TWI447450B - Light guide panel, backlight module, and manufacturing method thereof - Google Patents
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Description
本發明係關於一種背光模組，特別係關於一種導光板結構、背光模組及其製造方法。The invention relates to a backlight module, in particular to a light guide plate structure, a backlight module and a manufacturing method thereof.
液晶顯示裝置已廣泛應用於個人數位助理、筆記型電腦、數位相機、移動電話、液晶電視等電子產品中。但由於液晶顯示裝置為非自發光性的，因此其需要借助背光模組才具顯示功能。Liquid crystal display devices have been widely used in personal digital assistants, notebook computers, digital cameras, mobile phones, LCD TVs and other electronic products. However, since the liquid crystal display device is non-self-illuminating, it needs to have a display function by means of a backlight module.
液晶顯示裝置主要係由一液晶面板及一背光模組所構成。液晶面板主要包括二片透明基板及一液晶層，且此液晶層係配置在於此二透明基板之間。背光模組的出光面面向液晶層，以提供此液晶面板所需之面光源，致使液晶顯示裝置達到顯示的效果。The liquid crystal display device is mainly composed of a liquid crystal panel and a backlight module. The liquid crystal panel mainly includes two transparent substrates and a liquid crystal layer, and the liquid crystal layer is disposed between the two transparent substrates. The light emitting surface of the backlight module faces the liquid crystal layer to provide a surface light source required for the liquid crystal panel, so that the liquid crystal display device achieves the display effect.
習知的背光模組大多採用冷陰極螢光燈管作為光源。近年來，由於光電元件技術水準的提升，發光二極體(light emitting diode，LED)具有小尺寸、低操作電流、低功率消耗、壽命長與製作成本低廉等諸多優點。因此，使用發光二極體作為光源，已成為背光模組另一種新的選擇。Conventional backlight modules mostly use a cold cathode fluorescent tube as a light source. In recent years, due to the improvement of the technical level of photovoltaic components, light emitting diodes (LEDs) have many advantages such as small size, low operating current, low power consumption, long life and low manufacturing cost. Therefore, the use of light-emitting diodes as a light source has become another new option for backlight modules.
值得注意的是，背光模組通常係直接採用白光發光二極體，或是同時混用多個紅光發光二極體、綠光發光二極體與藍光發光二極體作為發光源，以期能夠獲得適當色溫的白光光源。It is worth noting that the backlight module usually uses a white light emitting diode directly, or a plurality of red light emitting diodes, a green light emitting diode and a blue light emitting diode as a light source, in order to obtain a backlight source. A white light source of appropriate color temperature.
一般常見的白光發光二極體係將紅光發光二極體晶片、綠光發光二極體晶片與藍光發光二極體晶片封裝於單一封裝膠體中，藉由各個發光二極體晶片所發出之紅光、綠光與藍光混合以形成白光。於此，在此架構之白光發光二極體中，必須使用最少三個以上的發光二極體晶片，且不同顏色的發光二極體晶片通常係個別進行驅動，藉由控制通入不同顏色的發光二極體晶片的電流，以獲得適當色溫的白光。因此，此架構之白光發光二極體不但成本無法降低，在驅動上亦較為複雜。A common white light-emitting diode system encapsulates a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip in a single package colloid, and the red light emitted by each light-emitting diode chip Light, green light and blue light are mixed to form white light. Therefore, in the white light emitting diode of the architecture, a minimum of three or more LED chips must be used, and the LEDs of different colors are usually driven individually by controlling different colors. The current of the LED chip is illuminated to obtain white light of a suitable color temperature. Therefore, the white light-emitting diode of this structure can not only be reduced in cost but also complicated in driving.
在另一種架構上，白光發光二極體可以是將藍光發光二極體晶片與螢光粉封裝於單一封裝膠體中。在此白光發光二極體中，螢光粉被藍光發光二極體晶片所發出的部分藍光激發，而進一步發出黃光。然後，藉由螢光粉產生的黃光與藍光發光二極體晶片所發出的藍光充分混光後，即可產生白光。然，由於發光二極體之封裝體一般是以點膠方式滴落到發光二極體晶片上，並經由加熱固化而成，因此其表面大多是弧狀曲面，使得封裝體內螢光粉分佈均勻性不易控制，進而導致所形成之白光源發光均勻性較差且發光效率較低。再者，由於此架構之白光發光二極體在實施上需支付額外之權利金，因此在製造成本上並無法有效地減少。In another architecture, the white light emitting diode can encapsulate the blue light emitting diode chip and the phosphor powder in a single encapsulant. In the white light emitting diode, the phosphor powder is excited by a portion of the blue light emitted by the blue light emitting diode chip to further emit yellow light. Then, the yellow light generated by the phosphor powder is sufficiently mixed with the blue light emitted from the blue light emitting diode chip to generate white light. However, since the package of the light-emitting diode is generally dropped onto the light-emitting diode wafer by a dispensing method and solidified by heating, the surface thereof is mostly curved and curved, so that the phosphor powder in the package is evenly distributed. The property is not easy to control, and the white light source formed is poor in uniformity of illumination and low in luminous efficiency. Moreover, since the white light emitting diode of this architecture requires an additional premium in implementation, it cannot be effectively reduced in manufacturing cost.
在一些實施例中，本發明提供一種導光板結構，其包括導光板、光轉換元件和光學防潮層。In some embodiments, the present invention provides a light guide plate structure including a light guide plate, a light conversion element, and an optical moisture barrier layer.
導光板具有一入光面，而光學防潮層覆蓋於入光面上。The light guide plate has a light incident surface, and the optical moisture barrier layer covers the light incident surface.
光轉換元件係位在入光面上且位在導光板與光學防潮層之間。The light conversion element is positioned on the light incident surface and is positioned between the light guide plate and the optical moisture barrier layer.
在一些實施例中，本發明更提供一種背光模組，其包括前述之導光板結構和至少一點光源。In some embodiments, the present invention further provides a backlight module including the foregoing light guide plate structure and at least one light source.
點光源係對應光轉換元件而設置，並且相對於光轉換元件而位在光學防潮層的另一側。The point light source is provided corresponding to the light conversion element, and is positioned on the other side of the optical moisture barrier layer with respect to the light conversion element.
在一些實施例中，入光面可具有至少一凹洞。於此，光轉換元件係位在各個凹洞中，且光學防潮層覆蓋至少一凹洞。In some embodiments, the light incident surface can have at least one recess. Here, the light conversion element is positioned in each of the cavities, and the optical moisture barrier layer covers at least one of the cavities.
其中，點光源係對應於凹洞而設置。Among them, the point light source is provided corresponding to the concave hole.
在一些實施例中，本發明另提供一種導光板結構的製造方法，其包括形成一光轉換元件在一導光板的入光面上，以及在具有光轉換元件的入光面上覆蓋一光學防潮層。其中，光轉換元件係位在導光板與光學防潮層之間。In some embodiments, the present invention further provides a method of fabricating a light guide plate structure, comprising: forming a light conversion element on a light incident surface of a light guide plate, and covering an optical light-proof surface having the light conversion element with an optical moisture-proof surface Floor. Wherein the light conversion element is tied between the light guide plate and the optical moisture barrier layer.
在一些實施例中，本發明更提供一種背光模組的製造方法，其包括前述之導光板結構的製造方法，以及設置至少一點光源在導光板的入光面的一側。In some embodiments, the present invention further provides a method for fabricating a backlight module, comprising the foregoing method for fabricating a light guide plate structure, and providing at least one light source on a side of a light incident surface of the light guide plate.
在一些實施例中，導光板結構的製造方法可更包括：於入光面上形成至少一凹洞。於此，光轉換元件則係形成在各凹洞中。In some embodiments, the method of fabricating the light guide plate structure may further include: forming at least one cavity on the light incident surface. Here, the light conversion element is formed in each of the cavities.
其中，點光源則係對應於凹洞而設置。Among them, the point source is set corresponding to the cavity.
綜上所述，根據本發明之導光板結構、背光模組及其製造方法利用光學防潮層將光轉換元件與外界隔離，以避免光轉換元件受潮加速其光轉換效率的衰減。In summary, the light guide plate structure, the backlight module and the manufacturing method thereof according to the present invention use an optical moisture barrier layer to isolate the light conversion element from the outside to prevent the light conversion element from being dampened to accelerate the attenuation of its light conversion efficiency.
第1圖係為根據本發明第一實施例之背光模組的俯視圖。第2圖係為根據本發明第二實施例之背光模組的俯視圖。而第3圖係為第1及2圖中切線I-I之截面圖。第4圖係為根據本發明第三實施例之背光模組的俯視圖，而第5圖係為第4圖中切線II-II之截面圖。第6圖係為根據本發明第四實施例之背光模組的仰視圖，而第7圖係為第6圖中切線III-III之截面圖。1 is a plan view of a backlight module according to a first embodiment of the present invention. 2 is a plan view of a backlight module according to a second embodiment of the present invention. The third figure is a cross-sectional view of the tangent I-I in the first and second figures. 4 is a plan view of a backlight module according to a third embodiment of the present invention, and FIG. 5 is a cross-sectional view taken along line II-II of FIG. 4. Fig. 6 is a bottom view of a backlight module according to a fourth embodiment of the present invention, and Fig. 7 is a cross-sectional view taken along line III-III of Fig. 6.
參照第1至7圖，背光模組10包括導光板結構110和至少一點光源120。Referring to FIGS. 1 through 7, the backlight module 10 includes a light guide plate structure 110 and at least one light source 120.
各個點光源120均係以發光面朝向導光板結構110而設置。Each of the point light sources 120 is disposed with the light emitting surface facing the light guide plate structure 110.
導光板結構110包括導光板112、光轉換元件114和光學防潮層116。在本實施例中，導光板112可為平板型導光板，但本發明並不以此為限，導光板112亦可為楔型導光板。The light guide plate structure 110 includes a light guide plate 112, a light conversion element 114, and an optical moisture barrier layer 116. In this embodiment, the light guide plate 112 may be a flat light guide plate, but the invention is not limited thereto, and the light guide plate 112 may also be a wedge type light guide plate.
導光板112具有一入光面112a。The light guide plate 112 has a light incident surface 112a.
在一些實施例中，導光板112可具有相對的第一表面112b和第二表面112c，即，分別為在第3、5及7圖中所示之導光板112的上表面和下表面。In some embodiments, the light guide plate 112 may have opposing first and second surfaces 112b, 112c, that is, upper and lower surfaces of the light guide plate 112 shown in FIGS. 3, 5, and 7, respectively.
在一些實施例中，背光模組10可為側邊入光式背光模組，但本發明並不以此為限，背光模組10亦可為直下式(Direct-Type)背光模組。In some embodiments, the backlight module 10 can be a side-lit backlight module, but the invention is not limited thereto. The backlight module 10 can also be a direct-type backlight module.
參照第1至3圖，以側邊入光式背光模組為例，入光面112a例如係導光板112的銜接於第一表面112b和第二表面112c之間的側表面，而導光板112的第一表面112b則作為出光面。此時，點光源120則係以面向導光板112的入光面112a而配置。As shown in FIG. 1 to FIG. 3 , the light-incident surface 112a is connected to the side surface between the first surface 112b and the second surface 112c, and the light guide plate 112 is connected to the light-emitting surface 112. The first surface 112b serves as a light exiting surface. At this time, the point light source 120 is disposed to face the light incident surface 112a of the light guide plate 112.
在一些實施例中，參照第4、5、6及7圖，以直下式背光模組來說，出光面和入光面112a則可分別為導光板112的第一表面112b和第二表面112c。此時，點光源120則係以陣列方式且面向導光板112之入光面112a(即第二表面112c)而配置。In some embodiments, referring to FIGS. 4, 5, 6 and 7, in the case of a direct type backlight module, the light emitting surface and the light incident surface 112a may be the first surface 112b and the second surface 112c of the light guide plate 112, respectively. . At this time, the point light source 120 is arranged in an array manner and faces the light incident surface 112a of the light guide plate 112 (that is, the second surface 112c).
再參照第1至7圖，光轉換元件114係位在入光面112a上。光學防潮層116覆蓋於入光面112a上，並且光轉換元件114係位在導光板112與光學防潮層116之間。Referring again to Figures 1 through 7, the light converting element 114 is positioned on the light incident surface 112a. The optical moisture barrier layer 116 covers the light incident surface 112a, and the light conversion element 114 is positioned between the light guide plate 112 and the optical moisture barrier layer 116.
於此，點光源120係對應光轉換元件114而設置，並且相對於光轉換元件114而位在光學防潮層116的另一側。也就是說，點光源120與光轉換元件114分別位在光學防潮層116的相對兩側。Here, the point light source 120 is provided corresponding to the light conversion element 114 and is positioned on the other side of the optical moisture barrier layer 116 with respect to the light conversion element 114. That is, the point source 120 and the light converting element 114 are respectively located on opposite sides of the optical moisture barrier layer 116.
在本實施例中，各個點光源120例如是發光二極體封裝結構，其具有面向入光面112a之發光面120a。點光源120所提供的光線係由其發光面120a出射。In this embodiment, each of the point light sources 120 is, for example, a light emitting diode package structure having a light emitting surface 120a facing the light incident surface 112a. The light provided by the point source 120 is emitted by its light emitting surface 120a.
於此，點光源120朝向導光板結構110發光，並入射至光轉換元件114或經由入光面112a進入導光板112，進而由導光板112的出光面(即第一表面112b)出射，以形成一面光源。Herein, the point light source 120 emits light toward the light guide plate structure 110, enters the light conversion element 114 or enters the light guide plate 112 via the light incident surface 112a, and is further emitted from the light exit surface (ie, the first surface 112b) of the light guide plate 112 to form One light source.
光轉換元件114將入射光由原波長轉換為其他波長，並經由入光面112a發射至導光板112中。The light conversion element 114 converts the incident light from the original wavelength to another wavelength, and emits it into the light guide plate 112 via the light incident surface 112a.
在一些實施例中，導光板112的入光面112a上形成有至少一凹洞113，如第1至7圖所示。光轉換元件114則是形成在各個凹洞113內。換言之，光轉換元件114嵌設在各個凹洞113中。In some embodiments, at least one recess 113 is formed on the light incident surface 112a of the light guide plate 112, as shown in FIGS. 1 to 7. The light conversion element 114 is formed in each of the recesses 113. In other words, the light conversion element 114 is embedded in each of the recesses 113.
在一些實施例中，點光源120可對應凹洞113設置，以致使點光源120所提供之光線可確實入射至光轉換元件114中。In some embodiments, the point source 120 can be disposed corresponding to the recess 113 such that the light provided by the point source 120 can be incident into the light converting element 114.
在一些實施例中，各個凹洞113與點光源120之間可以一對一的方式配置(如第1、4及5圖所示)，或者是一對多的方式配置(如第2、6及7圖所示)。In some embodiments, each of the recesses 113 and the point source 120 may be arranged in a one-to-one manner (as shown in FIGS. 1, 4, and 5), or in a one-to-many manner (eg, steps 2, 6). And 7 shows).
在一些實施例中，參照第8及9圖，光轉換元件114可額外設置在導光板112的入光面112a上。In some embodiments, referring to FIGS. 8 and 9, the light converting element 114 may be additionally disposed on the light incident surface 112a of the light guide plate 112.
在一些實施例中，光轉換元件114包括光轉換粒子1141。In some embodiments, light converting element 114 includes light converting particles 1141.
光轉換粒子1141可先混合在透光膠體1143中，以形成一混合膠體。再將此混合膠體填充至在導光板112的入光面112a上欲先形成好的凹洞113中(如第1至7圖所示)，或者是直接塗佈在入光面112a上(如第8及9圖所示)。The light converting particles 1141 may be first mixed in the light transmitting colloid 1143 to form a mixed colloid. The mixed colloid is further filled into the recess 113 to be formed on the light incident surface 112a of the light guide plate 112 (as shown in FIGS. 1 to 7), or directly coated on the light incident surface 112a (eg, Figures 8 and 9).
待入光面112a上的混合膠體固化後，即形成光轉換元件114在導光板112的入光面112a上。After the mixed colloid to be incident on the light surface 112a is solidified, the light conversion element 114 is formed on the light incident surface 112a of the light guide plate 112.
在一些實施例中，透光膠體1143可為UV(Ultraviolet；紫外線)膠或熱固膠。UV膠例如光學級SVR(Super View Resin)膠，光學級液態膠(如3M公司的型號3M 2175)。熱固膠例如光學環氧膠或矽膠。光轉換粒子1141例如是螢光粉、量子點、或光轉換物質。In some embodiments, the light transmissive colloid 1143 can be a UV (Ultraviolet) glue or a thermoset glue. UV glues such as optical grade SVR (Super View Resin) glue, optical grade liquid glue (such as Model 3M 2175 from 3M Company). Thermosetting adhesives such as optical epoxy or silicone. The light-converting particles 1141 are, for example, phosphor powder, quantum dots, or a light-converting substance.
舉例而言，為了方便描述，以下以螢光粉為例進行範例說明，然此非本發明之限制，以下範例亦適用於量子點或光轉換物質。For example, for convenience of description, the following examples are exemplified by fluorescent powder. However, the following examples are not applicable to quantum dots or light-converting materials.
為了發出白光，可選用藍光發光二極體封裝結構作為點光源120，而光轉換粒子1141的材質可對應選用發黃光之螢光粉。當部分藍光發光二極體封裝結構發出的藍光投射至光轉換元件114時，會使光轉換元件114中的發黃光之螢光粉激發出黃光。激發出的黃光再與點光源120發出之藍光混合為白光。In order to emit white light, a blue light emitting diode package structure may be selected as the point light source 120, and the material of the light converting particles 1141 may correspond to a yellow light fluorescent powder. When the blue light emitted by part of the blue light emitting diode package is projected to the light converting element 114, the yellowing phosphor in the light converting element 114 is excited to emit yellow light. The excited yellow light is then mixed with the blue light emitted by the point source 120 into white light.
在另一範例中，光轉換粒子1141的材質可同時選用發紅光之螢光粉及發綠光之螢光粉。當部分藍光發光二極體封裝結構發出的藍光投射至光轉換元件114時，會使光轉換元件114中的發紅光之螢光粉激發出紅光並使其中發綠光之螢光粉激發出綠光。激發出的紅光及綠光再與點光源120發出之藍光混合為白光。In another example, the material of the light-converting particle 1141 can simultaneously use a red-emitting phosphor powder and a green-emitting phosphor powder. When the blue light emitted by part of the blue light emitting diode package structure is projected to the light conversion element 114, the red light fluorescent powder in the light conversion element 114 is excited to emit red light and the green light fluorescent powder is excited. Green light. The excited red and green light is then mixed with the blue light emitted by the point source 120 into white light.
在又一範例中，點光源120為紫外光(UV Light)發光二極體封裝結構，而光轉換粒子1141的材質對應選用發紅光之螢光粉、發綠光之螢光粉以及發藍光之螢光粉。同樣地，紫外光發光二極體封裝結構發出的光投射至光轉換元件114時，會使其中的螢光粉分別激發出紅光、綠光以及藍光。激發出的紅光、綠光以及藍光再相互混合為白光，以致使導光板112的發光面120a可發出白光(白色面光線)，即形成面光源。In another example, the point light source 120 is a UV light emitting diode package structure, and the material of the light converting particle 1141 is selected to be a red fluorescent powder, a green fluorescent powder, and a blue light. Fluorescent powder. Similarly, when the light emitted from the ultraviolet light emitting diode package is projected onto the light converting element 114, the phosphor powder therein is excited to emit red light, green light, and blue light, respectively. The excited red light, green light, and blue light are then mixed with each other into white light, so that the light emitting surface 120a of the light guide plate 112 can emit white light (white surface light), that is, a surface light source is formed.
於此，光轉換粒子1141的含量可依據點光源120的種類、光轉換元件114的形狀和/或背光模組10所需的效能而決定。Here, the content of the light-converting particles 1141 may be determined according to the type of the point light source 120, the shape of the light conversion element 114, and/or the performance required of the backlight module 10.
並且，覆蓋於光轉換元件114上的光學防潮層116，可將確保光轉換元件114中的光轉換粒子1141與外界隔離，進而避免光轉換粒子1141受潮加速其衰減。Moreover, the optical moisture barrier layer 116 covering the light conversion element 114 can ensure that the light conversion particles 1141 in the light conversion element 114 are isolated from the outside, thereby preventing the light conversion particles 1141 from being accelerated by the moisture.
在一些實施例中，光學防潮層116的邊緣會貼合在導光板112上，以致使光轉換元件114密封在導光板112與光學防潮層116之間。In some embodiments, the edge of the optical moisture barrier layer 116 will conform to the light guide plate 112 such that the light conversion element 114 is sealed between the light guide plate 112 and the optical moisture barrier layer 116.
在一些實施例中，參照第10及11圖，導光板112的入光面112a可區分為一第一區塊1121和一第二區塊1122。In some embodiments, referring to FIGS. 10 and 11, the light incident surface 112a of the light guide plate 112 can be divided into a first block 1121 and a second block 1122.
第二區塊1122位在入光面112a的邊緣並且環繞整個第一區塊1121。The second block 1122 is located at the edge of the light incident surface 112a and surrounds the entire first block 1121.
光轉換元件114是形成入光面112a的第一區塊1121上。光學防潮層116覆蓋整個光轉換元件114，並且與第二區塊1122貼合。The light converting element 114 is formed on the first block 1121 of the light incident surface 112a. The optical moisture barrier layer 116 covers the entire light conversion element 114 and is bonded to the second block 1122.
在一些實施例中，參照第8及9圖，當光轉換元件114覆蓋整個入光面112a時，光學防潮層116則覆蓋整個光轉換元件114，並且導光板112與入光面112a鄰接的表面貼合。於此，光學防潮層116係與入光面112a鄰接的四個表面，即第一表面112b、第二表面112c、第三表面112d及第四表面112e，貼合。換言之，光學防潮層116可形成套蓋結構而罩在光轉換元件114上，並且套蓋結構的內表面與導光板112的表面貼合。In some embodiments, referring to FIGS. 8 and 9, when the light converting element 114 covers the entire light incident surface 112a, the optical moisture barrier layer 116 covers the entire light converting element 114, and the surface of the light guiding plate 112 adjacent to the light incident surface 112a. fit. Here, the optical moisture barrier layer 116 is bonded to the four surfaces adjacent to the light incident surface 112a, that is, the first surface 112b, the second surface 112c, the third surface 112d, and the fourth surface 112e. In other words, the optical moisture barrier layer 116 may form a cover structure to cover the light conversion element 114, and the inner surface of the cover structure is in contact with the surface of the light guide plate 112.
在一些實施例中，光學防潮層116可為一透光膠體或一阻隔膜。In some embodiments, the optical moisture barrier layer 116 can be a light transmissive gel or a barrier film.
舉例而言，以透光膠體構成光學防潮層116時，可直接塗佈特定厚度的透光膠體在具有光轉換元件114的入光面112a上，並且完全覆蓋住光轉換元件114。塗佈後，在將透光膠體固化以形成光學防潮層。For example, when the optical moisture barrier layer 116 is formed of a light-transmitting colloid, a light-transmitting colloid of a specific thickness can be directly coated on the light-incident surface 112a having the light-converting element 114, and completely covers the light-converting element 114. After coating, the light transmissive colloid is cured to form an optical moisture barrier.
在一些實施例中，光轉換元件114和光學防潮層116所使用的透光膠體可為相同材質，然此並非本發明之限制，即兩者亦可為不同材質。In some embodiments, the light transmissive elements used in the light conversion element 114 and the optical moisture barrier layer 116 may be the same material. However, it is not a limitation of the present invention, that is, the two may be different materials.
在一些實施例中，作為光學防潮層116的透光膠體和作為光轉換元件114的透光膠體(混合膠體)可同時進行固化，亦可分別進行。In some embodiments, the light-transmitting colloid as the optical moisture barrier layer 116 and the light-transmitting colloid (mixed colloid) as the light-converting element 114 may be simultaneously cured or separately.
以阻隔膜作為光學防潮層116時，可在入光面112a上形成光轉換元件114後，直接將阻隔膜黏貼在光轉換元件114上並將阻隔膜的邊緣與導光板112貼合。When the barrier film is used as the optical moisture barrier layer 116, after the light conversion element 114 is formed on the light incident surface 112a, the barrier film is directly adhered to the light conversion element 114 and the edge of the barrier film is bonded to the light guide plate 112.
此外，參照第12圖，在透光膠體1143中還可混入多個擴散粒子1151，以提升光線在導光板結構110中的散射效果。In addition, referring to FIG. 12, a plurality of diffusion particles 1151 may be mixed in the light-transmitting colloid 1143 to enhance the scattering effect of the light in the light guide plate structure 110.
於此實施例中，此些擴散粒子1151之折射率不同於透光膠體1143之折射率，以致使點光源120所提供的光線在進入光轉換元件114中後會被這些擴散粒子1151散射，並且光轉換粒子1141所發出的光線亦可被這些擴散粒子1151散射，因而產生所需要的散射效果。舉例而言，擴散粒子1151之折射率例如約1.49或1.57，且尺寸約3~15um。於此，透光膠體1143的折射率例如約1.52。In this embodiment, the refractive index of the diffusing particles 1151 is different from the refractive index of the transparent colloid 1143, so that the light provided by the point source 120 is scattered by the diffusing particles 1151 after entering the light converting element 114, and The light emitted by the light-converting particles 1141 can also be scattered by the diffusing particles 1151, thereby producing a desired scattering effect. For example, the refractive index of the diffusion particles 1151 is, for example, about 1.49 or 1.57, and the size is about 3 to 15 um. Here, the refractive index of the light-transmitting colloid 1143 is, for example, about 1.52.
在一些實施例中，參照第13及14圖，此些擴散粒子1151亦可設置在光轉換元件114的外部。In some embodiments, referring to FIGS. 13 and 14, such diffusing particles 1151 may also be disposed outside of the light converting element 114.
在一些實施例中，擴散粒子1151可混合在另一透光膠體1153中，以固化形成一擴散元件115。於此實施例中，此些擴散粒子1151之折射率不同於所混合的透光膠體1153之折射率。舉例而言，擴散粒子1151之折射率例如約1.49或1.57，且尺寸約3~15um。此時，透光膠體1153的折射率例如約1.52。In some embodiments, the diffusion particles 1151 can be mixed in another light transmissive colloid 1153 to cure to form a diffusing element 115. In this embodiment, the refractive index of the diffusing particles 1151 is different from the refractive index of the mixed light-transmitting colloid 1153. For example, the refractive index of the diffusion particles 1151 is, for example, about 1.49 or 1.57, and the size is about 3 to 15 um. At this time, the refractive index of the light-transmitting colloid 1153 is, for example, about 1.52.
此光擴散元件115可設置在光轉換元件114與導光板112的入光面112a之間。The light diffusing element 115 may be disposed between the light converting element 114 and the light incident surface 112a of the light guide plate 112.
在一些實施例中，擴散元件115和光轉換元件114所使用的透光膠體可為相同材質，然此並非本發明之限制，即兩者亦可為不同材質。再者，擴散元件115和光學防潮層116所使用的透光膠體可為相同材質，然此並非本發明之限制，即兩者亦可為不同材質。In some embodiments, the light-transmitting colloid used by the diffusing element 115 and the light-converting element 114 may be the same material, but this is not a limitation of the invention, that is, the two may be different materials. Moreover, the transparent colloid used in the diffusing element 115 and the optical moisture barrier layer 116 may be the same material, but this is not a limitation of the present invention, that is, the two may be different materials.
在一些實施例中，背光模組10可更包括一反射層。反射層係 設置在導光板相對於出光面的另一側表面。反射層將進入導光板的光線反射至出光面。In some embodiments, the backlight module 10 can further include a reflective layer. Reflective layer It is disposed on the other side surface of the light guide plate with respect to the light exit surface. The reflective layer reflects the light entering the light guide plate to the light exit surface.
舉例而言，當第2圖中所示之導光板112的第一表面112b係作為出光面時，反射層則係設置在第二表面112c上。For example, when the first surface 112b of the light guide plate 112 shown in FIG. 2 is used as the light exit surface, the reflective layer is disposed on the second surface 112c.
再者，此反射層可為額外設置的一反射片，且此反射片貼合在導光板的表面上。此外，此反射層亦可為直接形成在導光板表面上的金屬鍍膜。Furthermore, the reflective layer may be an additional reflective sheet, and the reflective sheet is attached to the surface of the light guide plate. In addition, the reflective layer may also be a metal plating film formed directly on the surface of the light guide plate.
在一些實施例中，背光模組10可更包括一光學膜片組。光學膜片組係設置在導光板的出光面上。光學膜片組可將出光面出射之面光源均勻化，和/或提高面光源的亮度。光學膜片組例如是擴散板、稜鏡片、增光片或其組合。In some embodiments, the backlight module 10 can further include an optical film set. The optical film set is disposed on the light emitting surface of the light guide plate. The optical film set can homogenize the surface light source exiting the light exiting surface and/or increase the brightness of the surface light source. The optical film set is, for example, a diffusion plate, a gusset, a brightness enhancement sheet, or a combination thereof.
舉例而言，當第2、5及7圖中所示之導光板112的第一表面112b係作為出光面時，光學膜片組則係設置在第一表面112b上。For example, when the first surface 112b of the light guide plate 112 shown in the figures 2, 5, and 7 is used as the light-emitting surface, the optical film group is disposed on the first surface 112b.
綜上所述，根據本發明之導光板結構、背光模組及其製造方法利用光學防潮層將光轉換元件與外界隔離，以避免光轉換元件受潮加速其光轉換效率的衰減。In summary, the light guide plate structure, the backlight module and the manufacturing method thereof according to the present invention use an optical moisture barrier layer to isolate the light conversion element from the outside to prevent the light conversion element from being dampened to accelerate the attenuation of its light conversion efficiency.
雖然本發明的技術內容已經以較佳實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神所作些許之更動與潤飾，皆應涵蓋於本發明的範疇內，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention are encompassed by the present invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.
10‧‧‧背光模組10‧‧‧Backlight module
110‧‧‧導光板結構110‧‧‧Light guide plate structure
112‧‧‧導光板112‧‧‧Light guide plate
112a‧‧‧入光面112a‧‧‧Into the glossy surface
112b‧‧‧第一表面112b‧‧‧ first surface
112c‧‧‧第二表面112c‧‧‧ second surface
112d‧‧‧第三表面112d‧‧‧ third surface
112e‧‧‧第四表面112e‧‧‧Fourth surface
1121‧‧‧第一區塊1121‧‧‧First block
1122‧‧‧第二區塊1122‧‧‧Second block
113‧‧‧凹洞113‧‧‧Deep
114‧‧‧光轉換元件114‧‧‧Light conversion components
1141‧‧‧光轉換粒子1141‧‧‧Light conversion particles
1143‧‧‧透光膠體1143‧‧‧Translucent colloid
115‧‧‧光擴散元件115‧‧‧Light diffusing elements
1151‧‧‧擴散粒子1151‧‧‧Diffusion particles
1153‧‧‧透光膠體1153‧‧‧Translucent colloid
116‧‧‧光學防潮層116‧‧‧Optical moisture barrier
120‧‧‧點光源120‧‧‧ point light source
120a‧‧‧發光面120a‧‧‧Lighting surface
第1圖係為根據本發明第一實施例之背光模組的俯視圖。1 is a plan view of a backlight module according to a first embodiment of the present invention.
第2圖係為根據本發明第二實施例之背光模組的俯視圖。2 is a plan view of a backlight module according to a second embodiment of the present invention.
第3圖係為第1及2圖中切線I-I之截面圖。Figure 3 is a cross-sectional view of the tangent I-I in Figures 1 and 2.
第4圖係為根據本發明第三實施例之背光模組的俯視圖。Figure 4 is a plan view of a backlight module in accordance with a third embodiment of the present invention.
第5圖係為第4圖中切線II-II之截面圖。Fig. 5 is a cross-sectional view taken along line II-II of Fig. 4.
第6圖係為根據本發明第四實施例之背光模組的仰視圖。Figure 6 is a bottom plan view of a backlight module in accordance with a fourth embodiment of the present invention.
第7圖係為第6圖中切線III-III之截面圖。Figure 7 is a cross-sectional view of the tangent III-III in Figure 6.
第8圖係為根據本發明第五實施例之背光模組的仰視圖。Figure 8 is a bottom plan view of a backlight module in accordance with a fifth embodiment of the present invention.
第9圖係為第8圖中切線IV-IV之截面圖。Figure 9 is a cross-sectional view taken along line IV-IV in Figure 8.
第10圖係為第1圖中切線V-V之截面圖。Fig. 10 is a cross-sectional view taken along the line V-V in Fig. 1.
第11圖係為第2圖中切線VI-VI之截面圖。Figure 11 is a cross-sectional view taken along line VI-VI of Figure 2.
第12圖係為根據本發明第六實施例之背光模組的俯視圖。Figure 12 is a plan view of a backlight module in accordance with a sixth embodiment of the present invention.
第13圖係為根據本發明第七實施例之背光模組的俯視圖。Figure 13 is a plan view of a backlight module in accordance with a seventh embodiment of the present invention.
第14圖係為第13圖中切線VII-VII之截面圖。Figure 14 is a cross-sectional view taken along line VII-VII of Figure 13.
10．．．背光模組10. . . Backlight module
110．．．導光板結構110. . . Light guide plate structure
112．．．導光板112. . . Light guide
112a．．．入光面112a. . . Glossy surface
112b．．．第一表面112b. . . First surface
112c．．．第二表面112c. . . Second surface
113．．．凹洞113. . . pit
114．．．光轉換元件114. . . Light conversion element
116．．．光學防潮層116. . . Optical moisture barrier
120．．．點光源120. . . point Light
120a．．．發光面120a. . . Luminous surface
Claims (27)
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| CN102628580A (en) | 2012-08-08 |
| TW201321810A (en) | 2013-06-01 |
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