TWI477660B - 凸塊成形用非氰系電解鍍金浴 - Google Patents
凸塊成形用非氰系電解鍍金浴 Download PDFInfo
- Publication number
- TWI477660B TWI477660B TW097129689A TW97129689A TWI477660B TW I477660 B TWI477660 B TW I477660B TW 097129689 A TW097129689 A TW 097129689A TW 97129689 A TW97129689 A TW 97129689A TW I477660 B TWI477660 B TW I477660B
- Authority
- TW
- Taiwan
- Prior art keywords
- bump
- gold
- plating bath
- film
- sulfite
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007205410 | 2007-08-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200925336A TW200925336A (en) | 2009-06-16 |
TWI477660B true TWI477660B (zh) | 2015-03-21 |
Family
ID=40389722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097129689A TWI477660B (zh) | 2007-08-07 | 2008-08-05 | 凸塊成形用非氰系電解鍍金浴 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5336785B2 (ja) |
KR (1) | KR20090014992A (ja) |
CN (1) | CN101363128B (ja) |
TW (1) | TWI477660B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5442400B2 (ja) * | 2009-11-13 | 2014-03-12 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
WO2011118537A1 (ja) * | 2010-03-26 | 2011-09-29 | メタローテクノロジーズジャパン株式会社 | シアン系電解金めっき浴及びそれを用いるめっき方法 |
JP5620798B2 (ja) * | 2010-12-01 | 2014-11-05 | メタローテクノロジーズジャパン株式会社 | 金バンプ形成用非シアン系電解金めっき浴、及び金バンプ形成方法 |
CN102254891A (zh) * | 2011-08-01 | 2011-11-23 | 三星半导体(中国)研究开发有限公司 | 倒装芯片封装结构及其制造方法 |
JP6011074B2 (ja) * | 2012-01-20 | 2016-10-19 | 富士通株式会社 | 電子装置の製造方法及び電子装置の製造装置 |
CN103290440B (zh) * | 2012-02-22 | 2016-12-14 | 美泰乐科技(日本)股份有限公司 | 金凸点形成用非氰系电解镀金浴及金凸点形成方法 |
KR101464343B1 (ko) * | 2013-04-02 | 2014-11-28 | 한밭대학교 산학협력단 | 범프 형성용 비시안계 금 도금욕 및 범프의 형성방법 |
JP6393526B2 (ja) * | 2014-06-11 | 2018-09-19 | メタローテクノロジーズジャパン株式会社 | シアン系電解金めっき浴及びこれを用いるバンプ形成方法 |
JP6659247B2 (ja) * | 2015-06-16 | 2020-03-04 | デクセリアルズ株式会社 | 接続体、接続体の製造方法、検査方法 |
CN105401180A (zh) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | 一种耐磨镀金膜的电镀液及其电镀方法 |
CN105401181A (zh) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | 一种环保无氰镀金电镀液的电镀方法 |
CN113913879B (zh) * | 2021-09-30 | 2022-08-09 | 深圳市联合蓝海黄金材料科技股份有限公司 | 无氰电镀金镀液及其应用和电镀制金凸块的方法以及金凸块和电子部件 |
KR102477921B1 (ko) * | 2021-11-11 | 2022-12-14 | 마츠다 산교 가부시끼가이샤 | 무시안 전해 금 도금액 |
JP7017664B1 (ja) * | 2021-11-11 | 2022-02-08 | 松田産業株式会社 | ノーシアン電解金めっき液 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6511589B1 (en) * | 2001-08-17 | 2003-01-28 | Electroplating Engineers Of Japan Limited | Gold plating solution and gold plating method using thereof |
US20050056545A1 (en) * | 2002-03-13 | 2005-03-17 | Mitsubishi Chemical Corporation | Gold plating solution and gold plating method |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006322037A (ja) * | 2005-05-18 | 2006-11-30 | Electroplating Eng Of Japan Co | 金めっき液 |
JP4713289B2 (ja) * | 2005-09-30 | 2011-06-29 | エヌ・イーケムキャット株式会社 | バンプ形成用非シアン系電解金めっき浴 |
JP4713290B2 (ja) * | 2005-09-30 | 2011-06-29 | エヌ・イーケムキャット株式会社 | 金バンプ又は金配線の形成方法 |
JP2009062584A (ja) * | 2007-09-06 | 2009-03-26 | Ne Chemcat Corp | バンプ形成用非シアン系電解金めっき浴及びバンプ形成方法 |
JP2009071093A (ja) * | 2007-09-14 | 2009-04-02 | Ne Chemcat Corp | バンプ及びバンプ形成方法 |
-
2008
- 2008-07-30 JP JP2008195566A patent/JP5336785B2/ja active Active
- 2008-08-05 TW TW097129689A patent/TWI477660B/zh active
- 2008-08-06 KR KR1020080076964A patent/KR20090014992A/ko active Search and Examination
- 2008-08-07 CN CN2008101458670A patent/CN101363128B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6511589B1 (en) * | 2001-08-17 | 2003-01-28 | Electroplating Engineers Of Japan Limited | Gold plating solution and gold plating method using thereof |
US20050056545A1 (en) * | 2002-03-13 | 2005-03-17 | Mitsubishi Chemical Corporation | Gold plating solution and gold plating method |
Also Published As
Publication number | Publication date |
---|---|
JP5336785B2 (ja) | 2013-11-06 |
TW200925336A (en) | 2009-06-16 |
JP2009057631A (ja) | 2009-03-19 |
CN101363128B (zh) | 2011-12-14 |
CN101363128A (zh) | 2009-02-11 |
KR20090014992A (ko) | 2009-02-11 |
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