TWI487762B - 黏著劑用樹脂組成物、含有其之黏著劑、黏著性薄片及含有其作為黏著劑層之印刷配線板 - Google Patents
黏著劑用樹脂組成物、含有其之黏著劑、黏著性薄片及含有其作為黏著劑層之印刷配線板 Download PDFInfo
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- TWI487762B TWI487762B TW100112720A TW100112720A TWI487762B TW I487762 B TWI487762 B TW I487762B TW 100112720 A TW100112720 A TW 100112720A TW 100112720 A TW100112720 A TW 100112720A TW I487762 B TWI487762 B TW I487762B
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- thermoplastic resin
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
- C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
- C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6633—Compounds of group C08G18/42
- C08G18/6659—Compounds of group C08G18/42 with compounds of group C08G18/34
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/08—Epoxidised polymerised polyenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010092938 | 2010-04-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201207059A TW201207059A (en) | 2012-02-16 |
TWI487762B true TWI487762B (zh) | 2015-06-11 |
Family
ID=44798654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100112720A TWI487762B (zh) | 2010-04-14 | 2011-04-13 | 黏著劑用樹脂組成物、含有其之黏著劑、黏著性薄片及含有其作為黏著劑層之印刷配線板 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4978753B2 (ja) |
KR (1) | KR101660083B1 (ja) |
CN (1) | CN102782074B (ja) |
TW (1) | TWI487762B (ja) |
WO (1) | WO2011129278A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5304152B2 (ja) * | 2008-09-30 | 2013-10-02 | 東洋紡株式会社 | 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板 |
KR101727353B1 (ko) | 2010-04-14 | 2017-04-14 | 도요보 가부시키가이샤 | 접착제용 수지 조성물, 이것을 함유하는 접착제, 접착성 시트 및 이것을 접착제층으로서 포함하는 프린트 배선판 |
JP5850103B1 (ja) * | 2014-07-25 | 2016-02-03 | 横浜ゴム株式会社 | 接着剤組成物 |
WO2016013621A1 (ja) * | 2014-07-25 | 2016-01-28 | 横浜ゴム株式会社 | 接着剤組成物 |
JP5924383B2 (ja) * | 2014-07-25 | 2016-05-25 | 横浜ゴム株式会社 | 接着剤組成物 |
JP5953391B1 (ja) * | 2015-03-30 | 2016-07-20 | 株式会社フジクラ | 熱硬化性接着剤組成物、カバーレイフィルム、接着剤フィルム、金属張積層板及びフレキシブルプリント配線板 |
JP6170211B1 (ja) * | 2016-07-15 | 2017-07-26 | 株式会社フジクラ | 熱硬化性接着剤組成物、カバーレイフィルム、接着剤フィルム、金属張積層板及びフレキシブルプリント配線板 |
WO2018179707A1 (ja) * | 2017-03-28 | 2018-10-04 | 東洋紡株式会社 | カルボン酸基含有ポリエステル系接着剤組成物 |
TWI779066B (zh) * | 2017-07-19 | 2022-10-01 | 日商東洋紡股份有限公司 | 黏接劑組成物 |
JP7098350B2 (ja) * | 2018-02-28 | 2022-07-11 | キヤノン株式会社 | 接着シートを用いたインクジェット記録ヘッド及び製造方法 |
CN108587508B (zh) * | 2018-03-29 | 2021-04-06 | 广东莱尔新材料科技股份有限公司 | 一种高粘金属力的热熔胶膜及其制备方法 |
CN116731500B (zh) * | 2023-06-20 | 2024-08-13 | 国网湖北省电力有限公司孝感供电公司 | 一种电缆线路包覆材料及其制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010038733A1 (ja) * | 2008-09-30 | 2010-04-08 | 東洋紡績株式会社 | 接着剤用樹脂組成物、これを含有する接着剤、接着シートおよびこれを用いて接着したプリント配線板用積層体 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3376133B2 (ja) * | 1994-10-21 | 2003-02-10 | ダイセル化学工業株式会社 | 接着剤組成物 |
JP4423513B2 (ja) | 1997-10-20 | 2010-03-03 | 東洋紡績株式会社 | 接着用樹脂組成物及び接着用フィルム |
JP4865157B2 (ja) * | 2001-07-19 | 2012-02-01 | 日東シンコー株式会社 | 耐湿熱性ホットメルト接着剤組成物 |
JP2005170999A (ja) * | 2003-12-09 | 2005-06-30 | Toyobo Co Ltd | 接着剤及びそれを用いたポリエステルフィルムラミネート鋼板 |
JP4946080B2 (ja) * | 2006-02-06 | 2012-06-06 | 東洋紡績株式会社 | 接着剤組成物及びそれを用いたフレキシブル銅張積層板 |
JP5050429B2 (ja) * | 2006-07-14 | 2012-10-17 | 東洋紡績株式会社 | ポリエステル樹脂組成物及びそれを含む接着剤 |
CN101490813B (zh) * | 2006-07-19 | 2011-07-13 | 积水化学工业株式会社 | 切片及芯片键合带以及半导体芯片制造方法 |
JP2008205370A (ja) | 2007-02-22 | 2008-09-04 | Sumitomo Bakelite Co Ltd | 樹脂組成物、支持基材付き接着剤および補強板付プリント回路板 |
JP2008260831A (ja) * | 2007-04-11 | 2008-10-30 | Mitsubishi Plastics Ind Ltd | 水性接着剤および樹脂シート被覆金属板 |
JP5181601B2 (ja) * | 2007-09-28 | 2013-04-10 | 東洋紡株式会社 | 溶剤可溶型結晶性ポリエステル樹脂を用いた接着剤組成物、積層体並びにフレキシブルフラットケーブル |
WO2010035822A1 (ja) * | 2008-09-29 | 2010-04-01 | 東洋紡績株式会社 | ポリエステル樹脂組成物、これを含む接着剤、接着テープおよびフレキシブルフラットケーブル |
JP5304152B2 (ja) * | 2008-09-30 | 2013-10-02 | 東洋紡株式会社 | 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板 |
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2011
- 2011-04-08 KR KR1020127023559A patent/KR101660083B1/ko active IP Right Grant
- 2011-04-08 WO PCT/JP2011/058902 patent/WO2011129278A1/ja active Application Filing
- 2011-04-08 JP JP2011528129A patent/JP4978753B2/ja active Active
- 2011-04-08 CN CN201180011811.6A patent/CN102782074B/zh active Active
- 2011-04-13 TW TW100112720A patent/TWI487762B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010038733A1 (ja) * | 2008-09-30 | 2010-04-08 | 東洋紡績株式会社 | 接着剤用樹脂組成物、これを含有する接着剤、接着シートおよびこれを用いて接着したプリント配線板用積層体 |
Non-Patent Citations (1)
Title |
---|
Yu.A. Gorbatkina;Adhesion of modified polymers to fibres: Maxima on adhesive strength-modifier amount curves and the causes of their appearance;International Journal of Adhesion & Adhesives;29;Page 9-17;2007/11/01 * |
Also Published As
Publication number | Publication date |
---|---|
KR101660083B1 (ko) | 2016-09-26 |
TW201207059A (en) | 2012-02-16 |
CN102782074A (zh) | 2012-11-14 |
WO2011129278A1 (ja) | 2011-10-20 |
JP4978753B2 (ja) | 2012-07-18 |
CN102782074B (zh) | 2014-06-18 |
JPWO2011129278A1 (ja) | 2013-07-18 |
KR20130057965A (ko) | 2013-06-03 |
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