TWI485027B - Composite of tin-silver alloy coating without lead - Google Patents
Composite of tin-silver alloy coating without lead Download PDFInfo
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- TWI485027B TWI485027B TW101145195A TW101145195A TWI485027B TW I485027 B TWI485027 B TW I485027B TW 101145195 A TW101145195 A TW 101145195A TW 101145195 A TW101145195 A TW 101145195A TW I485027 B TWI485027 B TW I485027B
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本發明係有關於一種無鉛錫銀合金鍍層之組合物，特別是指一種可以提高銲錫導電性、大幅降低製造成本、增加銲接性及抗氧化性，可供作為太陽能電池光電板鍍錫層之銲錫使用，並獲得最佳太陽能電池品質的銲錫之組成物成份。 The invention relates to a composition of a lead-free tin-silver alloy plating layer, in particular to a solder which can improve solder conductivity, greatly reduce manufacturing cost, increase weldability and oxidation resistance, and can be used as a tin plating layer of a solar cell photovoltaic panel. Use and obtain the best composition of the solder composition of the solar cell quality.
在太陽能電池模組中，其係以鍍錫銅帶(Photovoltaic ribbon，PV ribbon)作為串接太陽能電池用。例如有中華民國100年11月11日所公告之新型第M416200號「太陽能光電模組」專利案，其係揭露：一第一基板、一太陽能模組、以及一第二基板。太陽能模組設置於第一基板上，第二基板設置於太陽能模組上。太陽能模組包括有複數個太陽能晶片，其係封裝於兩封裝材料之間，其中每一太陽能晶片係以一導電膠帶形成電性連接。其係以導電膠帶取代先前技術使用之鍍錫銅帶以及覆蓋其上之有色膠帶，因此在製程較為簡便，也減少了使用鍍錫銅帶高溫焊接可能帶來破片的問題。 In the solar cell module, a photovoltaic ribbon (PV ribbon) is used as a tandem solar cell. For example, there is a new type of "Solar Photovoltaic Module" patent No. M416200 announced by the Republic of China on November 11, 100, which discloses a first substrate, a solar module, and a second substrate. The solar module is disposed on the first substrate, and the second substrate is disposed on the solar module. The solar module includes a plurality of solar wafers that are packaged between two packaging materials, wherein each solar wafer is electrically connected by a conductive tape. It replaces the tinned copper strip used in the prior art with the conductive tape and the colored tape covering the same, so the process is relatively simple, and the problem of using the tinned copper strip to weld at high temperature may be reduced.
該鍍錫銅帶與電池的銀膠層銲接，則是負責傳導太陽能電池轉換光能而生成的電能，在鍍錫銅帶中，該銅帶採用高導電的純銅，依需求有不同尺寸規格，其係在銅帶表面再以電鍍或是熱浸鍍的方式鍍上一層鍍錫層，該鍍錫層的目的則為保護銅帶使其不氧化，並且要求有良好銲接性及導電性，目前所常見的鍍錫層，其 所使用的銲錫主要區分為有鉛和無鉛，有鉛銲錫包括Sn-Pb-Ag、Sn-Pb；無鉛銲錫包括Sn-Ag、Sn-Ag-Cu、Sn-Bi等等，鍍錫層成分影響銲錫的銲接性，而鍍錫層與太陽能電池上的銀膠層之間的銲接性好壞，除影響銲接時工作參數外，並影響後續太陽能電池的效率及可靠度，因此，透過提升銲錫本身導電性以及銲接性，可以提升電池的發電效果及品質，由於有鉛銲錫會有污染環境及後續難以處理等缺點，因此已逐漸捨棄不用，而改採用無鉛銲錫。 The tinned copper strip is soldered to the silver glue layer of the battery, and is responsible for conducting the energy generated by the solar cell to convert the light energy. In the tinned copper strip, the copper strip is made of highly conductive pure copper, and has different sizes according to requirements. It is plated on the surface of the copper strip by electroplating or hot dip plating. The purpose of the tin plating layer is to protect the copper strip from oxidation and requires good solderability and conductivity. a common tin plating layer, The solder used is mainly divided into lead and lead-free, lead solder including Sn-Pb-Ag, Sn-Pb; lead-free solder including Sn-Ag, Sn-Ag-Cu, Sn-Bi, etc. The solderability of the solder, and the solderability between the tin plating layer and the silver paste layer on the solar cell, in addition to affecting the working parameters during soldering, and affecting the efficiency and reliability of the subsequent solar cell, therefore, by improving the solder itself Conductivity and solderability can improve the power generation and quality of the battery. Because lead solder has the disadvantage of polluting the environment and being difficult to handle, it has gradually abandoned it and replaced it with lead-free solder.
因此有中華民國97年5月11日所公告之發明第I296555號「耐高溫變形之無鉛銲錫合金組成物」專利案，其係揭露：6~15重量份之鋅(Zn)、0.001~1.0重量份之稀土族元素(RE)、0.0001~1.2重量份之鎳(Ni)，以及與前述元素合計100重量份之錫(Sn)。藉在錫-鋅合金組成物中加入適量的稀土族元素，可以改善組成物在高溫環境下的機械性質，而適量的鎳元素也可以提高組成物在高溫環境下之穩定性及抗氧化性，使該銲錫銲料運用在高溫環境下時具有較高的可靠度及接合強度。 Therefore, there is a patent for the invention of No. I296555, "High-temperature-resistant lead-free solder alloy composition" announced by the Republic of China on May 11, 1997, which discloses: 6 to 15 parts by weight of zinc (Zn), 0.001 to 1.0 weight. The rare earth element (RE), 0.0001 to 1.2 parts by weight of nickel (Ni), and 100 parts by weight of tin (Sn) in combination with the above elements. By adding an appropriate amount of rare earth elements to the tin-zinc alloy composition, the mechanical properties of the composition in a high temperature environment can be improved, and an appropriate amount of nickel element can also improve the stability and oxidation resistance of the composition in a high temperature environment. The solder solder has high reliability and joint strength when used in a high temperature environment.
然該專利前案並無法大幅提高銲錫的導電性，而且使用大量的非鋅材料，也使得製造的成本增加，因此在使用上並不理想。 However, this patent does not significantly improve the electrical conductivity of the solder, and the use of a large amount of non-zinc material also increases the cost of manufacturing, so it is not ideal in use.
爰此，有鑑於目前無鉛銲錫的組合物具有上述之缺點，本發明係提供一種無鉛錫銀合金鍍層之組合物，包括有：16至40重量百分比的鋅；0.1至1重量百分比的銀；0.01至0.3重量百分比的鋁；0.001至0.01重量百分比的磷；0.001至0.5重量百分比的鍺；以及餘量的錫。 Accordingly, in view of the fact that the current lead-free solder composition has the above disadvantages, the present invention provides a composition of a lead-free tin-silver alloy plating layer comprising: 16 to 40% by weight of zinc; 0.1 to 1% by weight of silver; To 0.3% by weight of aluminum; 0.001 to 0.01% by weight of phosphorus; 0.001 to 0.5% by weight of bismuth; and the balance of tin.
上述鋅係選自99.99%之純鋅錠，該錫係選自99.99%之純錫錠，該銀係選自與錫所形成之含銀錠，該鋁則係選自與錫所形成之含鋁錠，該磷係選自與錫所形成之含磷錠，該鍺係選自與錫所形成之含鍺錠。 The zinc is selected from the group consisting of 99.99% pure zinc ingots selected from the group consisting of 99.99% pure tin ingots selected from silver-containing ingots formed of tin, and the aluminum is selected from the group consisting of tin and tin. Ingot, the phosphorus is selected from the group consisting of tin-containing ingots formed from tin, and the lanthanum is selected from the group consisting of bismuth-containing ingots formed with tin.
本發明亦可為一種無鉛錫銀合金鍍層銲錫的製造方法，其步驟係包括：(a)係分別秤重16至40重量百分比的鋅；0.1至1重量百分比的銀；0.01至0.3重量百分比的鋁；0.001至0.01重量百分比的磷；0.001至0.5重量百分比的鍺；以及餘量的錫；(b)先將該鋅、錫、銀、鋁一起投入於一坩鍋內，然後將其共同升溫，並予以攪拌；(c)攪拌完成後，使所有的原料可以充分熔融並混合形成一錫液；(d)然後再於該錫液中添加入磷及鍺，並再予以攪拌；(e)於攪拌完成後，將該錫液急速冷卻而形成一合金鑄錠，以供可作為鍍錫層之銲錫使用。 The invention may also be a method for manufacturing a lead-free tin-silver alloy plating solder, the steps comprising: (a) weighing 16 to 40 weight percent of zinc, respectively; 0.1 to 1 weight percent of silver; 0.01 to 0.3 weight percent of Aluminum; 0.001 to 0.01 weight percent phosphorus; 0.001 to 0.5 weight percent bismuth; and the balance tin; (b) first put the zinc, tin, silver, aluminum together in a crucible, and then heat it together And stirring; (c) after the completion of the stirring, all the raw materials can be fully melted and mixed to form a tin liquid; (d) then the phosphorus and rhodium are added to the tin liquid, and then stirred; (e) After the stirring is completed, the tin liquid is rapidly cooled to form an alloy ingot for use as a solder for the tin plating layer.
上述步驟(b)之升溫的溫度係為500℃，攪拌時間則為1.5小時。 The temperature at which the temperature in the above step (b) was raised was 500 ° C, and the stirring time was 1.5 hours.
上述步驟(d)之攪拌時間則為20分鐘。 The stirring time of the above step (d) is 20 minutes.
上述合金鑄錠之熔點係為210至350℃，而其導電率則大於15.5%。 The above alloy ingot has a melting point of 210 to 350 ° C and a conductivity of more than 15.5%.
上述合金鑄錠之工作溫度係為260至400℃。 The above alloy ingots have an operating temperature of 260 to 400 °C.
本發明具有下列功效： The invention has the following effects:
1.本發明係利用增加鋅含量，可以提高銲錫的導電性。 1. The present invention utilizes an increased zinc content to increase the conductivity of the solder.
2.本發明由於鋅含量高，故可以減少其他元素的使用量，而能大幅降低製造的成本。 2. Since the present invention has a high zinc content, the amount of other elements can be reduced, and the manufacturing cost can be drastically reduced.
3.本發明添加銀含量，可以增加銲錫與銅基材或是銀基材的銲接性。 3. The addition of the silver content of the present invention can increase the weldability of the solder to the copper substrate or the silver substrate.
4.本發明添加微量的鋁、磷及鍺，可以增加銲錫的抗氧化性，並提昇鍍錫銅帶的焊接性。 4. The addition of trace amounts of aluminum, phosphorus and antimony in the present invention can increase the oxidation resistance of the solder and improve the weldability of the tinned copper strip.
5.本發明所製成之銲錫，係可提昇太陽能電池的品質，及提高其發電效率及可靠度。 5. The solder made by the invention can improve the quality of the solar cell and improve the power generation efficiency and reliability.
首先，本發明係為一種無鉛錫銀合金鍍層之組合物，本發明實施例之組合物成份係包括：16至40重量百分比的鋅。 First, the present invention is a composition of a lead-free tin-silver alloy plating layer, and the composition of the composition of the present invention comprises: 16 to 40% by weight of zinc.
0.1至1重量百分比的銀。 0.1 to 1 weight percent of silver.
0.01至0.3重量百分比的鋁。 0.01 to 0.3 weight percent of aluminum.
0.001至0.01重量百分比的磷。 0.001 to 0.01 weight percent phosphorus.
0.001至0.5重量百分比的鍺。 0.001 to 0.5 weight percent bismuth.
以及餘量(balance)的錫。 And the balance of tin.
其中，該鋅係選自於99.99%之純鋅錠，而該錫則選自於99.99%之純錫錠，而該銀則與錫先形成一含銀之母合金錠備用，該鋁則與錫先形成一含鋁之母合金錠備用，又該磷同樣與錫先形成一含磷之母合金錠備用，另該鍺則同樣與錫先形成一含鍺之母合金錠備用。 Wherein, the zinc is selected from a pure zinc ingot of 99.99%, and the tin is selected from a pure tin ingot of 99.99%, and the silver forms a silver alloy mother ingot with tin first, and the aluminum is The tin first forms an alloy ingot containing aluminum for use, and the phosphorus also forms a phosphorus-containing mother alloy ingot with tin first, and the niobium also forms a mother alloy ingot with tin first.
本發明係為一種無鉛錫銀合金鍍層銲錫的製造方法，如第一圖所示，其步驟係包括： The invention is a method for manufacturing lead-free tin-silver alloy plating solder, as shown in the first figure, the steps thereof include:
a.係先依照上述各元素的重量百分比，分別秤重純鋅錠(1)、純錫錠(2)、含銀錠(3)、含鋁錠(4)、含磷錠(5)及含鍺錠(6)。 a. Firstly, according to the weight percentage of each element, weigh the pure zinc ingot (1), pure tin ingot (2), silver ingot (3), aluminum ingot (4), phosphorus ingot (5) and锗 ingot (6).
b.先將該純鋅錠(1)、純錫錠(2)、含銀錠(3)、含鋁錠(4)一起投入於一坩鍋(7)內，然後將其共同升溫至500℃後，並以一不鏽鋼製的扇葉(8)攪拌1.5小時。 b. First, the pure zinc ingot (1), the pure tin ingot (2), the silver-containing ingot (3), and the aluminum-containing ingot (4) are put together in a crucible (7), and then the temperature is raised to 500 ° C together. After that, it was stirred with a stainless steel blade (8) for 1.5 hours.
c.攪拌完成後，使所有的原料可以充分熔融並混合形成一錫液(9)。 c. After the stirring is completed, all the raw materials can be sufficiently melted and mixed to form a tin liquid (9).
d.然後再於該錫液(9)中添加入含磷錠(5)及含鍺錠(6)，並再攪拌20分鐘。 d. Then, the phosphorus-containing ingot (5) and the antimony-containing ingot (6) were added to the tin liquid (9), and the mixture was further stirred for 20 minutes.
e.於攪拌完成後，將該錫液(9)急速冷卻而形成一合金鑄錠(10)，以供可作為鍍錫層之銲錫使用。 e. After the stirring is completed, the tin liquid (9) is rapidly cooled to form an alloy ingot (10) for use as a solder for the tin plating layer.
該製造完成之合金鑄錠(10)的熔點係在210至350℃之間，而其導電率則大於15.5%，遠較於一般錫-鉛合金的12.8%、錫-鉛-銀合金的12.4、錫-銀-銅合金的13.9%都要來得高，因此具有極佳的導電性。 The finished alloy ingot (10) has a melting point between 210 and 350 ° C and a conductivity of more than 15.5%, which is much higher than 12.8% of the general tin-lead alloy and 12.4 of the tin-lead-silver alloy. 13.9% of the tin-silver-copper alloy has to be high, so it has excellent electrical conductivity.
當該合金鑄錠(10)用於作為鍍錫層之銲錫使用時，其工作溫度需為260至400℃之間，其中所添加的鋅含量係可以提高銲錫的導電性，並且由於鋅含量高，故可以減少其他元素的使用量，並可以大幅降低製造的成本，而且銀含量的添加，可以增加銲錫與銅基材或是銀基材的銲接性，又微量元素的鋁含量、磷含量及鍺含量的添加，則可以增加銲錫的抗氧化性，以提昇鍍錫銅帶的焊接性，進而獲取良好的太陽能電池的品質。 When the alloy ingot (10) is used as a solder for a tin plating layer, the operating temperature is required to be between 260 and 400 ° C, wherein the added zinc content can improve the conductivity of the solder and is high in zinc content. Therefore, the amount of other elements can be reduced, and the manufacturing cost can be greatly reduced, and the addition of the silver content can increase the solderability of the solder to the copper substrate or the silver substrate, and the aluminum content and phosphorus content of the trace elements and The addition of niobium content can increase the oxidation resistance of the solder to improve the solderability of the tinned copper strip, thereby obtaining a good quality of the solar cell.
惟，以上所述僅為本發明其中之一最佳實施例，當不能以此限定本發明之申請專利保護範圍，舉凡依本發明之申請專利範圍及說明書內容所作之簡單的等效變化與替換，皆應仍屬於本發明申請專利範圍所涵蓋保護之範圍內。 However, the above description is only one of the preferred embodiments of the present invention, and the scope of the patent application and the contents of the description of the present invention are not limited thereto. All should still fall within the scope of protection covered by the scope of the patent application of the present invention.
(1)‧‧‧純鋅錠 (1)‧‧‧ pure zinc ingots
(2)‧‧‧純錫錠 (2)‧‧‧Pure tin ingots
(3)‧‧‧含銀錠 (3)‧‧‧With silver ingots
(4)‧‧‧含鋁錠 (4)‧‧‧With aluminum ingots
(5)‧‧‧含磷錠 (5) ‧‧‧Phosphorus ingots
(6)‧‧‧含鍺錠 (6)‧‧‧锗 containing ingots
(7)‧‧‧坩鍋 (7)‧‧‧ 坩 pot
(8)‧‧‧扇葉 (8)‧‧‧ fan blades
(9)‧‧‧錫液 (9)‧‧‧ tin liquid
(10)‧‧‧合金鑄錠 (10)‧‧‧ alloy ingots
[第一圖]係為本發明製造步驟之簡單示意圖。 [First figure] is a simplified schematic diagram of the manufacturing steps of the present invention.
(1)‧‧‧純鋅錠 (1)‧‧‧ pure zinc ingots
(2)‧‧‧純錫錠 (2)‧‧‧Pure tin ingots
(3)‧‧‧含銀錠 (3)‧‧‧With silver ingots
(4)‧‧‧含鋁錠 (4)‧‧‧With aluminum ingots
(5)‧‧‧含磷錠 (5) ‧‧‧Phosphorus ingots
(6)‧‧‧含鍺錠 (6)‧‧‧锗 containing ingots
(7)‧‧‧坩鍋 (7)‧‧‧ 坩 pot
(8)‧‧‧扇葉 (8)‧‧‧ fan blades
(9)‧‧‧錫液 (9)‧‧‧ tin liquid
(10)‧‧‧合金鑄錠 (10)‧‧‧ alloy ingots
Claims (7)
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| TW101145195A TWI485027B (en) | 2012-11-30 | 2012-11-30 | Composite of tin-silver alloy coating without lead |
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| TW101145195A TWI485027B (en) | 2012-11-30 | 2012-11-30 | Composite of tin-silver alloy coating without lead |
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| TWI485027B true TWI485027B (en) | 2015-05-21 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030133826A1 (en) * | 2002-01-15 | 2003-07-17 | Kwang-Lung Lin | Lead-free solder |
| JP2004358540A (en) * | 2003-06-06 | 2004-12-24 | Sumitomo Metal Mining Co Ltd | High-temperature brazing filler metal |
| CN101092006A (en) * | 2006-06-21 | 2007-12-26 | 北京有色金属研究总院 | Lead-free solder for micro alloyed eutectic alloy of stannum and zinc |
| CN101269446A (en) * | 2008-05-13 | 2008-09-24 | 南京航空航天大学 | Sn-Zn-Ga-Ce leadless brazing filler metal |
| TW201228764A (en) * | 2010-12-08 | 2012-07-16 | Sumitomo Metal Mining Co | Pb-free solder alloy mainly containing Zn |
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2012
- 2012-11-30 TW TW101145195A patent/TWI485027B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030133826A1 (en) * | 2002-01-15 | 2003-07-17 | Kwang-Lung Lin | Lead-free solder |
| JP2004358540A (en) * | 2003-06-06 | 2004-12-24 | Sumitomo Metal Mining Co Ltd | High-temperature brazing filler metal |
| CN101092006A (en) * | 2006-06-21 | 2007-12-26 | 北京有色金属研究总院 | Lead-free solder for micro alloyed eutectic alloy of stannum and zinc |
| CN101269446A (en) * | 2008-05-13 | 2008-09-24 | 南京航空航天大学 | Sn-Zn-Ga-Ce leadless brazing filler metal |
| TW201228764A (en) * | 2010-12-08 | 2012-07-16 | Sumitomo Metal Mining Co | Pb-free solder alloy mainly containing Zn |
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| TW201420253A (en) | 2014-06-01 |
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