TWI486978B - Manufacture method for surface-mount inductor - Google Patents
Manufacture method for surface-mount inductor Download PDFInfo
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- TWI486978B TWI486978B TW102125990A TW102125990A TWI486978B TW I486978 B TWI486978 B TW I486978B TW 102125990 A TW102125990 A TW 102125990A TW 102125990 A TW102125990 A TW 102125990A TW I486978 B TWI486978 B TW I486978B
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本發明一般係關於電感之製造方法，具體而言，本發明係關於微型化一體成型之表面黏著式電感之製造方法。The present invention generally relates to a method of manufacturing an inductor, and more particularly to a method of manufacturing a surface mount inductor that is miniaturized and integrally formed.
電感元件已廣泛地應用於各式各樣的電子產品，其通常為藉由黏合、焊接等技術將線圈包覆於上/下蓋體之中而製成。然而，隨著元件尺寸縮小化需求的日益提升，黏合、焊接等技術已不適用於形成微型化的電感元件。再者，利用表面黏著技術將元件固著在電路板上已成為一種技術趨勢，因此如何製造具有微型化尺寸且具有適合應用表面黏著技術的電感元件已成為現今的重要議題。Inductive components have been widely used in a wide variety of electronic products, which are usually made by coating a coil in an upper/lower cover by techniques such as bonding and soldering. However, as the demand for component size reduction has increased, bonding, soldering, and the like have not been applied to the formation of miniaturized inductive components. Furthermore, the use of surface mount technology to mount components on a circuit board has become a technological trend, so how to fabricate an inductive component having a miniaturized size and having a suitable surface adhesion technique has become an important issue today.
本發明之一目的在於提供一種表面黏著式電感之製造方法，其藉由一體成型技術以低成本製造微型化的表面黏著式電感。SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a surface-adhesive inductor which is manufactured by a one-shot molding technique at a low cost to produce a miniaturized surface-adhesive inductor.
本發明之另一目的在於提供一種表面黏著式電感之製造方法，其藉由模具裝置之溝槽設計，可有效定位線圈以簡化製造程序。Another object of the present invention is to provide a method of manufacturing a surface-adhesive inductor which can effectively position a coil to simplify the manufacturing process by the groove design of the mold device.
本發明之又一目的在於提供一種表面黏著式電感之製造方法，其藉由單一模具裝置之溝槽設計，可提供多樣化定位效果，以節省製造成本。It is still another object of the present invention to provide a method of manufacturing a surface-adhesive inductor which can provide a variety of positioning effects by a groove design of a single mold device to save manufacturing costs.
於一實施例，本發明提供一種表面黏著式電感之製造方法，其包含成形一線圈，該線圈係由扁平導線捲繞而成並具有線圈體、第一延伸端及第二延伸端，第一延伸端及第二延伸端係分別自線圈體相對側延伸而出；懸空放置線圈於模具裝置，使得線圈之第一延伸端及第二延伸端之延伸方向實質垂直於線圈體之捲繞中心軸；於模具裝置中模鑄形成包覆體包覆線圈，以使得線圈僅部分的第一延伸端及部分的第二延伸端裸露在包覆體外並突出於包覆體；彎折突出的第一延伸端及第二延伸端，以使彎折後的第一延伸端及第二延伸端分別平貼包覆體之第一側壁及第二側壁；以及形成第一電極及第二電極於包覆體之表面，其中第一電極及第二電極分別電連接第一延伸端及第二延伸端。In one embodiment, the present invention provides a method of manufacturing a surface-adhesive inductor, comprising forming a coil wound from a flat wire and having a coil body, a first extending end, and a second extending end, first The extending end and the second extending end respectively extend from opposite sides of the coil body; the coil is placed in the mold device so that the extending direction of the first extending end and the second extending end of the coil is substantially perpendicular to the winding central axis of the coil body Forming a cladding coated coil in the mold device such that only a portion of the first extended end and a portion of the second extended end of the coil are exposed outside the cladding and protrude from the covering body; And extending the first end and the second extending end respectively to the first side wall and the second side wall of the covering body; and forming the first electrode and the second electrode a surface of the body, wherein the first electrode and the second electrode are electrically connected to the first extending end and the second extending end, respectively.
於另一實施例，本發明提供一種表面黏著式電感之製造方法，包含成形線圈，該線圈係由扁平導線捲繞而成並具有線圈體、第一延伸端及第二延伸端，第一延伸端及第二延伸端係分別自線圈體相對側延伸而出；懸空放置線圈於模具裝置，使得線圈之第一延伸端及第二延伸端之延伸方向實質垂直於線圈體之捲繞中心軸且不通過線圈體，第一延伸端及第二延伸端係實質接觸模具裝置之側壁；於模具裝置中模鑄形成包覆體包覆線圈，以使得線圈僅第一延伸端及第二延伸端裸露在包覆體外並分別與包覆體之第一側壁及第二側壁實質共平面；以及形成第一電極及第二電極於包覆體之表面，其中第一電極及第二電極分別電連接第一延伸端及第二延伸端。In another embodiment, the present invention provides a method of manufacturing a surface-adhesive inductor, comprising a shaped coil wound from a flat wire and having a coil body, a first extended end, and a second extended end, a first extension The end and the second extending end respectively extend from opposite sides of the coil body; the coil is suspended in the mold device such that the extending direction of the first extending end and the second extending end of the coil is substantially perpendicular to the winding central axis of the coil body and Without passing through the coil body, the first extending end and the second extending end substantially contacting the sidewall of the mold device; and molding the cladding coil in the mold device to make the coil only the first extending end and the second extending end bare The first electrode and the second electrode are substantially coplanar with the first side wall and the second side wall of the covering body, and the first electrode and the second electrode are formed on the surface of the covering body, wherein the first electrode and the second electrode are respectively electrically connected An extended end and a second extended end.
於另一實施例，本發明提供一種表面黏著式電感之製造方法，其包含成形線圈，該線圈係由扁平導線捲繞而成並具有線圈體、第一 延伸端及第二延伸端，第一延伸端及第二延伸端係分別自線圈體相對側延伸而出；提供載體於模具裝置；放置線圈於載體上，使得線圈之第一延伸端及第二延伸端之延伸方向實質垂直於線圈體之捲繞中心軸且不通過線圈體，第一延伸端及第二延伸端係實質接觸模具裝置之側壁；於模具裝置中倒入導磁粉末，導磁粉末與載體壓鑄形成包覆體包覆線圈，以使得線圈僅第一延伸端及第二延伸端裸露在包覆體外並分別與包覆體之第一側壁及第二側壁實質共平面；以及形成第一電極及第二電極於包覆體之表面，其中第一電極及第二電極分別電連接第一延伸端及第二延伸端。In another embodiment, the present invention provides a method of manufacturing a surface-adhesive inductor, comprising a shaped coil wound from a flat wire and having a coil body, first The extending end and the second extending end, the first extending end and the second extending end respectively extending from opposite sides of the coil body; providing a carrier to the mold device; placing the coil on the carrier, so that the first extending end of the coil and the second The extending direction of the extending end is substantially perpendicular to the winding central axis of the coil body and does not pass through the coil body, and the first extending end and the second extending end substantially contact the side wall of the mold device; and the magnetic conductive powder is poured into the mold device to conduct magnetic The powder and the carrier are die-cast to form the cladding coated coil, such that only the first extended end and the second extended end of the coil are exposed outside the cladding and are substantially coplanar with the first sidewall and the second sidewall of the cladding; and The first electrode and the second electrode are on the surface of the covering body, wherein the first electrode and the second electrode are electrically connected to the first extending end and the second extending end, respectively.
於一實施例，模具裝置係具有第一溝槽及第二溝槽，放置線圈於模具裝置時，突出包覆體的第一延伸端及第二延伸端係分別置於第一溝槽及第二溝槽中。於另一實施例，模具裝置係具有第一溝槽及第二溝槽，放置線圈於模具裝置時，部分的第一延伸端及第二延伸端係分別置於第一溝槽及第二溝槽中，並在形成包覆體後分別自包覆體之第一側壁及第二側壁突出於包覆體。此外，放置線圈於模具裝置時，係使得線圈之第一延伸端及第二延伸端之延伸方向相反或相同。於又一實施例，模具裝置具有第一梯台及第二梯台，其中第一梯台及第二梯台係自模具裝置之側壁突出，當線圈放置於模具裝置時，第一延伸端及第二延伸端係分別由第一梯台及第二梯台支撐。In one embodiment, the mold device has a first groove and a second groove. When the coil is placed on the mold device, the first extended end and the second extended end of the protruding cover are respectively placed in the first groove and the first groove In the two grooves. In another embodiment, the mold device has a first groove and a second groove. When the coil is placed on the mold device, a portion of the first extending end and the second extending end are respectively disposed in the first groove and the second groove. In the groove, after forming the covering body, the first side wall and the second side wall of the covering body respectively protrude from the covering body. Further, when the coil is placed on the mold device, the first extended end and the second extended end of the coil extend in opposite or the same direction. In still another embodiment, the mold device has a first step and a second step, wherein the first step and the second step protrude from a side wall of the mold device, and when the coil is placed on the mold device, the first extended end and The second extension ends are respectively supported by the first step and the second step.
於一實施例，於形成第一電極及第二電極之前，更包含裁切第一延伸端及第二延伸端突出於包覆體的部分，以使第一延伸端及第二延伸端之延伸長度不超過包覆體之第一側壁及第二側壁之端面。於另一實施例，於形成第一電極及第二電極之前，更包含分別黏貼第一延伸端及第二 延伸端於包覆體之第一側壁及第二側壁。於又一實施例，扁平導線係由絕緣層包覆銅線所構成，且於形成第一電極及第二電極之前，更包含藉由雷射或研磨去除包覆在第一延伸端及第二延伸端之絕緣層，以裸露出銅線。In an embodiment, before forming the first electrode and the second electrode, the method further includes cutting a portion of the first extending end and the second extending end protruding from the covering body to extend the first extending end and the second extending end The length does not exceed the end faces of the first side wall and the second side wall of the covering body. In another embodiment, before forming the first electrode and the second electrode, the method further includes: respectively bonding the first extended end and the second The extending end is on the first side wall and the second side wall of the covering body. In another embodiment, the flat wire is composed of an insulating layer covering the copper wire, and before forming the first electrode and the second electrode, further comprises removing the coating on the first extending end and the second by laser or grinding. Extending the insulation layer to expose the copper wire.
於一實施例，模鑄形成包覆體之步驟包含：於模具裝置中倒入導磁粉末壓鑄形成包覆體。另一實施例，於形成包覆體後，更包含將包覆線圈之包覆體自模具裝置脫模。In one embodiment, the step of molding the cladding body comprises: pouring a magnetic conductive powder into the mold device to form a coating body. In another embodiment, after forming the covering body, the coating body covering the coil is further released from the mold device.
10‧‧‧扁平導線10‧‧‧flat wire
12‧‧‧絕緣層12‧‧‧Insulation
14‧‧‧銅線14‧‧‧ copper wire
100、100A、100B‧‧‧線圈100, 100A, 100B‧‧‧ coil
110‧‧‧線圈體110‧‧‧ coil body
112‧‧‧第一延伸端112‧‧‧First extension
114‧‧‧第二延伸端114‧‧‧Second extension
20、20A、20B‧‧‧模具裝置20, 20A, 20B‧‧‧ mold device
201‧‧‧第一溝槽201‧‧‧First trench
202‧‧‧第二溝槽202‧‧‧Second trench
203a-203d‧‧‧溝槽203a-203d‧‧‧ trench
220‧‧‧下模220‧‧‧下模
222‧‧‧下模座222‧‧‧ lower mold base
222a‧‧‧模穴222a‧‧‧ cavity
222b‧‧‧側壁222b‧‧‧ side wall
222c‧‧‧側壁222c‧‧‧ side wall
224‧‧‧推出件224‧‧‧Exhibition
230‧‧‧上模230‧‧‧上模
240‧‧‧下模240‧‧‧Down
242‧‧‧下模座242‧‧‧ lower mold base
242a‧‧‧模穴242a‧‧‧ cavity
242b‧‧‧第一梯台242b‧‧‧ first step
242c‧‧‧第二梯台242c‧‧‧second terrace
244‧‧‧推出件244‧‧‧Exhibition
30‧‧‧載體30‧‧‧ Carrier
30a‧‧‧定位機構30a‧‧ ‧ Positioning agency
300、300A‧‧‧包覆體300, 300A‧‧ ‧ wrap
300a‧‧‧導磁粉末300a‧‧‧Magnetic magnetic powder
310‧‧‧第一側壁310‧‧‧First side wall
320‧‧‧第二側壁320‧‧‧ second side wall
330‧‧‧凹口330‧‧‧ Notch
410‧‧‧第一電極410‧‧‧First electrode
420‧‧‧第二電極420‧‧‧second electrode
A1、A2、B1、B2、C1、C2‧‧‧延伸方向A1, A2, B1, B2, C1, C2‧‧‧ extension direction
C‧‧‧捲繞中心軸C‧‧‧Winding central axis
圖1A至圖1G為本發明第一實施例表面黏著式電感之製造方法之各階段示意圖，其中圖1A-1B係分別為線圈之立體圖及上視圖，圖1C-1D係顯示線圈置於模具裝置中之示意圖，圖1E-1F係顯示包覆體包覆線圈之示意圖，而圖1G係為形成電極完成表面黏著式電感之示意圖。1A to FIG. 1G are schematic diagrams showing stages of a method for manufacturing a surface-adhesive inductor according to a first embodiment of the present invention, wherein FIGS. 1A-1B are respectively a perspective view and a top view of the coil, and FIGS. 1C-1D show the coil placed in the mold device. In the schematic diagram, FIG. 1E-1F shows a schematic diagram of the coated body covered coil, and FIG. 1G is a schematic diagram of forming an electrode to complete the surface-adhesive inductor.
圖2A至圖2F為本發明第二實施例表面黏著式電感之製造方法之各階段示意圖，其中圖2A-2B係分別為線圈之立體圖及上視圖，圖2C-2D係顯示線圈置於模具裝置中之示意圖，圖2E係顯示包覆體包覆線圈之示意圖，而圖2F係為形成電極完成表面黏著式電感之示意圖。2A to 2F are schematic diagrams showing various stages of a method for manufacturing a surface-adhesive inductor according to a second embodiment of the present invention, wherein FIGS. 2A-2B are respectively a perspective view and a top view of the coil, and FIGS. 2C-2D show the coil placed in the mold device. In the schematic diagram of FIG. 2E, a schematic diagram of the coated body covered coil is shown, and FIG. 2F is a schematic diagram of forming an electrode to complete the surface-adhesive inductor.
圖3A及圖3B為本發明第三實施例表面黏著式電感之製造方法之示意圖，其中圖3A係顯示線圈置於模具裝置中之示意圖，而圖3B係顯示包覆體包覆線圈之示意圖。3A and FIG. 3B are schematic diagrams showing a method of manufacturing a surface-adhesive inductor according to a third embodiment of the present invention, wherein FIG. 3A is a schematic view showing a coil placed in a mold device, and FIG. 3B is a schematic view showing a coated body covered coil.
圖4A至圖4C為本發明第四實施例表面黏著式電感之製造方法之示意圖，其中圖4A係顯示線圈置於模具裝置中之示意圖，而圖4B-4C係顯示包覆體包覆線圈之示意圖。4A to 4C are schematic views showing a method of manufacturing a surface-adhesive inductor according to a fourth embodiment of the present invention, wherein FIG. 4A is a schematic view showing a coil placed in a mold device, and FIGS. 4B-4C are diagrams showing a coated body covered coil; schematic diagram.
圖5A至圖5C為本發明第五實施例表面黏著式電感之製造方 法之示意圖，其中圖5A-5B係分別為線圈之立體圖及上視圖，而圖5C係顯示包覆體包覆線圈之示意圖。5A to 5C are manufacturing sides of a surface-adhesive inductor according to a fifth embodiment of the present invention; The schematic diagram of the method, wherein FIGS. 5A-5B are respectively a perspective view and a top view of the coil, and FIG. 5C is a schematic view showing the envelope covered coil.
圖6A及圖6B為本發明第六實施例表面黏著式電感之製造方法之示意圖，其中圖6A-6B係分別顯示線圈置於模具裝置中之示意圖。6A and 6B are schematic views showing a method of manufacturing a surface-adhesive inductor according to a sixth embodiment of the present invention, wherein FIGS. 6A-6B are schematic views respectively showing the coils placed in the mold device.
本發明提供表面黏著式電感之製造方法，其藉由模具裝置之溝槽設計有效定位線圈簡化製造程序，並藉由一體成型技術以低成本製造微型化的表面黏著式電感。於後參考圖式，詳細說明本發明實施例表面黏著式電感之製造方法的細節。The invention provides a method for manufacturing a surface-adhesive inductor, which simplifies the manufacturing process by effectively designing the coil by the groove design of the mold device, and manufactures the miniaturized surface-adhesive inductor at low cost by an integral molding technique. Details of the manufacturing method of the surface-adhesive inductor of the embodiment of the present invention will be described in detail below with reference to the drawings.
參考圖1A及1B，於第一實施例，本發明之表面黏著式電感之製造方法包含成形線圈100，其中線圈100係由扁平導線10捲繞而成並具有線圈體110、第一延伸端112及第二延伸端114。於此實施例，扁平導線10較佳係由絕緣層12包覆銅線14所構成，以使扁平導線10捲繞成線圈100時，線圈體110各圈之間可保持絕緣。扁平導線10於捲繞前較佳為矩形條狀導線，且於其延伸方向呈扁平狀。如圖所示，扁平導線10以捲繞中心軸C為中心沿扁平表面捲繞成線圈100時，較佳形成具有複數圈之雙層螺旋線圈體110，且扁平導線10之兩端分別形成第一延伸端112及第二延伸端114。於此實施例，線圈體110之各層圈數較佳相等且可依需求改變，不以實施例為限。於本實施例中，第一延伸端112及第二延伸端114係自線圈體110之相對側延伸而出。舉例而言，第一延伸端112係自線圈體110之下層圈向左側延伸而出，而第二延伸端114係自線圈體110之上層圈向右側延伸而出，其中第一延伸端112及第二延伸端114之延伸方向A1、A2較佳為背向延伸且實質 垂直於線圈體110之捲繞中心軸C，亦即垂直線圈體110於延伸位置之切線方向。於本實施例中，成形線圈100之步驟可包含捲繞扁平導線10以形成線圈體110，接著整型線圈體110以使扁形導線10之兩端分別形成自線圈體110之相對側延伸而出之第一延伸端112及第二延伸端114。亦即，整型線圈體110以使第一延伸端112及第二延伸端114之延伸方向於平行捲繞中心軸C方向之投影較佳實質為共線。Referring to FIGS. 1A and 1B, in a first embodiment, a method of manufacturing a surface-adhesive inductor of the present invention includes a forming coil 100, wherein the coil 100 is wound from a flat wire 10 and has a coil body 110 and a first extended end 112. And a second extension end 114. In this embodiment, the flat wire 10 is preferably formed by the insulating layer 12 covering the copper wire 14 so that the coil wire 110 can be insulated between the turns of the coil body 110 when the flat wire 10 is wound into the coil 100. The flat wire 10 is preferably a rectangular strip wire before being wound, and is flat in its extending direction. As shown in the figure, when the flat wire 10 is wound into the coil 100 along the flat surface around the winding center axis C, it is preferable to form the double-layer spiral coil body 110 having a plurality of turns, and the two ends of the flat wire 10 are respectively formed. An extended end 112 and a second extended end 114. In this embodiment, the number of turns of the coil body 110 is preferably equal and can be changed according to requirements, and is not limited to the embodiment. In this embodiment, the first extended end 112 and the second extended end 114 extend from opposite sides of the coil body 110. For example, the first extending end 112 extends from the lower layer of the coil body 110 to the left side, and the second extending end 114 extends from the upper layer of the coil body 110 to the right side, wherein the first extending end 112 and The extending directions A1 and A2 of the second extending end 114 are preferably extended in the back direction and substantially It is perpendicular to the winding central axis C of the coil body 110, that is, the tangential direction of the vertical coil body 110 in the extended position. In the present embodiment, the step of forming the coil 100 may include winding the flat wire 10 to form the coil body 110, and then the integral coil body 110 such that the two ends of the flat wire 10 are respectively formed to extend from opposite sides of the coil body 110. The first extended end 112 and the second extended end 114. That is, the projection of the integral coil body 110 such that the extending direction of the first extending end 112 and the second extending end 114 in the direction of the parallel winding central axis C is preferably substantially collinear.
參考圖1C及1D，本發明之表面黏著式電感之製造方法更包含懸空放置線圈100於模具裝置20，使得線圈100之第一延伸端112及第二延伸端114之延伸方向實質垂直於線圈體110之捲繞中心軸C。於此實施例，模具裝置20係具有下模220及上模230，其中下模220及上模230可對應壓合。如圖所示，下模220包含下模座222及推出件224，其中下模座222具有模穴222a以及與模穴222a連通之第一溝槽201及第二溝槽202。舉例而言，第一溝槽201及第二溝槽202較佳自模穴222a之相對側延伸且直線對準，以供容置線圈100之第一延伸端112及第二延伸端114。再者，對應於線圈體110之雙層螺旋結構，第一溝槽201及第二溝槽202之底部高度較佳對應於第一延伸端112及第二延伸端114之位置相差線圈體110之單層螺旋厚度，以利支撐延伸端112、114。具體而言，當線圈100放置於模具裝置20時，線圈100之第一延伸端112及第二延伸端114分別容置於模具裝置20之第一溝槽201及第二溝槽202中並由溝槽底部所支撐，而線圈體110則藉此懸空定位於模穴222a中。亦即，藉由模具裝置20之溝槽設計，無須額外的支撐/定位部件即可有效定位線圈100，並能使線圈100保持成形後的形狀，例如使線圈100之第一延伸端112及第二延伸端114之延伸方向保持實質垂直於線圈體110之捲繞中 心軸C。推出件224及上模230係分別對應設置於下模座222之下方及上方，其中推出件224可相對於下模座222於模穴222a內移動，用於模鑄成形後將成形物推出下模座222，如後詳述。Referring to FIGS. 1C and 1D, the method of manufacturing the surface-adhesive inductor of the present invention further includes placing the coil 100 in the mold unit 20 such that the first extending end 112 and the second extending end 114 of the coil 100 extend substantially perpendicular to the coil body. The winding center axis C of 110. In this embodiment, the mold device 20 has a lower mold 220 and an upper mold 230, wherein the lower mold 220 and the upper mold 230 are correspondingly press-fitted. As shown, the lower mold 220 includes a lower die holder 222 and a pusher member 224. The lower die holder 222 has a cavity 222a and a first groove 201 and a second groove 202 communicating with the cavity 222a. For example, the first trench 201 and the second trench 202 preferably extend from opposite sides of the cavity 222a and are linearly aligned for receiving the first extended end 112 and the second extended end 114 of the coil 100. In addition, corresponding to the double-layer spiral structure of the coil body 110, the bottom heights of the first trench 201 and the second trench 202 preferably correspond to the positions of the first extended end 112 and the second extended end 114. The single layer of spiral has a thickness to support the extended ends 112, 114. Specifically, when the coil 100 is placed on the mold device 20, the first extended end 112 and the second extended end 114 of the coil 100 are respectively received in the first groove 201 and the second groove 202 of the mold device 20 and are The bottom of the groove is supported, and the coil body 110 is thereby suspended in the cavity 222a. That is, by the groove design of the mold device 20, the coil 100 can be effectively positioned without additional support/positioning members, and the coil 100 can be maintained in a shaped shape, such as the first extended end 112 of the coil 100 and the first The extending direction of the two extending ends 114 remains substantially perpendicular to the winding of the coil body 110 Mandrel C. The pushing member 224 and the upper die 230 are respectively disposed below and above the lower die holder 222, wherein the pushing member 224 is movable relative to the lower die holder 222 in the cavity 222a for molding and forming the molded product. The mold base 222 is described in detail later.
接著，同時參考圖1D及1E，本發明之表面黏著式電感之製造方法包含於模具裝置20中模鑄形成包覆體300包覆線圈100，以使得線圈100僅部分的第一延伸端112及部分的第二延伸端114裸露在包覆體300外並突出於包覆體300。模鑄形成包覆體300之步驟包含於模具裝置20中倒入導磁粉末300a壓鑄形成包覆體300。具體而言，如上述方式將線圈100懸空放置於模具裝置20之下模220後，倒入導磁粉末300a於下模座222之模穴222a中以完全覆蓋線圈100除了在溝槽201、202中之延伸段112、114的所有部分(即完全覆蓋線圈體110與部分的延伸段)，並藉由上模230及下模220壓合，以熱壓成型方式形成包覆體300，使得包覆體300將線圈體110完全包覆於其中並僅裸露出位於第一溝槽201及第二溝槽202中之第一延伸段112及第二延伸段114。模鑄形成包覆體300後，可將包覆體300自模具裝置20脫模。舉例而言，可利用推出件224將包覆體300(含被包覆的線圈100)推出模具裝置20，其中原本置於第一溝槽201及第二溝槽202中之第一延伸段112及第二延伸段114即成為突出包覆體300之側壁310、320的部分，如圖1E所示。Next, referring to FIGS. 1D and 1E, the manufacturing method of the surface-adhesive inductor of the present invention comprises molding in the mold device 20 to form the covering body 300 to cover the coil 100, so that the coil 100 has only a part of the first extending end 112 and A portion of the second extended end 114 is exposed outside the cladding 300 and protrudes from the cladding 300. The step of molding to form the covering body 300 includes pouring the magnetic conductive powder 300a into the mold device 20 to die-cast to form the covering body 300. Specifically, after the coil 100 is suspended in the lower mold 220 of the mold device 20 as described above, the magnetic conductive powder 300a is poured into the cavity 222a of the lower die holder 222 to completely cover the coil 100 except for the grooves 201, 202. All portions of the extensions 112, 114 (ie, completely covering the coil body 110 and a portion of the extension) are pressed by the upper mold 230 and the lower mold 220 to form the cladding 300 by thermoforming. The cover 300 completely encloses the coil body 110 therein and exposes only the first extension 112 and the second extension 114 located in the first trench 201 and the second trench 202. After the overmolding 300 is formed by molding, the covering 300 can be released from the mold device 20. For example, the wrapper 300 (including the wrapped coil 100) can be pushed out of the mold device 20 by means of the pusher 224, wherein the first extension 112 originally placed in the first trench 201 and the second trench 202 And the second extension 114 is a portion that protrudes from the sidewalls 310, 320 of the cladding 300, as shown in FIG. 1E.
再者，如圖1F所示，本發明之表面黏著式電感之製造方法包含彎折突出的第一延伸端112及第二延伸端114，以使彎折後的第一延伸端112及第二延伸端114分別平貼包覆體300之第一側壁310及第二側壁320。具體而言，本發明之製造方法較佳係分別沿第一側壁310及第二側壁320彎折第一延伸端112及第二延伸端114，以使第一延伸端112及第二延伸端 114之扁平表面分別平貼於包覆體300之第一側壁310及第二側壁320作為線圈100之電接觸部。為了加強彎折之第一延伸端112及第二延伸端114與包覆體300間的固定，可藉由黏著劑使第一延伸端112及第二延伸端114分別黏貼於包覆體300之第一側壁310及第二側壁320。在此需注意，因線圈100係藉由絕緣層12包覆銅線14之扁平導線10所構成，本發明之表面黏著式電感之製造方法更包含藉由雷射或研磨去除包覆在第一延伸端112及第二延伸端114之絕緣層12，以裸露出銅線14，進而達到作為電接觸之目的。此外，因應平貼於包覆體300之第一延伸端112及第二延伸端114的長度，於一實施例，可選擇性裁切第一延伸端112及第二延伸端114突出於包覆體300的部分，以使第一延伸端112及第二延伸端114之延伸長度較佳不超過包覆體300之第一側壁310及第二側壁320之端面。於另一實施例，則可沿包覆體300之側壁端面再次彎折延伸端112、114，以使延伸端112或114延伸平貼於包覆體300相鄰之側壁上，如後詳述。Furthermore, as shown in FIG. 1F, the method for manufacturing the surface-adhesive inductor of the present invention comprises bending the first extended end 112 and the second extending end 114 so as to bend the first extended end 112 and the second The extending end 114 is respectively flatly attached to the first sidewall 310 and the second sidewall 320 of the covering body 300. Specifically, the manufacturing method of the present invention preferably bends the first extending end 112 and the second extending end 114 along the first side wall 310 and the second side wall 320 respectively, so that the first extending end 112 and the second extending end are respectively The flat surfaces of the flat surfaces of the cover 300 are respectively attached to the first side wall 310 and the second side wall 320 of the covering body 300 as electrical contacts of the coil 100. In order to strengthen the fixing between the first extended end 112 and the second extending end 114 and the covering body 300, the first extending end 112 and the second extending end 114 are respectively adhered to the covering body 300 by an adhesive. The first sidewall 310 and the second sidewall 320. It should be noted that, since the coil 100 is composed of the flat wire 10 of the copper wire 14 covered by the insulating layer 12, the manufacturing method of the surface-adhesive inductor of the present invention further comprises the first method of removing the coating by laser or grinding. The insulating layer 12 of the extended end 112 and the second extended end 114 is exposed to expose the copper wire 14 for the purpose of electrical contact. In addition, in accordance with an embodiment, the first extended end 112 and the second extended end 114 are selectively cut to protrude from the cover. The portion of the body 300 is such that the length of the first extending end 112 and the second extending end 114 does not exceed the end faces of the first side wall 310 and the second side wall 320 of the covering body 300. In another embodiment, the extending ends 112, 114 may be bent again along the sidewall end faces of the covering body 300 so that the extending ends 112 or 114 extend flatly on the adjacent sidewalls of the covering body 300, as will be described in detail later. .
接著，參考圖1G，本發明之表面黏著式電感之製造方法包含形成第一電極410及第二電極420於包覆體300之表面，以作為表面黏著式電感的電極，其中第一電極410及第二電極420係分別電連接第一延伸端112及第二延伸端114。於此實施例，形成第一電極410及第二電極420之方法包含將包覆體300具有第一延伸端112平貼之第一側壁310及具有第二延伸端114平貼之第二側壁320進行電鍍，以使第一電極410及第二電極420形成於包覆體300之相對兩側，如圖1G所示。第一電極410及第二電極420可使用一或多種電鍍材料進行一或多次的電鍍程序，其中電鍍材料可選自鎳(Ni)、錫(Sn)、銅(Cu)、金(Au)、鈀(Pd)、銀(Ag)及其組合，但不以此為限。藉由第 一電極410及第二電極420的形成，可使得微型化的電感具有較大的電極面積而適合用於表面黏著技術，以作為表面黏著式電感。Next, referring to FIG. 1G, the method for manufacturing the surface-adhesive inductor of the present invention comprises forming a first electrode 410 and a second electrode 420 on the surface of the covering body 300 as an electrode of a surface-adhesive inductor, wherein the first electrode 410 and The second electrode 420 is electrically connected to the first extending end 112 and the second extending end 114, respectively. In this embodiment, the method for forming the first electrode 410 and the second electrode 420 includes the first sidewall 310 having the first extended end 112 flat and the second sidewall 320 having the second extended end 114 flat. Electroplating is performed so that the first electrode 410 and the second electrode 420 are formed on opposite sides of the covering body 300 as shown in FIG. 1G. The first electrode 410 and the second electrode 420 may perform one or more plating processes using one or more plating materials, wherein the plating material may be selected from the group consisting of nickel (Ni), tin (Sn), copper (Cu), and gold (Au). , palladium (Pd), silver (Ag) and combinations thereof, but not limited to this. By the first The formation of an electrode 410 and a second electrode 420 allows the miniaturized inductor to have a larger electrode area and is suitable for surface adhesion techniques as a surface-adhesive inductor.
在此需注意，本發明之表面黏著式電感之製造方法可進一步包含烘烤步驟，亦即在形成表面黏著式電感之適當階段可應用烘烤技術加強表面黏著式電感的製作，例如在形成包覆體後、施用黏著劑後等，不以此為限。It should be noted that the method for manufacturing the surface-adhesive inductor of the present invention may further comprise a baking step, that is, a baking technique may be applied to enhance the fabrication of the surface-adhesive inductor at an appropriate stage of forming the surface-adhesive inductor, for example, in forming a package. After the covering, after applying the adhesive, etc., it is not limited thereto.
再者，本發明之表面黏著式電感之製造方法可藉由線圈的整型變化並配合模具裝置的設計，而達到各種態樣。為清晰之故，於後各實施例的說明著重在於與第一實施例不同之處(例如線圈的整型方式及/或模具裝置的變化等)，且其餘製造步驟(例如模鑄方式、電鍍方式等)可參考第一實施例進行，不再詳述。參考圖2A-2B，於第二實施例，本發明之表面黏著式電感之製造方法包含成形線圈100A，其中類似於第一實施例，線圈100A可由相同的扁平導線10捲繞而成並具有線圈體110、第一延伸端112及第二延伸端114，且相關說明可參照第一實施例於此不再贅述。第二實施例與第一實施例不同之處在於整型線圈100時，使第一延伸端112及第二延伸端114自線圈體110相對側延伸而出，並使其延伸方向B1、B2實質垂直於線圈體110之捲繞中心軸C且不通過線圈體110。如圖2A-2B所示，第一延伸端112及第二延伸端114之延伸方向B1、B2係相同，且較佳平行於線圈體110直徑兩端之切線方向並為相互平行。在此需注意，第一延伸端112及第二延伸端114之延伸方向B1、B2亦可為相反(參見圖5A及圖5B)，不以此為限。於第二實施例中，當懸空放置線圈100A於模具裝置20時，使得線圈100之第一延伸端112及第二延伸端114之延伸方向實質垂直於線圈體110之捲繞中心軸 C且不通過線圈體110，且第一延伸端112及第二延伸端114係實質接觸模具裝置20之側壁222b及222c，如圖2C所示。亦即，當懸空放置線圈100A於模具裝置20時，係藉由線圈100本身第一延伸端112及第二延伸端114相對於線圈體110之形變力，使第一延伸端112及第二延伸端114之扁平表面抵觸模具裝置20之側壁222b及222c，以保持定位於模穴222a中。在此需注意，於第二實施例之製造方法較佳使用與第一實施相同的模具裝置20以節省開模成本，或者亦可另行開模以使用僅具有模穴222a並無溝槽之特製模具裝置。Furthermore, the method of manufacturing the surface-adhesive inductor of the present invention can achieve various aspects by changing the shape of the coil and matching the design of the mold device. For the sake of clarity, the description of the following embodiments focuses on differences from the first embodiment (for example, the nebula of the coil and/or variations of the mold device, etc.), and the remaining manufacturing steps (eg, molding, plating) The method and the like can be performed with reference to the first embodiment and will not be described in detail. Referring to Figures 2A-2B, in a second embodiment, a method of fabricating a surface-adhesive inductor of the present invention includes a forming coil 100A, wherein, similar to the first embodiment, the coil 100A can be wound from the same flat wire 10 and has a coil The body 110, the first extending end 112 and the second extending end 114, and the related description may be omitted herein with reference to the first embodiment. The second embodiment is different from the first embodiment in that the first extension end 112 and the second extension end 114 are extended from opposite sides of the coil body 110 when the coil 100 is formed, and the extension direction B1, B2 is substantially It is perpendicular to the winding central axis C of the coil body 110 and does not pass through the coil body 110. As shown in FIGS. 2A-2B, the extending directions B1, B2 of the first extending end 112 and the second extending end 114 are the same, and are preferably parallel to the tangential directions of the two ends of the diameter of the coil body 110 and are parallel to each other. It should be noted that the extending directions B1 and B2 of the first extending end 112 and the second extending end 114 may be opposite (see FIG. 5A and FIG. 5B ), and are not limited thereto. In the second embodiment, when the coil 100A is placed in the mold device 20, the extending direction of the first extended end 112 and the second extended end 114 of the coil 100 is substantially perpendicular to the winding central axis of the coil body 110. C does not pass through the coil body 110, and the first extended end 112 and the second extended end 114 substantially contact the side walls 222b and 222c of the mold device 20, as shown in Fig. 2C. That is, when the coil 100A is placed in the mold device 20, the first extended end 112 and the second extension are caused by the deformation force of the first extended end 112 and the second extended end 114 of the coil 100 relative to the coil body 110. The flat surface of the end 114 abuts the side walls 222b and 222c of the mold assembly 20 to remain positioned in the cavity 222a. It should be noted that the manufacturing method of the second embodiment preferably uses the same mold device 20 as the first embodiment to save the mold opening cost, or can be separately opened to use the special mold having only the cavity 222a and no groove. Mold device.
接著，類似於第一實施例，本發明之表面黏著式電感之製造方法進行形成包覆體、形成第一電極及第二電極等步驟以完成表面黏著式電感的製造。參考圖2D至圖2F，於模具裝置20中模鑄形成包覆體300包覆線圈100A。如上所述，模鑄形成包覆體300之步驟包含於模具裝置20中倒入導磁粉末300a壓鑄形成包覆體300。具體而言，將線圈100A懸空放置於模具裝置20之下模220後，倒入導磁粉末300a於下模座222之模穴222a中以完全覆蓋線圈100A，並藉由上模230及下模220壓合，以熱壓成型方式形成包覆體300，使得包覆體300將線圈體110完全包覆於其中並僅裸露出第一延伸端112及第二延伸端114。如圖2E所示，模鑄形成包覆體300後，可將包覆體300自模具裝置20脫模，其中線圈100A僅第一延伸端112及第二延伸端114裸露在包覆體300外並分別與包覆體300之第一側壁310及第二側壁320實質共平面。亦即，第二實施例藉由第一延伸端112及第二延伸端114之扁平表面平貼模具裝置20之側壁222b及222c，而於模鑄形成包覆體300後使得第一延伸端112及第二延伸端114之扁平表面與包覆體300之第一側壁310及第二側壁320形成實質共平面。然後，第二實施例的製造方法可進行形成第一電極410 及第二電極420之步驟，使得第一電極410及第二電極420形成於包覆體300具有第一延伸端112及第二延伸端114裸露之表面，以使第一電極410及第二電極420分別電連接第一延伸端112及第二延伸端114，其中細節可參照第一實施例於此不再贅述。此外，第二實施例之表面黏著式電感之製造方法亦包含上述脫模、烘烤、移除絕緣層等步驟，相關說明可參考第一實施例於此不再贅述。相較於第一實施例，第二實施例藉由第一延伸端112及第二延伸端114之扁平表面平貼模具裝置20之側壁222b及222c，無須額外的黏貼、彎折或裁切延伸端的步驟，簡化製造程序並有效節省製造成本。Next, similar to the first embodiment, the manufacturing method of the surface-adhesive inductor of the present invention performs the steps of forming a cladding body, forming a first electrode and a second electrode, and the like to complete the manufacture of the surface-adhesive inductor. Referring to FIGS. 2D to 2F, a covering body 300 is coated in the mold device 20 to form a coil 100A. As described above, the step of molding to form the covering body 300 includes pouring the magnetic conductive powder 300a into the mold device 20 to die-cast to form the covering body 300. Specifically, after the coil 100A is suspended in the lower mold 220 of the mold device 20, the magnetic conductive powder 300a is poured into the cavity 222a of the lower mold base 222 to completely cover the coil 100A, and the upper mold 230 and the lower mold are used. The cover body 300 is formed by thermoforming, so that the covering body 300 completely covers the coil body 110 and exposes only the first extending end 112 and the second extending end 114. As shown in FIG. 2E, after the overmolding 300 is formed by molding, the covering body 300 can be released from the mold device 20, wherein only the first extended end 112 and the second extended end 114 of the coil 100A are exposed outside the covering body 300. And being substantially coplanar with the first sidewall 310 and the second sidewall 320 of the covering body 300, respectively. That is, the second embodiment flattens the sidewalls 222b and 222c of the mold device 20 by the flat surfaces of the first extending end 112 and the second extending end 114, and the first extending end 112 is formed after the forming of the covering body 300 by molding. The flat surface of the second extended end 114 forms a substantially coplanar with the first side wall 310 and the second side wall 320 of the covering body 300. Then, the manufacturing method of the second embodiment can perform the formation of the first electrode 410 And the step of the second electrode 420, the first electrode 410 and the second electrode 420 are formed on the exposed surface of the covering body 300 having the first extending end 112 and the second extending end 114, so that the first electrode 410 and the second electrode The 420 is electrically connected to the first extending end 112 and the second extending end 114, respectively, and details are not described herein with reference to the first embodiment. In addition, the manufacturing method of the surface-adhesive inductor of the second embodiment also includes the above steps of demolding, baking, removing the insulating layer, and the like, and the related description may be omitted herein with reference to the first embodiment. Compared with the first embodiment, the second embodiment flattens the sidewalls 222b and 222c of the mold device 20 by the flat surfaces of the first extending end 112 and the second extending end 114, without additional adhesive, bending or cutting extension. The steps of the end simplify the manufacturing process and effectively save manufacturing costs.
再者，如圖3A-3B所示，第三實施例係為第二實施例之變化例，其中模具裝置20A具有下模240及上模230，且下模240及上模230可對應壓合。如圖所示，下模240包含下模座242及推出件244，其中下模座242具有模穴242a以及第一梯台242b與第二梯台242c。第一梯台242b及第二梯台242c係自下模座242之側壁朝模穴242a突出以形成支撐平台。當圖2A-2B所示之線圈100A放置於模具裝置20A之下模240時，第一延伸端112及第二延伸端114不僅接觸下模座242之側壁同時係分別由第一梯台242b及第二梯台242c支撐，以加強線圈100A之定位效果。接著進行如上所述形成包覆體、脫模、去除絕緣層、烘烤、形成第一電極、第二電極等步驟以完成表面黏著式電感之製作。在此需注意，如圖3B所示，因為藉由梯台242b、242c支撐延伸端112、114，因此包覆體300A之形狀與第一實施例及第二實施例略有不同，其中包覆體300A係為類似「凸」字型的塊體，除了裸露出延伸端112、114之扁平表面同時形成凹口330裸露出與扁平表面相鄰之側面。再者，形成第一電極410及第二電極420後，因延伸端側面之厚度相對而言非 常小，所以利用第三實施例之製造方法完成之表面黏著式電感可以視為具有與第二實施例圖2F相同之結構。此外，可依據設計需求變化梯台之形狀、位置而同樣達到支撐延伸端之作用。舉例而言，於此實施例，梯台係設計成延伸整個側壁的寬度，而使包覆體具有類似「凸」字型的塊體，然而於其他實施例，梯台朝模穴突出之寬度以及沿側壁延伸之長度可依據延伸端之設計變化，不以實施例為限。Furthermore, as shown in FIGS. 3A-3B, the third embodiment is a modification of the second embodiment, wherein the mold device 20A has a lower mold 240 and an upper mold 230, and the lower mold 240 and the upper mold 230 are correspondingly press-fitted. . As shown, the lower die 240 includes a lower die holder 242 and a pusher member 244, wherein the lower die holder 242 has a cavity 242a and a first step 242b and a second step 242c. The first step 242b and the second step 242c protrude from the sidewall of the lower die holder 242 toward the cavity 242a to form a support platform. When the coil 100A shown in FIGS. 2A-2B is placed on the lower mold 240 of the mold device 20A, the first extended end 112 and the second extended end 114 not only contact the side walls of the lower mold base 242 but are respectively separated by the first step 242b and The second step 242c is supported to enhance the positioning effect of the coil 100A. Then, the steps of forming the cladding body, demolding, removing the insulating layer, baking, forming the first electrode, and the second electrode are performed as described above to complete the fabrication of the surface-adhesive inductor. It should be noted here that, as shown in FIG. 3B, since the extending ends 112, 114 are supported by the terraces 242b, 242c, the shape of the covering body 300A is slightly different from that of the first embodiment and the second embodiment, wherein the covering is different. The body 300A is a "convex" shaped block, except that the flat surfaces of the extended ends 112, 114 are exposed while forming the notches 330 exposed to the side adjacent the flat surface. Furthermore, after the first electrode 410 and the second electrode 420 are formed, the thickness of the side surface of the extended end is relatively non- Often small, the surface-adhesive inductor which is completed by the manufacturing method of the third embodiment can be regarded as having the same structure as that of Fig. 2F of the second embodiment. In addition, the shape and position of the step can be changed according to the design requirements, and the support extension end can also be achieved. For example, in this embodiment, the platform is designed to extend the width of the entire side wall such that the cladding has a "convex" shaped block, whereas in other embodiments, the width of the ladder toward the cavity And the length extending along the side wall may vary depending on the design of the extended end, and is not limited to the embodiment.
再者，亦可改變第二實施例之模具裝置，以利用類似溝槽加強線圈的定位。如圖4A-4B所示，於第四實施例，模具裝置係設計具有複數溝槽，用於使線圈定位於模具裝置中，並使延伸端裸露於包覆體外有各種態樣。如圖4A所示，模具裝置20B具有上述第一實施例之第一溝槽201及第二溝槽202外，同時還具有複數溝槽203a-203d，其中溝槽203a-203d係成對平行設置於模穴222a的相對兩側並與模穴222a相通。亦即溝槽203a-203d之延伸方向係平行於圖2之線圈100A之延伸端112、114的延伸方向，以供容置線圈100A之延伸端112、114。具體而言，溝槽203a及203b係設置在模穴222a之同一側並延伸於相同方向，而溝槽203c及203d係設置在模穴222a之相對另一側並延伸於相同方向。此外，溝槽203a-203d係沿著模穴222a之側壁222b、222c延伸，以利於延伸端112、114以接觸側壁222b、222c之方式容置於溝槽203a-203d。舉例而言，當線圈100A放置於模具裝置20B時，部分的第一延伸端112及第二延伸端114可分別置於溝槽203a及203b(或者是溝槽203c及203d)中，並在形成包覆體300後將線圈體110完全包覆於其中，僅裸露出第一延伸端112及第二延伸端114與側壁310、320實質共平面的扁平表面。於此實施例中，因為模具裝置20B具有溝槽的設計，所以容置於溝槽203a、203b 的延伸端112、114會突出包覆體側壁310、320的端面，如圖4B所示。於此階段，可應用上述的裁切步驟，裁切第一延伸端112及第二延伸端114突出於包覆體300側壁端面的部分，以使第一延伸端112及第二延伸端114之延伸長度不超過包覆體300之第一側壁310及第二側壁320之端面，而形成類似圖2E的結構。選替地，亦可應用類似第一實施例的彎折、黏貼等步驟，將第一延伸端112及第二延伸端114突出於側壁310、320端面的部分彎折成平貼相鄰側表面，如圖4C所示。之後，接續第一實施例完成包覆體後之其餘步驟，於各種態樣的包覆體表面形成上述的第一電極410及第二電極420，而完成外觀與圖1F、圖2F相同的表面黏著式電感。Furthermore, the mold apparatus of the second embodiment can also be modified to utilize the positioning of the groove-like reinforcing coil. As shown in Figures 4A-4B, in a fourth embodiment, the mold apparatus is designed with a plurality of grooves for positioning the coils in the mold assembly and for exposing the extended ends to the exterior of the cladding. As shown in FIG. 4A, the mold device 20B has the first trench 201 and the second trench 202 of the first embodiment described above, and also has a plurality of trenches 203a-203d, wherein the trenches 203a-203d are arranged in parallel. On opposite sides of the cavity 222a and in communication with the cavity 222a. That is, the extending direction of the grooves 203a-203d is parallel to the extending direction of the extended ends 112, 114 of the coil 100A of FIG. 2 for accommodating the extended ends 112, 114 of the coil 100A. Specifically, the grooves 203a and 203b are disposed on the same side of the cavity 222a and extend in the same direction, and the grooves 203c and 203d are disposed on the opposite side of the cavity 222a and extend in the same direction. In addition, the trenches 203a-203d extend along the sidewalls 222b, 222c of the cavity 222a to facilitate the extension ends 112, 114 to be received in the trenches 203a-203d in contact with the sidewalls 222b, 222c. For example, when the coil 100A is placed on the mold device 20B, a portion of the first extended end 112 and the second extended end 114 may be placed in the grooves 203a and 203b (or the grooves 203c and 203d), respectively, and formed. After the covering body 300, the coil body 110 is completely covered therein, and only the flat surface of the first extending end 112 and the second extending end 114 and the side walls 310, 320 are substantially coplanar. In this embodiment, since the mold device 20B has a groove design, it is accommodated in the grooves 203a, 203b. The extended ends 112, 114 will project the end faces of the cladding side walls 310, 320 as shown in Figure 4B. At this stage, the cutting step of the first extending end 112 and the second extending end 114 are protruded from the end surface of the side wall of the covering body 300 so that the first extending end 112 and the second extending end 114 are The extension length does not exceed the end faces of the first side wall 310 and the second side wall 320 of the covering body 300 to form a structure similar to that of FIG. 2E. Alternatively, the steps of bending, pasting, and the like of the first embodiment may be applied, and the portions of the first extending end 112 and the second extending end 114 protruding from the end faces of the side walls 310 and 320 are bent to be adjacent to the adjacent side surfaces. As shown in Figure 4C. Thereafter, following the remaining steps after the completion of the coating body in the first embodiment, the first electrode 410 and the second electrode 420 are formed on the surface of the coating body of various aspects, and the surface having the same appearance as that of FIGS. 1F and 2F is completed. Adhesive inductor.
在此需注意，因應圖4A所示之模具裝置20B之溝槽203a-203d的設計，可改變圖2A所示線圈100A的整型方式，而滿足多樣化需求。參考圖5A及5B，於第五實施例中，相較於圖2A之線圈100A，線圈100B之第一延伸端112及第二延伸端114之延伸方向C1、C2係為相反，且較佳亦平行於線圈體110直徑兩端之切線方向並為相互平行。亦即，當線圈100B放置於模具裝置20B時，部分的第一延伸端112及第二延伸端114可分別置於溝槽203a及203c(或者是溝槽203b及203d)中，並在形成包覆體300後將線圈體110完全包覆於其中，僅裸露出第一延伸端112及第二延伸端114與側壁310、320實質共平面的扁平表面。於此實施例中，因為模具裝置20B之溝槽設計，所以容置於溝槽203a、203c的延伸端112、114會朝包覆體側壁310、320的反向端面突出，如圖5C所示。如上所述，之後可接續第一實施例完成包覆體後之其餘步驟，形成外觀與圖1F、圖2F相同的表面黏著式電感。It should be noted here that, in view of the design of the grooves 203a-203d of the mold device 20B shown in FIG. 4A, the shaping manner of the coil 100A shown in FIG. 2A can be changed to meet diverse needs. Referring to FIGS. 5A and 5B, in the fifth embodiment, the extending directions C1 and C2 of the first extended end 112 and the second extended end 114 of the coil 100B are opposite, and preferably also compared to the coil 100A of FIG. 2A. Parallel to the tangential direction of both ends of the diameter of the coil body 110 and parallel to each other. That is, when the coil 100B is placed on the mold device 20B, a portion of the first extended end 112 and the second extended end 114 may be placed in the grooves 203a and 203c (or the grooves 203b and 203d), respectively, and formed into a package. After the cover 300 completely covers the coil body 110 therein, only the flat surfaces of the first extended end 112 and the second extended end 114 and the side walls 310, 320 are substantially coplanar. In this embodiment, because of the groove design of the mold device 20B, the extended ends 112, 114 of the grooves 203a, 203c protrude toward the opposite end faces of the cover walls 310, 320, as shown in FIG. 5C. . As described above, the remaining steps after the completion of the cladding of the first embodiment can be continued to form the same surface-adhesive inductor having the same appearance as that of FIGS. 1F and 2F.
再者，除了模具裝置之溝槽設計外，亦可利用載體加強線圈 於模具裝置中的支撐及定位。如圖6A及6B所示，於第六實施例中，在放置圖2A之線圈100A於模具裝置20之前，係提供載體30於模具裝置20。載體30可為預製的板狀支撐件，且可選擇性具有定位機構。舉例而言，載體30可由導磁材料預先熱壓製成平板結構或者具有定位機構的板狀結構，且載體30之尺寸及形狀較佳配合模穴222a之截面形狀。線圈100A放置於載體30上，使得線圈100A之第一延伸端112及第二延伸端114之延伸方向實質垂直於線圈體110之捲繞中心軸C且不通過線圈體110，其中第一延伸端112及第二延伸端114係實質接觸模具裝置20之側壁。在此需注意，載體30及線圈100A可依序放入模具裝置20，亦可先將線圈100A放置於載體30再一起放置於模具裝置20。當載體30具有定位機構30a時(如圖6A所示)，線圈100A較佳先藉由載體30定位，再一起放置於模具裝置20。於此實施例，載體30之定位機構30a可包含例如套接線圈體110之中柱、定位延伸端延伸方向之定位塊、或其組合。Furthermore, in addition to the groove design of the mold device, the carrier reinforcing coil can also be utilized. Support and positioning in the mold device. As shown in FIGS. 6A and 6B, in the sixth embodiment, the carrier 30 is provided to the mold device 20 before the coil 100A of FIG. 2A is placed on the mold device 20. The carrier 30 can be a prefabricated plate-like support and can optionally have a positioning mechanism. For example, the carrier 30 may be pre-heated by a magnetically permeable material into a flat structure or a plate-like structure having a positioning mechanism, and the carrier 30 is preferably sized and shaped to match the cross-sectional shape of the cavity 222a. The coil 100A is placed on the carrier 30 such that the extending direction of the first extending end 112 and the second extending end 114 of the coil 100A is substantially perpendicular to the winding central axis C of the coil body 110 and does not pass through the coil body 110, wherein the first extending end 112 and second extension end 114 are in substantial contact with the sidewall of mold device 20. It should be noted here that the carrier 30 and the coil 100A may be sequentially placed in the mold device 20, or the coil 100A may be placed on the carrier 30 and placed together in the mold device 20. When the carrier 30 has the positioning mechanism 30a (as shown in FIG. 6A), the coil 100A is preferably first positioned by the carrier 30 and placed together in the mold unit 20. In this embodiment, the positioning mechanism 30a of the carrier 30 may include, for example, a post in the socket coil body 110, a positioning block that positions the extending end, or a combination thereof.
接著，於模具裝置20中倒入導磁粉末，其中導磁粉末300a與載體30以熱壓模鑄方式形成包覆體300而將線圈100A包覆於其中，以使得線圈100A僅第一延伸端112及第二延伸端114裸露在包覆體300外並分別與包覆體300之第一側壁310及第二側壁320實質共平面。亦即，於此階段形成之結構如圖2E所示。如上所述，之後可接續第一實施例完成包覆體後之其餘步驟，形成外觀與圖1F、圖2F相同的表面黏著式電感。Next, the magnetic conductive powder is poured into the mold device 20, wherein the magnetic conductive powder 300a and the carrier 30 are formed into a covering body 300 by hot press molding to wrap the coil 100A therein so that the coil 100A has only the first extended end. The 112 and the second extended end 114 are exposed outside the covering body 300 and are substantially coplanar with the first side wall 310 and the second side wall 320 of the covering body 300, respectively. That is, the structure formed at this stage is as shown in Fig. 2E. As described above, the remaining steps after the completion of the cladding of the first embodiment can be continued to form the same surface-adhesive inductor having the same appearance as that of FIGS. 1F and 2F.
在此需注意，上述各實施例中所述模具裝置之溝槽、梯台等設計、載體的使用以及線圈延伸端之延伸方向變化，可依據需求單獨或組合地應用，以達到有效定位線圈、簡化製造程序、一體成型技術低成本製 造微型化的表面黏著式電感。此外，藉由模具裝置的設計變化，本發明上述各實施例可使用相同的模具裝置製造(如模具裝置20B)，以較低成本達到多變化的製造方法。It should be noted that the design of the groove, the ladder, and the like of the mold device in the above embodiments, the use of the carrier, and the change of the extending direction of the extended end of the coil may be applied separately or in combination according to requirements to achieve effective positioning of the coil. Simplified manufacturing process, integrated molding technology, low cost Miniaturized surface-adhesive inductors. Moreover, by the design variations of the mold apparatus, the above-described embodiments of the present invention can be manufactured using the same mold apparatus (e.g., mold apparatus 20B) to achieve a multi-variable manufacturing method at a lower cost.
本發明已由上述實施例加以描述，然而上述實施例僅為例示目的而非用於限制。熟此技藝者當知在不悖離本發明精神下，於此特別說明的實施例可有例示實施例的其他修改。因此，本發明範疇亦涵蓋此類修改且僅由所附申請專利範圍限制。The present invention has been described by the above embodiments, but the above embodiments are for illustrative purposes only and are not intended to be limiting. It will be apparent to those skilled in the art that the embodiments specifically described herein may have other modifications of the embodiments. Accordingly, the scope of the invention is intended to cover such modifications and are only limited by the scope of the appended claims.
110‧‧‧線圈體110‧‧‧ coil body
112‧‧‧第一延伸端112‧‧‧First extension
114‧‧‧第二延伸端114‧‧‧Second extension
20‧‧‧模具裝置20‧‧‧Molding device
201‧‧‧第一溝槽201‧‧‧First trench
202‧‧‧第二溝槽202‧‧‧Second trench
220‧‧‧下模220‧‧‧下模
222a‧‧‧模穴222a‧‧‧ cavity
C‧‧‧捲繞中心軸C‧‧‧Winding central axis
Claims (9)
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| CN2013103174918A CN103413664A (en) | 2013-07-19 | 2013-07-26 | Method for manufacturing surface adhesion type inductors |
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| CN2013103174918A CN103413664A (en) | 2013-07-19 | 2013-07-26 | Method for manufacturing surface adhesion type inductors |
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| TWI620211B (en) * | 2016-06-04 | 2018-04-01 | 達方電子股份有限公司 | Surface-mount inductor and manufacturing method thereof |
| CN105895307B (en) * | 2016-06-08 | 2017-12-29 | 苏州达方电子有限公司 | Surface adhesive type inductance and its manufacture method |
| CN111899970A (en) * | 2019-05-06 | 2020-11-06 | 奇力新电子股份有限公司 | Preparation method of inductor |
| JP7207368B2 (en) * | 2020-01-15 | 2023-01-18 | 株式会社村田製作所 | inductor |
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| JPH11273980A (en) * | 1998-03-19 | 1999-10-08 | Tokin Corp | Method for manufacturing inductor |
| JP2004165539A (en) * | 2002-11-15 | 2004-06-10 | Toko Inc | Inductor |
| TW200614289A (en) * | 2004-10-26 | 2006-05-01 | Wang Wan Shiun | Inductance device, the fabrication method of the same, and the mold |
| TWI287238B (en) * | 2002-08-14 | 2007-09-21 | Traben Co Ltd | Inductance element and manufacturing method and mold thereof |
| TWM326692U (en) * | 2007-07-19 | 2008-02-01 | Abc Taiwan Electronics Corp | Shielded inductor structure |
| TW201042677A (en) * | 2009-04-10 | 2010-12-01 | Toko Inc | A surface-mount inductor and a method of producing the same |
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| JP3497276B2 (en) * | 1994-07-20 | 2004-02-16 | 松下電器産業株式会社 | Inductance element and manufacturing method thereof |
| CN2615833Y (en) * | 2003-05-09 | 2004-05-12 | 川部股份有限公司 | Inductance element |
| JP4851062B2 (en) * | 2003-12-10 | 2012-01-11 | スミダコーポレーション株式会社 | Inductance element manufacturing method |
| JP4528058B2 (en) * | 2004-08-20 | 2010-08-18 | アルプス電気株式会社 | Coiled powder magnetic core |
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| JPH11273980A (en) * | 1998-03-19 | 1999-10-08 | Tokin Corp | Method for manufacturing inductor |
| TWI287238B (en) * | 2002-08-14 | 2007-09-21 | Traben Co Ltd | Inductance element and manufacturing method and mold thereof |
| JP2004165539A (en) * | 2002-11-15 | 2004-06-10 | Toko Inc | Inductor |
| TW200614289A (en) * | 2004-10-26 | 2006-05-01 | Wang Wan Shiun | Inductance device, the fabrication method of the same, and the mold |
| TWM326692U (en) * | 2007-07-19 | 2008-02-01 | Abc Taiwan Electronics Corp | Shielded inductor structure |
| TW201042677A (en) * | 2009-04-10 | 2010-12-01 | Toko Inc | A surface-mount inductor and a method of producing the same |
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