The coolant is circulated through the coolant passage 25 provided in the liquid cooling partition 23 to absorb the electronic components and electronic devices housed in the electrical equipment casing 21 The heat generated thereby enables efficient cooling of the electronic components and electronic devices housed in the housing 21 of the electrical device. The cooling structure including the liquid cooling partition 23 has a small volume, so that the dry vacuum pump unit 20 which is combined with the cooling structure is also a small-volume device.

第4圖係根據本發明之另一實施例之乾真空泵裝置20a之結構配置示意圖，在如圖所示之乾真空泵裝置20a中，乾真空泵12之泵單元12b係被置於該外殼24之中央，而馬達12a及齒輪單元12c則被置於該泵單元12b之每一側。容納著該反相器17(參照第1圖)與其它電子元件及電子裝置之第一電器設備殼體31係設置於該馬達12a之側邊。利用例如水作為冷卻劑之高效率冷卻單元30，係用來冷卻馬達12a及第一電器設備殼體31，而置於馬達12a及第一電器設備殼體31之間。另一個利用例如水作為冷卻劑之高效率冷卻單元32，係設置於該齒輪單元12c之側邊。容納著具有電子元件(包括一中央處理器)之控制電路18(參照第1圖)之第二電器設備殼體33，係置於該泵單元12b與該馬達12a之上方。該泵單元12b具有包括有進氣口27及排氣口28之殼體。Fig. 4 is a schematic view showing the configuration of a dry vacuum pump unit 20a according to another embodiment of the present invention. In the dry vacuum pump unit 20a as shown, the pump unit 12b of the dry vacuum pump 12 is placed in the center of the outer casing 24. The motor 12a and the gear unit 12c are placed on each side of the pump unit 12b. The first electric device casing 31 that houses the inverter 17 (see FIG. 1) and other electronic components and electronic devices is disposed on the side of the motor 12a. The high efficiency cooling unit 30, which uses, for example, water as a coolant, is used to cool the motor 12a and the first electrical equipment casing 31, and is placed between the motor 12a and the first electrical equipment casing 31. Another high efficiency cooling unit 32 using, for example, water as a coolant is disposed on the side of the gear unit 12c. A second electrical device housing 33 housing a control circuit 18 (see FIG. 1) having electronic components (including a central processing unit) is disposed above the pump unit 12b and the motor 12a. The pump unit 12b has a housing including an intake port 27 and an exhaust port 28.

該泵單元12b包含例如正排量真空泵(positive-displacement vacuum pump)，其具有置於轉子殼體內之二個轉軸以及固定於該等轉軸上之複數對組之羅茨式轉子(roots-type rotors)。該等轉子係相互隔著一小間隙，且亦與該轉子殼體之內圓周表面隔著小間隙，因此固定於該等轉軸上之轉子能夠繞著其等之軸心旋轉，而不 會彼此碰觸或與轉子殼體碰觸。該轉子殼體之一系列之轉子隔室，係沿著各轉軸被界定且將複數對組之轉子容納於其內，以便傳遞氣體使之被泵經各轉子隔室。該馬達12a具有與其中之一個轉軸聯結之輸出軸。當該馬達12a通電後，該輸出軸即轉動與其聯結之轉軸，其即經由該齒輪單元12c之各齒輪而轉動另一個轉軸。該等轉軸即可透過該進氣口27，以吸入氣體，或經由該排氣口28以將氣體排出。The pump unit 12b includes, for example, a positive-displacement vacuum pump having two rotating shafts disposed in the rotor housing and a plurality of pairs of Roots-type rotors fixed to the rotating shafts (roots-type rotors) ). The rotors are separated from each other by a small gap, and also have a small gap with the inner circumferential surface of the rotor casing, so that the rotors fixed to the shafts can rotate about their axes, without Will touch each other or touch the rotor housing. A series of rotor compartments of the rotor housing are defined along each of the rotating shafts and house a plurality of pairs of rotors therein for transferring gas to be pumped through the rotor compartments. The motor 12a has an output shaft coupled to one of the rotating shafts. When the motor 12a is energized, the output shaft rotates the shaft to which it is coupled, that is, the other shaft is rotated via the gears of the gear unit 12c. The shafts can pass through the intake port 27 to draw in gas or through the exhaust port 28 to discharge the gas.

當該馬達12a通電後，其轉子即產生熱。所產生之熱於是傳遞至該馬達12a之殼體，進而增加溫度。且當二個轉軸轉動後，齒輪單元12c之各齒輪亦產生熱。所產生之熱於是傳遞至齒輪單元12c之齒輪箱，進而增加其溫度。馬達殼體係由高效率冷卻單元30之冷卻劑(例如水)所冷卻；而齒輪箱則由高效率冷卻單元32之冷卻劑(例如水)所冷卻者。When the motor 12a is energized, its rotor generates heat. The heat generated is then transferred to the housing of the motor 12a, which in turn increases the temperature. And when the two rotating shafts rotate, the gears of the gear unit 12c also generate heat. The generated heat is then transferred to the gearbox of the gear unit 12c, thereby increasing its temperature. The motor housing is cooled by a coolant (e.g., water) of the high efficiency cooling unit 30; and the gearbox is cooled by a coolant (e.g., water) of the high efficiency cooling unit 32.

如上所述，當操作乾真空泵裝置20a時，馬達殼體係因馬達12a之轉子所產生之熱而導致溫度提昇；而齒輪箱則因齒輪單元12c之旋轉齒輪所產生之熱而導致溫度提昇。根據此一實施例，通常利用水冷系統之高效率冷卻單元(冷卻結構)30、32係用來冷卻馬達殼體及齒輪箱。該供應驅動力至馬達12a之反相器17(參照第1圖)包括例如絕緣柵雙極電晶體(IGBTs)之開關裝置。該反相器17之各開關裝置由於電流流經各開關以及因各開關所引起的開關損失，而產生相當高之熱量，因此該反相器17有必要加以冷 卻。根據此一實施例，用來冷卻馬達殼體之高效率冷卻單元30係作為冷卻該反相器17之用。As described above, when the dry vacuum pump device 20a is operated, the motor casing is heated by the heat generated by the rotor of the motor 12a; and the gearbox is heated by the heat generated by the rotating gear of the gear unit 12c. According to this embodiment, a high efficiency cooling unit (cooling structure) 30, 32, typically utilizing a water cooling system, is used to cool the motor housing and the gearbox. The inverter 17 that supplies the driving force to the motor 12a (refer to Fig. 1) includes switching devices such as insulated gate bipolar transistors (IGBTs). The switching devices of the inverter 17 generate a relatively high amount of heat due to current flowing through the switches and switching losses caused by the switches, so the inverter 17 needs to be cooled. but. According to this embodiment, the high efficiency cooling unit 30 for cooling the motor housing serves to cool the inverter 17.

用來冷卻乾真空泵裝置20a之控制電路18(參照第1圖)具有電子元件。該控制電路18之電子元件，包括該控制泵之中央處理器，並非高自熱值。只要該控制電路18係置於該控制電路18之電子元件可使用之經常保持在環境溫度下之位置，該控制電路18並不需要具有特別之散熱結構，但假設該乾真空泵裝置20a會被使用於通常操作範圍以外之條件下，要與包括強制空氣冷卻系統併合之氣冷結構組合在一起。The control circuit 18 (refer to Fig. 1) for cooling the dry vacuum pump device 20a has electronic components. The electronic components of the control circuit 18, including the central processor of the control pump, are not high self-heating values. As long as the control circuit 18 is placed in a position where the electronic components of the control circuit 18 can be used to maintain the ambient temperature, the control circuit 18 does not need to have a special heat dissipation structure, but it is assumed that the dry vacuum pump device 20a will be used. Combined with an air-cooled structure that includes a forced air cooling system, outside the normal operating range.

如上所述，用來冷卻馬達12a之利用例如水冷系統之高效率冷卻單元30係被當作冷卻裝置，以吸收由該反相器17之各開關裝置所產生之熱量，然而包括有強制空氣冷卻系統之氣冷結構則是被用來冷卻並非高自熱值之控制電路18之電子元件。因此，該乾真空泵裝置20a具有簡單而有效率之最小體積冷卻結構。As described above, the high efficiency cooling unit 30 for cooling the motor 12a using, for example, a water cooling system is used as a cooling device to absorb the heat generated by the switching devices of the inverter 17, but includes forced air cooling. The air-cooled structure of the system is used to cool electronic components of the control circuit 18 that are not high self-heating values. Therefore, the dry vacuum pump device 20a has a simple and efficient minimum volume cooling structure.

第5圖係根據本發明之又另一實施例之一種乾真空泵裝置20b之結構配置示意圖，第5圖所示之乾真空泵裝置20b與第4圖係所示之乾真空泵裝置20a相差在於將該反相器17(參第1圖)以及其它電子元件及電子裝置容納於其內之該第一電器設備殼體31係置於該齒輪單元12c之一側，而作為冷卻該齒輪單元12c之齒輪箱則置於該齒輪單元12c與該第一電器設備殼體31之間。第5圖所示之乾真空泵裝置20b之其它詳細結構與第4圖係所示之乾真空泵 裝置20a相同。5 is a schematic structural view showing a dry vacuum pump device 20b according to still another embodiment of the present invention, and the dry vacuum pump device 20b shown in FIG. 5 is different from the dry vacuum pump device 20a shown in FIG. 4 in that The first electrical device housing 31 in which the inverter 17 (refer to FIG. 1) and other electronic components and electronic devices are housed is placed on one side of the gear unit 12c, and serves as a gear for cooling the gear unit 12c. The case is placed between the gear unit 12c and the first electrical device housing 31. The other detailed structure of the dry vacuum pump device 20b shown in Fig. 5 and the dry vacuum pump shown in Fig. 4 Device 20a is identical.

如上所述，用來冷卻該齒輪單元12c之齒輪箱之高效率冷卻單元32係被當作冷卻裝置，以吸收由該反相器17之各開關裝置所產生之熱量，然而包括有強制空氣冷卻系統之氣冷結構則是被用來冷卻並非高自熱值之控制電路18之電子元件。因此，該乾真空泵裝置20a具有簡單而有效率之最小體積冷卻結構。As described above, the high efficiency cooling unit 32 for cooling the gear unit of the gear unit 12c is used as a cooling device to absorb the heat generated by the switching devices of the inverter 17, but includes forced air cooling. The air-cooled structure of the system is used to cool electronic components of the control circuit 18 that are not high self-heating values. Therefore, the dry vacuum pump device 20a has a simple and efficient minimum volume cooling structure.

第6圖係根據本發明之再另一實施例之一種乾真空泵裝置之結構20c配置示意圖，第6圖所示之乾真空泵裝置20c與第4圖係所示之乾真空泵裝置20a相差在於，控制電路冷卻風扇34係置於該控制電路18之一側(參照第1圖)，而該控制電路18與該控制電路冷卻風扇34係被容納於第二電器設備殼體33內，因此由該控制電路18所產生之熱，係被冷卻風扇34帶來之空氣強制散熱，俾冷卻該控制電路18。第6圖所示之乾真空泵裝置20c之其它詳細結構與第4圖係所示之乾真空泵裝置20a相同。Figure 6 is a schematic view showing the configuration of a structure 20c of a dry vacuum pump device according to still another embodiment of the present invention, and the dry vacuum pump device 20c shown in Fig. 6 is different from the dry vacuum pump device 20a shown in Fig. 4 in that control The circuit cooling fan 34 is disposed on one side of the control circuit 18 (refer to FIG. 1), and the control circuit 18 and the control circuit cooling fan 34 are housed in the second electrical device housing 33, and thus the control The heat generated by the circuit 18 is forced to dissipate heat by the air from the cooling fan 34, and the control circuit 18 is cooled. The other detailed structure of the dry vacuum pump unit 20c shown in Fig. 6 is the same as that of the dry vacuum pump unit 20a shown in Fig. 4.

如上所述，用來冷卻馬達12a之高效率冷卻單元30係被當作冷卻裝置，以吸收由該反相器17之各開關裝置所產生之熱量，然而在控制電路18側之該控制電路冷卻風扇34係被當作冷卻裝置，以強制空氣冷卻並非高自熱值之控制電路18之電子元件。因此，該乾真空泵裝置20c具有簡單而有效率之最小體積冷卻結構。As described above, the high-efficiency cooling unit 30 for cooling the motor 12a is used as a cooling means for absorbing the heat generated by the switching means of the inverter 17, but the control circuit is cooled on the side of the control circuit 18. The fan 34 is used as a cooling device to force air to cool the electronic components of the control circuit 18 that are not high self-heating values. Therefore, the dry vacuum pump device 20c has a simple and efficient minimum volume cooling structure.

於乾真空泵裝置20a、20b、20c中，供電器10(參照第1圖)以及包含有馬達12a、泵單元12b、齒輪單元12c 之乾真空泵12係被容納於該外殼24內，而形成整體結構。乾真空泵裝置20a、20b、20c中之每一者包括著該第一電器設備殼體31，其內容納有高自熱值之大電流電路，通常為該反相器17；而該第二電器設備殼體33容納著具有非高自熱值之電子元件(通常為一泵控制中央處理器)之控制電路18。乾真空泵裝置20a、20b、20c中之每一者進一步包括第三電器設備殼體，其內容納著乾真空泵12之操作監視感測器。該其內容納有高自熱值大電流電路通常為反相器17之第一電器設備殼體31，係由高效率冷卻單元所冷卻，該冷卻單元係利用水作為冷卻劑來冷卻馬達12a、或齒輪單元12c；而另外，容納具有非高自熱值之電子元件(通常為泵控制中央處理器)之控制電路18，係由自然空氣循環或強制空氣循環所冷卻者。In the dry vacuum pump devices 20a, 20b, and 20c, the power supplier 10 (refer to FIG. 1) and the motor 12a, the pump unit 12b, and the gear unit 12c The dry vacuum pump 12 is housed in the outer casing 24 to form a unitary structure. Each of the dry vacuum pump devices 20a, 20b, 20c includes the first electrical device housing 31 that houses a high current circuit with a high self-heating value, typically the inverter 17; and the second electrical device The device housing 33 houses a control circuit 18 having electronic components (typically a pump control central processor) having a non-high self-heating value. Each of the dry vacuum pump devices 20a, 20b, 20c further includes a third electrical device housing that houses the operational monitoring sensor of the dry vacuum pump 12. The high electrical current value high current circuit, which is usually the first electrical equipment housing 31 of the inverter 17, is cooled by a high efficiency cooling unit that uses water as a coolant to cool the motor 12a, Or the gear unit 12c; and in addition, the control circuit 18 that houses the electronic component (usually a pump control central processor) having a non-high self-heating value is cooled by natural air circulation or forced air circulation.

如上所述，本發明之乾真空泵裝置包括其內容納高自熱值大電流電路(通常是該反相器17)之該第一電器設備殼體31以及其內容納該控制電路18(通常是一泵控制中央處理器)之該第二電器設備殼體33。該第一電器設備殼體31係由高效率冷卻單元以冷卻劑所冷卻，而該第二電器設備殼體33則由空氣冷卻結構以自然空氣循環或強制空氣循環所冷卻者。其內容納有高自熱值大電流電路(通常是該反相器17)之該第一電器設備殼體31係經高效率地冷卻，因而乾真空泵裝置之體積可以減小。As described above, the dry vacuum pump device of the present invention includes the first electrical device housing 31 that houses the high self-heating value high current circuit (typically the inverter 17) and the control circuit 18 (usually A second electrical device housing 33 of a central control unit is controlled by a pump. The first electrical equipment housing 31 is cooled by a high efficiency cooling unit with a coolant, and the second electrical equipment housing 33 is cooled by an air cooling structure by natural air circulation or forced air circulation. The first electrical device housing 31, which houses a high self-heating value high current circuit (usually the inverter 17), is cooled with high efficiency, so that the volume of the dry vacuum pump device can be reduced.

在上述實施例中，冷卻水被作為冷卻劑而流經該冷卻劑通道25。不過，任何除了冷卻水以外之冷卻劑亦可用在 冷卻劑通道25。除此之外，任何除了冷卻水以外之冷卻劑亦可用在高效率冷卻單元中30、32。In the above embodiment, the cooling water is passed through the coolant passage 25 as a coolant. However, any coolant other than cooling water can be used. Coolant passage 25. In addition to this, any coolant other than cooling water can be used in the high efficiency cooling unit 30, 32.

雖然本發明若干較佳實施例已經詳細圖示及敘述，但應可瞭解的是，在不偏離附件申請專利範圍之範疇下，仍然可對本發明做各種改變及變化。While the invention has been shown and described with reference to the embodiments of the embodiments of the present invention, it is understood that various modifications and changes can be made in the invention without departing from the scope of the appended claims.

10‧‧‧供電器10‧‧‧Power supply

12、12-1、12-2‧‧‧乾真空泵12, 12-1, 12-2‧‧‧ dry vacuum pump

12a、12-1a、12-2a‧‧‧馬達12a, 12-1a, 12-2a‧‧ ‧ motor

12b、12-1b、12-2b‧‧‧泵單元12b, 12-1b, 12-2b‧‧‧ pump unit

12c、12-1c、12-2c‧‧‧齒輪單元12c, 12-1c, 12-2c‧‧‧ gear units

13‧‧‧整流器13‧‧‧Rectifier

14‧‧‧濾波電容器14‧‧‧Filter capacitor

15‧‧‧直流電路15‧‧‧DC circuit

16‧‧‧直流/直流轉換電路16‧‧‧DC/DC converter circuit

17‧‧‧反相器17‧‧‧Inverter

18‧‧‧控制電路18‧‧‧Control circuit

19‧‧‧交流電供電器19‧‧‧AC power supply

20‧‧‧乾真空泵裝置20‧‧‧Dry vacuum pump unit

21‧‧‧電器設備殼體21‧‧‧Electrical equipment housing

22‧‧‧泵殼體22‧‧‧ pump housing

23‧‧‧液體冷卻隔壁23‧‧‧Liquid cooling next door

24‧‧‧外殼24‧‧‧ Shell

25‧‧‧冷卻劑通道25‧‧‧ coolant channel

27‧‧‧進氣口27‧‧‧Air inlet

28‧‧‧排氣口28‧‧‧Exhaust port

30、32‧‧‧高效率冷卻單元30, 32‧‧‧High efficiency cooling unit

31‧‧‧第一電器設備殼體31‧‧‧First electrical equipment housing

33‧‧‧第二電器設備殼體33‧‧‧Second electrical equipment housing

34‧‧‧控制電路冷卻風扇34‧‧‧Control circuit cooling fan

第1圖係根據本發明之乾真空泵裝置之系統配置圖之方塊圖；第2圖係根據本發明之一實施例之乾真空泵裝置之結構配置示意圖；第3A圖係冷卻結構之側視圖，該冷卻結構係供冷卻容納於該乾真空泵裝置內之電子元件及裝置；第3B圖係第3A圖之平面圖；第4圖係根據本發明之另一實施例之乾真空泵裝置之結構配置示意圖；第5圖係根據本發明之又另一實施例之乾真空泵裝置之結構配置示意圖；以及第6圖係根據本發明之再另一實施例之乾真空泵裝置之結構配置示意圖。1 is a block diagram of a system configuration diagram of a dry vacuum pump apparatus according to the present invention; FIG. 2 is a schematic structural view of a dry vacuum pump apparatus according to an embodiment of the present invention; and FIG. 3A is a side view of a cooling structure, The cooling structure is for cooling the electronic components and devices housed in the dry vacuum pump device; FIG. 3B is a plan view of FIG. 3A; and FIG. 4 is a schematic structural view of a dry vacuum pump device according to another embodiment of the present invention; 5 is a schematic structural view of a dry vacuum pump device according to still another embodiment of the present invention; and FIG. 6 is a schematic structural view of a dry vacuum pump device according to still another embodiment of the present invention.

12-1、12-2‧‧‧乾真空泵12-1, 12-2‧‧‧ dry vacuum pump

12-1a、12-2a‧‧‧馬達12-1a, 12-2a‧‧ ‧ motor

12-1b、12-2b‧‧‧泵單元12-1b, 12-2b‧‧‧ pump unit

12-1c、12-2c‧‧‧齒輪單元12-1c, 12-2c‧‧‧ gear unit

13‧‧‧整流器13‧‧‧Rectifier

14‧‧‧濾波電容器14‧‧‧Filter capacitor

16‧‧‧直流/直流轉換電路16‧‧‧DC/DC converter circuit

17‧‧‧反相器17‧‧‧Inverter

18‧‧‧控制電路18‧‧‧Control circuit

20‧‧‧乾真空泵裝置20‧‧‧Dry vacuum pump unit

21‧‧‧電器設備殼體21‧‧‧Electrical equipment housing

22‧‧‧泵殼體22‧‧‧ pump housing

23‧‧‧液體冷卻隔壁23‧‧‧Liquid cooling next door

24‧‧‧外殼24‧‧‧ Shell

25‧‧‧冷卻劑通道25‧‧‧ coolant channel

27‧‧‧進氣口27‧‧‧Air inlet

Claims (9)

一種乾真空泵裝置，包括：乾真空泵，包含泵單元及用於驅動該泵單元之馬達；反相器，用於將來自交流電源之交流電轉換至具有預定頻率之交流電並將該交流電供應至該馬達；電器設備殼體，於其中容納有包含該反相器之控制電子電路總成；泵殼體，於其中容納有包含了該泵單元及該馬達的該乾真空泵以及該乾真空泵之操作監控感測器；液體冷卻隔壁，係介於該電器設備殼體及該泵殼體之間且具有循環於其內之冷卻劑；以及外殼，於其中包容有該電器設備殼體、該泵殼體以及該液體冷卻隔壁，而形成整體結構；其中，產生於該電器設備殼體的熱係被循環於該液體冷卻隔壁中之該冷卻劑所吸收；該液體冷卻隔壁係以不與該泵殼體直接接觸之方式被固持且熱隔離該乾真空泵。 A dry vacuum pump device comprising: a dry vacuum pump comprising a pump unit and a motor for driving the pump unit; and an inverter for converting alternating current from an alternating current source to alternating current having a predetermined frequency and supplying the alternating current to the motor An electrical device housing containing therein a control electronic circuit assembly including the inverter; a pump housing containing therein the dry vacuum pump including the pump unit and the motor, and an operational monitoring sense of the dry vacuum pump a liquid cooling partition wall between the electrical device housing and the pump housing and having a coolant circulating therein; and an outer casing containing the electrical equipment housing, the pump housing, and The liquid cools the partition wall to form a unitary structure; wherein the heat generated in the housing of the electrical device is absorbed by the coolant circulating in the liquid cooling partition; the liquid cooling partition is not directly connected to the pump housing The means of contact are held and thermally isolated from the dry vacuum pump. 如申請專利範圍第1項所述之乾真空泵裝置，其中該外殼具有界定於其中之冷卻劑通道，該冷卻劑通道用以將冷卻劑起初供應至該液體冷卻隔壁、接著從該液體冷卻隔壁供應至該馬達、然後供應至該泵單元，以依續冷卻該液體冷卻隔壁、該馬達以及該泵單元。 The dry vacuum pump device of claim 1, wherein the outer casing has a coolant passage defined therein for initially supplying a coolant to the liquid cooling partition wall, and then supplying the liquid cooling partition wall The motor is then supplied to the pump unit to continuously cool the liquid cooling partition, the motor, and the pump unit. 如申請專利範圍第1項所述之乾真空泵裝置，其中該控 制電子電路總成具有會產生熱之電子元件，該電子元件包含該反相器之開關裝置，且該液體冷卻隔壁提供用於將該電子元件冷卻之冷卻結構。 The dry vacuum pump device of claim 1, wherein the control The electronic circuit assembly has an electronic component that generates heat, the electronic component includes a switching device of the inverter, and the liquid cooling partition provides a cooling structure for cooling the electronic component. 如申請專利範圍第1項所述之乾真空泵裝置，其中該液體冷卻隔壁係設成不與該乾真空泵之該泵單元直接接觸，且該液體冷卻隔壁係被固定至從該泵單元之外牆延伸之框架。 The dry vacuum pump device of claim 1, wherein the liquid cooling partition is not in direct contact with the pump unit of the dry vacuum pump, and the liquid cooling partition is fixed to the outer wall from the pump unit. The framework of the extension. 如申請專利範圍第1項所述之乾真空泵裝置，其中該電器設備殼體係安裝於該液體冷卻隔壁上。 The dry vacuum pump device of claim 1, wherein the electrical device housing is mounted on the liquid cooling partition. 一種乾真空泵裝置，包括：乾真空泵，包含泵單元及用於驅動該泵單元之馬達；反相器，用於將來自交流電源之交流電轉換至具有預定頻率之交流電並將該交流電供應至該馬達；第一電器設備殼體，於其中容納有會發熱大電流電路之該反相器；第二電器設備殼體，於其中容納有包含用於控制該乾真空泵之運作之中央處理器之控制電子電路；外殼，於其中容納有該第一電器設備殼體及該第二電器設備殼體，而形成整體結構；冷卻單元，用於以液體冷卻劑將該第一電器設備殼體冷卻；以及空氣冷卻結構，用於以自然空氣循環或強制空氣循環將該第二電器設備殼體冷卻。 A dry vacuum pump device comprising: a dry vacuum pump comprising a pump unit and a motor for driving the pump unit; and an inverter for converting alternating current from an alternating current source to alternating current having a predetermined frequency and supplying the alternating current to the motor a first electrical device housing in which the inverter for generating a high current circuit is housed; and a second electrical device housing containing control electronics including a central processing unit for controlling operation of the dry vacuum pump a housing having a first electrical device housing and the second electrical device housing therein to form a unitary structure; a cooling unit for cooling the first electrical device housing with a liquid coolant; and air a cooling structure for cooling the second electrical device housing with natural air circulation or forced air circulation. 如申請專利範圍第6項所述之乾真空泵裝置，其中該乾真空泵包含齒輪單元，且該冷卻單元包括用於以作為液體冷卻劑之冷卻水將該乾真空泵之該馬達或該齒輪單元冷卻之冷卻單元。 The dry vacuum pump device of claim 6, wherein the dry vacuum pump comprises a gear unit, and the cooling unit comprises a motor for cooling the dry vacuum pump or the gear unit with cooling water as a liquid coolant Cooling unit. 如申請專利範圍第6項所述之乾真空泵裝置，其中用以冷卻該第二電器設備殼體的該空氣冷卻結構係冷卻風扇。 The dry vacuum pump device of claim 6, wherein the air cooling structure for cooling the second electrical device housing is a cooling fan. 一種冷卻乾真空泵裝置之方法，其中該乾真空泵裝置包含含有泵單元及用於驅動該泵單元之馬達之乾真空泵、用於將來自交流電源之交流電轉換至具有預定頻率之交流電並將該交流電供應至馬達之反相器，於其中容納有作為高自熱值之會發熱大電流電路之反相器之第一電器設備殼體、於其中容納有包含用於控制該乾真空泵之運作之中央處理器之控制電子電路之第二電器設備殼體以及於其中容納有該第一電器設備殼體及該第二電器設備殼體而形成整體結構之外殼，該冷卻方法包括：以液體冷卻劑將該第一電器設備殼體冷卻；以及以自然空氣循環或強制空氣循環將該第二電器設備殼體冷卻。 A method of cooling a dry vacuum pump device, wherein the dry vacuum pump device comprises a dry vacuum pump including a pump unit and a motor for driving the pump unit, for converting alternating current from an alternating current power source to alternating current having a predetermined frequency and supplying the alternating current power An inverter to the motor, in which the first electrical device housing containing the inverter of the high-heating value of the high-heating current circuit, in which the central processing for controlling the operation of the dry vacuum pump is accommodated a second electrical device housing of the control electronic circuit and a housing having the first electrical device housing and the second electrical device housing therein to form a unitary structure, the cooling method comprising: using a liquid coolant The first electrical device housing is cooled; and the second electrical device housing is cooled by natural air circulation or forced air circulation.
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