TWI435841B - 接著材捲筒 - Google Patents
接著材捲筒 Download PDFInfo
- Publication number
- TWI435841B TWI435841B TW100108321A TW100108321A TWI435841B TW I435841 B TWI435841 B TW I435841B TW 100108321 A TW100108321 A TW 100108321A TW 100108321 A TW100108321 A TW 100108321A TW I435841 B TWI435841 B TW I435841B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive layer
- mass
- adhesive
- tape
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010056270 | 2010-03-12 | ||
JP2010086330 | 2010-04-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201139259A TW201139259A (en) | 2011-11-16 |
TWI435841B true TWI435841B (zh) | 2014-05-01 |
Family
ID=44563582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100108321A TWI435841B (zh) | 2010-03-12 | 2011-03-11 | 接著材捲筒 |
Country Status (5)
Country | Link |
---|---|
JP (3) | JPWO2011111784A1 (ja) |
KR (2) | KR20120113803A (ja) |
CN (2) | CN102712834B (ja) |
TW (1) | TWI435841B (ja) |
WO (1) | WO2011111784A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6046896B2 (ja) * | 2012-01-30 | 2016-12-21 | デクセリアルズ株式会社 | フィルム巻装体、及びフィルム巻装体の製造方法 |
JP5997306B2 (ja) * | 2015-02-18 | 2016-09-28 | 株式会社ホンマ | コーナー部用粘着テープ |
KR102615097B1 (ko) * | 2015-11-25 | 2023-12-18 | 가부시끼가이샤 레조낙 | 회로 접속용 접착제 조성물 및 구조체 |
DE102016200810A1 (de) | 2016-01-21 | 2017-07-27 | Tesa Se | Abroller, Verwendung eines Abrollers, Klebeband zur Verklebung von Bauteilen und Verklebung von zwei Bauteilen |
CN108603078A (zh) * | 2016-01-29 | 2018-09-28 | 日立化成株式会社 | 粘接剂膜及其制造方法、粘接剂带以及粘接剂膜用卷轴 |
CN111466015B (zh) * | 2018-03-23 | 2023-08-29 | 琳得科株式会社 | 固晶膜、切割固晶片及半导体芯片的制造方法 |
JP2020073404A (ja) * | 2019-09-30 | 2020-05-14 | 日立化成株式会社 | 異方導電フィルム用リール及び異方導電フィルム巻 |
JP7446095B2 (ja) * | 2019-12-03 | 2024-03-08 | デクセリアルズ株式会社 | フィルム巻装体及び接続体の製造方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3045427B2 (ja) * | 1992-06-22 | 2000-05-29 | ソニー株式会社 | 異方性導電膜の貼付け方法および装置 |
JPH0749504A (ja) * | 1993-08-06 | 1995-02-21 | Hitachi Electron Eng Co Ltd | 異方性導電テープのカット目検出装置 |
JP3223780B2 (ja) * | 1996-01-19 | 2001-10-29 | 松下電器産業株式会社 | チップの実装装置 |
JPH1051115A (ja) * | 1996-07-29 | 1998-02-20 | Sony Corp | 異方性導電膜貼付け装置及び異方性導電膜分割方法 |
JP4151083B2 (ja) * | 1997-05-12 | 2008-09-17 | 日立化成工業株式会社 | 異方導電性接着テープの貼付け方法および装置 |
JP3648933B2 (ja) * | 1997-08-06 | 2005-05-18 | 松下電器産業株式会社 | 異方性導電材の貼着方法 |
JPH11339575A (ja) * | 1998-05-22 | 1999-12-10 | Sony Corp | 異方性導電性テープの製造方法及び装置 |
JP3680669B2 (ja) * | 1999-12-17 | 2005-08-10 | ソニーケミカル株式会社 | 多層異方性導電膜積層体 |
JP4648521B2 (ja) * | 2000-07-17 | 2011-03-09 | スタンレー電気株式会社 | 液晶装置の製造方法 |
JP2002226822A (ja) * | 2001-01-30 | 2002-08-14 | Three M Innovative Properties Co | 光線活性化型接着フィルムを用いた基材接着方法 |
JP4239585B2 (ja) * | 2002-12-24 | 2009-03-18 | 日立化成工業株式会社 | 接着剤テープの接続方法及び接着剤テープ接続体 |
JP2004323621A (ja) * | 2003-04-23 | 2004-11-18 | Hitachi Chem Co Ltd | 接着材テープ |
JP4654566B2 (ja) * | 2003-04-23 | 2011-03-23 | 日立化成工業株式会社 | 接着剤テープの接続方法及び接着剤テープ接続体 |
JP4333140B2 (ja) * | 2003-01-08 | 2009-09-16 | 日立化成工業株式会社 | 接着剤テープの製造方法 |
CN100548840C (zh) * | 2002-07-30 | 2009-10-14 | 日立化成工业株式会社 | 粘接材料带连接体及粘接材料带的连接方法 |
JP3991268B2 (ja) * | 2002-11-29 | 2007-10-17 | 日立化成工業株式会社 | 回路部材接続用フィルム状接着剤及びこれを用いた半導体装置 |
KR20100009562A (ko) * | 2004-06-09 | 2010-01-27 | 히다치 가세고교 가부시끼가이샤 | 회로접속재료, 필름상 회로접속재, 및 회로부재의 접속 구조 |
JP4595459B2 (ja) * | 2004-09-15 | 2010-12-08 | カシオ計算機株式会社 | 粘着性接着材の転写方法 |
JP2009004354A (ja) * | 2007-05-23 | 2009-01-08 | Hitachi Chem Co Ltd | 接着材リール及びこれを用いた回路接続体の製造方法 |
WO2009031472A1 (ja) * | 2007-09-05 | 2009-03-12 | Hitachi Chemical Company, Ltd. | 接着剤及びそれを用いた接続構造体 |
JP5332259B2 (ja) * | 2008-03-28 | 2013-11-06 | デクセリアルズ株式会社 | 異方性導電膜転写具及び接続方法 |
-
2011
- 2011-03-10 WO PCT/JP2011/055671 patent/WO2011111784A1/ja active Application Filing
- 2011-03-10 KR KR1020127022602A patent/KR20120113803A/ko active Search and Examination
- 2011-03-10 CN CN201180006535.4A patent/CN102712834B/zh active Active
- 2011-03-10 CN CN201410610471.4A patent/CN104403589B/zh active Active
- 2011-03-10 KR KR1020147009593A patent/KR101763458B1/ko active IP Right Grant
- 2011-03-10 JP JP2011513812A patent/JPWO2011111784A1/ja active Pending
- 2011-03-11 TW TW100108321A patent/TWI435841B/zh active
-
2013
- 2013-10-07 JP JP2013210199A patent/JP2014037544A/ja active Pending
-
2014
- 2014-12-12 JP JP2014251690A patent/JP5928567B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR20120113803A (ko) | 2012-10-15 |
JP2015083691A (ja) | 2015-04-30 |
TW201139259A (en) | 2011-11-16 |
JPWO2011111784A1 (ja) | 2013-06-27 |
CN104403589B (zh) | 2017-01-11 |
WO2011111784A1 (ja) | 2011-09-15 |
JP2014037544A (ja) | 2014-02-27 |
KR20140054438A (ko) | 2014-05-08 |
CN102712834B (zh) | 2014-11-26 |
CN104403589A (zh) | 2015-03-11 |
JP5928567B2 (ja) | 2016-06-01 |
KR101763458B1 (ko) | 2017-07-31 |
CN102712834A (zh) | 2012-10-03 |
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