TWI447326B - Led illumination device and illuminating apparatus employing the same - Google Patents
Led illumination device and illuminating apparatus employing the same Download PDFInfo
- Publication number
- TWI447326B TWI447326B TW100101944A TW100101944A TWI447326B TW I447326 B TWI447326 B TW I447326B TW 100101944 A TW100101944 A TW 100101944A TW 100101944 A TW100101944 A TW 100101944A TW I447326 B TWI447326 B TW I447326B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- led
- light source
- heat sink
- light
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
本發明係有關於一種照明裝置,特別有關於一種針對以LED為光源的照明設備所進行的最佳散熱設計。The present invention relates to a lighting device, and more particularly to an optimal heat dissipation design for a lighting device that uses an LED as a light source.
當LED在進行操作時,隨著光的產生,無可避免地會生成熱。大約有20%的輸入能量會用來做為發光的能量,而剩下的80%都轉換為熱。由於用來照明的LED會使用大電流,以獲取較高的光學功率,但也因此產生了大量的熱,所以散熱的問題是十分重要的。若由LED發出的熱沒有被帶至外界,這些熱就會原封不動地留在LED光源模組之中,在一段長時間過後,LED晶片或印刷電路板就會處在一個非常高溫的環境之中。若在沒有散熱的情況下操作LED一段時間,就會導致LED晶片或印刷電路板的可靠度降低,其電子及光學性能也會被破壞等等,裝置的生命週期也會極度地被縮短。此外,最糟的情況是,LED會因電性上的過載而破裂,引起對LED本身的嚴重損害。When the LED is operating, heat is inevitably generated as the light is generated. About 20% of the input energy is used as the energy of the luminescence, and the remaining 80% is converted to heat. Since the LED used for illumination uses a large current to obtain a higher optical power, but also generates a large amount of heat, the problem of heat dissipation is very important. If the heat emitted by the LED is not carried to the outside world, the heat will remain in the LED light source module intact. After a long period of time, the LED chip or printed circuit board will be in a very high temperature environment. in. If the LED is operated for a while without heat dissipation, the reliability of the LED chip or printed circuit board will be reduced, the electronic and optical properties will be destroyed, and the life cycle of the device will be extremely shortened. In addition, the worst case is that the LED will break due to electrical overload, causing serious damage to the LED itself.
另一方面,由於LED各部位的熱膨脹係數相互不同,若LED曝露在一個極高溫的內部環境,溫度高於最大額定溫度或是不斷重複熱循環時,也會因溫度上的過載而發生嚴重的破裂。封裝中的內部溫度會因高環境溫度及餘熱的生成而提高,在晶片與保護層間也會發生層間破裂的情況,使得封裝內晶片與矽之間的接觸面積變薄,對白色LED來說,螢光鍍膜與矽保護層間或晶片與螢光鍍膜間也會發生層間破裂的情況。此外,過大的環境溫度改變會導致矽的熱膨脹或收縮,而使得導線發生斷裂。On the other hand, since the thermal expansion coefficients of the LED parts are different from each other, if the LED is exposed to an extremely high temperature internal environment, the temperature is higher than the maximum rated temperature or the repeated thermal cycle is repeated, the temperature will be severely overloaded. rupture. The internal temperature in the package is increased due to the high ambient temperature and the generation of residual heat. Interlayer cracking also occurs between the wafer and the protective layer, so that the contact area between the wafer and the crucible in the package is thinned. For white LEDs, Interlayer rupture also occurs between the fluorescent coating and the protective layer or between the wafer and the fluorescent coating. In addition, excessive ambient temperature changes can cause thermal expansion or contraction of the crucible, causing the wire to break.
因此,必需將LED所生成的熱快速傳導至外界。尤其是在使用LED為室內或室外照明設備之光源的情況下,由於LED會被緊密地排列在很小的面積之中,將熱傳導路徑最佳化就變成是一個關鍵的設計,才能使LED晶片所生成的熱被排放至鄰近的空間中。Therefore, it is necessary to quickly transfer the heat generated by the LED to the outside. Especially in the case of using LEDs as the light source for indoor or outdoor lighting equipment, since the LEDs are closely arranged in a small area, optimizing the heat conduction path becomes a key design to enable the LED chip. The generated heat is discharged into the adjacent space.
然而,在使用傳統LED的照明設備中,在設計熱傳導路徑時有個問題。第1圖顯示了一個傳統上一般封閉型LED室外照明設備。散熱器(14)附著於印刷電路板(16)上,LED則一體成型地具有一保護蓋(12),且共同設置於印刷電路板上,而在LED的前方則有用來保護裝置之透明遮蓋(18)。However, in lighting devices using conventional LEDs, there is a problem in designing a heat conduction path. Figure 1 shows a conventionally general closed LED outdoor lighting device. The heat sink (14) is attached to the printed circuit board (16), and the LED has a protective cover (12) integrally formed on the printed circuit board, and a transparent cover for protecting the device in front of the LED. (18).
在LED照明裝置(10)中的主要熱源是LED(20)。來自LED(20)的熱,在下方的部份,會經由空氣而從曝露於晶片及空氣中的導線部位傳導至透明遮蓋(18),以經由它們而被散佈至外界的空氣中;在上方的部份,則會經由印刷電路板(16)及散熱器(14)自LED(20)的連接處以熱傳導的方式傳送至保護遮蓋(12)的內部空氣(部份的熱是經由導線以熱傳導的方式傳送至散熱器),以經由保護遮蓋(12)將熱散佈至外界的空氣。The primary source of heat in the LED lighting device (10) is the LED (20). The heat from the LED (20), in the lower part, is conducted to the transparent cover (18) from the portion of the wire exposed to the wafer and the air via the air to be dispersed into the outside air via them; The part is transferred to the inner air of the protective cover (12) by heat conduction from the junction of the LED (20) via the printed circuit board (16) and the heat sink (14) (part of the heat is conducted through the wire for heat conduction) The way to the radiator) is to distribute the heat to the outside air via the protective cover (12).
同樣地,在傳統的LED照明設備中,當熱自做為熱源的LED(20)傳送至外界空氣時,熱傳遞的路徑通常會包含經由「空氣」的傳遞過程,但由於做為一種氣體的空氣,其熱傳遞的速度遠遠低於液體或固體,LED生成的熱就無法很快速地被散佈出去。此外,又由於LED模組(16、20)及散熱器(14)是一體成型且封閉的,來自LED的熱就無法快速地散佈出去,這就會造成溫室效應。如果在夏日的白天,某盞路燈的控制器故障而誤開了路燈,已經因太陽光形成的高溫再加上LED(20)生成的熱,就會使溫度快速提高至超過LED能夠承受的溫度。這種狀況會使LED的性能受損,造成對其生命週期的嚴重損害。Similarly, in conventional LED lighting equipment, when the LED (20) that heats itself as a heat source is sent to the outside air, the path of heat transfer usually includes a transfer process via "air", but as a gas Air, the rate of heat transfer is much lower than liquid or solid, and the heat generated by the LED cannot be dissipated very quickly. In addition, since the LED modules (16, 20) and the heat sink (14) are integrally formed and closed, the heat from the LEDs cannot be quickly dispersed, which causes a greenhouse effect. If during the summer day, the controller of a street lamp fails and the street lamp is accidentally turned on, the high temperature formed by the sun and the heat generated by the LED (20) will quickly increase the temperature beyond the LED can withstand. temperature. This condition can impair the performance of the LED, causing serious damage to its life cycle.
此外,由於散熱器(14)是與整個LED(20)整合在一起,由每一個LED(20)發出的熱會經由散熱器(14)被傳遞至其他的LED(20),而提高了其他LED的溫度,更加速了裝置的受損。尤其是在使用許多成群LED做為光源的LED照明設備中,因為在印刷電路板上含有多個三列、三行以上且排列緊密的LED,每一個LED不可能具有完全相同的散熱或熱幅射條件。意即,由於每一個LED的位置不同,自每一個LED傳送至散熱器的熱傳遞路徑、每一個LED鄰近LED的排列方式都是不同的,且每一個LED也有不同的散熱速度,因此會產生極大的溫度差異。由於位置越遠離邊緣而靠近中心的LED(20)自其他鄰近LED(20)接受到的熱也越多,其操作性能與生命週期也越會受到不良的影響(操作壽命的不均程度會加大)。又由於整個照明裝置的壽命是由具有最短壽命的LED來決定,所以在各個LED中是不希望見到有很大壽命不均之現象的。In addition, since the heat sink (14) is integrated with the entire LED (20), heat emitted by each of the LEDs (20) is transferred to the other LEDs (20) via the heat sink (14), thereby improving the other The temperature of the LED accelerates the damage of the device. Especially in LED lighting devices that use many clusters of LEDs as light sources, because there are multiple LEDs with three or more rows and tightly arranged LEDs on the printed circuit board, it is impossible for each LED to have the same heat dissipation or heat. Radiation conditions. That is, since the position of each LED is different, the heat transfer path from each LED to the heat sink, the arrangement of adjacent LEDs of each LED are different, and each LED has a different heat dissipation speed, thus generating Great temperature difference. As the position is farther from the edge, the LED (20) near the center receives more heat from other adjacent LEDs (20), and its operating performance and life cycle are also adversely affected (the unevenness of operating life will increase). Big). Moreover, since the life of the entire lighting device is determined by the LED having the shortest life, it is undesirable to see a large life unevenness in each LED.
第2圖顯示了另一個傳統照明裝置(30),其具有單向散熱的結構。一散熱器(36)會直接與裝載LED(32)之印刷電路板(34)接觸,但LED光線通過的前側是被透明的保護遮蓋(38)所包覆或密封起來的。在這種結構中,由於位在前側的透明保護遮蓋(38)具有很差的熱導率,很難有熱會經由此遮蓋散佈出去,而使得在保護遮蓋(38)的內部發生溫室效應。大部份的熱都是經由散熱器(36)單向散出。由於是單向的熱幅射,其散熱速率很低。因此,LED(32)會被加熱至如上述之高溫,而導致發生各種不良效應。Figure 2 shows another conventional illumination device (30) having a unidirectional heat dissipation structure. A heat sink (36) will be in direct contact with the printed circuit board (34) carrying the LEDs (32), but the front side through which the LED light passes is covered or sealed by a transparent protective cover (38). In this configuration, since the transparent protective cover (38) located on the front side has a poor thermal conductivity, it is difficult to have heat spread through the cover, so that a greenhouse effect occurs inside the protective cover (38). Most of the heat is released in one direction via the heat sink (36). Due to the one-way heat radiation, the heat dissipation rate is very low. Therefore, the LED (32) is heated to a high temperature as described above, resulting in various adverse effects.
同樣地,在傳統使用LED做為光源之照明設備中,由做為主熱源之LED所生成之熱,會經由導線及裝載LED之印刷電路板傳送至散熱器。因此,在裝載LED之印刷電路板與散熱器之間的連接處會塗佈導熱油或導熱膠帶。LED的其他部位(LED晶片封裝之側邊及導線之一部)會曝露於空氣中。在這種散熱結構中,由於空氣的熱導率是很差的,大部份LED所生成的熱是經由LED晶片及印刷電路板之底部表面,利用散熱器散佈出去,而極少量的熱能是經由空氣傳送至散熱器然後才直接散佈至外界空氣中的。由於這是一種單向的散熱路徑,其散熱速率是很慢的。因此,熱就會累積在其中而造成LED過熱。由於溫度過熱,螢光材料就會受損,而開始產生黃色斑點及晶片導線短路的情形。Similarly, in a conventional lighting device that uses LEDs as a light source, the heat generated by the LEDs serving as the main heat source is transmitted to the heat sink via the wires and the printed circuit board on which the LEDs are mounted. Therefore, a heat transfer oil or a heat conductive tape is applied to the joint between the printed circuit board on which the LED is mounted and the heat sink. Other parts of the LED (the side of the LED chip package and one of the wires) are exposed to the air. In this heat dissipation structure, since the thermal conductivity of air is very poor, the heat generated by most of the LEDs is transmitted through the bottom surface of the LED chip and the printed circuit board, and is radiated by the heat sink, and a very small amount of heat is It is sent to the radiator via air and then directly distributed to the outside air. Since this is a one-way heat dissipation path, the heat dissipation rate is very slow. Therefore, heat will accumulate in it and cause the LED to overheat. As the temperature is overheated, the phosphor material is damaged and begins to produce yellow spots and shorted wafer leads.
有鑑於此,本發明之一目的是提供一種LED照明裝置,可以更快速、有效地排出LED生成的熱,以解決習知技術中的問題。In view of the above, it is an object of the present invention to provide an LED lighting device that can discharge the heat generated by the LED more quickly and efficiently to solve the problems in the prior art.
本發明另一目的在於提供一種LED照明裝置,可以將來自每一個做為光源用的LED之熱平均地排出,使LED的亮度均勻,以減少LED間操作壽命的差異。Another object of the present invention is to provide an LED lighting device which can discharge heat from each LED used as a light source evenly, so that the brightness of the LED is uniform to reduce the difference in operational life between the LEDs.
本發明又另一目的在於提供一種使用上述多個LED照明裝置之室內或室外照明設備。Still another object of the present invention is to provide an indoor or outdoor lighting apparatus using the above plurality of LED lighting devices.
依本發明為解決上述問題所產生之的目的,提供了一種LED照明裝置,包括一安裝有複數位於一印刷電路板上之發光二極體之LED光源、以及一散熱器,該散熱器具有一光源收納元件,用以收納該LED光源,以曝露該些發光二極體之發光側,而接收來自該LED光源之熱,並將其散至空氣中,該LED照明裝置更包括一熱傳導填充物,由熱導率高於空氣之金屬材料構成,被填入用以收納該LED光源之該光源收納元件中之一可用空間,吸收來自與該LED光源接觸部位之熱,並將所吸收之熱傳送至該散熱器。In order to solve the above problems, an LED lighting device includes an LED light source mounted with a plurality of light emitting diodes on a printed circuit board, and a heat sink having a light source. a receiving component for accommodating the LED light source to expose the light emitting side of the light emitting diodes, and receiving heat from the LED light source and dispersing the heat into the air, the LED lighting device further comprising a heat conductive filler, The utility model is composed of a metal material having a thermal conductivity higher than air, and is filled with one available space of the light source receiving member for accommodating the LED light source, absorbs heat from a contact portion with the LED light source, and transmits the absorbed heat. To the radiator.
在上述的LED照明裝置中,較佳的方式是,熱傳送填充物是以無縫隙的方式填入光源收納元件中的可用空間,使得來自該些發光二極體之熱沿一經過該印刷電路板而抵達該散熱器之路徑進行傳送,而其餘的熱則經由該熱傳導填充物傳送至該散熱器。In the above LED lighting device, preferably, the heat transfer filler fills a usable space in the light source receiving member in a gapless manner, so that heat from the light emitting diodes passes through the printed circuit. The board reaches the path of the heat sink for transfer, and the remaining heat is transferred to the heat sink via the heat transfer filler.
此外,上述的發光二極體具有相同的散熱條件。相同之散熱條件可經由將每一發光二極體與鄰近熱源的位置、散熱器之位置以及熱傳送填充物之位置關係設為相同來達成。Further, the above-described light emitting diodes have the same heat dissipation conditions. The same heat dissipation conditions can be achieved by setting the positional relationship of each of the light-emitting diodes to the adjacent heat source, the position of the heat sink, and the position of the heat transfer filler to be the same.
上述之熱傳導填充物是以填入全部的該可用空間並在所有方向上包圍著該些發光二極體之方式進行填入,以在該LED光源至該光源收納元件之一內牆間形成一最短的熱傳送路徑。The heat conductive filler is filled in such a manner that all of the available space is filled and surrounds the light emitting diodes in all directions to form a wall between the LED light source and one of the light source receiving members. The shortest heat transfer path.
使散熱條件相同的方式之一是,使LED光源具有在該長形印刷電路板上在長度方向上排列成一列或兩列之複數發光二極體,而該散熱器在所有方向上以所有可能最短的方向包圍著每一個發光二極體。One of the ways to make the heat dissipation conditions the same is to have the LED light source have a plurality of light-emitting diodes arranged in a row or two columns in the length direction on the elongated printed circuit board, and the heat sink has all possibilities in all directions. The shortest direction surrounds each of the light-emitting diodes.
上述之散熱器包括一基座以及複數突出至一預設高度之散熱針或散熱翼,該基座係與該光源收納元件共同形成、在長度方向上延伸並在長度方向上之一側中央部位具有一隧道外形,其中用以曝露該些發光二極體發光部位之複數光輸出孔係形成於該光源收納元件中,而該些散熱針或散熱翼係自該基座至少一外側表面或內側表面之一延伸至一預設長度,以將熱幅射面積最大化。The heat sink includes a pedestal and a plurality of heat dissipating pins or heat dissipating fins protruding to a predetermined height, the pedestal being formed together with the light source accommodating member, extending in the longitudinal direction and at a central portion of the length direction Having a tunnel shape, wherein a plurality of light output holes for exposing the light emitting portions of the light emitting diodes are formed in the light source receiving member, and the heat dissipating pins or heat dissipating fins are from at least one outer surface or inner side of the base One of the surfaces extends to a predetermined length to maximize the heat radiation area.
舉例來說,上述之散熱器可以包括:一第一散熱槽,具有一沿一長度方向延伸並在一表面沿一長度方向之中央部位上具有一溝槽,且在該第一基座之一表面上形成有複數散熱針或散熱翼之一部;以及一第二散熱槽,在該長度方向上具有複數光輸出孔,與該光源收納元件之上部開口以及至少該第一基座之一部接合而覆蓋於上,以使該光源收納元件形成有一隧道外形。For example, the heat sink may include: a first heat sink having a groove extending along a length direction and having a groove along a longitudinal direction of a surface, and one of the first bases Forming a plurality of heat dissipating pins or one of the heat dissipating fins on the surface; and a second heat dissipating groove having a plurality of light output holes in the length direction, and an upper opening of the light source receiving member and at least one of the first bases The cover is covered to make the light source receiving member form a tunnel shape.
在上述的散熱器中,較佳的方式是,在至少該些散熱翼之一部中,形成有一個或一個以上之左、右通氣孔,以使該些散熱翼之間的空氣能夠流通。此外,在該散熱器之基座中形成有一個或一個以上之垂直通氣孔,以使該基座之一下方部位中的熱可以上升。In the above heat sink, preferably, one or more left and right vent holes are formed in at least one of the heat dissipating fins to allow air between the heat dissipating fins to circulate. Additionally, one or more vertical vents are formed in the base of the heat sink such that heat in the lower portion of one of the pedestals can rise.
在上述的LED照明裝置中,該熱傳導填充物之材料具有較空氣為高的熱導率,且呈現膠狀或在完成填充後硬化。該熱傳導填充物至少是導熱油或導熱矽膠之一。In the above-described LED lighting device, the material of the heat-conductive filler has a thermal conductivity higher than that of air, and is gel-like or hardened after completion of filling. The thermally conductive filler is at least one of a heat transfer oil or a thermal conductive silicone.
此外,上述之LED照明裝置更包括一透明熱傳送保護元件,覆蓋於曝露在該散熱器之該些發光二極體的發光面,並保護該發光面,且將所產生之熱傳送至外界空氣或該散熱器。其中,該熱傳送保護元件包括至少一透明導熱矽膠或一透明保護膜之一,該透明導熱矽膠填滿整個光輸出孔且覆蓋該發光二極體之發光面,將來自發光二極體發光面之熱導出,並傳送至該散熱器及外界空氣,而該透明保護膜係附著於鄰近區域中包含該些光輸出孔之該散熱器表面之一部。In addition, the LED lighting device further includes a transparent heat transfer protection component covering the light emitting surface of the light emitting diodes exposed to the heat sink, protecting the light emitting surface, and transmitting the generated heat to the outside air. Or the radiator. Wherein, the heat transfer protection component comprises at least one transparent heat conductive silicone or a transparent protective film, the transparent heat conductive silicone fills the entire light output hole and covers the light emitting surface of the light emitting diode, and is emitted from the light emitting diode The heat is led out and transmitted to the heat sink and the outside air, and the transparent protective film is attached to a portion of the heat sink surface of the adjacent area including the light output holes.
另一方面,根據本發明的另一實施例,提供了一種LED照明設備,包括:多個LED光源模組,每一該LED光源模組係以一單一模組之方式組合而成,每一該單一模組包括:一LED光源,安裝有複數位於一印刷電路板上之發光二極體;一散熱器,具有一光源收納元件,用以收納該LED光源,以向下曝露該些發光二極體之發光側,而將被傳送之熱散至空氣中;一熱傳導填充物,包括一熱導率高於空氣之金屬材料,被填入用以收納該LED光源之該光源收納元件中之一可用空間,吸收來自與該LED光源接觸部位之熱,並將所吸收之熱傳送至該散熱器;以及一透明熱傳送保護元件,覆蓋並保護自該散熱器曝露之該些發光二極體之發光面,且將來自該發光面之熱傳送至至少外界空氣或該散熱器之一;以及一燈具外殼,用以遮蓋該些以複數列並排設置之LED光源模組,且將其支撐與固定。其中,由每一該發光二極體所產生之熱之一部係經由該印刷電路板傳送至該散熱器,而另一部份之熱係經由該熱傳導填充物之熱導效應傳送至該散熱器,其餘的熱則經由該透明熱傳送保護元件傳送至該散熱器或直接散佈至外界空氣中。In another aspect, according to another embodiment of the present invention, an LED lighting device includes: a plurality of LED light source modules, each of the LED light source modules being combined in a single module, each The single module includes: an LED light source mounted with a plurality of light emitting diodes on a printed circuit board; a heat sink having a light source receiving component for receiving the LED light source to expose the light emitting light downward a light-emitting side of the polar body, and the heat to be transferred is dispersed into the air; a heat-conductive filler, including a metal material having a thermal conductivity higher than air, is filled in the light source receiving member for accommodating the LED light source a usable space absorbing heat from a portion in contact with the LED light source and transferring the absorbed heat to the heat sink; and a transparent heat transfer protection member covering and protecting the light emitting diodes exposed from the heat sink a light emitting surface, and transferring heat from the light emitting surface to at least one of the outside air or the heat sink; and a lamp housing for covering the plurality of LED light source modules arranged side by side in a plurality of columns and supporting the same Fixed. Wherein, one part of the heat generated by each of the light-emitting diodes is transmitted to the heat sink via the printed circuit board, and another part of the heat is transferred to the heat dissipation via the heat conduction effect of the heat-conductive filler The remaining heat is transferred to the heat sink via the transparent heat transfer protection element or directly to the outside air.
此外,又另一方面,依據本發明另一目的,提供了一種照明設備,包括:一光源套裝模組,具有多個如上述之LED照明裝置,該些LED照明裝置係以平行、串聯或平行、串聯混合之方式排列而組合成一單一模組;以及一燈具外殼,用以支撐及固定該些LED照明裝置,並覆蓋至少該光源模組之一上側。In addition, in another aspect, according to another object of the present invention, a lighting device is provided, comprising: a light source set module having a plurality of LED lighting devices as described above, the LED lighting devices being parallel, serial or parallel And a series of modules arranged to form a single module; and a lamp housing for supporting and fixing the LED lighting devices and covering at least one of the upper sides of the light source module.
上述之LED照明設備更包括一電源供應器,用以將一普通電源轉換成可適用於操作該些LED照明裝置並供應至該印刷電路板之電力。The LED lighting device described above further includes a power supply for converting a common power source into power suitable for operating the LED lighting devices and supplied to the printed circuit board.
上述之燈具外殼包括一燈具遮蓋,用以遮蓋住該光源套裝模組,該燈具遮蓋具有一通氣孔,用以將來自該LED照明裝置之熱快速散佈至外界。The luminaire housing includes a luminaire cover for covering the light source set module, and the luminaire cover has a vent hole for quickly dissipating heat from the LED illuminating device to the outside.
此外,上述之燈具外殼更包括一支柱連接架,用以連接至一支柱或一室內或室外照明設備之支撐本體。In addition, the above lamp housing further includes a post connector for connecting to a support or a support body of an indoor or outdoor lighting device.
再者,上述之燈具外殼更可以包括一燈具遮蓋,用以遮蓋該光源套裝模組,由於該遮蓋係與該光源套裝模組中的每一個LED照明裝置隔離,使得該遮蓋之設置不會在其間產生直接的熱傳導。Furthermore, the lamp housing may further include a luminaire cover for covering the light source set module. Since the cover is isolated from each LED lighting device in the light source set module, the cover setting is not There is direct heat transfer between them.
如上述之發明,熱傳送填充物之填充方式是使散熱器中用以收納光源之光源收納元件中的可用空間被填滿。此外,在LED裝置之前發光面上塗佈有透明的熱介面材料,而在光源收納元件中的光輸出孔是被封合的。由LED裝置所生成的熱,一大部份會經由熱傳送填充物或透明熱介面材料以熱傳導的方式傳送至散熱器或排放至外界空氣。此外,因為散熱器之設計是讓每一個LED裝置以最近的距離被散熱器包圍著,熱傳送填充物或透明熱介面材料所建立的熱傳導路徑是最短的。由於熱介面材料會直接自LED裝置所有的接觸部位直接吸熱並均勻地經由全面性最短的路徑以熱傳導的方式傳送至散熱器,因此排熱或熱幅射的進行是非常快速有效的,也避免LED過熱,使得裝置的光學性能與壽命可以被延長。此外,每一個LED裝置是獨立的,且具有實質相同的散熱環境,因此在LED裝置之間的熱干擾是很低的,而使得熱聚集現象幾乎不存在,又在這些LED裝置間幾乎沒有溫差,而使得LED裝置可均勻發光,其壽命就可穩定且一致。According to the invention described above, the heat transfer filler is filled in such a manner that the available space in the light source housing member for housing the light source in the heat sink is filled. Further, the light-emitting surface is coated with a transparent heat interface material before the LED device, and the light output holes in the light source housing member are sealed. A large portion of the heat generated by the LED device is transferred to the heat sink or to the outside air via a heat transfer filler or a transparent heat interface material in a thermally conductive manner. In addition, because the heat sink is designed such that each LED device is surrounded by a heat sink at the closest distance, the heat transfer path established by the heat transfer filler or transparent thermal interface material is the shortest. Since the thermal interface material directly absorbs heat from all the contact parts of the LED device and is uniformly transmitted to the heat sink through the shortest comprehensive path, the heat removal or heat radiation is very fast and effective, and is also avoided. The LED is overheated, allowing the optical performance and lifetime of the device to be extended. In addition, each LED device is independent and has substantially the same heat dissipation environment, so the thermal interference between the LED devices is very low, so that the heat accumulation phenomenon is almost non-existent, and there is almost no temperature difference between the LED devices. Therefore, the LED device can be uniformly illuminated, and its life can be stable and consistent.
由於LED裝置是以單列或兩列的方式設置,就可以很容易為每一個LED裝置設計出一致的散熱環境,而可以單獨地將LED光源模組化。Since the LED device is arranged in a single column or in two columns, it is easy to design a uniform heat dissipation environment for each LED device, and the LED light source can be separately modularized.
當藉由將多個LED光源模組共同組合成一個照明設備的情況時,由於即使某一個LED裝置發生故障,也不需要將整個照明設備拆解或替換,只需要將特定損壞LED裝置之光源模組進行修理或替換即可,因此可以降低維修的難度及管理成本。此外,藉由改變LED光源模組的設置位置,也可以得到不同的照明設備設計。When a plurality of LED light source modules are collectively combined into one lighting device, since even if one LED device fails, the entire lighting device does not need to be disassembled or replaced, and only the light source that specifically damages the LED device is needed. Modules can be repaired or replaced, thus reducing maintenance and management costs. In addition, different lighting device designs can also be obtained by changing the setting position of the LED light source module.
此外,照明設備具有用以阻擋陽光之遮蓋,且每一個LED光源模組具有單獨的遮蓋,因此即便在自動開關系統發生故障而誤開時,LED晶片也會受到遮蓋的保護。In addition, the illuminating device has a cover for blocking sunlight, and each of the LED light source modules has a separate cover, so that the LED chip is protected by the cover even if the automatic switch system malfunctions and is accidentally opened.
為使本發明之上述目的、特徵和優點能更明顯易懂,下文特舉一較佳實施例,並配合所附圖式,作詳細說明如下:The above described objects, features and advantages of the present invention will become more apparent and understood.
以下將介紹根據本發明所述之較佳實施例。必須說明的是,本發明提供了許多可應用之發明概念,所揭露之特定實施例僅是說明達成以及使用本發明之特定方式,不可用以限制本發明之範圍。Preferred embodiments in accordance with the present invention will now be described. It is to be understood that the invention is not limited by the scope of the invention.
第3a及3b至第6圖為本發明第一實施例中光源模組(120)結構之立體圖及分解圖。光源模組(120)是一種LED照明裝置,其包括一LED光源(105)、一散熱器(110)以及熱傳送填充物(126)。3a and 3b to 6 are perspective and exploded views showing the structure of the light source module (120) in the first embodiment of the present invention. The light source module (120) is an LED lighting device that includes an LED light source (105), a heat sink (110), and a heat transfer filler (126).
LED光源(105)包括多個安裝於具有操作LED所需電路圖案之印刷電路板(124)上的LED裝置(102)。印刷電路板(124)之電路圖案係連接至一電源供應器(稍後說明),接收電力並供應操作電流至每一個LED裝置(102)。LED裝置(102)包括一LED晶片(102a)及一覆蓋在LED晶片(102a)上端之螢光材料的發光面(102b),其中,當電流在LED晶片(102a)中流動時,就會自此螢光材料產生光,而經由發光面(102b)發射出來。LED光源(105)被收納於一光源收納元件(122)之中,使得LED裝置(102)之一前側發光面被曝露在外。光源收納元件(122)是散熱器(110)之一部。散熱器(110)之結構材料,可以吸收來自做為熱源的LED光源(105)的熱,並快速地將熱排放至大氣中。在光源收納元件(122)之底面上經由市面上可取得之導熱油或導熱膠帶而附著有LED光源(105)之印刷電路板(124)。The LED light source (105) includes a plurality of LED devices (102) mounted on a printed circuit board (124) having a circuit pattern required to operate the LEDs. The circuit pattern of the printed circuit board (124) is connected to a power supply (described later), receives power and supplies operating current to each of the LED devices (102). The LED device (102) includes an LED chip (102a) and a light emitting surface (102b) covering the upper end of the LED chip (102a), wherein when current flows in the LED chip (102a), This fluorescent material generates light and is emitted via the light emitting surface (102b). The LED light source (105) is housed in a light source housing member (122) such that one of the front side light emitting surfaces of the LED device (102) is exposed. The light source housing element (122) is part of the heat sink (110). The structural material of the heat sink (110) absorbs heat from the LED light source (105) as a heat source and rapidly discharges heat to the atmosphere. A printed circuit board (124) of the LED light source (105) is attached to the bottom surface of the light source housing member (122) via a commercially available heat transfer oil or thermal conductive tape.
除了這些基本元件之外,本發明最重要的新特徵在於,光源收納元件(122)在收納了LED光源(105)之後所形成的空間並不是只有空氣,而是填入了一種熱傳送填充物(126),其熱導率是遠比空氣高的。熱傳送填充物(126)可以是任何具有良好熱導率之材料,也可以是透明或不透明的。熱介面材料之熱導率是較空氣為高的,而且最好是呈乳膠狀而可以很方便地進行填充及處理,並在填充完成後會硬化。舉例來說,可以是導熱油、熱矽膠(導熱矽膠)等等。然而,它也不一定必需是呈乳膠狀的,即使只是具彈性的固體或液體,只要有良好的熱導率都可以被使用。In addition to these basic components, the most important new feature of the present invention is that the space formed by the light source housing member (122) after housing the LED light source (105) is not only air but is filled with a heat transfer filler. (126), its thermal conductivity is much higher than air. The heat transfer filler (126) can be any material having good thermal conductivity, or it can be transparent or opaque. The thermal conductivity of the thermal interface material is higher than that of air, and is preferably latex-like and can be easily filled and treated and hardened after filling. For example, it may be a heat transfer oil, a hot silicone (thermal conductive silicone), or the like. However, it does not necessarily have to be in the form of a latex, and even if it is only a solid or liquid, it can be used as long as it has a good thermal conductivity.
為了能使經由熱傳送填充物(126)排放之熱最大化,最好能以無縫隙的方式將熱傳送填充物(126)填入光源收納元件(122)之可用空間中。藉此,熱傳送填充物(126)會覆蓋LED裝置(102)之所有側邊表面、導線、光源收納元件(122)整個內牆以及印刷電路板(124)。如此,LED裝置(102)之四個側邊至散熱器(110)(意即,光源收納元件(122)之內牆)都具有一通過熱傳送填充物(126)以熱傳導方式進行散熱之路徑。In order to maximize the heat rejected by the heat transfer filler (126), it is preferred to fill the heat transfer filler (126) into the available space of the light source receiving member (122) in a seamless manner. Thereby, the heat transfer filler (126) covers all of the side surfaces of the LED device (102), the wires, the entire inner wall of the light source receiving member (122), and the printed circuit board (124). Thus, the four sides of the LED device (102) to the heat sink (110) (that is, the inner wall of the light source receiving member (122)) have a path for heat dissipation by heat transfer of the filler (126). .
上述之LED裝置(102)最好是具有實質相同的散熱條件。以LED裝置(102)所組成的光源模組之壽命,是由整個LED裝置(102)中具最短壽命之LED裝置來決定。若每一個LED裝置(102)之散熱條件差異很大,其中一個LED裝置(102)會遠較其他LED裝置提早損壞,而造成光源模組的壽命大大地被縮短。若LED裝置(102)之散熱條件都相同,其發光性能及平均壽命就會比較一致。因此,光源模組(120)之平均壽命會因而實質被延長。LED裝置(102)之散熱條件可以由每一個LED裝置(102)與鄰近熱源(其他的LED裝置)、散熱器(110)及熱介面材料(稍後說明)等等的位置關係來決定。藉由將每一LED裝置(102)之此種位置關係一致化,就可以得到一致的散熱條件。Preferably, the LED device (102) described above has substantially the same heat dissipation conditions. The life of the light source module composed of the LED device (102) is determined by the LED device having the shortest life in the entire LED device (102). If the heat dissipation conditions of each of the LED devices (102) are greatly different, one of the LED devices (102) will be damaged earlier than other LED devices, and the life of the light source module is greatly shortened. If the heat dissipation conditions of the LED device (102) are the same, the illuminating performance and the average life span will be relatively uniform. Therefore, the average life of the light source module (120) is thus substantially extended. The heat dissipation conditions of the LED device (102) can be determined by the positional relationship of each of the LED devices (102) with an adjacent heat source (other LED devices), a heat sink (110), and a thermal interface material (described later). By aligning the positional relationship of each LED device (102), uniform heat dissipation conditions can be obtained.
此外,每一個LED裝置(102)及散熱器(110)最好是設置得越靠近越好,以將每一個LED裝置(102)生成的熱快速傳送至散熱器(110)。為達此目的,最好是能將整個LED裝置(102)在印刷電路板(124)上以並排的方式設置成一列或兩列。這種排列方式可用來使LED裝置(102)具有相同的散熱條件。此外,將每一個LED裝置(102)與光源收納元件(122)內牆的距離縮短,會縮短熱傳送填充物(126)所形成之熱傳送路徑,所以也有助於快速地散熱。In addition, each LED device (102) and heat sink (110) are preferably placed as close as possible to rapidly transfer the heat generated by each of the LED devices (102) to the heat sink (110). To this end, it is preferred that the entire LED device (102) be arranged in a row or two on the printed circuit board (124) side by side. This arrangement can be used to provide the LED device (102) with the same heat dissipation conditions. In addition, shortening the distance between each of the LED devices (102) and the inner wall of the light source housing member (122) shortens the heat transfer path formed by the heat transfer filler (126), and thus contributes to rapid heat dissipation.
當然,LED裝置(102)也可以被排成三列,但在這種排列下,就不容易設計及製造出具有相同散熱條件之LED裝置,並且在相同散熱條件與印刷電路板、散熱器的設計效果間也必需進行折衷。Of course, the LED devices (102) can also be arranged in three columns, but in this arrangement, it is not easy to design and manufacture LED devices having the same heat dissipation conditions, and in the same heat dissipation conditions as the printed circuit boards and heat sinks. A compromise must also be made between design effects.
印刷電路板(124)也具有一長矩形,以符合LED裝置(102)所排列出來的形狀。舉例來說,在排成單列的情況下,LED裝置(102)間的間隔是相同的,而散熱器(110)及熱傳送填充物(126)會對稱地設置在每一個LED裝置(102)之右側及左側。而在排成雙列的情況下,散熱器(110)及熱傳送填充物(126)也可以以同樣的方式排列在每一個LED裝置(102)旁。然而,在排成超過三列的情況時,由於在最外側列的LED裝置(102)只有在單側有其他鄰近的LED裝置,而在中間列的LED裝置(102)在兩側都有其他鄰近的LED裝置,所以它們與鄰近熱源的位置關係是不同的,且在右側及左側上與散熱器之距離及其他的散熱條件也不同,LED裝置(102)之散熱速率會隨著其位置越靠近中間列而越慢,其溫度也會越高。The printed circuit board (124) also has a long rectangular shape to conform to the shape of the LED device (102). For example, in the case of a single row, the spacing between the LED devices (102) is the same, and the heat sink (110) and the heat transfer filler (126) are symmetrically disposed on each of the LED devices (102). Right and left. In the case of a double row, the heat sink (110) and the heat transfer filler (126) can also be arranged next to each of the LED devices (102) in the same manner. However, in the case of being arranged in more than three columns, since the LED devices (102) in the outermost row have only other adjacent LED devices on one side, the LED devices (102) in the middle row have other sides on the other side. Adjacent LED devices, so their positional relationship with adjacent heat sources is different, and the distance from the heat sink and other heat dissipation conditions on the right and left sides are different. The heat dissipation rate of the LED device (102) will be more along with its position. The slower you are near the middle column, the higher the temperature will be.
散熱器(110)包括一用以收納LED光源(105)之光源收納元件(122),以將LED裝置(102)之前側發光面曝露在外。散熱器(110)最好是由具有良好熱導率的金屬構成(例如鋁、鋁合金、銅或銅合金),以吸收來自LED光源(105)所生成之熱,並將其有效地排至大氣中。散熱器(110)具有一沿縱長方向上延伸之基座(111)、以及多個散熱針(圖未顯示)或散熱翼(112)。其中,散熱針自基座(111)的外側表面或內側表面突出一預設高度,以將散熱面積極大化。而散熱翼(112)則是突出至一預設高度並延伸至一預設長度。基座(111)之形狀是長矩形,在其一面沿縱長方向的中央處形成有具有隧道外形的光源收納元件(122),而在光源收納元件(122)中則具有光輸出孔(119),用以將LED裝置(102)之發光面曝露在外。為了增加散熱面積,散熱突出部(圖未顯示)或其他各種不同的突出形狀都可以使用,不限於使用散熱翼(112)。光源收納元件(122)本身的形狀也可以改變,任何如垂直形、環形、橢圓形的形狀都是適用的。光源收納元件(122)的位置最好是在散熱器(110)的中央,但也不限於此,也可因不同的需求而偏向一邊。此外,在散熱器(110)的一側表面上可以具有一側蓋接合槽(127),以在安裝側面遮蓋時可以鎖入螺絲。The heat sink (110) includes a light source housing member (122) for housing the LED light source (105) to expose the front side light emitting surface of the LED device (102). The heat sink (110) is preferably made of a metal having a good thermal conductivity (for example, aluminum, aluminum alloy, copper or copper alloy) to absorb heat generated from the LED light source (105) and efficiently discharge it to In the atmosphere. The heat sink (110) has a base (111) extending in the longitudinal direction, and a plurality of heat sink pins (not shown) or heat sink wings (112). Wherein, the heat dissipating pin protrudes from the outer surface or the inner side surface of the base (111) by a predetermined height to maximize the heat dissipating area. The heat dissipating fins (112) protrude to a predetermined height and extend to a predetermined length. The base (111) has a long rectangular shape, and a light source housing member (122) having a tunnel outer shape is formed at a center of one side thereof in the longitudinal direction, and a light output hole (119) is provided in the light source housing member (122). ) for exposing the light emitting surface of the LED device (102). In order to increase the heat dissipation area, heat dissipation protrusions (not shown) or other various protruding shapes may be used, and are not limited to the use of the heat dissipation fins (112). The shape of the light source receiving member (122) itself may also vary, and any shape such as a vertical shape, a ring shape, or an elliptical shape is suitable. The position of the light source housing member (122) is preferably at the center of the heat sink (110), but is not limited thereto, and may be biased to one side due to different needs. Further, a side cover engaging groove (127) may be provided on one side surface of the heat sink (110) to lock the screw when the mounting side is covered.
如第3a、3b及4圖之散熱器(110),可以使用將上散熱槽(第一散熱槽)(110a)及下散熱槽(第二散熱槽)(110b)組合而成並將LED光源(105)置於其間的方式來製作,以方便生產。當然,散熱器(110)也可以是一體成型的。上散熱槽(110a)包括在縱長方向上延伸並在一側表面的縱長方向***處形成有長矩形溝槽之第一基座,以及多個設置在第一基座(111a)表面、用以使散熱面積極大化的散熱針或散熱翼(112)。下散熱槽(110b)包括一第二基座(111b),第二基座(111b)在縱長方向上具有多個光輸出孔(119)、遮蓋住光源收納元件(122)之上端開口以及至少第一基座(111a)之一部、並接合而形成一隧道。在第二基座(111b)之表面上可以提供一散熱針或散熱翼(112)。以隧道外形形成的光源收納元件(122)具有一可用空間,用以在其收納LED光源(105)時可將熱傳送填充物(126)填入。此可用空間最好是位在每一個LED裝置(102)的所有側邊表面附近。For the heat sink (110) of Figures 3a, 3b and 4, the upper heat sink (first heat sink) (110a) and the lower heat sink (second heat sink) (110b) can be combined and the LED light source (105) Placed in between to make it easy to produce. Of course, the heat sink (110) can also be integrally formed. The upper heat dissipation groove (110a) includes a first base extending in the longitudinal direction and having a long rectangular groove formed at the center in the longitudinal direction of one side surface, and a plurality of surfaces disposed on the first base (111a) A heat sink or heat sink (112) for maximizing the heat dissipation area. The lower heat sink (110b) includes a second base (111b) having a plurality of light output holes (119) in the longitudinal direction, covering the upper end opening of the light source receiving member (122), and At least one of the first pedestals (111a) is joined and joined to form a tunnel. A heat sink or fin (112) may be provided on the surface of the second pedestal (111b). The light source receiving member (122) formed in the tunnel shape has a usable space for filling the heat transfer filler (126) when it houses the LED light source (105). This available space is preferably located near all of the side surfaces of each of the LED devices (102).
在散熱器(110)上形成有散熱翼(114)的情況下,最好可以形成水平通氣孔(114a),其係以垂直於散熱翼(114)之方向穿越,以使空氣能在散熱翼(114)之間水平地流通。水平通氣孔(114a)可以被安裝在散熱翼(114)中,或是只在最外側的散熱翼上。此外,在散熱器(110)之基座(111)中可以形成有一個或一個以上的垂直通氣孔(114b),以使散熱器(110)下方的熱可以上升並有效地被排放至外界。藉由這些水平通氣孔(114a)及/或垂直通氣孔(114b),散熱器(110)就可以與外界空氣進行熱交換,而使散熱更有效率。In the case where the heat dissipating fins (114) are formed on the heat sink (110), it is preferable to form a horizontal vent hole (114a) which is traversed in a direction perpendicular to the heat dissipating fins (114) so that air can be radiated in the fins Circulate horizontally between (114). The horizontal vents (114a) can be mounted in the fins (114) or only on the outermost fins. Further, one or more vertical vent holes (114b) may be formed in the base (111) of the heat sink (110) so that heat under the heat sink (110) can rise and be effectively discharged to the outside. With these horizontal vents (114a) and/or vertical vents (114b), the heat sink (110) can exchange heat with the outside air to make heat dissipation more efficient.
在這些結構中,由於發光面是經由光輸出孔(119)向外曝露的,因此LED裝置(102)就處於可能受到外界環境損害的危險之中。此外,若熱傳送填充物(126)是呈乳膠狀,就可能經由光輸出孔(119)的縫隙而滲漏出來。另外,LED裝置(102)生成之熱也必需有效地從發光面排放出來。所以,在考慮這些因素後,最好能再提供一個透明的熱傳送保護元件,遮蓋住LED裝置(102)經由散熱器(110)之光輸出孔(119)所曝露之發光面(102b),並將光輸出孔(119)密封,以保護發光面且將熱自該發光面傳送至外界空氣及/或散熱器(110)。舉例來說,用來封合光輸出孔(119)之材料最好可以使用透明的熱導矽膠(128)。透明熱導矽膠係塗佈在LED裝置經由光輸出孔(119)而曝露之發光面(102b)上,它也最好能與下散熱槽(110b)直接接觸。藉由此種的直接接觸,熱導矽膠(128)就可以將吸收自LED裝置(102)發光面(102b)的熱快速地經由散熱器(110)進行排放。由於透明熱導矽膠(128)與LED裝置(102)發光面(102b)接觸並以上述之方式快速排熱,光源模組(120)的散熱速率就會被提高。另外,也可以藉由使用透明保護膜(129)來覆蓋發光面(102b)的方式來進行封合。除此之外,也可以使用上述兩種方法的混合方式來進行封合,意即,可以將熱導矽膠(128)塗佈在LED裝置(102)之發光面(102b)上,然後再將包含發光面之鄰近區域再覆上一層透明保護膜(129)。藉此,LED裝置(102)就可以受到保護,而自發光面(102b)所發出的熱就可以被吸收且排放至外界。In these configurations, since the light emitting surface is exposed outward through the light output aperture (119), the LED device (102) is at risk of being damaged by the external environment. Further, if the heat transfer filler (126) is in the form of a latex, it may leak through the gap of the light output hole (119). In addition, the heat generated by the LED device (102) must also be efficiently discharged from the light emitting surface. Therefore, after considering these factors, it is preferable to provide a transparent heat transfer protection element to cover the light emitting surface (102b) exposed by the LED device (102) via the light output hole (119) of the heat sink (110). The light output aperture (119) is sealed to protect the light emitting surface and transfer heat from the light emitting surface to the outside air and/or heat sink (110). For example, a material for sealing the light output aperture (119) may preferably use a transparent thermal conductive silicone (128). The transparent thermal conductive adhesive is applied to the light-emitting surface (102b) exposed by the LED device via the light output hole (119), and it is also preferably in direct contact with the lower heat sink (110b). With such direct contact, the thermal conductive silicone (128) can quickly dissipate heat absorbed from the light emitting surface (102b) of the LED device (102) via the heat sink (110). Since the transparent thermal conductive silicone (128) is in contact with the light emitting surface (102b) of the LED device (102) and rapidly dissipates heat in the manner described above, the heat dissipation rate of the light source module (120) is increased. Alternatively, the sealing may be performed by covering the light-emitting surface (102b) with a transparent protective film (129). In addition, the sealing method of the above two methods may also be used for sealing, that is, the thermal conductive silicone (128) may be coated on the light emitting surface (102b) of the LED device (102), and then The vicinity of the light-emitting surface is covered with a transparent protective film (129). Thereby, the LED device (102) can be protected, and the heat emitted from the self-illuminating surface (102b) can be absorbed and discharged to the outside.
在上述本發明第一實施例之光源模組(120)之散熱結構中,由於散熱之機制係設置在熱源中央的四周且與空氣接觸,其散熱速率就會被最佳化。意即,做為主熱源的LED裝置(102)主要是經由LED裝置(102)某些部位與散熱器(110)、熱傳送填充物(126)、熱導矽膠(128)及印刷電路板(124)-熱導膠(圖未顯示)的直接接觸而以熱傳導的方式進行散熱,而被散熱器(110)、熱傳送填充物(126)、熱導矽膠(128)及印刷電路板(124)-熱導膠所吸收的熱則是再次地傳送至散熱器(110),然後再被排放出去,使得整個散熱機制非常地有效率。由於熱是藉由熱傳導的方式被排放至外界空氣,自LED光源(105)所有點至光源收納元件內牆的熱傳送在各個方向上都是均勻的,且在每個方向上的熱傳導路徑都是最短的。同樣地,由於在散熱機制中,自LED裝置(102)生成的熱有相當大的部份是自所有方向經由與LED裝置(102)接觸之熱傳送填充物(126)而傳送至散熱器(110)的,且這些熱也在所有方向上散佈並經由熱導矽膠(128)傳送至散熱器,所以本發明中的光源模組(120)之散熱速率是遠高於傳統的光源模組的。In the heat dissipation structure of the light source module (120) according to the first embodiment of the present invention, since the heat dissipation mechanism is disposed around the center of the heat source and is in contact with the air, the heat dissipation rate is optimized. That is to say, the LED device (102) as the main heat source is mainly through some parts of the LED device (102) and the heat sink (110), the heat transfer filler (126), the thermal conductive silicone (128) and the printed circuit board ( 124) - direct contact of the thermal conductive adhesive (not shown) to dissipate heat by heat conduction, and by the heat sink (110), heat transfer filler (126), thermal conductive silicone (128) and printed circuit board (124) ) - The heat absorbed by the thermal conductive adhesive is again transferred to the heat sink (110) and then discharged, making the overall heat dissipation mechanism very efficient. Since heat is discharged to the outside air by means of heat conduction, heat transfer from all points of the LED light source (105) to the inner wall of the light source receiving member is uniform in all directions, and the heat conduction paths in each direction are It is the shortest. Similarly, due to the heat dissipation mechanism, a substantial portion of the heat generated from the LED device (102) is transferred from all directions to the heat sink via the heat transfer filler (126) in contact with the LED device (102) ( 110), and the heat is also distributed in all directions and transmitted to the heat sink via the thermal conductive silicone (128), so the heat dissipation rate of the light source module (120) in the present invention is much higher than that of the conventional light source module. .
第7及8圖顯示了本發明第二實施例中之光源模組(220)的結構。此光源模組(220)包括了一散熱器(310),其含有一光源收納元件(312),光源收納元件(312)在縱長方向沿基座(314)之中央處具有矩形溝槽。在光源收納元件(312)之底部經由熱導膠附著有一在縱長方向上延伸之LED光源(105)的印刷電路板(124)。在基座(314)之左、右兩側與光源收納元件(312)之間具有多個對稱排列的散熱翼(316)。整個散熱器(310)的中間部位會覆蓋住LED光源(105),而呈現出反射鏡之外形。收納了LED光源(105)的光源收納元件(312)會被一個收納元件遮蓋(320)所遮蓋。在收納元件遮蓋(320)上與LED裝置(102)之位置相對應處具有光輸出孔(322)。每一個光輸出孔(322)會以如同第一實施例中的方式被密封。被收納元件遮蓋(320)所遮蓋住的光源收納元件(312)中之內部空間是被熱傳送填充物(126)所填滿。收納元件遮蓋(320)之底面及光源收納元件(312)之內牆是與熱傳送填充物(126)直接接觸的。收納元件遮蓋(320)之光輸出孔(322)的內牆則與熱導矽膠(128)直接接觸。散熱器(310)及收納元件遮蓋(320)是使用具有極佳熱導率之金屬材料所製成。Figures 7 and 8 show the structure of the light source module (220) in the second embodiment of the present invention. The light source module (220) includes a heat sink (310) including a light source receiving member (312) having a rectangular groove along the center of the base (314) in the longitudinal direction. A printed circuit board (124) having an LED light source (105) extending in the longitudinal direction is attached to the bottom of the light source housing member (312) via a thermal conductive adhesive. A plurality of symmetrically disposed radiating fins (316) are disposed between the left and right sides of the base (314) and the light source receiving member (312). The middle portion of the entire heat sink (310) covers the LED light source (105) and exhibits a mirror shape. The light source housing member (312) in which the LED light source (105) is housed is covered by a housing member cover (320). A light output aperture (322) is provided on the receiving element cover (320) corresponding to the position of the LED device (102). Each of the light output apertures (322) will be sealed in the same manner as in the first embodiment. The internal space in the light source housing member (312) covered by the housing member cover (320) is filled with the heat transfer filler (126). The bottom surface of the receiving member cover (320) and the inner wall of the light source housing member (312) are in direct contact with the heat transfer filler (126). The inner wall of the light output aperture (322) of the receiving element cover (320) is in direct contact with the thermal conductive silicone (128). The heat sink (310) and the receiving member cover (320) are made of a metal material having excellent thermal conductivity.
因此,熱傳送填充物(126)會吸收大量來自每一個LED裝置(102)及印刷電路板(124)周圍側邊表面生成之熱,並將其傳送至散熱器(310)及收納元件遮蓋(320),以將其排放至外界空氣。熱導矽膠(128)也會吸收來自每一個LED裝置(102)發光面之熱,並將其直接排放至外界空氣或收納元件遮蓋(320)。收納元件遮蓋(320)也會扮演散熱器的角色(以這種觀點來看,散熱器(310)可以被視為是一上散熱槽,而收納元件遮蓋(320)可以被視為是下散熱槽)。此種散熱機制幾乎與第一實施例中的相同。Therefore, the heat transfer filler (126) absorbs a large amount of heat generated from the side surfaces of each of the LED devices (102) and the printed circuit board (124), and transfers them to the heat sink (310) and the storage member cover ( 320) to discharge it to the outside air. The thermal conductive silicone (128) also absorbs heat from the light emitting surface of each of the LED devices (102) and discharges it directly to the outside air or the receiving member cover (320). The storage element cover (320) also acts as a heat sink (in this view, the heat sink (310) can be considered an upper heat sink, and the storage element cover (320) can be considered as a lower heat sink. groove). This heat dissipation mechanism is almost the same as that in the first embodiment.
光源模組(220)可以更包括一保護膜(330),覆蓋在收納元件遮蓋(320)上。此外,在散熱器(310)的兩端沿縱長方向上是以螺絲鎖接一安裝蓋(340),以將散熱器(310)、LED光源(105)及收納元件遮蓋(320)安裝成一個模組。而印刷電路板(124)與一導線(350)連接,以連接至可提供LED操作所需電力之電源供應器(134)。The light source module (220) may further include a protective film (330) covering the receiving member cover (320). In addition, a mounting cover (340) is screwed into the longitudinal direction of both ends of the heat sink (310) to mount the heat sink (310), the LED light source (105) and the receiving component cover (320). A module. The printed circuit board (124) is coupled to a conductor (350) for connection to a power supply (134) that provides the power required for LED operation.
光源模組(120、220)本身是個完整的照明設備,只要提供一操作所需電力至印刷電路板(124),就可以正常操作,但藉由將多個光源模組(120、220)組合起來也可以形成一個更大的照明設備(100)。第9及10圖顯示了本發明第三實施例的照明設備(100)。The light source module (120, 220) itself is a complete lighting device, as long as it provides a power required for operation to the printed circuit board (124), it can operate normally, but by combining a plurality of light source modules (120, 220) It can also form a larger lighting device (100). Figures 9 and 10 show a lighting apparatus (100) of a third embodiment of the present invention.
照明設備(100)包括一光源套裝模組(130)及一燈具外殼(150)。光源套裝模組(130)是由四個光源模組(120)共同形成一組,而燈具外殼(150)則將光源模組(120)支撐住。以四個光源模組(120)來形成一個套裝模組只是舉例說明,光源套裝模組(130)可以由更多的光源模組(120及或220)來形成。燈具外殼(150)的功能之一在於做為固定LED光源套裝模組(130)及電源供應器(134)之框架,而另一功能則是做為保護它們不受外界因素而損壞之保護器,例如下雪、下雨、霧氣、濕氣、日曬等等。更具體地的是,有多個光源模組(120)被並排設置(以平行的方式)在燈具外殼(140)中,而使光源套裝模組(130)中,LED裝置(102)之發光面是面向下方且被固定住的。這些光源模組(120)也可以依需要以串聯的方式設置,或以平行、串聯混合的方式設置。燈具外殼(140)之底面與每一個光源模組(120)相對之位置上可以是透明的或直接開孔。燈具外殼(140)可以依需要而有不同型式的設計。The lighting device (100) includes a light source set module (130) and a light fixture housing (150). The light source set module (130) is formed by a group of four light source modules (120), and the light source module (150) supports the light source module (120). Forming a kit with four light source modules (120) is merely illustrative. The light source kit (130) can be formed by more light source modules (120 and or 220). One of the functions of the lamp housing (150) is as a frame for fixing the LED light source package module (130) and the power supply (134), and another function is to protect them from external factors. Such as snow, rain, fog, moisture, sun and so on. More specifically, a plurality of light source modules (120) are arranged side by side (in a parallel manner) in the lamp housing (140), and the LED device (102) is illuminated in the light source kit (130). The face is facing down and fixed. The light source modules (120) may also be arranged in series as needed, or in a parallel or series mixing manner. The bottom surface of the lamp housing (140) may be transparent or directly open at a position opposite to each of the light source modules (120). The luminaire housing (140) can be of different types as desired.
光源套裝模組(130)係被一具有反射鏡外形的燈罩(142)所遮蓋。在燈罩(142)中可以具有通氣孔(143),以將光源模組(120)所生成之熱快速排放至外界。尤其是,因為燈罩(142)是與每一個LED光源模組(120或220)分離的,所以燈罩(142)之設計並非要形成直接的熱傳導。燈罩(142)之功能在於做為室外日光之遮罩,但並不會將日光所生成的熱直接經由熱傳導的方式傳送至每一個LED光源模組(120或220)。即使LED光源模組在白天被誤開,它也可以保護LED晶片不會過熱。The light source set module (130) is covered by a lamp cover (142) having a mirror shape. A vent hole (143) may be provided in the lamp cover (142) to quickly discharge heat generated by the light source module (120) to the outside. In particular, because the lampshade (142) is separate from each of the LED light source modules (120 or 220), the lampshade (142) is not designed to provide direct heat transfer. The function of the lampshade (142) is to act as a mask for outdoor sunlight, but the heat generated by daylight is not directly transmitted to each of the LED light source modules (120 or 220) via heat conduction. Even if the LED light source module is accidentally opened during the day, it can protect the LED chip from overheating.
在燈罩(142)的上方一側接合著一連接元件(146),其中具有一收納空間。連接元件(146)係連接至一支柱連接架(144),用以連接支撐一照明設備,例如街燈。在連接元件(146)的內部空間中也收納了延伸自普通電源並穿過支柱連接架(144)之電線、以及連接至此電線而用以操作光源模組(120)之控制器(145)。控制器(145)是電源供應器(134)之全部或一部。電源供應器(134)之主要功能在於將普通電源轉換可適用於操作LED裝置並產生光之電壓,並將此電壓供應至印刷電路板(124)。電源供應器(134)可以是AC-DC轉換器、DC-DC轉換器、DC-AC轉換器或是AC-AC轉換器。A connecting member (146) is joined to the upper side of the lamp cover (142), and has a receiving space therein. The connecting member (146) is coupled to a post connector (144) for connecting to support a lighting device, such as a street light. A wire extending from the normal power source and passing through the post connector (144), and a controller (145) connected to the wire for operating the light source module (120) are also housed in the interior space of the connecting member (146). The controller (145) is all or part of the power supply (134). The primary function of the power supply (134) is to convert the normal power supply to operate the LED device and generate a voltage of light that is supplied to the printed circuit board (124). The power supply (134) may be an AC-DC converter, a DC-DC converter, a DC-AC converter, or an AC-AC converter.
此外,第10圖中的照明設備(100)可依需求而藉由將兩個或三個照明設備(100)如第11圖連接在一起,做為如街燈來使用。舉例來說,可以藉由將多個照明設備(100)以放射狀之方式設置,並將每一個支柱連接架(144)與支柱連接架收納元件(148)結合成一體而形成一套照明設備。藉由將一套照明設備之支柱連接架收納元件(148)連接至一街燈的支柱(圖未顯示)就可以形成一街燈(圖未顯示)。另外,再舉例來說,也可以藉由將一套照明設備連接至其他的支柱上而形成室內的照明裝置。In addition, the lighting device (100) in FIG. 10 can be used as a street light by connecting two or three lighting devices (100) as shown in FIG. 11 as needed. For example, a set of lighting devices can be formed by radially arranging a plurality of lighting devices (100) and integrating each of the pillar connecting brackets (144) with the pillar connecting frame receiving members (148). . A street light (not shown) can be formed by attaching a set of struts of the luminaire to the struts (148) of a street light (not shown). In addition, for example, an indoor lighting device can also be formed by connecting a set of lighting devices to other pillars.
由於在本發明上述之照明設備(100)之結構中,LED光源模組、燈罩及電源供應器在結構及功能上是分離的,且具有各種不同的可能組合,其應用範圍便很廣。此外,照明範圍也可以很容易依狀況所需來進行調整,其製造成本是很低的。In the structure of the illumination device (100) of the present invention, the LED light source module, the lamp cover and the power supply are separated in structure and function, and have various possible combinations, and the application range thereof is wide. In addition, the illumination range can be easily adjusted as needed, and the manufacturing cost is very low.
熟知此技術之人能夠依上述之說明,使用本發明中的光源模組(120、220)來製作出各種不同型式與外形的照明設備。第12圖顯示了另一種照明設備的結構。它是經由將五個第二實施例中的光源模組(220)並排設置,且固定於一具有反射鏡外形之燈罩(240)中而形成。每一個光源模組(220)之底面覆有一透明光源保護蓋(230)。在燈具外殼(240)的上端部位中具有一連接元件(235),用以連接至另一照明設備之支柱。Those skilled in the art can use the light source modules (120, 220) of the present invention to produce a variety of different types and shapes of illumination devices in accordance with the above description. Figure 12 shows the structure of another lighting device. It is formed by arranging the light source modules (220) of the five second embodiments side by side and fixing them in a lamp cover (240) having a mirror shape. The bottom surface of each light source module (220) is covered with a transparent light source protection cover (230). In the upper end portion of the luminaire housing (240) there is a connecting element (235) for connection to the struts of another luminaire.
傳統照明設備中,熱的傳送是經由空氣,自LED裝置傳送至散熱器,而本發明的照明設備中,熱的傳送是在所有方向上經由熱傳送填充物(126)來傳送。第13(a)圖顯示了第1圖習知技術中LED照明裝置之相片,而第13(b)及13(c)圖分別是在LED照明裝置***作之初始時間及***作相當長一段時間後所拍攝之紅外線相片。第14(a)圖顯示了第7圖中本發明LED照明裝置(220)之相片,而第14(b)及14(c)圖分別是在LED照明裝置***作之初始時間及***作相當長一段時間後所拍攝之紅外線相片。In conventional lighting devices, heat is transferred from the LED device to the heat sink via air, while in the lighting device of the present invention, heat transfer is transmitted in all directions via the heat transfer filler (126). Figure 13(a) shows a photograph of the LED lighting device in the prior art of Figure 1, and Figures 13(b) and 13(c) are respectively operated for a long period of time at the initial operation of the LED lighting device. Infrared photos taken after time. Figure 14(a) shows a photograph of the LED lighting device (220) of the present invention in Figure 7, and Figures 14(b) and 14(c) are respectively operated at the initial time when the LED lighting device is operated. Infrared photos taken after a long period of time.
依據傳統LED照明設備之紅外線相片(第13(b)及(c)),隨著LED裝置操作時間的增加,在LED裝置及散熱器之間的溫差就越來越大,這是因為排熱沒有效率的關係。從詳細的溫度資料可以看出,在LED裝置最初的操作時間內,LED裝置及散熱器之溫度分別是約49.5℃及37.5℃,溫差為12℃。而在一段足夠的操作時間之後,LED裝置及散熱器之溫度分別是約56℃及34.7℃,溫差為21.3℃,確實有變大的現象。這些量測結果顯示了,隨著時間的增加,LED裝置會過熱,而經由散熱器所進行的排熱是效率不足的。According to the infrared photo of traditional LED lighting equipment (Sections 13(b) and (c)), as the operating time of the LED device increases, the temperature difference between the LED device and the heat sink becomes larger and larger. Inefficient relationship. As can be seen from the detailed temperature data, the temperature of the LED device and the heat sink are about 49.5 ° C and 37.5 ° C, respectively, and the temperature difference is 12 ° C during the initial operating time of the LED device. After a sufficient period of operation, the temperature of the LED device and the heat sink are about 56 ° C and 34.7 ° C, respectively, and the temperature difference is 21.3 ° C, which does increase. These measurements show that as time increases, the LED device overheats, and the heat removal through the heat sink is inefficient.
相反的,依據本發明LED照明設備之紅外線相片(第14(b)及(c))來看,即使操作時間增加,代表溫度的顏色仍然幾乎沒有改變,這顯示了整個排熱效率是良好的。從詳細的溫度資料可以看出,在操作的一開始,LED裝置及散熱器之溫度分別是約36.2℃及27.5℃,溫差為8.7℃。而在一段足夠的操作時間之後,LED裝置及散熱器之溫度分別是約37.5℃及28.0℃,溫差為9.5℃。LED裝置及散熱器之溫度從操作的一開始僅分別增加了1.3及0.5℃。這些量測結果顯示了,即使操作時間不斷繼續,自LED裝置所生成的熱會快速地經由散熱器排出,使得LED裝置不會發生過熱。因此,本發明確實具有極佳的排熱速度。當然,本發明LED裝置之壽命也會因此延長。In contrast, according to the infrared photograph (14(b) and (c)) of the LED lighting device of the present invention, even if the operation time is increased, the color representing the temperature is hardly changed, which shows that the entire heat exhaust efficiency is good. As can be seen from the detailed temperature data, at the beginning of the operation, the temperature of the LED device and the heat sink were about 36.2 ° C and 27.5 ° C, respectively, and the temperature difference was 8.7 ° C. After a sufficient period of operation, the temperature of the LED device and the heat sink are about 37.5 ° C and 28.0 ° C, respectively, and the temperature difference is 9.5 ° C. The temperature of the LED device and the heat sink increased by only 1.3 and 0.5 °C from the beginning of the operation. These measurement results show that even if the operation time continues, the heat generated from the LED device is quickly discharged through the heat sink, so that the LED device does not overheat. Therefore, the present invention does have an excellent heat removal rate. Of course, the life of the LED device of the present invention will also be extended.
如上所述,雖然本發明以數個實施例及圖示進行說明如上,熟知此技術之人仍能在不脫離本發明之精神及範圍下,進行適當的修改。As described above, the present invention has been described in terms of several embodiments and illustrations, and those skilled in the art can make appropriate modifications without departing from the spirit and scope of the invention.
本發明可在不受特定限制的情況下,應用於照明設備中。舉例來說,本發明可以應用在不同照明設備的使用情形下,例如做為室外或室內的照明設備、建築內部照明、廣告顯示器或背光。The present invention can be applied to a lighting device without being particularly limited. For example, the invention can be applied to the use of different lighting devices, for example as outdoor or indoor lighting, architectural interior lighting, advertising displays or backlights.
14、36、110、310...散熱器14, 36, 110, 310. . . heat sink
16、34、124...印刷電路板16, 34, 124. . . A printed circuit board
12...保護蓋12. . . protection cap
18、38...透明遮蓋18, 38. . . Transparent cover
10...LED照明裝置10. . . LED lighting device
20、32...LED20, 32. . . led
30...傳統照明裝置30. . . Traditional lighting
100...照明設備100. . . lighting device
120、220...光源模組120, 220. . . Light source module
105...LED光源105. . . LED light source
126...熱傳送填充物126. . . Heat transfer filler
102...LED裝置102. . . LED device
102a...LED晶片102a. . . LED chip
102b...發光面102b. . . Luminous surface
122、312...光源收納元件122, 312. . . Light source receiving component
111、111a、111b、314...基座111, 111a, 111b, 314. . . Pedestal
112、114、316...散熱翼112, 114, 316. . . Cooling fin
119、322...光輸出孔119, 322. . . Light output aperture
127...側蓋接合槽127. . . Side cover engagement groove
110a...上散熱槽110a. . . Upper heat sink
110b...下散熱槽110b. . . Lower heat sink
114a...水平通氣孔114a. . . Horizontal vent
114b...垂直通氣孔114b. . . Vertical vent
128...熱導矽膠128. . . Thermal conductive silicone
129...透明保護膜129. . . Transparent protective film
320...收納元件遮蓋320. . . Storage element covering
330...保護膜330. . . Protective film
340...安裝蓋340. . . Mounting cover
350...導線350. . . wire
134...電源供應器134. . . Power Supplier
130...光源套裝模組130. . . Light source set module
150、240...燈具外殼150, 240. . . Lamp housing
142、240...燈罩142, 240. . . lampshade
146、235...連接元件146, 235. . . Connecting element
144...支柱連接架144. . . Pillar connector
145...控制器145. . . Controller
148...支柱連接架收納元件148. . . Pillar connecting frame storage element
230...透明光源保護蓋230. . . Transparent light source cover
第1圖顯示了一傳統通用的封閉型LED室外照明設備之剖面圖;Figure 1 shows a cross-sectional view of a conventional universal enclosed LED outdoor lighting device;
第2圖顯示了具有單向散熱結構之LED照明裝置;Figure 2 shows an LED lighting device with a unidirectional heat dissipation structure;
第3~6圖顯示了本發明第一實施例中光源模組(120)之結構;其中,第3a及3b圖是組合完成之立體圖,第5圖顯示了其LED(120)以單列方式設置之LED光源模組的底面,而第6圖係第2(a)圖中沿A-A’切線之剖面圖;3 to 6 show the structure of the light source module (120) in the first embodiment of the present invention; wherein, the 3a and 3b are combined perspective views, and the fifth diagram shows the LEDs (120) arranged in a single column. The bottom surface of the LED light source module, and the sixth figure is a cross-sectional view along the line A-A' in the second (a) diagram;
第7及8圖分別係本發明第二實施例之光源模組(220)結構之分解圖及組合完成之剖面圖;7 and 8 are respectively an exploded view of the structure of the light source module (220) according to the second embodiment of the present invention and a cross-sectional view of the combination completed;
第9及10圖顯示了本發明第三實施例之照明設備,其係將多個本發明中的光源模組結合而成,第9(a)及9(b)圖係分別為側視平面圖及下視的平面圖,而第10圖則為第9(a)圖中沿切線B-B’之剖面圖;9 and 10 are views showing a lighting apparatus according to a third embodiment of the present invention, which is a combination of a plurality of light source modules of the present invention, and FIGS. 9(a) and 9(b) are side plan views, respectively. And the plan view of the lower view, and the 10th plan is a cross-sectional view along the tangential line B-B' in the 9th (a) figure;
第11(a)及11(b)圖分別顯示了將兩個及三個第10圖中的照明裝置(100)以放射狀連接之照明設備的上視平面圖;Figures 11(a) and 11(b) respectively show top plan views of illuminating devices that radially connect the illuminating devices (100) of the two and three Figure 10;
第12(a)及12(b)圖顯示了將本發明第二實施例中之LED光源模組結合而成之另一照明設備之剖面圖及下視平面圖;12(a) and 12(b) are a cross-sectional view and a bottom plan view showing another lighting device in which the LED light source module of the second embodiment of the present invention is combined;
第13(a)顯示了習知技術中LED照明裝置之相片,而第13(b)及13(c)圖分別是在LED照明裝置***作之初始時間及***作相當長一段時間後所拍攝之紅外線相片;及Figure 13(a) shows photographs of LED lighting devices in the prior art, and Figures 13(b) and 13(c) are taken at the initial time when the LED lighting device is operated and after being operated for a long period of time, respectively. Infrared photo; and
第14(a)圖顯示了本發明中LED照明裝置(220)之相片,而第14(b)及14(c)圖分別是在LED照明裝置***作之初始時間及***作相當長一段時間後所拍攝之紅外線相片。Figure 14(a) shows a photograph of the LED lighting device (220) of the present invention, and Figures 14(b) and 14(c) are respectively operated for a long time at the initial time when the LED lighting device is operated. Infrared photos taken afterwards.
102...LED裝置102. . . LED device
110...散熱器110. . . heat sink
110a...上散熱槽110a. . . Upper heat sink
110b...下散熱槽110b. . . Lower heat sink
111...基座111. . . Pedestal
112...散熱翼112. . . Cooling fin
114a...水平通氣孔114a. . . Horizontal vent
114b...垂直通氣孔114b. . . Vertical vent
120...光源模組120. . . Light source module
124...印刷電路板124. . . A printed circuit board
126...熱傳送填充物126. . . Heat transfer filler
128...熱導矽膠128. . . Thermal conductive silicone
134...電源供應器134. . . Power Supplier
Claims (10)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100004897 | 2010-01-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201131105A TW201131105A (en) | 2011-09-16 |
TWI447326B true TWI447326B (en) | 2014-08-01 |
Family
ID=44307387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100101944A TWI447326B (en) | 2010-01-19 | 2011-01-19 | Led illumination device and illuminating apparatus employing the same |
Country Status (2)
Country | Link |
---|---|
TW (1) | TWI447326B (en) |
WO (1) | WO2011090311A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2639500A1 (en) * | 2012-03-16 | 2013-09-18 | Guangxi Li | LED lighting device |
US9970649B2 (en) | 2015-07-24 | 2018-05-15 | Fluence Bioengineering | Systems and methods for a heat sink |
CN107342792A (en) * | 2017-01-11 | 2017-11-10 | 深圳市兆驰数码科技股份有限公司 | A kind of Homeplug |
CN107289424A (en) * | 2017-07-07 | 2017-10-24 | 四川晶力照明科技有限公司 | A kind of three-dimensional convection heat radiation light source module group radiator |
WO2019025201A1 (en) * | 2017-08-01 | 2019-02-07 | Philips Lighting Holding B.V. | A lighting device, and a method of producing a lighting device |
CN107842723A (en) * | 2017-11-13 | 2018-03-27 | 前海玖星光能低碳科技(深圳)有限公司 | A kind of outdoor water proof radiating LED light source module |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201093435Y (en) * | 2007-04-29 | 2008-07-30 | 东莞市科锐德数码光电科技有限公司 | Ultra-high power LED lamp |
CN201237097Y (en) * | 2008-05-28 | 2009-05-13 | 高锦阳 | LED luminous panel |
CN201368435Y (en) * | 2009-02-18 | 2009-12-23 | 深圳鸿森光电有限公司 | Heat radiating structure of LED (light emitting diode) lighting lamp |
TW201002976A (en) * | 2008-07-11 | 2010-01-16 | Foxconn Tech Co Ltd | Light emitting diode lamp and light engine thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080002564U (en) * | 2007-01-08 | 2008-07-11 | 광성전기산업(주) | Lamp with light emitting diode module |
KR100879818B1 (en) * | 2008-04-08 | 2009-01-23 | 주식회사 대림이엔지 | Lighting lamp using led |
KR100909366B1 (en) * | 2008-12-16 | 2009-07-24 | 주식회사 미소 | Led module with cooling structure |
-
2011
- 2011-01-19 TW TW100101944A patent/TWI447326B/en not_active IP Right Cessation
- 2011-01-19 WO PCT/KR2011/000384 patent/WO2011090311A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201093435Y (en) * | 2007-04-29 | 2008-07-30 | 东莞市科锐德数码光电科技有限公司 | Ultra-high power LED lamp |
CN201237097Y (en) * | 2008-05-28 | 2009-05-13 | 高锦阳 | LED luminous panel |
TW201002976A (en) * | 2008-07-11 | 2010-01-16 | Foxconn Tech Co Ltd | Light emitting diode lamp and light engine thereof |
CN201368435Y (en) * | 2009-02-18 | 2009-12-23 | 深圳鸿森光电有限公司 | Heat radiating structure of LED (light emitting diode) lighting lamp |
Also Published As
Publication number | Publication date |
---|---|
TW201131105A (en) | 2011-09-16 |
WO2011090311A2 (en) | 2011-07-28 |
WO2011090311A3 (en) | 2011-11-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5101578B2 (en) | Light emitting diode lighting device | |
US20190113180A1 (en) | Solid State Lamp Using Modular Light Emitting Elements | |
JP4452495B2 (en) | High power LED module for spot lighting | |
CN102782404B (en) | Lighting device with heat dissipation elements | |
US7338186B1 (en) | Assembled structure of large-sized LED lamp | |
JP5303319B2 (en) | Assembly type LED lighting equipment | |
KR101297340B1 (en) | LED illumination device and illuminating apparatus employing the same | |
US9518724B2 (en) | Light emitting device module array | |
CN103162129B (en) | There is the LED light emission device of flexible light emitting module | |
RU2510874C2 (en) | Radially directed heat dissipating device and pear-shaped light-emitting device using same | |
US9939144B2 (en) | Light emitting module | |
KR101472403B1 (en) | Lighting device module | |
TWI447326B (en) | Led illumination device and illuminating apparatus employing the same | |
KR101176442B1 (en) | led illumination lamp | |
WO2008138177A1 (en) | An led lighting fixture with high-efficiency radiation effect | |
KR100981329B1 (en) | An led lamp for exterior light system | |
KR20150060499A (en) | Lighting module array | |
KR20170005664A (en) | Lighting device module | |
KR101035100B1 (en) | Cooling device for led lamp | |
JP5766033B2 (en) | Light emitting device | |
US10295168B1 (en) | LED light fixture with inter-LED flow-through cooling | |
KR101344447B1 (en) | Led illumination device including led driving chip | |
RU114509U1 (en) | LED STREET LIGHT | |
RU81599U1 (en) | LED LIGHT LAMP | |
KR100982682B1 (en) | Structure of the efficiency lamp dragon illumination back that LED is high |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |