TWI468707B - Insert for handler with mesh sheet and insert for handler - Google Patents
Insert for handler with mesh sheet and insert for handler Download PDFInfo
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- TWI468707B TWI468707B TW102110685A TW102110685A TWI468707B TW I468707 B TWI468707 B TW I468707B TW 102110685 A TW102110685 A TW 102110685A TW 102110685 A TW102110685 A TW 102110685A TW I468707 B TWI468707 B TW I468707B
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- insert
- processor
- hole
- semiconductor device
- mesh
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
本申請案主張2012年3月26號向韓國智慧財產局申請的韓國專利申請案第10-2012-0030724號的利益，其揭露內容以全文引用的方式併入本文中。 The present application claims the benefit of Korean Patent Application No. 10-2012-0030724, filed on March 26, 2012, to the Korean Intellectual Property Office, the disclosure of which is hereby incorporated by reference.
本發明是關於具有網片的處理器用插件，且更特定言之，是關於易於製造且其端子不太可能由於與半導體裝置頻繁接觸而分離的具有網片的處理器用插件，以及處理器用插件。 BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a processor insert having a mesh, and more particularly to a processor insert having a mesh that is easy to manufacture and whose terminals are less likely to be separated due to frequent contact with the semiconductor device, and a processor insert.
一般而言，藉由半導體裝置製造程序製造的半導體裝置在所述半導體裝置的發佈之前經歷可靠性測試，諸如，電特性測試或功能測試。此處，所製造的半導體裝置轉移到測試裝置，且處理器用插件主要用作對經測試的半導體裝置進行分類的裝置。 In general, a semiconductor device fabricated by a semiconductor device manufacturing process undergoes a reliability test such as an electrical property test or a functional test before the release of the semiconductor device. Here, the manufactured semiconductor device is transferred to the test device, and the processor plug-in is mainly used as a device for classifying the tested semiconductor device.
處理器將多個半導體裝置轉移到測試裝置中，且使每一半導體裝置與測試頭電接觸，以便執行測試。處理器將經測試的 半導體裝置中的每一者自測試裝置取出，且根據測試結果對所述半導體裝置進行分類。此時，處理器將配置有容納所述半導體裝置的多個插件的測試託盤轉移到測試裝置中，以便執行測試。 The processor transfers the plurality of semiconductor devices into the test device and electrically contacts each of the semiconductor devices with the test head to perform the test. The processor will be tested Each of the semiconductor devices is taken out of the test device, and the semiconductor device is classified according to the test results. At this time, the processor transfers the test tray configured to accommodate the plurality of plug-ins of the semiconductor device to the test device to perform the test.
關於此種處理器用插件的先前技術揭露於韓國專利第0659153號中。換言之，圖1及圖2中的處理器用插件10為用於半導體封裝的插件，其包含本體70，所述本體70具有供***且容納包含外部連接端子的半導體封裝的空間、上表面及下表面。處理器用插件10包含支撐部分50，所述支撐部分50連接至本體70，且支撐所容納的半導體封裝。支撐部分50在整個上表面中與外部連接端子接觸，且電連接所述外部連接端子與測試插座。 The prior art regarding such a processor plug-in is disclosed in Korean Patent No. 0659153. In other words, the processor insert 10 of FIGS. 1 and 2 is an insert for a semiconductor package that includes a body 70 having a space, an upper surface, and a lower surface for inserting and housing a semiconductor package including external connection terminals. . The processor insert 10 includes a support portion 50 that is coupled to the body 70 and that supports the contained semiconductor package. The support portion 50 is in contact with the external connection terminal in the entire upper surface, and electrically connects the external connection terminal and the test socket.
具體而言，多個第一接觸襯墊51形成於支撐部分50的上表面上，以對應於半導體封裝20的多個導電球30，且電連接至導電球30。第一接觸襯墊51經形成而一對一地對應於導電球30，且具有與導電球30的間距C相同的間距C。由於支撐部分50在整個上表面中支撐半導體封裝20同時與導電球30接觸，因此支撐部分50甚至可穩定地支撐最外導電球30與半導體封裝20的邊緣之間的間隔B窄達0.2毫米或0.2毫米以下的半導體封裝20。同時，多個第二接觸襯墊52形成於支撐部分50的下表面上，以電連接至測試插座(圖中未示)的連接端子(圖中未示)。第二接觸襯墊52分別經由通過支撐部分50的通孔53而電連接至第一接觸襯墊51。導電材料填充於通孔53中。第二接觸襯墊52的間距C經設定而與第一接觸襯墊51的間距相同。以此方式，半導體封 裝20的導電球30經由第二接觸襯墊52的電連接而電連接至測試插座的連接端子。 Specifically, a plurality of first contact pads 51 are formed on the upper surface of the support portion 50 to correspond to the plurality of conductive balls 30 of the semiconductor package 20 and electrically connected to the conductive balls 30. The first contact pads 51 are formed to correspond one-to-one to the conductive balls 30, and have the same pitch C as the pitch C of the conductive balls 30. Since the support portion 50 supports the semiconductor package 20 in the entire upper surface while being in contact with the conductive ball 30, the support portion 50 can even stably support the interval B between the outermost conductive ball 30 and the edge of the semiconductor package 20 as narrow as 0.2 mm or A semiconductor package 20 of 0.2 mm or less. At the same time, a plurality of second contact pads 52 are formed on the lower surface of the support portion 50 to be electrically connected to connection terminals (not shown) of a test socket (not shown). The second contact pads 52 are electrically connected to the first contact pads 51 via via holes 53 through the support portions 50, respectively. A conductive material is filled in the through hole 53. The pitch C of the second contact pads 52 is set to be the same as the pitch of the first contact pads 51. In this way, the semiconductor package The conductive ball 30 of the package 20 is electrically connected to the connection terminal of the test socket via the electrical connection of the second contact pad 52.
根據先前技術的處理器用插件具有以下問題。 The processor plug-in according to the prior art has the following problems.
大量的半導體封裝20的導電球30與配置於支撐部分50的上表面上的第一接觸襯墊51接觸。在此過程中，第一接觸襯墊51可能會與支撐部分50分離。換言之，由於第一接觸襯墊51是藉由附著至支撐部分50的上表面而形成，因此存在以下問題：第一接觸襯墊51可能會由於由半導體封裝20的導電球30造成的衝擊而與支撐部分50分離。 A large number of conductive balls 30 of the semiconductor package 20 are in contact with the first contact pads 51 disposed on the upper surface of the support portion 50. During this process, the first contact pad 51 may be separated from the support portion 50. In other words, since the first contact pad 51 is formed by being attached to the upper surface of the support portion 50, there is a problem that the first contact pad 51 may be affected by the impact caused by the conductive ball 30 of the semiconductor package 20. The support portion 50 is separated.
此外，由於需要個別地形成第一接觸襯墊51、第二接觸襯墊52與通孔53以便將導電性應用於支撐部分50，因此存在以下問題：製造程序不簡單，且製造成本過高。 Further, since it is necessary to separately form the first contact pad 51, the second contact pad 52, and the through hole 53 to apply conductivity to the support portion 50, there is a problem that the manufacturing process is not simple and the manufacturing cost is too high.
此外，常用的支撐部分50是由薄膜狀樹脂薄片構成。然而，樹脂薄片整體缺乏可撓性，或具有高可撓性的樹脂薄片由於低強度而不佳。 Further, the conventional support portion 50 is composed of a film-like resin sheet. However, the resin sheet as a whole lacks flexibility, or a resin sheet having high flexibility is not preferable due to low strength.
特定言之，當支撐部分50缺乏可撓性時，半導體封裝20的所有導電球30不會完全與第一接觸襯墊51接觸，此情形導致整個測試的可靠性問題。在先前技術中，額外附著由導電橡膠構成的輔助薄片，以便解決上述問題。然而，當額外附著輔助薄片時，其因為整體製造成本增加而不佳。 In particular, when the support portion 50 lacks flexibility, all of the conductive balls 30 of the semiconductor package 20 are not completely in contact with the first contact pads 51, which causes reliability problems throughout the test. In the prior art, an auxiliary sheet composed of a conductive rubber is additionally attached in order to solve the above problem. However, when the auxiliary sheet is additionally attached, it is not preferable because the overall manufacturing cost is increased.
本發明提供一種處理器用插件，其中端子不太可能與所述處理器用插件分離且所述處理器用插件容易製造。 The present invention provides a plug-in for a processor in which the terminals are less likely to be separated from the processor plug-in and the processor is easy to manufacture with the plug-in.
本發明亦提供一種處理器用插件，所述處理器用插件具有能夠維持強度同時維持可撓性的支撐構件。 The present invention also provides an insert for a processor having a support member capable of maintaining strength while maintaining flexibility.
根據本發明的態樣，提供一種具有網片的處理器用插件，所述處理器用插件在所述處理器用插件容納設有多個端子的半導體裝置的狀態中朝向外部連接器移動，以使所述端子與所述連接器接觸，所述處理器用插件包含：插件本體，其中部中形成有貫孔，所述半導體裝置***至所述貫孔中；以及支撐構件，其經配置以跨越所述插件本體的所述貫孔且支撐所述半導體裝置，以使得穿過所述貫孔***的所述半導體裝置維持於所述貫孔內，其中所述支撐構件包含：所述網片，其設有多個空穴，從而使所述網片的上表面與下表面彼此連通；以及多個電極，其配置於對應於所述半導體裝置的所述端子的位置處，且由填充於所述空穴中的導電材料形成。 According to an aspect of the present invention, there is provided a processor insert having a mesh, the processor being moved toward an external connector in a state in which the processor inserts a semiconductor device provided with a plurality of terminals with a card, so that the a terminal is in contact with the connector, the processor insert comprising: a plug body having a through hole formed therein, the semiconductor device being inserted into the through hole; and a support member configured to span the insert The through hole of the body and supporting the semiconductor device such that the semiconductor device inserted through the through hole is maintained in the through hole, wherein the support member comprises: the mesh, which is provided a plurality of holes such that an upper surface and a lower surface of the mesh are in communication with each other; and a plurality of electrodes disposed at positions corresponding to the terminals of the semiconductor device and filled by the holes The conductive material is formed.
所述電極的頂表面可能夠與所述半導體裝置的所述端子接觸，且電極的底表面可能夠與所述連接器接觸。 A top surface of the electrode may be capable of contacting the terminal of the semiconductor device, and a bottom surface of the electrode may be capable of contacting the connector.
所述電極可鍍敷且結合至所述網片。 The electrode can be plated and bonded to the mesh.
所述支撐構件可包含與所述插件本體的下表面接觸的插件接觸部分，且所述插件接觸部分可包含網片以及經配置以填充所述網片的空穴的鍍敷層。 The support member can include a card contact portion that contacts a lower surface of the insert body, and the insert contact portion can include a mesh and a plating layer configured to fill voids of the mesh.
緊固件孔可形成於所述插件接觸部分中，通過所述緊固 件孔的緊固單元使所述支撐構件緊固至所述插件本體。 a fastener hole may be formed in the plug contact portion by the fastening A fastening unit of the hole of the piece fastens the support member to the insert body.
所述緊固單元可包含螺栓或自所述插件本體向下延伸的突起部分。 The fastening unit may include a bolt or a protruding portion extending downward from the insert body.
引導薄片可配置於所述支撐構件與所述插件本體之間，所述引導薄片可具有在對應於所述半導體裝置的所述端子的位置處形成的引導孔。 A guide sheet may be disposed between the support member and the insert body, and the guide sheet may have a guide hole formed at a position corresponding to the terminal of the semiconductor device.
所述引導薄片的所述引導孔的直徑可等於或大於所述半導體裝置的所述端子的直徑。 The diameter of the guiding hole of the guiding sheet may be equal to or larger than the diameter of the terminal of the semiconductor device.
所述引導薄片可由絕緣樹脂薄片形成。 The guide sheet may be formed of an insulating resin sheet.
所述引導薄片可由聚亞醯胺膜(kapton)、FR4、FR5、XPC及聚醯亞胺中的任一者形成。 The guide sheet may be formed of any one of a polyimide film (kapton), FR4, FR5, XPC, and polyimine.
根據本發明的另一態樣，提供一種處理器用插件，所述處理器用插件在所述處理器用插件容納設有多個端子的半導體裝置的狀態中朝向外部連接器移動，以使所述端子與所述連接器接觸，所述處理器用插件包含：插件本體，其中部中形成有貫孔，所述半導體裝置***至所述貫孔中；以及支撐構件，其經配置以跨越所述插件本體的所述貫孔，支撐所述半導體裝置，以使得穿過所述貫孔***的所述半導體裝置維持於所述貫孔內，且可拆卸地耦接至所述插件本體的下端，其中所述支撐構件包含：多孔薄片，其設有多個空穴，從而使網片的上表面與下表面彼此連通，且是由絕緣材料形成；以及多個電極，其配置於對應於所述半導體裝置的所述端子的位置處，自所述多孔薄片的上表面及下表面 突起，且在所述多孔薄片的平面方向上彼此分離。 According to another aspect of the present invention, a processor insert is provided, wherein the processor is moved toward an external connector in a state in which the processor inserts a semiconductor device provided with a plurality of terminals with a card, so that the terminal is Contacted by the connector, the processor insert includes: a plug body having a through hole formed therein, the semiconductor device being inserted into the through hole; and a support member configured to span the plug body The through hole supports the semiconductor device such that the semiconductor device inserted through the through hole is maintained in the through hole and detachably coupled to a lower end of the insert body, wherein The support member includes: a porous sheet provided with a plurality of holes such that an upper surface and a lower surface of the mesh are in communication with each other, and is formed of an insulating material; and a plurality of electrodes disposed in correspondence with the semiconductor device The position of the terminal from the upper surface and the lower surface of the porous sheet The protrusions are separated from each other in the planar direction of the porous sheet.
所述多孔薄片可為網眼織物或非編織織物。 The porous sheet may be a mesh fabric or a non-woven fabric.
10‧‧‧處理器用插件 10‧‧‧Processor plugin
20‧‧‧半導體封裝 20‧‧‧Semiconductor package
30‧‧‧導電球 30‧‧‧Electrical ball
50‧‧‧支撐部分 50‧‧‧Support section
51‧‧‧第一接觸襯墊 51‧‧‧First contact pad
52‧‧‧第二接觸襯墊 52‧‧‧Second contact pad
53‧‧‧通孔 53‧‧‧through hole
70‧‧‧本體 70‧‧‧ body
100‧‧‧處理器用插件 100‧‧‧Processor plugin
110‧‧‧插件本體 110‧‧‧ plugin ontology
111‧‧‧貫孔 111‧‧‧through holes
120‧‧‧支撐構件 120‧‧‧Support members
121‧‧‧網片 121‧‧‧ mesh
122‧‧‧電極 122‧‧‧ electrodes
123‧‧‧插件接觸部分 123‧‧‧ plug-in contact
123a‧‧‧鍍敷層 123a‧‧‧ plating layer
123b‧‧‧緊固件孔 123b‧‧‧ fastener holes
124‧‧‧中央孔 124‧‧‧Central hole
125‧‧‧緊固單元 125‧‧‧ fastening unit
130‧‧‧半導體裝置 130‧‧‧Semiconductor device
131‧‧‧端子 131‧‧‧terminal
200‧‧‧處理器用插件 200‧‧‧Processor plug-in
210‧‧‧插件本體 210‧‧‧ plugin ontology
211‧‧‧貫孔 211‧‧‧through holes
220‧‧‧支撐構件 220‧‧‧Support members
221‧‧‧網片 221‧‧‧ mesh
222‧‧‧電極 222‧‧‧electrode
230‧‧‧引導薄片 230‧‧‧ Guide sheet
231‧‧‧引導孔 231‧‧‧ Guide hole
藉由參看附圖詳細描述本發明的例示性實施例，本發明的以上以及其他特徵以及優點將變得更顯而易見。 The above as well as other features and advantages of the present invention will become more apparent from the detailed description of the exemplary embodiments.
圖1為繪示根據先前技術的處理器用插件的圖式。 1 is a diagram showing a plug-in for a processor according to the prior art.
圖2為圖1的放大橫截面圖。 Figure 2 is an enlarged cross-sectional view of Figure 1.
圖3為根據本發明的實施例的處理器用插件的俯視分解透視圖。 3 is a top exploded perspective view of a processor insert in accordance with an embodiment of the present invention.
圖4為圖3的處理器用插件的前視圖。 4 is a front elevational view of the processor plug-in of FIG. 3.
圖5為圖3的處理器用插件的仰視透視圖。 Figure 5 is a bottom perspective view of the processor insert of Figure 3.
圖6為圖3的處理器用插件的後視圖。 Figure 6 is a rear elevational view of the processor plug-in of Figure 3.
圖7為繪示圖3的處理器用插件的操作狀態的橫截面圖。 Figure 7 is a cross-sectional view showing the operational state of the processor insert of Figure 3.
圖8為根據本發明的另一實施例的處理器用插件的分解圖。 Figure 8 is an exploded view of a plug-in for a processor in accordance with another embodiment of the present invention.
圖9為繪示圖8的處理器用插件的操作狀態的橫截面圖。 Figure 9 is a cross-sectional view showing the operational state of the processor insert of Figure 8.
下文中，將參考附圖詳細描述根據本發明的實施例的處理器用插件100。 Hereinafter, a processor plug-in 100 according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
根據本發明的處理器用插件100在所述處理器用插件100容納設有多個端子131的半導體裝置130的狀態中朝向外部接 觸器(圖中未示)移動，以使端子131能夠與所述接觸器接觸。處理器用插件100包含插件本體110及支撐構件120。 The processor insert 100 according to the present invention is externally connected in a state in which the processor insert 100 accommodates the semiconductor device 130 provided with a plurality of terminals 131. A contactor (not shown) is moved to enable the terminal 131 to be in contact with the contactor. The processor insert 100 includes a plug body 110 and a support member 120.
可供***半導體裝置130的貫孔111形成於插件本體110的中央部分中。貫孔111經形成以自插件本體110的上端延伸至下端。貫孔111具有足以使待測試的半導體裝置130***其中的大小。 A through hole 111 into which the semiconductor device 130 can be inserted is formed in a central portion of the insert body 110. The through hole 111 is formed to extend from the upper end to the lower end of the insert body 110. The through hole 111 has a size enough to insert the semiconductor device 130 to be tested therein.
支撐構件120經配置以跨越插件本體110的貫孔111，且支撐半導體裝置130，以使得穿過貫孔111***的半導體裝置130維持於貫孔111內。因此，支撐構件120具有大於貫孔111的橫截面是較佳的。具有大致四邊形形狀的中央孔124形成於支撐構件120的中部中。支撐構件120具有多個電極122沿中央孔124的邊緣分佈的結構。電極122以具有預定厚度的帶的形式配置成電極122以預定間隔與中央孔124分離的狀態。與插件本體110的下表面接觸的插件接觸部分123沿支撐構件120的邊緣設置於電極122附近。 The support member 120 is configured to span the through hole 111 of the card body 110 and support the semiconductor device 130 such that the semiconductor device 130 inserted through the through hole 111 is maintained within the through hole 111. Therefore, it is preferable that the support member 120 has a cross section larger than the through hole 111. A central hole 124 having a substantially quadrangular shape is formed in the middle of the support member 120. The support member 120 has a structure in which a plurality of electrodes 122 are distributed along the edges of the center hole 124. The electrode 122 is configured in the form of a strip having a predetermined thickness in a state in which the electrode 122 is separated from the central hole 124 at a predetermined interval. The card contact portion 123 that is in contact with the lower surface of the insert body 110 is disposed near the electrode 122 along the edge of the support member 120.
支撐構件120包含網片121、電極122及插件接觸部分123。 The support member 120 includes a mesh 121, an electrode 122, and a card contact portion 123.
作為整體構成支撐構件120的加強構件的網片121設有多個空穴，所述空穴使網片的上表面與下表面彼此連通。較佳使用由有機纖維形成的網片121。 The mesh 121 as a reinforcing member constituting the support member 120 as a whole is provided with a plurality of cavities which allow the upper surface and the lower surface of the mesh to communicate with each other. A mesh sheet 121 formed of organic fibers is preferably used.
有機纖維的實例可包含氟樹脂纖維(諸如，聚(四氟乙烯)纖維)、芳族聚醯胺纖維(aramid fiber)、聚乙烯纖維、聚芳酯纖 維(polyarylate fiber)、耐綸纖維(nylon fiber)、聚酯纖維及其類似者。 Examples of the organic fiber may include a fluororesin fiber (such as poly(tetrafluoroethylene) fiber), an aramid fiber, a polyethylene fiber, a polyarylate fiber. Polyarylate fiber, nylon fiber, polyester fiber and the like.
較佳使用直徑為10微米至200微米的有機纖維。然而，支撐構件120不僅可使用網片121，而且可使用具有其他形狀中的任一者的多孔薄片，只要所述多孔薄片具有多個空穴即可。舉例而言，可使用具有多個空穴且由有機纖維構成的非編織織物。較佳使用藉由使用有機纖維的短纖維作為原材料而經由濕式方法製造且其中具有空穴的非編織織物。 Organic fibers having a diameter of from 10 micrometers to 200 micrometers are preferably used. However, the support member 120 may use not only the mesh sheet 121 but also a porous sheet having any of other shapes as long as the porous sheet has a plurality of holes. For example, a non-woven fabric having a plurality of cavities and composed of organic fibers can be used. A non-woven fabric produced by a wet method and having voids therein by using short fibers of organic fibers as a raw material is preferably used.
網片121具有50微米至500微米、更佳80微米至400微米的厚度是較佳的。然而，本發明不限於此，且一般熟習此項技術者可考慮到貫孔111的大小及其類似者以及必要的支撐力而在需要時選擇厚度。 It is preferable that the mesh sheet 121 has a thickness of 50 μm to 500 μm, more preferably 80 μm to 400 μm. However, the present invention is not limited thereto, and those skilled in the art can generally select the thickness as needed in consideration of the size of the through hole 111 and the like and the necessary supporting force.
電極122可經配置以對應於半導體裝置130的端子131，且可經配置以填充形成於網片121中的空穴。此時，可藉由填充所述空穴而與網片121一體地製造電極122。可如下執行電極122的整合程序。 The electrode 122 can be configured to correspond to the terminal 131 of the semiconductor device 130 and can be configured to fill voids formed in the mesh 121. At this time, the electrode 122 can be manufactured integrally with the mesh sheet 121 by filling the holes. The integration procedure of the electrodes 122 can be performed as follows.
首先，藉由使用例如乾膜抗蝕劑而在網片121上形成抗蝕劑層。關於形成有抗蝕劑層的網片121，沿對應於將形成的電極122的圖案的圖案而在抗蝕劑層(圖中未示)中形成多個圖案孔(圖中未示)。 First, a resist layer is formed on the mesh 121 by using, for example, a dry film resist. Regarding the mesh 121 on which the resist layer is formed, a plurality of pattern holes (not shown) are formed in a resist layer (not shown) along a pattern corresponding to the pattern of the electrode 122 to be formed.
接著，藉由在堆疊材料層上執行鍍敷而在抗蝕劑層的圖案孔內形成作為一體連接至網片121的電極122。 Next, an electrode 122 integrally connected to the mesh 121 is formed in the pattern holes of the resist layer by performing plating on the stacked material layer.
此後，藉由自堆疊材料層移除抗蝕劑層而獲得支撐構件120。作為用於形成電極122的鍍敷，可使用電鍍及無電極鍍敷。 Thereafter, the support member 120 is obtained by removing the resist layer from the layer of stacked material. As the plating for forming the electrode 122, electroplating and electrodeless plating can be used.
然而，電極122的形成不限於此，且可使用任何方法，只要電極122可與網片121一體地形成即可。 However, the formation of the electrode 122 is not limited thereto, and any method may be used as long as the electrode 122 can be integrally formed with the mesh 121.
可由銅或可易於鍍敷且具有極佳導電性的任何材料形成電極122。當然，可在電極122中額外形成用於改良導電性的鍍金層123a。此外，可將金剛石粉末、鎳粉末或其組合結合至電極122的表面以改良其導電性。 The electrode 122 can be formed of copper or any material that can be easily plated and has excellent electrical conductivity. Of course, a gold plating layer 123a for improving conductivity may be additionally formed in the electrode 122. Further, diamond powder, nickel powder, or a combination thereof may be bonded to the surface of the electrode 122 to improve its conductivity.
電極122的頂表面可與半導體裝置130的端子131直接接觸，且其底表面可與外部連接器直接接觸。然而，本發明不限於此，且電極122可經由單獨構件與端子131或外部連接器間接接觸。 The top surface of the electrode 122 may be in direct contact with the terminal 131 of the semiconductor device 130, and the bottom surface thereof may be in direct contact with the external connector. However, the invention is not limited thereto, and the electrode 122 may be in indirect contact with the terminal 131 or an external connector via a separate member.
與插件本體110的下表面接觸的插件接觸部分123經配置而以預定間隔與電極122分離。插件接觸部分123包含網片121及鍍敷層123a。鍍敷層123a經配置以填充網片121的空穴，且具有預定厚度。鍍敷層123a形成於插件接觸部分123中以使得插件接觸部分123具有高於網片121的強度，且因此插件接觸部分123可可靠地支撐半導體裝置130。 The card contact portion 123 that is in contact with the lower surface of the card body 110 is configured to be separated from the electrode 122 at a predetermined interval. The card contact portion 123 includes a mesh 121 and a plating layer 123a. The plating layer 123a is configured to fill the voids of the mesh sheet 121 and has a predetermined thickness. The plating layer 123a is formed in the card contact portion 123 such that the card contact portion 123 has a higher strength than the mesh 121, and thus the card contact portion 123 can reliably support the semiconductor device 130.
使支撐構件120緊固至插件本體110的多個緊固件孔123b配置於插件接觸部分123中，以預定間隔彼此分離。緊固件孔123b為可供***諸如螺栓的緊固單元125的孔。用作緊固單元125的螺栓***至緊固件孔123b中以藉此緊固至插件本體110的 下端，藉此使支撐構件120附著至插件本體110。 A plurality of fastener holes 123b that fasten the support member 120 to the insert body 110 are disposed in the insert contact portion 123, separated from each other at a predetermined interval. The fastener hole 123b is a hole into which the fastening unit 125 such as a bolt can be inserted. A bolt serving as the fastening unit 125 is inserted into the fastener hole 123b to thereby be fastened to the insert body 110 The lower end thereby attaching the support member 120 to the insert body 110.
同時，除了螺栓之外，亦可將自插件本體110突起的突起部分***至緊固件孔123b中。舉例而言，由與插件本體110相同的材料形成的突起部分經由緊固件孔123b自支撐構件120突起，且所述突起部分藉由加熱而伸展以藉此執行與螺栓類似的功能。 At the same time, in addition to the bolt, a protruding portion protruding from the insert body 110 may be inserted into the fastener hole 123b. For example, the protruding portion formed of the same material as the insert body 110 protrudes from the support member 120 via the fastener hole 123b, and the protruding portion is stretched by heating to thereby perform a function similar to that of the bolt.
根據本發明的實施例的處理器用插件100具有如下操作及效果。 The processor plug-in 100 according to an embodiment of the present invention has the following operations and effects.
首先，根據本發明的處理器用插件100在所述處理器用插件100將待測試的半導體裝置130容納於插件本體110的貫孔111內的狀態中移動至將執行測試的位置。接著，處理器用插件100下降以與必要的外部接觸器接觸。此時，電極122的底表面與所述外部接觸器接觸，且半導體裝置130的端子131與電極122的頂表面接觸。此後，當經由外部連接器(例如，測試裝置的襯墊)施加預定信號時，所述信號經由端子131傳輸至半導體裝置130，且因此執行預定測試。 First, the processor insert 100 according to the present invention moves to a position where the test will be performed in a state where the processor insert 100 receives the semiconductor device 130 to be tested in the through hole 111 of the plug body 110. The processor is then lowered with the insert 100 to contact the necessary external contactor. At this time, the bottom surface of the electrode 122 is in contact with the external contactor, and the terminal 131 of the semiconductor device 130 is in contact with the top surface of the electrode 122. Thereafter, when a predetermined signal is applied via an external connector (for example, a pad of the test device), the signal is transmitted to the semiconductor device 130 via the terminal 131, and thus a predetermined test is performed.
在本發明的處理器用插件中，在處理器用插件與半導體裝置的端子頻繁接觸時或在處理器用插件與外部連接器頻繁接觸時，可防止端子與支撐構件分離。舉例而言，由於本發明的處理器用插件在每一端子填充於網片的空穴中的狀態中可靠地固定且耦接至網片，因此端子不太可能與支撐構件分離，且因此其耐久性增加。 In the processor insert of the present invention, when the processor insert is in frequent contact with the terminals of the semiconductor device or when the processor insert is in frequent contact with the external connector, the terminal can be prevented from being separated from the support member. For example, since the processor insert of the present invention is reliably fixed and coupled to the mesh in a state where each terminal is filled in the cavity of the mesh, the terminal is less likely to be separated from the support member, and thus it is durable. Increase in sex.
另一方面，先前技術的處理器用插件包含僅與薄片的通孔內側或僅與其附近進行表面接觸的端子，且因此存在端子可能與薄片分離的問題。 On the other hand, the prior art processor insert contains a terminal which is only in surface contact with the inside of the through hole of the sheet or only in the vicinity thereof, and thus there is a problem that the terminal may be separated from the sheet.
此外，在先前技術的處理器用插件中，端子可經由形成通孔的製程或其他複雜製程中的任一者而形成於薄片中。另一方面，在本發明的實施例中，存在如下優勢：製程相對簡化，此是因為網片是藉由電極鍍敷，而無需額外形成用於在網片中形成端子的孔。 Moreover, in prior art processor inserts, the terminals may be formed in the sheet via any of a process of forming a via or other complicated process. On the other hand, in the embodiment of the present invention, there is an advantage that the process is relatively simplified because the mesh is plated by electrodes without additionally forming holes for forming terminals in the mesh.
此外，在根據本發明的處理器用插件中，由於網片具有可撓性，因此甚至當半導體裝置的端子具有不同高度時，網片亦具有可撓性，以藉此容易地與半導體裝置的端子接觸。舉例而言，在先前技術中，當待測試的裝置的端子具有不規則高度時，所有端子及電極可能不會可靠性地彼此接觸，這是因為使用了由具有相對高硬度的材料形成的薄片。為解決此問題，可能會額外使用採用導電橡膠的薄片。然而，在本發明的實施例中，由於可充分使用網片的可撓性，因此不太可能發生上述問題。 Further, in the insert for a processor according to the present invention, since the mesh has flexibility, the mesh has flexibility even when the terminals of the semiconductor device have different heights, thereby easily connecting the terminals of the semiconductor device contact. For example, in the prior art, when the terminals of the device to be tested have an irregular height, all the terminals and the electrodes may not reliably contact each other because a sheet formed of a material having a relatively high hardness is used. . To solve this problem, an additional sheet of conductive rubber may be used. However, in the embodiment of the present invention, the above problem is unlikely to occur because the flexibility of the mesh sheet can be sufficiently utilized.
可考慮如下修改根據本發明的實施例的處理器用插件。 A processor plug-in according to an embodiment of the present invention can be modified as follows.
首先，根據本發明的另一實施例的處理器用插件200與上述實施例相同，相同之處在於處理器用插件200包含形成有貫孔211的插件本體210以及支撐構件220，如圖8及圖9中所示。然而，引導薄片230額外設置於支撐構件220(其包含網片221及電極222)與插件本體210之間。此時，引導薄片230在對應於 半導體裝置130的端子131的位置處包含可供***半導體裝置130的端子131的引導孔231。引導薄片230的引導孔231的直徑等於或稍大於半導體裝置130的端子131的直徑，以使得半導體裝置130的端子131容易地***至引導孔231中，藉此使半導體裝置130的端子131與位於端子131下方的支撐構件220的電極222接觸。換言之，根據當前實施例的引導薄片230配置於支撐構件220上方，且因此甚至當在半導體裝置130的端子131與支撐構件220的電極222之間發生位置偏離時，亦可對準端子的位置，藉此使半導體裝置的端子可靠地與電極接觸。引導薄片可由絕緣樹脂薄片形成，但本發明不限於此。只要材料具有極佳的抗熱性及可撓性，引導薄片即可由各種材料(諸如，聚亞醯胺膜、FR4、FR5、XPC或聚醯亞胺)中的任一者形成。 First, the processor insert 200 according to another embodiment of the present invention is the same as the above embodiment, except that the processor insert 200 includes the insert body 210 and the support member 220 formed with the through holes 211, as shown in FIGS. 8 and 9. Shown in . However, the guide sheet 230 is additionally disposed between the support member 220 (which includes the mesh 221 and the electrode 222) and the insert body 210. At this time, the guide sheet 230 corresponds to The position of the terminal 131 of the semiconductor device 130 includes a guiding hole 231 into which the terminal 131 of the semiconductor device 130 can be inserted. The diameter of the guiding hole 231 of the guiding sheet 230 is equal to or slightly larger than the diameter of the terminal 131 of the semiconductor device 130, so that the terminal 131 of the semiconductor device 130 is easily inserted into the guiding hole 231, whereby the terminal 131 of the semiconductor device 130 is located The electrode 222 of the support member 220 under the terminal 131 is in contact. In other words, the guide sheet 230 according to the current embodiment is disposed above the support member 220, and thus even when a positional deviation occurs between the terminal 131 of the semiconductor device 130 and the electrode 222 of the support member 220, the position of the terminal can be aligned, Thereby, the terminals of the semiconductor device are reliably brought into contact with the electrodes. The guide sheet may be formed of an insulating resin sheet, but the invention is not limited thereto. The guide sheet can be formed of any of various materials such as polyimine film, FR4, FR5, XPC or polyimine as long as the material has excellent heat resistance and flexibility.
在根據本發明的另一實施例的處理器用插件中，甚至當半導體裝置的端子並未配置成對應於支撐構件的端子時，亦可使半導體裝置的位置稍微偏移以使得端子與電極可靠地彼此接觸。此外，處理器用插件結合支撐構件支撐半導體裝置，以便使將半導體裝置穩定地維持於插件本體的貫孔內。 In the processor insert according to another embodiment of the present invention, even when the terminals of the semiconductor device are not configured to correspond to the terminals of the support member, the position of the semiconductor device can be slightly shifted to make the terminal and the electrode reliably Contact each other. Further, the processor supports the semiconductor device with the insert member in conjunction with the support member to stably maintain the semiconductor device within the through hole of the insert body.
在根據本發明的處理器用插件中，與半導體裝置的端子接觸的電極是與網片一體地製造，且因此可防止端子的位置在測試期間偏離。 In the insert for a processor according to the present invention, the electrode in contact with the terminal of the semiconductor device is integrally formed with the mesh, and thus the position of the terminal can be prevented from deviating during the test.
此外，由於根據本發明的處理器用插件使用網片來支撐半導體裝置，因此可維持處理器用插件的強度，同時保證其可撓 性。 In addition, since the processor plug-in according to the present invention uses the mesh to support the semiconductor device, the strength of the plug-in for the processor can be maintained while ensuring its flexibility Sex.
儘管已參考本發明的例示性實施例特定地繪示且描述了本發明，但一般熟習此項技術者將理解，在不脫離如由隨附申請專利範圍界定的本發明的精神以及範疇的情況下，可對本發明進行形式及細節上的各種改變。 Although the present invention has been particularly shown and described with respect to the exemplary embodiments of the present invention, it will be understood by those skilled in the art Various changes in form and detail may be made to the invention.
100‧‧‧處理器用插件 100‧‧‧Processor plugin
110‧‧‧插件本體 110‧‧‧ plugin ontology
111‧‧‧貫孔 111‧‧‧through holes
121‧‧‧網片 121‧‧‧ mesh
122‧‧‧電極 122‧‧‧ electrodes
123‧‧‧插件接觸部分 123‧‧‧ plug-in contact
123a‧‧‧鍍敷層 123a‧‧‧ plating layer
130‧‧‧半導體裝置 130‧‧‧Semiconductor device
131‧‧‧端子 131‧‧‧terminal
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| KR1020120030724A KR101339165B1 (en) | 2012-03-26 | 2012-03-26 | Insert for handler with mesh sheet and insert for handler |
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| TW201403091A TW201403091A (en) | 2014-01-16 |
| TWI468707B true TWI468707B (en) | 2015-01-11 |
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| KR102220334B1 (en) * | 2014-10-16 | 2021-02-25 | 세메스 주식회사 | Insert assembly for receiving electronic device |
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| US20020190739A1 (en) * | 1999-01-21 | 2002-12-19 | Farnworth Warren M. | CSP BGA test socket with insert and method |
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| US20070182432A1 (en) * | 2006-01-26 | 2007-08-09 | Samsung Electronics Co., Ltd. | Insert with support for semiconductor package |
| TW200907348A (en) * | 2007-02-02 | 2009-02-16 | Johnstech Int Corp | A contact insert for a microcircuit test socket |
| US7477063B1 (en) * | 2007-08-17 | 2009-01-13 | Powertech Technologies, Inc. | Universal insert tool for fixing a BGA package under test |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130110239A (en) | 2013-10-10 |
| KR101339165B1 (en) | 2013-12-09 |
| TW201403091A (en) | 2014-01-16 |
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