TWI421740B - Manufacturing methods of touch display panel and electronic device applied with the same - Google Patents

Description

觸控顯示面板及電子裝置之製造方法Touch display panel and method of manufacturing electronic device

本發明是有關於一種觸控顯示面板及電子裝置之製造方法，且特別是有關於一種可提升良率之觸控顯示面板及電子裝置之製造方法。The present invention relates to a touch display panel and a method of manufacturing the electronic device, and more particularly to a touch display panel and a method of manufacturing the electronic device capable of improving yield.

隨著平面顯示器技術的發展，平面顯示器的顯示效果已有長足的進步。再者，由於製程技術的進步，帶動平面顯示器的成本下降，使得平面顯示器在市場上受到廣大消費者的喜愛。為了提升使用上的便利性，近年來業界更將觸控面板整合至平面顯示器，並且應用於各樣電子裝置當中。使用者可藉由直接在面板上點選畫面來進行各項操作，藉此提供更為便捷且人性化的操作模式。With the development of flat panel display technology, the display effect of flat panel displays has been greatly improved. Moreover, due to advances in process technology, the cost of driving flat-panel displays has declined, making flat-panel displays popular among consumers in the market. In order to improve the convenience of use, in recent years, the industry has integrated touch panels into flat displays and applied them to various electronic devices. The user can perform various operations by clicking on the screen directly on the panel, thereby providing a more convenient and user-friendly operation mode.

一般在觸控顯示面板的製造方法中，為了將觸控結構以及顯示面板之彩色濾光片結構分別形成於同一玻璃基板之兩表面上，必須在形成觸控結構之後將玻璃基板翻轉，使得觸控結構接觸於製程機台之傳送帶或平台上。如此一來，容易使得觸控結構與傳送帶或平台產生摩擦，進而發生刮傷的現象。如此係降低了製程的良率。另外，由於觸控結構形成在玻璃基板之表面上，在進行玻璃基板的薄化時會損壞觸控結構，故不能在此製程步驟下進行。再者，由於玻璃基板必須維持一定之結構強度，以確保在接下來的製程步驟中玻璃基板不會發生破裂的現象，使得玻 璃基板難以進行薄化。特別是玻璃基板之表面已形成有觸控結構時，更進一步提高了薄化玻璃基板的難度。如此係使玻璃基板的厚度無法進一步降低，進一步讓觸控顯示面板的厚度無法有效降低，難以達成目前市場上對於產品薄型化的需求。Generally, in the manufacturing method of the touch display panel, in order to form the touch filter structure and the color filter structure of the display panel on the two surfaces of the same glass substrate, the glass substrate must be flipped after the touch structure is formed, so that the touch The control structure is in contact with the conveyor belt or platform of the process machine. As a result, it is easy to cause the touch structure to rub against the conveyor belt or the platform, thereby causing scratches. This reduces the yield of the process. In addition, since the touch structure is formed on the surface of the glass substrate, the touch structure is damaged when the glass substrate is thinned, and thus cannot be performed under the process steps. Furthermore, since the glass substrate must maintain a certain structural strength, it is ensured that the glass substrate does not rupture in the subsequent process steps, so that the glass The glass substrate is difficult to be thinned. In particular, when the touch structure is formed on the surface of the glass substrate, the difficulty of thinning the glass substrate is further improved. In this way, the thickness of the glass substrate cannot be further reduced, and the thickness of the touch display panel cannot be effectively reduced, and it is difficult to achieve the current demand for thin products.

本發明係提供一種觸控顯示面板及電子裝置之製造方法，其係藉由虛擬基板覆蓋於觸控結構上之方式，可避免觸控結構在製程中受損的問題，進而提升製程之良率。另外，也可在製程中順利進行基板薄化之步驟，降低觸控顯示面板的整體厚度。The invention provides a touch display panel and a manufacturing method of the electronic device, which are covered by the virtual substrate on the touch structure, thereby avoiding the problem that the touch structure is damaged in the process, thereby improving the yield of the process. . In addition, the step of thinning the substrate can be smoothly performed in the process, and the overall thickness of the touch display panel can be reduced.

根據本發明之第一方面，提出一種觸控顯示面板之製造方法，包括以下步驟。提供一第一基板，第一基板之一第一表面上具有一觸控結構。設置一虛擬基板於第一基板之第一表面上，並且覆蓋於觸控結構之上。形成一覆蓋層於第一基板之一第二表面上，第二表面係相對於第一表面。提供一第二基板，第二基板之一第一表面上具有一主動結構。對組第一基板及第二基板，使第二基板之主動結構相對於第一基板之覆蓋層，並且於第一基板及第二基板之間形成一顯示介質層。移去虛擬基板。According to a first aspect of the present invention, a method of manufacturing a touch display panel is provided, comprising the following steps. A first substrate is provided, and a first surface of the first substrate has a touch structure. A dummy substrate is disposed on the first surface of the first substrate and overlying the touch structure. Forming a cover layer on a second surface of the first substrate, the second surface being opposite to the first surface. A second substrate is provided, the first surface of the second substrate having an active structure. For the first substrate and the second substrate of the group, the active structure of the second substrate is opposite to the cover layer of the first substrate, and a display medium layer is formed between the first substrate and the second substrate. Remove the virtual substrate.

根據本發明之第二方面，提出一種電子裝置之製造方法，該電子裝置係具有一觸控顯示面板，其製造方法中係包括如前述觸控顯示面板之製造方法。According to a second aspect of the present invention, a method of manufacturing an electronic device is provided. The electronic device has a touch display panel, and the manufacturing method thereof includes a method of manufacturing the touch display panel.

為讓本發明之上述內容能更明顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下：In order to make the above-mentioned contents of the present invention more comprehensible, the preferred embodiments are described below, and the detailed description is as follows:

依照本發明較佳實施例之觸控顯示面板之製造方法中，係利用虛擬基板覆蓋於觸控結構上之方式，係可保護觸控結構在製程中不會受到損傷，提升製程良率。此外，更可在製程中進行第一基板及/或第二基板的薄化動作，降低觸控顯示面板的厚度。以下係提出依照本發明較佳之實施例進行詳細說明，實施例僅用以作為範例說明，並不會限縮本發明欲保護之範圍。此外，實施例之圖式中係省略不必要之元件，以清楚顯示本發明之技術特點。In the method for manufacturing the touch display panel according to the preferred embodiment of the present invention, the method of covering the touch structure with the dummy substrate protects the touch structure from damage during the process and improves the process yield. In addition, the thinning operation of the first substrate and/or the second substrate can be performed in the process to reduce the thickness of the touch display panel. The following is a detailed description of the preferred embodiments of the present invention. The embodiments are intended to be illustrative only and not to limit the scope of the invention. In addition, unnecessary elements are omitted in the drawings to clearly show the technical features of the present invention.

請參照第1圖，其繪示依照本發明較佳實施例之觸控顯示面板之製造方法的流程圖。本實施例之觸控顯示面板之製造方法包括以下步驟：首先，提供一第一基板110，如步驟S1以及第2A圖所示，其中第2A圖係繪示第一基板110之示意圖。第一基板110之一第一表面110a上具有一觸控結構111。本實施例中觸控結構111例如是一電容式觸控結構為範例，請同時參照第2B及2C圖，第2B圖繪示第2A圖中觸控結構之俯視圖；第2C圖繪示第2B圖中沿A－A’線之剖面圖。該電容式觸控結構，例如包括一導電層111a、一第一絕緣層111b、一電極層111c及一第二絕緣層111d。導電層111a係設置於第一基板110之第一表面110a上，其可為單層結 構或多層結構，且導電層111a之材質包含：透明導電材料(例如銦錫氧化物(ITO)、銦鋅氧化物(IZO)、鎘錫氧化物(CTO)、鎘鋅氧化物(CZO)、鋁鋅氧化物(AZO)、鋁錫氧化物(ATO)、氧化鉿(HfO)、銦錫鋅氧化物(ITZO)、鋅化物、其他合適材料、或上述的組合)、不透明導電材料(例如金、銀、鐵、錫、鉛、鎘、鉬、鋁、鈦、鉭、鉿、其他合適材料、上述的氧化物、上述的氮化物、上述的氧氮化物、上述的合金、或上述的組合)、或上述透明與不透明導電材料的組合。第一絕緣層111b覆蓋於導電層111a，用以電性隔離導電層111a及電極層111c。其中，該第一絕緣層111b，可為單層結構或多層結構，且其材質例如是無機材質、有機材質或上述之組合。無機材質例如是氧化矽、氮化矽、氮氧化矽、其他適合的材質或上述之組合，有機材質例如是光阻、聚丙醯醚(polyarylene ether；PAE)、聚醯類、聚酯類、聚醇類、聚烯類、苯並環丁烯(benzocyclclobutene；BCB)、HSQ(hydrogen silsesquioxane)、MSQ(methyl silesquioxane)、矽氧碳氫化物(SiOC－H)、聚醚類、聚酮類、聚醛類、聚酚類、聚環烷類、聚環氧烷類、聚炔類、聚酚醛類、其它適合的材質或上述之組合。於本發明之實施例以有機材料為例，但不限於此。電極層111c，可為單層結構或多層結構，且其材料例如為透明導電材料(例如銦錫氧化物(ITO)、銦鋅氧化物(IZO)、鎘錫氧化物(CTO)、鎘鋅氧化物(CZO)、鋁鋅氧化物(AZO)、鋁錫氧化物(ATO)、氧化鉿(HfO)、銦錫鋅氧化物(ITZO)、鋅化物、其他合適材料、或 上述的組合)，其係覆蓋於第一絕緣層111b上。第二絕緣層111d覆蓋於電極層111c上，用以保護電極層111c。其中，該第二絕緣層111d，可為單層結構或多層結構，且其材質例如是無機材質、有機材質或上述之組合。無機材質例如是氧化矽、氮化矽、氮氧化矽、其他適合的材質或上述之組合，有機材質例如是光阻、聚丙醯醚(polyarylene ether；PAE)、聚醯類、聚酯類、聚醇類、聚烯類、苯並環丁烯(benzocyclclobutene；BCB)、HSQ(hydrogen silsesquioxane)、MSQ(methyl silesquioxane)、矽氧碳氫化物(SiOC－H)、聚醚類、聚酮類、聚醛類、聚酚類、聚環烷類、聚環氧烷類、聚炔類、聚酚醛類、其它適合的材質或上述之組合。於本發明之實施例以有機材料為例，但不限於此。本實施例中係以第2B及第2C圖所繪示之電容式觸控結構111為例進行說明。然而，觸控結構111係不限制於此，其他設置於第一基板110上，用以與顯示面板整合之觸控結構111，例如：電阻式、壓電式、壓容式、光感應式、按壓式、或其它合適的觸控結構、或上述至少二者模式之組合均可應用於此。此外，導電層111a與電極層111c各別具有二個圖案部(未標示)與一連接該些圖案部的連接部(未標示)，其中導電層111a之連接部與電極層111c之連接部相交錯為範例。於其它實施例中，導電層111a之圖案部與電極層111c之圖案部各別可為二個以上、導電層111a之連接部與電極層111c之連接部各可為一個以上、或是導電層111a之圖案部與電極層111c之圖案部之俯視圖形狀 可為矩形、梯形、三角形、長方形、菱形、六邊形、五邊形、楕圓形或其它合適的形狀。Please refer to FIG. 1 , which is a flow chart of a method for manufacturing a touch display panel according to a preferred embodiment of the present invention. The method for manufacturing the touch display panel of the present embodiment includes the following steps: First, a first substrate 110 is provided, as shown in steps S1 and 2A, wherein FIG. 2A is a schematic view of the first substrate 110. The first surface 110a of the first substrate 110 has a touch structure 111 thereon. In the embodiment, the touch structure 111 is an example of a capacitive touch structure. Please refer to FIGS. 2B and 2C simultaneously. FIG. 2B is a top view of the touch structure in FIG. 2A. FIG. 2C is a second view. A cross-sectional view along the line A-A' in the figure. The capacitive touch structure includes, for example, a conductive layer 111a, a first insulating layer 111b, an electrode layer 111c, and a second insulating layer 111d. The conductive layer 111a is disposed on the first surface 110a of the first substrate 110, which may be a single layer junction a structure or a multilayer structure, and the material of the conductive layer 111a comprises: a transparent conductive material (for example, indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), cadmium zinc oxide (CZO), Aluminum zinc oxide (AZO), aluminum tin oxide (ATO), hafnium oxide (HfO), indium tin zinc oxide (ITZO), zinc compound, other suitable materials, or combinations thereof, opaque conductive materials (such as gold) , silver, iron, tin, lead, cadmium, molybdenum, aluminum, titanium, niobium, tantalum, other suitable materials, the above oxides, the above nitrides, the above oxynitrides, the above alloys, or a combination thereof Or a combination of the above transparent and opaque conductive materials. The first insulating layer 111b covers the conductive layer 111a for electrically isolating the conductive layer 111a and the electrode layer 111c. The first insulating layer 111b may be a single layer structure or a multilayer structure, and the material thereof is, for example, an inorganic material, an organic material, or a combination thereof. The inorganic material is, for example, cerium oxide, cerium nitride, cerium oxynitride, other suitable materials or a combination thereof, and the organic material is, for example, photoresist, polyarylene ether (PAE), polyfluorene, polyester, poly Alcohols, polyolefins, benzocyclclobutene (BCB), HSQ (hydrogen silsesquioxane), MSQ (methyl silesquioxane), oxime oxycarbide (SiOC-H), polyethers, polyketones, poly Aldehydes, polyphenols, polycycloalkanes, polyalkylene oxides, polyacetylenes, polyphenols, other suitable materials or combinations thereof. The organic material is exemplified in the embodiment of the present invention, but is not limited thereto. The electrode layer 111c may be a single layer structure or a multilayer structure, and the material thereof is, for example, a transparent conductive material (for example, indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), cadmium zinc oxide. (CZO), aluminum zinc oxide (AZO), aluminum tin oxide (ATO), hafnium oxide (HfO), indium tin zinc oxide (ITZO), zinc compounds, other suitable materials, or The above combination) covers the first insulating layer 111b. The second insulating layer 111d covers the electrode layer 111c to protect the electrode layer 111c. The second insulating layer 111d may have a single layer structure or a multi-layer structure, and the material thereof is, for example, an inorganic material, an organic material, or a combination thereof. The inorganic material is, for example, cerium oxide, cerium nitride, cerium oxynitride, other suitable materials or a combination thereof, and the organic material is, for example, photoresist, polyarylene ether (PAE), polyfluorene, polyester, poly Alcohols, polyolefins, benzocyclclobutene (BCB), HSQ (hydrogen silsesquioxane), MSQ (methyl silesquioxane), oxime oxycarbide (SiOC-H), polyethers, polyketones, poly Aldehydes, polyphenols, polycycloalkanes, polyalkylene oxides, polyacetylenes, polyphenols, other suitable materials or combinations thereof. The organic material is exemplified in the embodiment of the present invention, but is not limited thereto. In this embodiment, the capacitive touch structure 111 illustrated in FIGS. 2B and 2C is taken as an example for description. However, the touch structure 111 is not limited thereto, and the touch structure 111 is integrated on the first substrate 110 for integration with the display panel, for example, resistive, piezoelectric, pressure-capacitive, and light-sensitive. A push-type, or other suitable touch structure, or a combination of at least two of the above may be applied thereto. In addition, the conductive layer 111a and the electrode layer 111c each have two pattern portions (not shown) and a connection portion (not labeled) connecting the pattern portions, wherein the connection portion of the conductive layer 111a and the connection portion of the electrode layer 111c are Interlaced as an example. In other embodiments, the pattern portion of the conductive layer 111a and the pattern portion of the electrode layer 111c may each be two or more, and the connection portion between the conductive portion 111a and the electrode layer 111c may be one or more, or a conductive layer. Top view shape of pattern portion of 111a and pattern portion of electrode layer 111c It may be rectangular, trapezoidal, triangular, rectangular, rhombic, hexagonal, pentagonal, oblong, or other suitable shape.

請參照第3A圖，其繪示虛擬基板130設置於第一基板110上之示意圖。本實施例之製造方法接著執行步驟S2，設置一虛擬基板(dummy substrate)130於第一基板110之第一表面110a上，並且覆蓋於觸控結構111之上。也就是說，虛擬基板(dummy substrate)130之內表面對應於觸控結構111之上表面與第一基板110之內表面(即一表面110a)。於一實施例中，虛擬基板130係可例如經由一框膠層150設置於第一基板110上為範例或者是框膠層150設置於虛擬基板130上，使得虛擬基板130設置於第一基板110之第一表面110a上。請參照第3B圖，其繪示框膠層150及第一基板110之俯視圖。框膠層150係圍繞觸控結構111，並且具有多個開口150a。如第3B圖所繪示，框膠層150包括至少四個開口150a，此些開口150a，較佳地，分別與觸控結構111的四個角落相對應為例，但不限於此，亦可設置於其它位置。此外，框膠層150係與觸控結構111可選擇性地具有一間隙d，本實施例以具有間隙d為例，但不限於此，亦可不具有此間隙，而是二者邊緣切齊，但不互相覆蓋。另外，本實施例之製造方法虛擬基板130與觸控結構111可選擇性地具有一間隙g，以使虛擬基板130在接下來的製程步驟中起緩衝的作用，但不限於此，虛擬基板130與觸控結構111經由框膠層150貼合時，亦可不具有此間隙g。再者，本實施例以虛擬基 板130與觸控結構111具有一間隙g為例，但為了更維持此間隙g之穩定度，則更可選擇地例如包括灑佈間隙子於第一基板110上之步驟，以使虛擬基板130與觸控結構111具有一間隔g，以使虛擬基板130在接下來的製程步驟中起緩衝的作用，避免其接觸到觸控結構111，以保護觸控結構111不會受到損傷。此外，於其它實施例中，虛擬基板130除了以框膠層150粘著外，尚可經由靜電方式吸著於第一基板上，且覆蓋於該觸控元件111上，則因虛擬基板130與觸控元件111就無間隔g存在或是其它合適的組合方式。Please refer to FIG. 3A , which illustrates a schematic diagram of the dummy substrate 130 disposed on the first substrate 110 . The manufacturing method of the embodiment is followed by the step S2 of disposing a dummy substrate 130 on the first surface 110a of the first substrate 110 and overlying the touch structure 111. That is, the inner surface of the dummy substrate 130 corresponds to the upper surface of the touch structure 111 and the inner surface of the first substrate 110 (ie, a surface 110a). In one embodiment, the dummy substrate 130 can be disposed on the first substrate 110 via a masking layer 150 or the masking layer 150 is disposed on the dummy substrate 130 such that the dummy substrate 130 is disposed on the first substrate 110. On the first surface 110a. Please refer to FIG. 3B , which illustrates a top view of the sealant layer 150 and the first substrate 110 . The sealant layer 150 surrounds the touch structure 111 and has a plurality of openings 150a. As shown in FIG. 3B, the sealant layer 150 includes at least four openings 150a. The openings 150a are preferably respectively corresponding to the four corners of the touch structure 111, but are not limited thereto. Set to other locations. In addition, the sealant layer 150 and the touch structure 111 can selectively have a gap d. In this embodiment, the gap d is taken as an example, but is not limited thereto, and the gap is not included, but the edges are aligned. But not covering each other. In addition, the manufacturing method of the present embodiment, the dummy substrate 130 and the touch structure 111 may selectively have a gap g, so that the dummy substrate 130 functions as a buffer in the subsequent process steps, but is not limited thereto, and the dummy substrate 130 When the touch structure 111 is bonded via the sealant layer 150, the gap g may not be provided. Furthermore, this embodiment uses a virtual basis The board 130 and the touch structure 111 have a gap g as an example. However, in order to maintain the stability of the gap g, the step of sprinkling the gap on the first substrate 110 is further selected, for example, to make the dummy substrate 130. The touch structure 111 has a gap g to prevent the dummy substrate 130 from being buffered in the subsequent process step to prevent the touch structure 111 from being damaged. In addition, in other embodiments, the dummy substrate 130 can be electrostatically occluded on the first substrate and over the touch element 111, except for being adhered to the sealant layer 150. The touch element 111 is present without a gap g or other suitable combination.

接下來，本實施例之製造方法執行步驟S3，形成一覆蓋層。請參照第4圖，其繪示覆蓋層112形成於第一基板110上之示意圖。覆蓋層112係形成於第一基板110之一第二表面110b上，此第二表面110b係相對於第一表面110a，亦即第一基板110之外表面。實際應用上，覆蓋層112例如是包括一配向層、一透明電極及一彩色濾光片其中之至少一者。在進行步驟S3之前，較佳地係將設置有虛擬基板130之第一基板110進行翻轉，使得第一基板110經由虛擬基板130設置在製程之傳送帶或平台上，避免觸控結構111受到摩擦發生刮傷的現象，但不限於此，可依形成覆蓋層之機台設計，而不需先將設置有虛擬基板130之第一基板110進行翻轉。Next, the manufacturing method of this embodiment performs step S3 to form a cover layer. Please refer to FIG. 4 , which illustrates a schematic view of the cap layer 112 formed on the first substrate 110 . The cover layer 112 is formed on one of the second surfaces 110b of the first substrate 110, and the second surface 110b is opposite to the first surface 110a, that is, the outer surface of the first substrate 110. In practical applications, the cover layer 112 includes, for example, at least one of an alignment layer, a transparent electrode, and a color filter. Before the step S3 is performed, the first substrate 110 provided with the dummy substrate 130 is preferably flipped, so that the first substrate 110 is disposed on the conveyor belt or the platform via the dummy substrate 130, so as to prevent the touch structure 111 from being subjected to friction. The phenomenon of scratching, but not limited thereto, can be designed according to the machine platform forming the cover layer without first turning over the first substrate 110 provided with the dummy substrate 130.

再來，進行步驟S4，提供一第二基板。請參照第5圖，其繪示第二基板120及第一基板110之示意圖。第二 基板120之一第一表面120a上具有一主動結構121，亦即第二基板120之內表面。實際應用上，主動結構121例如是包括多個薄膜電晶體。Then, in step S4, a second substrate is provided. Referring to FIG. 5 , a schematic diagram of the second substrate 120 and the first substrate 110 is illustrated. second One of the first surfaces 120a of the substrate 120 has an active structure 121, that is, an inner surface of the second substrate 120. In practical applications, the active structure 121 includes, for example, a plurality of thin film transistors.

接著，進行對組兩基板110、120之步驟。請參照第6圖，其繪示第一基板110及第二基板120對組後之示意圖。如步驟S5所示，對組第一基板110及第二基板120，使第二基板120之主動結構121相對於第一基板110之覆蓋層112，且於第一基板110及第二基板120之間形成一顯示介質層(display medium layer)140。也就是說，第二基板120之主動結構121之上表面對應於第一基板110之覆蓋層112之上表面。實際應用上，顯示介質層140例如是於對組兩基板110、120之前，利用滴注法(One Drop Filling；ODF)形成於第一基板110或第二基板120上。又，顯示介質層140亦可於對組兩基板110、120之後，利用注入法(injecting)形成於第一基板110及第二基板120之間。前述應用滴注法或注入法形成之顯示介質層140係為非自發光材料，例如：液晶(Liquid Crystal；LC)材料、電泳材料；然本發明之技術係不限制於此，顯示介質層140亦可例如是電激發光材料，並且於對組兩基板110、120之前形成於第二基板120上，且其可位於主動結構121之上或之下。顯示介質層亦可例如是非自發光材料與電激發光材質之單層結構或多層結構。Next, the steps of pairing the two substrates 110, 120 are performed. Please refer to FIG. 6 , which is a schematic diagram of the first substrate 110 and the second substrate 120 after the pair. As shown in step S5, the active substrate 121 of the second substrate 120 is opposed to the cover layer 112 of the first substrate 110, and the first substrate 110 and the second substrate 120 are disposed on the first substrate 110 and the second substrate 120. A display medium layer 140 is formed therebetween. That is, the upper surface of the active structure 121 of the second substrate 120 corresponds to the upper surface of the cover layer 112 of the first substrate 110. In practical applications, the display medium layer 140 is formed on the first substrate 110 or the second substrate 120 by one drop filling (ODF), for example, before the two substrates 110 and 120 are paired. Moreover, the display dielectric layer 140 may be formed between the first substrate 110 and the second substrate 120 by implantation after the pair of substrates 110 and 120. The display medium layer 140 formed by the dropping method or the injection method is a non-self-luminous material, for example, a liquid crystal (LC) material or an electrophoretic material; however, the technology of the present invention is not limited thereto, and the display medium layer 140 is not limited thereto. It may also be, for example, an electroluminescent material, and formed on the second substrate 120 prior to the pair of substrates 110, 120, and it may be located above or below the active structure 121. The display medium layer can also be, for example, a single layer structure or a multilayer structure of a non-self-luminous material and an electroluminescent material.

然後，本實施例之製造方法進行步驟S6，移去虛擬基板130。請參照第7圖，其繪示自第一基板110上移去 虛擬基板130後之示意圖。以第3B圖為例，但不限於此。由於框膠層150係與觸控結構111具有間隙d，因此係可利用自間隙d中切裂虛擬基板130及對組後之第一基板110及第二基板120之方式，來移除圍繞觸控結構111之框膠層150。其中，切裂方式，可使用雷射方式、刀輪、鑽石刀其中至少一者來運用於此。然而，移去虛擬基板130之方式係不限於於此，其他用以分離第一基板110及虛擬基板130，或者直接研磨或蝕刻虛擬基板130；或是去除二基板間之靜電；或是直接去除框膠層150，均可應用於此。移去虛擬基板130之後係完成觸控式顯示面板100。Then, the manufacturing method of this embodiment proceeds to step S6, and the dummy substrate 130 is removed. Please refer to FIG. 7 , which is removed from the first substrate 110 . Schematic diagram of the virtual substrate 130. Take the 3B figure as an example, but it is not limited to this. Since the sealant layer 150 has a gap d with the touch structure 111, the method of removing the dummy substrate d from the gap d and the first substrate 110 and the second substrate 120 after the group can be used to remove the surrounding touch. The sealant layer 150 of the structure 111 is controlled. Among them, the cutting method can be applied to at least one of a laser method, a cutter wheel and a diamond knife. However, the manner of removing the dummy substrate 130 is not limited thereto, and the other is to separate the first substrate 110 and the dummy substrate 130, or directly polish or etch the dummy substrate 130; or remove static electricity between the two substrates; or directly remove The sealant layer 150 can be applied to this. After the dummy substrate 130 is removed, the touch display panel 100 is completed.

更進一步來說，本實施例之製造方法係可選擇性地進行第一基板110及/或第二基板120之薄化步驟。請參照第8圖，其繪示第一基板110進行薄化步驟之示意圖。本實施例之製造方法中，第一基板110以無機透明基板(例如是玻璃、石英或其它適合的材質)為例時，較佳地，可於設置虛擬基板130之步驟S2後進行薄化。當然，依設計的需求亦可不薄化第一基板110。若，第一基板110以有機透明材質(例如是聚烯類、聚酼類、聚醇類、聚酯類、橡膠、熱塑性聚合物、熱固性聚合物、聚芳香烴類、聚甲基丙醯酸甲酯類、聚碳酸酯類、其它適合的材質、上述之衍生物或上述之組合)時，並依第一基板110之厚度可適當的選擇進行薄化與否，較佳地，大部份的有機透明基板可呈現相當薄之厚度，因而，不需要薄化。另外，於其它實施例中，第二基板120以無機透明基板(例如是玻璃、石英或其它適合的材質)或無機不透明 材質(例如是矽片、陶瓷、其它適合的材質或上述之組合)亦可不用再薄化。詳細而言，第一基板110以無機透明基板(例如是玻璃、石英或其它適合的材質)或無機不透明材質(例如是矽片、陶瓷、其它適合的材質或上述之組合)已經先被薄化至適當的厚度並放置於額外的支撐膜(未繪示)上，等觸控顯示面板完成後，依需要再移除額外的支撐膜。薄化第一基板110之方式，係對第一基板110之第二表面110b進行薄化步驟，以將第一基板110薄化至第一基板110’，其中，薄化步驟可使用研磨及/或蝕刻方式。如第8圖所示，當進行第一基板110之薄化步驟時，虛擬基板130係保護觸控結構111，避免觸控結構111受到損傷。此外，虛擬基板130亦可提供第一基板110強度支撐之功能，使得第一基板110可順利進行薄化步驟。請參照第9圖，其繪示第二基板120進行薄化步驟之示意圖。第二基板120以無機透明基板(例如是玻璃、石英或其它適合的材質)或無機不透明材質(例如是矽片、陶瓷、其它適合的材質或上述之組合)為例時，較佳地，可於對組第一基板110及第二基板120之步驟S5後進行第二基板120之薄化步驟。當然，依設計的需求亦可於步驟S6後進行第二基板120之薄化或直接不薄化第二基板120。若，第二基板120以有機透明材質(例如是聚烯類、聚酼類、聚醇類、聚酯類、橡膠、熱塑性聚合物、熱固性聚合物、聚芳香烴類、聚甲基丙醯酸甲酯類、聚碳酸酯類、其它適合的材質、上述之衍生物或上述之組合)時，並依第二基板120之厚度可適當的選擇進行薄化與否，較佳地，大部份的有機透明 基板可呈現相當薄之厚度，因而，不需要薄化。另外，於其它實施例中，第二基板120以無機透明基板(例如是玻璃、石英或其它適合的材質)或無機不透明材質(例如是矽片、陶瓷、其它適合的材質或上述之組合)亦可不用薄化。詳細而言，第二基板120以無機透明基板(例如是玻璃、石英或其它適合的材質)或無機不透明材質(例如是矽片、陶瓷、其它適合的材質或上述之組合)已經先被薄化至適當的厚度並放置於額外的支撐膜(未繪示)上，等觸控顯示面板完成後，依需要再移除額外的支撐膜。薄化第二基板120之方式，係對第二基板120之相對於第一表面120a的一第二表面120b進行薄化步驟，以將第二基板120薄化至第二基板120’，其中，薄化步驟可使用研磨及/或蝕刻方式。如第9圖所示，當進行第二基板120之薄化步驟時，虛擬基板130係保護觸控結構111，避免觸控結構111受到損傷。藉由前述選擇性地進行第一基板110及/或第二基板120之薄化步驟，係可進一步降低觸控顯示面板100之厚度。此外，由於進行薄化步驟時虛擬基板130係覆蓋於觸控結構111之上，係可避免觸控結構111發生刮傷、受力損壞、受化學溶劑腐蝕的問題。Furthermore, the manufacturing method of the present embodiment selectively performs the thinning step of the first substrate 110 and/or the second substrate 120. Please refer to FIG. 8 , which illustrates a schematic diagram of the thinning step of the first substrate 110 . In the manufacturing method of the present embodiment, when the first substrate 110 is exemplified by an inorganic transparent substrate (for example, glass, quartz, or other suitable material), it is preferable to thin the step S2 after the dummy substrate 130 is provided. Of course, the first substrate 110 may not be thinned according to the design requirements. The first substrate 110 is made of an organic transparent material (for example, a polyolefin, a polyfluorene, a polyester, a polyester, a rubber, a thermoplastic polymer, a thermosetting polymer, a polyaromatic hydrocarbon, or a polymethylpropionic acid). When a methyl ester, a polycarbonate, another suitable material, the above derivative or a combination thereof is used, the thickness of the first substrate 110 can be appropriately selected to be thinned or not, preferably, most The organic transparent substrate can exhibit a relatively thin thickness and, therefore, does not require thinning. In addition, in other embodiments, the second substrate 120 is an inorganic transparent substrate (for example, glass, quartz, or other suitable material) or inorganic opaque. The material (for example, enamel, ceramic, other suitable materials or a combination of the above) may not be thinned. In detail, the first substrate 110 has been thinned first with an inorganic transparent substrate (for example, glass, quartz or other suitable materials) or an inorganic opaque material (for example, a ruthenium, a ceramic, other suitable materials, or a combination thereof). To the appropriate thickness and placed on an additional support film (not shown), after the touch display panel is completed, additional support film is removed as needed. The thinning of the first substrate 110 is performed by thinning the second surface 110b of the first substrate 110 to thin the first substrate 110 to the first substrate 110', wherein the thinning step can use grinding and/or Or etching method. As shown in FIG. 8 , when the thinning step of the first substrate 110 is performed, the dummy substrate 130 protects the touch structure 111 to prevent the touch structure 111 from being damaged. In addition, the dummy substrate 130 can also provide the function of the strength support of the first substrate 110, so that the first substrate 110 can smoothly perform the thinning step. Please refer to FIG. 9 , which illustrates a schematic diagram of the thinning step of the second substrate 120 . Preferably, the second substrate 120 is exemplified by an inorganic transparent substrate (for example, glass, quartz or other suitable material) or an inorganic opaque material (for example, a ruthenium, a ceramic, another suitable material, or a combination thereof). The thinning step of the second substrate 120 is performed after the step S5 of the first substrate 110 and the second substrate 120. Of course, according to the design requirements, the second substrate 120 may be thinned or the second substrate 120 may not be thinned directly after the step S6. The second substrate 120 is made of an organic transparent material (for example, polyenes, polybenzazoles, polyalcohols, polyesters, rubbers, thermoplastic polymers, thermosetting polymers, polyaromatic hydrocarbons, polymethylpropionic acid). When a methyl ester, a polycarbonate, another suitable material, the above derivative or a combination thereof is used, the thickness of the second substrate 120 can be appropriately selected to be thinned or not, preferably, most Organic transparency The substrate can exhibit a relatively thin thickness and, therefore, does not require thinning. In addition, in other embodiments, the second substrate 120 is made of an inorganic transparent substrate (for example, glass, quartz, or other suitable materials) or an inorganic opaque material (for example, a ruthenium, ceramic, other suitable materials, or a combination thereof). Can not be thinned. In detail, the second substrate 120 has been thinned first with an inorganic transparent substrate (for example, glass, quartz or other suitable materials) or an inorganic opaque material (for example, a ruthenium, a ceramic, other suitable materials, or a combination thereof). To the appropriate thickness and placed on an additional support film (not shown), after the touch display panel is completed, additional support film is removed as needed. The method of thinning the second substrate 120 is performed by thinning a second surface 120b of the second substrate 120 relative to the first surface 120a to thin the second substrate 120 to the second substrate 120'. The thinning step can use grinding and/or etching. As shown in FIG. 9 , when the thinning step of the second substrate 120 is performed, the dummy substrate 130 protects the touch structure 111 to prevent the touch structure 111 from being damaged. The thickness of the touch display panel 100 can be further reduced by selectively performing the thinning step of the first substrate 110 and/or the second substrate 120. In addition, since the dummy substrate 130 is overlaid on the touch structure 111 during the thinning step, the touch structure 111 can be prevented from being scratched, damaged by force, and corroded by chemical solvents.

另外一方面，本發明上述實施例之觸控顯示面板100係可運用於一電子裝置中，且電子裝置之製造方法亦包含上述實施例之觸控顯示面板100之製造方法。請參照第10圖，其繪示包含觸控顯示面板100之電子裝置300的功能方塊圖。觸控顯示面板100可以跟電子元件200電性連接而組成電子裝置300。這裡要說明的是，電子元件200包 括例如：控制元件、操作元件、處理元件、輸入元件、記憶元件、驅動元件、發光元件、保護元件、感測元件、偵測元件、其他功能元件或前述元件之組合。再者，電子裝置300之類型包括：可攜式產品(如手機、攝影機、照相機、筆記型電腦、遊戲機、音樂播放器、電子信件收發器、地圖導航器、數位相框或類似之產品)、影音產品(如影音放映器或類似之產品)、螢幕、電視、戶外/戶內看板或投影機之面板等。On the other hand, the touch display panel 100 of the above embodiment of the present invention can be used in an electronic device, and the manufacturing method of the electronic device also includes the manufacturing method of the touch display panel 100 of the above embodiment. Please refer to FIG. 10 , which is a functional block diagram of an electronic device 300 including the touch display panel 100 . The touch display panel 100 can be electrically connected to the electronic component 200 to form the electronic device 300. What is to be explained here is that the electronic component 200 package For example, a control element, an operation element, a processing element, an input element, a memory element, a driving element, a light-emitting element, a protection element, a sensing element, a detecting element, other functional elements, or a combination of the foregoing. Moreover, the types of the electronic device 300 include: a portable product (such as a mobile phone, a camera, a camera, a notebook computer, a game machine, a music player, an electronic mail transceiver, a map navigator, a digital photo frame, or the like), Audio and video products (such as audio and video projectors or similar products), screens, televisions, outdoor / indoor billboards or projector panels.

本發明上述實施例所揭露之觸控顯示面板及電子裝置之製造方法，係利用虛擬基板覆蓋於觸控結構上方的方式，使得在各樣製程步驟中(例如黃光製程、蝕刻、濺鍍及基板薄化之步驟)，避免第一基板及觸控結構受到刮傷的現象。如此係可於觸控顯示面板之製程中進行第一基板及/或第二基板之薄化步驟，而不會使觸控結構受到損傷，進一步提升產品的良率。另外，上述之製造方法係不限制觸控顯示面板之類型，包括電容式、電阻式、自發光顯示、非自發光顯示之觸控顯示面板，均可應用本發明上述實施例之製造方法，係可相容於習知之觸控顯示面板製程中。The touch display panel and the electronic device manufacturing method disclosed in the above embodiments of the present invention use a virtual substrate to cover the touch structure so as to be in various process steps (for example, yellow light processing, etching, sputtering, and the like). The step of thinning the substrate) avoids the phenomenon that the first substrate and the touch structure are scratched. In this way, the thinning step of the first substrate and/or the second substrate can be performed in the process of the touch display panel without damage to the touch structure, thereby further improving the yield of the product. In addition, the manufacturing method described above does not limit the type of the touch display panel, and the touch display panel including the capacitive type, the resistive type, the self-luminous display, and the non-self-luminous display can be applied to the manufacturing method of the above embodiment of the present invention. It is compatible with the conventional touch display panel process.

綜上所述，雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧觸控顯示面板100‧‧‧Touch display panel

110、110’‧‧‧第一基板110, 110'‧‧‧ first substrate

110a‧‧‧第一基板之第一表面110a‧‧‧ First surface of the first substrate

110b‧‧‧第一基板之第二表面110b‧‧‧Second surface of the first substrate

111‧‧‧觸控結構111‧‧‧ touch structure

111a‧‧‧導電層111a‧‧‧ Conductive layer

111b‧‧‧第一絕緣層111b‧‧‧First insulation

111c‧‧‧電極層111c‧‧‧electrode layer

111d‧‧‧第二絕緣層111d‧‧‧Second insulation

112‧‧‧覆蓋層112‧‧‧ Coverage

120、120’‧‧‧第二基板120, 120'‧‧‧ second substrate

120a‧‧‧第二基板之第一表面120a‧‧‧ First surface of the second substrate

120b‧‧‧第二基板之第二表面120b‧‧‧ second surface of the second substrate

121‧‧‧主動結構121‧‧‧Active structure

130‧‧‧虛擬基板130‧‧‧Virtual substrate

140‧‧‧顯示介質層140‧‧‧Display media layer

150‧‧‧框膠層150‧‧‧Block layer

150a‧‧‧開口150a‧‧‧ openings

200‧‧‧電子元件200‧‧‧Electronic components

300‧‧‧電子裝置300‧‧‧Electronic devices

d‧‧‧間隙D‧‧‧ gap

g‧‧‧間隔G‧‧‧ interval

第1圖繪示依照本發明較佳實施例之觸控顯示面板之製造方法的流程圖；第2A圖繪示第一基板之示意圖；第2B圖繪示第2A圖中觸控結構之俯視圖；第2C圖繪示第2B圖中沿A－A’線之剖面圖；第3A圖繪示虛擬基板設置於第一基板上之示意圖；第3B圖繪示框膠層及第一基板之俯視圖；第4圖繪示覆蓋層形成於第一基板上之示意圖；第5圖繪示第二基板及第一基板之示意圖；第6圖繪示第一基板及第二基板對組後之示意圖；第7圖繪示自第一基板上移去虛擬基板後之示意圖；第8圖繪示第一基板進行薄化步驟之示意圖；第9圖繪示第二基板進行薄化步驟之示意圖；以及第10圖繪示包含觸控顯示面板之電子裝置的功能方塊圖。1 is a flow chart of a method for manufacturing a touch display panel according to a preferred embodiment of the present invention; FIG. 2A is a schematic view showing a first substrate; FIG. 2B is a plan view showing a touch structure of FIG. 2A; 2C is a cross-sectional view taken along line A-A' of FIG. 2B; FIG. 3A is a schematic view showing a dummy substrate disposed on the first substrate; FIG. 3B is a plan view showing the sealant layer and the first substrate; 4 is a schematic view showing a cover layer formed on a first substrate; FIG. 5 is a schematic view showing a second substrate and a first substrate; FIG. 6 is a schematic view showing a first substrate and a second substrate pair; 7 is a schematic view showing the removal of the dummy substrate from the first substrate; FIG. 8 is a schematic view showing the thinning step of the first substrate; FIG. 9 is a schematic view showing the thinning step of the second substrate; The figure shows a functional block diagram of an electronic device including a touch display panel.

Claims (11)

一種觸控顯示面板之製造方法，包括：提供一第一基板，該第一基板之一第一表面上具有一觸控結構；設置一虛擬基板(dummy substrate)於該第一基板之該第一表面上，且覆蓋於該觸控結構之上；形成一覆蓋層於該第一基板之一第二表面上，該第二表面係相對於該第一表面；提供一第二基板，該第二基板之一第一表面上具有一主動結構；對組該第一基板及該第二基板，使該第二基板之該主動結構相對於該第一基板之該覆蓋層，且於該第一基板及該第二基板之間形成一顯示介質層；以及移去該虛擬基板。A method for manufacturing a touch display panel includes: providing a first substrate, wherein a first surface of the first substrate has a touch structure; and a first dummy substrate is disposed on the first substrate Surfacely covering the touch structure; forming a cover layer on a second surface of the first substrate, the second surface is opposite to the first surface; providing a second substrate, the second One of the first surface of the substrate has an active structure; the first substrate and the second substrate are paired, the active structure of the second substrate is opposite to the cover layer of the first substrate, and the first substrate is And forming a display medium layer between the second substrate; and removing the dummy substrate. 如申請專利範圍第1項所述之製造方法，其中形成該顯示介質層的方法包含於對組該第一基板及該第二基板之前，利用滴注法(One Drop Filling；ODF)形成該顯示介質層於該第一基板或該第二基板上。The manufacturing method of claim 1, wherein the method of forming the display medium layer comprises forming the display by using a drop drop method (ODF) before the first substrate and the second substrate are assembled. The dielectric layer is on the first substrate or the second substrate. 如申請專利範圍第1項所述之製造方法，其中形成該顯示介質層的方法包含於對組該第一基板及該第二基板之後，利用注入法(injecting)形成該顯示介質層於該第一基板及該第二基板之間。The method of manufacturing the display medium layer according to the method of claim 1, wherein the method of forming the display medium layer comprises: forming the display medium layer by injecting after the first substrate and the second substrate are paired Between a substrate and the second substrate. 如申請專利範圍第1項所述之製造方法，於設置該虛擬基板之後，更包括： 對該第一基板之該第二表面進行一薄化步驟，來薄化該第一基板。The manufacturing method of claim 1, after the setting of the virtual substrate, further comprises: The second surface of the first substrate is subjected to a thinning step to thin the first substrate. 如申請專利範圍第1項所述之製造方法，於對組該第一基板及該第二基板之後，更包括：對該第二基板之一第二表面進行一薄化步驟，來薄化該第二基板。The manufacturing method of claim 1, further comprising: performing a thinning step on the second surface of one of the second substrates to thin the first substrate and the second substrate The second substrate. 如申請專利範圍第1項所述之製造方法，其中該虛擬基板係經由一框膠層設置於該第一基板上，該框膠層係圍繞該觸控結構且具有複數個開口。The manufacturing method of claim 1, wherein the virtual substrate is disposed on the first substrate via a sealant layer, the sealant layer surrounding the touch structure and having a plurality of openings. 如申請專利範圍第6項所述之製造方法，其中該框膠層係與該觸控結構具有一間隙，且至少包括四個開口分別與該觸控結構的四個角落相對應。The manufacturing method of claim 6, wherein the sealant layer has a gap with the touch structure, and at least four openings respectively correspond to the four corners of the touch structure. 如申請專利範圍第6項所述之製造方法，其中移去該虛擬基板之該步驟包括：切裂該虛擬基板及對組後之該第一基板及該第二基板，以移除圍繞該觸控結構之該框膠層。The manufacturing method of claim 6, wherein the step of removing the dummy substrate comprises: cutting the dummy substrate and the first substrate and the second substrate after the pair to remove the touch Control the structure of the sealant layer. 如申請專利範圍第1項所述之製造方法，其中設置該虛擬基板之該步驟包括：灑佈複數個間隙子於該第一基板上，以使該虛擬基板與該觸控結構具有一間隔。The manufacturing method of claim 1, wherein the step of disposing the dummy substrate comprises: spraying a plurality of spacers on the first substrate such that the dummy substrate has a space from the touch structure. 如申請專利範圍第1項所述之製造方法，其中該覆蓋層包括一配向層、一透明電極及一彩色濾光片其中至少一者。The manufacturing method of claim 1, wherein the covering layer comprises at least one of an alignment layer, a transparent electrode and a color filter. 一種電子裝置之製造方法，包括如申請專利範圍 第1項所述之觸控顯示面板之製造方法。A method of manufacturing an electronic device, including, for example, a patent application scope A method of manufacturing a touch display panel according to item 1.