TWI461251B - Method for cutting brittle material substrates - Google Patents
Method for cutting brittle material substrates Download PDFInfo
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- TWI461251B TWI461251B TW100148572A TW100148572A TWI461251B TW I461251 B TWI461251 B TW I461251B TW 100148572 A TW100148572 A TW 100148572A TW 100148572 A TW100148572 A TW 100148572A TW I461251 B TWI461251 B TW I461251B
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Description
本發明係關於對脆性材料基板照射雷射光束，沿著互相交差之2方向將脆性材料基板割斷之方法。The present invention relates to a method of irradiating a brittle material substrate with a laser beam and cutting the brittle material substrate in a direction intersecting each other.
以往，做為玻璃基板或陶瓷基板等脆性材料基板之割斷方法，係廣泛使用使刀輪等壓接轉動而形成刻劃線之後，沿著刻劃線從垂直方向施加外力將基板割斷之方法。Conventionally, as a method of cutting a brittle material substrate such as a glass substrate or a ceramic substrate, a method of cutting a substrate by applying an external force along a scribe line after a scribe line is formed by pressing a cutter wheel or the like to form a scribe line is widely used.
通常，在使用刀輪進行脆性材料基板之刻劃之場合，以刀輪對脆性材料基板賦予之機械式應力使基板之缺陷容易產生，於進行折斷時起因於上述缺陷之破裂等會發生。In general, when the squeegee of the brittle material substrate is performed using the cutter wheel, the mechanical stress applied to the brittle material substrate by the cutter wheel causes the defect of the substrate to easily occur, and the breakage or the like due to the defect occurs when the breakage occurs.
針對上述問題，近年來使用雷射將脆性材料基板割斷之方法已實用化。此方法係將雷射光束對基板照射而將基板加熱至熔融溫度未滿後，藉由以冷卻媒體將基板冷卻而使前述基板產生熱應力，以此熱應力從基板之表面於大致垂直方向使裂痕形成者。以此使用雷射光束之脆性材料基板之割斷方法係利用熱應力，故不會使工具直接接觸基板，割斷面成為破裂等較少之平滑之面，維持基板之強度。In response to the above problems, in recent years, a method of cutting a brittle material substrate using a laser has been put into practical use. In this method, after the laser beam is irradiated onto the substrate to heat the substrate until the melting temperature is not full, the substrate is cooled by the cooling medium to generate thermal stress, so that the thermal stress is caused from the surface of the substrate in a substantially vertical direction. Crack formation. In this way, the cutting method of the brittle material substrate using the laser beam utilizes thermal stress, so that the tool does not directly contact the substrate, and the cut surface becomes a smooth surface with less cracks and the like, and the strength of the substrate is maintained.
此外，例如在專利文獻1亦提案使用雷射於互相交差之2方向將脆性材料基板割斷之方法。此提案方法係對脆性材料基板照射雷射光束而形成半切狀態之第1裂痕後，同樣藉由雷射光束之照射來形成對第1裂痕交差之半切狀態之第2裂痕，其次對第1裂痕與第2裂痕再度照射雷射 光束而全切者。Further, for example, Patent Document 1 also proposes a method of cutting a brittle material substrate by using a laser in a direction intersecting each other. In the proposed method, after the laser beam is irradiated onto the brittle material substrate to form the first crack in the half-cut state, the second crack is formed in the half-cut state of the first crack by the irradiation of the laser beam, and then the first crack is formed. Re-illuminate the laser with the 2nd crack The beam is completely cut.
專利文獻1：日本特開2001-130921號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2001-130921
然而，如上述提案方法於對第1裂痕與第2裂痕再度照射雷射光束而將脆性材料基板全切時，可能於第1裂痕與第2裂痕之交點部分有破裂產生。若於成為割斷後之角部之脆性材料基板之交點部分有破裂產生，割斷後之脆性材料基板之尺寸精度會降低且發生之玻璃屑對基板表面附著等而成為問題之原因。However, as described above, when the first and second cracks are irradiated with the laser beam to completely cut the brittle material substrate, cracks may occur at the intersection of the first crack and the second crack. If the crack occurs at the intersection of the brittle material substrate at the corner portion after the cutting, the dimensional accuracy of the brittle material substrate after the cutting is lowered, and the generated glass frit adheres to the surface of the substrate, which is a cause.
本發明係鑑於此種以往之問題而為者，其目的在於提供於使用雷射在互相交差之2方向將脆性材料基板割斷之場合抑制交點部分之破裂之發生之方法。The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a method for suppressing occurrence of cracking at an intersection portion when a brittle material substrate is cut in a direction in which two laser beams are intersected with each other.
根據本發明，提供一種脆性材料基板之割斷方法，包含：將互相交差之由垂直裂痕構成之第1刻劃線與第2刻劃線於脆性材料基板形成之步驟、沿著第1刻劃線與第2刻劃線使雷射光束相對移動同時照射而使前述垂直裂痕伸展並以第1刻劃線與第2刻劃線將前述基板割斷之步驟，其特徵在於：於沿著第1刻劃線及/或第2刻劃線將雷射光束照射之 際使往第1刻劃線與第2刻劃線之交點區域之雷射光束照射量比交點區域以外之雷射光束照射量減少。According to the present invention, there is provided a method for cutting a brittle material substrate, comprising: a step of forming a first scribe line and a second scribe line formed of vertical cracks which are mutually intersected on a brittle material substrate, and a step along the first scribe line a step of stretching the laser beam while the second scribe line is relatively moved, causing the vertical crack to extend, and cutting the substrate by the first scribe line and the second scribe line, and is characterized by: The scribe line and/or the second scribe line illuminate the laser beam The amount of laser beam irradiation to the intersection of the first score line and the second score line is reduced by the amount of laser beam irradiation outside the intersection area.
在此，使往第1刻劃線與第2刻劃線之交點區域之雷射光束照射量為交點區域以外之雷射光束照射量之50%以下較理想。Here, it is preferable that the irradiation amount of the laser beam to the intersection region of the first scribe line and the second scribe line is 50% or less of the irradiation amount of the laser beam other than the intersection region.
此外，藉由控制雷射光束輸出，使往第1刻劃線與第2刻劃線之交點區域之雷射光束照射量減少亦可。此外，將第1刻劃線與第2刻劃線之交點區域以將雷射光束吸收或反射之被覆構件覆蓋，使往前述交點區域之雷射光束照射量減少亦可。此外，將第1刻劃線與第2刻劃線之交點區域以將雷射光束吸收或反射之液體覆蓋，使往前述交點區域之雷射光束照射量減少亦可。Further, by controlling the output of the laser beam, the amount of laser beam irradiation to the intersection of the first scribe line and the second scribe line may be reduced. Further, the intersection of the first score line and the second score line is covered by the covering member that absorbs or reflects the laser beam, and the amount of the laser beam irradiated to the intersection region may be reduced. Further, the intersection of the first score line and the second score line is covered with a liquid that absorbs or reflects the laser beam, and the amount of the laser beam irradiated to the intersection region may be reduced.
此外，前述交點區域係在從第1刻劃線與第2刻劃線之交點往雷射光束之相對移動方向上流側與下流側分別具有5mm以下之寬度之區域較理想。Further, it is preferable that the intersection region is a region having a width of 5 mm or less from the intersection of the first scribe line and the second scribe line to the upstream side and the downstream side in the relative movement direction of the laser beam.
此外，第1刻劃線與第2刻劃線係對前述基板使雷射光束相對移動同時照射，將前述基板加熱為熔融溫度未滿後，之後對前述基板吹送冷卻媒體以冷卻，以藉由於前述基板產生之熱應力形成較理想。Further, the first scribe line and the second scribe line are irradiated to the substrate while the laser beam is relatively moved, and the substrate is heated to a temperature at which the melting temperature is not completed, and then the cooling medium is blown to the substrate to be cooled. The thermal stress generated by the aforementioned substrate is preferably formed.
根據本發明之脆性材料基板之割斷方法，可於於互相交差之2方向將脆性材料基板割斷時抑制交點部分之破裂之發生。藉此，割斷後之脆性材料基板之尺寸精度向上，且格外抑制起因於玻璃屑之問題。According to the cutting method of the brittle material substrate of the present invention, it is possible to suppress the occurrence of cracking at the intersection portion when the brittle material substrate is cut in the direction of the mutual intersection. Thereby, the dimensional accuracy of the brittle material substrate after cutting is upward, and the problem of glass swarf is particularly suppressed.
以下雖針對本發明之脆性材料基板之割斷方法更詳細說明，但本發明並不限於此等實施型態。Although the cutting method of the brittle material substrate of the present invention will be described in more detail below, the present invention is not limited to these embodiments.
於圖1係顯示可實施本發明之割斷方法之割斷裝置之一例之概說圖。在圖1之割斷裝置中，於架台11上具備於對紙面垂直方向(Y方向)可移動之滑動平台12、於滑動平台12上於圖之左右方向(X方向)可移動之台座19、設於台座19上之旋轉機構25，載置、固定於設於此旋轉機構25上之旋轉平台26之脆性材料基板50係藉由此等移動手段在水平面內自由移動。Fig. 1 is a schematic view showing an example of a cutting device which can implement the cutting method of the present invention. In the cutting device of Fig. 1, the gantry 11 is provided with a sliding platform 12 movable in the vertical direction (Y direction) of the paper surface, and a pedestal 19 movable on the sliding platform 12 in the left-right direction (X direction) of the drawing. The rotating mechanism 25 on the pedestal 19 freely moves the brittle material substrate 50 placed and fixed to the rotating platform 26 provided on the rotating mechanism 25 in the horizontal plane by the moving means.
滑動平台12係可移動地安裝於於架台11之上面隔既定距離平行配置之一對之導軌14、15。此外，於一對之導軌14、15之間係與一對之導軌14、15平行地設有藉由以不圖示之馬達而可正、反轉之滾珠螺桿13。此外，於滑動平台12之底面係設滾珠螺帽16。此滾珠螺帽16係螺合於滾珠螺桿13。藉由滾珠螺桿13正轉或反轉，滾珠螺帽16係於Y方向移動，藉此安裝滾珠螺帽16之滑動平台12在一對之導軌14、15上於Y方向移動。The sliding platform 12 is movably mounted on the rails 14 and 15 in a pair of parallel positions on the gantry 11 at a predetermined distance. Further, a ball screw 13 that can be positively and reversely rotated by a motor (not shown) is provided between the pair of guide rails 14 and 15 in parallel with the pair of guide rails 14, 15. Further, a ball nut 16 is attached to the bottom surface of the sliding platform 12. This ball nut 16 is screwed to the ball screw 13. By the forward or reverse rotation of the ball screw 13, the ball nut 16 is moved in the Y direction, whereby the slide platform 12 on which the ball nut 16 is mounted is moved in the Y direction on the pair of guide rails 14, 15.
此外，台座19係可移動地支持於於滑動平台12上隔既定距離平行配置之一對之導引構件21。此外，於一對之導引構件21之間係與一對之導引構件21平行地設有藉由以馬達23而可正、反轉之滾珠螺桿22。此外，於台座19之底面係設滾珠螺帽24。此滾珠螺帽24係螺合於滾珠螺桿 22。藉由滾珠螺桿22正轉或反轉，滾珠螺帽24係於X方向移動，藉此台座19與滾珠螺帽24一起在一對之導引構件21上於X方向移動。Further, the pedestal 19 is movably supported on the sliding platform 12 by a pair of guiding members 21 arranged in parallel with a predetermined distance. Further, a ball screw 22 that can be positively and reversely rotated by the motor 23 is provided between the pair of guide members 21 in parallel with the pair of guide members 21. Further, a ball nut 24 is attached to the bottom surface of the pedestal 19. The ball nut 24 is screwed to the ball screw twenty two. By the forward rotation or the reverse rotation of the ball screw 22, the ball nut 24 is moved in the X direction, whereby the pedestal 19 moves together with the ball nut 24 on the pair of guide members 21 in the X direction.
於台座19係設旋轉機構25。此外，於此旋轉機構25上係設旋轉平台26。為割斷對象之脆性材料基板50係於旋轉平台26上以真空吸著固定。旋轉機構25係使旋轉平台26繞垂直方向之中心軸旋轉。A rotating mechanism 25 is provided on the pedestal 19. Further, a rotating platform 26 is attached to the rotating mechanism 25. The brittle material substrate 50 for cutting the object is attached to the rotating platform 26 by vacuum suction. The rotating mechanism 25 rotates the rotating platform 26 about the central axis of the vertical direction.
於旋轉平台26之上方係支持台31以從安裝台32垂下之保持構件33支持以使與旋轉平台26分離對向。於支持台31係設為了於脆性材料基板50之表面形成觸發裂痕之刀輪35、為了對脆性材料基板50照射雷射光束之開口(不圖示)、為了將脆性材料基板50之表面冷確知冷卻噴嘴37。Above the rotating platform 26, the support table 31 is supported by the holding member 33 suspended from the mounting table 32 so as to be separated from the rotating platform 26. The support table 31 is provided with a cutter wheel 35 that forms a trigger crack on the surface of the brittle material substrate 50, an opening (not shown) for irradiating the brittle material substrate 50 with a laser beam, and a cold known surface for the brittle material substrate 50. The nozzle 37 is cooled.
刀輪35係以刀輪保持具36保持為可於對脆性材料基板50壓接之位置與非接觸之位置升降，僅在形成成為刻劃線之開始起點之觸發裂痕時往對脆性材料基板50壓接之位置下降。觸發裂痕之形成位置係為了抑制從觸發裂痕往無法預測之方向有裂痕產生之先行現象而於比脆性材料基板50之表面側端內側形成較理想。The cutter wheel 35 is held by the cutter holder 36 so as to be movable up and down at a position where the brittle material substrate 50 is pressed against the non-contact position, and is directed to the brittle material substrate 50 only when a trigger crack which is the starting point of the score line is formed. The position of the crimp is lowered. The position at which the trigger crack is formed is preferably formed on the inner side of the surface side end of the brittle material substrate 50 in order to suppress the occurrence of cracks from the trigger crack to the unpredictable direction.
於安裝台32上係設雷射輸出裝置34。從雷射輸出裝置34射出之雷射光束LB係以反射鏡44往下方反射，透過保持於保持構件33內之光學系從形成於支持台31之開口往固定於旋轉平台26上之脆性材料基板50照射。A laser output device 34 is attached to the mounting table 32. The laser beam LB emitted from the laser output device 34 is reflected downward by the mirror 44, and passes through the optical system held in the holding member 33 from the opening formed in the support table 31 to the brittle material substrate fixed to the rotary table 26. 50 irradiation.
此外，從支持台31之設於雷射光束LB射出之開口附近之冷卻噴嘴37係往脆性材料基板50有做為冷卻媒體之 水與空氣一起噴出。冷卻媒體噴出之脆性材料基板50上之位置係在割斷預定線51上且雷射光束LB之照射區域之後側(參照圖2)。Further, the cooling nozzle 37 provided near the opening of the laser beam LB from the support table 31 is connected to the brittle material substrate 50 as a cooling medium. Water is sprayed with the air. The position on the brittle material substrate 50 ejected from the cooling medium is on the cut-off line 51 and on the rear side of the irradiation area of the laser beam LB (refer to FIG. 2).
於安裝台32係設辨識預先刻印於脆性材料基板50之對準標記之一對之CCD攝影機38、39。以此等一對之CCD攝影機38、39檢出脆性材料基板50之設定時之位置偏移，例如在脆性材料基板50偏移角度θ之場合係旋轉平台26旋轉-θ之量，脆性材料基板50偏移Y之場合係滑動平台12移動-Y之量。The mounting table 32 is provided with CCD cameras 38 and 39 for identifying one of the alignment marks previously imprinted on the brittle material substrate 50. The pair of CCD cameras 38 and 39 detect the positional deviation of the brittle material substrate 50 at the time of setting, for example, when the brittle material substrate 50 is offset by the angle θ, the amount of rotation of the rotating platform 26 is -θ, and the brittle material substrate The occasion of the 50 offset Y is the amount by which the sliding platform 12 moves -Y.
於於此種構成之割斷裝置中將脆性材料基板50割斷之場合係先將脆性材料基板50往旋轉平台26上載置並以吸引手段固定。之後，以一對之CCD攝影機38、39拍攝設於脆性材料基板50之對準標記，如前述基於拍攝資料將脆性材料基板50定位於既定之位置。In the case of cutting the brittle material substrate 50 in the cutting device having such a configuration, the brittle material substrate 50 is first placed on the rotary table 26 and fixed by suction means. Thereafter, the alignment marks provided on the brittle material substrate 50 are imaged by a pair of CCD cameras 38 and 39, and the brittle material substrate 50 is positioned at a predetermined position based on the image data as described above.
其次，如前述以刀輪35對脆性材料基板50形成觸發裂痕。之後，從雷射輸出裝置34射出雷射光束LB。雷射光束LB係藉由反射鏡44而如圖2所示，對脆性材料基板50之表面大致垂直地照射。此外，對雷射光束照射區域之後端附近使做為冷卻媒體之水從冷卻噴嘴37噴出。藉由對脆性材料基板50照射雷射光束LB，脆性材料基板50係於厚度方向以熔融溫度未滿加熱，脆性材料基板50係欲熱膨脹，但因局部加熱故無法膨脹而已照射點為中心有壓縮應力發生。此外，於加熱後立刻藉由脆性材料基板50之表面以水冷卻而脆性材料基板50這次是收縮而有拉伸應力發 生。藉由此拉伸應力之作用，以觸發裂痕為開始點沿著割斷預定線51於脆性材料基板50形成垂直裂痕53。Next, a trigger crack is formed on the brittle material substrate 50 by the cutter wheel 35 as described above. Thereafter, the laser beam LB is emitted from the laser output device 34. The laser beam LB is irradiated to the surface of the brittle material substrate 50 substantially perpendicularly by the mirror 44 as shown in FIG. Further, water as a cooling medium is ejected from the cooling nozzle 37 near the rear end of the laser beam irradiation region. By irradiating the brittle material substrate 50 with the laser beam LB, the brittle material substrate 50 is not heated at the melting temperature in the thickness direction, and the brittle material substrate 50 is intended to be thermally expanded, but cannot be expanded due to local heating, and the irradiation point is compressed at the center. Stress occurs. Further, immediately after heating, the surface of the brittle material substrate 50 is cooled by water, and the brittle material substrate 50 is contracted this time and has tensile stress. Health. By the action of the tensile stress, a vertical crack 53 is formed on the brittle material substrate 50 along the cut planned line 51 with the trigger crack as a starting point.
之後藉由使雷射光束LB與冷卻噴嘴37沿著割斷預定線51相對移動，垂直裂痕53伸展而於脆性材料基板50有刻劃線52形成。於此實施形態之場合係在雷射光束LB與冷卻噴嘴37固定於既定位置之狀態下藉由滑動平台12、台座19、旋轉平台26之旋轉機構25而脆性材料基板50移動。當然，在將脆性材料基板50固定之狀態下使雷射光束LB與冷卻噴嘴37移動亦無妨。或使脆性材料基板50與雷射光束LB與冷卻噴嘴37之雙方移動亦無妨。Thereafter, by moving the laser beam LB and the cooling nozzle 37 relatively along the cut planned line 51, the vertical crack 53 is stretched and the fringe material substrate 50 is formed with the score line 52. In the case of this embodiment, the brittle material substrate 50 is moved by the sliding mechanism 12, the pedestal 19, and the rotating mechanism 25 of the rotating platform 26 in a state where the laser beam LB and the cooling nozzle 37 are fixed at a predetermined position. Of course, it is also possible to move the laser beam LB and the cooling nozzle 37 in a state where the brittle material substrate 50 is fixed. Alternatively, the brittle material substrate 50 and both the laser beam LB and the cooling nozzle 37 may be moved.
其次，針對本發明之割斷方法說明。圖3係顯示本發明之割斷方法之一例之步驟圖。如同圖(a)所示，藉由使雷射光束LB與冷卻噴嘴37沿著割斷預定線51相對移動，使以不圖示之觸發裂痕為開始點之垂直裂痕53a於相對移動方向伸展而於脆性材料基板50有第1刻劃線52a形成。Next, the cutting method of the present invention will be described. Fig. 3 is a view showing the steps of an example of the cutting method of the present invention. As shown in (a), by moving the laser beam LB and the cooling nozzle 37 relatively along the planned cutting line 51, the vertical crack 53a starting from the trigger crack (not shown) is extended in the relative moving direction. The brittle material substrate 50 is formed by a first scribe line 52a.
做為在此使用之雷射光束LB係沒有特別限定，由基板之材質或厚度、想要形成之垂直裂痕之深度等適當決定即可。脆性材料基板為玻璃基板之場合，在玻璃基板表面之吸收較大之波長9~11μm之雷射光束合適地使用。The laser beam LB used here is not particularly limited, and may be appropriately determined depending on the material or thickness of the substrate, the depth of the vertical crack to be formed, and the like. When the brittle material substrate is a glass substrate, a laser beam having a large absorption wavelength of 9 to 11 μm on the surface of the glass substrate is suitably used.
做為此種雷射光束係可舉出二氧化碳雷射。做為雷射光束之往基板之照射形狀係於雷射光束之相對移動方向細長之橢圓形狀較理想，相對移動方向之照射長度L係10~60mm之範圍，照射寬度W係1~5mm之範圍較合適。As such a laser beam system, a carbon dioxide laser can be cited. The illumination shape of the laser beam to the substrate is preferably an elliptical shape in which the relative movement direction of the laser beam is elongated, and the irradiation length L in the relative movement direction is in the range of 10 to 60 mm, and the irradiation width W is in the range of 1 to 5 mm. More suitable.
做為從冷卻噴嘴37使噴出之冷卻媒體係可舉出水或酒 精等。此外，於在使用割斷後之脆性材料基板上不會給予不良影響之範圍添加界面活性劑等添加劑亦無妨。做為冷卻媒體之吹送量係通常為數ml/min程度較合適。冷卻媒體導致之基板之冷卻從將以雷射光束加熱之基板急冷之觀點係使水與氣體(通常為空氣)一起噴射之所謂water jet方式較理想。冷卻媒體導致之冷卻區域係為長徑1~5mm程度之原形狀或橢圓形狀較理想。此外，形成為冷卻區域係雷射光束導致之加熱區域之相對移動方向後方且冷卻區域與加熱區域之中心點間之距離成為數mm~數十mm程度較理想。As a cooling medium that is ejected from the cooling nozzle 37, water or wine can be cited. Fine and so on. Further, it is also possible to add an additive such as a surfactant to a range in which no adverse effect is exerted on the brittle material substrate after cutting. The amount of blowing as a cooling medium is usually about several ml/min. The cooling of the substrate caused by the cooling medium is preferably a so-called water jet method in which water is sprayed together with a gas (usually air) from the viewpoint of quenching the substrate heated by the laser beam. The cooling zone caused by the cooling medium is preferably an original shape or an elliptical shape having a long diameter of 1 to 5 mm. Further, it is preferable that the distance between the cooling region and the center point of the heating region in the cooling region is a range of several mm to several tens of mm in the relative movement direction of the heating region caused by the laser beam.
做為雷射光束LB與冷卻噴嘴37之相對移動速度係沒有特別限定，由想要獲得之垂直裂痕之深度等適當決定即可。一般越使相對移動速度緩慢，形成之垂直裂痕就越加深。通常，相對速度係數百mm/sec程度。The relative moving speed of the laser beam LB and the cooling nozzle 37 is not particularly limited, and may be appropriately determined depending on the depth of the vertical crack to be obtained. Generally, the slower the relative movement speed, the deeper the vertical crack formed. Usually, the relative speed coefficient is about 100 mm/sec.
做為構成第1刻劃線52a之垂直裂痕53a之深度雖沒有特別限定，但為了增大後步驟之為了將脆性材料基板割斷之照射雷射光束之條件，例如相對移動速度或雷射輸出等之裕度，使為相對於基板厚度25%以上之深度較理想。The depth of the vertical crack 53a constituting the first score line 52a is not particularly limited. However, in order to increase the conditions for irradiating the laser beam to the bridging material substrate in the subsequent step, for example, the relative movement speed or the laser output, etc. The margin is preferably a depth of 25% or more with respect to the thickness of the substrate.
其次如圖3(b)所示，藉由沿著對第1刻劃線52a正交之割斷預定線51b使雷射光束LB與冷卻噴嘴37相對移動來形成第2刻劃線52b。做為第2刻劃線52b之形成條件係與第1刻劃線52a之形成條件相同條件在此亦可舉出。Next, as shown in FIG. 3(b), the second scribe line 52b is formed by relatively moving the laser beam LB and the cooling nozzle 37 along the cut line 51b orthogonal to the first scribe line 52a. The conditions for forming the second score line 52b are the same as those for forming the first score line 52a.
其次，如同圖(c)所示，沿著第2刻劃線52b再度照射雷射光束LB。藉此垂直裂痕53h於基板厚度方向伸展， 以第2刻劃線52b割斷脆性材料基板50而形成割斷線54。另外，垂直裂痕53b係只要伸展至不施加外力便將脆性材料基板50割斷之深度即可，不一定要到達脆性材料基板50之反面側。Next, as shown in the diagram (c), the laser beam LB is again irradiated along the second scribe line 52b. Thereby, the vertical crack 53h extends in the thickness direction of the substrate, The brittle material substrate 50 is cut by the second scribe line 52b to form a cut line 54. Further, the vertical crack 53b may be stretched to a depth at which the brittle material substrate 50 is cut without applying an external force, and does not necessarily reach the reverse side of the brittle material substrate 50.
為了使垂直裂痕53b於基板厚度方向伸展之雷射光束LB之照射條件雖只要由脆性材料基板50之厚度或垂直裂痕53b之深度等適當決定即可，但通常係形成前述之第2刻劃線52b時之照射條件在此亦例示。The irradiation condition of the laser beam LB for extending the vertical crack 53b in the thickness direction of the substrate may be appropriately determined by the thickness of the brittle material substrate 50 or the depth of the vertical crack 53b, etc., but the second scribe line is usually formed. The irradiation conditions at 52b are also exemplified herein.
其次，如同圖(d)所示，沿著第1刻劃線52a再度照射雷射光束LB。藉此垂直裂痕53a於基板厚度方向伸展，以第1刻劃線52a割斷脆性材料基板50。伸展後之垂直裂痕53a之基板厚度方向之深度係與垂直裂痕53b之場合同樣地，只要伸展至不施加外力便將脆性材料基板50割斷之深度即可，不一定要到達脆性材料基板50之反面側。Next, as shown in the diagram (d), the laser beam LB is again irradiated along the first scribe line 52a. Thereby, the vertical crack 53a extends in the thickness direction of the substrate, and the brittle material substrate 50 is cut by the first scribe line 52a. The depth of the vertical crack 53a after stretching in the thickness direction of the substrate is the same as that of the vertical crack 53b, and the depth of the brittle material substrate 50 may be cut as long as the external force is not applied, and it is not necessary to reach the reverse side of the brittle material substrate 50. side.
在此，重點係在於於沿著第1刻劃線52a再度照射雷射光束LB時使往第1刻劃線52a與割斷線54之交點區域之雷射光束LB之照射量比其他部分之照射量減少。藉由如上述使往第1刻劃線52a與割斷線54之交點區域之雷射光束LB之照射量比其他部分之照射量減少，有效抑制割斷後之成為角部之交點部分之破裂。交點區域中之較理想之雷射光束照射量係交點區域以外之雷射光束照射量之50%以下，較理想係10%以下，更理想係0%。Here, the main point is that when the laser beam LB is irradiated again along the first scribe line 52a, the irradiation amount of the laser beam LB to the intersection region of the first scribe line 52a and the cut line 54 is made larger than that of the other portions. The amount of exposure is reduced. By reducing the amount of irradiation of the laser beam LB to the intersection of the first score line 52a and the cut line 54 as compared with the other portions as described above, it is possible to effectively suppress the breakage of the intersection portion of the corner portion after the cut. The ideal laser beam irradiation amount in the intersection region is 50% or less of the laser beam irradiation amount outside the intersection region, and is preferably 10% or less, more preferably 0%.
另外，在以上說明之實施形態雖係於沿著第1刻劃線52a再度照射雷射光束LB時使往第1刻劃線52a與割斷線 54之交點區域之雷射光束LB之照射量比其他部分之照射量減少，但於沿著第2刻劃線52b再度照射雷射光束LB時使往交點區域之雷射光束LB之照射量比其他部分之照射量減少亦可。或者於沿著第1刻劃線52a再度照射雷射光束LB時與沿著第2刻劃線52b再度照射雷射光束LB時使往交點區域之雷射光束LB之照射量比其他部分之照射量減少亦可。Further, in the embodiment described above, the first scribe line 52a and the cut line are made to be irradiated to the laser beam LB again along the first scribe line 52a. The irradiation amount of the laser beam LB at the intersection point of 54 is smaller than that of the other portions, but the irradiation amount of the laser beam LB toward the intersection region is made when the laser beam LB is irradiated again along the second scribe line 52b. The amount of exposure in other parts can also be reduced. Or, when the laser beam LB is irradiated again along the first scribe line 52a and the laser beam LB is irradiated again along the second scribe line 52b, the irradiation amount of the laser beam LB toward the intersection region is irradiated more than other portions. The amount can be reduced.
往第1刻劃線52a與第2刻劃線52b之交點區域之雷射光束LB之照射量之調整係可以例如雷射光束之輸出之控制來進行。於將雷射光束之照射點以圓柱透鏡等光學系使為於雷射光束之相對移動方向細長之橢圓形狀之場合係如圖4(a)所示，以第1刻劃線52a與第2刻劃線52b之交點為中心，從雷射光束LB之相對移動方向上流側涵蓋至下流側之既定範圍設不照射雷射光束LB之區域。將此時之雷射光束LB之照射量於圖4(b)顯示。如由圖4(b)理解，雷射光束LB之照射量係往第1刻劃線52a與第2刻劃線52b之交點從通常照射量逐漸減少，在交點成為0後，逐漸增加返回通常照射量。如上述，藉由使往第1刻劃線52a與第2刻劃線52b之交點區域之雷射光束之照射量減少，抑制交點部分中之破裂之發生。The adjustment of the amount of irradiation of the laser beam LB to the intersection of the first score line 52a and the second score line 52b can be performed, for example, by control of the output of the laser beam. When the irradiation point of the laser beam is an elliptical shape elongated in the relative movement direction of the laser beam by an optical system such as a cylindrical lens, as shown in FIG. 4(a), the first scribe line 52a and the second line are used. The intersection of the scribe line 52b is centered, and the area from the flow side covering the downstream side of the laser beam LB to the downstream side is set to a region where the laser beam LB is not irradiated. The irradiation amount of the laser beam LB at this time is shown in Fig. 4(b). As understood from Fig. 4(b), the irradiation amount of the laser beam LB gradually decreases from the normal irradiation amount to the intersection of the first scribe line 52a and the second scribe line 52b, and gradually increases back to the normal point after the intersection becomes zero. The amount of exposure. As described above, by reducing the amount of irradiation of the laser beam to the intersection region between the first score line 52a and the second score line 52b, the occurrence of cracks in the intersection portion is suppressed.
做為使雷射光束LB之照射量減少之區域，亦即第1刻劃線52a與第2刻劃線52b之交點區域，係在從第1刻劃線52a與第2刻劃線52b之交點往雷射光束LB之相對移動方向上流側與下流側分別具有5mm以下之寬度之區域較理 想。The region where the irradiation amount of the laser beam LB is reduced, that is, the intersection region between the first score line 52a and the second score line 52b is from the first score line 52a and the second score line 52b. The intersection point has a width of 5 mm or less between the flow side and the downstream side in the relative movement direction of the laser beam LB. miss you.
此外，於使雷射光束LB之照射點使用多邊形鏡或檢流鏡、圓筒型反射鏡等掃瞄並使為於雷射光束之相對移動方向細長之橢圓形狀之場合，照射點內之雷射強度成為均勻且亦可涵蓋既定範圍使雷射照射量為0。於圖5(a)顯示將雷射光束LB之照射狀態經時地顯示之圖。雷射光束LB到達第1刻劃線52a與第2刻劃線52b之交點區域後，掃瞄交點區域內係使雷射振盪為關閉，但出到交點區域外後便使雷射振盪為開啟。藉此，如圖5(b)所示，可使往第1刻劃線52a與第2刻劃線52b之交點區域之雷射光束LB之照射量為0。In addition, in the case where the irradiation point of the laser beam LB is scanned using a polygon mirror, a galvanometer mirror, a cylindrical mirror or the like and the elliptical shape is elongated in the relative movement direction of the laser beam, the lightning in the irradiation point The intensity of the shot becomes uniform and can also cover a predetermined range such that the amount of laser exposure is zero. Fig. 5(a) shows a diagram showing the illumination state of the laser beam LB over time. After the laser beam LB reaches the intersection of the first score line 52a and the second score line 52b, the laser oscillation is turned off in the scan intersection area, but the laser oscillation is turned on after exiting the intersection area. . As a result, as shown in FIG. 5(b), the amount of irradiation of the laser beam LB to the intersection region between the first scribe line 52a and the second scribe line 52b can be made zero.
於圖6顯示調整往第1刻劃線52a與第2刻劃線52b之交點區域之雷射光束LB之照射量之其他之手段。在於此圖顯示之手段係將第1刻劃線52a與第2刻劃線52b之交點區域以被覆構件61覆蓋，使往第1刻劃線52a與第2刻劃線52b之交點區域之雷射光束LB之照射量減少。若利用此手段，沒有如前述實施形態之將雷射振盪開啟、關閉之控制之必要，可以被覆構件61之載置之簡單之作業將雷射光束LB之照射量減少。FIG. 6 shows another means for adjusting the amount of irradiation of the laser beam LB to the intersection of the first score line 52a and the second score line 52b. In the figure shown in the figure, the intersection region between the first score line 52a and the second score line 52b is covered with the covering member 61, and the region to the intersection of the first score line 52a and the second score line 52b is changed. The amount of irradiation of the beam LB is reduced. According to this means, it is not necessary to control the opening and closing of the laser oscillation as in the above embodiment, and the irradiation amount of the laser beam LB can be reduced by a simple operation of placing the covering member 61.
做為在本發明使用之被覆構件61係只要是將雷射光束LB吸收或反射之構件便沒有特別限定，例如，可舉出玻璃基板或鋁等金屬板、乾冰等。於使用玻璃基板之場合係以玻璃基板吸收雷射光束LB，故可以其材質或厚度等調整往脆性材料基板50之雷射光束LB之照射量。此外，於使用 鋁等金屬板之場合係雷射光束LB在金屬板反射故往脆性材料基板50之照射量成為0。The covering member 61 used in the present invention is not particularly limited as long as it is a member that absorbs or reflects the laser beam LB, and examples thereof include a glass substrate, a metal plate such as aluminum, and dry ice. When the glass substrate is used, since the laser beam LB is absorbed by the glass substrate, the irradiation amount of the laser beam LB to the brittle material substrate 50 can be adjusted by the material or thickness thereof. In addition, in use In the case of a metal plate such as aluminum, the amount of irradiation of the laser beam LB reflected on the metal plate to the brittle material substrate 50 becomes zero.
於圖7顯示調整往第1刻劃線52a與第2刻劃線52b之交點區域之雷射光束LB之照射量之再其他之手段。在於此圖顯示之手段係將第1刻劃線52a與第2刻劃線52b之交點區域以液體62覆蓋，使往第1刻劃線52a與第2刻劃線52b之交點區域之雷射光束LB之照射量減少。若利用此手段，與上述實施形態同樣地沒有如前述實施形態之將雷射振盪開啟、關閉之控制之必要，可以液體62之滴下、塗布等簡單之作業將雷射光束LB之照射量減少。FIG. 7 shows still another means for adjusting the amount of irradiation of the laser beam LB to the intersection of the first score line 52a and the second score line 52b. The means shown in this figure is that the intersection of the first score line 52a and the second score line 52b is covered with the liquid 62, and the laser is applied to the intersection of the first score line 52a and the second score line 52b. The amount of irradiation of the light beam LB is reduced. According to this embodiment, as in the above-described embodiment, it is not necessary to control the opening and closing of the laser oscillation as in the above-described embodiment, and the irradiation amount of the laser beam LB can be reduced by a simple operation such as dropping or coating of the liquid 62.
做為在本發明使用之液體62係只要是將雷射光束LB吸收或反射之構件便沒有特別限定，例如，水或酒精等合適地使用。往脆性材料基板50之交點區域之液體62之附著係可以例如洗滌器等之滴下或塗布等來進行。做為液體62之附著量雖係只要由交點區域之大小、使用之雷射之種類或輸出等適當決定即可，於使用水之場合係通常0.01mL~0.05mL之範圍較理想。The liquid 62 to be used in the present invention is not particularly limited as long as it absorbs or reflects the laser beam LB. For example, water or alcohol is suitably used. The adhesion of the liquid 62 to the intersection region of the brittle material substrate 50 can be performed, for example, by dropping or coating a scrubber or the like. The amount of adhesion of the liquid 62 may be appropriately determined by the size of the intersection region, the type of the laser to be used, or the output, and is preferably in the range of 0.01 mL to 0.05 mL in the case of using water.
以上，在說明之各實施形態雖係將第1刻劃線52a與第2刻劃線52b各形成1條而將基板割斷，但於大面積之脆性材料基板50將第1刻劃線52a與第2刻劃線52b分別形成複數條再割斷為多數個之小面積基板之場合本發明之割斷方法亦當然可適用。此外，本發明之割斷方法係除使2個刻劃線正交之場合外，於以所望之角度使交點之場合亦當然可適用。As described above, in each of the embodiments, the first scribe line 52a and the second scribe line 52b are formed in one piece to cut the substrate. However, the first scribe line 52a is formed on the large-area brittle material substrate 50. The second cutting line 52b is formed by forming a plurality of strips and then cutting into a plurality of small-area substrates. The cutting method of the present invention is of course applicable. Further, the cutting method of the present invention is of course applicable to the case where the intersection is made at a desired angle, except for the case where the two scribe lines are orthogonal.
使用於圖1顯示之割斷裝置於厚度0.55mm之化學強化蘇打玻璃基板形成互相正交之複數條之刻劃線以使其交點成為40個，沿著形成之一方之刻劃線照射雷射光束而將基板割斷後，於割斷線與另一方之刻劃線之交點區域載置玻璃板(5mm＊ 5mm＊ 厚度0.4mm)。之後，沿著前述另一方之刻劃線照射雷射光束而將基板割斷為複數個。玻璃基板之割斷係使用於圖3顯示之方法來進行。將結果顯示於表1。另外，雷射光束之具體照射條件係如下述。The cutting device shown in FIG. 1 is used to form a plurality of lines orthogonal to each other in a chemically-strengthened soda glass substrate having a thickness of 0.55 mm so as to have 40 intersection points, and the laser beam is irradiated along one of the square lines. After the substrate was cut, a glass plate (5 mm * 5 mm * thickness 0.4 mm) was placed on the intersection of the cut line and the other line. Thereafter, the laser beam is irradiated along the other of the aforementioned scribe lines to cut the substrate into a plurality of pieces. The cutting of the glass substrate was carried out using the method shown in FIG. The results are shown in Table 1. In addition, the specific irradiation conditions of the laser beam are as follows.
雷射種類：二氧化碳雷射Laser type: carbon dioxide laser
雷射輸出：100WLaser output: 100W
相對移動速度：100mm/secRelative movement speed: 100mm/sec
雷射點：橢圓形Laser point: oval
雷射種類：二氧化碳雷射Laser type: carbon dioxide laser
雷射輸出：120WLaser output: 120W
相對移動速度：200mm/secRelative movement speed: 200mm/sec
雷射點：橢圓形Laser point: oval
雷射種類：二氧化碳雷射Laser type: carbon dioxide laser
雷射輸出：320WLaser output: 320W
相對移動速度：1500mm/secRelative movement speed: 1500mm/sec
雷射點：橢圓形Laser point: oval
於交點區域沒有載置玻璃板以外係使與實施例1同樣來進行基板之割斷。將結果於表1一起顯示。The substrate was cut in the same manner as in Example 1 except that the glass plate was not placed in the intersection region. The results are shown together in Table 1.
「破裂」：於交點部分有破裂產生"rupture": there is a break in the intersection
「交點跳躍」：從交點往雷射光束之相對移動方向下流側割斷線沒有伸展"Intersection jump": from the intersection point to the relative movement direction of the laser beam, the downstream side cut line does not stretch
如由表1理解，相對於以實施例1之方法係40個交點之中在所有交點為割斷良好，以比較例1之割斷方法只有3個交點為割斷良好，在其餘37個交點有破裂發生。As understood from Table 1, the cuts were good at all intersections among the 40 intersections of the method of Example 1, and only 3 intersections of the cut method of Comparative Example 1 were well cut, and cracks occurred at the remaining 37 intersections. .
使代替玻璃板之水(附著量：0.04mL、直徑8~10mm)對交點區域附著以外係使與實施例1同樣來進行基板之割斷。將結果於表2顯示。另外，雷射光束之具體照射條件係如下述。The substrate was cut in the same manner as in Example 1 except that water (adhesion amount: 0.04 mL, diameter: 8 to 10 mm) in place of the glass plate was attached to the intersection region. The results are shown in Table 2. In addition, the specific irradiation conditions of the laser beam are as follows.
雷射種類：二氧化碳雷射Laser type: carbon dioxide laser
雷射輸出：100WLaser output: 100W
相對移動速度：100mm/secRelative movement speed: 100mm/sec
雷射點：橢圓形Laser point: oval
雷射種類：二氧化碳雷射Laser type: carbon dioxide laser
雷射輸出：130WLaser output: 130W
相對移動速度：180mm/secRelative movement speed: 180mm/sec
雷射點：橢圓形Laser point: oval
雷射種類：二氧化碳雷射Laser type: carbon dioxide laser
雷射輸出：240WLaser output: 240W
相對移動速度：1500mm/secRelative movement speed: 1500mm/sec
雷射點：橢圓形Laser point: oval
於交點區域沒有使水滴附著以外係使與實施例2同樣來進行基板之割斷。將結果於表2一起顯示。The substrate was cut in the same manner as in Example 2 except that the water droplets were not adhered to the intersection region. The results are shown together in Table 2.
如由表2理解，相對於以於交點區域使水滴附著之實施例2之割斷方法係40個交點之中在所有交點為割斷良好，以比較例2之割斷方法只有2個交點為割斷良好，在其餘38個交點有破裂發生。As understood from Table 2, among the 40 intersection points of the cutting method of Example 2 in which the water droplets were adhered to the intersection region, the cutting was good at all the intersections, and the cutting method of Comparative Example 2 only had two intersections which were well cut. A rupture occurred at the remaining 38 intersections.
利用本發明之割斷方法，於使用雷射於互相交差之2方向將脆性材料基板割斷之場合可抑制交點部分之破裂之發生，甚為有用。According to the cutting method of the present invention, it is useful to suppress the occurrence of cracking at the intersection portion in the case where the brittle material substrate is cut by the laser in the direction of the mutual intersection.
37‧‧‧冷卻噴嘴37‧‧‧Cooling nozzle
50‧‧‧脆性材料基板50‧‧‧Battery material substrate
51、51a、51b‧‧‧割斷預定線51, 51a, 51b‧‧‧ cut line
52‧‧‧刻劃線52‧‧•marking
52a‧‧‧第1刻劃線52a‧‧‧1st line
52b‧‧‧第2刻劃線52b‧‧‧2nd line
53、53a、53b‧‧‧垂直裂痕53, 53a, 53b‧‧‧ vertical cracks
61‧‧‧被覆構件61‧‧‧covered components
62‧‧‧液體62‧‧‧Liquid
LB‧‧‧雷射光束LB‧‧‧Laser beam
圖1係顯示可實施本發明之割斷方法之割斷裝置之一例之概說圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an example of a cutting device which can implement the cutting method of the present invention.
圖2係說明雷射刻劃之操作狀態之圖。Figure 2 is a diagram illustrating the operational state of the laser scribing.
圖3係顯示本發明之割斷方法之一例之步驟圖。Fig. 3 is a view showing the steps of an example of the cutting method of the present invention.
圖4係顯示往雷射光束LB之交點區域之照射量調整例與在交點區域之雷射照射量之圖。Fig. 4 is a view showing an example of the irradiation amount adjustment to the intersection region of the laser beam LB and the laser irradiation amount in the intersection region.
圖5係顯示往雷射光束LB之交點區域之照射量調整例與在交點區域之雷射照射量之圖。Fig. 5 is a view showing an example of adjustment of the amount of irradiation to the intersection region of the laser beam LB and a laser irradiation amount in the intersection region.
圖6係顯示將往雷射光束LB之交點區域之照射量調整以被覆構件來進行之場合之例之圖。Fig. 6 is a view showing an example in which the irradiation amount to the intersection region of the laser beam LB is adjusted by the covering member.
圖7係顯示將往雷射光束LB之交點區域之照射量調整以液體來進行之場合之例之圖。Fig. 7 is a view showing an example in which the irradiation amount to the intersection region of the laser beam LB is adjusted to be liquid.
37‧‧‧冷卻噴嘴37‧‧‧Cooling nozzle
50‧‧‧脆性材料基板50‧‧‧Battery material substrate
51a、51b‧‧‧割斷預定線51a, 51b‧‧‧ cut line
52a‧‧‧第1刻劃線52a‧‧‧1st line
52b‧‧‧第2刻劃線52b‧‧‧2nd line
53a、53b‧‧‧垂直裂痕53a, 53b‧‧‧ vertical cracks
54‧‧‧割斷線54‧‧‧Cut line
LB‧‧‧雷射光束LB‧‧‧Laser beam
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