TWI435479B - Light emitting package - Google Patents
Light emitting package Download PDFInfo
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- TWI435479B TWI435479B TW100127692A TW100127692A TWI435479B TW I435479 B TWI435479 B TW I435479B TW 100127692 A TW100127692 A TW 100127692A TW 100127692 A TW100127692 A TW 100127692A TW I435479 B TWI435479 B TW I435479B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
- H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Description
本發明係有關一種晶片封裝件，尤指一種可發光式封裝件。The present invention relates to a chip package, and more particularly to an illuminable package.
隨著電子工業的進步與數位時代的來臨，各式電子產品均朝向提升功效之趨勢發展。對於各類發光裝置，例如發光二極體(LED)而言，如何提升演色性、出光效率等，係為目前LED封裝產業的研發方向。With the advancement of the electronics industry and the advent of the digital era, all kinds of electronic products are moving toward the trend of improving efficiency. For various types of light-emitting devices, such as light-emitting diodes (LEDs), how to improve color rendering, light-emitting efficiency, etc., is the current research and development direction of the LED packaging industry.
目前白光LED封裝件常在螢光粉中添加紅色螢光粉以提升演色性(color rendering index,CRI)。如第1圖所示之習知白光LED封裝件1，其包括：承載件10、設置並電性連接於該承載件10上之發光二極體晶片11、形成於該承載件10上且包覆該發光二極體晶片11之第一矽膠體13、以及塗佈於該第一矽膠體13上之第二矽膠體14，其中，該第二矽膠體14係填入有紅色螢光粉141與黃色螢光粉142。At present, white LED packages often add red phosphor powder to the phosphor powder to enhance color rendering index (CRI). A conventional white LED package 1 as shown in FIG. 1 includes: a carrier 10, a light-emitting diode chip 11 disposed on the electrical component 10, and formed on the carrier 10 and packaged a first colloid 13 covering the LED wafer 11 and a second colloid 14 coated on the first colloid 13 , wherein the second colloid 14 is filled with red phosphor 141 With yellow phosphor powder 142.
惟，習知白光LED封裝件1中，因該黃色螢光粉142之光波長(黃光真空下為577-597nm)短於該紅色螢光粉141之光波長(紅光真空下為622-780nm)，故該黃色螢光粉142因其能隙大而所發出之光線的能量較大，而能量大的光線會被能隙小的螢光粉吸收能量，因而該紅色螢光粉141會吸收黃色螢光粉142所發出之光線的能量，導致白光LED封裝件1之出光效率降低，更甚者，其所發出之光並不會呈現高亮白之 白光，而會有色偏產生，因而造成演色性下降。However, in the conventional white LED package 1, the wavelength of light of the yellow phosphor 142 (577-597 nm under yellow vacuum) is shorter than the wavelength of the red phosphor 141 (622- under red vacuum). 780 nm), so the yellow phosphor powder 142 has a larger energy of light emitted by the energy gap, and the energy of the light is absorbed by the phosphor with a small energy gap, so the red phosphor powder 141 will Absorbing the energy of the light emitted by the yellow phosphor powder 142 causes the light-emitting efficiency of the white LED package 1 to decrease, and even more, the light emitted by the light-emitting LED 1 does not appear bright white White light, and color shift occurs, resulting in a decrease in color rendering.
因此，如何克服習知技術之種種問題，實為一重要課題。Therefore, how to overcome various problems of the prior art is an important issue.
為克服習知技術之種種問題，本發明係提供一種可發光式封裝件，係包括：承載件；設於該承載件上之至少一發光晶片；設於該承載件上，且佈設於該發光晶片周圍之擋塊，該擋塊中具有第一螢光粉；形成於該承載件上，以包覆該發光晶片與擋塊之第一封裝膠體；以及形成於該第一封裝膠體上之第二封裝膠體，且該第二封裝膠體中具有第二螢光粉，該第二螢光粉之光波長短於該第一螢光粉之光波長。In order to overcome the problems of the prior art, the present invention provides an illuminable package, comprising: a carrier; at least one illuminating chip disposed on the carrier; disposed on the carrier and disposed on the illuminating device a stopper around the wafer, the stopper having a first phosphor powder; a first encapsulant formed on the carrier to cover the illuminating wafer and the stopper; and a first formed on the first encapsulant The second encapsulant has a second phosphor, and the second phosphor has a light wavelength shorter than a wavelength of the first phosphor.
前述之封裝件中，該發光晶片可為發光二極體，且該擋塊可為矽膠塊，又該擋塊之佈設形式可為點狀或框狀。In the above package, the light-emitting chip may be a light-emitting diode, and the block may be a rubber block, and the block may be arranged in a dot shape or a frame shape.
前述之封裝件中，該第一螢光粉之光色可為紅色或橙色，而該第二螢光粉之光色可為黃色或綠色。In the foregoing package, the light color of the first phosphor may be red or orange, and the color of the second phosphor may be yellow or green.
由上可知，本發明之可發光式封裝件，係將長光波長之第一螢光粉與短光波長之第二螢光粉分開設置，且該第二螢光粉位於該第一螢光粉之外側，使該第二螢光粉所發出之光不會經過該第一螢光粉，因而可避免該第一螢光粉吸收該第二螢光粉所發出之光，不僅可提升出光效率，且可避免演色性下降之問題。As can be seen from the above, the illuminable package of the present invention is characterized in that the first phosphor of the long wavelength is separated from the second phosphor of the short wavelength, and the second phosphor is located at the first phosphor. On the outer side of the powder, the light emitted by the second phosphor does not pass through the first phosphor, thereby preventing the first phosphor from absorbing the light emitted by the second phosphor, and not only lifting the light Efficiency, and can avoid the problem of color rendering.
再者，藉由將擋塊佈設於該發光晶片周圍，使該第一螢光粉分布於發光晶片周圍，以有效利用該發光晶片側面所發出之光，亦可提升出光效率。Furthermore, by arranging the stopper around the light-emitting chip, the first phosphor powder is distributed around the light-emitting chip to effectively utilize the light emitted from the side surface of the light-emitting chip, thereby improving the light-emitting efficiency.
以下藉由特定的具體實施例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如“上”、“下”、“頂”、“底”、“內”、“外”及“一”等之用語，亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. At the same time, the terms "upper", "lower", "top", "bottom", "inside", "outside" and "one" as used in this specification are only for the convenience of description, not The scope of the present invention is to be construed as being limited to the scope of the invention.
請參閱第2圖，本發明係提供一種可發光式封裝件2，其包括：一承載件20、設於該承載件20上之一發光晶片21、設於該承載件20上且佈設於該發光晶片21周圍之至少一擋塊(dam)22、形成於該承載件20上且包覆該發光晶片21與擋塊22之第一封裝膠體23以及塗佈於該第一封裝膠體23上之第二封裝膠體24。Referring to FIG. 2, the present invention provides an illuminable package 2, comprising: a carrier 20, an illuminating chip 21 disposed on the carrier 20, disposed on the carrier 20, and disposed on the carrier 20 At least one dam 22 around the illuminating wafer 21, a first encapsulant 23 formed on the carrier 20 and covering the luminescent wafer 21 and the stopper 22, and coated on the first encapsulant 23 The second encapsulant 24 is.
本實施例中，所述之承載件20係為凹槽型。該承載件20係由一導線架201與一散熱片202作為底部，再於底部上方以封裝材形成凹槽200，且令該凹槽200壁面形成反射面200a。有關承載件之種類繁多，可依需求作設計，並不限於此，且其並非本案之技術特徵，故不再贅述。In this embodiment, the carrier 20 is a groove type. The carrier 20 is formed by a lead frame 201 and a heat sink 202 as a bottom portion, and a groove 200 is formed in the package material above the bottom portion, and the wall surface of the groove 200 forms a reflecting surface 200a. There are many types of carrier members, which can be designed according to requirements. It is not limited to this, and it is not a technical feature of the present case, so it will not be described again.
所述之發光晶片21係為發光二極體(Light Emitting Diode,LED)晶片，其具有上表面21a與下表面21b，該上表面21a上具有電性接觸墊210。於本實施例中，該發光晶片21之下表面21b藉由黏著層211結合於該凹槽200底面(散熱片202)上，並藉由複數導線212電性連接該電性接觸墊210與該導線架201之導腳。The illuminating wafer 21 is a Light Emitting Diode (LED) wafer having an upper surface 21a and a lower surface 21b, and the upper surface 21a has an electrical contact pad 210 thereon. In this embodiment, the lower surface 21b of the luminescent wafer 21 is bonded to the bottom surface of the recess 200 (the heat sink 202) by an adhesive layer 211, and electrically connected to the electrical contact pad 210 by a plurality of wires 212. The lead of the lead frame 201.
所述之擋塊22係為具有第一螢光粉220之矽膠塊。於本實施例中，該擋塊22係佈設於該凹槽200底面上，且該擋塊22之佈設形式可為如第2a圖所示之框狀、或如第2b圖所示之複數點狀。The stopper 22 is a silicone block having a first phosphor powder 220. In this embodiment, the block 22 is disposed on the bottom surface of the groove 200, and the block 22 can be arranged in a frame shape as shown in FIG. 2a or as a plurality of points as shown in FIG. 2b. shape.
所述之第一封裝膠體23係為矽膠體。於本實施例中，該第一封裝膠體23係形成於該凹槽200中，以包覆該發光晶片21、導線212與擋塊22。The first encapsulant 23 is a tantalum colloid. In the embodiment, the first encapsulant 23 is formed in the recess 200 to cover the illuminating chip 21, the wire 212 and the stopper 22.
所述之第二封裝膠體24係為具有第二螢光粉240之矽膠體，且該第二螢光粉240之光波長短於該第一螢光粉220之光波長。於本實施例中，該第二封裝膠體24形成於該凹槽200中之第一封裝膠體23上，且該第一螢光粉220之光色係為紅色或橙色，而該第二螢光粉240之光色係為黃色或綠色，但不限於此。The second encapsulant 24 is a colloidal gel having a second phosphor powder 240, and the second phosphor powder 240 has a shorter wavelength than the first phosphor powder 220. In this embodiment, the second encapsulant 24 is formed on the first encapsulant 23 in the recess 200, and the light color of the first phosphor 220 is red or orange, and the second fluorescent The color of the powder 240 is yellow or green, but is not limited thereto.
本發明係藉由短光波長之螢光粉不會吸收長波長之光線的特性，而將光波長較長之第一螢光粉220分布在離封裝件的出光側較遠之處(即位於靠近封裝件內側，如圖所示之靠近凹槽200底部)，且將短光波長之第二螢光粉240設於離封裝件的出光側較近之處(即位於靠近封裝件外側，如圖所示之靠近凹槽200頂部)，使該第一螢光粉220所發出之光線向出光側(即圖中朝上)射出經過該第二封裝膠體24時，該第一螢光粉220所發出之光線不會被該第二螢光粉240吸收(如圖中箭頭L所示之第一螢光粉220發出之光線路徑)，以維持出光效率。In the present invention, the fluorescent powder having a short light wavelength does not absorb the characteristics of the long-wavelength light, and the first fluorescent powder 220 having a longer optical wavelength is distributed farther from the light-emitting side of the package (ie, located at the light-emitting side of the package) Adjacent to the inside of the package, as shown in the bottom of the recess 200, and the second phosphor of the short-light wavelength is disposed closer to the light-emitting side of the package (ie, located near the outside of the package, such as The first phosphor powder 220 is shown when the light emitted by the first phosphor powder 220 is emitted toward the light exiting side (ie, upward in the drawing) through the second encapsulant 24, as shown in the figure. The emitted light is not absorbed by the second phosphor 240 (the light path from the first phosphor 220 as indicated by the arrow L in the figure) to maintain the light output efficiency.
再者，該第二螢光粉240所發出之光線向出光側(即圖中朝上)射出時，因不會經過該第一螢光粉220，故該第二螢光粉240所發出之光線不會被該第一螢光粉220吸收(如圖中箭頭S所示之第二螢光粉240發出之光線路徑)，以提升出光效率。In addition, when the light emitted by the second phosphor 240 is emitted toward the light emitting side (ie, upward in the drawing), since the first phosphor powder 220 is not passed, the second phosphor powder 240 is emitted. The light is not absorbed by the first phosphor powder 220 (the light path emitted by the second phosphor powder 240 as indicated by the arrow S in the figure) to enhance the light extraction efficiency.
又，於該發光晶片21周圍設置高度較高之擋塊22，令該第一螢光粉220分布於該發光晶片21周圍，以藉該第一螢光粉220改善該發光晶片21側面所發出之光線的演色性及發光效率，使該發光晶片21側面所發出之光線符合使用需求，而達到利用價值。Further, a spacer 22 having a higher height is disposed around the illuminating chip 21, and the first phosphor powder 220 is distributed around the illuminating wafer 21 to improve the side surface of the illuminating chip 21 by the first phosphor powder 220. The color rendering and luminous efficiency of the light source make the light emitted from the side of the light-emitting chip 21 meet the use requirements and achieve the use value.
請參閱第3圖，係提供另一種本發明之可發光式封裝件3，其包括：一承載件30、設於該承載件30上之一發光晶片31、設於該承載件30上且佈設於該發光晶片31周圍之至少一擋塊32、形成於該承載件30上且包覆該發光晶片31與擋塊32之第一封裝膠體33、以及塗佈於該第一封裝膠體33上之第二封裝膠體34。Referring to FIG. 3, another illuminable package 3 of the present invention is provided, comprising: a carrier member 30, an illuminating chip 31 disposed on the carrier member 30, and disposed on the carrier member 30. At least one stopper 32 around the illuminating wafer 31, a first encapsulant 33 formed on the carrier 30 and covering the luminescent wafer 31 and the stopper 32, and coated on the first encapsulant 33 The second encapsulant 34.
所述之承載件30係為平板型。於本實施例中，該承載件20係為電路板。The carrier 30 is a flat type. In this embodiment, the carrier 20 is a circuit board.
所述之發光晶片31係為發光二極體(LED)晶片，且電性連接該承載件30(可以打線式或覆晶式電性連接)。有關發光晶片31電性連接承載件30之方式繁多，並無特別限制。The light-emitting chip 31 is a light-emitting diode (LED) wafer, and is electrically connected to the carrier 30 (which can be wired or flip-chip electrically connected). There are many ways in which the light-emitting chip 31 is electrically connected to the carrier 30, and is not particularly limited.
所述之擋塊32係為具有第一螢光粉320之矽膠塊。The stopper 32 is a silicone block having a first phosphor powder 320.
所述之第一封裝膠體33係為矽膠體。The first encapsulant 33 is a tantalum colloid.
所述之第二封裝膠體34係為具有第二螢光粉340之矽膠體，且該第二螢光粉340之光波長短於該第一螢光粉320之光波長。The second encapsulant 34 is a colloid having a second phosphor 340, and the second phosphor 340 has a shorter wavelength than the first phosphor 320.
如第3圖所示，係將光波長較長之第一螢光粉320設在靠近封裝件內側，且將短光波長之第二螢光粉340設於靠近封裝件外側，使該第一螢光粉320所發出之光線向外射出經過該第二封裝膠體34時，該第一螢光粉320所發出之光線不會被該第二螢光粉340吸收，以維持出光效率。As shown in FIG. 3, the first phosphor powder 320 having a longer wavelength of light is disposed near the inside of the package, and the second phosphor powder 340 having a short wavelength of light is disposed near the outside of the package, so that the first When the light emitted by the phosphor 320 is emitted out through the second encapsulant 34, the light emitted by the first phosphor 320 is not absorbed by the second phosphor 340 to maintain the light-emitting efficiency.
再者，該第二螢光粉340所發出之光線向外射出時，因不會經過該第一螢光粉320，故該第二螢光粉340所發出之光線不會被該第一螢光粉320吸收，以提升出光效率。Moreover, when the light emitted by the second phosphor powder 340 is emitted outward, since the first phosphor powder 320 does not pass, the light emitted by the second phosphor powder 340 is not blocked by the first phosphor. The light powder 320 is absorbed to enhance light extraction efficiency.
又，該第一螢光粉320分布於該發光晶片31周圍，以改善該發光晶片31側面所發出之光線的演色性及出光效率，使該發光晶片31側面所發出之光線符合使用需求。Moreover, the first phosphor powder 320 is distributed around the light-emitting chip 31 to improve the color rendering property and the light-emitting efficiency of the light emitted from the side surface of the light-emitting chip 31, so that the light emitted from the side surface of the light-emitting chip 31 meets the use requirements.
綜上所述，本發明之可發光式封裝件，主要藉由將短波長之第二螢光粉設於長波長之第一螢光粉外側，使該第二螢光粉所發出之光線向外射出時不會被該第一螢光粉吸收，不僅可提升出光效率，且可避免演色性下降之問題。In summary, the illuminable package of the present invention mainly uses a short-wavelength second phosphor to be disposed outside the long-wavelength first phosphor to cause the second phosphor to emit light. When it is shot out, it is not absorbed by the first phosphor powder, which not only improves the light extraction efficiency, but also avoids the problem of color rendering degradation.
再者，藉由將長波長之第一螢光粉設於該發光晶片周圍，使該發光晶片側面所發出之光達到利用價值，以提升出光效率。Furthermore, by providing a long-wavelength first phosphor on the periphery of the light-emitting chip, the light emitted from the side surface of the light-emitting chip is used to increase the light-emitting efficiency.
上述實施例係用以例示性說明本發明之原理及其功效，而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修改。因此本發明之權利保護範圍，應如後述之申請專利範圍所列。The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.
1．．．白光LED封裝件1. . . White LED package
10、20、30．．．承載件10, 20, 30. . . Carrier
11．．．發光二極體晶片11. . . Light-emitting diode chip
13．．．第一矽膠體13. . . First colloid
14．．．第二矽膠體14. . . Second colloid
141．．．紅色螢光粉141. . . Red fluorescent powder
142．．．黃色螢光粉142. . . Yellow fluorescent powder
2、3．．．可發光式封裝件2, 3. . . Illuminable package
200．．．凹槽200. . . Groove
200a．．．反射面200a. . . Reflective surface
201．．．導線架201. . . Lead frame
202．．．散熱片202. . . heat sink
21、31．．．發光晶片21, 31. . . Light emitting chip
21a．．．上表面21a. . . Upper surface
21b．．．下表面21b. . . lower surface
210．．．電性接觸墊210. . . Electrical contact pad
211．．．黏著層211. . . Adhesive layer
212．．．導線212. . . wire
22、32．．．擋塊22, 32. . . Stoppers
220、320．．．第一螢光粉220, 320. . . First phosphor
23、33．．．第一封裝膠體23, 33. . . First encapsulant
24、34．．．第二封裝膠體24, 34. . . Second encapsulant
240、340．．．第二螢光粉240, 340. . . Second phosphor
L、S．．．箭頭L, S. . . arrow
第1圖係為習知白光LED封裝件之剖面示意圖；Figure 1 is a schematic cross-sectional view of a conventional white LED package;
第2圖係為本發明可發光式封裝件之一實施例之剖面示意圖；2 is a schematic cross-sectional view showing an embodiment of an illuminable package of the present invention;
第2a及2b圖係為第2圖之不同實施態樣的局部上視示意圖；以及2a and 2b are partial top views of different embodiments of Fig. 2;
第3圖係為本發明可發光式封裝件之另一實施例之剖面示意圖。Figure 3 is a cross-sectional view showing another embodiment of the illuminable package of the present invention.
3．．．可發光式封裝件3. . . Illuminable package
30．．．承載件30. . . Carrier
31．．．發光晶片31. . . Light emitting chip
32．．．擋塊32. . . Stoppers
320．．．第一螢光粉320. . . First phosphor
33．．．第一封裝膠體33. . . First encapsulant
34．．．第二封裝膠體34. . . Second encapsulant
340．．．第二螢光粉340. . . Second phosphor
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100127692A TWI435479B (en) | 2011-08-04 | 2011-08-04 | Light emitting package |
| CN2011102600162A CN102916115A (en) | 2011-08-04 | 2011-08-30 | Luminous package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100127692A TWI435479B (en) | 2011-08-04 | 2011-08-04 | Light emitting package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201308679A TW201308679A (en) | 2013-02-16 |
| TWI435479B true TWI435479B (en) | 2014-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100127692A TWI435479B (en) | 2011-08-04 | 2011-08-04 | Light emitting package |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102916115A (en) |
| TW (1) | TWI435479B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7521728B2 (en) * | 2006-01-20 | 2009-04-21 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same |
| CN101558501B (en) * | 2006-10-12 | 2015-04-22 | 科锐公司 | Lighting device and method of making same |
| US8247827B2 (en) * | 2008-09-30 | 2012-08-21 | Bridgelux, Inc. | LED phosphor deposition |
| TWI354365B (en) * | 2009-08-26 | 2011-12-11 | Quasioptical led package structure for increasing |
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2011
- 2011-08-04 TW TW100127692A patent/TWI435479B/en not_active IP Right Cessation
- 2011-08-30 CN CN2011102600162A patent/CN102916115A/en active Pending
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| Publication number | Publication date |
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| CN102916115A (en) | 2013-02-06 |
| TW201308679A (en) | 2013-02-16 |
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