KR101726399B1

KR101726399B1 - Test socket having bottom metal plate bump and method for manufacturing thereof

Info

Publication number: KR101726399B1
Application number: KR1020160032391A
Authority: KR
Inventors: 박성규; 전진국; 박영식; 정병원; 최명근
Original assignee: 주식회사 오킨스전자
Priority date: 2016-03-17
Filing date: 2016-03-17
Publication date: 2017-04-13

Abstract

The present invention provides a test socket comprising: a bottom printed circuit board (PCB) film where a plurality of hold pads are uniformly arranged; bottom bumps passing through the hole pads to be coupled; an insulation silicon rubber installed on the bottom PCB film and having a plurality of through holes formed thereon; conductive silicon rubber filling the through holes and having bottom surfaces connected to the bottom bumps; a top PCB film installed on the insulation silicon rubber and having top bumps formed thereon; and a conductive wire bonded to an interior surface of the top bump and inserted into the conductive silicon rubber or not in direct contact with the bottom bumps. According to the above described structure of the present invention, no contact failure occurs even though there are height variations between adjacent bumps or different sizes of conductive balls of external devices.

Description

Technical Field [0001] The present invention relates to a test socket having a bottom metal plate bump and a method of manufacturing the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test socket including a bottom metal plate bump and a method of manufacturing the same, and more particularly to a test socket for inspecting electrical characteristics of a semiconductor device manufactured through a semiconductor package manufacturing process before shipment, .

Particularly, by using the conductive silicone rubber in which the conductive wire is inserted as the conductive connector for connecting the upper and lower bumps of the test socket, it is possible to absorb the impact even in repeated tests, and as the upper connector, The top metal plate bump is formed and the bottom metal plate bump is formed as the bottom connector to improve the contact characteristics with the conductive balls of the external device. Even when the adjacent bumps are not leveled or have different heights, And a method of manufacturing the same, in which the insulative silicone rubber is used as a general purpose silicone rubber, the conductive silicone rubber is filled therein, and the wire is inserted after the rubber is cured to improve the assemblability of the socket.

In general, semiconductor devices manufactured through complicated processes are inspected for their characteristics and defects through various electrical tests.

Specifically, in the electrical inspection of semiconductor devices such as semiconductor integrated circuit devices such as a package IC and an MCM, and wafers on which integrated circuits are formed, in order to electrically connect the terminals formed on one surface of the semiconductor device to be inspected and the pads of the test device to each other , A test socket is disposed between the semiconductor device and the test apparatus.

However, the test socket is provided with a conductive connector (wire or spring, etc.) for contacting the terminals provided in the test instrument.

However, the conductive connector must be capable of absorbing the impact even in contact with the semiconductor device. When a conductive wire is used to form a connector, if the conductive wire is broken by an impact due to repetitive testing, the function can not be performed.

Further, since the conductive wires connect the upper and lower pads of the socket, if the length of the conductive wires is increased, a test is required at a high frequency such as an RF (Radio Frequency) semiconductor device.

Further, even when the test is performed by inserting the conductive wire into the conductive silicone rubber to electrically connect the semiconductor device and the test device, there is a problem that the conductive silicone rubber or the conductive wire is in direct contact with the conductive ball of the external device, have.

Further, even when the conductive wire is included in the conductive silicone rubber, since the conductive wire is inserted during the molding of the conductive silicone rubber, the assembling property is significantly deteriorated.

Further, in the case of electrically connecting the conductive connectors connecting the upper and lower pads of the socket to the conductive balls of the external device, when the upper and lower pads are not aligned horizontally or the height of the conductive balls is different, a contact failure occurs, .

KR registered utility model 20-0368242

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art as described above, and it is an object of the present invention to provide a bump, And a method of manufacturing the same.

Another object of the present invention is to provide a test socket which exhibits constant contact characteristics even when the height of the upper and lower pads of the socket is different or the size of the external device conductive balls is different, and a method of manufacturing the same.

It is still another object of the present invention to provide a test socket for improving the assemblability of the conductive wire, the conductive silicone rubber, the PCB film, and the bump, and a method of manufacturing the same.

It is still another object of the present invention to provide a test socket that improves electrical contact characteristics as well as physical contact characteristics by providing a shape that can give various changes to a conductive connector portion in contact with an external device, and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a test socket comprising: a bottom PCB film having a plurality of hole pads uniformly arranged; a bottom bump coupled to the hole pads; An insulating silicone rubber which is formed on the film and is formed with a plurality of through holes, a conductive silicone rubber which is filled in the through hole and whose bottom surface is connected to the bottom bump, a top PCB film And a conductive wire that is wire-bonded to the inner surface of the top bump and is not directly in contact with the bottom bump, but is inserted into the conductive silicone rubber.

According to another aspect of the present invention, a test socket of the present invention includes a bottom PCB film on which a plurality of hole pads are regularly arranged, bottom bumps for coupling through the hole pads, a plurality of through holes And a bottom bum connected to the top surface of the conductive silicone rubber and a bottom bum connected to the inner surface of the top bum and electrically connected to the bottom bumper, And a conductive wire inserted in the silicone rubber but not in direct contact with the bottom bump.

According to another aspect of the present invention, there is provided a method of manufacturing a test socket, comprising: forming a sacrificial substrate by plating Cu with a predetermined thickness; forming a bump groove at a predetermined interval by removing a part of the sacrificial substrate; Filling the bump grooves with a metal plate bump and filling the bump grooves; wire bonding the studs to the plate bumps; preparing a bottom PCB film including the spaced hole pads; A step of bonding the studs to the hole pads, pressing the studs to fasten the studs to the hole pads, removing the sacrificial substrate, and providing a bottom PCB film including the plate bumps Preparing an insulating silicone rubber on which a through hole is to be formed; Attaching a rubber, and by filling the conductive silicone rubber to the through-hole includes the step of forming the bumps and the connector plate.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, since the sacrificial substrate is used in forming the bottom bump, mass production is possible.

Second, the conductive connector connecting the upper and lower pads of the test socket can absorb the impact even after repetitive testing by using the conductive silicone rubber in which the conductive wire is inserted.

Third, even if the upper and lower pads are not aligned horizontally or have different heights, a constant contact characteristic can be exhibited by the studs.

Fourth, the insulative silicone rubber is used as a general purpose silicone rubber, the conductive silicone rubber is filled therein, and the wire is inserted after the rubber is cured, thereby improving the assemblability of the socket.

Finally, with the use of the metal plate bump, it is possible to provide various changes to the flat portion in contact with the external device, thereby improving physical contact as well as electrical contact.

1A and 1B are top and bottom perspective views, respectively, of a configuration of a test socket according to a first embodiment of the present invention;
FIGS. 2A and 2B are top and bottom perspective views, respectively, of a test socket according to a second embodiment of the present invention; FIG.
FIGS. 3A and 3B are top and bottom perspective views respectively showing the configuration of a test socket according to a third embodiment of the present invention; FIG.
4A and 4B are top and bottom perspective views, respectively, showing the configuration of a test socket according to a fourth embodiment of the present invention;
5A to 5K are cross-sectional views showing a manufacturing process of the first embodiment.

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

Hereinafter, preferred embodiments of the test socket according to the present invention will be described in detail with reference to the accompanying drawings.

1A and 1B, a test socket 100 of the present invention includes a bottom PCB film 110 in which a plurality of hole pads 102 are regularly arranged, a bottom bump 110 which passes through the hole pads 102, A plurality of through holes 124 formed on the bottom PCB film 110, a plurality of through holes 124 formed on the bottom PCB film 110, a plurality of through holes 124 formed on the bottom PCB film 110, A top PCB film 152 that is mounted on the insulating silicone rubber 130 and on which the top bump 150 is formed and a conductive rubber 140 that is wire bonded to the inner surface of the top bump 150, But not in direct contact with the bottom bump 120. The conductive bump 120 may be a conductive wire.

1A and 1B, the bottom bump 120 includes a plate bump 120a connected to a conductive ball (not shown) of an external device, and a plate bump 120b wire-bonded to the plate bump 120a, And a stud 120b that engages with the conductive silicone rubber 140. At this time, the normal stud is a wire of a predetermined length, but the stud 120b is pressed at a predetermined pressure, and the surface is flat.

The top bump 150 may include a wire bump. The wire bumps are formed by wire bonding on the bonding pads 154. A wire bump can be formed by lengthening the length of the stud when the wire is cut to cut the wire. For example, the length of the stud forming the wire bump can be adjusted according to the contact characteristics.

2A and 2B, the bottom bump 120 includes a plate bump 120a that is coupled to the conductive silicone rubber 140 and a wire bump 120b that is wire-bonded to the plate bump 120a, And a wire stud 120c connected to the conductive ball of the external device. The top bump 150 may include a wire bump as described above.

3A and 3B, a test socket 100 according to the present invention includes a bottom PCB film 110 having a plurality of hole pads 102 arranged in a uniform manner, a bottom bump 110 which passes through the hole pads 102, A plurality of through holes 124 formed on the bottom PCB film 110, a plurality of through holes 124 formed on the bottom PCB film 110, a plurality of through holes 124 formed on the bottom PCB film 110, The top bump 150 connected to the top surface of the conductive silicone rubber 140 and the inner surface of the top bump 150 and is inserted into the conductive silicone rubber 140, And a conductive wire 160 that is not in direct contact with the conductive wire 160.

3A and 3B, the bottom bump 120 includes a plate bump 120a connected to a conductive ball of an external device, and a conductive bump 120b which is wire-bonded to the plate bump 120a and passes through the hole pad 102, And an indent stud 120b that engages with the rubber 140. At this time, the normal stud is a wire of a predetermined length, but the stud 120b is pressed at a predetermined pressure, and the surface is flat. The top bump 150 may include a metal plate bump.

Since the top surface of the metal plate bump is flat, contact characteristics can be enhanced through various patterns on the top surface. For example, it is possible to provide a step having a height at the bump. When the upper step and the lower step are repeated and the protrusion area is generated at the boundary line between the upper step and the lower step, the conductive balls of the external device can be stably mounted thereon. That is, since the natural oxide film of the conductive ball is broken or pierced and contacted with the conductive ball at the boundary of the step, the overall contactability can be improved.

Alternatively, an embossing may be formed on the surface. When the embossing type bump surface is formed, embossing forms a protruding region, and since there are many protruding regions uniformly in the entire region, the contact pail can be minimized even if a horizontal deviation occurs, have.

Since the contact characteristics with the conductive balls are improved in the case where the surface is rounded as compared with the case where the surface is flat, the surface of the bumps is provided with a pattern of a predetermined concavo-convex shape.

4A and 4B, the bottom bump 120 includes a plate bump 120a that is coupled to the conductive silicone rubber 140 and a wire bump 120b that is wire bonded to the plate bump 120a, And a wire stud 120c connected to the conductive ball of the external device. The top bump 150 may include a metal plate bump as described above.

Thereby, the test socket 100 contacts the semiconductor device (not shown) through the bottom bump 120 and contacts the test device (not shown) through the top bump 150 to perform inspection of the semiconductor device can do.

The bottom PCB film 110 is formed on a rigid printed circuit board (RIGID PCB) or a polyimide film having excellent ductility by forming a circuit by printing copper (Cu) on epoxy or phenol resin A flexible printed circuit board (Flexible PCB) that forms various circuit patterns by copper (Cu), gold (Au), or other conductive material may be used.

The insulating silicone rubber 130 is not limited to the silicone rubber as long as it has a predetermined elasticity. For example, polybutadiene rubber, urethane rubber, natural rubber, polyisoprene rubber, and other elastic rubbers may be used as the heat resistant polymer material having a crosslinked structure.

As the conductive silicone rubber 140, silicone rubber, urethane rubber, epoxy rubber or other elastic rubber may be used as the insulating silicone rubber 130.

However, the conductive particles to be magnetically arranged may be mixed here. The conductive particles may be composed of iron, nickel, cobalt, other magnetic metal, or two or more alloys. Or a mixed type in which the above-mentioned conductive particles are plated on an insulating core.

Or the conductive silicone rubber 140 may be an unaligned conductive connector formed by including a conductive powder and a platinum (Pt) catalyst in a silicone rubber resin. In addition, the above-mentioned conductive powder among the unaligned conductive connectors may be a single metal of magnetic silver (Ag), iron (Fe), nickel (Ni), or cobalt (Co) .

Here, the conductive wire 160 may be further plated with conductive gold (Au) or nickel (Ni). In the present invention, the conductive wire 160 is not directly connected to the bottom bump 104. Since the conductive wire 160 of the present invention cooperates with the conductive silicone rubber 140 to electrically connect the bumps 104 and 150, the conductive wire 160 may be broken or damaged The conductive silicone rubber 140 can increase the current capacity through the conductive wire 160, so that a mutual synergy effect can be obtained.

Although not shown in the drawings, the lower PCB film 110 can provide individual contacts of the lower bumps 104. [ For example, a PCB land can be formed that distributes the compressive load during contact for testing and isolates each bump through recesses to eliminate interference between adjacent bumps by the PCB film. However, since the PCB film is not included in the upper part, interference between neighboring bumps does not occur, so that it is not necessary to separate the PCB land.

Further, the lower PCB film 110 may further include a double-sided adhesive film for enhancing the adhesion to the insulating silicone rubber 130. For example, since the interval between the bumps is narrowed in order to realize a fine pitch, the contact area between the PCB film and the silicon rubber tends to become small as it is peeled off arbitrarily. However, since a separate PCB film is not required in the upper part, the double-sided adhesive film can be omitted.

Hereinafter, a method of manufacturing a test socket according to the present invention will be described with reference to FIGS. 5A to 5K.

Referring to FIG. 5A, a sacrificial substrate 200 is formed. The sacrificial substrate 200 is formed by electroplating copper (Cu) or depositing other metal to a predetermined thickness. Because the sacrificial substrate 200 is provided during processing to form the bottom bump and later removed, a metal having an etch rate relative to the bump is used. For example, the sacrificial substrate 200 is formed using copper (Cu). When the sacrificial substrate 200 is formed using copper (Cu), copper (Cu) can be formed by electroplating or electroless plating.

Referring to FIG. 5B, a part of the sacrificial substrate 200 is removed to form a bump groove 210 having a predetermined depth at regular intervals. For example, a part of the sacrificial substrate 200 may be etched using a mask or a part of the sacrificial substrate 200 may be removed using a laser. Where the constant spacing may vary depending on the design of the bottom bump 120.

Referring to FIG. 5C, a seed bump 122 having a predetermined thickness is formed in the bump groove 210. Nickel (Ni) may be deposited to form the seed bump 122.

Referring to FIG. 5D, the bottom bump 120 is plated using the seed bump 122. As described above, the bottom bump 120 can use the metal plate bump 120a.

Referring to FIG. 5E, stud bumps are formed on the inner surface of the bottom bump 120 using wire bonding. For example, a stud bump that is wire-bonded to the plate bump 120a is formed.

Referring to FIG. 5F, a bottom PCB film 110 including the spacing hole pads 102 is prepared. Then, the plate bump 120a is exposed to the outside of the hole pad 102, and the stud passes through the hole pad 102. Then,

Referring to FIG. 5G, the stud is pressed and fastened to the hole pad 102. On the surface of the plate bump 120a exposed to the outside, various patterns are formed using a press in a subsequent process, so that the conductive balls can be stably stuck and the electrical contact characteristics can be enhanced.

Referring to FIG. 5H, the sacrificial substrate 200 is removed to provide a bottom PCB film 110 including the plate bumps 120a. The sacrificial substrate 200 including Cu has a higher etch rate than the seed bump 122 containing nickel (Ni) or the plate bump 120a containing gold (Au) .

Referring to FIG. 5I, an insulating silicone rubber 130 having a through hole 124 is prepared, and an insulating silicone rubber 130 is attached on the bottom PCB film 110. For example, the insulative silicone rubber 130 can be pre-patterned into a predetermined shape using a mold.

Referring to FIG. 5J, the through hole 124 is filled with the conductive silicone rubber 140 to form the plate bump 120a and the connector. For example, the conductive liquid silicone rubber is filled in the through hole 124 at a predetermined pressure and cured to complete the conductive silicone rubber 140.

Referring to FIG. 5K, a top PCB film 152 is attached on the insulating silicone rubber 130 to complete a test socket. Although not shown in the figure, a double-sided adhesive film may be interposed between the top PCB film 152 and the insulating silicone rubber 130. It is also possible to form a recess around each bump for individual contact of the top PCB film 152 and fill the recess with soft silicone rubber to eliminate interference between adjacent bumps.

As described above, according to the present invention, a stud bump or a plate bump of various patterns is used as an upper conductive connector to be contacted with a semiconductor device, and a plate bump or a stud bump is formed as a lower conductive connector to be in contact with a test device, The contact hole can be prevented even in the presence of a height deviation and the contact property can be improved by connecting the conductive ball or the natural oxide film of the conductive pad through the edge contact by the bump to thereby improve the contact characteristics. . Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

100: Test socket 102: Hall pads
110: bottom PCB film 120: bottom bump
120a: plate bump 120b: stamped stud
120c: wire stud 130: insulated silicone rubber
140: conductive silicone rubber 150: top bump
152: Top PCB film 160: Conductive wire
200: sacrificial substrate 210: bump groove

Claims

A bottom PCB film in which a plurality of hole pads are regularly arranged;
A bottom bump coupled through the hole pad;
An insulating silicone rubber disposed on the bottom PCB film and having a plurality of through holes formed therein;
A conductive silicone rubber which is filled in the through hole and whose bottom face is connected to the bottom bump;
A top PCB film disposed on the insulating silicone rubber and formed with a top bump; And
And a conductive wire which is wire-bonded to an inner surface of the top bump and is inserted into the conductive silicone rubber but is not in direct contact with the bottom bump.

The method according to claim 1,
In the bottom bump,
A plate bump connected to the conductive ball of the external device; And
And a stud which is wire-bonded to the plate bump and passes through the hole pad to engage with the conductive silicone rubber.

3. The method of claim 2,
Wherein the top bump comprises a wire bump formed by wire bonding on a bonding pad of the top PCB film.

The method according to claim 1,
In the bottom bump,
A plate bump coupled with the conductive silicone rubber; And
And a wire stud which is wire-bonded to the plate bump and is exposed through the hole pad to be connected to a conductive ball of an external device.

A bottom PCB film in which a plurality of hole pads are regularly arranged;
A bottom bump coupled through the hole pad;
An insulating silicone rubber disposed on the bottom PCB film and having a plurality of through holes formed therein;
A conductive silicone rubber which is filled in the through hole and whose bottom face is connected to the bottom bump;
A top bump connected to an upper surface of the conductive silicone rubber; And
And a conductive wire which is wire-bonded to an inner surface of the top bump and which is inserted into the conductive silicone rubber but is not in direct contact with the bottom bump.

6. The method of claim 5,
In the bottom bump,
A plate bump connected to the conductive ball of the external device; And
And a stud which is wire-bonded to the plate bump and passes through the hole pad to engage with the conductive silicone rubber.

The method according to claim 6,
Said top bump comprising a metal plate bump,
Wherein the plate bump includes at least nickel and further has a seed bump of gold formed on an upper surface thereof and the conductive wire is directly bonded to a bottom surface thereof.

6. The method of claim 5,
In the bottom bump,
A plate bump coupled with the conductive silicone rubber; And
And a wire stud which is wire-bonded to the plate bump and is exposed through the hole pad to be connected to a conductive ball of an external device.

Plating copper (Cu) to a predetermined thickness to form a sacrificial substrate;
Removing a part of the sacrificial substrate to form bump grooves at regular intervals;
Depositing and filling a metal plate bump in the bump grooves;
Wire bonding the stud to the plate bump;
Preparing a bottom PCB film comprising the spacing hole pads;
The plate bumps being exposed to the outside of the hole pads, the studs being coupled to pass through the hole pads;
Pressing the stud onto the hole pad;
Removing the sacrificial substrate to provide a bottom PCB film comprising the plate bump;
Preparing an insulating silicone rubber having a through-hole formed therein;
Attaching an insulating silicone rubber on the bottom PCB film; And
And filling the through hole with conductive silicone rubber to form the plate bump and the connector.

10. The method of claim 9,
Wherein a seed bump is first formed using gold (Au) in the bump groove before forming the metal plate bump, and the plate bump is formed using nickel (Ni) using the seed bump A method of manufacturing a socket.