TWI458641B - 列印頭及其相關方法與系統 - Google Patents
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- 238000000034 method Methods 0.000 title claims description 17
- 235000012431 wafers Nutrition 0.000 claims description 89
- 239000000463 material Substances 0.000 claims description 21
- 238000007639 printing Methods 0.000 claims description 11
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- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 4
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 4
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- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
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Description
一種列印頭及其相關方法與系統。
供需式噴墨印表機通常依據噴墨列印頭之液滴形成的兩種方式分類。熱泡式噴墨印表機使用帶有加熱致動器的熱式噴墨列印頭將列印頭管道中的墨汁(或其他液體)氣化,形成一個氣泡,迫使噴嘴處的墨水滴出。壓電式噴墨印表機使用帶有壓電致動器的壓電式噴墨列印頭在列印頭管道中產生壓力脈衝將墨滴(或其他液體)推出噴嘴。
當使用高黏性或化學組成無法用於熱式噴墨列印頭的噴墨墨水時,例如紫外線硬化型墨水,壓電式噴墨列印頭會比熱式列印頭更受重用。熱式噴墨列印頭限用於能在沸點溫度之下不產生物理或化學性變質的噴墨墨水。因為壓電式列印頭用壓力(非熱)將墨水推出噴嘴,壓電式列印頭可相容於更多種類的噴墨墨水。因此,壓電式列印頭被廣泛的應用在各式媒材的列印上。
然而,壓電式列印頭其一困難是微機電與壓電制動器驅動電路的架構型態以使列印系統的成本最小化。壓電式列印頭有許多特性是需要以單一噴嘴為單元做電路控制的。例如,調整個別噴嘴並減少鄰近噴嘴的串音干擾需要每個噴嘴使用獨立的電路。然而為每個噴嘴提供電路需要列印頭上額外的面積,因此而增加成本。因此製作具有高噴嘴密度且省錢的的壓電式列印頭是一項仍在進行中的挑戰。
如前所述,一項仍在進行中的挑戰是製作具有高噴嘴密度且省錢的壓電式列印頭。困難點在於列印頭缺乏空間容納控制每個噴嘴的獨立電路。
本揭露內容之實施例面對此項挑戰,大致上透過一壓電式噴墨列印頭,其CMOS電路製作於可移動式薄膜上,用於啟動列印頭。至少將一些CMOS電路製作在因噴墨微機電機構啟動而變形的晶圓表面上,能更有效的利用列印頭的面積並且降低了微機電製作的複雜度。製作CMOS電路且將其結合在晶圓上,形成一或多個晶圓構成微機電系統的一部分,也可減少連接壓力致動器和CMOS電路的成本。
在一實施例中,一列印頭包含一可移動式薄膜,一壓電致動器用於移動薄膜,以及一配置於可移動式薄膜的電子電路。在另一實施例中,一列印系統包含一列印頭,其CMOS電路製作於可移動式薄膜的第一面。一墨水室的底部組成可移動式薄膜的第二面。一壓電致動器製作於CMOS電路上方,用於將可移動式薄膜移向墨水室內部。
在另一實施例中,製作噴墨列印頭的一種方法包括將CMOS電路製作於電路晶圓的第一面。一墨水室製作於電路晶圓的第二面使得墨水室底部形成一可移動式薄膜。製作於電路晶圓第一面的CMOS電路位於可移動式薄膜上面,與製作於電路晶圓第二面的墨水室底部相對。
有關本發明的具體實施方式將藉由實施例於下描述,參照圖式,其中:
第1圖根據一具體實施例,說明一噴墨列印系統適用於實現一列印頭。
第2圖根據一實施例,為一具有一CMOS電路的壓電式噴墨列印頭的側視圖,該CMOS電路設置於一可移動式薄膜。
第3圖根據一實施例說明壓電式列印頭的啟動,經由施加一啟動電壓信號於各別管道上方的壓電材料上。
第4圖根據一實施例,為一壓電式列印頭的晶片堆疊上視圖。
第5圖根據一實施例,說明製作一壓電式列印頭晶片堆疊的一般處理程序。
第1圖根據一實施例,說明適用於實現本案揭露之列印頭或流體噴射裝置的一噴墨列印系統100。在本實施例中,揭露之列印頭為一墨滴噴射列印頭114。噴墨列印系統100包含一噴墨列印頭組件102,一墨水供應組件104,一底座組件106,一媒介輸送組件108,一電子控制器110,以及至少一個電源供應系統112負責供應電源給噴墨列印系統100中的各式電子元件。噴墨列印頭組件102包括至少一個列印頭(流體噴射裝置)或列印頭晶粒114用於通過數個空洞或噴嘴116向列印媒體118噴出墨滴,以便於列印媒體118上列印。列印媒體118是適當的薄片材質,例如紙,卡片,幻燈片,邁勒膠片及類似物。典型地,噴嘴116是安排成一或多列或陣列,所以當噴墨列印頭組件102和列印媒體118相對運動時,從噴嘴116適當地順序噴墨使得文字、符號及/或其他圖畫或影像列印在列印媒體118上。
墨水供應組件104供應液態墨水至列印頭組件102且包含一貯存槽120用於貯存墨水。墨水從貯存槽120流向噴墨列印頭組件102。墨水供應組件104和噴墨列印頭組件102可以做為一單方向墨水供應系統或循環式墨水供應系統。在一單方向墨水供應系統中,實質上所有供應到噴墨列印頭組件102的墨水都在列印過程中消耗完。然而,在一循環式墨水供應系統,只有一部分送到列印頭組件102的墨水在列印過程中被消耗掉。列印未用完的墨水會回到墨水供應系統104。
在一實施例中,噴墨列印頭組件102和墨水供應組件104一起裝置在一墨水夾或筆中。在另一實施例,墨水供應組件104從噴墨列印頭組件102分開並透過一介面連接,例如供應管,以供應墨水到噴墨列印頭組件102。在此二實施例中,墨水供應組件104的貯存槽120可被移除,取代且/或再裝滿。在一實施例中噴墨列印頭組件102和墨水供應組件104一起裝置在一墨水夾,貯存槽120包括一位於墨水夾的局部貯存槽,以及一與墨水夾分開的大貯存槽。該分開的大貯存槽用於再填滿局部貯存槽。因此,大貯存槽及/或局部貯存槽可被移除,取代及/或再填滿。
底座組件106將噴墨列印頭組件102相對於媒介輸送組件108固定,而媒介輸送組件108將列印媒體118相對於噴墨列印頭組件102固定。因此,一列印區域122定義為鄰近噴嘴116,且在噴墨列印頭102和列印媒體118之間的區域。在一實施例中,噴墨列印頭組件102是一掃描式列印頭組件。在一掃描式列印頭組件中,底座組件106包含一滑動架用以將噴墨列印頭組件102相對於媒介輸送組件108移動以掃描列印媒體118。在另一實施例中,噴墨列印頭組件102是一非掃描式的列印頭組件。在一非掃描式的列印頭組件中,底座組件106將噴墨列印頭組件102固定在如前述相對於媒介輸送組件108的位置。因此媒介輸送組件108將列印媒體118相對於噴墨列印頭組件102固定。
電子控制器或印表機控制器110通常包含一處理器,韌體,和其他印表機電子設備用於通訊並控制噴墨列印頭組件102,底座組件106,和媒介輸送組件108。電子控制器110從主機系統(例如電腦)接受資料124,並包含記憶體以暫時儲存資料124。通常資料124經由一電子,紅外線,光學,或其他資料傳輸路徑被送到噴墨列印系統100。資料124代表,例如一將被列印的文件及/或檔案。本身而言,資料124成為噴墨列印系統100的一列印任務而且包含一或多個列印任務指令和/或指令參數。
在一實施例中,電子控制器110控制噴墨列印頭組件102用於從噴嘴116噴出墨滴。因此,電子控制器110定義了噴出墨滴的圖案,在列印媒體118上形成字母,符號和/或其他圖畫或影像。該噴出墨滴的圖案是由列印任務指令和/或指令參數所決定的。
在一實施例中,噴墨列印組件102包含一列印頭114。在其他實施例中噴墨列印組件102是一寬鬆陣列或多頭的列印頭組件。在一寬鬆陣列實施例中,噴墨列印組件102包含一輸送架用於輸送列印頭晶粒114,提供列印頭晶粒114和電子控制器110的電子通訊,並且於列印頭晶粒114和墨水供應組件104間提供射流通訊。
在一實施例中,噴墨列印系統100是一供需式壓電噴墨列印系統,其中列印頭114是一壓電噴墨列印頭,如第2圖所示。根據一實施例,第2圖為一壓電噴墨列印頭114的部分側視圖,具有CMOS電路製作於可移動式薄膜上。壓電列印頭114形成一晶片堆疊506,其通常包含一矽電路晶圓500和一矽微機電系統504,詳述於後,參閱第5圖。壓電噴墨列印頭114提供一壓電噴射元件/致動器200於一墨水室202以產生壓力脈衝將墨水或其他液滴推出噴嘴116。墨水可透過墨水充填孔204補充到墨水室200中。當一致動電壓信號送至連結該墨水室的壓電材料200時,壓力室202產生致動。
根據一實施例,第3圖說明透過施加一致動電壓信號到位於個別墨水室202上方的壓電材料200,一壓電列印頭114的壓力室202的致動。壓電列印頭114包含一製作成個別墨水室202底部的可移動式薄膜206。壓電材料200和可移動式薄膜206連結(黏貼或塑形)。壓電材料200的致動造成材料200向墨水室202方向變形使連接的可移動式薄膜206朝向墨水室202作相關的移位。(為了說明,第3圖誇大此變形和移位)可移動式薄膜206朝向墨水室202的移位減少了墨水室的體積,造成墨滴(或其他液體)從墨水室202透過噴嘴116的噴射。
參閱第2,3圖,壓電列印頭114也包含製作於電路晶圓500表面的電子式CMOS電路208(第5圖)。該CMOS電路208透過標準CMOS製作程序製成,而且可以製作於電路晶圓500的整個上表面,包含在可移動式薄膜206上。因此,可移動式薄膜206依靠壓電材料200的致動彈性地變形造成墨滴噴射,一方面做為墨水室202的底面,另一方面做為矽的實際基底,用來製作CMOS電路208。因此,如第3圖所示,當壓電材料200致動時,CMOS電路208製作在可移動式薄膜206的部分跟隨可移動式薄膜206的彈性變形而移動。
根據一實施例,第4圖為一壓電列印頭114矽晶片堆疊的上視圖。CMOS電路208包含可移動式薄膜電路400和靜態表面電路402。可移動式薄膜電路400製作於可移動式薄膜206之上且包含,例如作為放大電路的驅動電路Q1-Q4,配置以驅動壓電致動器材料200。可移動式薄膜206上的電路400也可包含一植入電阻的應變感測器。
於操作中,薄膜206相對於電路晶圓500表面的平面作上下移動,造成矽晶格受到張力。結果是修正半導體的載子移動率。對於應變感測器電阻而言,其效果就是改變元件的電阻值。對MOS電晶體而言(例如Q1-Q4),在給定閘極電壓下(Vgs),此效果影響元件的飽和電流,依據晶格張力的指向或方向等效的讓電晶體更窄或更寬。然而此效果很小(小於6%),而且計算值顯示晶格張力在0.032到0.054間。對於高精度和/或高速電路而言,此值是可以接受的,而對目前用在最後階段驅動壓電致動器200的輸出驅動電晶體之實施方式而言,已綽綽有餘。
植入電阻的應變感測器可如傳統電阻一般使用,由佈植摻雜進入可移動式薄膜206的矽表面。此類電阻擁有高歐姆/平方的電阻率,且透過佈植它們可以完全機械性地結合在矽表面/基板。傳統的全電橋組態使用四個電阻。機構上,電阻安排成兩個沿著張力方向,而兩個垂直於張力方向。如此,張力信號就可直接從薄膜206的移動中量測。此張力信號可以用來,例如將薄膜206的位置回饋以做控制。
靜態的表面電路402包含各噴嘴電路區塊,其置於電路晶圓500表面的靜止區域(第5圖)圍繞著可移動式薄膜206。該電路區塊包含一邏輯區,一信號產生器區和一放大器電路區。這些區塊一起做為解多工器和功率輸出電路,驅動壓電式致動器200。
根據一實施例,第5圖說明在晶片堆疊上製作壓電列印頭114的一般處理步驟。該處理步驟在第5圖中分為步驟A-E。在步驟A,為一電路晶圓500。該電路晶圓500是一SOI(Silicon on insulator,矽絕緣體)晶圓,製作成全功能的CMOS電路。電路晶圓500包含佈植入且形成於SOI晶圓上的CMOS電路208。關於製作CMOS電路208於電路晶圓500上的步驟是標準的CMOS製程,已被熟悉該技術領域的人所熟知。
在步驟B中,一柄狀晶圓被加/黏(例如熱熔膠)到電路晶圓500上。為了機械性的原因,柄狀晶圓502在處理過程中暫時貼著。例如,柄狀晶圓502允許工具機在處理過程中夾住晶圓組件而不損傷到CMOS電路208。柄狀晶圓502也在接下來的處理步驟中(例如蝕刻)提供機械強度。
在第5圖的步驟C中,墨水室202和可移動式薄膜206製作在電路晶圓500上。墨水室202為蝕刻SOI電路晶圓500至一深度,定義了可移動式薄膜的厚度。此步驟中,蝕刻深度同常由SOI電路晶圓500的蝕刻停止控制,例如二氧化矽層。蝕刻停止提供一機制可精準達成可移動式薄膜206的深度。
在第5圖的步驟D中,顯示一矽為主的MEMS(microelectromechanical systems,微機電系統)晶圓504。MEMS晶圓504製作成包含噴嘴116和墨水充填孔204。MEMS晶圓504無電子功能,和電路晶圓500相反。更確切地說,MEMS晶圓504提供一液體-機械功能使墨水或其他液體能從壓電列印頭114流過。就像電路晶圓500一樣,MEMS晶圓504通常是一SOI晶圓,擁有一或多個蝕刻停止,當製作噴嘴116和墨水充填孔204可提供蝕刻精度。關於製作MEMS晶圓504的步驟是標準的MEMS製程,已被熟悉該技術領域的人所熟知。基礎的MEMS製程步驟包括,例如金屬層沉積(如物理或化學沉積),使用微影術製作各層圖案,和蝕刻(如乾或溼蝕刻)在晶圓上產生想要的形狀,例如噴嘴116和墨水充填孔204。在步驟D中,電路晶圓500和MEMS晶圓504的接合也以虛線顯示出來。
在步驟E中,顯示完整的晶圓堆疊506。在此步驟中,電路晶圓500和MEMS晶圓504經由黏著互相接合(虛線),如此墨水室202和噴嘴116能適當對齊。在步驟E中,明顯的當電路晶圓500和MEMS晶圓504接合後,柄狀晶圓從電路晶圓500上移開。在步驟E中,壓電致動器材料200也加在可移動式薄膜206的面上。於是,製作於可移動式薄膜206上的CMOS電路2008被置於壓電材料200之下。壓電材料200由例如PZT(鈦酸鋯鉛)製成,且通常是塊狀處理,藉此預成形並黏到電路晶圓500的表面。PZT也可以利用薄膜技術直接在可移動式薄膜206的表面上成形。在薄膜技術中,PZT旋置在該電路晶圓500上以作為一液態薄膜塗佈然後在爐中處理。該注意的是將PZT加到電路晶圓500的可移動式薄膜206的薄膜技術已接近CMOS電路所能承受高溫而不引起破壞的工業標準極限。然而,除了PZT以外,薄膜技術可能更適合用於壓電材料200。
100‧‧‧壓電噴墨列印系統
102‧‧‧噴墨頭組件
104‧‧‧墨水供應組件
106‧‧‧底座組件
108‧‧‧媒介輸送組件
110‧‧‧電子控制器
112‧‧‧電源供應系統
114‧‧‧噴射列印頭
116‧‧‧噴嘴
118‧‧‧列印媒體
120‧‧‧貯存槽
122‧‧‧列印區域
124‧‧‧資料
200‧‧‧壓電噴射元件/致動器
202‧‧‧墨水室
204‧‧‧墨水充填孔
206‧‧‧可移動式薄膜
208‧‧‧CMOS電路
400‧‧‧可移動式薄膜電路
402‧‧‧靜態表面電路
500‧‧‧電路晶圓
502‧‧‧柄狀晶圓
504‧‧‧微機電系統晶圓
506‧‧‧晶片堆疊
第1圖根據一具體實施例,說明一噴墨列印系統適用於實現一列印頭。
第2圖根據一實施例,為一具有一CMOS電路的壓電式噴墨列印頭的側視圖,該CMOS電路設置於一可移動式薄膜。
第3圖根據一實施例說明壓電式列印頭的啟動,經由施加一啟動電壓信號於各別管道上方的壓電材料上。
第4圖根據一實施例,為一壓電式列印頭的晶片堆疊上視圖。
第5圖根據一實施例,說明製作一壓電式列印頭晶片堆疊的一般處理程序。
114...噴射列印頭
116...噴嘴
200...壓電噴射元件/致動器
202...墨水室
204...墨水充填孔
206...可移動式薄膜
208...CMOS電路
500...電路晶圓
504...微機電系統晶圓
Claims (14)
- 一種列印頭,包含:一可移動式薄膜;一壓電致動器,用以移動該薄膜;配置於該可移動式薄膜上的主動電子電路;及其中該主動電子電路配置於該壓電致動器和該薄膜之間,且其中該主動電子電路包含多個輸出驅動器,用以驅動該壓電致動器及組配來感測該薄膜之移動的一感測器。
- 如請求項1之列印頭,其中該可移動式薄膜是一電路晶圓的一可移動部分,該列印頭更包含:配置在該電路晶圓之一靜止部分上的電子電路。
- 如請求項2之列印頭,其中該電路晶圓包含一絕緣體上矽(SOI)晶圓。
- 如請求項1之列印頭,其中該感測器為一應變量測電阻器,組配來透過電阻變化,顯示出矽晶體晶格中的應變。
- 一種製作噴墨列印頭的方法,包含下列步驟:在一電路晶圓的一第一面上製造一CMOS電路;及在該電路晶圓的一第二面上形成一腔室,以致該腔室的一底部形成一可移動式薄膜,且該CMOS電路相對立於該腔室之底部配置於該可移動式薄膜上。
- 如請求項5之方法,更進一步包含將壓力致動器材料加至該電路晶圓之第一面上的該CMOS電路之上。
- 如請求項6之方法,其中施加壓力致動器材料之步驟包 含以由一系列所選出的程序來施加,該系列由將預處理的壓力致動器材料黏到該電路晶圓的第一面上以及將壓力致動器材料旋轉塗佈到該電路晶圓的第一面上所組成。
- 如請求項5之方法,其中該電路晶圓包含一SOI(silicon on insulator,絕緣體上矽)晶圓,且形成該腔室之步驟包含蝕刻該SOI晶圓下到一由該SOI晶圓內的二氧化矽層所定義的蝕刻停止層。
- 如請求項5之方法,其中CMOS電路製作在該電路晶圓的該第一面的靜止區域上,該等靜止區域非在該可移動式薄膜上。
- 如請求項5之方法,更進一步包含對該電路晶圓接合一MEMS(microelectromechanical systems,微機電系統)晶圓,其包含一墨水充填孔和一噴嘴,以致該腔室的上方是開的直到該噴嘴的輸入端。
- 如請求項10之方法,更進一步包含:在形成該腔室之前,黏著一柄式晶圓到該電路晶圓的該第一面;及在接合該電路晶圓與該MEMS晶圓之後,將該柄式晶圓從該電路晶圓的該第一面移除。
- 一種列印系統,包含:一列印頭,具有形成在一可移動式薄膜之一第一面上的CMOS電路;一腔室,具有一底部,該底部包含該可移動式薄膜 的一第二面;一壓電致動器,形成於該CMOS電路上方且組配來造成該可移動式薄膜向該腔室內位移;及其中該可移動式薄膜是一電路晶圓的一可移動部分,且其中該CMOS電路包含多個輸出驅動器,用以驅動該壓電致動器及組配來感測該薄膜之移動的一感測器。
- 如請求項12之系統,其中該腔室和該可移動式薄膜形成於一電路晶圓中,該系統更進一步包含:一形成在一MEMS晶圓內的噴嘴;其中該電路晶圓和該MEMS晶圓接合在一起,以提供該墨水室與該噴嘴間的對準和流體連通。
- 如請求項12之系統,其中該列印頭進一步包含:配置於該電路晶圓之一靜止部分上的CMOS電路。
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- 2010-05-27 US US13/695,780 patent/US8789932B2/en active Active
- 2010-05-27 WO PCT/US2010/036431 patent/WO2011149469A1/en active Application Filing
- 2010-05-27 KR KR1020127031058A patent/KR101656915B1/ko active IP Right Grant
- 2010-05-27 CN CN201080067064.3A patent/CN102905903B/zh not_active Expired - Fee Related
- 2010-05-27 JP JP2013512584A patent/JP5632964B2/ja not_active Expired - Fee Related
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Also Published As
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WO2011149469A1 (en) | 2011-12-01 |
EP2576225A4 (en) | 2017-11-08 |
CN102905903B (zh) | 2015-04-22 |
KR20130090764A (ko) | 2013-08-14 |
JP2013527062A (ja) | 2013-06-27 |
BR112012030070A2 (pt) | 2016-08-09 |
JP5632964B2 (ja) | 2014-11-26 |
US20130106961A1 (en) | 2013-05-02 |
CN102905903A (zh) | 2013-01-30 |
BR112012030070B1 (pt) | 2020-04-07 |
KR101656915B1 (ko) | 2016-09-12 |
US8789932B2 (en) | 2014-07-29 |
TW201200364A (en) | 2012-01-01 |
EP2576225A1 (en) | 2013-04-10 |
EP2576225B1 (en) | 2020-01-15 |
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