TWI462209B - Glass substrate suction table, and glass substrate processing methods - Google Patents
Glass substrate suction table, and glass substrate processing methods Download PDFInfo
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- TWI462209B TWI462209B TW098106568A TW98106568A TWI462209B TW I462209 B TWI462209 B TW I462209B TW 098106568 A TW098106568 A TW 098106568A TW 98106568 A TW98106568 A TW 98106568A TW I462209 B TWI462209 B TW I462209B
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- glass substrate
- sheet
- absorbing table
- absorbing
- teflon
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Surface Treatment Of Glass (AREA)
Description
本發明係關於一種玻璃基板吸著檯、及玻璃基板加工方法，進而係關於一種經由片材而對進行倒角之玻璃基板進行吸著保持的玻璃基板吸著檯及其加工方法。The present invention relates to a glass substrate absorbing table and a glass substrate processing method, and further relates to a glass substrate absorbing table for absorbing and holding a chamfered glass substrate via a sheet, and a method for processing the same.
液晶顯示或電漿顯示等之FPD(Flat Panel Display，平板顯示器)用玻璃基板，係藉由切折步驟將板玻璃切折加工成所規定之矩形形狀大小，將其藉由倒角步驟對緣部進行倒角加工，製造成產品的外形尺寸之玻璃基板。而且，該玻璃基板經過配置於倒角步驟的後段之洗淨步驟及檢查步驟，向表面研磨步驟移送，在此可製造產品厚度厚之玻璃基板。A glass substrate for an FPD (Flat Panel Display) such as a liquid crystal display or a plasma display is formed by cutting a sheet glass into a predetermined rectangular shape by a cutting step, and the chamfering step is performed on the edge. The part is chamfered to produce a glass substrate of the outer dimensions of the product. Further, the glass substrate is transferred to the surface polishing step through the cleaning step and the inspection step disposed in the subsequent stage of the chamfering step, whereby a glass substrate having a thick product thickness can be produced.
於該種玻璃基板之製造步驟中，當將板玻璃高精度地切折成所規定大小、或是對已被切折之玻璃基板進行高精度倒角加工時，重要的是將玻璃基板定位於玻璃基板吸著檯上後，牢固地真空吸著保持玻璃基板。特別是在倒角加工中，對端面形狀加工有高精度、高品質的要求，因此須提高吸著力而使玻璃基板吸著保持於玻璃基板吸著檯上。In the manufacturing step of the glass substrate, when the plate glass is cut into a predetermined size with high precision or a high-precision chamfering process is performed on the glass substrate that has been cut, it is important to position the glass substrate at a predetermined time. After the glass substrate is sucked on the stage, the glass substrate is firmly vacuumed and held. In particular, in the chamfering process, since the end face shape processing is required to have high precision and high quality, it is necessary to increase the absorbing force to cause the glass substrate to be sucked and held on the glass substrate absorbing table.
然而，若玻璃基板吸著檯與玻璃基板之間夾雜有設備之異物、玻璃屑等垃圾，則會產生以下問題：由於其吸著力較強，故因該垃圾而使吸著於玻璃基板吸著檯上之玻璃基板上留下瑕疵，從而使玻璃基板之品質下降；而且，於發現在步驟後段之研磨步驟已結束的玻璃基板上存在此瑕疵之情形時，直至被發現為止所生產的多數玻璃基板成為次品。因此，一般會於玻璃基板吸著檯上黏附片材。However, if there is any foreign matter such as foreign matter or glass swarf between the glass substrate absorbing table and the glass substrate, the following problem occurs: since the absorbing force is strong, the absorbing liquid is sucked on the glass substrate. The enamel is left on the glass substrate on the stage, so that the quality of the glass substrate is lowered. Moreover, when the enamel is found on the glass substrate where the polishing step at the end of the step is completed, most of the glass produced until it is found The substrate becomes a defective product. Therefore, the sheet is generally adhered to the glass substrate sorption table.
專利文獻1中，揭示有一種倒角裝置之玻璃基板吸著檯。載置於該玻璃基板吸著檯上之玻璃基板藉由定位止動部而定位於玻璃基板吸著檯上後，藉由玻璃基板吸著檯吸著保持，其後藉由倒角磨石倒角加工。Patent Document 1 discloses a glass substrate absorbing table of a chamfering device. The glass substrate placed on the absorbing table of the glass substrate is positioned on the glass substrate sorption table by the positioning stopper, and then held by the glass substrate absorbing table, and then poured by the chamfering stone. Angle processing.
貼著於玻璃基板吸著檯上之普通的片材，如圖3所示，係使用在玻璃纖維片材1上塗層有鐵氟龍(註冊商標)2之片材3。根據該鐵氟龍(註冊商標)2之性質，玻璃基板G相對於片材3之滑動性提高，玻璃基板G可於片材3上之、亦即玻璃基板吸著檯上順利地定位。且，圖3中之符號4係用以使片材3貼著於玻璃基板吸著檯之玻璃基板吸著面側的黏著劑、或是附有脫模紙之黏著劑。又，在片材3上，形成有多個用以真空吸著玻璃基板G之吸著孔，同時形成有多個用以使玻璃基板懸浮支撐並定位於玻璃基板吸著檯上之吹氣孔。As the ordinary sheet adhered to the glass substrate absorbing table, as shown in Fig. 3, a sheet 3 coated with Teflon (registered trademark) 2 on the glass fiber sheet 1 was used. According to the nature of the Teflon (registered trademark) 2, the slidability of the glass substrate G with respect to the sheet 3 is improved, and the glass substrate G can be smoothly positioned on the sheet 3, that is, on the glass substrate absorbing table. Further, reference numeral 4 in Fig. 3 is an adhesive for adhering the sheet 3 to the absorbing surface side of the glass substrate of the glass substrate absorbing table or an adhesive to which the release paper is attached. Further, a plurality of suction holes for vacuum-absorbing the glass substrate G are formed on the sheet 3, and a plurality of blow holes for suspending and supporting the glass substrate and positioning on the glass substrate sorption table are formed.
[專利文獻1]日本專利特開2003-11043號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-11043
然而，圖3所示之片材3由於鐵氟龍(註冊商標)2而滑動性較好，但無法完全抑制片材3與玻璃基板G之間由於夾雜有玻璃或金屬粉此類垃圾產生之玻璃基板的瑕疵，藉由仔細的清掃等操作可解決上述問題。However, the sheet 3 shown in FIG. 3 has a good slidability due to Teflon (registered trademark) 2, but it is not possible to completely suppress the occurrence of waste such as glass or metal powder between the sheet 3 and the glass substrate G. The flaw of the glass substrate can be solved by careful cleaning or the like.
本發明係鑒於此情況而研製者，其目的在於：提供一種可維持玻璃基板定位時所要求之滑動性及相對於吸著檯之玻璃基板保持力，且可在吸著保持有玻璃基板時抑制玻璃基板產生瑕疵之玻璃基板吸著檯、及玻璃基板加工方法。The present invention has been made in view of the above circumstances, and an object thereof is to provide a slidability required for maintaining a positioning of a glass substrate and a holding force with respect to a glass substrate of a absorbing table, and suppressing when a glass substrate is held by absorbing The glass substrate generates a glass substrate absorbing table and a glass substrate processing method.
本發明為達成上述目的，提供一種玻璃基板吸著檯，其設置於玻璃基板加工機上，且貼著於上述玻璃基板吸著檯之玻璃基板吸著面側之片材以JIS K6253(2006年)或JIS K7215(1986年)為標準之硬度為90~95度，厚度為0.7mm以下，且動摩擦係數為0.3以下。In order to achieve the above object, the present invention provides a glass substrate absorbing table which is provided on a glass substrate processing machine and which is attached to a sheet of a glass substrate absorbing surface side of the glass substrate absorbing table by JIS K6253 (2006) Or JIS K7215 (1986) is a standard hardness of 90 to 95 degrees, a thickness of 0.7 mm or less, and a dynamic friction coefficient of 0.3 or less.
本發明為達成上述目的，提供一種玻璃基板加工方法，其特徵在於：使玻璃基板吸著保持於片材上而對該玻璃基板進行加工，且該片材貼著於玻璃基板吸著檯上、且以JIS K6253(2006年)或JIS K7215(1986年)為標準之硬度為90~95度、厚度為0.7mm以下、且動摩擦係數為0.3以下。In order to achieve the above object, the present invention provides a glass substrate processing method, wherein a glass substrate is immersed and held on a sheet to process the glass substrate, and the sheet is attached to the glass substrate sorption table. Further, JIS K6253 (2006) or JIS K7215 (1986) has a hardness of 90 to 95 degrees, a thickness of 0.7 mm or less, and a dynamic friction coefficient of 0.3 or less.
又，本發明中，上述片材較好的是複層結構。Further, in the invention, the sheet is preferably a multi-layer structure.
本發明中較好的是，上述片材至少由聚氨酯片材和烯烴片材、或聚氨酯片材和日東鐵氟龍(Nitoflon)片材構成，且上述烯烴片材或日東鐵氟龍片材與上述玻璃基板接觸。In the present invention, it is preferred that the sheet is composed of at least a urethane sheet and an olefin sheet, or a urethane sheet and a Nitoflon sheet, and the olefin sheet or Nitto Teflon sheet is The above glass substrate is in contact.
又，根據本發明之玻璃基板加工方法，較好的是，上述片材至少由聚氨酯片材和烯烴片材、或聚氨酯片材和日東鐵氟龍片材構成，上述烯烴片材或日東鐵氟龍片材與上述玻璃基板接觸。Further, according to the glass substrate processing method of the present invention, it is preferable that the sheet is composed of at least a urethane sheet and an olefin sheet, or a urethane sheet and a Nitto Teflon sheet, and the olefin sheet or Nitto Teflon The dragon sheet is in contact with the above glass substrate.
進而，本發明之玻璃基板加工方法中較好的是，上述玻璃基板之加工機利用倒角磨石，而對被吸著保持之玻璃基板的緣部進行倒角加工。Further, in the glass substrate processing method of the present invention, it is preferable that the glass substrate processing machine chamfers the edge portion of the glass substrate that is sucked and held by the chamfering grindstone.
作為倒角裝置的前步驟中配置之切折裝置的玻璃基板吸著檯，亦可使用本發明之玻璃基板吸著檯，又，只要係吸著保持玻璃基板者，則任一步驟中配置之玻璃基板吸著檯均可適用本發明之玻璃基板吸著檯，但較好的是要求高精度倒角加工之倒角機。As the glass substrate absorbing table of the dicing device disposed in the previous step of the chamfering device, the glass substrate absorbing table of the present invention can be used, and if it is affixed to hold the glass substrate, it can be disposed in any step. The glass substrate absorbing table of the present invention can be applied to the glass substrate absorbing table, but a chamfering machine which requires high-precision chamfering is preferred.
根據本發明之玻璃基板吸著檯、及玻璃基板加工方法，規定片材之硬度為90~95度、厚度為0.7mm以下、動摩擦係數為0.3以下，故而，可維持玻璃基板定位時所要求之滑動性、及對於吸著檯之玻璃基板保持力，並在吸著保持有玻璃基板時抑制玻璃基板產生瑕疵。According to the glass substrate absorbing table and the glass substrate processing method of the present invention, the sheet has a hardness of 90 to 95 degrees, a thickness of 0.7 mm or less, and a dynamic friction coefficient of 0.3 or less, so that the glass substrate can be maintained at the time of positioning. The slidability and the holding force of the glass substrate of the absorbing table suppress the occurrence of flaws in the glass substrate when the glass substrate is held by the absorbing.
以下，按照隨附圖示對本發明之玻璃基板吸著檯、及玻璃基板加工方法之較好的實施形態進行說明。Hereinafter, preferred embodiments of the glass substrate absorbing table and the glass substrate processing method of the present invention will be described with reference to the accompanying drawings.
圖1(A)~(C)係表示實施形態中之玻璃基板加工機的玻璃基板吸著檯10之結構的說明圖，(A)~(C)中之左圖係玻璃基板吸著檯10之平面圖，右圖係玻璃基板吸著檯10之側剖面圖。該玻璃基板吸著檯10係設置於玻璃基板之倒角機上，圖1中分割成構成為長矩形形狀之3個檯12、14、16，整體上形成與玻璃基板G之形狀相對應之平面矩形形狀。且，玻璃基板吸著檯10之分割個數並不限定為3個，而可為2個以上。又，亦可不進行分割，而為1個。1(A) to 1(C) are explanatory views showing the structure of the glass substrate absorbing table 10 of the glass substrate processing machine in the embodiment, and the left side of the glass substrate absorbing table 10 in (A) to (C). The plan view, right side is a side cross-sectional view of the glass substrate absorbing table 10. The glass substrate absorbing table 10 is disposed on a chamfering machine of a glass substrate, and is divided into three stages 12, 14, and 16 which are formed into a long rectangular shape in FIG. 1, and are integrally formed to correspond to the shape of the glass substrate G. Flat rectangular shape. Further, the number of divisions of the glass substrate absorbing table 10 is not limited to three, but may be two or more. Further, it is also possible to divide one without dividing.
該等檯12、14、16係按規定之間隔而配置，且各個檯12、14、16上之玻璃基板吸著面側分別貼著有本發明之片材18。又，在玻璃基板吸著檯10之周圍，對應於各邊而分別配置有2個用於將玻璃基板定位於玻璃基板吸著檯10上之定位部件，例如定位輥20、20...。The stages 12, 14, and 16 are arranged at predetermined intervals, and the sheet 18 of the present invention is attached to the glass substrate absorbing surface side of each of the stages 12, 14, and 16, respectively. Further, around the glass substrate absorbing table 10, two positioning members for positioning the glass substrate on the glass substrate absorbing table 10, for example, the positioning rollers 20, 20, ... are disposed corresponding to the respective sides.
在貼著於檯12、14、16上之各片材18、18、18上，於規定之位置上形成有吸著孔22、22...及吹氣孔24、24...。該等吸著孔22、22...只要能在玻璃基板加工時確實地固定玻璃基板之位置，則可形成於任一地方，亦可在玻璃基板吸著檯10上設計用以擴大吸著面積之吸著溝而與吸著孔22、22...連結。又，吹氣孔24、24...在進行玻璃基板之定位時，只要能使玻璃基板在玻璃基板吸著檯10上順暢地浮動則可形成任何形態。On the sheets 18, 18, and 18 which are attached to the stages 12, 14, and 16, the suction holes 22, 22, ... and the air holes 24, 24, ... are formed at predetermined positions. The suction holes 22, 22, ... can be formed in any place as long as the position of the glass substrate can be surely fixed during the processing of the glass substrate, or can be designed on the glass substrate absorbing table 10 to expand the sorption The area is sucked into the groove and connected to the suction holes 22, 22, .... Further, when the air holes 24, 24, ... are positioned on the glass substrate, any form can be formed as long as the glass substrate can be smoothly floated on the glass substrate absorbing table 10.
繼而，對於玻璃基板吸著檯10上玻璃基板之定位順序進行說明。Next, the positioning order of the glass substrate on the glass substrate absorbing table 10 will be described.
首先，自形成於玻璃基板吸著檯10之各檯12、14、18上的多個吹氣孔24、24...噴出規定壓力之空氣。繼而，自切折機(未圖示)搬出已切折加工成圖1(B)所示之矩形形狀之玻璃基板G，且將其載置於玻璃基板吸著檯10上。藉此，玻璃基板G被懸浮支撐於玻璃基板吸著檯10上。而且，該懸浮支撐並非指玻璃基板G整體完全懸浮於玻璃基板吸著檯10上之狀態，而是指一部分懸浮、其他部分接觸於玻璃基板吸著檯10之片材18而自由滑動之狀態。First, air of a predetermined pressure is ejected from a plurality of blow holes 24, 24, ... formed on the respective stages 12, 14, 18 of the glass substrate absorbing table 10. Then, the glass substrate G which has been cut into the rectangular shape shown in FIG. 1(B) is carried out from a folding machine (not shown), and is placed on the glass substrate absorbing table 10. Thereby, the glass substrate G is suspended and supported on the glass substrate absorbing table 10. Further, the suspension support does not mean a state in which the entire glass substrate G is completely suspended on the glass substrate absorbing table 10, but a state in which a part of the suspension is suspended and the other portion is in contact with the sheet 18 of the glass substrate absorbing table 10 to be freely slid.
繼而，於懸浮支撐之狀態下，使如圖1(B)所示之定位輥20、20...向玻璃基板G之各邊進出移動而使其等與各邊相接觸，使玻璃基板G在片材18上滑動，從而將玻璃基板G定位至正規的位置(倒角位置)。Then, in the state of the suspension support, the registration rollers 20, 20, ... shown in FIG. 1(B) are moved in and out to the respective sides of the glass substrate G to be in contact with the respective sides, so that the glass substrate G is brought into contact with each other. Slide on the sheet 18 to position the glass substrate G to a normal position (chamfered position).
定位結束後，停止自玻璃基板吸著檯10之吹氣孔24、24...噴射空氣。而且，此後立刻自吸著孔22、22...抽吸空氣，經由片材18、18、18而將玻璃基板G真空吸著保持於玻璃基板吸著檯10上，同時或之後定位墊20、20...自玻璃基板G退避。藉此，已定位之玻璃基板G確實地吸著保持於玻璃基板吸著檯10上。After the positioning is completed, the air is blown from the air blowing holes 24, 24, ... of the glass substrate absorbing table 10. Further, immediately thereafter, the air is sucked from the holes 22, 22, ..., and the glass substrate G is vacuum-sucked and held on the glass substrate absorbing table 10 via the sheets 18, 18, and 18, while or after positioning the mat 20 , 20... Retracted from the glass substrate G. Thereby, the positioned glass substrate G is surely sucked and held on the glass substrate absorbing table 10.
繼而，使如圖1(C)所示之倒角磨石30、30沿玻璃基板G之相對的兩邊移動，而對相對之兩邊實施倒角加工。該兩邊之倒角加工結束後，利用玻璃基板吸著檯10使玻璃基板G旋轉90度，藉由倒角磨石30、30之動作而對剩餘兩邊實施倒角加工。且，關於倒角機，亦可於2處設置倒角機構，而剩餘之兩邊的倒角加工則由下游之倒角機構實施。該情形下，玻璃基板G在吸著保持於玻璃基板吸著檯10上之狀態下，藉由玻璃基板吸著檯10而搬送至下游之倒角機構。又，倒角加工中只要倒角磨石與被倒角之玻璃基板相對動作，任一方動作均可。Then, the chamfering grindstones 30 and 30 shown in Fig. 1(C) are moved along the opposite sides of the glass substrate G, and the opposite sides are chamfered. After the chamfering of the both sides is completed, the glass substrate G is rotated by 90 degrees by the glass substrate absorbing table 10, and the remaining two sides are chamfered by the operation of the chamfering grindstones 30 and 30. Moreover, regarding the chamfering machine, the chamfering mechanism can also be provided at two places, and the chamfering processing of the remaining two sides is performed by the chamfering mechanism of the downstream. In this case, the glass substrate G is transported to the downstream chamfering mechanism by the glass substrate absorbing table 10 while being held by the glass substrate absorbing table 10. Further, in the chamfering process, any one of the chamfering grindstones may be operated in opposition to the chamfered glass substrate.
繼而，對貼著於玻璃基板吸著檯10上之片材18的結構進行說明。Next, the structure of the sheet 18 attached to the glass substrate absorbing table 10 will be described.
就倒角加工前實施之藉由定位墊20的玻璃基板G之定位、及玻璃基板吸著檯10之吸著保持而言，對片材18之滑動性、柔軟性及硬度有如下要求，即：滑動性，能使玻璃基板G順利地定位於玻璃基板吸著檯10上；柔軟性，即便片材18與玻璃基板G之間存在玻璃或金屬粉之類的垃圾，亦不會使因該垃圾而產生之瑕疵附著於玻璃基板G上；硬度，具有在玻璃基板加工時能將玻璃基板相對於玻璃基板吸著檯而保持在相對位置之剛性。The positioning of the glass substrate G by the positioning pad 20 and the absorbing and holding of the glass substrate absorbing table 10 performed before the chamfering process have the following requirements for the slidability, flexibility and hardness of the sheet 18, that is, : Slidability, the glass substrate G can be smoothly positioned on the glass substrate absorbing table 10; flexibility, even if there is garbage such as glass or metal powder between the sheet 18 and the glass substrate G, it does not cause The ruthenium generated by the garbage adheres to the glass substrate G; and the hardness has rigidity to hold the glass substrate at a relative position with respect to the glass substrate absorbing table during processing of the glass substrate.
因此，實施形態中之片材18，以JIS K6253(2006年)或JIS K7215(1986年)為標準，硬度為90~95度、厚度為0.7mm以下、且動摩擦係數為0.3以下，而且該片材18貼著於玻璃基板吸著檯10。即，若硬度小於90度，則會由於片材18過軟而導致加工精度惡化。例如，於玻璃基板加工機為如圖1(C)所示之倒角機之情形下，由於片材18較柔軟，故而藉由倒角磨石30所施加之加工壓力而使片材18變形，因該變形而使玻璃基板G相對於被定位之玻璃基板吸著檯10移動，因此導致倒角精度惡化。倒角機中，根據倒角磨石30對玻璃基板G之進給量而控制倒角量，因此，若片材18如上述產生變形，則進給量會使該變形量增加，而成為邊緣不均之加工形狀。藉此，不可能進行高精度加工。另一方面，若片材18之硬度超過95度，則片材18過硬，因此無法解決先前之問題，即因上述垃圾而產生之附著於玻璃基板G上之瑕疵。Therefore, the sheet 18 in the embodiment has a hardness of 90 to 95 degrees, a thickness of 0.7 mm or less, and a dynamic friction coefficient of 0.3 or less, in accordance with JIS K6253 (2006) or JIS K7215 (1986). The material 18 is attached to the glass substrate absorbing table 10. That is, if the hardness is less than 90 degrees, the processing accuracy is deteriorated because the sheet 18 is too soft. For example, in the case where the glass substrate processing machine is a chamfering machine as shown in FIG. 1(C), since the sheet 18 is relatively soft, the sheet 18 is deformed by the processing pressure applied by the chamfering grindstone 30. Due to this deformation, the glass substrate G is moved relative to the positioned glass substrate absorbing table 10, and thus the chamfering accuracy is deteriorated. In the chamfering machine, the amount of chamfering is controlled according to the feed amount of the chamfering grindstone 30 to the glass substrate G. Therefore, if the sheet 18 is deformed as described above, the amount of feed increases the amount of deformation and becomes an edge. Uneven processing shape. Thereby, high-precision machining is impossible. On the other hand, if the hardness of the sheet 18 exceeds 95 degrees, the sheet 18 is too hard, and thus the previous problem, that is, the flaw which adheres to the glass substrate G due to the above-mentioned garbage, cannot be solved.
又，關於厚度，若超過0.7mm，則在吸著玻璃基板G而對玻璃基板G進行倒角加工時，由於該加工壓力，而使玻璃基板G相對於玻璃基板吸著檯10移動，因此無法高精度地對玻璃基板G進行加工。In addition, when the glass substrate G is subjected to chamfering by the glass substrate G when the thickness is more than 0.7 mm, the glass substrate G is moved relative to the glass substrate absorbing table 10 due to the processing pressure. The glass substrate G is processed with high precision.
因此，藉由形成具有90~95度之硬度、厚度為0.7mm以下之片材18，從而，其剛性可滿足在玻璃基板加工時玻璃基板G能相對於玻璃基板吸著檯10而保持在相對位置，且可實現高精度倒角加工，亦可解決上述因夾雜垃圾而產生之瑕疵的問題。且，片材10之硬度係藉由TECLOCK股份有限公司製造之硬度測定機(GS-719G)測定。Therefore, by forming the sheet 18 having a hardness of 90 to 95 degrees and a thickness of 0.7 mm or less, the rigidity thereof can satisfy that the glass substrate G can be held relative to the glass substrate absorbing table 10 during the processing of the glass substrate. The position and high-precision chamfering can be achieved, and the above-mentioned problems caused by the inclusion of garbage can also be solved. Further, the hardness of the sheet 10 was measured by a hardness measuring machine (GS-719G) manufactured by TECLOCK Co., Ltd.
進而，為確保玻璃基板G相對於片材18之滑動性，動摩擦係數必須為0.3以下。動摩擦係數若超過0.3，則滑動性會產生異常，玻璃基板G相對於玻璃基板吸著檯10難以順利定位，並產生倒角加工不良及未倒角等。Further, in order to ensure the slidability of the glass substrate G with respect to the sheet 18, the dynamic friction coefficient must be 0.3 or less. When the dynamic friction coefficient exceeds 0.3, the slidability is abnormal, and the glass substrate G is difficult to be positioned smoothly with respect to the glass substrate absorbing table 10, and chamfering defects and chamfering are generated.
因此，根據實施形態中之倒角機之玻璃基板吸著檯10，規定片材18之硬度為90~95度，動摩擦係數為0.3以下，厚度為0.7mm以下，故而可維持玻璃基板G定位時所要求之滑動性、及相對於吸著檯之玻璃基板保持力，同時可抑制吸著保持玻璃基板G時玻璃基板G上產生瑕疵。又，在使用有該玻璃基板吸著檯10之玻璃基板倒角加工方法中，可高精度地對玻璃基板G進行倒角加工。Therefore, according to the glass substrate absorbing table 10 of the chamfering machine in the embodiment, the predetermined sheet 18 has a hardness of 90 to 95 degrees, a dynamic friction coefficient of 0.3 or less, and a thickness of 0.7 mm or less, so that the glass substrate G can be positioned. The required slidability and the holding force of the glass substrate with respect to the absorbing table can suppress the occurrence of flaws on the glass substrate G when the glass substrate G is held by the absorbing. Further, in the glass substrate chamfering method using the glass substrate absorbing table 10, the glass substrate G can be chamfered with high precision.
在此，對片材18之動摩擦係數之測定方法進行說明。Here, a method of measuring the dynamic friction coefficient of the sheet 18 will be described.
作為測定裝置，使用新東科學(heidon)公司製造之表面性測定機(商品名：HEIDON TYPE：14DR)，在以下測試條件下實施動摩擦係數之測定。As a measuring apparatus, the surface friction measuring machine (trade name: HEIDON TYPE: 14DR) manufactured by Heidon Co., Ltd. was used, and the dynamic friction coefficient was measured under the following test conditions.
測試條件Test Conditions
測試負重：1000gTest load: 1000g
滑動速度：100mm/minSliding speed: 100mm/min
滑動距離：30mmSliding distance: 30mm
滑動次數：n3Number of slides: n3
溫度：室溫Temperature: room temperature
測試條件：DRY、WET(滴下純水2cc)Test conditions: DRY, WET (2cc of pure water)
對象材料：烯烴片材、日東鐵氟龍片材、絨面革片材Target material: olefin sheet, Nitto Teflon sheet, suede sheet
測試結果Test Results
烯烴片材：0.202(DRY平均)、0.159(WET平均)Olefin sheet: 0.202 (DRY average), 0.159 (WET average)
日東鐵氟龍片材：0.080(DRY平均)、0.058(WET平均)Nitto Teflon sheet: 0.080 (DRY average), 0.058 (WET average)
絨面革片材：0.498(DRY平均)、0.486(WET平均)Suede sheet: 0.498 (DRY average), 0.486 (WET average)
上述烯烴片材、日東鐵氟龍片材之動摩擦係數為0.3以下，在貼著有該等材料之玻璃基板吸著檯10上，玻璃基板G能順利滑動，且玻璃基板G通常被定位於正規位置。The olefin sheet and the Nitto Teflon sheet have a dynamic friction coefficient of 0.3 or less. On the glass substrate absorbing table 10 to which the materials are attached, the glass substrate G can smoothly slide, and the glass substrate G is usually positioned to be regular. position.
相對於此，絨面革片材之動摩擦係數超過0.3，在貼著有該材料之玻璃基板吸著檯10上，玻璃基板G之定位產生不良。On the other hand, the coefficient of dynamic friction of the suede sheet exceeds 0.3, and the positioning of the glass substrate G is poor on the glass substrate absorbing table 10 to which the material is adhered.
另一方面，片材18如圖2所示，較好的是由聚氨酯片材32與烯烴片材(或日東鐵氟龍片材)34構成之2層結構，總厚度為0.7mm以下。烯烴片材(或者日東鐵氟龍片材)34係與玻璃基板G相接之片材。又，聚氨酯片材中亦含有發泡聚氨酯片材。在圖2中，符號36係將聚氨酯片材32與烯烴片材(或日東鐵氟龍片材)34黏著之黏著劑，符號38係用以將片材18貼著於玻璃基板吸著檯10之玻璃基板吸著面側的黏著劑、或附有黏著劑之脫模紙。On the other hand, as shown in Fig. 2, the sheet 18 is preferably a two-layer structure composed of a urethane sheet 32 and an olefin sheet (or Nitto Teflon sheet) 34, and has a total thickness of 0.7 mm or less. An olefin sheet (or Nitto Teflon sheet) 34 is a sheet which is in contact with the glass substrate G. Further, the polyurethane sheet also contains a foamed polyurethane sheet. In Fig. 2, reference numeral 36 is an adhesive for adhering the urethane sheet 32 to the olefin sheet (or Nitto Teflon sheet) 34, and reference numeral 38 is for attaching the sheet 18 to the glass substrate absorbing table 10. The glass substrate adsorbs the adhesive on the surface side or the release paper with the adhesive attached thereto.
根據較好的實施形態，藉由聚氨酯片材32能確保90~95度之硬度，藉由烯烴片材(或日東鐵氟龍片材)34能確保玻璃基板接觸面之動摩擦係數為0.3以下。關於總厚度，於該等材質之硬度下，若總厚度超過0.7mm，則在吸著玻璃基板G而對玻璃基板G進行倒角加工時，藉由該加工壓力，玻璃基板G會相對於玻璃基板吸著檯10移動，因此無法高精度地對玻璃基板G進行加工。故而，片材18之總厚度定為0.7mm以下。According to a preferred embodiment, the hardness of 90 to 95 degrees can be ensured by the urethane sheet 32, and the olefin sheet (or Nitto Teflon sheet) 34 can ensure that the kinetic friction coefficient of the glass substrate contact surface is 0.3 or less. Regarding the total thickness, when the total thickness exceeds 0.7 mm under the hardness of the materials, when the glass substrate G is subjected to chamfering by absorbing the glass substrate G, the glass substrate G is opposed to the glass by the processing pressure. Since the substrate absorbing table 10 moves, the glass substrate G cannot be processed with high precision. Therefore, the total thickness of the sheet 18 is set to be 0.7 mm or less.
且，總厚度之下限值可設定為與2張片材32、34之製造極限相差約0.2mm，為充分達成本發明之目的，下限值較好的為0.5mm。又，只要能夠獲得平坦度與耐久度，則可以是1種材質之單層結構、或2種材質以上之複層結構，亦可將烯烴系樹脂等塗佈於聚氨酯片材上而製造片材。而且，複層結構亦包括該種塗層者。進而，在實施形態中，對適用於倒角裝置之玻璃基板吸著檯10進行了說明，但並不限定於此，亦可使用實施形態中之玻璃基板吸著檯10來作為切折裝置中之玻璃基板吸著檯、或開孔裝置中之玻璃基板吸著檯。又，只要能吸著保持玻璃基板G，則任何步驟中所配置之玻璃基板吸著檯均可適用實施形態中之玻璃基板吸著檯10。Further, the lower limit of the total thickness can be set to be about 0.2 mm from the manufacturing limit of the two sheets 32 and 34. In order to sufficiently achieve the object of the present invention, the lower limit is preferably 0.5 mm. In addition, as long as the flatness and the durability are obtained, a single-layer structure of one type of material or a multi-layer structure of two or more materials may be used, and an olefin-based resin or the like may be applied to the urethane sheet to produce a sheet. . Moreover, the multi-layer structure also includes such a coating. Further, in the embodiment, the glass substrate absorbing table 10 applied to the chamfering device has been described. However, the present invention is not limited thereto, and the glass substrate absorbing table 10 of the embodiment may be used as the dicing device. The glass substrate absorbing table or the glass substrate absorbing table in the opening device. Further, as long as the glass substrate G can be held by suction, the glass substrate absorbing table 10 of the embodiment can be applied to the glass substrate absorbing table disposed in any step.
在本實施形態中，記載有關於藉由黏著劑將厚度為0.2mm之烯烴片材(為日東鐵氟龍片材之情形時，厚度為0.13mm)黏著至厚度為0.3mm之聚氨酯片材上所成的2層片材，但亦可使用藉由黏著劑將0.13mm之鐵氟龍(註冊商標)片材黏著至0.2mm~0.3mm之聚氨酯片材上的2層片材等。而且，片材材質、片材之厚度並不限定於上述範圍。In the present embodiment, it is described that an olefin sheet having a thickness of 0.2 mm (in the case of a Nitto Teflon sheet, a thickness of 0.13 mm) is adhered to a polyurethane sheet having a thickness of 0.3 mm by an adhesive. The resulting two-layer sheet may be a two-layer sheet obtained by adhering a 0.13 mm Teflon (registered trademark) sheet to a polyurethane sheet of 0.2 mm to 0.3 mm by an adhesive. Further, the thickness of the sheet material and the sheet is not limited to the above range.
以上，參照特定之實施態形態對本發明作了詳細說明，但業者應知，可在不偏離本發明之精神與範圍之情況下進行各種變更或修改。本申請書係基於2008年2月29日申請之日本專利申請(專利申請2008-049618)者，其內容以參照的形式併入本文中。The present invention has been described in detail above with reference to the specific embodiments thereof. It is understood that various changes and modifications may be made without departing from the spirit and scope of the invention. The present application is based on a Japanese patent application (Patent Application No. 2008-049618) filed on Feb. 29, 2008, the content of which is hereby incorporated by reference.
10．．．玻璃基板吸著檯10. . . Glass substrate suction table
12．．．檯12. . . station
18．．．片材18. . . Sheet
20．．．定位墊20. . . Positioning pad
22．．．吸著孔twenty two. . . Sucking hole
24．．．吹氣孔twenty four. . . Blow hole
30．．．倒角磨石30. . . Chamfer grindstone
32．．．聚氨酯片材32. . . Polyurethane sheet
34．．．烯烴片材(或日東鐵氟龍片材)34. . . Olefin sheet (or Nitto Teflon sheet)
36．．．黏著劑36. . . Adhesive
38．．．黏著劑或脫模紙38. . . Adhesive or release paper
圖1(A)係實施形態中之玻璃基板吸著檯之平面圖，(B)係玻璃基板定位於(A)之玻璃基板吸著檯位上之情形的說明圖，(C)係對吸著保持於(A)之玻璃基板吸著檯上之玻璃基板進行倒角加工之情形的說明圖；Fig. 1(A) is a plan view of a glass substrate absorbing table in the embodiment, and Fig. 1(B) is an explanatory view showing a state in which the glass substrate is positioned on the glass substrate absorbing table of (A), and (C) is absorbing An explanatory view of a case where the glass substrate held on the glass substrate absorbing table of (A) is chamfered;
圖2係表示本發明之實施形態中之片材的結構之剖面圖；及Figure 2 is a cross-sectional view showing the structure of a sheet in an embodiment of the present invention;
圖3係表示先前之片材的結構之剖面圖。Figure 3 is a cross-sectional view showing the structure of a prior sheet.
18．．．片材18. . . Sheet
32．．．聚氨酯片材32. . . Polyurethane sheet
34．．．烯烴片材(或日東鐵氟龍片材)34. . . Olefin sheet (or Nitto Teflon sheet)
36．．．黏著劑36. . . Adhesive
38．．．黏著劑或脫模紙38. . . Adhesive or release paper
G．．．玻璃基板G. . . glass substrate
Claims (7)
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| JP2008049618A JP5246583B2 (en) | 2008-02-29 | 2008-02-29 | Glass substrate adsorption table and glass substrate processing method |
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| JP2016102048A (en) * | 2014-11-13 | 2016-06-02 | 三星ダイヤモンド工業株式会社 | Scribe method and scribe device |
| CN107921601B (en) * | 2015-07-21 | 2023-06-20 | 康宁股份有限公司 | Method and apparatus for edge finishing glass substrates |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI232235B (en) * | 2001-06-27 | 2005-05-11 | Nitto Denko Corp | Adhesive sheet for dicing |
| CN1750917A (en) * | 2003-02-21 | 2006-03-22 | 三星钻石工业股份有限公司 | Substrate-processing table and substrate processing device |
| TW200810000A (en) * | 2006-03-20 | 2008-02-16 | Mitsubishi Heavy Ind Ltd | Electrostatic attraction device for glass substrate and attraction secession method therefor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07237929A (en) * | 1994-02-28 | 1995-09-12 | Central Glass Co Ltd | Bending and breaking of thin plate glass and apparatus therefor |
| JP4756295B2 (en) * | 2000-11-09 | 2011-08-24 | 日本電気硝子株式会社 | Adsorption holding device and adsorption holding method for glass plate |
| JP2003261346A (en) * | 2002-03-06 | 2003-09-16 | Toray Ind Inc | Method for cutting glass substrate |
| JP2006117480A (en) * | 2004-10-22 | 2006-05-11 | Citizen Seimitsu Co Ltd | Work table for glass breaker, method of manufacturing the same and automatic glass breaker provided with the same |
| JP2006317484A (en) * | 2005-05-10 | 2006-11-24 | Sanyo Epson Imaging Devices Corp | Method for manufacturing electro-optic device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI232235B (en) * | 2001-06-27 | 2005-05-11 | Nitto Denko Corp | Adhesive sheet for dicing |
| CN1750917A (en) * | 2003-02-21 | 2006-03-22 | 三星钻石工业股份有限公司 | Substrate-processing table and substrate processing device |
| TW200810000A (en) * | 2006-03-20 | 2008-02-16 | Mitsubishi Heavy Ind Ltd | Electrostatic attraction device for glass substrate and attraction secession method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101959814A (en) | 2011-01-26 |
| KR101442884B1 (en) | 2014-09-22 |
| CN101959814B (en) | 2014-05-14 |
| KR20100136968A (en) | 2010-12-29 |
| WO2009107685A1 (en) | 2009-09-03 |
| JP5246583B2 (en) | 2013-07-24 |
| TW200945478A (en) | 2009-11-01 |
| JP2009203141A (en) | 2009-09-10 |
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