201202555 六、發明說明： 【發明所屬之技術領域】 、本發明令有關一種乾真空泵裝置及該乾真空泵裝置 之冷部方法，尤其是有關—種體積小且具有高效率冷卻結 構的乾真空果裝置以及一種將該乾真空果裝置冷卻之方 法。 【先前技術】 近幾年來，可易於在大氣壓力下操作來產生真空環境 的乾真空泵裝置，已被使用於包括半導體製造設備之廣泛 〜用該乾A空泵裝置具有I單元，其係由馬達所驅動。 供應電力至馬達以便驅賴乾真空縣置之泵單元之供電 裝置’經常為了各種原因而併合反相器（inverter，有稱為 反向器、換流器等情形）。其中—種理由是，反相器可使得 供應至馬達之電力之頻率高於商用頻率，因而增加了馬達 速’提南真空L氣能力。由反相器控制之乾真空 栗裝置’能夠使用較小之馬達而達到滿意之真空度。 壯根據另一種理由，當氣室或類似者藉著操作乾真空泵 置，而已被排氣至滿意之真空度時，域乾真空栗裝置 已經達到非常輕負荷之操作時，該反相器使得控制其輸出 端電壓（〇u_t—lv〇ltage)變得容易，且亦能夠控 制馬達之轉速，以便高效率地操作馬達。 該反相器配合著其内之半導體開關裝置，而能夠於不 同於經由AC/DC/AC轉換電路所應用之輸入電壓之頻率輸 出電廢。該反相II需要組合適t之冷卻裝置，以便將該用 323041 4 201202555 來改變頻率之半導體開關裝置加以冷卻，此乃因半導體開 關裝置被其内部產生之損失所加熱。 習知之乾真空泵裝置，其係與包括反相器之供電襞置 組合，具有利用自然空氣循環或強制空氣循環之空氣冷卻 結構，用以將該反相器之半導體開關裝置加以冷卻。習知 之乾真空泵裝置亦有利用水冷式結構，以冷卻乾真空泵 者’其係將冷卻劑循環經過安裝在乾真空泵之馬達外殼固 定段下方之冷卻劑管’致使在該乾真空泵内之基板，能夠 有效地被冷卻（參日本特許公開公告號2〇〇3_269369)。 在各種真空泵令，併合著空氣冷卻結構之真空泵馬達 及殼體’是需要有相當大之冷卻區域。因此一些真空泵具 有併合著冷卻劑循環結構之水冷式真空泵馬達及殼體（參 PC(W0)專利申請案2006-520873以及日本特許公開公告號 8-21332)。 【發明内容】 在習知技術之利用自然空氣循環或強制空氣循環之 空氣冷卻結構中’為了冷卻該反相器之半導體開關裝置， 該空氣冷卻結構因冷卻效率低而有必要是大體積者，使得 它本身成為為了減少乾真空泵裝置整體體積所作努力之障 礙者。而該水冷式結構則僅能冷卻部分之乾真空泵，整體 上無法有效地冷卻該乾真空泵裝置。 馨於上述習之技術之缺憾，本發明之目的在提供一種 乾真空栗裝置，其包括反相器以供應交流電力於馬達，而 驅動栗單元，以及高效率冷卻單元，以冷卻高自熱值大電 5 323041 201202555 流電路元件單元，例如反相器之開關裝置，因而能夠使乾 真空泵裝置之體積減少。另外，本發明並提供一種將該乾 真空泵裝置冷卻之方法。 為了連到上述之目的’本發明提供一種乾真空泵裝置， 包括：乾真空泵、反相器、電器設備殼體、泵殼體、液體 冷卻隔區（liquid cooled partition)、以及外殼。該乾真 空泵具有栗單元及用於驅動該泵單元之馬達；該反相器將 交流電源之交流電轉換為具有預定頻率之交流電並將之供 應給該馬達；該電器設備殼體容納包括該反相器之控制電 子電路總成；該泵殼體容納該乾真空泵以及該乾真空泵之 操作監控感測器；該液體冷卻隔區係介於該電器設備殼體 及該泵殼體之間，且具有循環於其内之冷卻劑；而該外殼 將該電器設備殼體、該系殼體、以及該液體冷卻隔區包容 在其内，而形成整體結構。 在本發明之較佳態樣中，該外殼具有界定於其内之冷 卻劑通道，以供應冷卻劑起初至該液體冷卻隔區，接著從 該液體冷卻隔區至該馬達，然後至該泵單元，以便陸續地 冷卻該液體冷卻隔區、該馬達、及該泵單元。 在本發明之較佳態樣中，該控制電子電路總成具有會 產生熱之各電子元件，而各電子元件包括該反相器之開關 裝置而該液體冷卻隔區提供冷卻結構，可將各電子元件 冷卻。 在本發明之較佳態樣中，該液體冷卻隔區係被固持而 不與該乾真空泵之泵單元直接接觸，且被固定於由該泵單 323041 6 201202555 元外牆延伸之框架上。 藉著上述之設置，該電器設備殼體將該具有反相器之 控制電子電路總成容納於其内；而該泵殼體將該乾真空泵 以及該乾真空泵之操作監控感測器容納於其内；且該液體 冷卻隔區係介於該電器設備殼體及該泵殼體之間，並具有 循環於其内之冷卻劑；該外殼並將該電器設備殼體、該泵 殼體、以及該液體冷卻隔區包容在其内，而形成整體結構。 循環於該液體冷卻隔區内之冷卻劑可有效地將該電器設備 殼體内之控制電子電路總成所產生之熱吸收，使得該電器 設備殼體内之控制電子電路總成被極有效率地冷卻。此之 所以乾真空泵裝置能夠僅具有小冷卻結構，且之所以其本 身能夠為小體積之裝置。 當其内界定有冷卻劑通道之該外殼供應冷卻劑起初 至该液體冷卻隔區，接著從該液體冷卻隔區至該馬達，然 後至該泵單兀，以便陸續地冷卻該液體冷卻隔區、該馬達、 及該栗單元時’該包括有反相器之控制電子電路總成，即 能夠起初地被冷㈣丨所冷卻，接著該馬達及該纟單元陸續 地被冷卻劑所冷卻。此之所以能夠減少該乾真空栗裝置之 體積，且有效率地作整體上之冷卻。 用以冷卻容約於該電器設備殼體内之反相器開關裝 置且會產生熱之各電子元件之該冷卻結構，可由該液體冷 卻，區提健環以之冷卻劑。因此，各電子元件可藉: 循環於該㈣冷卻隔區狀冷卻劑而有效率地被冷卻。 該液體冷卻隔區可設成不與該乾真空泵之泵單元直 323041 7 201202555 接接觸，且固定於由該泵單元外牆延伸之框架上。因而能 夠促使從該泵單元之熱吸收成為最小，並減少該乾真空泵 之泵單元内牆表面之沉積。 本發明亦提供一種乾真空泵裝置，其包括：乾真空’泉、 反相器、第一電器設備殼體、第二電器設備殼體、外殼、 冷卻單元、以及空氣冷卻結構，其中該乾真空泵包括泵單 元及用於驅動該泵單元之馬達；該反相器將交流電源之交 流電轉換為具有預定頻率之交流電並將之供應給該馬達； 該第一電器設備殼體將作為產生熱之大電流電路之反相器 容納於其内；該第二電器設備殼體容納包括中央處理器 (CPU)之控制電子電路，以控制該乾真空泵之運作；該外殼 可容納該第一電器設備殼體及該第二電器設備殼體，而形 成整體結構。該冷卻單元利用冷卻劑，以將該第一電器設 備殼體予以冷卻；且該空氣冷卻結構，係利用自然空氣循 環或者是強制空氣循環，以便將該第二電器設備殼體予以 冷卻。 在本發明之較佳態樣中，該乾真空泵包括齒輪單元 (gear unit) ’而該冷卻單元包含利用冷卻水作為冷卻劑之 可供冷卻該馬達或該乾真空泵齒輪單元之冷卻單元。 本發明進一步提供一種冷卻乾真空泵裝置之方法，其 中該乾真空泵裝置包括乾真空泵、反相器、第一電器設備 殼體、第二電器設備殼體、外殼、以及冷卻單元，其中該 乾真空泵包括泵單元及用於驅動該泵單元之馬達；該反相 器將交流電源之交流電轉換為具有預定頻率之交流電並將 8 323041 201202555 之供應給該馬達；該第一電器設備殼體將作為熱產生之高 自熱值大電流電路之反相器容納於其内；該第二電器設備 殼體容納包括中央處理器之控制電子電路，以控制該乾真 空泵之運作；該外殼可容納該第一電器設備殼體及該第二 電器設備殼體，而形成整體結構。該冷卻方法包含：利用 冷卻劑，以將該第一電器設備殼體予以冷卻；且利用自然 空氣循環或者是強制空氣循環，以便將該第二電ιΐ設備殼 體予以冷卻。 由於該第一電器設備殼體容納其内之作為熱產生之 高自熱值大電流電路之反相器該冷卻單元利用冷卻劑予以 高效率地冷卻，該乾真空泵裝置能夠僅具有小的冷卻結構， 且因而其自身能夠為小體積之裝置。 【實施方式】 本發明各較佳實施例將參照圖式詳述於後，各視圖中 相同或對應之組件將以相同或對應之元件符號標示，而其 等之景贅敘述將為了簡潔之緣故而盡可能地避免。 第1圖係根據本發明之一種乾真空泵裝置之系統配置 圖之方塊圖，其顯示該乾真空泵裝置包括含有整流器13 之供電器10、具有遽波電容器（smoothing capacitor)14、 直流/直流轉換電路16及反相器17之直流電路15、含有 馬達12a及泵單元12b之乾真空泵12，以及控制電路18。 該供電器10及該控制電路18可被稱為「控制電子電路總 成」。該整流器13係連接至交流電供電器19。該交流電供 電器19供應交流電至該乾真空泵12，以便將該交流電轉 9 323041 201202555 換成直流電。在該控制電路18之控制下，該直流/直流轉 換電路16將來自該整流器13之直流電轉換成具有預定電 壓之直流電而供應至該反相器17。而在該控制電路18之 控制下’該反相器17將來自該直流/直流轉換電路16之直 流電轉換成具有預疋頻率之交流電而供麻至該乾真空果 12之馬達12a’而馬達12a被通電後即驅動該泵單元12b， 藉以操’作該乾真空泵12。 在具有上述系統配置之乾真空栗裝置中，當操作該乾 真空泵12時，該整流器13之整流襞置、該直流電路15 之慮波電容器14、該直流/直流轉換電路16之開關裝置、 以及該反相器17之開關裝置等在輸出電力以通電該馬達 12a時，會產生熱。且該乾真空泵12之馬達12a及泵單元 12b亦會產生熱。根據本發明之乾真空泵裝置併合著小體 積之冷卻結構，以便有效率地吸收由上述各開關及乾真空 泵裝置之電子元件與電子裝置所產生之熱，俾將該乾真空 泵裝置予以冷卻。該併合小體積冷卻結構之乾真空泵裝置 亦為小體積之裝置。 第2圖係根據本發明之一實施例之乾真空泵裝置20 之結構配置示意圖，其顯示該乾真空泵裝置20包括電器設 備殼體21、泵殼體22、以及介於該電器設備殼體21及該 泵殼體22之間的液體冷卻隔區23。有外殼22將該電器設 備殼體21、談泵殼體22、以及該液體冷卻隔區23包容在 其内’而形成整體結構。 該電器設備殼體21將會產生熱之各種電子元件及電 323041 201202555 子裝置容納於其内，其等係包括該整流器13之整流裝置、 該直流電路15之濾波電容器14、該直流/直流轉換電路16 之開關裝置、該反相器17之開關裝置、以及該控制電路 18之電子元件。而該泵殼體22則將二個乾真空泵12-1、 12-2以及該等乾真空泵12-1、12-2之操作監視感測器（未 圖示）容納於其内。因為容納於該電器設備殼體21之各電 子元件及電子裝置會產生熱，他們係被設置於二個乾真空 泵12-1、12-2之上方。而該液體冷卻隔區23則被設置於 各電子元件及電子裝置以及二個乾真空泵12-1、12-2之 間，俾隔離由二個乾真空泵12-1、12-2所產生之熱，使不 致傳遞至該電器設備殼體21内之各電子元件及電子裝置。 該乾真空泵12-1包含馬達12-la、泵單元12-lb、以 及齒輪單元12-lc。同樣地，該乾真空泵12-2也包含馬達 12-2a、泵單元12-2b、以及齒輪單元12-2c。於操作該等 乾真空泵12-1、12-2之馬達12-la、12-2a、泵單元12-lb、 12-2b以及齒輪單元12-lc、12-2c時亦會產生熱。該乾真 空泵12-1具有殼體，其包含進氣口 27，而該真空泵12-2 則包含具有排氣口 28之殼體。 該液體冷卻隔區23係被設成不與該等乾真空泵12-卜 12-2之泵單元12-lb、12-2b直接接觸，且被固定於由該 等泵單元12-lb、12-2b之外牆延伸之框架上。 該外殼24，或者更具體地說是該液體冷卻隔區23及 該泵殼體22具有界定於其内之冷卻劑通道25，以讓例如 冷卻水（亦即冷水）之冷卻劑流過。該冷卻劑經安排以供應 11 323041 201202555 冷卻水W起初至該液體冷卻隔區23，接著從該液體冷卻隔 區23至該等乾真空泵12-1、12-2之馬達12-la、12-2a， 然後至該等乾真空泵12-卜12-2之泵單元12-lb、12-2b， 以便在冷卻水W流過時，陸續地冷卻會產生熱之各電子元 件及電子裝置。 如上所述，該液體冷卻隔區23係介於該電器設備殼 體21及該泵殼體22之間，且該冷卻劑通道25經安排以供 應冷卻水W起初至該液體冷卻隔區23,接著從該液體冷卻 隔區23至該等乾真空泵12-1、12-2之馬達12-la、12-2a， 然後至該等泵單元12-lb、12-2b。如此將能夠有效率地冷 卻傾向產生相當熱而導致故障之各電子元件及電子裝置。 而且亦能使容納著該整流器13、該直流電路15、該直流/ 直流轉換電路16、該反相器17、以及該控制電路18之電 器設備殼體21有效地熱隔絕容納著乾真空泵12-1、12-2 之該泵殼體22。因此，使得併合著冷卻劑通道25之該乾 真空泵裝置20在整個體積上減至最小，而尺寸大小亦為之 減少。 第3A圖係冷卻結構之側視圖，該冷卻結構係供冷卻 容納於該電器設備殼體21内之該整流器13之整流裝置、 該直流電路15之濾波電容器14、該直流/直流轉換電路16 之開關裝置、該反相器17之開關裝置、以及該控制電路 18之電子元件。第3B圖係第3A圖之平面圖。如第3A、3B 圖所示，屬於該整流器13、該直流電路15、該直流/直流 轉換電路16、該反相器17、以及該控制電路18而會產生 12 323041 201202555 熱之電子元件及電子裝置，係安裝於該其内有冷卻水循環 之液體冷卻隔區23。 該液體冷卻隔區23内部界定著該冷卻劑通道25，其 内有作為冷卻劑之冷卻水W循環著。該冷卻水是供應至該 冷卻劑通道25。該液體冷卻隔區23係由高熱導率（high thermal conductivity)材料製成，例如金屬，譬如铭。依 照此種配置，容納於電器設備殼體21内之電子元件及電子 裝置所產生之熱被傳遞至該液體冷卻隔區23，且被流經該 冷卻劑通道25之冷卻水有效地吸收。 在此〜實施例中’該泵殼體22内容納著二個乾真空 S 19^1 , 、12-2。然而，該泵殼體22内亦可容納著單一乾 真二栗、或三個或更多個乾真空泵。 如上所述’根據本實施例之乾真空泵裝置2〇包括該 電器叹備毂體21 ’其内容納著控制電子電路總成（c〇ntr〇1 electr〇nic circuit assemMy)，即該整流器 13、該直流 電路15、該直流/直流轉換電路16、該反相器17、以及該 控制電路18。而縣殼體22將二個乾真空泵12-卜12-2 以及乾真空泵之操作監視感測器容納於其内。 且該液體冷卻隔區23係介於該電器設備殼體21及該泵殼 體22之間，且具有冷卻劑通道25以便循環冷卻劑。外殼 %將該電器設備殼體21、該泵殼體22、以及該液體冷卻 隔品3包各在其内，而形成整體結構。冷卻劑係被循環經 過二於4液體冷卻隔區23内之冷卻劑通道25，以便吸收 由今納於電器設備殼體21内之電子元件及電子裝置所產 13 323041 201202555 生之熱，因而能夠有效率地冷卻容納於電器設備殼體21 内之電子元件及電子裝置。該包括有液體冷卻隔區23之冷 卻結構之體積很小’因此該併合著冷卻結構之乾真空栗裝 置20亦為小體積之裝置。 第4圖係根據本發明之另一實施例之乾真空泵裝置 20a之結構配置示意圖，在如圖所示之乾真空泵裝置2〇a 中，乾真空泵12之泵單元12b係被置於該外殼24之中央， 而馬達12a及齒輪單元12c則被置於該泵單元i2b之每一 側。容納著該反相器17(參照第1圖）與其它電子元件及電 子裝置之第一電器設備殼體31係設置於該馬達12a之侧 邊。利用例如水作為冷卻劑之高效率冷卻單元3〇，係用來 冷卻馬達12a及第一電器設備殼體31，而置於馬達12a及 第一電器設備殼體31之間。另一個利用例如水作為冷卻劑 之高效率冷卻單元32，係設置於該齒輪單元12C之側邊。 容納著具有電子元件（包括一中央處理器）之控制電路18 (參照第1圖）之第二電器設備殼體33,係置於該泵單元i2b 與該馬達12a之上方。該泵單元12b具有包括有進氣口 27 及排氣口 28之殼體。 該泵單元12b包含例如正排量真空泵 (positive-displacement vacuum pump)，其具有置於轉子 殼體内之二個轉軸以及固定於該等轉轴上之複數對組之羅 茨式轉子（roots-type rotors)。該等轉子係相互隔著一小 間隙’且亦與該轉子殼體之内圓周表面隔著小間隙，因此 固定於該等轉軸上之轉子能夠繞著其等之軸心旋轉，而不 323041 14 .201202555 會彼此碰觸或與轉子殼體碰觸。該轉子殼體之一系列之轉 子隔室，係沿著各轉軸被界定且將複數對組之轉子容納於 其内，以便傳遞氣體使之被泵經各轉子隔室。該馬達12a 具有與其中之一個轉軸聯結之輸出軸。當該馬達12a通電 後，該輸出軸即轉動與其聯結之轉轴，其即經由該齒輪單 元12c之各齒輪而轉動另一個轉軸。該等轉轴即可透過該 進氣口 27，以吸入氣體’或經由該排氣口 28以將氣體排 出。 當該馬達12a通電後’其轉子即產生熱。所產生之熱 於是傳遞至該馬達12a之殼體，進而增加溫度。且當二個 轉軸轉動後，齒輪單元12c之各齒輪亦產生熱。所產生之 熱於是傳遞至齒輪單元12c之齒輪箱，進而增加其溫度。 馬達殼體係由高效率冷卻單元3 0之冷卻劑（例如水）所冷 卻；而齒輪箱則由高效率冷卻單元32之冷卻劑（例如水） 所冷卻者。 如上所述，當操作乾真空泵裝置20a時，馬達殼體係 因馬達12a之轉子所產生之熱而導致溫度提昇；而齒輪箱 則因齒輪單元12c之旋轉齒輪所產生之熱而導致溫度提 昇。根據此一實施例，通常利用水冷系統之高效率冷卻單 元（冷卻結構）30、32係用來冷卻馬達殼體及齒輪箱。該供 應驅動力至馬達12a之反相器17(參照第1圖）包括例如絕 緣柵雙極電晶體（IGBTs)之開關裝置。該反相器17之各開 關裝置由於電流流經各開關以及因各開關所引起的開關損 失，而產生相當高之熱量，因此該反相器17有必要加以冷 15 323041 201202555 卻。根據此一實施例’用來冷卻馬達殼體之高效率冷卻單 元30係作為冷卻該反相器17之用。 用來冷卻乾真空泵裝置20a之控制電路18(參照第！ 圖）具有電子元件。該控制電路18之電子元件’包括該控 制泵之中央處理器，並非高自熱值。只要該控制電路18 係置於該控制電路18之電子元件可使用之經常保持在環 境溫度下之位置’該控制電路18並不需要具有特別之散熱 結構，但假設該乾真空泵裝置20a會被使用於通常操作範 圍以外之條件下，要與包括強制空氣冷卻系統併合之氣冷 結構組合在一起。 如上所述，用來冷卻馬達12a之利用例如水冷系統之 高效率冷卻單元30係被當作冷卻裝置，以吸收由該反相器 17之各開關裝置所產生之熱量，然而包括有強制空氣冷卻 系統之氣冷結構則是被用來冷卻並非高自熱值之控制電路 18之電子元件。因此，該乾真空泵裝置20a具有簡單而有 效率之最小體積冷卻結構。 第5圖係根據本發明之又另一實施例之一種乾真空泵 裝置20b之結構配置示意圖’第5圖所示之乾真空泵裝置 20b與第4圖係所示之乾真空泵裝置20a相差在於將該反 相器17(參第1圖）以及其它電子元件及電子裴置容納於其 内之該第一電器設備殼體31係置於該齒輪單元12e之一 侧，而作為冷卻該齒輪單元12c之齒輪箱則置於該齒輪單 元12c與該第一電器设備殼體31之間。第5圖所示之乾真 空泵裝置20b之其它詳細結構與第4圖係所示之乾真空泵 323041 201202555 裝置20a相同。 如上所述，用來冷卻該齒輪單元12c之齒輪箱之高效 率冷卻單元32係被當作冷卻裒置，以吸收由該反相琴Η 之各開關裝置所產生之熱量’然而包括有強制空氣冷卻系 統之氣冷結構則是被用來冷卻並非高自熱值之控制電路 18之電子元件。因此，該乾真空泵裝置2〇a具有簡單而有 效率之最小體積冷卻結構。 第6圖係根據本發明之再另一實施例之一種乾真空栗 裝置之結構2 0 c配置不忍圖，第6圖所示之乾真空系穿·置 20c與第4圖係所示之乾真空泵裝置20a相差在於，控制 電路冷卻風扇34係置於該控制電路18之一側（參照第1 圖）’而該控制電路18與該控制電路冷卻風扇34係被容納 於第二電器設備殼體33内，因此由該控制電路18所產生 之熱’係被冷卻風扇34帶來之空氣強制散熱，俾冷卻該控 制電路18。第6圖所示之乾真空泵裝置20c之其它詳細結 構與第4圖係所示之乾真空泵裝置20a相同。 如上所述，用來冷卻馬達12a之高效率冷卻單元3〇 係被當作冷卻裝置，以吸收由該反相器17之各開關裝置所 產生之熱量，然而在控制電路18側之該控制電路冷卻風扇 34係被當作冷卻裝置，以強制空氣冷卻並非高自熱值之控 制電路18之電子元件。因此，該乾真空泵裝置20c具有簡 單而有效率之最小體積冷卻結構。201202555 VI. Description of the Invention: [Technical Field] The present invention relates to a dry vacuum pump device and a cold portion method of the dry vacuum pump device, and more particularly to a dry vacuum device with a small volume and a high efficiency cooling structure And a method of cooling the dry vacuum device. [Prior Art] In recent years, a dry vacuum pump device which can be easily operated under atmospheric pressure to generate a vacuum environment has been widely used for a semiconductor manufacturing apparatus. The dry air pump unit has an I unit which is a motor. Driven. The power supply unit that supplies power to the motor to drive the pump unit of the dry vacuum county often combines inverters for various reasons (inverters, such as inverters, inverters, etc.). One of the reasons is that the inverter can make the frequency of the power supplied to the motor higher than the commercial frequency, thus increasing the motor speed. The dry vacuum pump unit controlled by the inverter can achieve a satisfactory degree of vacuum using a smaller motor. For another reason, when the air chamber or the like is operated by a dry vacuum pump and has been exhausted to a satisfactory vacuum, the inverter makes control when the dry vacuum device has reached a very light load operation. Its output voltage (〇u_t_lv〇ltage) becomes easy, and it is also possible to control the rotational speed of the motor in order to operate the motor with high efficiency. The inverter is coupled to the semiconductor switching device therein to output electrical waste at a frequency different from the input voltage applied via the AC/DC/AC conversion circuit. The reverse phase II requires a suitable set of cooling means to cool the semiconductor switching device that changes frequency with 323041 4 201202555 because the semiconductor switching device is heated by losses generated internally. A conventional dry vacuum pump unit, in combination with a power supply unit including an inverter, has an air cooling structure utilizing natural air circulation or forced air circulation for cooling the semiconductor switching device of the inverter. The conventional dry vacuum pump device also has a water-cooled structure for cooling the dry vacuum pump, which circulates the coolant through a coolant tube installed under the fixed section of the motor casing of the dry vacuum pump to cause the substrate in the dry vacuum pump to It is effectively cooled (see Japanese Laid-Open Patent Publication No. 2〇〇3_269369). In various vacuum pump arrangements, the vacuum pump motor and housing 'concomitant with the air cooling structure are required to have a relatively large cooling area. Therefore, some of the vacuum pumps have a water-cooled vacuum pump motor and a housing in which a coolant circulation structure is incorporated (see PC (W0) Patent Application No. 2006-520873 and Japanese Patent Laid-Open Publication No. 8-21332). SUMMARY OF THE INVENTION In an air cooling structure utilizing natural air circulation or forced air circulation in the prior art, the semiconductor cooling device for cooling the inverter has a large volume due to low cooling efficiency. It makes itself an obstacle to the efforts to reduce the overall volume of the dry vacuum pump unit. The water-cooled structure can only cool part of the dry vacuum pump, and the dry vacuum pump unit cannot be effectively cooled as a whole. In view of the shortcomings of the above-mentioned techniques, it is an object of the present invention to provide a dry vacuum pump apparatus including an inverter for supplying alternating current power to a motor, driving a pump unit, and a high efficiency cooling unit for cooling a high self-heating value. Dadian 5 323041 201202555 Streaming circuit component units, such as inverter switching devices, can reduce the volume of dry vacuum pumping devices. Additionally, the present invention provides a method of cooling the dry vacuum pump unit. For the purpose of connection to the above, the present invention provides a dry vacuum pump apparatus comprising: a dry vacuum pump, an inverter, an electrical equipment housing, a pump housing, a liquid cooling partition, and an outer casing. The dry vacuum pump has a pump unit and a motor for driving the pump unit; the inverter converts an alternating current of an alternating current power source into an alternating current having a predetermined frequency and supplies the same to the motor; the electrical equipment housing accommodates the reverse phase a control electronic circuit assembly; the pump housing houses the dry vacuum pump and an operation monitoring sensor of the dry vacuum pump; the liquid cooling compartment is interposed between the electrical device housing and the pump housing, and has a coolant circulating therein; and the outer casing houses the electrical device casing, the casing, and the liquid cooling compartment therein to form a unitary structure. In a preferred aspect of the invention, the outer casing has a coolant passage defined therein for supplying a coolant initially to the liquid cooling compartment, and then from the liquid cooling compartment to the motor, and then to the pump unit In order to successively cool the liquid cooling compartment, the motor, and the pump unit. In a preferred aspect of the invention, the control electronics circuit assembly has electronic components that generate heat, and each of the electronic components includes a switching device of the inverter and the liquid cooling compartment provides a cooling structure that can be Electronic components are cooled. In a preferred aspect of the invention, the liquid cooling compartment is held in direct contact with the pump unit of the dry vacuum pump and is secured to the frame extending from the outer wall of the pump unit 323041 6 201202555. With the above arrangement, the electrical device housing houses the control electronic circuit assembly having the inverter therein; and the pump housing houses the dry vacuum pump and the operation monitoring sensor of the dry vacuum pump therein And the liquid cooling compartment is interposed between the electrical equipment housing and the pump housing and has a coolant circulating therein; the housing and the electrical equipment housing, the pump housing, and The liquid cooling compartment is contained therein to form a unitary structure. The coolant circulating in the liquid cooling compartment can effectively absorb the heat generated by the control electronic circuit assembly in the electrical equipment housing, so that the control electronic circuit assembly in the electrical equipment housing is extremely efficient Ground cooling. The reason why the dry vacuum pump device can have only a small cooling structure, and it can be a small-sized device itself. The outer casing defining a coolant passage therein supplies coolant initially to the liquid cooling compartment, then from the liquid cooling compartment to the motor, and then to the pump unit to successively cool the liquid cooling compartment, The motor and the pump unit include a control electronic circuit assembly including an inverter that can be initially cooled by a cold (four) crucible, and then the motor and the crucible unit are successively cooled by the coolant. This makes it possible to reduce the volume of the dry vacuum pump unit and efficiently cool it as a whole. The cooling structure for cooling the electronic components of the inverter switching device housed in the housing of the electrical device and generating heat can be cooled by the liquid to neutralize the coolant. Therefore, each electronic component can be efficiently cooled by circulating the (four) cooling compartment-like coolant. The liquid cooling compartment may be disposed not in contact with the pump unit of the dry vacuum pump 323041 7 201202555, and is fixed to the frame extending from the outer wall of the pump unit. It is thus possible to minimize the heat absorption from the pump unit and to reduce the deposition of the inner wall surface of the pump unit of the dry vacuum pump. The present invention also provides a dry vacuum pump apparatus including: a dry vacuum spring, an inverter, a first electrical equipment housing, a second electrical equipment housing, a housing, a cooling unit, and an air cooling structure, wherein the dry vacuum pump includes a pump unit and a motor for driving the pump unit; the inverter converts an alternating current of an alternating current power source into an alternating current having a predetermined frequency and supplies the same to the motor; the first electrical equipment housing is used as a large current for generating heat An inverter of the circuit is housed therein; the second electrical device housing houses a control electronic circuit including a central processing unit (CPU) for controlling operation of the dry vacuum pump; the housing can accommodate the first electrical device housing and The second electrical device housing forms a unitary structure. The cooling unit utilizes a coolant to cool the first electrical device housing; and the air cooling structure utilizes natural air circulation or forced air circulation to cool the second electrical equipment housing. In a preferred aspect of the invention, the dry vacuum pump includes a gear unit and the cooling unit includes a cooling unit for cooling the motor or the dry vacuum pump gear unit using cooling water as a coolant. The present invention further provides a method of cooling a dry vacuum pump device, wherein the dry vacuum pump device comprises a dry vacuum pump, an inverter, a first electrical equipment housing, a second electrical equipment housing, a housing, and a cooling unit, wherein the dry vacuum pump comprises a pump unit and a motor for driving the pump unit; the inverter converts an alternating current of an alternating current power source into an alternating current having a predetermined frequency and supplies 8 323041 201202555 to the motor; the first electrical equipment housing is to be generated as heat The inverter of the high self-heating value high current circuit is housed therein; the second electrical equipment housing houses a control electronic circuit including a central processing unit to control the operation of the dry vacuum pump; the housing can accommodate the first electrical appliance The device housing and the second electrical device housing form a unitary structure. The cooling method includes: utilizing a coolant to cool the first electrical equipment housing; and utilizing natural air circulation or forced air circulation to cool the second electrical equipment housing. The dry vacuum pump device can have only a small cooling structure because the first electrical device housing houses an inverter therein as a heat-generating high self-heating value high current circuit that is efficiently cooled by a coolant And thus it can be a small volume device by itself. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE INVENTION The present invention will be described in detail with reference to the drawings, and the same or corresponding components will be denoted by the same or corresponding elements, and the description will be omitted for the sake of brevity. And avoid as much as possible. 1 is a block diagram of a system configuration diagram of a dry vacuum pump apparatus according to the present invention, which shows that the dry vacuum pump apparatus includes a power supply 10 including a rectifier 13, a smoothing capacitor 14, and a DC/DC conversion circuit. 16 and a DC circuit 15 of the inverter 17, a dry vacuum pump 12 including a motor 12a and a pump unit 12b, and a control circuit 18. The power supply 10 and the control circuit 18 may be referred to as "control electronic circuit assemblies." The rectifier 13 is connected to an alternating current power supply 19. The AC power supply 19 supplies an alternating current to the dry vacuum pump 12 to change the alternating current to 9323041 201202555 for direct current. Under the control of the control circuit 18, the DC/DC conversion circuit 16 converts the direct current from the rectifier 13 into a direct current having a predetermined voltage and supplies it to the inverter 17. Under the control of the control circuit 18, the inverter 17 converts the direct current from the DC/DC conversion circuit 16 into an alternating current having a pre-twist frequency for supplying the motor 12a' to the dry vacuum 12 and the motor 12a. The pump unit 12b is driven after being energized, whereby the dry vacuum pump 12 is operated. In the dry vacuum pump apparatus having the above system configuration, when the dry vacuum pump 12 is operated, the rectifying device of the rectifier 13 , the wave capacitor 14 of the DC circuit 15 , the switching device of the DC/DC converting circuit 16 , and When the switching device or the like of the inverter 17 outputs electric power to energize the motor 12a, heat is generated. The motor 12a and the pump unit 12b of the dry vacuum pump 12 also generate heat. The dry vacuum pump apparatus according to the present invention incorporates a small-sized cooling structure to efficiently absorb the heat generated by the electronic components and electronic devices of the respective switches and dry vacuum pump devices, and to cool the dry vacuum pump device. The dry vacuum pump unit incorporating the small volume cooling structure is also a small volume device. 2 is a schematic structural view of a dry vacuum pump device 20 according to an embodiment of the present invention, which shows that the dry vacuum pump device 20 includes an electrical equipment housing 21, a pump housing 22, and an electrical equipment housing 21 and The liquid between the pump housings 22 cools the compartment 23. A housing 22 encloses the electrical device housing 21, the pump housing 22, and the liquid cooling compartment 23 therein to form a unitary structure. The electrical equipment housing 21 will generate various electronic components of heat and a 323041 201202555 sub-device housed therein, which includes a rectifying device of the rectifier 13, a filter capacitor 14 of the DC circuit 15, and the DC/DC conversion. The switching device of the circuit 16, the switching device of the inverter 17, and the electronic components of the control circuit 18. The pump housing 22 houses the two dry vacuum pumps 12-1, 12-2 and the operational monitoring sensors (not shown) of the dry vacuum pumps 12-1, 12-2 therein. Since the electronic components and electronic devices housed in the electrical device casing 21 generate heat, they are disposed above the two dry vacuum pumps 12-1, 12-2. The liquid cooling compartment 23 is disposed between each of the electronic components and the electronic device and the two dry vacuum pumps 12-1, 12-2 to isolate the heat generated by the two dry vacuum pumps 12-1, 12-2. Therefore, it is not transmitted to the electronic components and electronic devices in the electrical device casing 21. The dry vacuum pump 12-1 includes a motor 12-la, a pump unit 12-lb, and a gear unit 12-lc. Similarly, the dry vacuum pump 12-2 also includes a motor 12-2a, a pump unit 12-2b, and a gear unit 12-2c. Heat is also generated when the motors 12-la, 12-2a, the pump units 12-lb, 12-2b, and the gear units 12-lc, 12-2c of the dry vacuum pumps 12-1, 12-2 are operated. The dry vacuum pump 12-1 has a housing that includes an air inlet 27, and the vacuum pump 12-2 includes a housing having an exhaust port 28. The liquid cooling compartment 23 is disposed not in direct contact with the pump units 12-lb, 12-2b of the dry vacuum pumps 12-b-12, and is fixed to the pump units 12-lb, 12- 2b outside the wall extending the frame. The outer casing 24, or more specifically the liquid cooling compartment 23 and the pump casing 22, have a coolant passage 25 defined therein for allowing coolant such as cooling water (i.e., cold water) to flow therethrough. The coolant is arranged to supply 11 323041 201202555 cooling water W initially to the liquid cooling compartment 23, and then from the liquid cooling compartment 23 to the motors 12-la, 12- of the dry vacuum pumps 12-1, 12-2 2a, then to the pump units 12-lb, 12-2b of the dry vacuum pumps 12-b-12, so that when the cooling water W flows, the electronic components and electronic devices that generate heat are successively cooled. As described above, the liquid cooling compartment 23 is interposed between the electrical equipment housing 21 and the pump housing 22, and the coolant passage 25 is arranged to supply cooling water W to the liquid cooling compartment 23 initially. The liquid 12-la, 12-2a from the liquid cooling compartment 23 to the dry vacuum pumps 12-1, 12-2 is then passed to the pump units 12-lb, 12-2b. In this way, it is possible to efficiently cool down the electronic components and electronic devices that are quite hot and cause malfunction. Moreover, the electrical equipment housing 21 housing the rectifier 13, the DC circuit 15, the DC/DC conversion circuit 16, the inverter 17, and the control circuit 18 can be effectively thermally insulated from the dry vacuum pump 12-1. The pump housing 22 of 12-2. Therefore, the dry vacuum pump unit 20 that causes the coolant passage 25 to be combined is minimized over the entire volume, and the size is also reduced. 3A is a side view of a cooling structure for cooling a rectifier of the rectifier 13 housed in the electrical device housing 21, a filter capacitor 14 of the DC circuit 15, and a DC/DC conversion circuit 16 A switching device, a switching device of the inverter 17, and electronic components of the control circuit 18. Figure 3B is a plan view of Figure 3A. As shown in FIGS. 3A and 3B, the rectifier 13, the DC circuit 15, the DC/DC conversion circuit 16, the inverter 17, and the control circuit 18 generate 12 323041 201202555 thermal electronic components and electronics. The apparatus is mounted to a liquid cooling compartment 23 having a cooling water circulation therein. The inside of the liquid cooling compartment 23 defines the coolant passage 25 in which the cooling water W as a coolant circulates. This cooling water is supplied to the coolant passage 25. The liquid cooling compartment 23 is made of a material having a high thermal conductivity, such as a metal, such as Ming. According to this configuration, heat generated by the electronic components and electronic devices housed in the electrical device casing 21 is transferred to the liquid cooling compartment 23, and is efficiently absorbed by the cooling water flowing through the coolant passage 25. In this embodiment, the pump housing 22 houses two dry vacuums S 19^1 , 12-2. However, the pump housing 22 can also house a single dry two chestnut, or three or more dry vacuum pumps. As described above, the dry vacuum pump device 2 according to the present embodiment includes the electrical sling hub 21', which houses the control electronic circuit assembly (c〇ntr〇1 electr〇nic circuit assemMy), that is, the rectifier 13, The DC circuit 15, the DC/DC conversion circuit 16, the inverter 17, and the control circuit 18. The county casing 22 houses the two dry vacuum pumps 12-b 12-2 and the operation monitor sensors of the dry vacuum pump therein. And the liquid cooling compartment 23 is interposed between the electrical equipment housing 21 and the pump casing 22 and has a coolant passage 25 for circulating coolant. The outer casing % encloses the electrical equipment casing 21, the pump casing 22, and the liquid cooling partition 3 therein to form a unitary structure. The coolant is circulated through the coolant passages 25 in the liquid cooling compartment 23 to absorb the heat generated by the electronic components and electronic devices incorporated in the electrical equipment casing 21, thereby enabling the heat generated by the 13323041 201202555 The electronic components and electronic devices housed in the electrical device housing 21 are efficiently cooled. The cooling structure including the liquid cooling compartment 23 is small in size. Therefore, the dry vacuum pumping device 20 which is combined with the cooling structure is also a small-sized device. Figure 4 is a schematic view showing the configuration of a dry vacuum pump unit 20a according to another embodiment of the present invention. In the dry vacuum pump unit 2a shown in the drawing, the pump unit 12b of the dry vacuum pump 12 is placed in the outer casing 24. At the center, the motor 12a and the gear unit 12c are placed on each side of the pump unit i2b. The first electric device casing 31 that houses the inverter 17 (see Fig. 1) and other electronic components and electronic devices is disposed on the side of the motor 12a. A high-efficiency cooling unit 3, for example, using water as a coolant, is used to cool the motor 12a and the first electrical equipment casing 31, and is placed between the motor 12a and the first electrical equipment casing 31. Another high-efficiency cooling unit 32 using, for example, water as a coolant is disposed on the side of the gear unit 12C. A second electrical device housing 33 housing a control circuit 18 (see Fig. 1) having electronic components (including a central processing unit) is disposed above the pump unit i2b and the motor 12a. The pump unit 12b has a housing including an intake port 27 and an exhaust port 28. The pump unit 12b includes, for example, a positive-displacement vacuum pump having two rotating shafts disposed in the rotor housing and a plurality of pairs of Roots-type rotors fixed to the rotating shafts (roots- Type rotors). The rotors are separated from each other by a small gap 'and also with a small gap between the inner circumferential surfaces of the rotor casings, so that the rotors fixed to the shafts can rotate about their axes, instead of 323041 14 .201202555 will touch each other or touch the rotor housing. A series of rotor compartments of the rotor housing are defined along each of the rotating shafts and house a plurality of pairs of rotors therein for transferring gas to be pumped through the rotor compartments. The motor 12a has an output shaft coupled to one of the rotating shafts. When the motor 12a is energized, the output shaft rotates the shaft to which it is coupled, i.e., rotates the other shaft via the gears of the gear unit 12c. The shafts can pass through the intake port 27 to draw in gas or through the exhaust port 28 to vent the gas. When the motor 12a is energized, its rotor generates heat. The heat generated is then transferred to the housing of the motor 12a, which in turn increases the temperature. And when the two rotating shafts are rotated, the gears of the gear unit 12c also generate heat. The heat generated is then transmitted to the gearbox of the gear unit 12c, thereby increasing its temperature. The motor housing is cooled by a coolant (e.g., water) of the high efficiency cooling unit 30; and the gearbox is cooled by a coolant (e.g., water) of the high efficiency cooling unit 32. As described above, when the dry vacuum pump device 20a is operated, the motor casing is heated by the heat generated by the rotor of the motor 12a; and the gearbox is heated by the heat generated by the rotating gear of the gear unit 12c. According to this embodiment, the high efficiency cooling units (cooling structures) 30, 32, which typically utilize a water cooling system, are used to cool the motor housing and the gearbox. The inverter 17 (see Fig. 1) that supplies the driving force to the motor 12a includes switching devices such as insulated gate bipolar transistors (IGBTs). The switching devices of the inverter 17 generate a relatively high amount of heat due to current flowing through the switches and the switching losses caused by the switches, so the inverter 17 needs to be cooled 15 323041 201202555. The high efficiency cooling unit 30 for cooling the motor casing according to this embodiment serves to cool the inverter 17. The control circuit 18 (see Fig.) for cooling the dry vacuum pump unit 20a has electronic components. The electronic component ' of the control circuit 18 includes the central processing unit of the control pump and is not a high self-heating value. As long as the control circuit 18 is placed in the position where the electronic components of the control circuit 18 can be used to maintain the ambient temperature, the control circuit 18 does not need to have a special heat dissipation structure, but it is assumed that the dry vacuum pump device 20a will be used. Combined with an air-cooled structure that includes a forced air cooling system, outside the normal operating range. As described above, the high efficiency cooling unit 30 for cooling the motor 12a using, for example, a water cooling system is used as a cooling device to absorb the heat generated by the switching devices of the inverter 17, but includes forced air cooling. The air-cooled structure of the system is used to cool electronic components of the control circuit 18 that are not high self-heating values. Therefore, the dry vacuum pump unit 20a has a simple and efficient minimum volume cooling structure. Figure 5 is a schematic view showing the configuration of a dry vacuum pump unit 20b according to still another embodiment of the present invention. The dry vacuum pump unit 20b shown in Fig. 5 differs from the dry vacuum pump unit 20a shown in Fig. 4 in that The first electrical device housing 31 in which the inverter 17 (refer to FIG. 1) and other electronic components and electronic components are housed is placed on one side of the gear unit 12e, and serves as a cooling gear unit 12c. A gearbox is placed between the gear unit 12c and the first electrical equipment housing 31. The other detailed structure of the dry vacuum pump unit 20b shown in Fig. 5 is the same as that of the dry vacuum pump 323041 201202555 unit 20a shown in Fig. 4. As described above, the high efficiency cooling unit 32 for cooling the gear unit of the gear unit 12c is used as a cooling device to absorb the heat generated by the switching devices of the inverted piano. The air-cooled structure of the cooling system is an electronic component that is used to cool the control circuit 18 that is not a high self-heating value. Therefore, the dry vacuum pump unit 2〇a has a simple and efficient minimum volume cooling structure. Figure 6 is a diagram showing the structure of a dry vacuum pump device according to still another embodiment of the present invention. The configuration of the dry vacuum system shown in Figure 6 is shown in Figure 6 and the dry vacuum system shown in Figure 6 is the same as shown in Figure 4 The difference between the vacuum pump device 20a is that the control circuit cooling fan 34 is placed on one side of the control circuit 18 (refer to FIG. 1) and the control circuit 18 and the control circuit cooling fan 34 are housed in the second electrical device housing. Therefore, the heat generated by the control circuit 18 is forced to dissipate heat by the air from the cooling fan 34, and the control circuit 18 is cooled. The other detailed structure of the dry vacuum pump unit 20c shown in Fig. 6 is the same as that of the dry vacuum pump unit 20a shown in Fig. 4. As described above, the high-efficiency cooling unit 3 for cooling the motor 12a is used as a cooling device to absorb the heat generated by the switching devices of the inverter 17, but the control circuit on the side of the control circuit 18 The cooling fan 34 is used as a cooling device to force air to cool the electronic components of the control circuit 18 that are not high self-heating values. Therefore, the dry vacuum pump unit 20c has a simple and efficient minimum volume cooling structure.
於乾真空泵裝置20a、20b、20c中，供電器1〇(參照 第1圖）以及包含有馬達12a、泵單元12b、齒輪單元12C 17 323041 201202555 之乾真空泵12係被容納於該外殼24内，而形成整體結構。 乾真空泵裴置2〇a、20b、20c中之每一者包括著該第一電 器設備殼體31，其内容納有高自熱值之大電流電路，通常 為該反相器17 ;而該第二電器設備殼體33容納著具有非 円自熱值之電子元件（通常為一泵控制中央處理器）之控制 電路18。乾真空泵裝置2〇a、20b、20c中之每一者進一步 包括第二電器設備殼體，其内容納著乾真空泵12之操作監 視感測器。該其内容納有高自熱值大電流電路通常為反相 器17之第一電器設備殼體31，係由高效率冷卻單元所冷 卻’該冷卻單元係利用水作為冷卻劑來冷卻馬達l2a.、或 齒輪單元12c;而另外，容納具有非高自熱值之電子元件 (通常為泵控制中央處理器）之控制電路18,係由自然空氣 循環或強制空氣循環所冷卻者。 如上所述，本發明之乾真空泵裝置包括其内容納高自 熱值大電流電路（通常是該反相器17)之該第一電器設備 殼體31以及其内容納該控制電路18(通常是一泵控制中央 處理器）之該第二電器設備殼體33。該第一電器設備殼體 31係由高效率冷卻單元以冷卻劑所冷卻，而該第二電器設 備殼體33則由空氣冷卻結構以自然空氣循環或強制空氣 猶環所冷卻者。其内容納有高自熱值大電流電路（通常是該 反相器17)之該第一電器設備殼體31係經高效率地冷卻， 因而乾真空泵裝置之體積可以減小。 在上述實施例中，冷卻水被作為冷卻劑而流經該冷卻 劑通道25。不過，任何除了冷卻水以外之冷卻劑亦可用在 18 323041 201202555 冷卻劑通道25。除此之外，任何除了冷卻水以外之冷卻劑 亦可用在高效率冷卻單元中30、32。 雖然本發明若干較佳實施例已經詳細圖示及敘述，但 應可瞭解的是，在不偏離附件申請專利範圍之範疇下，仍 然可對本發明做各種改變及變化。 【圖式簡單說明】 第1圖係根據本發明之乾真空泵裝置之系統配置圖之 方塊圖； 第2圖係根據本發明之一實施例之乾真空泵裝置之結 構配置示意圖； 第3A圖係冷卻結構之側視圖，該冷卻結構係供冷卻 容納於該乾真空泵裝置内之電子元件及裝置； 第3B圖係第3A圖之平面圖； 第4圖係根據本發明之另一實施例之乾真空泵裝置之 結構配置示意圖； 第5圖係根據本發明之又另一實施例之乾真空泵裝置 之結構配置示意圖；以及 第6圖係根據本發明之再另一實施例之乾真空泵裝置 之結構配置示意圖。 【主要元件符號說明】 10 供電器 12、12-1、12-2 乾真空泵 12a、12-la、12-2a 馬達 12b、12-lb、12-2b 泵單元 12c、12-2c 齒輪單元 14 濾波電容器 13 整流器 直流電路 19 323041 15 201202555 16 直流/直流轉換電路 17 反相器 18 控制電路 19 交流電供電器 20 乾真空泵裝置 21 電器設備殼體 22 系殼體 23 液體冷卻隔區 24 外殼 25 冷卻劑通道 27 進氣口 28 排氣口 30、32 高效率冷卻單元 31 第一電器設備殼體 33 第二電器設備殼體 34 控制電路冷卻風扇 20 323041In the dry vacuum pump devices 20a, 20b, and 20c, a power supply unit 1 (refer to FIG. 1) and a dry vacuum pump 12 including a motor 12a, a pump unit 12b, and a gear unit 12C 17 323041 201202555 are housed in the outer casing 24, And form the overall structure. Each of the dry vacuum pumping devices 2A, 20b, 20c includes the first electrical device housing 31, which houses a high current circuit having a high self-heating value, typically the inverter 17; The second electrical device housing 33 houses a control circuit 18 having an electronic component that is not self-heating (typically a pump control central processor). Each of the dry vacuum pump units 2a, 20b, 20c further includes a second electrical equipment housing that houses the operational monitoring sensor of the dry vacuum pump 12. The high electrical current value high current circuit is usually the first electrical equipment housing 31 of the inverter 17, which is cooled by a high efficiency cooling unit. The cooling unit uses water as a coolant to cool the motor 12a. Or, the gear unit 12c; and additionally, the control circuit 18 that houses the electronic component (usually a pump control central processor) having a non-high self-heating value is cooled by natural air circulation or forced air circulation. As described above, the dry vacuum pump device of the present invention includes the first electrical device housing 31 that houses the high self-heating value high current circuit (typically the inverter 17) and the control circuit 18 (usually A second electrical device housing 33 of a central control unit is controlled by a pump. The first electrical equipment casing 31 is cooled by a high efficiency cooling unit with a coolant, and the second electrical equipment housing 33 is cooled by an air cooling structure by natural air circulation or forced air. The first electrical device housing 31, which houses a high self-heating value high current circuit (usually the inverter 17), is cooled with high efficiency, so that the volume of the dry vacuum pump device can be reduced. In the above embodiment, the cooling water is passed through the coolant passage 25 as a coolant. However, any coolant other than cooling water can be used in 18 323041 201202555 coolant passage 25. In addition to this, any coolant other than cooling water can be used in the high efficiency cooling unit 30, 32. While the invention has been shown and described with reference to the embodiments of the embodiments of the present invention, it is understood that various modifications and changes may be made in the invention without departing from the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram of a system configuration diagram of a dry vacuum pump device according to the present invention; FIG. 2 is a schematic structural view of a dry vacuum pump device according to an embodiment of the present invention; a side view of the structure for cooling the electronic components and devices housed in the dry vacuum pump device; FIG. 3B is a plan view of FIG. 3A; and FIG. 4 is a dry vacuum pump device according to another embodiment of the present invention FIG. 5 is a schematic structural view of a dry vacuum pump device according to still another embodiment of the present invention; and FIG. 6 is a schematic structural view of a dry vacuum pump device according to still another embodiment of the present invention. [Main component symbol description] 10 Power supply 12, 12-1, 12-2 Dry vacuum pump 12a, 12-la, 12-2a Motor 12b, 12-lb, 12-2b Pump unit 12c, 12-2c Gear unit 14 Filter Capacitor 13 Rectifier DC Circuit 19 323041 15 201202555 16 DC/DC Converter Circuit 17 Inverter 18 Control Circuit 19 AC Power Supply 20 Dry Vacuum Pump Unit 21 Electrical Equipment Housing 22 System Housing 23 Liquid Cooling Compartment 24 Housing 25 Coolant Channel 27 intake port 28 exhaust port 30, 32 high efficiency cooling unit 31 first electrical equipment housing 33 second electrical equipment housing 34 control circuit cooling fan 20 323041