CN101424992A - Method for manufacturing touch control display panel and electronic device - Google Patents
Method for manufacturing touch control display panel and electronic device Download PDFInfo
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- CN101424992A CN101424992A CNA2008101802216A CN200810180221A CN101424992A CN 101424992 A CN101424992 A CN 101424992A CN A2008101802216 A CNA2008101802216 A CN A2008101802216A CN 200810180221 A CN200810180221 A CN 200810180221A CN 101424992 A CN101424992 A CN 101424992A
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Abstract
The invention discloses a manufacturing method of a touch-sensitive display panel and an electronic device. The manufacturing method of the touch-sensitive display panel comprises the following steps: a first base plate is provided, a touch-sensitive structure is arranged on a first surface of the first base plate; a virtual base pate is arranged on the first surface, and is covered on the touch-sensitive structure; a covering layer is formed on a second surface of the first base plate, and the second surface is opposite to the first surface; a second base plate is provided, and an initiative structure is arranged on a first surface of the second base plate; the first base plate and the second base plate are pair-grouped so as to cause the initiative structure of the second base plate to be opposite to the covering layer of the first base plate, a display medium layer is formed between the first base plate and the second base plate, and the virtual base plate is removed. The manufacturing method of the electronic device comprises the manufacturing method of the touch-sensitive display panel. The invention can avoid the touch-sensitive structure being damaged, and improve the qualification ratio, can perform the step of thinning the base plates in the process, and lower the whole thickness of the touch-sensitive display panel.
Description
Technical field
The invention relates to the manufacture method of a kind of touch-control display panel and electronic installation, and particularly relevant for a kind of manufacture method that promotes the touch-control display panel and the electronic installation of qualification rate.
Background technology
Along with the development of flat-panel screens technology, the display effect of flat-panel screens has significant progress.Moreover because the progress of process technique, the cost that drives flat-panel screens descends, and makes flat-panel screens be subjected to liking of consumers in general on market.In order to promote the convenience in the use, industry more is integrated into flat-panel screens with contact panel in recent years, and is applied in the middle of the various kinds electronic installation.The user can carry out operations by directly click picture on panel, and the operator scheme of more convenient and hommization is provided by this.
General in the manufacture method of touch-control display panel, be formed at respectively for colorful filter structure on two surfaces of same glass substrate touch-control structure and display panel, must make touch-control structure be contacted with on the travelling belt or platform of process work bench with the glass substrate upset after forming touch-control structure.Thus, make touch-control structure and travelling belt or platform produce friction easily, and then the phenomenon of scratch takes place.So can reduce the qualification rate of processing procedure.In addition, because touch-control structure is formed on the surface of glass substrate, when carrying out the thinning of glass substrate, can damage touch-control structure, so can not under this fabrication steps, carry out.Moreover, because glass substrate must be kept certain structure intensity,, make glass substrate be difficult to carry out thinning with the phenomenon of guaranteeing that glass substrate can not break in ensuing fabrication steps.When particularly the surface of glass substrate has been formed with touch-control structure, further improved the difficulty of thinning glass substrate.The thickness of glass substrate can't further be reduced, further allow the thickness of touch-control display panel effectively reduce, be difficult to reach in the market demand for the product slimming.
Summary of the invention
The invention provides the manufacture method of a kind of touch-control display panel and electronic installation, it is covered in mode on the touch-control structure by virtual substrate, can avoid touch-control structure impaired problem in processing procedure, and then promotes the qualification rate of processing procedure.In addition, also can in processing procedure, carry out the step of substrate thinning smoothly, reduce the integral thickness of touch-control display panel.
According to a first aspect of the invention, propose a kind of manufacture method of touch-control display panel, may further comprise the steps.One first substrate is provided, has a touch-control structure on the first surface of this first substrate; One virtual substrate is set on this first surface of this first substrate, and is covered on this touch-control structure; Form an overlayer on a second surface of this first substrate, this second surface is with respect to this first surface; One second substrate is provided, has an initiating structure on the first surface of this second substrate; To organizing this first substrate and this second substrate, make this initiating structure of this second substrate this overlayer, and between this first substrate and this second substrate, form a display dielectric layer with respect to this first substrate; And remove this virtual substrate.
According to a second aspect of the invention, propose a kind of manufacture method of electronic installation, this electronic installation has a touch-control display panel, comprises the manufacture method of touch-control display panel as described above in its manufacture method.
The present invention is covered in mode on the touch-control structure by virtual substrate, can avoid touch-control structure impaired problem in processing procedure, and then promotes the qualification rate of processing procedure.In addition, also can in processing procedure, carry out the step of substrate thinning smoothly, reduce the integral thickness of touch-control display panel.
Description of drawings
Fig. 1 is the process flow diagram according to the manufacture method of the touch-control display panel of preferred embodiment of the present invention;
Fig. 2 A is the synoptic diagram of first substrate;
Fig. 2 B is the vertical view of touch-control structure among Fig. 2 A;
Fig. 2 C is along the sectional view of A-A ' line among Fig. 2 B;
Fig. 3 A is that virtual substrate is arranged at the synoptic diagram on first substrate;
Fig. 3 B is the vertical view of the frame glue-line and first substrate;
Fig. 4 is formed at synoptic diagram on first substrate for overlayer;
Fig. 5 is the synoptic diagram of second substrate and first substrate;
Fig. 6 is first substrate and second substrate synoptic diagram after to group;
Fig. 7 is the synoptic diagram after removing virtual substrate on first substrate;
Fig. 8 is the synoptic diagram that first substrate carries out the thinning step;
Fig. 9 is the synoptic diagram that second substrate carries out the thinning step; And
Figure 10 is the functional block diagram that comprises the electronic installation of touch-control display panel.
Wherein, Reference numeral:
100: touch-control display panel 110,110 ': first substrate
110a: the first surface 110b of first substrate: the second surface of first substrate
111: touch-control structure 111a: conductive layer
111b: the first insulation course 111c: electrode layer
111d: second insulation course 112: overlayer
120,120 ': the second substrate 120a: the first surface of second substrate
120b: the second surface 121 of second substrate: initiating structure
130: virtual substrate 140: display dielectric layer
150: frame glue-line 150a: opening
200: electronic package 300: electronic installation
D: gap g: at interval
Embodiment
In the manufacture method according to the touch-control display panel of preferred embodiment of the present invention, utilize virtual substrate to be covered in mode on the touch-control structure, can protect touch-control structure in processing procedure, can not sustain damage, promote the processing procedure qualification rate.In addition, more can in processing procedure, carry out the thinning action of first substrate and/or second substrate, reduce the thickness of touch-control display panel.Below propose to be elaborated according to preferred embodiment of the present invention, embodiment is only in order to as the example explanation, scope that can't limit desire protection of the present invention.In addition, omit unnecessary assembly in the accompanying drawing of embodiment, with clear demonstration technical characterstic of the present invention.
Please refer to Fig. 1, it is the process flow diagram according to the manufacture method of the touch-control display panel of preferred embodiment of the present invention.The manufacture method of the touch-control display panel of present embodiment may further comprise the steps:
At first, provide one first substrate 110, shown in step S1 and Fig. 2 A, wherein Fig. 2 A is the synoptic diagram of first substrate 110.Has a touch-control structure 111 on the one first surface 110a of first substrate 110.Touch-control structure 111 for example is that a capacitance type touch-control structure is an example in the present embodiment, please be simultaneously with reference to Fig. 2 B and 2C, and Fig. 2 B is the vertical view of touch-control structure among Fig. 2 A; Fig. 2 C is along the sectional view of A-A ' line among Fig. 2 B.This capacitance type touch-control structure for example comprises a conductive layer 111a, one first insulation course 111b, an electrode layer 111c and one second insulation course 111d.Conductive layer 111a is arranged on the first surface 110a of first substrate 110, it can be single layer structure or sandwich construction, and the material of conductive layer 111a comprises: transparent conductive material (indium tin oxide (ITO) for example, indium-zinc oxide (IZO), cadmium tin-oxide (CTO), cadmium zinc oxide (CZO), aluminium zinc oxide (AZO), aluminium tin-oxide (ATO), hafnia (HfO), indium tin zinc oxide (ITZO), Zinc compounds, other suitable material, or above-mentioned combination), opaque conductive material is (for example golden, silver, iron, tin, plumbous, cadmium, molybdenum, aluminium, titanium, tantalum, hafnium, other suitable material, above-mentioned oxide, above-mentioned nitride, above-mentioned oxynitride, above-mentioned alloy, or above-mentioned combination), or the combination of above-mentioned transparent and opaque conductive material.The first insulation course 111b is covered in conductive layer 111a, in order to electrical isolation conductive layer 111a and electrode layer 111c.Wherein, this first insulation course 111b can be single layer structure or sandwich construction, and its material for example is inorganic, organic material or above-mentioned combination.Inorganic for example is monox, silicon nitride, silicon oxynitride, other material that is fit to or above-mentioned combination, and organic material for example is photoresistance, poly-propionyl ether (polyarylene ether; PAE), polyamides class, polyesters, polyalcohols, polyalkenes, benzocyclobutene (benzocyclclobutene; BCB), HSQ (hydrogen silsesquioxane), MSQ (methyl silesquioxane), silica hydrocarbons (SiOC-H), polyethers, polyketone class, polyacetals class, poly-phenols, poly-naphthenic, polyalkylene oxide class, carbene class, poly-phenolic, other material that is fit to or above-mentioned combination.Is example in embodiments of the invention with the organic material, but is not limited thereto.Electrode layer 111c, can be single layer structure or sandwich construction, and its material for example is transparent conductive material (for example indium tin oxide (ITO), indium-zinc oxide (IZO), cadmium tin-oxide (CTO), cadmium zinc oxide (CZO), aluminium zinc oxide (AZO), aluminium tin-oxide (ATO), hafnia (HfO), indium tin zinc oxide (ITZO), Zinc compounds, other suitable material or above-mentioned combination), and it is covered on the first insulation course 111b.The second insulation course 111d is covered on the electrode layer 111c, in order to guard electrode layer 111c.Wherein, this second insulation course 111d can be single layer structure or sandwich construction, and its material for example is inorganic, organic material or above-mentioned combination.Inorganic for example is monox, silicon nitride, silicon oxynitride, other material that is fit to or above-mentioned combination, and organic material for example is photoresistance, poly-propionyl ether (polyarylene ether; PAE), polyamides class, polyesters, polyalcohols, polyalkenes, benzocyclobutene (benzocyclclobutene; BCB), HSQ (hydrogensilsesquioxane), MSQ (methyl silesquioxane), silica hydrocarbons (SiOC-H), polyethers, polyketone class, polyacetals class, poly-phenols, poly-naphthenic, polyalkylene oxide class, carbene class, poly-phenolic, other material that is fit to or above-mentioned combination.Is example in embodiments of the invention with the organic material, but is not limited thereto.Be that example describes with the capacitance type touch-control structure 111 shown in Fig. 2 B and Fig. 2 C in the present embodiment.Yet, touch-control structure 111 is not restricted to this, other is arranged on first substrate 110, in order to the touch-control structure of integrating with display panel 111, for example: the combination of resistance-type, piezoelectric type, pressure/capacitance type, photoinduction formula, push type or other suitable touch-control structure or above-mentioned the two pattern at least all can be applicable to this.In addition, conductive layer 111a distinctly has two drafting department (not shown) are connected those drafting departments with one connecting portion (not shown) with electrode layer 111c, and wherein the connecting portion of the connecting portion of conductive layer 111a and electrode layer 111c is staggered is example.In other embodiment, the drafting department of the drafting department of conductive layer 111a and electrode layer 111c distinctly can be more than two, the connecting portion of the connecting portion of conductive layer 111a and electrode layer 111c respectively can be more than one or the vertical view shape of the drafting department of the drafting department of conductive layer 111a and electrode layer 111c can be rectangle, trapezoidal, triangle, rectangle, rhombus, hexagon, pentagon, ellipse or other suitable shape.
Please refer to Fig. 3 A, it is that virtual substrate 130 is arranged at the synoptic diagram on first substrate 110.The manufacture method of present embodiment is followed execution in step S2, a virtual substrate (dummy substrate) 130 is set on the first surface 110a of first substrate 110, and is covered on the touch-control structure 111.That is to say that the inside surface of virtual substrate (dummy substrate) 130 is corresponding to the upper surface of touch-control structure 111 and the inside surface of first substrate 110 (i.e. a surperficial 110a).In an embodiment, virtual substrate 130 can be for example be arranged on first substrate 110 to example or frame glue-line 150 are arranged on the virtual substrate 130 via a frame glue-line 150, makes virtual substrate 130 be arranged on the first surface 110a of first substrate 110.Please refer to Fig. 3 B, it is the vertical view of the frame glue-line 150 and first substrate 110.Frame glue-line 150 centers on touch-control structure 111, and has a plurality of opening 150a.Shown in Fig. 3 B, frame glue-line 150 comprises at least four opening 150a, these a little opening 150a, and preferably, relative with four corners of the touch-control structure 111 respectively example that should be but is not limited thereto, and also can be arranged at other position.In addition, frame glue-line 150 optionally has a gap d with touch-control structure 111, and present embodiment is an example to have gap d, but is not limited thereto, and also can not have this gap, but the two edge trims, but does not cover mutually.In addition, the manufacture method virtual substrate 130 and the touch-control structure 111 of present embodiment optionally have a gap g, so that virtual substrate 130 plays buffering in ensuing fabrication steps, but be not limited thereto, when virtual substrate 130 is fitted via frame glue-line 150 with touch-control structure 111, also can not have this gap g.Moreover; it is example that present embodiment has a gap g with virtual substrate 130 and touch-control structure 111; but in order more to keep the degree of stability of this gap g; then more selectively for example comprise and spill the step of cloth gap on first substrate 110; so that virtual substrate 130 has an interval g with touch-control structure 111; so that virtual substrate 130 plays buffering in ensuing fabrication steps, avoid it to touch touch-control structure 111, can not sustain damage with protection touch-control structure 111.In addition, in other embodiment, virtual substrate 130 still can be via the electrostatic means sorption on first substrate except adhering with frame glue-line 150, and be covered on this touch control component 111, then just exist or other suitable array mode every g continuously because of virtual substrate 130 and touch control component 111.
Next, the manufacture method execution in step S3 of present embodiment forms an overlayer.Please refer to Fig. 4, it is that overlayer 112 is formed at the synoptic diagram on first substrate 110.Overlayer 112 is formed on the second surface 110b of first substrate 110, and this second surface 110b is with respect to first surface 110a, that is the outside surface of first substrate 110.In the practical application, overlayer 112 for example is to comprise wherein at least one of a both alignment layers, a transparency electrode and a colored filter.Before carrying out step S3, first substrate 110 that preferably will be provided with virtual substrate 130 overturns, make the substrate 110 of winning be arranged on the travelling belt or platform of processing procedure via virtual substrate 130, avoid touch-control structure 111 to be subjected to rubbing the phenomenon of scratch takes place, but be not limited thereto, can design according to the tectal board of formation, and first substrate 110 that does not need to be provided with virtual substrate 130 earlier overturns.
Come again, carry out step S4, one second substrate is provided.Please refer to Fig. 5, it is the synoptic diagram of second substrate 120 and first substrate 110.Have an initiating structure 121 on the one first surface 120a of second substrate 120, that is the inside surface of second substrate 120.In the practical application, initiating structure 121 for example is to comprise a plurality of thin film transistor (TFT)s.
Then, carry out organizing the step of two substrates 110,120.Please refer to Fig. 6, it is the synoptic diagram after first substrate 110 and 120 pairs of groups of second substrate.Shown in step S5, to organizing first substrate 110 and second substrate 120, make the overlayer 112 of the initiating structure 121 of second substrate 120, and between first substrate 110 and second substrate 120, form a display dielectric layer (display mediumlayer) 140 with respect to first substrate 110.That is to say that the upper surface of the initiating structure 121 of second substrate 120 is corresponding to the upper surface of the overlayer 112 of first substrate 110.In the practical application, display dielectric layer 140 for example is in to before organizing two substrates 110,120, utilizes drip (One Drop Filling; ODF) be formed on first substrate 110 or second substrate 120.Again, display dielectric layer 140 also can utilize injection method (injecting) to be formed between first substrate 110 and second substrate 120 after to group two substrates 110,120.The display dielectric layer 140 that aforementioned applications drip or injection method form is non-self-luminescent material, for example: liquid crystal (Liquid Crystal; LC) material, electrophoresis material; But technology of the present invention is not restricted to this, and display dielectric layer 140 also can for example be the electroluminescence material, and is formed on second substrate 120 before to group two substrates 110,120, and its can be positioned on the initiating structure 121 or under.Display dielectric layer also can for example be the single layer structure or the sandwich construction of non-self-luminescent material and electroluminescence material.
Then, the manufacture method of present embodiment is carried out step S6, removes virtual substrate 130.Please refer to Fig. 7, it is the synoptic diagram after removing virtual substrate 130 on first substrate 110.With Fig. 3 B is example, but is not limited thereto.Because frame glue-line 150 has gap d with touch-control structure 111, therefore can utilize in gap d, to cut and split virtual substrate 130 and, remove frame glue-line 150 around touch-control structure 111 to first substrate 110 after the group and the mode of second substrate 120.Wherein, cut the mode of splitting, wherein at least one applies to this can to use laser mode, break bar, diamond cutter.Yet the mode of removing virtual substrate 130 is not limited in this, and other perhaps directly grinds or etching virtual substrate 130 in order to separate first substrate 110 and virtual substrate 130; Or remove static between two substrates; Or directly remove frame glue-line 150, all can be applicable to this.Removing virtual substrate 130 is to finish touch control display panel 100 afterwards.
Further, the manufacture method of present embodiment is optionally carried out the thinning step of first substrate 110 and/or second substrate 120.Please refer to Fig. 8, it is the synoptic diagram that first substrate 110 carries out the thinning step.In the manufacture method of present embodiment, first substrate 110 when being example, preferably, can carry out thinning with inorganic transparent substrate (for example being glass, quartz or other material that is fit to) behind the step S2 that virtual substrate 130 is set.Certainly, also can not thinning first substrate 110 according to the demand of design.If, first substrate 110 is during with organic transparent material (for example being polyalkenes, poly-Hai class, polyalcohols, polyesters, rubber, thermoplastic polymer, thermosetting polymer, poly aromatic hydro carbons, poly-methyl propionyl acid methyl esters class, polycarbonate-based, other material that is fit to, above-mentioned derivant or above-mentioned combination), and whether carry out thinning according to the selection that the thickness of first substrate 110 can be suitable, preferably, most organic transparency carrier can present quite thin thickness, thereby, do not need thinning.In addition, in other embodiment, second substrate 120 is with inorganic transparent substrate (for example being glass, quartz or other material that is fit to) or also thinning again of inorganic transparent materials (for example being silicon chip, pottery, other material that is fit to or above-mentioned combination).Specifically, first substrate 110 has been thinned to suitable thickness earlier with inorganic transparent substrate (for example being glass, quartz or other material that is fit to) or inorganic transparent materials (for example being silicon chip, pottery, other material that is fit to or above-mentioned combination) and has been positioned on the extra support membrane (not shown), after finishing Deng touch-control display panel, remove extra support membrane according to need again.The mode of thinning first substrate 110 is carried out the thinning step to the second surface 110b of first substrate 110, and so that first substrate 110 is thinned to first substrate 110 ', wherein, the thinning step can be used and grind and/or etching mode.As shown in Figure 8, when carrying out the thinning step of first substrate 110, virtual substrate 130 protection touch-control structures 111 avoid touch-control structure 111 to sustain damage.In addition, virtual substrate 130 also can provide the function of first substrate, 110 strength support, makes the substrate 110 of winning can carry out the thinning step smoothly.Please refer to Fig. 9, it is the synoptic diagram that second substrate 120 carries out the thinning step.Second substrate 120 is with inorganic transparent substrate (for example being glass, quartz or other material that is fit to) or inorganic transparent materials (for example being silicon chip, pottery, other material that is fit to or above-mentioned combination) when being example, preferably, can carry out the thinning step of second substrate 120 after to the step S5 that organizes first substrate 110 and second substrate 120.Certainly, also can behind step S6, carry out the thinning of second substrate 120 or direct not thinning second substrate 120 according to the demand of design.If, second substrate 120 is during with organic transparent material (for example being polyalkenes, poly-Hai class, polyalcohols, polyesters, rubber, thermoplastic polymer, thermosetting polymer, poly aromatic hydro carbons, poly-methyl propionyl acid methyl esters class, polycarbonate-based, other material that is fit to, above-mentioned derivant or above-mentioned combination), and whether carry out thinning according to the selection that the thickness of second substrate 120 can be suitable, preferably, most organic transparency carrier can present quite thin thickness, thereby, do not need thinning.In addition, in other embodiment, second substrate 120 also can be without thinning with inorganic transparent substrate (for example being glass, quartz or other material that is fit to) or inorganic transparent materials (for example being silicon chip, pottery, other material that is fit to or above-mentioned combination).Specifically, second substrate 120 has been thinned to suitable thickness earlier with inorganic transparent substrate (for example being glass, quartz or other material that is fit to) or inorganic transparent materials (for example being silicon chip, pottery, other material that is fit to or above-mentioned combination) and has been positioned on the extra support membrane (not shown), after finishing Deng touch-control display panel, remove extra support membrane according to need again.The mode of thinning second substrate 120 is carried out the thinning step to the second surface 120b with respect to first surface 120a of second substrate 120, and so that second substrate 120 is thinned to second substrate 120 ', wherein, the thinning step can be used and grind and/or etching mode.As shown in Figure 9, when carrying out the thinning step of second substrate 120, virtual substrate 130 protection touch-control structures 111 avoid touch-control structure 111 to sustain damage.By aforementioned thinning step of optionally carrying out first substrate 110 and/or second substrate 120, can further reduce the thickness of touch-control display panel 100.In addition, because virtual substrate 130 is covered on the touch-control structure 111 when carrying out the thinning step, can avoids touch-control structure 111 that scratch, stressed damages take place, be subjected to the problem of chemical solvent corrosion.
On the one hand, the touch-control display panel 100 of the above embodiment of the present invention can apply in the electronic installation, and the manufacture method of electronic installation also comprises the manufacture method of the touch-control display panel 100 of the foregoing description in addition.Please refer to Figure 10, it is the functional block diagram that comprises the electronic installation 300 of touch-control display panel 100.Touch-control display panel 100 can electrically connect and composition electronic installation 300 with electronic package 200.Here be noted that electronic package 200 for example comprises: the combination of Control Component, operating assembly, processing components, input module, memory element, driven unit, luminescence component, protection assembly, sensing component, detection element, other functional module or aforementioned components.Moreover the type of electronic installation 300 comprises: the panel of portable product (as mobile phone, video camera, camera, mobile computer, game machine, music player, electronic mail transceiver, map navigator, digital frame or similar products like), video and audio product (as audio-visual projector or similar products like), screen, TV, outdoor/indoor billboard or projector etc.
The manufacture method of disclosed touch-control display panel of the above embodiment of the present invention and electronic installation, utilize virtual substrate to be covered in the mode of touch-control structure top, make in the various kinds fabrication steps (for example step of gold-tinted processing procedure, etching, sputter and substrate thinning), avoid first substrate and touch-control structure to be subjected to the phenomenon of scratch.So can in the processing procedure of touch-control display panel, carry out the thinning step of first substrate and/or second substrate, and touch-control structure is sustained damage, further promote the qualification rate of product.In addition, above-mentioned manufacture method does not limit the type of touch-control display panel, comprise that condenser type, resistance-type, autoluminescence show, the touch-control display panel of non-autoluminescence demonstration, all can use the manufacture method of the above embodiment of the present invention, can be compatible with in the existing touch-control display panel processing procedure.
In sum, though the present invention with preferred embodiment openly as above, it is not in order to limit the present invention.The technical staff in the technical field of the invention, without departing from the spirit and scope of the present invention, when doing various changes and modification.Therefore, protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (11)
1. the manufacture method of a touch-control display panel is characterized in that, comprising:
One first substrate is provided, has a touch-control structure on the first surface of this first substrate;
One virtual substrate is set on this first surface of this first substrate, and is covered on this touch-control structure;
Form an overlayer on a second surface of this first substrate, this second surface is with respect to this first surface;
One second substrate is provided, has an initiating structure on the first surface of this second substrate;
To organizing this first substrate and this second substrate, make this initiating structure of this second substrate this overlayer, and between this first substrate and this second substrate, form a display dielectric layer with respect to this first substrate; And
Remove this virtual substrate.
2. manufacture method as claimed in claim 1 is characterized in that, the method that forms this display dielectric layer is contained in organizing before this first substrate and this second substrate, utilizes drip to form this display dielectric layer on this first substrate or this second substrate.
3. manufacture method as claimed in claim 1 is characterized in that, the method that forms this display dielectric layer is contained in organizing after this first substrate and this second substrate, utilizes injection method to form this display dielectric layer between this first substrate and this second substrate.
4. manufacture method as claimed in claim 1 is characterized in that, after this virtual substrate is set, also comprises:
This second surface to this first substrate carries out a thinning step, comes this first substrate of thinning.
5. manufacture method as claimed in claim 1 is characterized in that, in to after organizing this first substrate and this second substrate, also comprises:
Second surface to this second substrate carries out a thinning step, comes this second substrate of thinning.
6. manufacture method as claimed in claim 1 is characterized in that, this virtual substrate is arranged on this first substrate via a frame glue-line, and this frame glue-line is around this touch-control structure and have a plurality of openings.
7. manufacture method as claimed in claim 6 is characterized in that, this frame glue-line and this touch-control structure have a gap, and comprises that at least four openings are corresponding with four corners of this touch-control structure respectively.
8. manufacture method as claimed in claim 6 is characterized in that, this step of removing this virtual substrate comprises:
Cut split this virtual substrate and to the group after this first substrate and this second substrate, to remove this frame glue-line around this touch-control structure.
9. manufacture method as claimed in claim 1 is characterized in that, this step that this virtual substrate is set comprises:
Spill a plurality of gaps of cloth on this first substrate, so that this virtual substrate and this touch-control structure have one at interval.
10. manufacture method as claimed in claim 1 is characterized in that, this overlayer comprise a both alignment layers, a transparency electrode and a colored filter wherein at least one.
11. the manufacture method of an electronic installation comprises the manufacture method of touch-control display panel as claimed in claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101802216A CN101424992A (en) | 2008-11-28 | 2008-11-28 | Method for manufacturing touch control display panel and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101802216A CN101424992A (en) | 2008-11-28 | 2008-11-28 | Method for manufacturing touch control display panel and electronic device |
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| CN101424992A true CN101424992A (en) | 2009-05-06 |
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| CNA2008101802216A Pending CN101424992A (en) | 2008-11-28 | 2008-11-28 | Method for manufacturing touch control display panel and electronic device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015043297A1 (en) * | 2013-09-29 | 2015-04-02 | 宸鸿科技(厦门)有限公司 | Touch panel manufacturing method |
| US9164645B2 (en) | 2013-09-29 | 2015-10-20 | Tpk Touch Solutions (Xiamen) Inc. | Touch panel and manufacturing method thereof |
| CN105589585A (en) * | 2014-10-21 | 2016-05-18 | 宸鸿科技(厦门)有限公司 | Touch device and production method thereof |
| CN110707133A (en) * | 2019-09-06 | 2020-01-17 | 深圳市华星光电技术有限公司 | Active matrix organic light emitting diode display screen and preparation method thereof |
-
2008
- 2008-11-28 CN CNA2008101802216A patent/CN101424992A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015043297A1 (en) * | 2013-09-29 | 2015-04-02 | 宸鸿科技(厦门)有限公司 | Touch panel manufacturing method |
| US9164645B2 (en) | 2013-09-29 | 2015-10-20 | Tpk Touch Solutions (Xiamen) Inc. | Touch panel and manufacturing method thereof |
| US9164644B2 (en) | 2013-09-29 | 2015-10-20 | Tpk Touch Solutions (Xiamen) Inc. | Touch panel and manufacturing method thereof |
| US10459590B2 (en) | 2013-09-29 | 2019-10-29 | Tpk Touch Solutions (Xiamen) Inc. | Touch panel and manufacturing method thereof |
| CN105589585A (en) * | 2014-10-21 | 2016-05-18 | 宸鸿科技(厦门)有限公司 | Touch device and production method thereof |
| CN110707133A (en) * | 2019-09-06 | 2020-01-17 | 深圳市华星光电技术有限公司 | Active matrix organic light emitting diode display screen and preparation method thereof |
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Application publication date: 20090506 |