TWI445982B - Electronic device crimping device, application of crimping device test equipment and crimp control method - Google Patents
Electronic device crimping device, application of crimping device test equipment and crimp control method Download PDFInfo
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Description
本發明係提供一種可利用下壓機構之壓抵器使電子元件之各接點平均受力而確實接觸測試座之探針，以提升測試品質之壓接裝置。The invention provides a crimping device which can improve the test quality by using the pressure device of the pressing mechanism to make the contacts of the electronic component receive the force evenly and actually contact the probe of the test seat.
在現今，電子元件(例如具錫球之IC)於製作完成後，均會於測試分類機上進行測試作業，以淘汰出不良品，以IC測試分類機為例，測試分類機係於測試裝置之上方配置有壓接裝置，用以下壓IC，使IC之錫球確實接觸測試座之探針而執行測試作業，以確保IC之測試品質；請參閱第1圖，係為測試裝置11及壓接裝置12之示意圖，該測試裝置11係設有至少一具測試座112之電路板111，測試座112係設有複數個可電性連接IC各錫球之探針113，該壓接裝置12係位於測試裝置11之上方，並設有一可升降位移之傳動桿121，傳動桿121係用以驅動一可下壓IC之下壓治具122；於測試時，測試裝置11之測試座112可承置待測之IC13，IC13係於基板131之頂面固設有晶片132，並於基板131之底面分佈配置有複數個錫球133，壓接裝置12係控制傳動桿121帶動下壓治具122下降位移而壓抵待測之IC13，以使待測IC13之錫球133與測試座112之各探針113確實接觸而執行測試作業；惟，由於IC13之基板131頂面與晶片132具有高低位差，當傳動桿121帶動下壓治具122下壓IC13時，下壓治具121僅壓抵到IC13之晶片132，並未壓抵到晶片132四周之基板131頂面，雖可使IC13中間部位之錫球133受力而確實接觸測試座112之探針113，但卻導致IC13四周部位之錫球133因受力不均而無法與測試座112之探針113確實接觸，進而影響測試品質，實有待改善。Nowadays, electronic components (such as ICs with solder balls) will be tested on the test sorter after the production is completed to eliminate defective products. Take the IC test sorter as an example. The test sorter is attached to the test device. The upper part is equipped with a crimping device, and the following test IC is used to make the IC ball of the IC contact the probe of the test stand to perform the test operation to ensure the test quality of the IC; please refer to FIG. 1 for the test device 11 and the pressure A schematic diagram of the device 12 is provided with at least one circuit board 111 having a test socket 112. The test socket 112 is provided with a plurality of probes 113 electrically connected to the solder balls of the IC. The crimping device 12 The test device 11 is located above the test device 11 and is provided with a drive rod 121 that can be moved up and down. The drive rod 121 is used to drive the pressurization tool 122 under the pressure IC; during the test, the test seat 112 of the test device 11 can be The IC 13 is mounted on the top surface of the substrate 131, and the IC 132 is fixed on the bottom surface of the substrate 131. A plurality of solder balls 133 are disposed on the bottom surface of the substrate 131. The crimping device 12 controls the transmission rod 121 to drive the lower pressing fixture. 122 drops the displacement and presses against the IC13 to be tested, so that the test is to be tested The solder ball 133 of the IC 13 is in contact with the probes 113 of the test socket 112 to perform the test operation; however, since the top surface of the substrate 131 of the IC 13 has a high level difference with the wafer 132, when the driving rod 121 drives the lower pressing fixture 122 to press down At the time of IC13, the lower pressing fixture 121 is only pressed against the wafer 132 of the IC 13, and is not pressed against the top surface of the substrate 131 around the wafer 132. Although the solder ball 133 in the middle portion of the IC 13 can be forced to contact the test socket 112. The probe 113, however, causes the solder ball 133 around the IC 13 to be incapable of being in contact with the probe 113 of the test socket 112 due to uneven force, thereby affecting the test quality and needs to be improved.
因此，如何設計一種可使電子元件之各接點平均受力而確實 接觸測試座之探針，以提升測試品質之壓接裝置，即為業者研發之標的。Therefore, how to design an average force on each contact of an electronic component Contact with the probe of the test stand to improve the quality of the test crimping device, which is the subject of research and development by the manufacturer.
本發明之目的一，係提供一種電子元件壓接裝置，其係設有可壓接電子元件之下壓機構，該下壓機構係設有傳動桿及壓抵器，傳動桿係由驅動源驅動作至少一方向位移，壓抵器係配置於傳動桿之一端，並設有至少一抵接部，用以壓抵於電子元件之發熱源，以及設有至少一防翹部，用以限制電子元件周側翹曲；藉此，可利用下壓機構之壓抵器以抵接部及防翹部分別下壓頂抵電子元件之不同部位，使電子元件之各接點平均受力而確實接觸測試座之探針，達到提升測試品質之實用效益。An object of the present invention is to provide an electronic component crimping device which is provided with a press-fit electronic component lower pressing mechanism, wherein the lower pressing mechanism is provided with a transmission rod and a pressure roller, and the transmission rod is driven by a driving source. Displacement in at least one direction, the pressure device is disposed at one end of the transmission rod, and is provided with at least one abutting portion for pressing against a heat source of the electronic component, and at least one anti-warping portion for limiting the electron The peripheral side of the component is warped; thereby, the abutting portion and the anti-warping portion can be pressed down to the different parts of the electronic component by the pressing device of the pressing mechanism, so that the contacts of the electronic component are subjected to the average force and the contact test is performed. The probe of the seat achieves the practical benefit of improving the quality of the test.
本發明之目的二，係提供一種電子元件壓接裝置，其中，該壓接裝置係於下壓機構之傳動桿與壓抵器間設有溫控機構，用以準確的將電子元件控制於預設的測試溫度範圍，達到提升測試品質之實用效益。A second object of the present invention is to provide an electronic component crimping device, wherein the crimping device is provided with a temperature control mechanism between the driving rod and the pressing device of the pressing mechanism for accurately controlling the electronic component to the pre-control Set the test temperature range to achieve the practical benefits of improving test quality.
本發明之目的三，係提供一種電子元件壓接裝置，其中，該溫控機構包含具入、出水口之熱交換本體及具鯺片之熱傳導件，並設有可升溫壓抵器之溫控件，用以調整冷卻效能，熱傳導件之鰭片則容置於熱交換本體之內部，另熱交換本體之入水口係連接流體供應機，流體供應機包含水冷機及溫水機，並設有可切換水冷機或溫水機輸出流體之切換控制裝置，因此，可視電子元件之溫度，而控制水冷機或溫水機輸出流體，以輔助溫控件調整冷卻效能，而降低溫控件之耗電量，達到更加節省能源及成本之實用效益。The third object of the present invention is to provide an electronic component crimping device, wherein the temperature control mechanism comprises a heat exchange body having a water inlet and a water outlet, and a heat conducting member having a silicon plate, and is provided with a temperature control device capable of heating the pressure roller. For adjusting the cooling performance, the fins of the heat conducting member are accommodated inside the heat exchange body, and the water inlet of the other heat exchange body is connected to the fluid supply machine, and the fluid supply machine comprises a water cooler and a water heater, and is provided with The switch control device for the output fluid of the water cooler or the warm water machine can be switched, so that the temperature of the electronic component can be controlled, and the water output of the water cooler or the warm water machine can be controlled to assist the temperature control to adjust the cooling performance and reduce the consumption of the temperature control. Electricity, to achieve more practical benefits of energy and cost savings.
本發明之目的四，係提供一種電子元件壓接裝置，其中，該溫控機構係設有至少一可控制溫度傳導效能之傳導件，用以輔助將電子元件之溫度控制於預設的測試溫度範圍，達到提升使用效能之實用效益。A fourth object of the present invention is to provide an electronic component crimping apparatus, wherein the temperature control mechanism is provided with at least one conductive member capable of controlling temperature conduction performance for assisting in controlling the temperature of the electronic component to a preset test temperature. Scope, to achieve practical benefits of improved performance.
本發明之目的五，係提供一種電子元件壓接裝置，其中，該壓接裝置係設有可使至少一具抵接部或防翹部之下壓治具位移的 掣移機構，該掣移機構係於下壓治具之上方設有具容室之控壓件，控壓件之容室連通至少一可流通流體之流體通道，不僅可使下壓治具位移，並利用控制容室內之流體壓力，而可無段式調整位於控壓件下方之抵接部或防翹部的下壓力量，使二分別由傳動桿與掣移機構驅動之抵接部及防翹部具有壓力差，進而視壓接作業所需，以不同下壓力量壓抵電子元件，達到提升使用效能之目的。A fifth aspect of the present invention provides an electronic component crimping apparatus, wherein the crimping apparatus is provided with at least one abutting portion or a pressure gauge under the anti-warping portion. The shifting mechanism is provided with a pressure control member with a chamber above the lower pressing fixture, and the chamber of the pressure regulating member communicates with at least one fluid passage through which the fluid can flow, which can not only displace the lower pressing fixture And using the fluid pressure in the control chamber, and the amount of downward pressure of the abutting portion or the anti-warping portion under the pressure regulating member can be adjusted steplessly, so that the abutting portion driven by the transmission rod and the displacement mechanism respectively The anti-warping part has a pressure difference, and then, depending on the crimping operation, presses the electronic component with different pressing amounts to achieve the purpose of improving the use efficiency.
本發明之目的六，係提供一種應用電子元件壓接裝置之測試設備，其係於機台上配置有供料裝置、收料裝置、測試裝置、壓接裝置、輸送裝置及中央控制裝置，供料裝置係用以容納至少一待測之電子元件，收料裝置係用以容納至少一完測之電子元件，測試裝置係設有具測試座之測試電路板，用以測試電子元件，壓接裝置係用以壓接電子元件，使電子元件之各接點平均受力而確實接觸測試座之探針，輸送裝置係設有至少一具移料器之移料機構，用以移載電子元件，中央控制裝置係用以控制及整合各裝置作動，以執行自動化作業，達到自動化測試而提升測試生產效能之實用效益。A sixth object of the present invention is to provide a testing device for applying an electronic component crimping device, which is provided with a feeding device, a receiving device, a testing device, a crimping device, a conveying device and a central control device. The material device is for accommodating at least one electronic component to be tested, the receiving device is for accommodating at least one electronic component to be tested, and the testing device is provided with a test circuit board with a test socket for testing electronic components, crimping The device is used for crimping electronic components, so that the contacts of the electronic components are evenly stressed and actually contact the probes of the test socket, and the conveying device is provided with at least one shifting mechanism of the shifting device for transferring the electronic components. The central control device is used to control and integrate the operation of each device to perform automated operations, to achieve automated testing and to improve the practical benefits of testing production efficiency.
本發明之目的七，係提供一種壓接控制方法，其方法係為壓接裝置低速壓接電子元件，感測單元係感測壓接裝置之壓抵力量，並將感測資料傳輸至中央控制裝置，於壓接裝置之壓抵力量到達設定值時，位置檢知單元係檢知壓接裝置之目前位置，並將資料傳輸至中央控制裝置，中央控制裝置依據位置檢知單元傳輸之資料建立壓接裝置之壓抵基準位置，於執行下一電子元件測試作業時，中央控制裝置可控制壓接裝置位移至壓抵基準位置之前開始減速，並位移至壓抵基準位置而執行壓抵電子元件測試作業；藉此，於執行批次化電子元件測試作業時，可控制壓接裝置位移至預設之壓抵位置，而以設定之壓抵力量壓抵電子元件，達到提升壓接作業穩定性及品質之實用效益。A seventh object of the present invention is to provide a crimping control method, wherein the crimping device presses the electronic component at a low speed, and the sensing unit senses the pressing force of the crimping device, and transmits the sensing data to the central control. When the pressing force of the crimping device reaches the set value, the position detecting unit detects the current position of the crimping device and transmits the data to the central control device, and the central control device establishes the data transmitted according to the position detecting unit. When the crimping device is pressed against the reference position, when the next electronic component test operation is performed, the central control device can control the pressure device to be decelerated before being displaced to the reference position, and is displaced to the pressed reference position to perform pressing against the electronic component. The test operation; thereby, when performing the batch electronic component test operation, the pressure device can be controlled to be displaced to the preset pressure contact position, and the set pressure is pressed against the electronic component to improve the stability of the crimping operation. And the practical benefits of quality.
為使 貴審查委員對本發明作更進一步之瞭解，茲舉一較佳 實施例並配合圖式，詳述如后：請參閱第2、3、4圖，本發明電子元件壓接裝置20係設有可下壓待測電子元件之下壓機構，該下壓機構係設有傳動桿21及壓抵器22，傳動桿21係由驅動源(圖未示出)驅動作至少一方向位移，用以帶動壓抵器22下壓電子元件，更進一步，傳動桿21係於一端設有連動器，用以連結驅動壓抵器22，於本實施例中，連動器包含傳動件211及複數支連結件212，傳動件211之上方係連結傳動桿21，於下方則固設複數支連結件212；壓抵器22係配置於傳動桿21之一端，並設有至少一抵接部，用以壓抵於電子元件之發熱源，以及設有至少一防翹部，用以限制電子元件周側翹曲，更進一步，壓抵器22包含至少一下壓治具，並於下壓治具之底部固設有具高低位差之抵接部及防翹部，於抵接部壓抵電子元件之發熱源時，可利用防翹部限制電子元件之周側翹曲，壓抵器22亦可包含複數個下壓治具，並於至少一下壓治具上設有抵接部，以及於至少一下壓治具上設有防翹部，各下壓治具可視使用所需而分別為固定式及活動式設計，或二者均為活動式設計，另壓接裝置20係設有可使至少一下壓治具位移之掣移機構，掣移機構可於下壓治具設有彈性件，該彈性件可為彈簧，並視使用所需而選用具適當彈力之彈簧，以控制下壓治具之抵壓力量，亦或於下壓治具之上方設有利用流體壓力頂推作線性位移之控壓件，並藉由控制流體壓力而可無段調整位於控壓件下方之抵接部或防翹部的下壓力量，使二分別由傳動桿與掣移機構驅動之抵接部及防翹部具有壓力差，進而視壓接作業所需，以不同下壓力量壓抵電子元件，於本實施例中，壓抵器22係包含第一下壓治具221及第二下壓治具222，第一下壓治具221係固設連結傳動桿21之連結件212，並相對於電子元件之周側，而可隨傳動桿21同步位移，第一下壓治具221係於中間部位開設有容置孔2211，並以底部作為防翹部2212，用以限制電子元件周側翹曲，第二下壓治具222係位於第一下壓治具221之容置孔2211內，並相對於電 子元件之發熱源，且設有抵接部2221，用以壓抵電子元件之發熱源，另於第二下壓治具222之上方設有掣移機構，掣移機構係於第二下壓治具222與傳動桿21間設有一具容室231之控壓件23，控壓件23之容室231係連通至少一流體通道，以供流通可為氣體、液體之流體，更進一步，可於控壓件23之上方獨立裝配一具有流體通道之面板，亦或於傳動桿21之傳動件211內部直接開設有流體通道，於本實施例中，係於傳動桿21之傳動件211內直接開設有流體通道213，以供注入氣體至控壓件23之容室231，使控壓件23與傳動件211間具有位移空間，又控壓件23係開設有複數個可套置於連結件212上之套合孔232，使控壓件23可沿連結件212作升降位移，進而利用調整控壓件23之容室231內的氣體壓力，以控制具抵接部2221之第二下壓治具222的下壓力量，不僅可使第二下壓治具222與第一下壓治具221間具有高低位差，由於具防翹部2212之第一下壓治具221係由傳動桿21控制下壓力量，掣移機構亦可控制流體壓力，使抵接部2221與防翹部2212具有壓力差，並視壓接作業所需，以不同下壓力量壓抵電子元件，又該壓接裝置20係於傳動桿21與壓抵器22間設有溫控機構，用以準確的將電子元件控制於預設的測試溫度範圍，於本實施例中，溫控機構包含熱交換本體24、熱傳導件25、溫控件等，其中，熱交換本體24之底面係凹設有中空之腔室241，腔室241之頂面開設有可流入冷卻流體之入水口242，於本實施例中，入水口242係設於腔室241頂面中間位置，並使入水口242連通位於熱交換本體24側面且可輸入冷卻水液、氣體等流體之流體輸入管243，流體輸入管243連接流體供應機(圖未示出)，流體供應機包含水冷機及溫水機，並設有可切換水冷機或溫水機輸出流體之切換控制裝置，於本實施例中，壓接裝置20之流體輸入管243係連接水冷機及溫水機，並設有可切換水冷機或溫水機輸出流體之切換控制裝置，進而可視測試作業溫度所需，於熱交換本體24內 輸入冷水或溫水，用以調整冷卻效能，例如當原輸入之冷水溫度過低，而使電子元件之溫度低於預設測試溫度時，可變換輸入溫水至熱交換本體24內，使熱交換本體24適當升溫而調整冷卻效能，以減少溫控件之耗電量，進而可準確的將電子元件控制於預設的測試溫度範圍，達到降低電能損耗之實用效益，再者，更包含溫控機構係設有可控制冷卻流體流量之流量器，用以輔助控制冷卻效能，亦可減少溫控件之耗電量，進而降低電能損耗，另於熱交換本體24之腔室241四周開設有複數個出水口244，各出水口244可連通位於熱交換本體24側面之流體輸出管245，於本實施例中，各出水口244係連通位於熱交換本體24頂面之導流槽246，導流槽246則連通熱交換本體24之流體輸出管245，用以輸出已冷熱交換後之冷卻流體，再於熱交換本體24之頂面裝配可防止流體外洩之封蓋，於本實施例中，係直接以控壓件23作為封蓋，另於熱交換本體24上開設有複數個可套置於連結件212上之穿孔247，使熱交換本體24可沿連結件212作升降位移，又熱傳導件25係位於熱交換本體24之下方，並於頂面設有陣列之鰭片251，各鰭片251係置入於熱交換本體24之腔室241內，另溫控機構更包含於熱傳導件25與第二下壓治具222間，或第二下壓治具222底部與電子元件間裝配有可為致冷晶片、加熱件等之溫控件，於本實施例中，溫控件係為加熱件26，並於加熱件26之上、下方設有具導熱性質之石墨片，又溫控機構更包含設有可防止元件表面結露之升溫件，更進一步，可於熱交換本體24、控壓件23或熱傳導件25等元件之表面覆置有升溫件，於本實施例中，係於熱交換本體24之表面覆置有可為加熱線248之升溫件，以使熱交換本體24之表面適當升溫至常溫而防止結露，另該壓接裝置20係設有感測電子元件溫度變化之感溫單元，該感溫單元可為感測電子元件表面溫度或感測第二下壓治具之感溫器，或為電子元件本身內建之感溫器，或為其他感測電子元件內部實際溫度之感溫電路等，於本實施例中，第二下壓治具222 之底面設有感溫器27，用以感測電子元件之表面溫度，並以線路將溫度訊號連結至中央控制單元(圖未示出)。In order to make the reviewer further understand the present invention, it is better to The embodiment and the drawings are detailed as follows: Referring to Figures 2, 3 and 4, the electronic component crimping device 20 of the present invention is provided with a pressing mechanism for pressing down the electronic component to be tested, and the pressing mechanism is The transmission rod 21 and the pressure roller 22 are provided. The transmission rod 21 is driven by the driving source (not shown) to be displaced in at least one direction, and is used to drive the pressure device 22 to press down the electronic component. Further, the transmission rod 21 is driven. An actuator is provided at one end for connecting the driving presser 22. In the embodiment, the connecting device includes a transmission member 211 and a plurality of connecting members 212. The upper portion of the transmission member 211 is coupled to the transmission rod 21, and is fixed below. A plurality of connecting members 212 are disposed; the pressing device 22 is disposed at one end of the driving rod 21, and is provided with at least one abutting portion for pressing against a heat source of the electronic component, and at least one anti-warping portion is provided. In order to limit the warpage of the electronic component on the circumference side, further, the presser 22 includes at least a lower pressure fixture, and abutting portion and a warpage preventing portion having a high and low difference are fixed on the bottom of the lower pressing fixture to abut When the part is pressed against the heat source of the electronic component, the anti-warpage portion can be used to limit the peripheral side warpage of the electronic component The presser 22 can also include a plurality of pressing tools, and at least a lower pressing device is provided with an abutting portion, and at least a lower pressing device is provided with an anti-warping portion, and each pressing device can be visually used. The fixed and movable designs are respectively required, or both are movable designs, and the crimping device 20 is provided with a transfer mechanism that can displace at least the lower pressure fixture, and the transfer mechanism can be used to press the fixture. The elastic member is provided with a spring, and a spring with a suitable elastic force is selected according to the use to control the pressing force of the pressing fixture, or the fluid pressure is applied above the pressing fixture. Pushing the pressure-control member as a linear displacement, and by controlling the fluid pressure, the amount of depression of the abutting portion or the anti-warping portion under the pressure-control member can be adjusted steplessly, so that the two are driven by the transmission rod and the displacement mechanism respectively. The abutting portion and the anti-warping portion have a pressure difference, and are pressed against the electronic component by different pressing amounts as required for the crimping operation. In the embodiment, the pressing device 22 includes the first pressing device 221 and The second pressing fixture 222, the first pressing fixture 221 is fixed to the connection of the transmission rod 21 The connecting member 212 is synchronously displaced with the transmission rod 21 with respect to the peripheral side of the electronic component. The first pressing fixture 221 is provided with a receiving hole 2211 at the middle portion and the bottom portion as the anti-warping portion 2212. To limit the warpage of the electronic component on the circumference side, the second lower pressing fixture 222 is located in the receiving hole 2211 of the first pressing fixture 221, and is opposite to the electric The heat source of the sub-element is provided with an abutting portion 2221 for pressing against the heat source of the electronic component, and a transfer mechanism is disposed above the second lower press fixture 222, and the transfer mechanism is applied to the second pressing A pressure control member 23 having a chamber 231 is disposed between the fixture 222 and the transmission rod 21, and the chamber 231 of the pressure control member 23 communicates with at least one fluid passage for circulating a fluid which can be a gas or a liquid, and further, A panel having a fluid passage is separately assembled above the pressure control member 23, or a fluid passage is directly formed in the transmission member 211 of the transmission rod 21, which is directly in the transmission member 211 of the transmission rod 21 in this embodiment. The fluid passage 213 is opened for injecting gas into the chamber 231 of the pressure control member 23, so as to have a displacement space between the pressure control member 23 and the transmission member 211, and the pressure control member 23 is provided with a plurality of sleeves that can be sleeved. The sleeve hole 232 of the 212 allows the pressure control member 23 to be moved up and down along the coupling member 212, thereby adjusting the pressure of the gas in the chamber 231 of the pressure control member 23 to control the second depression of the abutting portion 2221. The amount of depression of the jig 222 can not only make the second pressing fixture 222 and the first pressing fixture 2 21 has a high and low level difference. Since the first pressing fixture 221 having the anti-warping portion 2212 controls the amount of depression by the transmission rod 21, the migration mechanism can also control the fluid pressure to make the abutting portion 2221 and the anti-warping portion 2212. It has a pressure difference and is pressed against the electronic component with different pressing force as required by the crimping operation, and the crimping device 20 is provided with a temperature control mechanism between the transmission rod 21 and the pressing device 22 for accurately The electronic component is controlled by a predetermined test temperature range. In this embodiment, the temperature control mechanism includes a heat exchange body 24, a heat conduction member 25, a temperature control, and the like, wherein the bottom surface of the heat exchange body 24 is concavely provided with a hollow cavity. In the chamber 241, a top surface of the chamber 241 is provided with a water inlet 242 for flowing a cooling fluid. In the embodiment, the water inlet 242 is disposed at an intermediate position of the top surface of the chamber 241, and the water inlet 242 is connected to the heat exchange body. 24 side and can input a fluid input pipe 243 for cooling a liquid such as water, gas, etc., and the fluid input pipe 243 is connected to a fluid supply machine (not shown). The fluid supply machine includes a water cooler and a water heater, and is provided with switchable water cooling. Switching control of machine or warm water output fluid In the embodiment, the fluid input tube 243 of the crimping device 20 is connected to the water cooler and the warm water machine, and is provided with a switching control device that can switch the output fluid of the water cooler or the warm water machine, thereby visually testing the operating temperature. In the heat exchange body 24 Input cold water or warm water to adjust the cooling performance. For example, when the temperature of the cold water originally input is too low, and the temperature of the electronic component is lower than the preset test temperature, the input warm water can be changed into the heat exchange body 24 to make the heat The switching body 24 is appropriately warmed up to adjust the cooling performance to reduce the power consumption of the temperature control, thereby accurately controlling the electronic components to a preset test temperature range, thereby achieving the practical benefit of reducing power loss, and further including temperature. The control mechanism is provided with a flow device for controlling the flow rate of the cooling fluid to assist in controlling the cooling performance, and also reduces the power consumption of the temperature control, thereby reducing the power loss, and is further disposed around the chamber 241 of the heat exchange body 24. A plurality of water outlets 244, each of which can communicate with a fluid outlet tube 245 located at a side of the heat exchange body 24. In the present embodiment, each water outlet 244 communicates with a flow guiding groove 246 located at a top surface of the heat exchange body 24. The flow cell 246 is connected to the fluid output pipe 245 of the heat exchange body 24 for outputting the cooling fluid after the heat exchange, and then assembling the top surface of the heat exchange body 24 to prevent the fluid from leaking. In the present embodiment, the pressure-control member 23 is directly used as a cover, and the heat exchange body 24 is provided with a plurality of through holes 247 which can be placed on the connecting member 212 so that the heat exchange body 24 can be along the connecting member 212. For the lifting displacement, the heat conducting member 25 is located below the heat exchange body 24, and the array of fins 251 is disposed on the top surface, and the fins 251 are placed in the chamber 241 of the heat exchange body 24, and the temperature is controlled. The mechanism is further included between the heat conducting member 25 and the second lower pressing fixture 222, or the bottom of the second pressing fixture 222 and the electronic component are equipped with a temperature control which can be a cooling wafer, a heating member, etc., in this embodiment. The temperature control is a heating element 26, and a graphite sheet with thermal conductivity is disposed above and below the heating element 26. The temperature control mechanism further comprises a heating element capable of preventing dew condensation on the surface of the element, and further, The surface of the heat exchange body 24, the pressure regulating member 23 or the heat conducting member 25 is covered with a temperature increasing member. In the embodiment, the surface of the heat exchange body 24 is covered with a temperature rising member which can be a heating wire 248. The surface of the heat exchange body 24 is appropriately heated to a normal temperature to prevent condensation, and The crimping device 20 is provided with a temperature sensing unit for sensing the temperature change of the electronic component, and the temperature sensing unit may be a temperature sensor for sensing the surface temperature of the electronic component or sensing the second pressing fixture, or the electronic component itself The built-in temperature sensor, or other temperature sensing circuit for sensing the actual temperature inside the electronic component, etc., in this embodiment, the second pressing fixture 222 The bottom surface is provided with a temperature sensor 27 for sensing the surface temperature of the electronic component, and connecting the temperature signal to the central control unit (not shown) by a line.
請參閱第5圖，係壓接裝置20應用壓抵測試裝置30內待測之電子元件40的示意圖，該測試裝置30係設有具測試座32之測試電路板31，測試座32內係具有複數支探針33，於測試座32承置待測之電子元件40後，由於待測之電子元件40係於基板41之頂面固設有可為晶片42之發熱源，並於基板41之底面分佈配置有複數個可為錫球43之接點，壓接裝置20之傳動桿21可利用傳動件211及連結件212帶動第一下壓治具221向下位移，因第二下壓治具222係連結於熱傳導件25，熱傳導件25又連結於熱交換本體24，進而傳動桿21可利用熱交換本體24而帶動第二下壓治具222同步下降位移，由於第二下壓治具222之抵接部2221與第一下壓治具221之防翹部2212具有高低位差，使第二下壓治具222之抵接部2221會先壓抵於電子元件40之晶片42，進而使待測電子元件40底面中間位置之錫球43受壓而確實接觸測試座32之探針33，感溫器27則會受到晶片42之反作用力頂推而內移，並感測待測電子元件40之表面溫度，而將溫度訊號傳輸至中央控制裝置(圖未示出)；請參閱第6圖，壓接裝置20之傳動桿21繼續帶動第一、二下壓治具221、222及溫控機構同步下移，令第一下壓治具221之防翹部2212下壓待測電子元件40之基板41頂面四周，使待測電子元件40底面四周之各錫球43受壓而確實接觸測試座32之探針33，此時，第二下壓治具222係受待測電子元件40之反作用力頂推而向上位移，並帶動熱傳導件25、熱交換本體24及控壓件23上移，由於控壓件23與傳動件211間具有位移空間，控壓件23即可壓縮容室231內之氣體，使第二下壓治具222向上作緩衝位移，進而第一下壓治具221之防翹部2212與第二下壓治具222之抵接部2221分別壓抵電子元件40之基板41四周及晶片42時即會產生高低位差，由於第一、二下壓 治具221、222係各別壓抵於待測電子元件40之四周位置及中間位置，壓接裝置20可全面性壓抵待測電子元件40，使待測電子元件40之各錫球43平均受力而確實接觸測試座32之探針33，以提升測試作業品質，再者，由於電子元件40在執行測試作業時，將會快速的產生自熱，為可準確的將電子元件40控制於預設的測試溫度範圍，可利用第二下壓治具222將電子元件40之高溫傳導至熱傳導件25及鰭片251，此時，溫控機構之流體輸入管243可將水冷機輸出之冷卻流體輸送至熱交換本體24內，並使冷卻流體由位於中間位置之入水口242注入於腔室241內，由於入水口242位於中間位置，而可使冷卻流體與熱傳導件25所對應待測電子元件40中間發熱源之鰭片251先作一冷熱交換，而可大幅降低電子元件40之高溫，又溫控機構為防止電子元件40之溫度降溫至低於預設測試溫度範圍，溫控機構可控制加熱件26升溫第二下壓治具222，進而調整冷卻效能，使電子元件40於預設的測試溫度範圍執行測試作業，再可利用各出水口244分散於腔室241四周之設計，使冷卻流體由中間位置作放射狀向四周流動，而可與熱傳導件25四周部位之鰭片251作大面積且均勻的冷熱交換，以全面降低電子元件40四周部位之高溫，使電子元件40均勻降溫，接著已升溫之冷卻流體由各出水口244流入於熱交換本體24頂面之導流槽246中，再匯流排入於流體輸出管245中，由流體輸出管245輸出水液。Referring to FIG. 5, a crimping device 20 is applied to a schematic diagram of an electronic component 40 to be tested in a test device 30. The test device 30 is provided with a test circuit board 31 having a test socket 32. The plurality of probes 33 are mounted on the top surface of the substrate 41 after the electronic component 40 to be tested is mounted on the top surface of the substrate 41, and the heat source of the wafer 42 is fixed on the substrate 41. The bottom surface is disposed with a plurality of contacts which can be solder balls 43. The transmission rod 21 of the crimping device 20 can drive the first lower pressing fixture 221 downward by the transmission member 211 and the connecting member 212, because the second lower pressing is performed. The 222 series is connected to the heat conducting member 25, and the heat conducting member 25 is coupled to the heat exchange body 24, and the transmission rod 21 can use the heat exchange body 24 to drive the second lower pressing fixture 222 to synchronously descend the displacement, because the second pressing fixture The abutting portion 2221 of the second pressing fixture 222 has a high and low level difference, so that the abutting portion 2221 of the second pressing fixture 222 is first pressed against the wafer 42 of the electronic component 40, and further The solder ball 43 in the middle position of the bottom surface of the electronic component 40 to be tested is pressed to actually contact the test socket 32. The probe 33, the temperature sensor 27 is pushed by the reaction force of the wafer 42 to move inwardly, and senses the surface temperature of the electronic component 40 to be tested, and transmits the temperature signal to the central control device (not shown); Referring to FIG. 6, the transmission rod 21 of the crimping device 20 continues to drive the first and second pressing fixtures 221 and 222 and the temperature control mechanism to move down synchronously, so that the anti-warpage portion 2212 of the first lower pressing fixture 221 is pressed down. The periphery of the top surface of the substrate 41 of the electronic component 40 to be tested is such that the solder balls 43 around the bottom surface of the electronic component 40 to be tested are pressed to actually contact the probe 33 of the test socket 32. At this time, the second lower pressing fixture 222 is subjected to The reaction force of the electronic component 40 to be tested is pushed up and displaced upward, and the heat conduction member 25, the heat exchange body 24 and the pressure control member 23 are moved upward. Because of the displacement space between the pressure control member 23 and the transmission member 211, the pressure control member 23 The gas in the chamber 231 can be compressed, so that the second pressing fixture 222 is upwardly buffered, and then the abutting portion 2212 of the first pressing fixture 221 and the abutting portion 2221 of the second pressing fixture 222 are respectively When the substrate 41 of the electronic component 40 is pressed against the wafer 41 and the wafer 42 is high, the height difference is generated due to the first and second pressing. The fixtures 221 and 222 are respectively pressed against the peripheral position and the intermediate position of the electronic component 40 to be tested, and the crimping device 20 can fully press the electronic component 40 to be tested, so that the solder balls 43 of the electronic component 40 to be tested are averaged. It is forced to contact the probe 33 of the test socket 32 to improve the quality of the test work. Furthermore, since the electronic component 40 performs the test operation, it will quickly generate self-heating, so that the electronic component 40 can be accurately controlled. The preset test temperature range can be used to conduct the high temperature of the electronic component 40 to the heat conduction member 25 and the fin 251 by using the second pressing fixture 222. At this time, the fluid input tube 243 of the temperature control mechanism can cool the output of the water cooler. The fluid is delivered into the heat exchange body 24, and the cooling fluid is injected into the chamber 241 from the water inlet 242 at the intermediate position. Since the water inlet 242 is at the intermediate position, the cooling fluid and the heat conducting member 25 correspond to the electron to be tested. The fin 251 of the intermediate heat source of the component 40 first performs a cold heat exchange, and can greatly reduce the high temperature of the electronic component 40, and the temperature control mechanism prevents the temperature of the electronic component 40 from falling below a preset test temperature range, and the temperature control machine The heating element 26 can be controlled to raise the temperature of the second pressing fixture 222 to adjust the cooling performance, so that the electronic component 40 performs the testing operation within a preset test temperature range, and the water outlet 244 can be dispersed around the chamber 241. The cooling fluid is radially flowed from the intermediate position to the periphery, and a large-area and uniform heat exchange with the fins 251 around the heat conducting member 25 is performed to comprehensively reduce the high temperature of the peripheral portion of the electronic component 40, thereby making the electronic component 40 uniform. After the temperature is lowered, the cooled cooling fluid flows from each of the water outlets 244 into the flow guiding groove 246 on the top surface of the heat exchange body 24, and is again discharged into the fluid output pipe 245, and the fluid output pipe 245 outputs the water liquid.
請參閱第7圖，係為應用上述壓接裝置20之電子元件測試分類機，該測試分類機包含有機台50、供料裝置60、收料裝置70、測試裝置30、壓接裝置20及輸送裝置80及中央控制裝置，該供料裝置60係配置於機台50，用以容納至少一待測之電子元件，於本實施例中，供料裝置60係配置有至少一盛裝待測電子元件之料盤61；該收料裝置70係配置於機台50，用以容納至少一完測之電子元件，於本實施例中，係設有複數個可盛裝不同等級完測電子元件之料盤71；該測試裝置30 係設有具測試座32之測試電路板31，各測試座32內係具有探針33，並以測試器(圖未示出)將測試結果傳輸至中央控制裝置(圖未示出)，由中央控制裝置控制各裝置作動；至少一壓接裝置20係相同上述之壓接裝置(請配合參閱第2、3、4圖)，並配置於機台50上，用以壓抵測試座32內之電子元件，使電子元件之各錫球確實接觸測試座32之探針33而提升測試品質；輸送裝置80係配置於機台50上，並設有至少一具移料器之移料機構，用以移載電子元件，於本實施例中，輸送裝置80係包含有第一移料機構81、載送機構82及第二移料機構83，第一移料機構81係設有至少一第一移料器811，用以於供料裝置60、收料裝置70及載送機構82間移載待測/完測之電子元件，載送機構82係設有至少一載台821，用以於第一移料機構81及第二移料機構83間載送待測/完測之電子元件，第二移料機構83係設有至少一第二移料器831，用以於各測試裝置30及載送機構82間移載待測/完測之電子元件。Please refer to FIG. 7 , which is an electronic component test sorting machine applying the above-mentioned crimping device 20 , which comprises an organic table 50 , a feeding device 60 , a receiving device 70 , a testing device 30 , a crimping device 20 , and a conveying device . The device 80 and the central control device are disposed on the machine 50 for accommodating at least one electronic component to be tested. In this embodiment, the feeding device 60 is configured with at least one electronic component to be tested. The receiving device 70 is disposed on the machine 50 for accommodating at least one electronic component that is inspected. In this embodiment, a plurality of trays for loading electronic components of different levels are provided. 71; the test device 30 A test circuit board 31 having test sockets 32 is provided, each of which has a probe 33 therein, and transmits a test result to a central control device (not shown) by a tester (not shown). The central control device controls the operation of each device; at least one crimping device 20 is the same as the above-mentioned crimping device (please refer to Figures 2, 3 and 4), and is disposed on the machine table 50 for pressing against the test seat 32. The electronic component is such that the solder balls of the electronic component actually contact the probe 33 of the test socket 32 to improve the test quality; the transport device 80 is disposed on the machine 50 and is provided with at least one shifting mechanism of the shifter. In the present embodiment, the transport device 80 includes a first transfer mechanism 81, a transport mechanism 82, and a second transfer mechanism 83. The first transfer mechanism 81 is provided with at least one A shifter 811 is configured to transfer the electronic components to be tested/tested between the feeding device 60, the receiving device 70 and the carrying mechanism 82. The carrying mechanism 82 is provided with at least one loading platform 821 for The electronic component to be tested/completed is carried between the first transfer mechanism 81 and the second transfer mechanism 83, and the second transfer mechanism 83 is At least a second hopper 831 move to the respective test apparatus 30 and the loading mechanism 82 transfer the test / measurement of the finished electronic device.
請參閱第8圖，第一移料機構81之第一移料器811係位移至供料裝置60處，並於料盤61內取出待測之電子元件40，接著第一移料機構81之第一移料器811係將待測之電子元件40移載置入於載送機構82之載台821上；請參閱第9圖，載台821於承載待測之電子元件40後，即作Y軸向位移，將待測之電子元件40載送至第二移料機構83之側方，第二移料機構83之第二移料器831即位移至載台821處，並於載台821上取出待測之電子元件40；請參閱第10圖(請配合參閱第5、6圖)，第二移料機構83之第二移料器831係將待測之電子元件40移載置入於測試裝置30之測試座32內，壓接裝置20之傳動桿21可利用傳動件211及連結件212帶動第一、二下壓治具221、222同步向下位移，並先以第二下壓治具222之抵接部2221壓抵待測電子元件40之晶片42，使待測電子元件40底面中間位置之錫球43受壓而確實 接觸測試座32之探針33，第二下壓治具222上之感溫器27則可感測待測電子元件40之表面溫度，再以第一下壓治具22之防翹部2212壓抵待測電子元件40之基板41頂面四周，使待測電子元件40四周之各錫球43受壓而確實接觸測試座32之探針33，此時，第二下壓治具222可向上作緩衝位移，進而第一下壓治具221之防翹部2212與第二下壓治具222之抵接部2221可以不同作業高度而分別壓抵電子元件40之基板41及晶片42，令壓接裝置20全面性壓抵待測之電子元件40，使待測電子元件40之各錫球43平均受力而確實接觸測試座32之探針33，以提升測試作業品質，再者，壓接裝置20可利用流體輸入管243輸送冷卻流體至熱交換本體24內，並使冷卻流體由位於中間位置之入水口242注入於腔室241內，使冷卻流體與熱傳導件25之鰭片251作一冷熱交換，而可大幅降低電子元件40之高溫，接著已升溫之冷卻流體由各出水口244流入於熱交換本體24之導流槽246中，再匯流排入於流體輸出管245中，由流體輸出管245輸出水液，進而可將電子元件40控制於預設的測試溫度範圍；請參閱第4、11、12圖，於測試裝置30測試電子元件40完畢後，壓接裝置20係控制第一、二下壓治具221、222復位，第二移料機構83之第二移料器831即位移至測試座32取出完測之電子元件40，並移載至載送機構82之載台821，載台821係將完測之電子元件40載送至第一移料機構81之側方，第一移料機構81之第一移料器811即於載台821上取出完測之電子元件40，並依測試結果，將完測之電子元件40移載至收料裝置70處，並置入於收料裝置70之料盤71內，達到分類收置之實用效益。Referring to FIG. 8, the first shifter 811 of the first transfer mechanism 81 is displaced to the feeding device 60, and the electronic component 40 to be tested is taken out in the tray 61, and then the first transfer mechanism 81 The first shifter 811 is configured to transfer the electronic component 40 to be tested to the carrier 821 of the carrier mechanism 82. Referring to FIG. 9, the carrier 821 is placed on the electronic component 40 to be tested. Y axial displacement, carrying the electronic component 40 to be tested to the side of the second transfer mechanism 83, the second shifter 831 of the second transfer mechanism 83 is displaced to the stage 821, and on the stage The electronic component 40 to be tested is taken out at 821; please refer to FIG. 10 (please refer to FIGS. 5 and 6), and the second shifter 831 of the second transfer mechanism 83 moves the electronic component 40 to be tested. In the test socket 32 of the testing device 30, the transmission rod 21 of the crimping device 20 can drive the first and second pressing fixtures 221 and 222 to be synchronously displaced downward by using the transmission member 211 and the connecting member 212, and firstly The abutting portion 2221 of the pressing fixture 222 is pressed against the wafer 42 of the electronic component 40 to be tested, so that the solder ball 43 in the middle position of the bottom surface of the electronic component 40 to be tested is pressed. Contacting the probe 33 of the test socket 32, the temperature sensor 27 on the second lower pressing fixture 222 can sense the surface temperature of the electronic component 40 to be tested, and then press the anti-warpage portion 2212 of the first pressing fixture 22. Abutting the top surface of the substrate 41 of the electronic component 40, the solder balls 43 around the electronic component 40 to be tested are pressed to actually contact the probe 33 of the test socket 32. At this time, the second pressing fixture 222 can be upward. The cushioning displacement, and the abutting portion 2221 of the first pressing device 221 and the second pressing device 222 can be pressed against the substrate 41 and the wafer 42 of the electronic component 40 at different working heights, respectively. The connecting device 20 is fully pressed against the electronic component 40 to be tested, so that the solder balls 43 of the electronic component 40 to be tested are evenly stressed and actually contact the probe 33 of the test socket 32 to improve the quality of the test work, and further, crimping The device 20 can use the fluid input pipe 243 to deliver the cooling fluid into the heat exchange body 24, and inject the cooling fluid into the chamber 241 from the water inlet 242 at the intermediate position, so that the cooling fluid and the fin 251 of the heat conducting member 25 are made one. Cold and hot exchange, which can greatly reduce the high temperature of the electronic component 40, and then has cooled The fluid flows from the water outlets 244 into the flow guiding grooves 246 of the heat exchange body 24, and then flows into the fluid output pipe 245, and the liquid output pipe 245 outputs the water liquid, thereby controlling the electronic component 40 to be preset. Test temperature range; please refer to Figures 4, 11, and 12, after the test device 30 is tested for the electronic component 40, the crimping device 20 controls the first and second pressing fixtures 221, 222 to be reset, and the second transfer mechanism 83 The second shifter 831 is displaced to the test stand 32 to take out the tested electronic component 40 and transferred to the carrier 821 of the carrier mechanism 82. The carrier 821 carries the completed electronic component 40 to the first On the side of the material transfer mechanism 81, the first loader 811 of the first material transfer mechanism 81 takes out the measured electronic component 40 on the stage 821, and transfers the completed electronic component 40 to the test result. The receiving device 70 is placed in the tray 71 of the receiving device 70 to achieve the practical benefit of sorting and collecting.
請參閱第13圖，係為本發明壓接裝置之另一實施例，該壓接裝置20A之下壓機構係包含傳動桿21A及壓抵器22A，傳動桿21A係於一端設有連動器，用以連結驅動至少一壓抵器22A，於本實施例中，連動器包含有傳動件211A及複數支 連結件212A，傳動件211A之頂面係連結傳動桿21A，於內頂面則固設複數支連結件212A；壓抵器22A包含第一下壓治具221A及第二下壓治具222A，第二下壓治具222A係固定連結於傳動桿21A之傳動件211A一端，並相對於電子元件之發熱源，且以底部作為抵接部2221A，用以壓抵電子元件之發熱源，而可隨傳動桿21A同步位移，另於第二下壓治具222A之底面四周設有承置孔2222A，以供裝配具彈性件之第一下壓治具221A，該彈性件可為彈簧2213A，使第一下壓治具221A可於承置孔2222A內彈性升降位移，另第一下壓治具221A之底部可作為防翹部2212A，用以限制電子元件周側翹曲，更進一步，壓接裝置20A係於傳動桿21A與壓抵器22A間設有溫控機構，用以準確的將電子元件控制於預設的測試溫度範圍，於本實施例中，溫控機構包含熱交換本體24A、熱傳導件25A及加熱件26A，其中，熱交換本體24A之底面係凹設有中空之腔室241A，腔室241A係於頂面開設有一可流入冷卻流體之入水口242A，並使入水口242A連通可輸入冷卻水液、氣體等流體之流體輸入管243A，該流體輸入管243A可連接流體供應機，另於熱交換本體24A之腔室241A四周開設有複數個出水口244A，各出水口244A可連通位於熱交換本體24A頂面之導流槽246A，導流槽246A則連通熱交換本體24A之流體輸出管245A，用以輸出已冷熱交換後之冷卻流體，再於熱交換本體24A之頂面裝配一可防止流體外洩之封蓋249A，另於下壓機構之傳動件211A內部設有可驅動熱交換本體24A作升降位移之驅動源，於本實施例中，驅動源係於傳動件211A之內部設有馬達214A，馬達214A係驅動一為導螺桿215A之掣動件，並以導螺桿215A連結熱交換本體24A之封蓋249A，用以帶動熱交換本體24A作升降位移，又熱交換本體24A上係開設有複數個可套置於連結件212A上之穿孔247A，使熱交換本體24A可沿連結件212A而平穩位 移，該熱傳導件25A係位於熱交換本體24A之下方，並於頂面設有陣列之鰭片251A，各鰭片251A係置入於熱交換本體24A之腔室241A內，另於第二下壓治具222A上方固設有可為加熱件26A之溫控件，加熱件26A之上、下方則設有具導熱性能之石墨片，另該壓接裝置20A係設有感測電子元件溫度變化之感溫單元，該感溫單元可為感測電子元件表面溫度或感測第二下壓治具之感溫器，或為電子元件本身內建之感溫器，或為其他感測電子元件內部實際溫度之感溫電路等，於本實施例中，第二下壓治具222A之底面設有感溫器27A，用以感測電子元件之表面溫度，並以線路將溫度訊號連結至中央控制單元(圖未示出)，再者，壓接裝置20A係設有可控制溫度傳導效能之傳導件28A，傳導件28A可為具彈性之傳導片，傳導件28A可設於第二下壓治具222A與加熱件26A間，亦或設於加熱件26A與熱傳導件25A間，進而可控制傳導件28A之彈性變形量，以調整加熱件26A與第二下壓治具222A(或熱傳導件25A)間之距離，而控制溫度傳導之效能，於本實施例中，係於加熱件26A與熱傳導件25A間設有具彈性之傳導件28A，當電子元件之溫度保持於預設之測試溫度時，可利用傳導件28A令加熱件26A與熱傳導件25A間具有較大之間距，而延緩熱交換本體24A之低溫傳導，以防止電子元件之溫度低於預設之測試溫度，並降低加熱件26A之電能耗損，當電子元件之溫度高於預設之測試溫度時，則可控制馬達214A經導螺桿215A而帶動熱交換本體24A下降位移，令熱交換本體24A經熱傳導件25A而下壓傳導件28A壓縮變形，而縮短加熱件26A與熱傳導件25A間之距離，而提升熱交換本體24A之低溫傳導，以準確的將電子元件之溫度控制於預設的測試溫度範圍，進而提升冷卻效能。Referring to FIG. 13 , it is another embodiment of the crimping device of the present invention. The pressing mechanism of the crimping device 20A includes a transmission rod 21A and a presser 22A. The transmission rod 21A is provided with a coupling at one end. For connecting and driving at least one presser 22A, in the embodiment, the linker includes a transmission member 211A and a plurality of branches The connecting member 212A, the top surface of the transmission member 211A is coupled to the transmission rod 21A, and the plurality of connecting members 212A are fixed on the inner top surface; the pressing device 22A includes a first lower pressing fixture 221A and a second lower pressing fixture 222A. The second pressing fixture 222A is fixedly coupled to one end of the transmission member 211A of the transmission rod 21A, and is opposite to the heat source of the electronic component, and has a bottom portion as the abutting portion 2221A for pressing against the heat source of the electronic component. The driving rod 21A is synchronously displaced, and the receiving hole 2222A is disposed around the bottom surface of the second pressing fixture 222A for assembling the first pressing fixture 221A with the elastic member, and the elastic member can be the spring 2213A. The first lower pressing fixture 221A can be elastically moved up and down in the receiving hole 2222A, and the bottom of the first lower pressing fixture 221A can be used as the anti-warping portion 2212A for limiting the peripheral side warpage of the electronic component, and further, crimping The device 20A is provided with a temperature control mechanism between the transmission rod 21A and the pressure roller 22A for accurately controlling the electronic component to a preset test temperature range. In this embodiment, the temperature control mechanism includes a heat exchange body 24A, Heat conduction member 25A and heating member 26A, wherein the heat exchange body 24A The surface recess is provided with a hollow chamber 241A. The chamber 241A is provided with a water inlet 242A through which the cooling fluid can flow, and the water inlet 242A is connected to a fluid input pipe 243A for inputting a fluid such as cooling water, gas or the like. The fluid inlet pipe 243A can be connected to the fluid supply device, and a plurality of water outlets 244A are disposed around the chamber 241A of the heat exchange body 24A. The water outlets 244A can communicate with the flow guiding grooves 246A on the top surface of the heat exchange body 24A. The flow cell 246A is connected to the fluid output pipe 245A of the heat exchange body 24A for outputting the cooling fluid after the heat exchange, and then the top surface of the heat exchange body 24A is equipped with a cover 249A for preventing fluid leakage, and The driving member 211A of the pressing mechanism is internally provided with a driving source for driving the heat exchange body 24A for lifting and lowering. In this embodiment, the driving source is provided with a motor 214A inside the transmission member 211A, and the motor 214A is driven by a lead screw. The 215A is connected to the cover 249A of the heat exchange body 24A by the lead screw 215A for driving the heat exchange body 24A for lifting displacement, and the heat exchange body 24A is provided with a plurality of sleeves that can be placed on the joint The perforation 247A on the 212A enables the heat exchange body 24A to be stable along the joint 212A. The heat conducting member 25A is disposed below the heat exchange body 24A, and is provided with an array of fins 251A on the top surface, and the fins 251A are placed in the chamber 241A of the heat exchange body 24A, and in the second A temperature control member for the heating member 26A is fixed on the pressing fixture 222A, and a graphite sheet having thermal conductivity is disposed above and below the heating member 26A, and the crimping device 20A is provided with a temperature change of the sensing electronic component. a temperature sensing unit, which may be a temperature sensor for sensing the surface temperature of the electronic component or sensing the second pressing fixture, or a temperature sensor built in the electronic component itself, or other sensing electronic component In the present embodiment, the bottom surface of the second lower pressing fixture 222A is provided with a temperature sensor 27A for sensing the surface temperature of the electronic component and connecting the temperature signal to the center by the line. The control unit (not shown), further, the crimping device 20A is provided with a conductive member 28A for controlling the temperature conduction performance, the conductive member 28A can be a flexible conductive sheet, and the conductive member 28A can be disposed at the second pressing Between fixture 222A and heating element 26A, or in heating element 26A and heat conduction Between 25A, the amount of elastic deformation of the conductive member 28A can be controlled to adjust the distance between the heating member 26A and the second lower pressing fixture 222A (or the heat conducting member 25A) to control the efficiency of temperature conduction. In this embodiment, An elastic conductive member 28A is disposed between the heating member 26A and the heat conducting member 25A. When the temperature of the electronic component is maintained at a preset test temperature, the conductive member 28A can be used to make the heating member 26A and the heat conducting member 25A larger. The distance between the heat exchange body 24A is delayed, so as to prevent the temperature of the electronic component from being lower than the preset test temperature, and reducing the electrical energy loss of the heating element 26A. When the temperature of the electronic component is higher than the preset test temperature, Then, the motor 214A can be controlled to drive the heat exchange body 24A to be displaced downward by the lead screw 215A, so that the heat exchange body 24A compresses and deforms the lower conductive member 28A via the heat conducting member 25A, and shortens the distance between the heating member 26A and the heat conducting member 25A. The low temperature conduction of the heat exchange body 24A is improved to accurately control the temperature of the electronic component to a preset test temperature range, thereby improving the cooling performance.
請參閱第14、15圖，係為本發明之壓接控制方法，用以建構於測試批次化電子元件所依據之壓抵力量，並可微調壓抵力量，進而以最佳化之壓抵力量壓抵電子元件執行測試作業，批次 化電子元件係指整批之電子元件為相同型式之電子元件，壓接控制方法包含下列步驟：步驟91：壓接裝置20係位移作動壓抵電子元件，於本實施例中，壓接裝置20係以低速位移，例如以0.1~0.5 mm/sec低速位移，令壓抵器之抵接部及防翹部分別壓抵電子元件之發熱源及基板之周側，使電子元件底面之各部位錫球可平均受力接觸測試座之探針，並達到穩定電性傳導之效益；步驟92：感測單元100係感測壓接裝置20之壓抵力量，並將感測資料傳輸至中央控制裝置110，更進一步，感測單元100可於壓接裝置20或測試座上設有感測器(圖未示出)，感測器可為力量感測器，用以感測壓接裝置20之壓抵力量，於本實施例中，感測單元100係於壓接裝置20上設有力量感測器，力量感測器可感測壓接裝置20之抵接部及防翹部壓抵於電子元件上的力量，再將感測資料傳輸至中央控制裝置110；步驟93：於壓接裝置20之壓抵力量到達設定值時，位置檢知單元120係將壓接裝置20之目前位置資料傳輸儲存於中央控制裝置110，更進一步，中央控制裝置110係設有可儲存測試作業所需數據之資料庫，而可於資料庫內設定壓抵電子元件所需之壓抵力量數據，位置檢知單元120可於壓接裝置20或機台上配置有位置感測器(圖未示出)，用以感測壓接裝置20之壓抵器位置，並以線路連結中央控制裝置110，於本實施例中，位置檢知單元120可於壓接裝置20上配置有位置感測器，當中央控制裝置110由感測單元100傳輸之感測資料得知壓接裝置20之壓抵力量已到達資料庫內預設之設定值時，中央控制裝置110係控制位置檢知單元120檢知壓接裝置20之目前位置，位置檢知單元120即將壓接裝置20之目前位置傳輸儲存於中央控制裝置110之資料庫；步驟94：中央控制裝置110依據位置檢知單元120傳輸之資料建立壓接裝置20之壓抵基準位置，於本實施例中，由於測試批次化電子元件，中央控制裝置110可依據位置檢知單元120檢知壓接裝置20壓抵初始電子元件時之所在位置，而作為壓接裝置20壓抵後續電子元件之壓 抵基準位置；步驟95：於執行下一電子元件測試作業時，中央控制裝置110依據資料而控制壓接裝置20位移至壓抵基準位置壓抵電子元件執行測試作業，於本實施例中，於執行同批次之各電子元件測試作業時，中央控制裝置110可依據資料庫建立之數據，而控制壓接裝置20位移至壓抵基準位置之前即減速位移，壓接裝置20開始減速之位置可視該批次之電子元件公差而設定，例如壓接裝置20之壓抵器位移至距離待測電子元件0.2~0.5 mm時開始減速，並使壓抵器位移至壓抵基準位置即可壓抵電子元件執行測試作業；再者，壓接裝置20於壓抵各電子元件時，感測單元100之力量感測器可將每一次感測壓接裝置20之壓抵力量回饋至中央控制裝置110，中央控制裝置110即作一分析判別，若壓接裝置20之壓抵力量異於設定值，中央控制裝置110可利用警告單元130發出警告，警告單元130可以警報器發出警報，亦或於螢幕顯示器顯示錯誤訊息。Please refer to Figures 14 and 15 for the crimping control method of the present invention, which is used for constructing the pressing force according to the test batch electronic component, and can finely adjust the pressing force, thereby optimizing the pressure. Power against electronic components to perform test operations, batches The electronic component means that the electronic component of the whole batch is the same type of electronic component, and the crimping control method comprises the following steps: Step 91: The crimping device 20 is driven to be pressed against the electronic component. In the embodiment, the crimping device 20 At a low speed displacement, for example, a low speed displacement of 0.1 to 0.5 mm/sec, the abutting portion and the anti-warpage portion of the pressure roller are respectively pressed against the heat source of the electronic component and the peripheral side of the substrate, so that the portions of the bottom surface of the electronic component are tin. The ball can be contacted with the probe of the test stand on average, and achieve the benefit of stable electrical conduction; Step 92: The sensing unit 100 senses the pressing force of the crimping device 20 and transmits the sensing data to the central control device 110, further, the sensing unit 100 can be provided with a sensor (not shown) on the crimping device 20 or the test socket, and the sensor can be a force sensor for sensing the crimping device 20 In the present embodiment, the sensing unit 100 is provided with a force sensor on the crimping device 20, and the force sensor can sense the abutting portion and the anti-warping portion of the crimping device 20. The power on the electronic components, and then transmit the sensing data to the central control unit Step 93: When the pressing force of the crimping device 20 reaches the set value, the position detecting unit 120 stores the current position data of the crimping device 20 in the central control device 110, and further, the central control device 110 A database for storing data required for the test operation is provided, and the pressing force data required for pressing the electronic component can be set in the database, and the position detecting unit 120 can be configured with the position on the crimping device 20 or the machine. A sensor (not shown) is used to sense the position of the presser of the crimping device 20, and the central control device 110 is connected by a line. In this embodiment, the position detecting unit 120 can be used in the crimping device 20 A position sensor is disposed on the central control device 110. When the central control device 110 is informed by the sensing data transmitted by the sensing unit 100 that the pressing force of the crimping device 20 has reached a preset value in the database, the central control device 110 is configured. The control position detecting unit 120 detects the current position of the crimping device 20, and the position detecting unit 120 transmits the current position of the crimping device 20 to the database of the central control device 110; Step 94: The central control device 110 checks the position according to the position The data transmitted by the unit 120 establishes the pressing position of the crimping device 20, and in the embodiment, the central control device 110 can detect that the crimping device 20 is pressed according to the position detecting unit 120. The position of the initial electronic component, and the pressure of the subsequent electronic component as the crimping device 20 Step 95: When performing the next electronic component test operation, the central control device 110 controls the pressure device 20 to be pressed against the reference position to press the electronic component to perform the test operation according to the data. In this embodiment, When performing the test operation of each electronic component in the same batch, the central control device 110 can control the pressure-bonding device 20 to decelerate the displacement before the pressure is pressed against the reference position according to the data established by the database, and the position where the crimping device 20 starts to decelerate can be visualized. The electronic component tolerance of the batch is set. For example, when the pressure device of the crimping device 20 is displaced to 0.2 to 0.5 mm from the electronic component to be tested, the deceleration is started, and the pressure roller is displaced to the reference position to press the electron. The component performs a test operation. Further, when the crimping device 20 is pressed against the electronic components, the force sensor of the sensing unit 100 can feed back the pressing force of each sensing crimping device 20 to the central control device 110. The central control device 110 performs an analysis and determination. If the pressing force of the crimping device 20 is different from the set value, the central control device 110 can issue a warning by using the warning unit 130. 130 can siren alarm, or will display an error message appears on the screen.
〔習知〕[study]
11‧‧‧測試裝置11‧‧‧Testing device
112‧‧‧測試座112‧‧‧ test seat
111‧‧‧電路板111‧‧‧Circuit board
113‧‧‧探針113‧‧‧Probe
12‧‧‧壓接裝置12‧‧‧Crimping device
121‧‧‧傳動桿121‧‧‧Transmission rod
122‧‧‧下壓治具122‧‧‧Under pressure fixture
13‧‧‧IC13‧‧‧IC
131‧‧‧基板131‧‧‧Substrate
132‧‧‧晶片132‧‧‧ wafer
133‧‧‧錫球133‧‧‧ solder balls
〔本發明〕〔this invention〕
20、20A‧‧‧壓接裝置20, 20A‧‧‧ crimping device
21、21A‧‧‧傳動桿21, 21A‧‧‧ drive rod
211、211A‧‧‧傳動件211, 211A‧‧‧ transmission parts
212、212A‧‧‧連結件212, 212A‧‧‧Links
213‧‧‧流體通道213‧‧‧ fluid passage
214A‧‧‧馬達214A‧‧‧Motor
215A‧‧‧導螺桿215A‧‧‧ lead screw
22‧‧‧壓抵器22‧‧‧Bender
221、221A‧‧‧第一下壓治具221, 221A‧‧‧First pressing fixture
2211‧‧‧容置孔2211‧‧‧ accommodating holes
2212、2212A‧‧‧防翹部2212, 2212A‧‧ ‧ anti-warming department
2213A‧‧‧彈簧2213A‧‧ Spring
222、222A‧‧‧第二下壓治具222, 222A‧‧‧Second pressing fixture
2221、2221A‧‧‧抵接部2221, 2221A‧‧‧Apartment
2222A‧‧‧承置孔2222A‧‧‧Holding holes
23‧‧‧控壓件23‧‧‧Control parts
231‧‧‧容室231‧‧ ‧ room
232‧‧‧套合孔232‧‧‧Close hole
24、24A‧‧‧熱交換本體24, 24A‧‧‧ heat exchange body
241、241A‧‧‧腔室241, 241A‧‧ ‧ chamber
242、242A‧‧‧入水口242, 242A‧‧ ‧ water inlet
243、243A‧‧‧流體輸入管243, 243A‧‧‧ fluid input tube
244、244A‧‧‧出水口244, 244A‧‧ ‧ water outlet
245、245A‧‧‧流體輸出管245, 245A‧‧‧ fluid output tube
246、246A‧‧‧導流槽246, 246A‧‧ ‧ diversion trough
247、247A‧‧‧穿孔247, 247A‧‧‧ perforation
248、248A‧‧‧加熱線248, 248A‧‧‧ heating wire
249A‧‧‧封蓋249A‧‧‧ Cover
25、25A‧‧‧熱傳導件25, 25A‧‧‧ heat conduction parts
251、251A‧‧‧鰭片251, 251A‧‧‧ fins
26、26A‧‧‧加熱件26, 26A‧‧‧heating parts
27、27A‧‧‧感溫器27, 27A‧‧ ‧ temperature sensor
28A‧‧‧傳導件28A‧‧‧Transmission parts
30‧‧‧測試裝置30‧‧‧Testing device
31‧‧‧測試電路板31‧‧‧Test circuit board
32‧‧‧測試座32‧‧‧ test seat
33‧‧‧探針33‧‧‧Probe
40‧‧‧電子元件40‧‧‧Electronic components
41‧‧‧基板41‧‧‧Substrate
42‧‧‧晶片42‧‧‧ wafer
43‧‧‧錫球43‧‧‧ solder balls
50‧‧‧機台50‧‧‧ machine
60‧‧‧供料裝置60‧‧‧Feeding device
61‧‧‧料盤61‧‧‧Tray
70‧‧‧收料裝置70‧‧‧Receiving device
71‧‧‧料盤71‧‧‧Tray
80‧‧‧輸送裝置80‧‧‧Conveyor
81‧‧‧第一移料機構81‧‧‧First Transfer Mechanism
811‧‧‧第一移料器811‧‧‧First mover
82‧‧‧載送機構82‧‧‧ Carriers
821‧‧‧載台821‧‧‧ stage
83‧‧‧第二移料機構83‧‧‧Second transfer mechanism
831‧‧‧第二移料器831‧‧‧Second shifter
91~95‧‧‧步驟91~95‧‧‧Steps
100‧‧‧感測單元100‧‧‧Sensor unit
110‧‧‧中央控制裝置110‧‧‧Central control unit
120‧‧‧位置檢知單元120‧‧‧Location detection unit
130‧‧‧警示單元130‧‧‧Warning unit
第1圖：習知壓接裝置與測試裝置之使用示意圖。Figure 1: Schematic diagram of the use of conventional crimping devices and test devices.
第2圖：本發明壓接裝置之外觀圖。Fig. 2 is an external view of the crimping device of the present invention.
第3圖：本發明壓接裝置之零件分解圖。Figure 3 is an exploded view of the crimping device of the present invention.
第4圖：本發明壓接裝置之剖視圖。Figure 4 is a cross-sectional view of the crimping device of the present invention.
第5圖：本發明壓接裝置之使用示意圖(一)。Figure 5: Schematic diagram of the use of the crimping device of the present invention (1).
第6圖：本發明壓接裝置之使用示意圖(二)。Figure 6: Schematic diagram of the use of the crimping device of the present invention (2).
第7圖：本發明應用壓接裝置之電子元件測試分類機的示意圖。Figure 7 is a schematic view of an electronic component test sorter using the crimping device of the present invention.
第8圖：本發明電子元件測試分類機之示意圖(一)。Figure 8: Schematic diagram (1) of the electronic component test sorting machine of the present invention.
第9圖：本發明電子元件測試分類機之示意圖(二)。Figure 9: Schematic diagram of the electronic component test sorter of the present invention (2).
第10圖：本發明電子元件測試分類機之示意圖(三)。Figure 10: Schematic diagram of the electronic component test sorter of the present invention (3).
第11圖：本發明電子元件測試分類機之示意圖(四)。Figure 11: Schematic diagram of the electronic component test sorter of the present invention (4).
第12圖：本發明電子元件測試分類機之示意圖(五)。Figure 12: Schematic diagram of the electronic component test sorter of the present invention (5).
第13圖：係本發明壓接裝置之另一實施例圖。Figure 13 is a view showing another embodiment of the crimping apparatus of the present invention.
第14圖：係本發明壓接控制方法之示意圖。Figure 14 is a schematic view showing the crimping control method of the present invention.
第15圖：係應用壓接控制方法之方塊圖。Figure 15: Block diagram of the application of the crimp control method.
20‧‧‧壓接裝置20‧‧‧Crimping device
21‧‧‧傳動桿21‧‧‧ Transmission rod
211‧‧‧傳動件211‧‧‧ transmission parts
212‧‧‧連結件212‧‧‧Links
213‧‧‧流體通道213‧‧‧ fluid passage
22‧‧‧壓抵器22‧‧‧Bender
221‧‧‧第一下壓治具221‧‧‧First pressing fixture
2211‧‧‧容置孔2211‧‧‧ accommodating holes
2212‧‧‧防翹部2212‧‧‧Anti-warming department
222‧‧‧第二下壓治具222‧‧‧Second pressing fixture
2221‧‧‧抵接部2221‧‧‧Apartment
23‧‧‧控壓件23‧‧‧Control parts
231‧‧‧容室231‧‧ ‧ room
24‧‧‧熱交換本體24‧‧‧Heat Exchange Ontology
241‧‧‧腔室241‧‧‧ chamber
242‧‧‧入水口242‧‧‧ water inlet
243‧‧‧流體輸入管243‧‧‧ Fluid input tube
244‧‧‧出水口244‧‧‧Water outlet
245‧‧‧流體輸出管245‧‧‧ fluid output tube
246‧‧‧導流槽246‧‧‧Guide trough
248‧‧‧加熱線248‧‧‧heating line
25‧‧‧熱傳導件25‧‧‧Heat conductive parts
251‧‧‧鰭片251‧‧‧Fins
26‧‧‧加熱件26‧‧‧heating parts
27‧‧‧感溫器27‧‧‧temperature sensor
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101116914A TWI445982B (en) | 2012-05-11 | 2012-05-11 | Electronic device crimping device, application of crimping device test equipment and crimp control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101116914A TWI445982B (en) | 2012-05-11 | 2012-05-11 | Electronic device crimping device, application of crimping device test equipment and crimp control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201346293A TW201346293A (en) | 2013-11-16 |
| TWI445982B true TWI445982B (en) | 2014-07-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101116914A TWI445982B (en) | 2012-05-11 | 2012-05-11 | Electronic device crimping device, application of crimping device test equipment and crimp control method |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI445982B (en) |
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