TWI485214B - And a photohardenable resin composition for bonding an optical functional material - Google Patents
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
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- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
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- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
Description
本發明係關於一種含有骨架上具有聚異戊二烯、聚丁二烯或聚氨酯之(甲基)丙烯酸酯低聚物及柔軟化成分之觸控面板接著用光硬化型接著組成物;一種含有前述(甲基)丙烯酸酯低聚物、柔軟化成分及特定之(甲基)丙烯酸酯單體或硫醇化合物,且該硬化物具有特定之彈性率及斷裂時之伸長之光硬化型接著組成物;以及,以其等進行貼合之觸控面板或顯示面板。The present invention relates to a touch panel comprising a (meth) acrylate oligomer having a polyisoprene, polybutadiene or polyurethane on a skeleton and a softening component, followed by a photocurable type of subsequent composition; The (meth) acrylate oligomer, the softening component, and the specific (meth) acrylate monomer or thiol compound, and the cured product has a specific elastic modulus and an elongation at break. And a touch panel or display panel that is attached to it.
為在LCD等之顯示體上搭載觸控面板,可採用電阻膜式、靜電容量式、電磁誘導式、光學式等。在此等之觸控面板上,可能須貼合用以使外觀之設計性更佳之裝飾板,或貼合可指定觸控位置之圖示片(Icon sheet)。此外,靜電容量式觸控面板,係於透明基板之上形成透明電極,並於其上具有貼合了透明板之構造者。In order to mount a touch panel on a display body such as an LCD, a resistive film type, an electrostatic capacity type, an electromagnetic induction type, an optical type, or the like can be used. On such touch panels, it may be necessary to fit a decorative panel to make the design of the appearance better, or to fit an Icon sheet that can specify a touch position. Further, the capacitive touch panel is formed by forming a transparent electrode on a transparent substrate and having a structure in which a transparent plate is bonded thereto.
傳統上,上述裝飾板與觸控面板之貼合,圖示片(icon sheet)與觸控面板之貼合,以及靜電容量式觸控面板上形成透明電極之透明基板與透明板之貼合,係以使用薄片狀之雙面黏著薄片而進行,或於被著體之單面上以黏著加工而進行者。在使用此種此種黏著材料之技術中,則有接著不完全,或在貼合面上有氣泡混入之問題產生。其中,尤以在貼合面上進行印刷加工時,在有印刷部分即無印刷部分所造成之高低差部分容易有氣泡殘留之問題。Conventionally, the decorative board and the touch panel are bonded together, the icon sheet is attached to the touch panel, and the transparent substrate and the transparent plate are formed on the electrostatic capacitance type touch panel. It is carried out by using a flaky double-sided adhesive sheet or by adhering to one side of the object. In the technique of using such an adhesive material, there is a problem that the film is incomplete or there is a problem that air bubbles are mixed in the bonding surface. Among them, in particular, when printing is performed on the bonding surface, there is a problem that air bubbles are likely to remain in the difference portion between the printed portion and the non-printing portion.
此外,近年來,LCD等之顯示體之玻璃已變薄,而玻璃一變薄則因為外部應力就容易有LCD變形之問題產生。如將此種薄玻璃之LCD等之顯示體,以及丙烯板或聚碳酸酯板等之光學機能材料加以貼合時,因為玻璃與丙烯等之線膨脹之不同,或者丙烯板與聚碳酸酯等之塑膠成型材料在成型時之變形,將導致在耐熱試驗或耐濕試驗中發生成形變形之緩和或吸濕/乾燥產生,而有尺寸變化或彎曲等之面精度變化之情形。在傳統之接著劑(例如專利文獻1)中為抑制此種變形起見,會有接著面剝落,LCD破裂,或LCD顯示斑產生等問題點。Further, in recent years, the glass of the display body of LCD or the like has been thinned, and when the glass is thinned, the problem of deformation of the LCD is liable to occur due to external stress. When a display body such as a thin glass LCD or an optical functional material such as an acrylic plate or a polycarbonate plate is bonded, the glass expands differently from propylene or the like, or an acrylic plate or a polycarbonate or the like. The deformation of the plastic molding material during molding causes a relaxation of the molding deformation or moisture absorption/drying in the heat resistance test or the moisture resistance test, and there is a case where the dimensional accuracy such as dimensional change or bending changes. In the conventional adhesive (for example, Patent Document 1), in order to suppress such deformation, there are problems such as peeling of the surface, cracking of the LCD, or occurrence of spots on the LCD.
專利文獻1:特開2004-77887號公報Patent Document 1: JP-A-2004-77887
因此,本發明之課題,係提供一種接著組成物,其特徵在於能解決:在觸控面板上將裝飾板與圖示片加以貼合時,或將靜電容量式觸控面板上形成透明電極之透明基板與透明板加以貼合時,賦予充分之接著性且不含氣泡而進行貼合有困難之先前技術的問題點,或者,在顯示體與光學機能材料進行貼合時,所產生之接著面剝落,顯示體之玻璃破裂等,傳統技術之問題點。Therefore, the subject of the present invention is to provide a follow-up composition, which is characterized in that, when the decorative panel is attached to the graphic sheet on the touch panel, or the transparent electrode is formed on the electrostatic capacitance type touch panel. When the transparent substrate and the transparent plate are bonded together, there is a problem in the prior art that provides sufficient adhesion and does not contain bubbles, and it is difficult to bond them, or when the display body and the optical functional material are bonded together, Surface peeling, showing the glass breakage of the body, etc., the problem of the conventional technology.
本發明者們,發現了:在光硬化型接著組成物中,藉由使其含有骨架上具有聚異戊二烯、聚丁二烯或聚氨酯之(甲基)丙烯酸酯低聚物及柔軟化成分,或者,在前述之(甲基)丙烯酸酯低聚物及柔軟化成分之外,再使其含有特定之(甲基)丙烯酸酯單體或硫醇化合物,且將該硬化物之彈性率及斷裂時之伸長控制在特定範圍內時,可達成上述課題,從而完成了本發明。The present inventors have found that a photocurable secondary composition is provided with a (meth) acrylate oligomer having polyisoprene, polybutadiene or polyurethane on a skeleton and softened. a component, or a specific (meth) acrylate monomer or a thiol compound, in addition to the aforementioned (meth) acrylate oligomer and a softening component, and the modulus of elasticity of the cured product When the elongation at the time of the fracture is controlled within a specific range, the above problems can be attained, and the present invention has been completed.
本發明之第一發明,係一種觸控面板接著用光硬化型接著組成物,其特徵為含有(A)骨架上具有聚異戊二烯、聚丁二烯或聚氨酯之(甲基)丙烯酸酯低聚物及(B)柔軟化成分。A first invention of the present invention is a touch panel which is followed by a photocurable type subsequent composition characterized by containing (A) a (meth) acrylate having polyisoprene, polybutadiene or polyurethane on the skeleton. Oligomer and (B) softening component.
進一步,本發明係一種貼合體,其特徵係藉由上述之觸控面板接著用光硬化型接著組成物進行貼合後,所成之靜電容量式觸控面板中之透明電極形成之透明基板與透明板之貼合體或者觸控面板與薄片或板之貼合體。Further, the present invention is a bonding body characterized in that the transparent substrate formed by the transparent electrode in the electrostatic capacitance type touch panel is formed by bonding the above-mentioned touch panel and then using the photo-curing type subsequent composition. A laminate of a transparent plate or a laminate of a touch panel and a sheet or a plate.
本發明之第二發明,係一種光硬化型樹脂組成物,其特徵為其係含有:(A)骨架上具有聚異戊二烯、聚丁二烯或聚氨酯之(甲基)丙烯酸酯低聚物、(B)柔軟化成分、以及(C1)選自苯氧基乙基(甲基)丙烯酸酯、苯氧基聚乙二醇(甲基)丙烯酸酯、2-羥基-3-苯氧基丙基(甲基)丙烯酸酯、環己基(甲基)丙烯酸酯、壬基苯酚EO加成物(甲基)丙烯酸酯、甲氧基三乙二醇(甲基)丙烯酸酯及四氫糠基(甲基)丙烯酸酯之(甲基)丙烯酸酯單體,且係用以將顯示體及光學機能材料進行貼合之光硬化型接著組成物;該硬化物之彈性率係未達12kPa,且硬化物在斷裂時之伸長係300%以上者。A second invention of the present invention is a photocurable resin composition characterized by: (A) (meth) acrylate oligomerization having polyisoprene, polybutadiene or polyurethane on a skeleton And (B) a softening component, and (C1) is selected from the group consisting of phenoxyethyl (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, 2-hydroxy-3-phenoxy Propyl (meth) acrylate, cyclohexyl (meth) acrylate, nonyl phenol EO adduct (meth) acrylate, methoxy triethylene glycol (meth) acrylate and tetrahydroindenyl a (meth) acrylate (meth) acrylate monomer, which is a photocurable type subsequent composition for bonding a display body and an optical functional material; the elastic modulus of the cured product is less than 12 kPa, and The elongation of the cured product at break is more than 300%.
本發明之第三發明,係一種光硬化型樹脂組成物,其特徵係含有:(A)骨架上具有聚異戊二烯、聚丁二烯或聚氨酯之(甲基)丙烯酸酯低聚物、(B)柔軟化成分、以及(C2)硫醇化合物,且係用以將顯示體及光學機能材料進行貼合之光硬化型樹脂組成物;該硬化物之彈性率係未達10kPa,且硬化物在斷裂時之伸長係300%以上者。硬化物之彈性率,其較佳係1kPa以上;而硬化物在斷裂時之伸長,其較佳係1000%以下者。A third invention of the present invention is a photocurable resin composition characterized by: (A) a (meth) acrylate oligomer having polyisoprene, polybutadiene or polyurethane on a skeleton, (B) a softening component and a (C2) thiol compound, and is a photocurable resin composition for bonding a display body and an optical functional material; the elastic modulus of the cured product is less than 10 kPa, and is hardened. The elongation of the material at break is more than 300%. The modulus of elasticity of the cured product is preferably 1 kPa or more; and the elongation of the cured product at the time of fracture is preferably 1000% or less.
進一步,本發明係一種顯示面板,其特徵係含有以上述之第二或第三之光硬化型樹脂組成物加以貼合之顯示體及光學機能材料者。Furthermore, the present invention is a display panel comprising a display body and an optical functional material bonded together with the second or third photocurable resin composition described above.
藉由本發明之第一發明,可於觸控面板上貼合裝飾板或圖示片時,或於靜電容量式觸控面板上形成透明電極之透明基板與透明板加以貼合時,具有充分之接著力,且不含氣泡而進行貼合。According to the first invention of the present invention, when the decorative board or the graphic sheet is attached to the touch panel, or the transparent substrate and the transparent board which form the transparent electrode on the electrostatic capacitance type touch panel are bonded together, it is sufficient. Then, the force is applied without a bubble.
藉由本發明之第二及第三發明,可在將顯示體及光學機能材料加以貼合時,其接著面不會剝落,且顯示體之玻璃不會破裂。According to the second and third inventions of the present invention, when the display body and the optical functional material are bonded together, the adhesion surface thereof does not peel off, and the glass of the display body does not break.
本發明之第一發明,係一種觸控面板接著用光硬化型接著組成物,其特徵為含有(A)骨架上具有聚異戊二烯、聚丁二烯或聚氨酯之(甲基)丙烯酸酯低聚物及(B)柔軟化成分。A first invention of the present invention is a touch panel which is followed by a photocurable type subsequent composition characterized by containing (A) a (meth) acrylate having polyisoprene, polybutadiene or polyurethane on the skeleton. Oligomer and (B) softening component.
本發明之成分(A),係骨架上具有聚異戊二烯、聚丁二烯或聚氨酯之(甲基)丙烯酸酯低聚物。此等之(甲基)丙烯酸酯低聚物,可使用1種或2種以上者。The component (A) of the present invention is a (meth) acrylate oligomer having polyisoprene, polybutadiene or polyurethane on the skeleton. One type or two or more types of these (meth) acrylate oligomers can be used.
骨架上具有聚異戊二烯之(甲基)丙烯酸酯低聚物,亦稱為(甲基)丙烯基變性聚異戊二烯,其較佳為具有1000~100000,最佳為具有100000~50000之分子量。市售品,例如有Kuraray公司製之「UC-1」(分子量25000)。a (meth) acrylate oligomer having a polyisoprene on the skeleton, which is also called a (meth) propylene-based denatured polyisoprene, preferably having from 1,000 to 100,000, and most preferably having 100,000 ~ Molecular weight of 50000. Commercially available products include "UC-1" (molecular weight: 25,000) manufactured by Kuraray Co., Ltd.
骨架上具有聚丁二烯之(甲基)丙烯酸酯低聚物,亦稱為(甲基)丙烯基變性聚丁二烯,其較佳為具有500~100000,最佳為具有1000~30000之分子量。市售品,例如有日本石油公司製之「TE2000」(分子量2000)。a (meth) acrylate oligomer having a polybutadiene on the skeleton, also referred to as a (meth) propylene-based denatured polybutadiene, preferably having from 500 to 100,000, most preferably from 1,000 to 30,000. Molecular weight. Commercially available products are, for example, "TE2000" (molecular weight 2000) manufactured by Nippon Oil Corporation.
骨架上具有聚氨酯之(甲基)丙烯酸酯低聚物,亦稱為(甲基)丙烯基變性聚氨酯,其較佳為具有1000~100000,最佳為具有10000~50000之分子量。市售品,例如有Light Chemical公司製之「UA-1」。The (meth) acrylate oligomer having a polyurethane on the skeleton, which is also called a (meth) propylene-based denatured polyurethane, preferably has a molecular weight of from 1,000 to 100,000, and most preferably from 10,000 to 50,000. Commercially available products include "UA-1" manufactured by Light Chemical Co., Ltd.
成分(A)之(甲基)丙烯酸酯低聚物,係骨架上具有聚異戊二烯之(甲基)丙烯酸酯低聚物為最佳。The (meth) acrylate oligomer of the component (A) is preferably a (meth) acrylate oligomer having a polyisoprene skeleton.
本發明之成分(B),係柔軟化成分。柔軟化成分,例如有可與成分(A)相溶之聚合物、低聚物、苯二酸酯類、蓖麻油類等。低聚物或聚合物,例如有聚異戊二烯系、聚丁二烯系或二甲苯系之低聚物或聚合物。此等柔軟成分,係Kuraray以LIR系列、Degussa公司以Polyoil系列販售。此等之柔軟化成分,可使用1種或2種以上者。The component (B) of the present invention is a softening component. The softening component may, for example, be a polymer, an oligomer, a phthalate or a castor oil which is compatible with the component (A). The oligomer or polymer is, for example, a polyisoprene-based, polybutadiene-based or xylene-based oligomer or polymer. These soft ingredients are sold by Kuraray in the LIR series and Degussa in the Polyoil series. These softening components can be used alone or in combination of two or more.
在本發明之觸控面板接著用光硬化型接著組成物中,相對於成分(A) 100質量份,成分(B),其較佳係10~400質量份,更佳係50~300質量份,最佳係100~300質量份者。In the touch panel of the present invention, the photocurable composition is further used, and the component (B) is preferably 10 to 400 parts by mass, more preferably 50 to 300 parts by mass, per 100 parts by mass of the component (A). The best system is 100 to 300 parts by mass.
本發明之觸控面板接著用光硬化型接著組成物,進一步,較佳係含有(C)特定之(甲基)丙烯酸酯單體(C1)或硫醇化合物(C2)。The touch panel of the present invention is followed by a photocurable type of subsequent composition, and further preferably contains (C) a specific (meth) acrylate monomer (C1) or a thiol compound (C2).
特定之(甲基)丙烯酸酯單體(C1),可為選自:苯氧基乙基(甲基)丙烯酸酯(PO)、苯氧基聚乙二醇(甲基)丙烯酸酯、2-羥基-3-苯氧基丙基(甲基)丙烯酸酯、環己基(甲基)丙烯酸酯(CH)、壬基苯酚EO加成物(甲基)丙烯酸酯、甲氧基三乙二醇(甲基)丙烯酸酯及四氫糠基(甲基)丙烯酸酯。此等之(甲基)丙烯酸酯單體,可使用1種或2種以上者。成分(C1),係用以賦予硬化物能伸長之成分。The specific (meth) acrylate monomer (C1) may be selected from the group consisting of: phenoxyethyl (meth) acrylate (PO), phenoxy polyethylene glycol (meth) acrylate, 2- Hydroxy-3-phenoxypropyl (meth) acrylate, cyclohexyl (meth) acrylate (CH), nonyl phenol EO adduct (meth) acrylate, methoxy triethylene glycol ( Methyl) acrylate and tetrahydrofurfuryl (meth) acrylate. One type or two or more types of these (meth) acrylate monomers can be used. The component (C1) is a component for imparting elongation to the cured product.
本發明之成分(C2),係硫醇化合物。硫醇化合物,例如有巰基丙酸十三烷基酯、巰基丙酸甲氧基丁酯、巰基丙酸辛酯、三羥甲基丙烷三硫丙酸酯、季戊四醇四硫丙酸酯、二季戊四醇六(3-巰基丙酸酯)、三[(3-巰基丙醯氧基)-乙基]三聚異氰酸酯及3-巰基丁酸酯衍生物等。此等之硫醇化合物,可使用1種或2種以上者。The component (C2) of the present invention is a thiol compound. Thiol compounds, for example, tridecyl mercaptopropionate, methoxybutyl mercaptopropionate, octyl mercaptopropionate, trimethylolpropane trithiopropionate, pentaerythritol tetrathiopropionate, dipentaerythritol (3-mercaptopropionate), tris[(3-mercaptopropoxy)-ethyl]trimeric isocyanate, 3-mercaptobutyrate derivative, and the like. These thiol compounds can be used alone or in combination of two or more.
成分(C2),其較佳係3-巰基丁酸酯衍生物,舉例而言,有1,4-雙(3-巰基丁醯基氧基)丁烷、1,3,5-三(3-巰基丁基氧基乙基)-1,3,5-三嗪-2,4,6-(1H,3H,5H)-三酮、季戊四醇四(3-巰基丁酸酯)、三羥甲基丙烷三(3-巰基丙酸酯)等。此等之硫醇化合物,可由昭和電工,購得商品名稱為Karenz MT BD1、Karenz MT PE1、Karenz MT NR1,或可由堺化學社購得商品名稱為TMMP者。Component (C2), which is preferably a 3-mercaptobutyrate derivative, for example, 1,4-bis(3-mercaptobutyloxy)butane, 1,3,5-tris(3-fluorenyl) Butyloxyethyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione, pentaerythritol tetrakis(3-mercaptobutyrate), trimethylolpropane Tris(3-mercaptopropionate) and the like. These thiol compounds are commercially available from Showa Denko under the trade names Karenz MT BD1, Karenz MT PE1, Karenz MT NR1, or may be commercially available from 堺Chemical Co., Ltd. under the trade name TMMP.
在本發明之觸控面板接著用光硬化型接著組成物中,相對於成分(A) 100質量份,成分(C1),其較佳係1~100質量份,最佳係5~50質量份。此外,成分(C2),相對於成分(A) 100質量份,其較佳係0.05~100質量份,最佳係0.1~10質量份。In the touch panel of the present invention, the photocurable composition is further used, and the component (C1) is preferably 1 to 100 parts by mass, preferably 5 to 50 parts by mass, based on 100 parts by mass of the component (A). . Further, the component (C2) is preferably 0.05 to 100 parts by mass, more preferably 0.1 to 10 parts by mass, per 100 parts by mass of the component (A).
本發明之觸控面板接著用光硬化型接著組成物,如在成分之相溶性惡劣或其黏度高而作業性惡劣時,可在含有反應稀釋劑,例如成分(C1)以外之一般性(甲基)丙烯酸酯單體。一般性(甲基)丙烯酸酯單體,例如有2-乙基己基(甲基)丙烯酸酯、n-丁基(甲基)丙烯酸酯、i-丁基(甲基)丙烯酸酯、t-丁基(甲基)丙烯酸酯、月桂基(甲基)丙烯酸酯、烷基(甲基)丙烯酸酯、甲氧基乙基(甲基)丙烯酸酯、2-羥基乙基(甲基)丙烯酸酯、2-羥基丙基(甲基)丙烯酸酯、2-羥基丁基(甲基)丙烯酸酯、苄基(甲基)丙烯酸酯、苯基(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、羥基乙基(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、二環戊烯基氧基乙基(甲基)丙烯酸酯、原菠烯(甲基)丙烯酸酯。此等之(甲基)丙烯酸酯,可使用1種或2種以上者。The touch panel of the present invention is followed by a photocurable type of subsequent composition, such as when the compatibility of the components is poor or the viscosity is high and the workability is poor, and the general content (A) other than the component (C1) may be contained. Base) acrylate monomer. General (meth) acrylate monomers, for example, 2-ethylhexyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, t-butyl Base (meth) acrylate, lauryl (meth) acrylate, alkyl (meth) acrylate, methoxy ethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, ethylene glycol di(methyl) Acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, hydroxyethyl (meth)acrylate, 1,3-butanediol di(meth)acrylic acid Ester, 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, dicyclopentenyloxy Ethyl ethyl (meth) acrylate, raw spinel (meth) acrylate. One type or two or more types of these (meth) acrylates can be used.
本發明之觸控面板接著用光硬化型接著組成物,可進一步含有光開始劑。光開始劑,可使用一般的開始劑,例如1-[4-(2-羥基乙氧基)苯基]-2-羥基-2-甲基-1-丙烷-1-酮、1-羥基-環己基-苯基-酮、二苯甲酮、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、2,4,6-三甲基苯甲醯基二苯基膦氧化物、2,4,6-三甲基苯甲醯基苯基乙氧基膦氧化物、2-苄基-2-二甲基胺基-1-(4-嗎啉代苯基)丁酮-1、2-羥基-2-甲基-1-苯基-丙烷-1-酮、2-甲基-1-[4-甲基硫代]苯基]-2-嗎啉代丙烷-1-酮、苯偶因甲醚、苯偶因***、苯偶因異丁醚、苯偶因異丙醚、雙(2,4,6-三甲基苯甲醯基)苯基膦氧化物、2-羥基-2-甲基-[4-(1-甲基乙烯基)苯基]丙醇低聚物、2-羥基-2-甲基-[4-(1-甲基乙烯基)苯基]丙醇低聚物、2-羥基-2-甲基-1-苯基-1-丙酮、異丙基噻噸酮、o-苯甲醯基苯甲酸甲酯、[4-(甲基苯基硫代)苯基]苯基甲烷、2,4-二乙基噻噸酮、2-氯噻噸酮、二苯甲酮、乙基蒽醌、二苯甲酮銨鹽、噻噸酮銨鹽、雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基-戊基膦氧化物、雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基-戊基膦氧化物、2,4,6-三甲基二苯甲酮、4-甲基二苯甲酮、4,4'-雙二乙基胺二苯甲酮、1,4-二苯甲醯基苯、10-丁基-2-氯吖啶酮、2,2'-雙(o-氯苯基)-4,5,4',5'-四(3,4,5-三甲氧基苯基)1,2'-雙咪唑、2,2'-雙(o-氯苯基)-4,5,4',5'-四苯基-1,2'-雙咪唑、2-苯甲醯基萘、4-苯甲醯基聯苯、4-苯甲醯基二苯基醚、丙烯基化二苯甲酮、雙(η5-2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1H-吡咯-1-基)-苯基)鈦、o-甲基苯甲醯基苯甲酸酯、p-二甲基胺基苯甲酸乙酯、p-二甲基胺基苯甲酸異戊基乙酯、活性三級胺、咔唑‧苯酚系光聚合開始劑、吖啶系光聚合開始劑、三嗪系光聚合開始劑、苯甲醯基系光聚合開始劑等。此等之光開始劑,可使用其1種或2種以上。光開始劑之量,相對於成分(A)100質量份,係0.1~10質量份。The touch panel of the present invention is followed by a photocurable subsequent composition, which may further contain a photoinitiator. As the photoinitiator, a general starting agent such as 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 1-hydroxy- can be used. Cyclohexyl-phenyl-ketone, benzophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2,4,6-trimethylbenzylidene Phenylphosphine oxide, 2,4,6-trimethylbenzimidylphenylethoxyphosphine oxide, 2-benzyl-2-dimethylamino-1-(4-morpholinobenzene Butanone-1, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 2-methyl-1-[4-methylthio]phenyl]-2-morpholine Propane-1-one, benzoin methyl ether, benzoin ether, benzoin isobutyl ether, benzoin isopropyl ether, bis(2,4,6-trimethylbenzylidene)phenyl Phosphonium oxide, 2-hydroxy-2-methyl-[4-(1-methylvinyl)phenyl]propanol oligomer, 2-hydroxy-2-methyl-[4-(1-methyl) Vinyl)phenyl]propanol oligomer, 2-hydroxy-2-methyl-1-phenyl-1-propanone, isopropylthioxanthone, methyl o-benzoylbenzoate, [4 -(methylphenylthio)phenyl]phenylmethane, 2,4-diethylthioxanthone, 2-chlorothioxanthone, benzophenone, ethyl hydrazine, benzophenone ammonium salt , thioxanthone ammonium salt, double (2,6-di Oxylbenzylidene)-2,4,4-trimethyl-pentylphosphine oxide, bis(2,6-dimethoxybenzylidene)-2,4,4-trimethyl- Amylphosphine oxide, 2,4,6-trimethylbenzophenone, 4-methylbenzophenone, 4,4'-bisdiethylamine benzophenone, 1,4-diphenyl Mercaptobenzene, 10-butyl-2-chloroacridone, 2,2'-bis(o-chlorophenyl)-4,5,4',5'-tetra (3,4,5-trimethyl) Oxyphenyl) 1,2'-bisimidazole, 2,2'-bis(o-chlorophenyl)-4,5,4',5'-tetraphenyl-1,2'-bisimidazole, 2 -benzimidylnaphthalene, 4-benzylidenebiphenyl, 4-benzylidene diphenyl ether, acrylated benzophenone, bis(η5-2,4-cyclopentadiene-1- Bis-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium, o-methylbenzhydryl benzoate, p-dimethylaminobenzene Ethyl formate, p-dimethylaminobenzoic acid isoamyl ethyl ester, active tertiary amine, carbazole ‧ phenol photopolymerization initiator, acridine photopolymerization initiator, triazine photopolymerization initiator, A benzamidine-based photopolymerization initiator or the like. One or two or more kinds of these light-initiating agents can be used. The amount of the photoinitiator is 0.1 to 10 parts by mass based on 100 parts by mass of the component (A).
本發明中,較佳之光開始劑,例如有2,4,6-三甲基苯甲醯基苯基乙氧基膦氧化物、1-羥基-環己基-苯基-酮。其等可各自單獨使用,或組合使用亦可。In the present invention, preferred photoinitiators are, for example, 2,4,6-trimethylbenzimidylphenylethoxyphosphine oxide and 1-hydroxy-cyclohexyl-phenyl-ketone. They may be used singly or in combination.
本發明之光硬化型接著組成物,可進一步含有接著賦予劑。接著賦予劑,為矽烷偶合劑,例如有乙烯基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二乙氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、p-苯乙烯基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基三甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基三乙氧基矽烷、3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-三乙氧基甲矽烷基-N-(1,3-二甲基-亞丁基)丙基胺、N-苯基-3-胺基丙基三甲氧基矽烷、3-脲基丙基三乙氧基矽烷、3-氯丙基三甲氧基矽烷、3-巰基丙酯、甲基二甲氧基矽烷、3-巰基丙基三甲氧基矽烷、雙(三乙氧基甲矽烷基丙基)四硫化物、3-異氰酸酯丙基三乙氧基矽烷等。此等之接著賦予劑,可單獨使用1種或2種以上。接著賦予劑之量,相對於成分(A) 100質量份,一般係0.01~10質量份,較佳係0.5~5質量份。The photocurable composition of the present invention may further contain a subsequent imparting agent. The following agent is a decane coupling agent, for example, vinyl trimethoxy decane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxy decane, 3-glycidoxypropyltrimethoxy Decane, 3-glycidoxypropylmethyldiethoxydecane, 3-glycidoxypropyltriethoxydecane, p-styryltrimethoxydecane, 3-methylpropene oxime Oxypropyl propyl dimethoxy decane, 3-methyl propylene methoxy propyl trimethoxy decane, 3-methyl propylene methoxy propyl methyl diethoxy decane, 3-methyl propylene Methoxypropyltriethoxydecane, 3-propenyloxypropyltrimethoxydecane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxydecane, N -2-(Aminoethyl)-3-aminopropyltrimethoxydecane, N-2-(aminoethyl)-3-aminopropyltriethoxydecane, 3-aminopropyl Trimethoxydecane, 3-aminopropyltriethoxydecane, 3-triethoxymethylidene-N-(1,3-dimethyl-butylene)propylamine, N-phenyl- 3-aminopropyltrimethoxydecane, 3-ureidopropyltriethoxydecane, 3-chloropropyltrimethoxydecane, 3-mercaptopropyl ester, methyl Methoxy Silane, 3-mercaptopropyl trimethoxy Silane, bis (triethoxysilyl silicon alkyl) tetrasulfide, 3-isocyanate propyl triethoxy silane-like. These subsequent additives may be used alone or in combination of two or more. The amount of the agent to be added is usually 0.01 to 10 parts by mass, preferably 0.5 to 5 parts by mass, per 100 parts by mass of the component (A).
本發明之光硬化型接著組成物,亦可進一部含有抗氧化劑。抗氧化劑,例如有BHT、2,4-雙-(n-辛基硫代)-6-(4-羥基-3,5-二-t-丁基苯胺基)-1,3,5-三嗪、季戊四醇‧四[3-(3,5-二-t-丁基-4-羥基苯基)丙酸酯]、2,2-硫-二伸乙基雙[3-(3,5-二-t-丁基-4-羥基苯基)丙酸酯]、三乙二醇-雙[3-(3-t-丁基-5-甲基-4-羥基苯基)丙酸酯]、1,6-乙二醇-雙[3-(3,5-二-t-丁基-4-羥基苯基)丙酸酯]、十八烷基-3-(3,5-二-t-丁基-4-羥基苯基)丙酸酯、N,N'-六伸甲基雙(3,5-二-t-丁基-4-羥基-氫化肉桂醯胺)、1,3,5-三甲基-2,4,6-三(3,5-二-t-丁基-4-羥基苄基)苯、三-(3,5-二-t-丁基-4-羥基苄基)-三聚異氰酸酯、辛基化二苯基胺、2,4-雙[(辛基硫)甲基]-O-甲酚、異辛基-3-(3,5-二-t-丁基-4-羥基苯基)丙酸酯、二丁基羥基甲苯。此等抗氧化劑,可單獨使用1種或2種以上。抗氧化劑之量,相對於成分(A) 100質量份,一般係0.01~10質量份,較佳係0.5~5質量份。The photocurable composition of the present invention may further contain an antioxidant. Antioxidants, for example, BHT, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-three Pyrazine, pentaerythritol, ‧[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,2-sulfanyl-diethylidene bis[3-(3,5- Di-t-butyl-4-hydroxyphenyl)propionate], triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate] 1,6-ethylene glycol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di- T-butyl-4-hydroxyphenyl)propionate, N,N'-hexamethyl-bis(3,5-di-t-butyl-4-hydroxy-hydrocinnamylamine), 1,3 ,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, tris-(3,5-di-t-butyl-4- Hydroxybenzyl)-trimeric isocyanate, octylated diphenylamine, 2,4-bis[(octylthio)methyl]-O-cresol, isooctyl-3-(3,5-di- T-butyl-4-hydroxyphenyl)propionate, dibutylhydroxytoluene. These antioxidants may be used alone or in combination of two or more. The amount of the antioxidant is generally 0.01 to 10 parts by mass, preferably 0.5 to 5 parts by mass, per 100 parts by mass of the component (A).
本發明之光硬化型接著組成物,如因光學機能材料之構造,致使塗佈於接著面之接著組成物之一部照不到光時,可在照光處以光使其硬化,並在無法照光處添加有機過氧化物並以熱使其硬化,從而為光硬化及熱硬化之倂用型之接著組成物。有機過氧化物,其例子有酮過氧化物系、過氧基縮酮系、氫過氧化物系、二烷基過氧化物系、二醯基過氧化物系、過氧基酯基、過氧基二碳酸酯系等。此等之有機過氧化物,可單獨使用1種或2種以上。其量,相對於成分(A) 100質量份,一般係0.1~10質量份,較佳係1~5質量份。The photocurable type subsequent composition of the present invention, such as due to the structure of the optical functional material, causes one of the subsequent constituents applied to the subsequent surface to be exposed to light, which can be hardened by light at the illumination, and cannot be illuminated An organic peroxide is added and hardened by heat to form a subsequent composition of the photohardenable and thermally hardened type. Examples of the organic peroxides include ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, dimercapto peroxide, peroxy ester, and Oxydicarbonate or the like. These organic peroxides may be used alone or in combination of two or more. The amount thereof is usually 0.1 to 10 parts by mass, preferably 1 to 5 parts by mass, per 100 parts by mass of the component (A).
此外,此等有機過氧化物之硬化促進劑,可使用環烷酸金屬錯合物、二甲基苯胺、四級銨鹽、磷酸酯類。Further, as the hardening accelerator for these organic peroxides, a metal naphthenate complex, dimethylaniline, a quaternary ammonium salt, or a phosphate ester can be used.
本發明之光硬化型接著組成物,係以作成在靜電容量式觸控面板中,用以將形成有透明電極之透明基板及透明板加以貼合之接著劑為較佳。透明基板之材質,例如有玻璃、PC、PMMA、PC及PMMA之複合體、COC、COP。透明板之材質,例如有玻璃、PC、PMMA、PC及PMMA之複合體、COC、COP。The photocurable adhesive composition of the present invention is preferably an adhesive for bonding a transparent substrate on which a transparent electrode is formed and a transparent plate in a capacitive touch panel. The material of the transparent substrate is, for example, a composite of glass, PC, PMMA, PC, and PMMA, COC, and COP. The material of the transparent plate is, for example, a composite of glass, PC, PMMA, PC, and PMMA, COC, and COP.
本發明之光硬化型接著組成物,係以作為在觸控面板及其上將薄片或板加以貼合之接著劑為較佳。薄片,例如有圖示片(icon sheet)、保護薄片、裝飾薄片,其材質例如有PET、PC、COC、COP。板,例如有裝飾板、保護板,其材質,則例如有PET、玻璃、PC、PMMA、PC及PMMA之複合體、COC、COP。可與薄片或板進行貼合之觸控面板面之材質,例如有玻璃、PET、PC、PMMA、PC及PMMA之複合體、COC、COP。The photocurable secondary composition of the present invention is preferably used as an adhesive for bonding a sheet or a sheet to a touch panel. Examples of the sheet include an icon sheet, a protective sheet, and a decorative sheet, and the material thereof is, for example, PET, PC, COC, or COP. The board is, for example, a decorative board or a protective board, and its material is, for example, a composite of PET, glass, PC, PMMA, PC, and PMMA, COC, and COP. The material of the touch panel surface that can be bonded to the sheet or the board, for example, a composite of glass, PET, PC, PMMA, PC, and PMMA, COC, and COP.
此外,本發明亦關於一種以上述之光硬化型接著組成物加以貼合,於靜電容量式觸控面板中將形成有透明電極之透明基板與透明板之貼合體,或者觸控面板與薄片或板之貼合體。In addition, the present invention also relates to a bonding body of a transparent substrate and a transparent plate in which a transparent electrode is formed in an electrostatic capacitance type touch panel, or a touch panel and a sheet or The fit of the board.
第2之發明Invention of the second
第2之本發明,係一種光硬化型樹脂組成物,其特徵為其係含有:(A)骨架上具有聚異戊二烯、聚丁二烯或聚氨酯之(甲基)丙烯酸酯低聚物、(B)柔軟化成分、以及(C1)選自苯氧基乙基(甲基)丙烯酸酯、苯氧基聚乙二醇(甲基)丙烯酸酯、2-羥基-3-苯氧基丙基(甲基)丙烯酸酯、環己基(甲基)丙烯酸酯、壬基苯酚EO加成物(甲基)丙烯酸酯、甲氧基三乙二醇(甲基)丙烯酸酯及四氫糠基(甲基)丙烯酸酯之(甲基)丙烯酸酯單體,且係用以將顯示體及光學機能材料進行貼合之光硬化型接著組成物;該硬化物之彈性率係未達12kPa,且硬化物在斷裂時之伸長係300%以上者。The invention of the second aspect is a photocurable resin composition characterized by comprising: (A) a (meth) acrylate oligomer having polyisoprene, polybutadiene or polyurethane on the skeleton And (B) a softening component, and (C1) is selected from the group consisting of phenoxyethyl (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, 2-hydroxy-3-phenoxy propyl Base (meth) acrylate, cyclohexyl (meth) acrylate, nonyl phenol EO adduct (meth) acrylate, methoxy triethylene glycol (meth) acrylate and tetrahydrofurfuryl ( a (meth) acrylate monomer of methyl acrylate, and a photocurable type subsequent composition for bonding a display body and an optical functional material; the elastic modulus of the cured product is less than 12 kPa, and is hardened. The elongation of the material at break is more than 300%.
本發明之成分(A)、成分(B)及成分(C1)之具體例子,係如第1之發明中所記載者。Specific examples of the component (A), the component (B) and the component (C1) of the present invention are as described in the first invention.
本發明之光硬化型樹脂組成物,係用以將顯示體及光學機能材料進行貼合者。顯示體,例如有將偏光板貼合於玻璃上之LCD、EL顯示器、EL照明、電子紙或電漿顯示器等之顯示元件。光學機能材料,例如有基於視認性提升或防止外部衝擊導致顯示元件之破裂的丙烯板(亦可單面或雙面進行硬塗處理或AR塗佈處理)、聚碳酸酯板、PET板、PEN板等之透明塑膠板、強化玻璃(亦可附有防止飛散薄膜)及觸控面板輸入感應器等。The photocurable resin composition of the present invention is used to bond a display body and an optical functional material. The display body is, for example, a display element such as an LCD, an EL display, an EL illumination, an electronic paper, or a plasma display in which a polarizing plate is attached to glass. Optical functional materials, such as acrylic sheets with cracking of display elements based on visual enhancement or prevention of external impact (can be hard coated or AR coated on one or both sides), polycarbonate sheets, PET sheets, PEN Transparent plastic plate, tempered glass (with anti-scatter film) and touch panel input sensor.
本發明之光硬化型樹脂組成物,該硬化物之彈性率係未達12kPa,且硬化物在斷裂時之伸長係300%以上者。硬化物藉由具有此種彈性率及在斷裂時之伸長,本發明之光硬化型接著組成物,如將顯示體及光學機能材料加以貼合時,就不會發生接著面剝落,顯示體之玻璃破裂,或顯示斑產生之情形。硬化物之彈性率及在斷裂時之伸長,可依據後述實施例所記載之方法加以測定。In the photocurable resin composition of the present invention, the elastic modulus of the cured product is less than 12 kPa, and the elongation at break of the cured product is 300% or more. When the cured product has such an elastic modulus and elongation at the time of breaking, the photocurable type subsequent composition of the present invention, such as a display body and an optical functional material, does not peel off the surface, and the display body The glass ruptures or shows the situation where the plaque is produced. The elastic modulus of the cured product and the elongation at the time of the fracture can be measured in accordance with the method described in the examples below.
本發明中,硬化物之彈性率係以1kPa以上、未達12kPa者為較佳;硬化物在斷裂時之伸長,則以300%以上700%以下為較佳。In the present invention, the elastic modulus of the cured product is preferably 1 kPa or more and less than 12 kPa, and the elongation of the cured product at the time of fracture is preferably 300% or more and 700% or less.
本發明之光硬化型樹脂組成物,其硬化物中之400~800nm光之初期穿透率係95%以上,而60℃、濕度90%下放置500小時後之穿透率係70%以上,且85℃下放置500小時後之穿透率係90%以上者為較佳。The photocurable resin composition of the present invention has an initial transmittance of light of 400 to 800 nm in a cured product of 95% or more, and a transmittance of 70% or more after being left at 60 ° C and a humidity of 90% for 500 hours. It is preferred that the transmittance after leaving at 85 ° C for 500 hours is 90% or more.
本發明之光硬化型樹脂組成物,其硬化物之折射率係以1.45~1.55為較佳。In the photocurable resin composition of the present invention, the cured product has a refractive index of preferably 1.45 to 1.55.
在本發明之光硬化型樹脂組成物中,如將相對於成分(A)之成分(C1)之量比增加時,可降低硬化物之彈性率,並可增大硬化物在斷裂時之伸長,且如將成分(B)之量比增加時,可降低硬化物之彈性率。因此,藉由調節成分(A)、成分(B)、成分(C1)之配合比,就可在硬化物上賦予所期望之彈性率及在斷裂時之伸長。In the photocurable resin composition of the present invention, when the ratio of the component (C1) relative to the component (A) is increased, the modulus of elasticity of the cured product can be lowered, and the elongation of the cured product at the time of fracture can be increased. And, if the ratio of the component (B) is increased, the modulus of elasticity of the cured product can be lowered. Therefore, by adjusting the compounding ratio of the component (A), the component (B), and the component (C1), the desired elastic modulus and elongation at the time of fracture can be imparted to the cured product.
本發明之光硬化型樹脂組成物,其較佳者,係含有(A)之(甲基)丙烯酸酯低聚物100質量份,(B)之柔軟化成分100~400質量份,更佳為100~300質量份,以及(C1)之(甲基)丙烯酸酯單體1~100質量份,更佳為5~50質量份者。The photocurable resin composition of the present invention preferably contains 100 parts by mass of the (meth) acrylate oligomer of (A) and 100 to 400 parts by mass of the softening component of (B), more preferably 100 to 300 parts by mass, and 1 to 100 parts by mass of the (meth) acrylate monomer of (C1), more preferably 5 to 50 parts by mass.
本發明之光硬化型樹脂組成物,其最佳者,係含有成分(A)之低聚物,亦即聚異戊二烯(甲基)丙烯酸酯低聚物(100質量份),成分(B)之柔軟化成分,亦即液狀聚丁二烯(10~300質量份,較佳為50~200質量份)及/或聚異戊二烯(10~300質量份,較佳為50~200質量份),以及成分(C1)之(甲基)丙烯基單體,亦即環己基甲基丙烯酸酯(1~100質量份,較佳為5~50質量份),及/或苯氧基乙基甲基丙烯酸酯(1~100質量份,較佳為5~50質量份)。The photocurable resin composition of the present invention is preferably an oligomer containing the component (A), that is, a polyisoprene (meth) acrylate oligomer (100 parts by mass), and a component ( B) a softening component, that is, liquid polybutadiene (10 to 300 parts by mass, preferably 50 to 200 parts by mass) and/or polyisoprene (10 to 300 parts by mass, preferably 50) ~200 parts by mass), and a (meth) propylene monomer of the component (C1), that is, cyclohexyl methacrylate (1 to 100 parts by mass, preferably 5 to 50 parts by mass), and/or benzene Oxyethyl methacrylate (1 to 100 parts by mass, preferably 5 to 50 parts by mass).
本發明之光硬化型樹脂組成物,如成分(A)及成分(C1)之相溶性惡劣或黏度高而作業性惡劣時,反應稀釋劑,可含有成分(C1)以外之一般性(甲基)丙烯酸酯單體。一般性之(甲基)丙烯酸酯單體,例如有2-乙基己基(甲基)丙烯酸酯、n-丁基(甲基)丙烯酸酯、i-丁基(甲基)丙烯酸酯、t-丁基(甲基)丙烯酸酯、月桂基(甲基)丙烯酸酯、烷基(甲基)丙烯酸酯、甲氧基乙基(甲基)丙烯酸酯、2-羥基乙基(甲基)丙烯酸酯、2-羥基丙基(甲基)丙烯酸酯、2-羥基丁基(甲基)丙烯酸酯、苄基(甲基)丙烯酸酯、苯基(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、羥基乙基(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、二環戊烯基氧基乙基(甲基)丙烯酸酯、原菠烯基(甲基)丙烯酸酯。此等之(甲基)丙烯酸酯,可單獨使用1種或2種以上。In the photocurable resin composition of the present invention, if the compatibility between the component (A) and the component (C1) is poor or the viscosity is high and the workability is poor, the reactive diluent may contain a general (methyl group) other than the component (C1). ) acrylate monomer. General (meth) acrylate monomers, for example, 2-ethylhexyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, t- Butyl (meth) acrylate, lauryl (meth) acrylate, alkyl (meth) acrylate, methoxy ethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate , 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, ethylene glycol di(methyl) Acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, hydroxyethyl (meth)acrylate, 1,3-butanediol di(methyl) Acrylate, 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, dicyclopentenyl Oxyethyl (meth) acrylate, raw spinel alkenyl (meth) acrylate. These (meth) acrylates may be used alone or in combination of two or more.
本發明之光硬化型樹脂組成物,進一步,可含有光開始劑。光開始劑,可使用第1之發明所記載之光開始劑。光開始劑之量,相對於成分(A) 100質量份,係0.1~10質量份。The photocurable resin composition of the present invention may further contain a photoinitiator. As the photoinitiator, the photoinitiator described in the first aspect of the invention can be used. The amount of the photoinitiator is 0.1 to 10 parts by mass based on 100 parts by mass of the component (A).
本發明之光硬化型樹脂組成物,進一步,可含有接著賦予劑。接著賦予劑,可使用第1之發明所記載者。接著賦予劑之量,相對於成分(A) 100質量份,係0.01~10質量份,較佳係0.5~5質量份。The photocurable resin composition of the present invention may further contain a subsequent imparting agent. Next, the applicant can be used as described in the first invention. The amount of the agent to be added is 0.01 to 10 parts by mass, preferably 0.5 to 5 parts by mass, per 100 parts by mass of the component (A).
本發明之光硬化型樹脂組成物,進一步,可含有抗氧化劑。抗氧化劑,可使用第1之發明所記載者。抗氧化劑之量,相對於成分(A) 100質量份,係0.01~10質量份,較佳係0.5~5質量份。The photocurable resin composition of the present invention may further contain an antioxidant. As the antioxidant, those described in the first invention can be used. The amount of the antioxidant is 0.01 to 10 parts by mass, preferably 0.5 to 5 parts by mass, per 100 parts by mass of the component (A).
本發明之光硬化型樹脂組成物,與第1之發明為相同地,可為光硬化與熱硬化之倂用型式之樹脂組成物。有機過氧化物之量,相對於成分(A) 100質量份,係0.1~10質量份,較佳係1~5質量份。The photocurable resin composition of the present invention is a resin composition of a photo-curing type and a heat-curing type in the same manner as in the first aspect of the invention. The amount of the organic peroxide is 0.1 to 10 parts by mass, preferably 1 to 5 parts by mass, per 100 parts by mass of the component (A).
此外,有機過氧化物之硬化促進劑,可使用環烷酸金屬錯合物、二甲基苯胺、4級銨鹽、磷酸酯類。Further, as the hardening accelerator for the organic peroxide, a metal naphthenate complex, dimethylaniline, a 4-grade ammonium salt, or a phosphate ester can be used.
本發明,係含有以上述之光硬化型樹脂組成物加以貼合之顯示體及光學機能材料的顯示面板,此例如可組裝入電視、數位照相機、行動電話、電腦、顯示器等之電子機器中。The present invention relates to a display panel comprising a display body and an optical functional material bonded together with the photocurable resin composition described above, and can be incorporated, for example, into an electronic device such as a television, a digital camera, a mobile phone, a computer, or a display.
第3之發明Invention of the third
第3之發明,係一種光硬化型樹脂組成物,其特徵係含有:(A)以聚異戊二烯、聚丁二烯或聚氨酯為骨架之(甲基)丙烯酸酯低聚物、(B)柔軟化成分、以及(C2)硫醇化合物,且係用以將顯示體及光學機能材料進行貼合之光硬化型樹脂組成物;該硬化物之彈性率係未達10kPa,且硬化物在斷裂時之伸長係300%以上者。The invention of the third aspect is a photocurable resin composition characterized by comprising: (A) a (meth) acrylate oligomer having a polyisoprene, a polybutadiene or a polyurethane as a skeleton, (B) a softening component and a (C2) thiol compound, and a photocurable resin composition for bonding a display body and an optical functional material; the elastic modulus of the cured product is less than 10 kPa, and the cured product is The elongation at break is more than 300%.
本發明之成分(A)、成分(B)及成分(C2)之具體例子,係如第1之發明所記載者。Specific examples of the component (A), the component (B) and the component (C2) of the present invention are as described in the first invention.
本發明之光硬化型樹脂組成物,係用以將顯示體及光學機能材料加以貼合者。顯示體,例如有在玻璃上有貼附有偏光板之LCD、EL顯示器、EL照明、電子紙或電漿顯示器等之顯示元件。光學機能材料,有基於視認性提升或防止外部衝擊導致顯示元件之破裂的丙烯板(亦可為單面或雙面硬塗處理或AR塗佈處理)、聚碳酸酯板、PET板、PEN板等之透明塑膠板、強化玻璃(亦可附有防止飛散薄膜)以及觸控面板輸入感應器等。The photocurable resin composition of the present invention is used to bond a display body and an optical functional material. The display body is, for example, a display element such as an LCD, an EL display, an EL illumination, an electronic paper, or a plasma display having a polarizing plate attached to the glass. Optical functional materials, acrylic sheets (which may be single-sided or double-sided hard coating treatment or AR coating treatment), polycarbonate sheets, PET sheets, PEN boards, which are based on the improvement of visibility or prevention of external impact. Such as transparent plastic plate, tempered glass (can also be attached with anti-scatter film) and touch panel input sensor.
本發明之光硬化型樹脂組成物,該硬化物之彈性率係未達10kPa,且硬化物在斷裂時之伸長係300%以上者。硬化物藉由具有此種彈性率及在斷裂時之伸長,本發明之光硬化型接著組成物,如將顯示體及光學機能材料加以貼合時,就不會發生接著面剝落,顯示體之玻璃破裂,或顯示斑產生之情形。硬化物之彈性率及在斷裂時之伸長,可依據後述實施例所記載之方法加以測定。In the photocurable resin composition of the present invention, the elastic modulus of the cured product is less than 10 kPa, and the elongation at break of the cured product is 300% or more. When the cured product has such an elastic modulus and elongation at the time of breaking, the photocurable type subsequent composition of the present invention, such as a display body and an optical functional material, does not peel off the surface, and the display body The glass ruptures or shows the situation where the plaque is produced. The elastic modulus of the cured product and the elongation at the time of the fracture can be measured in accordance with the method described in the examples below.
本發明中,硬化物之彈性率係以1kPa以上且未達10kPa為較佳,硬化物在斷裂時之伸長,係以300%以上700%以下者為較佳,並以350%以上600%以下者為最佳。In the present invention, the elastic modulus of the cured product is preferably 1 kPa or more and less than 10 kPa, and the elongation of the cured product at the time of fracture is preferably 300% or more and 700% or less, and preferably 350% or more and 600% or less. The best.
本發明之光硬化型樹脂組成物,其中在硬化物中,400~800nm之光之初期穿透率係95%以上,在60℃、濕度90%下放置500小時後之穿透率係70%以上,且在85℃下放置500小時後之穿透率係90%以上者為較佳。In the photocurable resin composition of the present invention, in the cured product, the initial transmittance of light of 400 to 800 nm is 95% or more, and the transmittance after leaving for 500 hours at 60 ° C and 90% humidity is 70%. The above, and the transmittance after leaving at 85 ° C for 500 hours is preferably 90% or more.
本發明之光硬化型樹脂組成物,其硬化物之折射率係以1.45~1.55為較佳。In the photocurable resin composition of the present invention, the cured product has a refractive index of preferably 1.45 to 1.55.
在本發明之光硬化型樹脂組成物中,如將相對於成分(A)之成分(C2)之量比增加時,可降低硬化物之彈性率,並可增大硬化物在斷裂時之伸長,且如將成分(B)之量比增加時,可降低硬化物之彈性率。因此,藉由調節成分(A)、成分(B)、成分(B)之配合比,就可在硬化物上賦予所期望之彈性率及在斷裂時之伸長。In the photocurable resin composition of the present invention, when the ratio of the component (C2) relative to the component (A) is increased, the modulus of elasticity of the cured product can be lowered, and the elongation of the cured product at the time of fracture can be increased. And, if the ratio of the component (B) is increased, the modulus of elasticity of the cured product can be lowered. Therefore, by adjusting the compounding ratio of the component (A), the component (B), and the component (B), the desired elastic modulus and elongation at the time of fracture can be imparted to the cured product.
本發明之光硬化型樹脂組成物,其較佳者,係含有(A)之(甲基)丙烯酸酯低聚物100質量份,(B)之柔軟化成分10~300質量份,更佳為100~200質量份,以及(C2)之硫醇化合物0.05~100質量份,更佳為0.1~10質量份者。The photocurable resin composition of the present invention preferably contains 100 parts by mass of the (meth) acrylate oligomer of (A) and 10 to 300 parts by mass of the softening component of (B), more preferably 100 to 200 parts by mass, and (C2) the thiol compound is 0.05 to 100 parts by mass, more preferably 0.1 to 10 parts by mass.
本發明之光硬化型樹脂組成物,其最佳者,係含有成分(A)之低聚物,亦即聚異戊二烯甲基丙烯酸酯(100質量份),成分(B)之柔軟化成分,亦即液狀聚丁二烯(10~300質量份,較佳為100~200質量份)及/或液狀聚異戊二烯(10~300質量份,較佳為100~200質量份),以及成分(C2)之硫醇化合物季戊四醇四(3-巰基丁酸酯)(0.05~100質量份,較佳為0.1~10質量份)。The photocurable resin composition of the present invention preferably contains an oligomer of the component (A), that is, polyisoprene methacrylate (100 parts by mass), and the component (B) is softened. The component, that is, liquid polybutadiene (10 to 300 parts by mass, preferably 100 to 200 parts by mass) and/or liquid polyisoprene (10 to 300 parts by mass, preferably 100 to 200 parts by mass) And a thiol compound pentaerythritol tetrakis(3-mercaptobutyrate) of the component (C2) (0.05 to 100 parts by mass, preferably 0.1 to 10 parts by mass).
本發明之光硬化型樹脂組成物,如相溶性惡劣或為提昇作業性時,可含有(甲基)丙烯酸酯單體。(甲基)丙烯酸酯單體,例如有第1之發明中所使用者。藉由添加(甲基)丙烯酸酯單體,可調整硫醇化合物及柔軟化成分之添加量。丙烯酸酯單體,可於能賦予所期望之相溶性之範圍內進行添加,惟較佳者,相對於成分(A) 100質量份,係1~100質量份,最佳者為10~50質量份。The photocurable resin composition of the present invention may contain a (meth) acrylate monomer if the compatibility is poor or the workability is improved. The (meth) acrylate monomer is, for example, a user of the first invention. The addition amount of the thiol compound and the softening component can be adjusted by adding a (meth) acrylate monomer. The acrylate monomer may be added within a range capable of imparting desired compatibility, and is preferably 1 to 100 parts by mass, preferably 10 to 50 parts by mass based on 100 parts by mass of the component (A). Share.
本發明之光硬化型樹脂組成物,進一步,可含有光開始劑。光開始劑,可使用第1之發明所記載之光開始劑。光開始劑之量,相對於成分(A) 100質量份,係0.1~10質量份。The photocurable resin composition of the present invention may further contain a photoinitiator. As the photoinitiator, the photoinitiator described in the first aspect of the invention can be used. The amount of the photoinitiator is 0.1 to 10 parts by mass based on 100 parts by mass of the component (A).
本發明之光硬化型樹脂組成物,進一步,可含有接著賦予劑。接著賦予劑,可使用第1之發明所記載者。接著賦予劑之量,相對於成分(A) 100質量份,係0.01~20質量份,較佳係0.5~5質量份。The photocurable resin composition of the present invention may further contain a subsequent imparting agent. Next, the applicant can be used as described in the first invention. The amount of the agent to be added is 0.01 to 20 parts by mass, preferably 0.5 to 5 parts by mass, per 100 parts by mass of the component (A).
本發明之光硬化型樹脂組成物,進一步,可含有抗氧化劑。抗氧化劑,可使用第1之發明所記載者。抗氧化劑之量,相對於成分(A) 100質量份,係0.01~10質量份,較佳係0.5~5質量份。The photocurable resin composition of the present invention may further contain an antioxidant. As the antioxidant, those described in the first invention can be used. The amount of the antioxidant is 0.01 to 10 parts by mass, preferably 0.5 to 5 parts by mass, per 100 parts by mass of the component (A).
本發明之光硬化型樹脂組成物,與第1之發明為相同地,可為光硬化與熱硬化之倂用型式之樹脂組成物。有機過氧化物之量,相對於成分(A) 100質量份,係0.1~10質量份,較佳係1~5質量份。The photocurable resin composition of the present invention is a resin composition of a photo-curing type and a heat-curing type in the same manner as in the first aspect of the invention. The amount of the organic peroxide is 0.1 to 10 parts by mass, preferably 1 to 5 parts by mass, per 100 parts by mass of the component (A).
此外,此等有機過氧化物之硬化促進劑,可使用環烷酸金屬錯合物、二甲基苯胺、4級銨鹽、磷酸酯類。Further, as the hardening accelerator for these organic peroxides, a metal naphthenate complex, dimethylaniline, a quaternary ammonium salt, or a phosphate ester can be used.
本發明,係含有以上述之光硬化型樹脂組成物加以貼合之顯示體及光學機能材料的顯示面板,此例如可組裝入電視、數位照相機、行動電話、電腦、顯示器等之電子機器中。The present invention relates to a display panel comprising a display body and an optical functional material bonded together with the photocurable resin composition described above, and can be incorporated, for example, into an electronic device such as a television, a digital camera, a mobile phone, a computer, or a display.
以下茲舉出實施例進一步地詳細說明本發明。惟本發明並不受這些實施例之任何限制。The invention will now be described in further detail by way of examples. However, the invention is not limited by these examples.
將表1及2所示成分配合如表1及2之量(質量份),而製得實施例A~I之光硬化型樹脂組成物。The components shown in Tables 1 and 2 were blended in an amount (parts by mass) as shown in Tables 1 and 2 to obtain photocurable resin compositions of Examples A to I.
(試驗例1)(Test Example 1)
使用試驗例1所製造之實施例A~I之光硬化型樹脂組成物,以下述之各種試驗分析其特性值。結果如表3~5所示。實施例A~I之任一者,在熱衝擊試驗、耐熱試驗及耐濕試驗中,皆無氣泡存在。Using the photocurable resin compositions of Examples A to I produced in Test Example 1, the characteristic values were analyzed by various tests described below. The results are shown in Tables 3 to 5. In any of Examples A to I, no bubbles were present in the thermal shock test, the heat resistance test, and the moisture resistance test.
彈性率及在斷裂時之伸長,係將JISZ1702 No.3亞鈴試驗片(厚度1mmt)使用島津製作所製材料試驗機,以10m/min之速度進行測定。此外,亞鈴試驗片係使用附有輸送帶之擴散金屬鹵素燈,並以積算光量6000mJ/cm2 使其硬化。The elastic modulus and the elongation at the time of the fracture were measured by using a JIS Z 1702 No. 3 bell test piece (thickness: 1 mmt) using a material testing machine manufactured by Shimadzu Corporation at a speed of 10 m/min. Further, the Yaling test piece was made by using a diffused metal halide lamp with a conveyor belt and hardened with an integrated light amount of 6000 mJ/cm 2 .
收縮率,係依據JIS-K-6833測定其液比重及硬化物比重,再由兩者之體積比計算得到。The shrinkage ratio is determined by measuring the specific gravity of the liquid and the specific gravity of the hardened material according to JIS-K-6833, and then calculating the volume ratio of the two.
穿透率,係於參考側之玻璃(1mm厚)、樣品室側之1mm厚玻璃間,使樹脂組成物硬化成1mm厚而調製成之試驗片,再使用日本分光製之紫外可見分光器,以400nm~800nm之波長進行測定。關於85℃500小時後及60℃/90%500小時後之穿透率,亦同樣地進行測定。The transmittance is based on the glass on the reference side (1 mm thick) and the 1 mm thick glass on the side of the sample chamber, and the resin composition is hardened into a test piece of 1 mm thick, and the UV-visible spectroscope manufactured by JASCO Corporation is used. The measurement was carried out at a wavelength of 400 nm to 800 nm. The measurement was carried out in the same manner after 500 hours at 85 ° C and after 60 ° C / 90% for 500 hours.
折射率,係將將調製成厚度300μm薄片狀之試驗片,以亞塔哥製阿貝折射率計(D線,25℃)進行測定。The refractive index was measured in a sheet having a thickness of 300 μm, and was measured by an Abbe's Abbe refractometer (D line, 25 ° C).
熱衝擊試驗,係將0.8mm厚之丙烯板(三菱Rayon公司製MR-200)及0.8mm厚之玻璃板(30×40mm),使用光硬化型樹脂組成物所貼合成之硬化厚度100μm之試驗片(玻璃/丙烯試驗片);或者,將0.8mm厚之玻璃板及0.7mm厚之玻璃板(30×40mm),使用光硬化型樹脂組成物所貼合成之硬化厚度100μm之試驗片(玻璃/玻璃試驗片)。試驗片係以,且各30分鐘之500循環進行,試驗後以目視確認有無剝離、氣泡及受損之情形。The thermal shock test is a test in which a 0.8 mm thick acrylic plate (MR-200 manufactured by Mitsubishi Rayon Co., Ltd.) and a 0.8 mm thick glass plate (30 × 40 mm) are laminated to a hardened thickness of 100 μm using a photocurable resin composition. Sheet (glass/propylene test piece); or a 0.8 mm thick glass plate and a 0.7 mm thick glass plate (30×40 mm), which were laminated with a light-hardened resin composition and cured to a thickness of 100 μm (glass) / glass test piece). Test film And 500 cycles of each 30 minutes were carried out, and after the test, it was visually confirmed whether there were peeling, bubbles, and damage.
耐熱試驗,係將與熱衝擊試驗所使用者為相同之試驗片,保持於85℃烘箱中500小時,試驗後以目視確認有無剝離、氣泡及受損之情形。In the heat resistance test, the test piece which is the same as the user of the thermal shock test was kept in an oven at 85 ° C for 500 hours, and after the test, the presence or absence of peeling, air bubbles, and damage was visually confirmed.
耐濕試驗,係將與熱衝擊試驗所使用者為相同之試驗片,保持於60℃/90%之恆溫恆濕中500小時,試驗後以目視確認有無剝離、氣泡及受損之情形。In the moisture resistance test, the test piece which is the same as the user of the thermal shock test was kept at 60 ° C / 90% constant temperature and humidity for 500 hours, and the presence or absence of peeling, air bubbles and damage was visually confirmed after the test.
此外,在玻璃/玻璃試驗片所進行之試驗,可測定觸控面板接著用之接著特性;在玻璃/丙烯試驗片所進行之試驗,可測定顯示體及光學機能材料之接著特性。In addition, in the test conducted on the glass/glass test piece, the subsequent characteristics of the touch panel can be measured; in the test conducted on the glass/propylene test piece, the subsequent characteristics of the display body and the optical functional material can be measured.
實施例2Example 2
將表6所示之成分配合如表6所示之量,而製得實施例A2~H2之光硬化型樹脂組成物。The components shown in Table 6 were blended in an amount shown in Table 6, and the photocurable resin compositions of Examples A2 to H2 were obtained.
(試驗例2)(Test Example 2)
使用試驗例2所製造之實施例A2~H2之光硬化型樹脂組成物,進行各種之試驗,分析其特性值。Using the photocurable resin compositions of Examples A2 to H2 produced in Test Example 2, various tests were carried out to analyze the characteristic values.
其分析結果如表7所示。實施例A2~H2之任一者,在熱衝擊試驗及耐濕試驗中,皆無氣泡存在。The analysis results are shown in Table 7. In any of Examples A2 to H2, no bubbles were present in the thermal shock test and the moisture resistance test.
根據第1之本發明,可提供一種光硬化型樹脂組成物,其係用以在觸控面板上將裝飾板或圖示片加以貼合,或在靜電容量式觸控面板中,將形成有透明電極之透明基板與透明板加以貼合時,可賦予充分之接著性且不含氣泡者。According to the first aspect of the invention, there is provided a photocurable resin composition for attaching a decorative panel or a graphic sheet to a touch panel, or for forming an electrostatic capacitance type touch panel. When the transparent substrate of the transparent electrode and the transparent plate are bonded together, sufficient adhesion can be imparted and bubbles are not contained.
根據第2或第3之本發明,可提供一種光硬化型樹脂組成物,其係用以在接著面不會剝落,且顯示體之玻璃不會破裂之情形下,將顯示體及光學機能性材料加以貼合者;以及,一種顯示面板,其係將顯示體及光學機能性材料加以貼合者。According to the second or third aspect of the invention, it is possible to provide a photocurable resin composition for displaying a body and optical function without peeling off the bonding surface and without rupturing the glass of the display body. A material is attached; and a display panel that fits the display body and the optical functional material.
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CN102144009B (en) | 2016-04-20 |
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KR101823196B1 (en) | 2018-01-29 |
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CN103589347A (en) | 2014-02-19 |
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KR20140048346A (en) | 2014-04-23 |
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