JP2003124256A - Mounting method of flexible substrate - Google Patents
Mounting method of flexible substrateInfo
- Publication number
- JP2003124256A JP2003124256A JP2001314891A JP2001314891A JP2003124256A JP 2003124256 A JP2003124256 A JP 2003124256A JP 2001314891 A JP2001314891 A JP 2001314891A JP 2001314891 A JP2001314891 A JP 2001314891A JP 2003124256 A JP2003124256 A JP 2003124256A
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- mounting
- work
- electrode
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/065—Press rams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75315—Elastomer inlay
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、同一実装面に実装
高さの異なる電極が形成されたワークにフレキシブル基
板を実装するフレキシブル基板の実装方法に関するもの
である。
【０００２】
【従来の技術】電子機器において電子回路を構成する機
能部品としてフレキシブル基板が用いられている。この
フレキシブル基板は一般に回路基板などのワークに実装
して用いられ、実装工程においては、フレキシブル基板
をワークに接着して固定するとともに、フレキシブル基
板に設けられた接続用端子をワークの電極に導通させ
る。
【０００３】この実装方法として、接着剤中に導電粒子
を配合した異方性導電剤を用いる方法が知られている。
この方法では、テープ状の異方性導電剤が貼り付けられ
た電極上にフレキシブル基板を載置して接続用端子と電
極とを位置合わせした状態で、フレキシブル基板をワー
クの実装面に対して押圧するとともに加熱する。これに
より、接続用端子は電極と異方性導電剤中に含まれる導
電粒子を介して導通するとともに、熱硬化した異方性導
電剤によって固着される。
【０００４】
【発明が解決しようとする課題】ところでフレキシブル
基板が実装されるワークには、実装面に設けられた電極
の実装高さが異なる種類のワークが存在する。たとえ
ば、インクジェットプリンタのヘッド用基板において
は、信号出力用の電極とこれらの電極の両側に設けられ
るＧＮＤ電極との高さが異なり、これらの電極との間に
段差が存在する。このような基板にフレキシブル基板を
実装する際には、同一のフレキシブル基板の接続用端子
をこれらの実装高さが異なる複数の電極と接合しなけれ
ばならないが、異方性導電剤による実装では同一の圧着
工程で高さの異なる電極を一括して接合することができ
ず、従来はやむを得ず複数の圧着工程に分割して実装を
行っていた。このため、工程数が増加して製品コストの
上昇を招くこととなり、効率のよい実装方法が望まれて
いた。
【０００５】そこで本発明は、実装高さの異なる電極が
形成されたワークを対象としてフレキシブル基板を効率
よく実装することができるフレキシブル基板の実装方法
を提供することを目的とする。
【０００６】
【課題を解決するための手段】本発明のフレキシブル基
板の実装方法は、接続用端子が形成された可撓性を有す
るフレキシブル基板を実装高さの異なる複数の電極部が
形成されたワークに圧着するフレキシブル基板の実装方
法であって、前記ワークの実装面の前記電極部上に異方
性導電テープを貼り付けるテープ貼り付け工程と、異方
性導電テープが貼り付けられた実装面上にフレキシブル
基板を搭載する搭載工程と、このフレキシブル基板を圧
着ツールによって押圧することによりフレキシブル基板
をワークに接合するとともに前記接続用端子をワークの
電極に異方性導電剤を介して導通させる圧着工程とを含
み、この圧着工程において、フレキシブル基板の上面と
圧着ツールとの間に可撓性を有する弾性膜部材を介在さ
せた状態でフレキシブル基板をワークの実装面に対して
押圧する。
【０００７】本発明によれば、フレキシブル基板を圧着
ツールによって押圧することにより前記接続用端子をワ
ークの電極に異方性導電剤を介して接合するとともに導
通させる圧着工程において、フレキシブル基板の上面と
圧着ツールとの間に可撓性を有する弾性膜部材を介在さ
せた状態でフレキシブル基板をワークの実装面に対して
押圧することにより、実装高さの差による押圧状態の不
均一を吸収させて圧着品質を均一化するとともに、単一
圧着工程で圧着作業を行うことができ、実装作業を効率
化することができる。
【０００８】
【発明の実施の形態】次に本発明の実施の形態を図面を
参照して説明する。図１，図２は本発明の一実施の形態
のフレキシブル基板の実装方法の工程説明図である。図
１（ａ）において、ワーク保持部１上には、ワーク２が
保持されている。ワーク２の上面の実装面には部分的に
表面層２ａが形成されており、表面層２ａの周縁部は周
囲との高さ差が存在する段差部２ｂとなっている。ワー
ク２の縁部近傍には、第１の電極部３が形成されてお
り、表面層２ａの上面には、第２の電極部４が形成され
ている。
【０００９】第２の電極部４の上面の高さは、表面層２
ａのために第１の電極部３の上面よりもΔｈ（約５μｍ
程度）だけ高くなっており、これらの複数の電極部に電
子部品を実装する際には、実装高さが異なる。このよう
なワークの例として、インクジェットプリンタのヘッド
に用いられる基板がある。この例では、表面層２ａ上に
出力用の端子電極が設けられ、表面層２ａを外れた外縁
部に出力用の端子電極よりも低い実装高さのＧＮＤ端子
が設けられる。
【００１０】次にワーク２上には、フレキシブル基板を
実装するためのＡＣＦテープ（異方性導電テープ）が貼
り付けられる（テープ貼り付け工程）。図１（ｂ）に示
すように、ワーク２の上方に、セパレータテープ６を上
向きにしてＡＣＦテープ５を載置する。ＡＣＦテープ５
は、樹脂接着剤成分５ａ中に導電粒子５ｂを混入させた
ものであり、２つの接続対象面の間にＡＣＦテープ５を
介在させた状態で、熱と荷重を作用させることにより、
接続対象面を固着させるとともに、電気的に導通させる
ことができる。
【００１１】このＡＣＦテープ５の貼り付けには、圧着
ツール７が用いられる。圧着ツール７でＡＣＦテープ５
を貼り付ける際には、図１（ｃ）に示すように、圧着ツ
ール７の下面とＡＣＦテープ５の上面のセパレータテー
プ６との間に、膜部材８を介在させた状態でＡＣＦテー
プ５をワーク２の実装面に対して押圧する。膜部材８
は、ゴムなどのエラストマ材質のように可撓性に富む弾
性材を膜状に形成したものである。このような弾性膜部
材を介在させてＡＣＦテープ５をワーク２に対して押し
つけることにより、実装高さが異なる実装面を有するワ
ーク２に対しても、ＡＣＦテープ５を全面に密着させて
均一に貼り付けることができる。テープ貼り付け後に
は、セパレータテープ６のみが、ＡＣＦテープ５から剥
離される。
【００１２】次に、ＡＣＦテープ５が貼り付けられたワ
ーク２に対して、フレキシブル基板１０が実装される。
フレキシブル基板１０には、図２（ａ）に示すように複
数の接続用端子が形成されており、両側に形成された端
子１１は、ワーク２の電極部３と、また中央部に形成さ
れた端子１２は表面層２ａ上の電極部４とそれぞれ接続
される。フレキシブル基板１０は、端子形成面側を下向
きにしてワーク２上に段差部２ｂをまたいだ形で搭載さ
れる（搭載工程）。
【００１３】次いで、図２（ｂ）に示すように、圧着ツ
ール１７の下面とフレキシブル基板１０の上面との間
に、膜部材１８を介在させた状態で圧着ツール１７を下
降させる。そして図２（ｃ）に示すように、圧着ツール
１７をワーク２に対して押圧する。これにより、フレキ
シブル基板１０をＡＣＦテープ５が剥離されたワーク２
の実装面に対して所定荷重で押圧するとともに、圧着ツ
ール１７に内蔵された加熱手段によってフレキシブル基
板１０およびＡＣＦテープ５を加熱して、フレキシブル
基板１０をワーク２に圧着する（圧着工程）。
【００１４】ここで膜部材１８は、膜部材８と同様に可
撓性に富む弾性膜部材であるが、フレキシブル基板押圧
用の膜部材１８には、グラスファイバなどの補強材を織
り込んで、加熱時の熱伝導性を向上させるとともに熱膨
張率を低下させるようにしている。これにより、加熱・
押圧を伴う圧着過程において、フレキシブル基板１０の
過度の昇温を防止して熱による伸び変形を低減すること
ができる。
【００１５】そして所定の押圧荷重によって押圧するこ
とにより、端子１１と電極部３との間の隙間、端子１２
と電極部４との間の隙間に介在するＡＣＦ中の導電粒子
５ｂが押しつぶされて、端子１１と電極部３、端子１２
と電極部４とを導通させるとともに、所定時間加熱状態
を保持して樹脂接着剤成分５ａが熱硬化することによ
り、フレキシブル基板１０はワーク２に固着される。
【００１６】この熱圧着過程においては、可撓性に富む
膜部材１８を介して押圧が行われることから、段差部２
ｂを有するワーク２に対しても一体のフレキシブル基板
１０を段差部２ｂをまたいで圧着することができる。し
たがって、段差部２ｂやワーク上面の実装面の高さのば
らつきなどによる押圧状態の不均一を膜部材１８によっ
て吸収させて均一な圧着品質を確保できるとともに、従
来はこの段差部２ｂに起因して２段階に分割して行われ
ていた圧着作業を単一圧着工程で実行することができ、
工程を簡略化して実装作業の効率を向上させることが可
能となっている。
【００１７】
【発明の効果】本発明によれば、フレキシブル基板を圧
着ツールによって押圧することにより接続用端子をワー
クの電極に異方性導電剤を介して接合するとともに導通
させる圧着工程において、フレキシブル基板の上面と圧
着ツールとの間に可撓性を有する弾性膜部材を介在させ
た状態でフレキシブル基板をワークの実装面に対して押
圧することにより、実装高さの差による押圧状態の不均
一を吸収させて圧着品質を均一化するとともに、単一圧
着工程で圧着作業を行うことができ、実装作業を効率化
することができる。Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a method of mounting a flexible substrate on a work in which electrodes having different mounting heights are formed on the same mounting surface. is there. 2. Description of the Related Art In electronic equipment, a flexible substrate is used as a functional component constituting an electronic circuit. This flexible board is generally used by being mounted on a work such as a circuit board. In the mounting process, the flexible board is adhered and fixed to the work, and the connection terminals provided on the flexible board are electrically connected to the electrodes of the work. . As this mounting method, a method using an anisotropic conductive agent in which conductive particles are mixed in an adhesive is known.
In this method, a flexible substrate is placed on an electrode to which a tape-shaped anisotropic conductive agent is attached, and the connection terminal and the electrode are aligned with each other. Press and heat. Thus, the connection terminal is electrically connected to the electrode through the conductive particles contained in the anisotropic conductive agent, and is fixed by the thermosetting anisotropic conductive agent. [0004] By the way, in the work on which the flexible substrate is mounted, there are kinds of works in which the electrodes provided on the mounting surface have different mounting heights. For example, in a head substrate of an ink jet printer, the heights of signal output electrodes and GND electrodes provided on both sides of these electrodes are different, and there is a step between these electrodes. When mounting a flexible substrate on such a substrate, the connection terminals of the same flexible substrate must be joined to a plurality of electrodes having different mounting heights, but mounting with an anisotropic conductive agent is the same. In this crimping step, electrodes having different heights cannot be collectively joined, and in the past, it was unavoidable that the mounting was performed by dividing into a plurality of crimping steps. For this reason, the number of steps increases, which leads to an increase in product cost, and an efficient mounting method has been desired. Accordingly, an object of the present invention is to provide a method of mounting a flexible substrate, which can efficiently mount a flexible substrate on a workpiece on which electrodes having different mounting heights are formed. According to the method of mounting a flexible substrate of the present invention, a plurality of electrode portions having different mounting heights are formed on a flexible substrate having connection terminals formed thereon. A method of mounting a flexible substrate to be pressure-bonded to a work, comprising: a tape bonding step of bonding an anisotropic conductive tape on the electrode portion on a mounting surface of the work; and a mounting surface on which the anisotropic conductive tape is bonded. A mounting step of mounting a flexible substrate thereon, and pressing the flexible substrate with a crimping tool to join the flexible substrate to the work and to conduct the connection terminal to the work electrode through an anisotropic conductive agent. In this pressure bonding step, a flexible elastic film member having flexibility is interposed between the upper surface of the flexible substrate and the pressure bonding tool. In this state, the flexible substrate is pressed against the work mounting surface. According to the present invention, in the crimping step in which the connection terminal is joined to the electrode of the work via the anisotropic conductive agent and is made conductive by pressing the flexible board with the crimping tool, By pressing the flexible board against the mounting surface of the work with the elastic film member having flexibility interposed between the pressure bonding tool and the unevenness of the pressing state due to the difference in mounting height, The crimping quality can be made uniform and the crimping work can be performed in a single crimping process, so that the mounting work can be made more efficient. Next, an embodiment of the present invention will be described with reference to the drawings. 1 and 2 are process explanatory views of a method for mounting a flexible substrate according to an embodiment of the present invention. In FIG. 1A, a work 2 is held on a work holding unit 1. A surface layer 2a is partially formed on the mounting surface on the upper surface of the work 2, and a peripheral portion of the surface layer 2a is a step portion 2b having a height difference from the periphery. A first electrode unit 3 is formed near the edge of the work 2, and a second electrode unit 4 is formed on the upper surface of the surface layer 2 a. The height of the upper surface of the second electrode portion 4 is
Due to a, Δh (about 5 μm
), And the mounting height is different when electronic components are mounted on these plural electrode portions. An example of such a work is a substrate used for a head of an ink jet printer. In this example, an output terminal electrode is provided on the surface layer 2a, and a GND terminal having a lower mounting height than the output terminal electrode is provided on an outer edge portion outside the surface layer 2a. Next, an ACF tape (anisotropic conductive tape) for mounting a flexible substrate is attached onto the work 2 (tape attaching step). As shown in FIG. 1B, the ACF tape 5 is placed above the work 2 with the separator tape 6 facing upward. ACF tape 5
Is obtained by mixing conductive particles 5b into a resin adhesive component 5a, and by applying heat and load with an ACF tape 5 interposed between two connection target surfaces,
The surface to be connected can be fixed and electrically connected. A crimping tool 7 is used for attaching the ACF tape 5. ACF tape 5 with crimping tool 7
1A, the ACF tape 5 is sandwiched between the lower surface of the crimping tool 7 and the separator tape 6 on the upper surface of the ACF tape 5 with the film member 8 interposed therebetween, as shown in FIG. The work 2 is pressed against the mounting surface. Membrane member 8
Is a film formed of an elastic material having a high flexibility such as an elastomer material such as rubber. By pressing the ACF tape 5 against the work 2 with such an elastic film member interposed therebetween, the ACF tape 5 can be brought into close contact with the entire surface of the work 2 having a mounting surface having a different mounting height, and can be uniformly formed. Can be pasted. After attaching the tape, only the separator tape 6 is separated from the ACF tape 5. Next, a flexible substrate 10 is mounted on the work 2 to which the ACF tape 5 has been attached.
As shown in FIG. 2A, a plurality of connection terminals are formed on the flexible substrate 10, and the terminals 11 formed on both sides are formed at the electrode portion 3 of the work 2 and at the center. The terminals 12 are respectively connected to the electrode portions 4 on the surface layer 2a. The flexible substrate 10 is mounted on the work 2 with the terminal formation surface side facing down, straddling the step 2b (mounting step). Next, as shown in FIG. 2B, the crimping tool 17 is lowered with the film member 18 interposed between the lower surface of the crimping tool 17 and the upper surface of the flexible substrate 10. Then, as shown in FIG. 2C, the pressure tool 17 is pressed against the workpiece 2. As a result, the flexible substrate 10 is moved to the work 2 from which the ACF tape 5 has been peeled.
The flexible substrate 10 and the ACF tape 5 are heated by a heating means incorporated in the crimping tool 17, and the flexible substrate 10 is crimped onto the work 2 (crimping step). Here, the membrane member 18 is an elastic membrane member having a high flexibility like the membrane member 8. However, the membrane member 18 for pressing the flexible substrate is woven with a reinforcing material such as glass fiber and heated. At the same time, the thermal conductivity is improved and the coefficient of thermal expansion is reduced. This allows heating and
In the pressing process involving pressing, it is possible to prevent the temperature of the flexible substrate 10 from being excessively increased and to reduce elongation deformation due to heat. By pressing with a predetermined pressing load, a gap between the terminal 11 and the electrode portion 3,
The conductive particles 5b in the ACF interposed in the gap between the electrode 11 and the electrode portion 4 are crushed, and the terminal 11 and the electrode portion 3 and the terminal 12 are crushed.
The flexible substrate 10 is fixed to the work 2 by conducting the electrical conduction between the electrode substrate 4 and the resin adhesive component 5a while maintaining the heating state for a predetermined time. In this thermocompression bonding process, the pressing is performed via the highly flexible membrane member 18, so that the stepped portion 2 is formed.
The integrated flexible substrate 10 can also be pressure-bonded to the work 2 having the b. Therefore, the unevenness of the pressing state due to the unevenness of the height of the stepped portion 2b and the mounting surface of the work upper surface can be absorbed by the film member 18 to ensure uniform crimping quality, and conventionally, due to the stepped portion 2b, The crimping operation that has been performed in two stages can be performed in a single crimping process,
It is possible to simplify the process and improve the efficiency of the mounting operation. According to the present invention, the flexible terminal is connected to the electrode of the work via the anisotropic conductive agent by pressing the flexible substrate with the pressing tool, and the flexible terminal is connected to the flexible terminal. By pressing the flexible substrate against the mounting surface of the work with a flexible elastic film member interposed between the upper surface of the substrate and the crimping tool, the pressing state is uneven due to the difference in mounting height Is absorbed, and the crimping quality can be made uniform, and the crimping work can be performed in a single crimping process, so that the mounting work can be made more efficient.
【図面の簡単な説明】
【図１】本発明の一実施の形態のフレキシブル基板の実
装方法の工程説明図
【図２】本発明の一実施の形態のフレキシブル基板の実
装方法の工程説明図
【符号の説明】
２ ワーク
２ａ 表面層
３，４ 電極部
５ ＡＣＦテープ
７，１７ 圧着ツール
８，１８ 膜部材BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a process explanatory diagram of a flexible substrate mounting method according to an embodiment of the present invention. FIG. 2 is a process explanatory diagram of a flexible substrate mounting method according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 2 Work 2a Surface layer 3, 4 Electrode part 5 ACF tape 7, 17 Crimping tool 8, 18 Membrane member
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中村 崇 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 5E319 AA03 AC03 AC20 BB16 CC03 CC61 GG15 5E344 AA02 AA12 AA22 AA26 BB02 BB04 BB11 CC14 CC17 CD04 DD06 DD10 EE21 5F044 KK03 LL09 NN05 NN07 ────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Takashi Nakamura Matsushita Electric, 1006 Kadoma, Kazuma, Osaka Sangyo Co., Ltd. F term (reference) 5E319 AA03 AC03 AC20 BB16 CC03 CC61 GG15 5E344 AA02 AA12 AA22 AA26 BB02 BB04 BB11 CC14 CC17 CD04 DD06 DD10 EE21 5F044 KK03 LL09 NN05 NN07
Claims (1)
レキシブル基板を実装高さの異なる複数の電極部が形成
されたワークに圧着するフレキシブル基板の実装方法で
あって、前記ワークの実装面の前記電極部上に異方性導
電テープを貼り付けるテープ貼り付け工程と、異方性導
電テープが貼り付けられた実装面上にフレキシブル基板
を搭載する搭載工程と、このフレキシブル基板を圧着ツ
ールによって押圧することによりフレキシブル基板をワ
ークに接合するとともに前記接続用端子をワークの電極
に異方性導電剤を介して導通させる圧着工程とを含み、
この圧着工程において、フレキシブル基板の上面と圧着
ツールとの間に可撓性を有する弾性膜部材を介在させた
状態でフレキシブル基板をワークの実装面に対して押圧
することを特徴とするフレキシブル基板の実装方法。Claims: 1. A method of mounting a flexible substrate, comprising: bonding a flexible substrate having connection terminals formed thereon to a work having a plurality of electrode portions having different mounting heights. A tape attaching step of attaching an anisotropic conductive tape on the electrode portion on the mounting surface of the work, and a mounting step of mounting a flexible substrate on the mounting surface to which the anisotropic conductive tape is attached, A pressure bonding step of joining the flexible substrate to the work by pressing the flexible substrate with a pressure bonding tool and conducting the connection terminal to an electrode of the work via an anisotropic conductive agent,
In the pressure bonding step, the flexible substrate is pressed against a work mounting surface with a flexible elastic film member interposed between the upper surface of the flexible substrate and the pressure bonding tool. Implementation method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001314891A JP2003124256A (en) | 2001-10-12 | 2001-10-12 | Mounting method of flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001314891A JP2003124256A (en) | 2001-10-12 | 2001-10-12 | Mounting method of flexible substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003124256A true JP2003124256A (en) | 2003-04-25 |
Family
ID=19133137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001314891A Pending JP2003124256A (en) | 2001-10-12 | 2001-10-12 | Mounting method of flexible substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003124256A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7226821B2 (en) | 2005-06-24 | 2007-06-05 | Cardiac Pacemakers, Inc. | Flip chip die assembly using thin flexible substrates |
| WO2007088647A1 (en) * | 2006-02-01 | 2007-08-09 | Sony Chemical & Information Device Corporation | Method of mounting electric part |
| WO2008120513A1 (en) * | 2007-03-29 | 2008-10-09 | Citizen Holdings Co., Ltd. | Electrode terminal connecting structure of multilayer substrate |
| EP2001050A2 (en) * | 2006-03-28 | 2008-12-10 | Sony Chemical & Information Device Corporation | Method for manufacturing substrate having electric component |
| JP2013060008A (en) * | 2011-09-14 | 2013-04-04 | Xerox Corp | In situ flexible circuit embossing to form electrical interconnect |
| US9741971B2 (en) | 2013-12-10 | 2017-08-22 | Samsung Display Co., Ltd. | Flexible display device and method of manufacturing the same |
| CN107155260A (en) * | 2016-03-04 | 2017-09-12 | 富士通株式会社 | Electronic installation and the method for manufacturing electronic installation |
-
2001
- 2001-10-12 JP JP2001314891A patent/JP2003124256A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7226821B2 (en) | 2005-06-24 | 2007-06-05 | Cardiac Pacemakers, Inc. | Flip chip die assembly using thin flexible substrates |
| US7497911B2 (en) | 2005-06-24 | 2009-03-03 | Cardiac Pacemakers, Inc. | Flip chip die assembly using thin flexible substrates |
| WO2007088647A1 (en) * | 2006-02-01 | 2007-08-09 | Sony Chemical & Information Device Corporation | Method of mounting electric part |
| EP2001050A2 (en) * | 2006-03-28 | 2008-12-10 | Sony Chemical & Information Device Corporation | Method for manufacturing substrate having electric component |
| EP2001050A4 (en) * | 2006-03-28 | 2009-12-02 | Sony Chem & Inf Device Corp | Method for manufacturing substrate having electric component |
| US8402645B2 (en) | 2006-03-28 | 2013-03-26 | Sony Chemical & Information Device Corporation | Method for producing an electric component-mounted substrate |
| WO2008120513A1 (en) * | 2007-03-29 | 2008-10-09 | Citizen Holdings Co., Ltd. | Electrode terminal connecting structure of multilayer substrate |
| JP2013060008A (en) * | 2011-09-14 | 2013-04-04 | Xerox Corp | In situ flexible circuit embossing to form electrical interconnect |
| US9741971B2 (en) | 2013-12-10 | 2017-08-22 | Samsung Display Co., Ltd. | Flexible display device and method of manufacturing the same |
| CN107155260A (en) * | 2016-03-04 | 2017-09-12 | 富士通株式会社 | Electronic installation and the method for manufacturing electronic installation |
| CN107155260B (en) * | 2016-03-04 | 2019-05-21 | 富士通株式会社 | Electronic device and method for manufacturing electronic device |
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