TWI458612B - 可作ｚ軸運動並具多關節手臂之線性真空機械手 - Google Patents

可作ｚ軸運動並具多關節手臂之線性真空機械手 Download PDF

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Publication number
TWI458612B
TWI458612B TW099130817A TW99130817A TWI458612B TW I458612 B TWI458612 B TW I458612B TW 099130817 A TW099130817 A TW 099130817A TW 99130817 A TW99130817 A TW 99130817A TW I458612 B TWI458612 B TW I458612B
Authority
TW
Taiwan
Prior art keywords
pulley
arm
magnetic coupling
coupled
follower
Prior art date
Application number
TW099130817A
Other languages
English (en)
Chinese (zh)
Other versions
TW201124245A (en
Inventor
Gee Sun Hoey
Terry Bluck
Hoang Huy Vu
Jimin Ryu
Original Assignee
Intevac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intevac Inc filed Critical Intevac Inc
Publication of TW201124245A publication Critical patent/TW201124245A/zh
Application granted granted Critical
Publication of TWI458612B publication Critical patent/TWI458612B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0009—Constructional details, e.g. manipulator supports, bases
    • B25J9/0021—All motors in base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW099130817A 2009-11-10 2010-09-13 可作ｚ軸運動並具多關節手臂之線性真空機械手 TWI458612B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25992809P 2009-11-10 2009-11-10

Publications (2)

Publication Number Publication Date
TW201124245A TW201124245A (en) 2011-07-16
TWI458612B true TWI458612B (zh) 2014-11-01

Family

ID=44174749

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099130817A TWI458612B (zh) 2009-11-10 2010-09-13 可作ｚ軸運動並具多關節手臂之線性真空機械手

Country Status (4)

Country Link
JP (1) JP5984036B2 (ja)
KR (1) KR101829186B1 (ja)
CN (1) CN102110633B (ja)
TW (1) TWI458612B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5434990B2 (ja) * 2011-08-31 2014-03-05 株式会社安川電機 ロボットのアーム構造およびロボット
JP6213079B2 (ja) * 2013-09-09 2017-10-18 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
US10014196B2 (en) 2015-10-20 2018-07-03 Lam Research Corporation Wafer transport assembly with integrated buffers
CN105583854A (zh) * 2016-03-11 2016-05-18 深圳市康明发机器人有限公司 一种机器人用多工位交换装置
CN109994358B (zh) * 2017-12-29 2021-04-27 中微半导体设备(上海)股份有限公司 一种等离子处理***和等离子处理***的运行方法
JP7181068B2 (ja) 2018-11-30 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US11565402B2 (en) 2020-03-09 2023-01-31 Applied Materials, Inc. Substrate transfer devices, systems and methods of use thereof
KR20230088475A (ko) * 2020-10-19 2023-06-19 어플라이드 머티어리얼스, 인코포레이티드 공급 어레인지먼트, 진공 프로세싱 시스템, 및 진공 프로세싱 시스템에서 이동하는 디바이스를 공급하는 방법
KR102678409B1 (ko) * 2023-09-06 2024-06-27 주식회사 폴라리스쓰리디 딜리버리 로봇
CN117506964B (zh) * 2024-01-08 2024-03-22 江苏骠马智能工业设计研究有限公司 用于配电柜的操作机器人的分体式地刀结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4951601A (en) * 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
JPH0446781A (ja) * 1990-06-11 1992-02-17 Seiko Instr Inc 真空内磁気浮上搬送ロボット
US5584647A (en) * 1988-09-16 1996-12-17 Tokyo Ohka Kogyo Co., Ltd. Object handling devices
JP2002066976A (ja) * 2000-08-28 2002-03-05 Assist Japan Kk 基板搬送用真空ロボット
US20090191030A1 (en) * 2006-09-19 2009-07-30 Intevac, Inc. Apparatus and methods for transporting and processing substrates

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6121743A (en) * 1996-03-22 2000-09-19 Genmark Automation, Inc. Dual robotic arm end effectors having independent yaw motion
WO1999017356A1 (en) * 1997-09-30 1999-04-08 Semitool, Inc. Semiconductor processing apparatus having linear conveyor system
US7988398B2 (en) * 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
JP4283559B2 (ja) * 2003-02-24 2009-06-24 東京エレクトロン株式会社 搬送装置及び真空処理装置並びに常圧搬送装置
JP3935883B2 (ja) * 2004-01-06 2007-06-27 コリア インスティテュート オブ サイエンス アンド テクノロジー 可撓性ネジ駆動式高さ調節装置
JP5247094B2 (ja) * 2007-09-14 2013-07-24 インテヴァック インコーポレイテッド 基板処理システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4951601A (en) * 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US5584647A (en) * 1988-09-16 1996-12-17 Tokyo Ohka Kogyo Co., Ltd. Object handling devices
JPH0446781A (ja) * 1990-06-11 1992-02-17 Seiko Instr Inc 真空内磁気浮上搬送ロボット
JP2002066976A (ja) * 2000-08-28 2002-03-05 Assist Japan Kk 基板搬送用真空ロボット
US20090191030A1 (en) * 2006-09-19 2009-07-30 Intevac, Inc. Apparatus and methods for transporting and processing substrates

Also Published As

Publication number Publication date
KR20110052462A (ko) 2011-05-18
KR101829186B1 (ko) 2018-02-14
CN102110633A (zh) 2011-06-29
JP2011103463A (ja) 2011-05-26
CN102110633B (zh) 2016-08-24
TW201124245A (en) 2011-07-16
JP5984036B2 (ja) 2016-09-06

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