TWI474767B - 多層撓性印刷佈線板及其製造方法及部分多層撓性印刷佈線板 - Google Patents

多層撓性印刷佈線板及其製造方法及部分多層撓性印刷佈線板 Download PDF

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Publication number
TWI474767B
TWI474767B TW99126883A TW99126883A TWI474767B TW I474767 B TWI474767 B TW I474767B TW 99126883 A TW99126883 A TW 99126883A TW 99126883 A TW99126883 A TW 99126883A TW I474767 B TWI474767 B TW I474767B
Authority
TW
Taiwan
Prior art keywords
double
flexible printed
wiring board
printed wiring
wiring layer
Prior art date
Application number
TW99126883A
Other languages
English (en)
Chinese (zh)
Other versions
TW201117692A (en
Inventor
Kazuhiro Hashimoto
Syohei Morimoto
Yoshinori Kawakami
Norihiro Yamaguchi
Original Assignee
Tatsuta Densen Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Densen Kk filed Critical Tatsuta Densen Kk
Publication of TW201117692A publication Critical patent/TW201117692A/zh
Application granted granted Critical
Publication of TWI474767B publication Critical patent/TWI474767B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW99126883A 2009-08-12 2010-08-12 多層撓性印刷佈線板及其製造方法及部分多層撓性印刷佈線板 TWI474767B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009187306A JP4768059B2 (ja) 2009-08-12 2009-08-12 多層フレキシブルプリント配線板

Publications (2)

Publication Number Publication Date
TW201117692A TW201117692A (en) 2011-05-16
TWI474767B true TWI474767B (zh) 2015-02-21

Family

ID=42180882

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99126883A TWI474767B (zh) 2009-08-12 2010-08-12 多層撓性印刷佈線板及其製造方法及部分多層撓性印刷佈線板

Country Status (5)

Country Link
JP (1) JP4768059B2 (ja)
KR (1) KR101580203B1 (ja)
CN (1) CN102474985B (ja)
TW (1) TWI474767B (ja)
WO (1) WO2011018862A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422291B (zh) * 2011-04-20 2014-01-01 Adv Flexible Circuits Co Ltd Multi-layer stacked circuit cable with local separation section
US8895864B2 (en) * 2012-03-30 2014-11-25 Nokia Corporation Deformable apparatus and method
CN103635036A (zh) * 2012-08-22 2014-03-12 富葵精密组件(深圳)有限公司 柔性多层电路板及其制作方法
EP2991460B1 (en) 2014-08-29 2018-11-21 Nokia Technologies OY An apparatus and associated methods for deformable electronics
CN105682354A (zh) * 2016-02-25 2016-06-15 广东欧珀移动通信有限公司 软硬结合板及终端
US11277924B2 (en) 2017-08-04 2022-03-15 Fujikura Ltd. Method for manufacturing multilayer printed wiring board and multilayer printed wiring board
CN107949152B (zh) * 2017-11-30 2024-04-09 广州兴森快捷电路科技有限公司 刚挠结合线路板的制作方法
KR20210020673A (ko) * 2019-08-16 2021-02-24 삼성전기주식회사 인쇄회로기판
CN110557894A (zh) * 2019-10-15 2019-12-10 深圳市华旭达精密电路科技有限公司 一种多层镂空软板开盖工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258426A (ja) * 2002-03-07 2003-09-12 Cmk Corp リジッド・フレックス多層基板
TW200631482A (en) * 2005-02-25 2006-09-01 Samsung Electro Mech Rigid flexible printed circuit board and method of fabricating same
JP2006299209A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd ボンディングシートとそれを用いた多層フレキシブルプリント配線板
TW200810654A (en) * 2006-01-31 2008-02-16 Sony Corp Printed circuit board assembly and method of manufacturing the same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06204664A (ja) * 1992-12-28 1994-07-22 Dai Ichi Kogyo Seiyaku Co Ltd 多層化基板
JP3311899B2 (ja) * 1995-01-20 2002-08-05 松下電器産業株式会社 回路基板及びその製造方法
JPH10190158A (ja) * 1996-12-27 1998-07-21 Cmk Corp リジッド・フレックスプリント配線板およびその製造方法
JP2000036664A (ja) * 1998-05-14 2000-02-02 Matsushita Electric Ind Co Ltd 多層配線基板およびその製造方法
SG86345A1 (en) * 1998-05-14 2002-02-19 Matsushita Electric Ind Co Ltd Circuit board and method of manufacturing the same
JP3744383B2 (ja) * 2000-06-09 2006-02-08 松下電器産業株式会社 複合配線基板及びその製造方法
JP2002232135A (ja) * 2001-01-30 2002-08-16 Matsushita Electric Ind Co Ltd 積層用両面回路基板とその製造方法及びそれを用いた多層プリント配線板
JP2003133734A (ja) * 2001-10-24 2003-05-09 Nippon Mektron Ltd ケーブル部を有するフレキシブルプリント基板
CN1326155C (zh) 2002-05-31 2007-07-11 大自达电线股份有限公司 导电糊、使用其的多层基板及其制造方法
JP4109156B2 (ja) 2002-05-31 2008-07-02 タツタ電線株式会社 導電性ペースト
JP2004296481A (ja) * 2003-03-25 2004-10-21 Nitto Denko Corp 多層配線回路基板
JP2005347414A (ja) 2004-06-01 2005-12-15 Hitachi Metals Ltd 接着シート及びそれを用いた両面プリント基板或いは多層プリント基板
JP2006066458A (ja) * 2004-08-24 2006-03-09 Sharp Corp 多層プリント配線板及び多層プリント配線板の製造方法
JP2006179679A (ja) 2004-12-22 2006-07-06 Fujikura Ltd フレキシブルプリント配線板及びその製造方法
JP4481184B2 (ja) * 2005-02-07 2010-06-16 日本メクトロン株式会社 多層フレキシブル回路基板の製造方法
JP4237726B2 (ja) 2005-04-25 2009-03-11 パナソニック電工株式会社 フレキシブルプリント配線板用基材入り接着シート及びその製造方法、多層フレキシブルプリント配線板、フレックスリジッドプリント配線板
JP2006324406A (ja) * 2005-05-18 2006-11-30 Sharp Corp フレックスリジッド多層配線板
JP2007059822A (ja) * 2005-08-26 2007-03-08 Nippon Steel Chem Co Ltd ヒンジ基板及びその製造方法
JP4817771B2 (ja) * 2005-09-09 2011-11-16 株式会社フジクラ 多層プリント配線板の製造方法
TW200740334A (en) * 2005-10-20 2007-10-16 Matsushita Electric Ind Co Ltd Multilayer printed wiring board and its manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258426A (ja) * 2002-03-07 2003-09-12 Cmk Corp リジッド・フレックス多層基板
TW200631482A (en) * 2005-02-25 2006-09-01 Samsung Electro Mech Rigid flexible printed circuit board and method of fabricating same
JP2006299209A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd ボンディングシートとそれを用いた多層フレキシブルプリント配線板
TW200810654A (en) * 2006-01-31 2008-02-16 Sony Corp Printed circuit board assembly and method of manufacturing the same

Also Published As

Publication number Publication date
JP4768059B2 (ja) 2011-09-07
KR20120071387A (ko) 2012-07-02
CN102474985B (zh) 2015-11-25
JP2011040607A (ja) 2011-02-24
KR101580203B1 (ko) 2015-12-24
CN102474985A (zh) 2012-05-23
WO2011018862A1 (en) 2011-02-17
TW201117692A (en) 2011-05-16

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