TWI486859B - Capacitive touch panel structure - Google Patents
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- TWI486859B TWI486859B TW101150824A TW101150824A TWI486859B TW I486859 B TWI486859 B TW I486859B TW 101150824 A TW101150824 A TW 101150824A TW 101150824 A TW101150824 A TW 101150824A TW I486859 B TWI486859 B TW I486859B
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- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 12
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- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 claims description 6
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 4
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- 239000011521 glass Substances 0.000 claims description 4
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- 238000004544 sputter deposition Methods 0.000 claims description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 3
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Description
本發明係有關於一種電容式觸控面板結構，尤指一種可減少導電層設置與降低製造成本之電容式觸控面板結構。 The present invention relates to a capacitive touch panel structure, and more particularly to a capacitive touch panel structure that can reduce the placement of the conductive layer and reduce the manufacturing cost.
隨著資訊技術與通訊網路的迅速發展，電子資訊產品漸漸普及於個人，相對的觸控面板也同時迅速發展，現今觸控面板依其感應原理的不同，主要區分為電阻式、電容式、電磁式以及光學式等四種，其中電容式觸碰面板結構具防塵、防火以及高解析度等特性，因而廣泛地被採用，該電容式觸控面板作用原理，主要是依據電容量變化來確認接觸點位置，利用觸控物(如手指等導體)的接近對電極間產生電容性的電性變化，而確定接觸點的座標。 With the rapid development of information technology and communication networks, electronic information products are gradually becoming popular among individuals, and the relative touch panels are also rapidly developing. Today's touch panels are mainly classified into resistive, capacitive, and electromagnetic types according to their different sensing principles. Four types of optical touch panels, such as dust-proof, fire-proof and high-resolution, are widely used. The principle of the capacitive touch panel is mainly based on the change in capacitance to confirm contact. The position of the point is determined by utilizing a capacitive electrical change between the electrodes of the touch object (such as a finger) to determine the coordinates of the contact point.
而電容式觸控面板也漸漸的成為觸控技術中的主流，並應用在各項電子資訊產品當中，例如手機、平板電腦、隨身聽、手持式電子裝置(設備)、各種顯示器、監視器等等，該等電容式觸控面板之電子資訊產品其原理為應用感應人體微弱電流所形成之電容值變化的方式來達到觸控的目的，進而測得手指之位置變化與點選狀況，與達成操控之目的。 Capacitive touch panels are gradually becoming the mainstream in touch technology and are used in various electronic information products, such as mobile phones, tablets, walkmans, handheld electronic devices (devices), various displays, monitors, etc. The electronic information products of the capacitive touch panels have the principle of sensing the change of the capacitance value formed by the weak current of the human body to achieve the purpose of the touch, thereby measuring the position change and the selection state of the finger, and achieving The purpose of manipulation.
而一般電容式的觸控面板主要應用為雙層式觸控面板，其雙層式觸控面板均係於各透明導電基板上進行多道網版印刷製程或黃光蝕刻製程有可相互對應配合之氧化銦錫(ITO)層， 該類透明導電基板之材質多為玻璃，由於透明導電基板單價高，製造時會重覆耗費較多的生產材料，當觸控面板製程中產生不良品時，必須將整個觸控面板報廢，且無法回收，進而造成成本浪費，更且各透明導電基板需分別進行有所述氧化銦錫(ITO)層，而其進行多道網版印刷製程或黃光蝕刻製程且對應時其製造步驟繁瑣與製造成本同時大幅提升。 The general capacitive touch panel is mainly used as a double-layer touch panel, and the double-layer touch panel is mounted on each transparent conductive substrate for multi-screen printing process or yellow etching process. Indium tin oxide (ITO) layer, The material of the transparent conductive substrate is mostly glass. Since the transparent conductive substrate has a high unit price, the production material is repeated and costly. When the defective product is generated in the touch panel process, the entire touch panel must be scrapped. It is impossible to recycle, which causes waste of cost. Moreover, each of the transparent conductive substrates needs to have the indium tin oxide (ITO) layer separately, and the multi-pass screen printing process or the yellow etching process is performed, and the manufacturing steps are complicated in correspondence. Manufacturing costs have also increased significantly.
此外，上述黃光微影製法不僅所需的設備昂貴，相對必定提高整體生產成本，且所用之成分及顯影液均為對人體有害之化學溶液，不但對現場之操作人員的健康造成嚴重的影響，也對環境生態造成嚴重的污染；故習知具有下列缺點：1.製造步驟繁瑣；2.製造成本高。 In addition, the above-mentioned yellow light micro-shadowing method not only requires expensive equipment, but also relatively increases the overall production cost, and the components and developing solutions used are chemical solutions harmful to the human body, which not only have a serious impact on the health of the operators on the site, but also It causes serious pollution to the environment and ecology; therefore, it has the following disadvantages: 1. The manufacturing steps are cumbersome; 2. The manufacturing cost is high.
是以，要如何解決上述習用之問題與缺失，即為本案之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.
爰此，為解決上述習知技術之缺點，本發明之主要目的係提供一種可減少導電層設置的電容式觸控面板結構。 Accordingly, in order to solve the above disadvantages of the prior art, the main object of the present invention is to provide a capacitive touch panel structure capable of reducing the arrangement of conductive layers.
本發明之另一目的係提供一種可大幅降低製造成本的電容式觸控面板結構。 Another object of the present invention is to provide a capacitive touch panel structure that can greatly reduce manufacturing costs.
為達上述目的本發明係提供一種電容式觸控面板結構，係包含：一透明基板、一導電層、一高分子透明基板及一膠體層；所述透明基板具有一第一側及一相反該第一側之第二 側；所述導電層係披覆於該第二側上；所述高分子透明基板具有一第三側及第四側，其第三側係與所述導電層相對透明基板另一側對應貼合；所述膠體層設於前述透明基板及該高分子透明基板之間，藉以令所述該透明基板與高分子透明基板相接合；透過本發明之電容式觸控面板結構的設計，俾使有效達到減少導電層設置及大幅降低製造成本的效果者。 The present invention provides a capacitive touch panel structure comprising: a transparent substrate, a conductive layer, a polymer transparent substrate, and a colloid layer; the transparent substrate has a first side and an opposite Second on the first side The conductive layer is coated on the second side; the polymer transparent substrate has a third side and a fourth side, and the third side of the conductive layer is opposite to the other side of the transparent substrate The colloid layer is disposed between the transparent substrate and the polymer transparent substrate, so that the transparent substrate and the polymer transparent substrate are bonded; and the design of the capacitive touch panel structure of the present invention is used to Effectively achieve the effect of reducing the setting of the conductive layer and greatly reducing the manufacturing cost.
本發明之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
本發明係一種電容式觸控面板結構，請參閱第1圖及第2圖所示，係顯示本發明第一較佳實施例之分解剖面示意圖及組合剖面示意圖；該電容式觸控面板結構1係包括一透明基板10、一導電層11、一高分子透明基板12及一膠體層13，其中該透明基板10之材質於該較佳實施係以玻璃做說明，但並不侷限於此，亦可選擇為聚乙烯對苯二甲酸酯(Polyethylene Terephthalate，PET)、聚碳酸酯(Poly Carbonate，PC)、聚乙烯(polyethylene，PE)、聚氯乙烯(Poly Vinyl Chloride，PVC)、聚丙烯(Poly Propylene，PP)、聚苯乙烯(Poly Styrene，PS)、聚甲基丙烯酸甲酯(Polymethylmethacrylate，PMMA)、環烯烴共聚物(cyclo olefin coplymer，COC)其中任一材質。 The present invention is a capacitive touch panel structure. Please refer to FIG. 1 and FIG. 2 for an exploded cross-sectional view and a combined cross-sectional view of a first preferred embodiment of the present invention. The capacitive touch panel structure 1 The invention comprises a transparent substrate 10, a conductive layer 11, a polymer transparent substrate 12 and a colloid layer 13. The material of the transparent substrate 10 is described by the glass in the preferred embodiment, but is not limited thereto. It can be selected from polyethylene terephthalate (PET), polycarbonate (Poly Carbonate, PC), polyethylene (PE), polyvinyl chloride (Poly Vinyl Chloride, PVC), polypropylene ( Poly Propylene, PP), Poly Styrene (PS), Polymethylmethacrylate (PMMA), or cycloolefin coplymer (COC).
另者前述透明基板10具有一第一側101及一相反該第一側之第二側102，所述導電層11係設置在該第二側102上， 且其材質係為銦錫氧化物(Indium Tin Oxide，ITO)或銻錫氧化物(Antimony Tin Oxide，ATO)或銦鋅氧化物(indium zinc oxide，IZO)薄膜；並所述導電層11於該較佳實施例係以濺鍍之方式形成在該第二側102上，但並不侷限於此，於具體實施時，亦可選擇以塗佈凝膠、電鍍或蒸鍍之方式形成在該第二側102上，合先陳明。 In addition, the transparent substrate 10 has a first side 101 and a second side 102 opposite to the first side, and the conductive layer 11 is disposed on the second side 102. And the material is an indium tin oxide (ITO) or an antimony tin Oxide (ATO) or an indium zinc oxide (IZO) film; and the conductive layer 11 is The preferred embodiment is formed on the second side 102 by sputtering, but is not limited thereto. In the specific implementation, it may be selected to be formed by coating, electroplating or vapor deposition. On the two sides 102, the first Chen Ming.
續參閱第1圖及第2圖，所述高分子透明基板12係選擇為聚乙烯對苯二甲酸酯、聚碳酸酯、聚乙烯、聚氯乙烯、聚丙烯、聚苯乙烯、聚甲基丙烯酸甲酯及環烯烴共聚物其中任一材質，本實施例係以聚乙烯對苯二甲酸酯(Polyethylene Terephthalate，PET)基板做為說明，但並不引以為限。 Referring to FIG. 1 and FIG. 2, the polymer transparent substrate 12 is selected from the group consisting of polyethylene terephthalate, polycarbonate, polyethylene, polyvinyl chloride, polypropylene, polystyrene, and polymethyl. In any of the materials of the methyl acrylate and the cyclic olefin copolymer, the polyethylene terephthalate (PET) substrate is described in the present embodiment, but is not limited thereto.
另者前述高分子透明基板12係具有一第三側121及一相反該第三側121之第四側122，該第三側121係相對該第二側102，而該膠體層13係為光學膠(Optical Clear Adhesive，OCA)或光學膠脂(Optical Clear Resin，OCR)，且其膠體層13係設置在該透明基板10及高分子透明基板12之間，亦即所述膠體層13之一側與相對的導電層11與透明基板10相黏合，其另一側則對應黏設該高分子透明基板12，藉以透過該膠體層13令該透明基板10與高分子透明基板12相接合為一體。 In addition, the polymer transparent substrate 12 has a third side 121 and a fourth side 122 opposite to the third side 121. The third side 121 is opposite to the second side 102, and the colloid layer 13 is optical. (Optical Clear Adhesive, OCA) or Optical Clear Resin (OCR), and a colloid layer 13 is disposed between the transparent substrate 10 and the polymer transparent substrate 12, that is, one of the colloid layers 13 The side and the opposite conductive layer 11 are bonded to the transparent substrate 10, and the other side is correspondingly bonded to the polymer transparent substrate 12, so that the transparent substrate 10 and the polymer transparent substrate 12 are bonded together through the colloid layer 13. .
另請參閱第3圖係為本發明電容式觸控面板結構11第二較佳實施例之組合剖面示意圖，如圖所示，所述電容式觸控面 板結構1係包括有一透明基板10、一遮蔽層103、一導電層11、一導線層104、一軟性基板105、一高分子透明基板12及一膠體層13；所述透明基板10具有一第一側101及一第二側102，且該透明基板10於中央位置處界定有一觸控區2與側邊位置處界定有一非觸控區3，其中該透明基板10之材質於該較佳實施係以玻璃做說明，但並不侷限於此，亦可選擇為聚乙烯對苯二甲酸酯(Polyethylene Terephthalate，PET)、聚碳酸酯(Poly Carbonate，PC)、聚乙烯(polyethylene，PE)、聚氯乙烯(Poly Vinyl Chloride，PVC)、聚丙烯(Poly Propylene，PP)、聚苯乙烯(Poly Styrene，PS)、聚甲基丙烯酸甲酯(Polymethylmethacrylate，PMMA)、環烯烴共聚物(cyclo olefin coplymer，COC)其中任一材質。 3 is a schematic cross-sectional view of a second preferred embodiment of the capacitive touch panel structure 11 of the present invention. As shown, the capacitive touch surface is shown. The board structure 1 includes a transparent substrate 10, a shielding layer 103, a conductive layer 11, a wire layer 104, a flexible substrate 105, a polymer transparent substrate 12, and a colloid layer 13; the transparent substrate 10 has a first The transparent substrate 10 defines a touch area 2 at a central location and a non-touch area 3 defined at a central position. The material of the transparent substrate 10 is preferably implemented. The description is made of glass, but it is not limited thereto, and may be selected from polyethylene terephthalate (PET), polycarbonate (Poly Carbonate, PC), polyethylene (PE), Poly Vinyl Chloride (PVC), Polypropylene (PP), Poly Styrene (PS), Polymethylmethacrylate (PMMA), cycloolefin copolymer (cyclo olefin coplymer) , COC) Any material.
而該遮蔽層103係設置於所述透明基板10之第二側102且相對設置於其非觸控區3位置處，而該透明基板10之上披覆有所述遮蔽層103之區域界定為所述非觸控區3，反之，該透明基板10之上未披覆有所述遮蔽層103之區域界定為所述觸控區2，而本實施例的遮蔽層103可例如是採用不透明(透光)且絕緣的材料印刷或塗佈而成。 The shielding layer 103 is disposed on the second side 102 of the transparent substrate 10 and disposed opposite to the non-touch area 3 thereof, and the area of the transparent substrate 10 over which the shielding layer 103 is coated is defined as The non-touch area 3, on the other hand, the area of the transparent substrate 10 that is not covered with the shielding layer 103 is defined as the touch area 2, and the shielding layer 103 of the embodiment may be opaque, for example. Light-transmitting and insulating materials are printed or coated.
而該導電層11係披覆於所述透明基板10之第二側102位置處且相對設置於其觸控區2位置處，而部分之導電層11由第二側102位置處延伸至所述遮蔽層103相對該透明基板10 另一側位置處，且其材質係為銦錫氧化物(Indium Tin Oxide，ITO)或銻錫氧化物(Antimony Tin Oxide，ATO)或銦鋅氧化物(indium zinc oxide，IZO)薄膜；並所述導電層11於該較佳實施例係以濺鍍之方式形成在該第二側102上，但並不侷限於此，於具體實施時，亦可選擇以塗佈凝膠、電鍍或蒸鍍之方式形成在該第二側102上，合先陳明。 The conductive layer 11 is disposed at a position of the second side 102 of the transparent substrate 10 and oppositely disposed at a position of the touch area 2 thereof, and a portion of the conductive layer 11 is extended from the second side 102 to the The shielding layer 103 is opposite to the transparent substrate 10 The other side of the material is made of Indium Tin Oxide (ITO) or Antimony Tin Oxide (ATO) or Indium Zinc Oxide (IZO) film; The conductive layer 11 is formed on the second side 102 by sputtering in the preferred embodiment, but is not limited thereto. In specific implementation, it may also be selected to apply gel, electroplating or evaporation. The manner is formed on the second side 102, which is first and foremost.
而該導線層104係設置於所述非觸控區3且相對設置於所述遮蔽層103相反該第二側102之一側，而部分之導線層104同時延伸至所述導電層11相對該遮蔽層103另一側位置處且與所述導電層11電性連接，且該導線層104可為銀漿或銅或鉬等金屬材質構成。 The wire layer 104 is disposed on the non-touch area 3 and opposite to the side of the second side 102 opposite to the shielding layer 103, and a portion of the wire layer 104 extends to the conductive layer 11 at the same time. The other side of the shielding layer 103 is electrically connected to the conductive layer 11 , and the wire layer 104 can be made of a silver paste or a metal material such as copper or molybdenum.
而該軟性基板105係設置於所述非觸控區3，且該軟性基板105與導線層104間具有一導電膠106，該導電膠106一側貼附有所述軟性基板105，另一側貼附有所述導線層104，而該導電膠106係為異方性導電膜(Anisotropic Conductive Film，ACF)或異方向性導電膠(Anisotropic conductive paste，ACP)。 The flexible substrate 105 is disposed on the non-touch area 3, and a conductive adhesive 106 is disposed between the flexible substrate 105 and the wire layer 104. The flexible substrate 105 is attached to one side of the conductive adhesive 106, and the other side is attached. The conductive layer 106 is attached to the conductive layer 106, and the conductive paste 106 is an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP).
而該高分子透明基板12具有一第三側121及一第四側122，所述第三側121與前述導電層11相對透明基板10另一側對應貼合，其中該高分子透明基板12係選擇為聚乙烯對苯二甲酸酯、聚碳酸酯、聚乙烯、聚氯乙烯、聚丙烯、聚苯乙烯、聚甲基丙烯酸甲酯及環烯烴共聚物其中任一材質，本實施例係 以聚乙烯對苯二甲酸酯(Polyethylene Terephthalate，PET)基板做為說明，但並不引以為限。 The polymer transparent substrate 12 has a third side 121 and a fourth side 122. The third side 121 and the conductive layer 11 are correspondingly bonded to the other side of the transparent substrate 10, wherein the polymer transparent substrate 12 is attached. The material is selected from any of polyethylene terephthalate, polycarbonate, polyethylene, polyvinyl chloride, polypropylene, polystyrene, polymethyl methacrylate and cyclic olefin copolymer. A polyethylene terephthalate (PET) substrate is described, but is not limited.
而該膠體層13係為光學膠(Optical Clear Adhesive，OCA)或光學膠脂(Optical Clear Resin，OCR)，且其膠體層13係設置於前述透明基板10及該高分子透明基板12之間，亦即所述膠體層13一側貼附所述高分子透明基板12，而另一側相對貼附所述軟性基板105及導電層11及導線層104，藉以透過該膠體層13令該透明基板10與高分子透明基板12相接合為一體。 The colloid layer 13 is an Optical Clear Adhesive (OCA) or an Optical Clear Resin (OCR), and the colloid layer 13 is disposed between the transparent substrate 10 and the polymer transparent substrate 12, That is, the polymer transparent substrate 12 is attached to the side of the colloid layer 13 , and the flexible substrate 105 and the conductive layer 11 and the wiring layer 104 are relatively attached to the other side, so that the transparent substrate is transmitted through the colloid layer 13 . 10 is integrally joined to the polymer transparent substrate 12.
故本發明之電容式觸控面板結構1設計係可以單一導電層11進行偵測與完成觸控之目的，進而達到可減少導電層11設置與降低製造成本的效果者。 Therefore, the capacitive touch panel structure 1 of the present invention can be designed to detect and complete the touch by the single conductive layer 11, thereby achieving the effect of reducing the setting of the conductive layer 11 and reducing the manufacturing cost.
以上所述，本發明相較於習知具有下列之優點：1.可減少導電層設置；2.降低製造成本；3.提高生產速率。 As described above, the present invention has the following advantages over conventional ones: 1. It can reduce the setting of the conductive layer; 2. Reduce the manufacturing cost; 3. Increase the production rate.
按，以上所述，僅為本發明的較佳具體實施例，惟本發明的特徵並不侷限於此，任何熟悉該項技藝者在本發明領域內，可輕易思及的變化或修飾，皆應涵蓋在以下本發明的申請專利範圍中。 The above description is only a preferred embodiment of the present invention, but the features of the present invention are not limited thereto, and any changes or modifications that can be easily conceived in the field of the present invention are known to those skilled in the art. It is intended to be included in the scope of the claims of the present invention below.
1‧‧‧電容式觸控面板結構 1‧‧‧Capacitive touch panel structure
11‧‧‧導電層 11‧‧‧ Conductive layer
10‧‧‧透明基板 10‧‧‧Transparent substrate
12‧‧‧高分子透明基板 12‧‧‧ polymer transparent substrate
101‧‧‧第一側 101‧‧‧ first side
121‧‧‧第三側 121‧‧‧ third side
102‧‧‧第二側 102‧‧‧ second side
122‧‧‧第四側 122‧‧‧ fourth side
103‧‧‧遮蔽層 103‧‧‧shading layer
13‧‧‧膠體層 13‧‧‧colloid layer
104‧‧‧導線層 104‧‧‧Wire layer
2‧‧‧觸控區 2‧‧‧ touch area
105‧‧‧軟性基板 105‧‧‧Soft substrate
3‧‧‧非觸控區 3‧‧‧ non-touch area
106‧‧‧導電膠 106‧‧‧conductive adhesive
第1圖係本發明之第一較佳實施例之分解剖面示意圖；第2圖係本發明之第一較佳實施例之組合剖面示意圖；第3圖係本發明之第二較佳實施例之組合剖面示意圖。 1 is a schematic cross-sectional view showing a first preferred embodiment of the present invention; FIG. 2 is a schematic cross-sectional view showing a first preferred embodiment of the present invention; and FIG. 3 is a second preferred embodiment of the present invention. A schematic cross-sectional view.
1‧‧‧電容式觸控面板結構 1‧‧‧Capacitive touch panel structure
10‧‧‧透明基板 10‧‧‧Transparent substrate
101‧‧‧第一側 101‧‧‧ first side
102‧‧‧第二側 102‧‧‧ second side
11‧‧‧導電層 11‧‧‧ Conductive layer
12‧‧‧高分子透明基板 12‧‧‧ polymer transparent substrate
121‧‧‧第三側 121‧‧‧ third side
122‧‧‧第四側 122‧‧‧ fourth side
13‧‧‧膠體層 13‧‧‧colloid layer
Claims (6)
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| TW101150824A TWI486859B (en) | 2012-05-29 | 2012-12-28 | Capacitive touch panel structure |
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| TW101150824A TWI486859B (en) | 2012-05-29 | 2012-12-28 | Capacitive touch panel structure |
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| KR102087193B1 (en) * | 2013-09-09 | 2020-04-16 | 삼성디스플레이 주식회사 | Method for manufacturing organic light emitting diode display and method for manufacturing touch panel |
| TWI587189B (en) * | 2015-07-17 | 2017-06-11 | 林志忠 | Touch panel with pressure sensing function |
| TWI567606B (en) * | 2015-07-17 | 2017-01-21 | 林志忠 | Touch display device |
| US9786248B2 (en) | 2015-08-07 | 2017-10-10 | Chih-Chung Lin | Touch display device with pressure sensor |
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|---|---|---|---|---|
| US20070132737A1 (en) * | 2005-12-09 | 2007-06-14 | Mulligan Roger C | Systems and methods for determining touch location |
| TW201120712A (en) * | 2009-12-09 | 2011-06-16 | J Touch Corp | Capacitive touch device structure. |
| TWM416814U (en) * | 2011-05-05 | 2011-11-21 | Mastouch Optoelectronics Technologies Co Ltd | Touch panel and touch control electronic device with photoelectric conversion capability |
| TWI364579B (en) * | 2010-05-11 | 2012-05-21 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070132737A1 (en) * | 2005-12-09 | 2007-06-14 | Mulligan Roger C | Systems and methods for determining touch location |
| TW201120712A (en) * | 2009-12-09 | 2011-06-16 | J Touch Corp | Capacitive touch device structure. |
| TWI364579B (en) * | 2010-05-11 | 2012-05-21 | ||
| TWM416814U (en) * | 2011-05-05 | 2011-11-21 | Mastouch Optoelectronics Technologies Co Ltd | Touch panel and touch control electronic device with photoelectric conversion capability |
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