TWI481474B - Glass processing methods - Google Patents
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- TWI481474B TWI481474B TW101119434A TW101119434A TWI481474B TW I481474 B TWI481474 B TW I481474B TW 101119434 A TW101119434 A TW 101119434A TW 101119434 A TW101119434 A TW 101119434A TW I481474 B TWI481474 B TW I481474B
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本發明係有關玻璃的加工方法，尤其是有關使玻璃形成穿透孔的加工方法。 The present invention relates to a method of processing glass, and more particularly to a method of forming a glass into a through hole.
目前手持式電子裝置的觸控面板，大都是由強化玻璃製成，該等強化玻璃通常設有多個穿透孔，以供安裝按鍵等元件。一般強化玻璃穿孔加工的方式，包括雷射加工、噴砂加工或化學蝕刻加工等。 At present, touch panels of handheld electronic devices are mostly made of tempered glass, and the tempered glass is usually provided with a plurality of penetration holes for mounting components such as buttons. Generally, the method of strengthening glass perforation processing includes laser processing, sand blasting or chemical etching processing.
如第1圖所示，能量束加工，係使能量束11照射待加工玻璃20的表層較硬的剛化區21，進而穿透剛化區21及內層的硬化區22，使待加工玻璃20形成穿透孔200。能量束加工使待加工玻璃20形成穿透孔200的速度較快，但會在穿透孔200的周圍產生熱影響區23，例如產生玻璃的變質或產生微裂痕等。 As shown in Fig. 1, the energy beam processing causes the energy beam 11 to illuminate the hardened zone 21 of the surface of the glass to be processed 20, and then penetrates the rigidified zone 21 and the hardened zone 22 of the inner layer to make the glass to be processed. 20 forms a penetration hole 200. The energy beam processing causes the glass 20 to be processed to form the penetration hole 200 faster, but generates a heat-affected zone 23 around the penetration hole 200, for example, causing deterioration of the glass or generation of micro-cracks and the like.
如第2、3、4圖所示，噴砂加工前，係先使待加工玻璃20的剛化區21結合一層保護膜24，然後在保護膜24的上表面製作光罩25及照射光線12後，在保護膜24上形成要進行穿孔的缺口241；再使噴砂13噴向缺口241，使待加工玻璃20形成穿透孔200。由於保護膜24具有彈性，噴向保護膜24的噴砂13將被保護膜24反彈而無法穿透保護膜24。噴砂加工雖不會在玻璃的穿透孔200的周圍產生變質或微裂痕等，但使待加工玻璃20形成穿透孔200的速度較慢 。 As shown in the figures 2, 3 and 4, before the sandblasting, the rigidification zone 21 of the glass to be processed 20 is first bonded with a protective film 24, and then the mask 25 and the illumination light 12 are formed on the upper surface of the protective film 24. A notch 241 to be perforated is formed on the protective film 24; the blasting 13 is sprayed toward the notch 241 to form the through hole 200 of the glass 20 to be processed. Since the protective film 24 has elasticity, the blast 13 sprayed toward the protective film 24 will be bounced by the protective film 24 to penetrate the protective film 24. Although the sandblasting process does not cause deterioration or micro-cracks or the like around the penetration hole 200 of the glass, the glass 20 to be processed is formed to penetrate the hole 200 at a slower speed. .
化學蝕刻加工需使用腐蝕性強的化學材料，加工人員操作時必須非常小心，否則容易受傷。化學蝕刻加工不容易控制蝕刻的方向，難以在待加工玻璃上的精確位置形成穿透孔，且該化學材料也會造成環境的污染。 Chemical etching requires the use of highly corrosive chemicals, and the processor must be very careful when handling it, otherwise it is prone to injury. The chemical etching process does not easily control the direction of etching, and it is difficult to form a through hole at a precise position on the glass to be processed, and the chemical material also causes environmental pollution.
台灣公開專利第201136694號，揭示一種雷射複合加工裝置及其運作方法，其雷射複合加工裝置包含一第一噴砂裝置、一第二噴砂裝置、一雷射源、一第一噴嘴及一第二噴嘴。利用雷射複合加工裝置控制第一噴砂裝置透過第一噴嘴對一金屬工件之一表面進行噴砂，以去除該表面上的污垢並增加該表面的粗糙度；接著，雷射複合加工裝置控制雷射源發射出一雷射光對該表面進行加工；然後，雷射複合加工裝置控制第二噴砂裝置透過該第二噴嘴對該表面進行噴砂，以去除該表面經雷射複合加工後所形成之毛邊。 Taiwan Patent Publication No. 201136694 discloses a laser composite processing device and a method for operating the same, the laser composite processing device comprising a first blasting device, a second blasting device, a laser source, a first nozzle and a first Two nozzles. Controlling, by the laser composite processing device, the first blasting device to blast a surface of a metal workpiece through the first nozzle to remove dirt on the surface and increase the roughness of the surface; and then, the laser composite processing device controls the laser The source emits a laser beam to process the surface; then, the laser composite processing device controls the second blasting device to blast the surface through the second nozzle to remove the burrs formed by the surface after the laser composite processing.
上述台灣專利揭示的雷射複合加工裝置係用於對金屬工件之表面進行加工，並未揭示用在玻璃上形成穿透孔的相關加工技術。 The laser composite processing apparatus disclosed in the above Taiwan patent is used for processing the surface of a metal workpiece, and does not disclose a related processing technique for forming a penetration hole in the glass.
為了進一步改良習知玻璃的加工方法而提出本發明。 The present invention has been proposed in order to further improve the processing method of the conventional glass.
本發明的主要目的，在提供一種玻璃的加工方法，採用能量束加工或化學蝕刻加工結合噴砂加工成為複合式的玻璃加工法，擷取能量束加工可快速在較硬的剛化區的準確位置形成凹槽的優點，及利用噴砂去除能量束加工所產生的熱影響區以獲得較佳品質的穿透孔的優點。 The main object of the present invention is to provide a method for processing glass, which uses energy beam processing or chemical etching processing combined with sandblasting to form a composite glass processing method, and the energy beam processing can be quickly placed in the exact position of the hardened rigid zone. The advantages of forming the groove and the advantage of using the sandblasting to remove the heat affected zone generated by the energy beam processing to obtain a better quality through hole.
本發明的另一目的，在提供一種玻璃的加工方法，採用能量束加工或化學蝕刻加工結合噴砂加工成為複合式的玻璃加工法，不需於噴砂加工前先製作光罩的程序，可節省玻璃穿孔作業的時間，提升玻璃加工的效率及品質。 Another object of the present invention is to provide a method for processing glass, which uses energy beam processing or chemical etching processing combined with sandblasting to form a composite glass processing method, which eliminates the need to prepare a mask before sandblasting, thereby saving glass. The time of perforation work improves the efficiency and quality of glass processing.
本發明玻璃的加工方法，包括如下步驟：(1)使待加工玻璃的上端面及下端面中至少一端面結合一層保護膜；(2)使能量束照射該保護膜對應於該待加工玻璃要形成穿透孔的位置，進而該能量束蝕穿該保護膜在該待加工玻璃的上端面及下端面中至少一端面形成至少一凹槽；(3)使噴砂噴向該至少一凹槽，進而穿透該待加工玻璃，而使該待加工玻璃形成至少一穿透孔；(4)使該保護膜脫離該待加工玻璃，完成使該待加工玻璃具有該至少一穿透孔的作業；俾利用該能量束先在該待加工玻璃需要穿孔的準確位置形成凹槽，然後利用該噴砂去除該能量束所產生的熱影響區並使該待加工玻璃形成該至少一穿透孔，以提升玻璃加工的效率及品質。 The processing method of the glass of the invention comprises the following steps: (1) combining at least one end surface of the upper end surface and the lower end surface of the glass to be processed with a protective film; (2) irradiating the energy beam with the energy beam corresponding to the glass to be processed Forming a position of the penetration hole, and the energy beam is etched through the protective film to form at least one groove on at least one of the upper end surface and the lower end surface of the glass to be processed; (3) spraying the blasting sand toward the at least one groove, Further, the glass to be processed is penetrated to form at least one through hole of the glass to be processed; (4) the protective film is detached from the glass to be processed, and the operation of the glass to be processed having the at least one through hole is completed;俾 using the energy beam to form a groove at an exact position where the glass to be processed needs to be perforated, and then using the blasting to remove the heat-affected zone generated by the energy beam and forming the at least one penetration hole into the glass to be processed to enhance The efficiency and quality of glass processing.
本發明玻璃的加工方法，包括如下步驟：(1)使待加工玻璃的上端面及下端面中至少一端面結合一層保護膜，並使該保護膜形成至少一缺口；(2)使化學蝕刻材料穿過該至少一缺口蝕刻該待加工玻璃，進而在該待加工玻璃的上端面及下端面中至少一端面形成至少一凹槽 ；(3)使噴砂噴向該至少一凹槽，進而穿透該待加工玻璃，而使該待加工玻璃形成至少一穿透孔；(4)使該保護膜脫離該待加工玻璃，完成使該待加工玻璃具有至少一穿透孔的作業。 The processing method of the glass of the present invention comprises the following steps: (1) bonding at least one end surface of the upper end surface and the lower end surface of the glass to be processed with a protective film, and forming at least one notch of the protective film; (2) chemical etching material Etching the glass to be processed through the at least one notch, and forming at least one groove on at least one of the upper end surface and the lower end surface of the glass to be processed (3) spraying the blasting sand toward the at least one groove to penetrate the glass to be processed, so that the glass to be processed forms at least one penetration hole; (4) removing the protective film from the glass to be processed, and completing The glass to be processed has at least one penetration hole.
其中該化學蝕刻材料於該凹槽中的部分區域蝕刻穿透該待加工玻璃。 Wherein the portion of the chemically etched material in the recess is etched through the glass to be processed.
其中該待加工玻璃的上端面及下端面中至少一端面設有剛化區；該化學蝕刻材料蝕刻穿透該剛化區。 Wherein at least one of the upper end surface and the lower end surface of the glass to be processed is provided with a rigidization zone; the chemical etching material is etched through the rigidization zone.
本發明的其他目的、功效，請參閱圖式及實施例，詳細說明如下。 For other purposes and functions of the present invention, please refer to the drawings and the embodiments, which are described in detail below.
11‧‧‧能量束 11‧‧‧ Energy beam
12‧‧‧光線 12‧‧‧Light
13‧‧‧噴砂 13‧‧‧ Sandblasting
20‧‧‧待加工玻璃 20‧‧‧Stained glass
200、300‧‧‧穿透孔 200, 300‧‧‧ penetration holes
201、32‧‧‧凹槽 201, 32‧‧‧ grooves
21‧‧‧剛化區 21‧‧‧Ganghua District
22‧‧‧硬化區 22‧‧‧ hardened area
23‧‧‧熱影響區 23‧‧‧heat affected zone
24、31‧‧‧保護膜 24, 31‧‧‧ protective film
241‧‧‧缺口 241‧‧ ‧ gap
25‧‧‧光罩 25‧‧‧Photomask
30‧‧‧曲面玻璃 30‧‧‧Surface glass
(1)、(2)、(3)、(4)‧‧‧分別為實施本發明的步驟編號 (1), (2), (3), (4) ‧ ‧ ‧ are the step numbers for implementing the invention
第1圖為待加工玻璃能量束加工的示意圖。 Figure 1 is a schematic diagram of the processing of the glass energy beam to be processed.
第2圖為待加工玻璃結合保護膜的示意圖。 Figure 2 is a schematic view of a glass bonded protective film to be processed.
第3圖為於待加工玻璃上製作光罩的示意圖。 Figure 3 is a schematic view of a reticle on a glass to be processed.
第4圖為待加工玻璃噴砂加工的示意圖。 Figure 4 is a schematic view of the glass blasting process to be processed.
第5圖為本發明玻璃的加工方法的流程圖。 Figure 5 is a flow chart showing the processing method of the glass of the present invention.
第6圖為本發明待加工玻璃結合保護膜的示意圖。 Figure 6 is a schematic view of a glass bonded protective film to be processed according to the present invention.
第7圖為本發明待加工玻璃能量束加工的示意圖。 Figure 7 is a schematic view of the processing of the glass energy beam to be processed according to the present invention.
第8圖為本發明待加工玻璃雷噴砂工的示意圖。 Figure 8 is a schematic view of a glass mine sandblaster to be processed according to the present invention.
第9圖為本發明待加工玻璃雷噴砂工形成穿透孔的示意圖。 Figure 9 is a schematic view showing the formation of a penetration hole by a glass mine sandblaster to be processed according to the present invention.
第10圖為本發明待加工玻璃撕開保護膜的示意圖。 Figure 10 is a schematic view of a glass tear-off protective film to be processed according to the present invention.
第11圖為本發明曲面玻璃結合保護膜的示意圖。 Figure 11 is a schematic view of a curved glass bonded protective film of the present invention.
第12圖為本發明曲面玻璃能量束加工的示意圖。 Figure 12 is a schematic view of the energy beam processing of curved glass of the present invention.
第13圖為本發明曲面玻璃雷噴砂工的示意圖。 Figure 13 is a schematic view of a curved glass mine blasting machine of the present invention.
如第5至10圖所示，本發明玻璃的加工方法，包括如下步驟：(1)使待加工玻璃20的剛化區21結合一層保護膜24，如第6圖所示；(2)使能量束11照射保護膜24對應於待加工玻璃20的要形成穿透孔的位置，進而能量束11依序穿透保護膜24及剛化區21形成凹槽201，或使能量束11於凹槽201中的部分區域穿透待加工玻璃20，如第7圖所示；(3)使噴砂13噴向凹槽201，進而穿透硬化區22，而使待加工玻璃20形成穿透孔200，如第8、9圖所示；(4)使保護膜24脫離剛化區21，完成使待加工玻璃20具有穿透孔200的作業，如第10圖所示。 As shown in Figures 5 to 10, the method for processing a glass of the present invention comprises the steps of: (1) bonding a rigidified region 21 of the glass 20 to be processed to a protective film 24, as shown in Fig. 6; The energy beam 11 illuminates the protective film 24 corresponding to the position of the glass 20 to be processed to form the penetration hole, and the energy beam 11 sequentially penetrates the protective film 24 and the rigidized region 21 to form the groove 201, or the energy beam 11 is concave. A portion of the groove 201 penetrates the glass 20 to be processed, as shown in FIG. 7; (3) the blast 13 is sprayed toward the groove 201, thereby penetrating the hardened region 22, and the glass 20 to be processed is formed into the through hole 200. As shown in Figs. 8 and 9, (4) the protective film 24 is separated from the rigidified region 21, and the operation of making the glass 20 to be processed with the penetration hole 200 is completed, as shown in Fig. 10.
本發明待加工玻璃20的上下兩端面均可設有剛化區21，中間設有硬化區22；硬化區22連接剛化區21；上下兩端面的剛化區21分別結合一層保護膜24；使能量束11分別照射待加工玻璃20上下兩端面的剛化區21，於上下兩端面分別形成凹槽201；使噴砂13分別 噴向上下兩端面的凹槽201，以加速穿孔作業，然後使上下兩端面的保護膜24脫離剛化區21。 The upper and lower end faces of the glass to be processed 20 of the present invention may be provided with a stiffening zone 21, with a hardened zone 22 in the middle; the hardened zone 22 is connected to the rigidified zone 21; the rigidified zone 21 of the upper and lower ends is respectively combined with a protective film 24; The energy beam 11 is respectively irradiated to the rigidification zone 21 of the upper and lower end faces of the glass 20 to be processed, and the groove 201 is respectively formed on the upper and lower end faces; The grooves 201 on the upper and lower end faces are sprayed to accelerate the piercing operation, and then the protective film 24 on the upper and lower end faces is separated from the rigidified region 21.
本發明噴砂13的顆粒成份可為碳化矽(SiC)、氧化鋯(ZrO)、氧化鋁(Al2O3)或二氧化鈰(CeO2)等，顆粒的粒徑為1微米(um)至1000微米。能量束11可為雷射、電漿、電子束等。 The particle component of the blasting 13 of the present invention may be cerium carbide (SiC), zirconia (ZrO), alumina (Al 2 O 3 ) or cerium oxide (CeO 2 ), etc., and the particle size of the particles is 1 micron (um) to 1000 microns. The energy beam 11 can be a laser, a plasma, an electron beam, or the like.
本發明上述玻璃的加工方法的步驟(2)中，也可利用化學蝕刻加工的化學蝕刻材料取代能量束11，蝕刻待加工玻璃20的表層較硬的剛化區21。但在步驟(1)中要先應用上述第2、3、4圖所示的習知技術，先使待加工玻璃20的剛化區21結合一層保護膜24，然後在保護膜24的上表面製作光罩25及照射光線12後，在保護膜24上形成要進行穿孔的至少一缺口241，再使化學蝕刻材料穿過缺口241蝕刻剛化區21形成凹槽201，然後再進行後續步驟，完成使待加工玻璃20具有穿透孔200的作業。 In the step (2) of the method for processing glass according to the present invention, the energy beam 11 may be replaced by a chemical etching material of a chemical etching process to etch the hardened region 21 of the surface of the glass 20 to be processed. However, in the step (1), the conventional technique shown in the above FIGS. 2, 3, and 4 is applied first, and the rigidified region 21 of the glass to be processed 20 is first bonded with a protective film 24, and then on the upper surface of the protective film 24. After the reticle 25 and the illuminating light 12 are formed, at least one notch 241 to be perforated is formed on the protective film 24, and then the chemical etching material is etched through the notch 241 to form the groove 201, and then the subsequent steps are performed. The work of making the glass to be processed 20 have the penetration hole 200 is completed.
如第11圖所示，本發明玻璃的加工方法，除了可應用於平板玻璃的加工外，也可方便應用於曲面玻璃30的穿孔加工作業，更能顯示本發明的優點。如上述步驟，先使曲面玻璃30要穿孔的位置貼上保護膜31；如第12圖所示，再利用能量束11照射曲面玻璃30要開設孔洞的位置，能量束11依序穿透保護膜及剛化區形成對應的凹槽32；如第13圖所示，然後利用噴砂13噴向凹槽，使曲面玻璃30形成穿透孔300；然後撕掉保護膜即完成曲面玻璃30的穿孔加工作業。 As shown in Fig. 11, the processing method of the glass of the present invention can be applied to the perforation processing of the curved glass 30 in addition to the processing of the flat glass, and the advantages of the present invention can be further exhibited. As described above, the protective film 31 is first attached to the position where the curved glass 30 is to be perforated; as shown in Fig. 12, the energy beam 11 is used to illuminate the position where the curved glass 30 is to be opened, and the energy beam 11 sequentially penetrates the protective film. And the corrugated area forms a corresponding groove 32; as shown in FIG. 13, the blasting 13 is then sprayed toward the groove to form the curved glass 30 into the through hole 300; then the protective film is removed to complete the perforation of the curved glass 30. operation.
本發明玻璃的加工方法係採用能量束加工或化學蝕刻加工結合噴砂加工成為複合式的玻璃加工法，擷取能量束加工可快速在較硬 的剛化區的準確位置形成凹槽的優點，及利用噴砂去除能量束加工所產生的熱影響區以獲得較佳品質的穿透孔的優點，且不需於噴砂加工前先製作光罩的程序，可節省玻璃穿孔作業的時間，提升玻璃加工的效率及品質。 The processing method of the glass of the invention adopts energy beam processing or chemical etching processing combined with sandblasting processing to become a composite glass processing method, and the energy beam processing can be quickly hardened. The exact position of the rigidized zone forms the advantage of the groove, and the advantage of using the sandblasting to remove the heat affected zone generated by the energy beam processing to obtain a better quality through hole, and does not need to make a mask before the sandblasting process The program can save time in glass perforation and improve the efficiency and quality of glass processing.
以上所記載者，僅為利用本發明技術內容之實施例，任何熟悉本項技藝者運用本發明所為之修飾、變化，皆屬本創作所主張之專利範圍。 The above descriptions are only examples of the use of the technical content of the present invention, and any modifications and variations made by those skilled in the art using the present invention are within the scope of the patent claimed.
(1)、(2)、(3)、(4)‧‧‧分別為實施本發明的步驟編號 (1), (2), (3), (4) ‧ ‧ ‧ are the step numbers for implementing the invention
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW445213B (en) * | 2000-01-03 | 2001-07-11 | Wisertek Internat Corp | Manufacturing method for wafer of ink-jet nozzle |
| TW200624861A (en) * | 2004-09-27 | 2006-07-16 | Idc Llc | Method and device for generating white in an interferometric modulator display |
| TW201233648A (en) * | 2011-03-10 | 2012-08-16 | Hi Bound Technology Co Ltd | Processing device and method for glass plate |
-
2012
- 2012-05-30 TW TW101119434A patent/TWI481474B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW445213B (en) * | 2000-01-03 | 2001-07-11 | Wisertek Internat Corp | Manufacturing method for wafer of ink-jet nozzle |
| TW200624861A (en) * | 2004-09-27 | 2006-07-16 | Idc Llc | Method and device for generating white in an interferometric modulator display |
| TW201233648A (en) * | 2011-03-10 | 2012-08-16 | Hi Bound Technology Co Ltd | Processing device and method for glass plate |
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| Publication number | Publication date |
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| TW201347917A (en) | 2013-12-01 |
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