TWI420155B - Method for manufacturing optical module and display device - Google Patents
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本發明關於一種光學模組及顯示裝置之製造方法，尤指一種可用於雙折射透鏡製程之切割方法。The invention relates to an optical module and a manufacturing method of the display device, in particular to a cutting method which can be used in a birefringent lens process.
一般而言，人造立體影像成像原理在於模擬真實狀況，產生真正立體物體存在，或將不同影像(成對立體影像)分別投影到左右眼，提供額外的深度資訊以形成立體影像。習知的立體影像成像技術可分成三種：全像式、平面式及成對立體影像式。由於全像式與平面式具有大量資料處理上的困難以及顯示效果不佳的缺點，近年來立體影像顯示器的研究以成對立體影像式為主。成對立體影像式中，又以空間多工式的立體顯示技術為主要應用的技術。In general, the principle of artificial stereoscopic image imaging is to simulate the real situation, to generate the existence of a true solid object, or to project different images (paired stereo images) to the left and right eyes, respectively, to provide additional depth information to form a stereoscopic image. The conventional stereo image imaging technology can be divided into three types: holographic, planar, and paired stereo images. In view of the fact that the hologram and the flat type have a large number of data processing difficulties and the display effect is not good, in recent years, the research on the stereoscopic image display is mainly based on the stereoscopic image type. In the paired stereoscopic image type, the spatially multiplexed stereoscopic display technology is the main application technology.
常見的習知空間多工立體顯示器所使用的光學技術主要有斜紋光柵片(slanted lenticular lens)與視差屏障(parallax barrier)兩種。由於斜紋光柵片技術不會有亮度損耗，相較於視差屏障技術，斜紋光柵片技術有更好的亮度優勢。欲達到斜紋光柵片技術之顯示優勢，又同時可以有2D/3D的切換功能，可在液晶顯示器上設置切換元件，並且搭配雙折射透鏡(birefringence lens)，以構成一組2D/3D可切換的立體顯示器。The optical techniques used in common conventional spatial multiplexed stereoscopic displays are mainly slanted lenticular lenses and parallax barriers. Because the twill grating technology does not have brightness loss, the twill grating technology has a better brightness advantage than the parallax barrier technology. In order to achieve the display advantages of the twill grating technology, and also have the 2D/3D switching function, a switching element can be arranged on the liquid crystal display, and a birefringence lens is matched to form a set of 2D/3D switchable. Stereo display.
在製造雙折射透鏡的過程中，一般是先在一大片玻璃基板上形成透鏡結構，之後再利用傳統切割方式(例如刀輪切割)進行裂片，以形成多個雙折射透鏡。然而，在裂片的過程中，往往會造成透鏡結構與玻璃基板分離，使得雙折射透鏡的生產良率大為降低。In the process of manufacturing a birefringent lens, a lens structure is generally formed on a large glass substrate, and then a dicing is performed by a conventional cutting method (for example, cutter wheel cutting) to form a plurality of birefringent lenses. However, in the process of splitting, the lens structure is often separated from the glass substrate, so that the production yield of the birefringent lens is greatly reduced.
因此，本發明的目的之一在於提供一種光學模組及顯示裝置之製造方法，利用雷射與刀具分別切割透鏡結構與基板，以解決上述問題。Therefore, an object of the present invention is to provide an optical module and a method of manufacturing the display device, which use the laser and the cutter to respectively cut the lens structure and the substrate to solve the above problem.
根據一實施例，本發明之光學模組之製造方法包含：提供一板材，板材包含一透鏡結構以及一基板，透鏡結構形成在基板之一第一表面上；以一雷射在透鏡結構上切割出一溝槽，使基板之第一表面顯露於溝槽；以一刀具在基板之一第二表面上切割出一切割線，第二表面與第一表面相對，切割線與溝槽相對；以及將板材自切割線處裂開。According to an embodiment, a method of fabricating an optical module of the present invention comprises: providing a plate comprising a lens structure and a substrate, the lens structure being formed on a first surface of the substrate; and cutting by a laser on the lens structure Forming a groove to expose the first surface of the substrate to the trench; cutting a cutting line on a second surface of the substrate by a cutter, the second surface being opposite to the first surface, the cutting line being opposite to the groove; The plate is split from the cutting line.
根據另一實施例，本發明之顯示裝置之製造方法包含：提供一板材，板材包含一透鏡結構以及一基板，透鏡結構形成在基板之一第一表面上；以一雷射在透鏡結構上切割出一溝槽，使基板之第一表面顯露於溝槽；以一刀具在基板之一第二表面上切割出一切割線，第二表面與第一表面相對，切割線與溝槽相對；將板材自切割線處裂開，以形成二光學模組；將光學模組設置於一液晶模組上；以及將液晶模組設置在一顯示模組上。According to another embodiment, a method of fabricating a display device of the present invention includes: providing a plate material comprising a lens structure and a substrate, the lens structure being formed on a first surface of the substrate; and cutting by a laser on the lens structure Forming a groove to expose the first surface of the substrate to the trench; cutting a cutting line on the second surface of the substrate by a cutter, the second surface is opposite to the first surface, and the cutting line is opposite to the groove; The plate is split from the cutting line to form two optical modules; the optical module is disposed on a liquid crystal module; and the liquid crystal module is disposed on a display module.
根據另一實施例，本發明之光學模組之製造方法包含：提供一板材，板材包含一透鏡結構、一第一基板、一第二基板以及一第一液晶材料，第一基板位於透鏡結構與第二基板之間，第一液晶材料設置於第一基板與第二基板之間；以一雷射在透鏡結構上切割出一溝槽，使第一基板顯露於溝槽；以一刀具通過溝槽在第一基板上切割出一第一切割線；以刀具在第二基板上切割出一第二切割線，第二切割線與第一切割線相對；以及將板材自第一切割線與第二切割線處裂開。According to another embodiment, a method of manufacturing an optical module of the present invention includes: providing a plate material comprising a lens structure, a first substrate, a second substrate, and a first liquid crystal material, the first substrate being located in the lens structure and Between the second substrates, the first liquid crystal material is disposed between the first substrate and the second substrate; a trench is cut on the lens structure by a laser to expose the first substrate to the trench; The groove cuts a first cutting line on the first substrate; the second cutting line is cut on the second substrate by the cutter, the second cutting line is opposite to the first cutting line; and the sheet is cut from the first cutting line The second cutting line is split.
根據另一實施例，本發明之顯示裝置之製造方法包含：提供一板材，板材包含一透鏡結構、一第一基板、一第二基板以及一第一液晶材料，第一基板位於透鏡結構與第二基板之間，第一液晶材料設置於第一基板與第二基板之間；以一雷射在透鏡結構上切割出一溝槽，使第一基板顯露於溝槽；以一刀具通過溝槽在第一基板上切割出一第一切割線；以刀具在第二基板上切割出一第二切割線，第二切割線與第一切割線相對；將板材自第一切割線與第二切割線處裂開，以形成二光學模組；將光學模組設置於一顯示模組上。According to another embodiment, a method of manufacturing a display device of the present invention includes: providing a plate material comprising a lens structure, a first substrate, a second substrate, and a first liquid crystal material, wherein the first substrate is located in the lens structure and Between the two substrates, the first liquid crystal material is disposed between the first substrate and the second substrate; a trench is cut on the lens structure by a laser to expose the first substrate to the trench; Cutting a first cutting line on the first substrate; cutting a second cutting line on the second substrate by the cutter, the second cutting line is opposite to the first cutting line; cutting the sheet from the first cutting line and the second cutting line The line is split to form two optical modules; the optical module is disposed on a display module.
綜上所述，由於本發明是先利用雷射在透鏡結構上切割出溝槽，使基板顯露於溝槽，之後再利用刀具在基板上對應溝槽的位置處切割出切割線，因此在沿切割線進行裂片時，可確保透鏡結構不會與基板分離，進而提高光學模組的生產良率。In summary, the present invention firstly uses a laser to cut a groove on the lens structure to expose the substrate to the groove, and then uses a cutter to cut the cutting line at a position corresponding to the groove on the substrate, so When the cutting line is split, it ensures that the lens structure is not separated from the substrate, thereby improving the production yield of the optical module.
關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.
請參閱第1圖以及第2圖，第1圖為根據本發明一實施例之光學模組之製造方法的流程圖，第2圖為搭配第1圖的製程示意圖。首先，執行步驟S10，提供一板材1，其中板材1包含一透鏡結構10以及一基板12，且透鏡結構10形成在基板12之一第一表面120上，如第2圖(A)所示。於此實施例中，基板12可為玻璃基板，但不以此為限。接著，執行步驟S12，以一雷射2在透鏡結構10上切割出一溝槽100，並且使基板12之第一表面120顯露於溝槽100，如第2圖(B)與第2圖(C)所示。接著，執行步驟S14，將板材1翻面，並且以一刀具3在基板12之一第二表面122上切割出一切割線124，其中第二表面122與第一表面120相對，且切割線124與溝槽100相對，更明確地說，切割線124實質上係對準於溝槽100，如第2圖(C)所示。最後，執行步驟S16，將板材1自切割線124處裂開。根據上述的切割方式，即可將板材1切割成多個由透鏡結構10以及基板12構成的光學模組。Referring to FIG. 1 and FIG. 2, FIG. 1 is a flow chart showing a method of manufacturing an optical module according to an embodiment of the present invention, and FIG. 2 is a schematic view showing a process of the first embodiment. First, in step S10, a sheet 1 is provided, wherein the sheet 1 comprises a lens structure 10 and a substrate 12, and the lens structure 10 is formed on one of the first surfaces 120 of the substrate 12, as shown in Fig. 2(A). In this embodiment, the substrate 12 can be a glass substrate, but is not limited thereto. Next, step S12 is performed to cut a trench 100 on the lens structure 10 by a laser 2, and expose the first surface 120 of the substrate 12 to the trench 100, as shown in FIG. 2(B) and FIG. 2 ( C) is shown. Next, step S14 is performed to turn the sheet 1 and a cutting line 124 is cut on the second surface 122 of the substrate 12 by a cutter 3, wherein the second surface 122 is opposite to the first surface 120, and the cutting line 124 Opposite the trenches 100, more specifically, the dicing lines 124 are substantially aligned with the trenches 100, as shown in Figure 2(C). Finally, step S16 is performed to rupture the sheet 1 from the cutting line 124. According to the above-described cutting method, the sheet material 1 can be cut into a plurality of optical modules composed of the lens structure 10 and the substrate 12.
如第2圖所示，經由雷射2切割透鏡結構10所形成的溝槽100大致上呈梯形。於此實施例中，溝槽100之底部寬度W1介於15至40微米之間，且該溝槽之頂部寬度W2介於200至400微米之間。此外，由於溝槽100是經由雷射2切割形成，若以電子顯微鏡觀察溝槽100之四周，會發現有燒焦的痕跡產生。As shown in Fig. 2, the trench 100 formed by the laser-cutting lens structure 10 is substantially trapezoidal. In this embodiment, the bottom width W1 of the trench 100 is between 15 and 40 microns, and the top width W2 of the trench is between 200 and 400 microns. Further, since the groove 100 is formed by laser 2 cutting, if the circumference of the groove 100 is observed by an electron microscope, a burnt mark is found.
於實際應用中，可在透鏡結構10中形成一對位標記102(alignment mark)，在執行步驟S12與S14的切割程序之前，先利用影像感測器，如電荷耦合元件(charge coupled device,CCD)影像感測器或互補式金氧半導體(complementary metal oxide semiconductor,CMOS)影像感測器，讀取對位標記102以進行對位。藉此，雷射2與刀具3即可準確地將溝槽100與切割線124切割在相對位置。此外，於實際應用中，基板12可為玻璃基板，雷射2可為聚焦雷射(focus laser)，且刀具3可為鑽石刀輪，但不以此為限。In practical applications, a pair of alignment marks 102 may be formed in the lens structure 10. Before performing the cutting process of steps S12 and S14, an image sensor such as a charge coupled device (CCD) is used. An image sensor or a complementary metal oxide semiconductor (CMOS) image sensor reads the alignment mark 102 for alignment. Thereby, the laser 2 and the cutter 3 can accurately cut the groove 100 and the cutting line 124 in a relative position. In addition, in practical applications, the substrate 12 may be a glass substrate, the laser 2 may be a focus laser, and the cutter 3 may be a diamond cutter wheel, but not limited thereto.
請參閱第3圖以及第4圖，第3圖為第1圖之步驟S10的詳細流程圖，第4圖為搭配第3圖的製程示意圖。首先，執行步驟S100，提供基板12，如第4圖(A)所示。接著，執行步驟S102，於基板12上形成一封膠層14，如第4圖(B)所示。接著，執行步驟S104，於封膠層14上形成複數個凹槽140以及對位標記102，如第4圖(C)所示。接著，執行步驟S106，於每一個凹槽140中填充一液晶材料16，如第4圖(D)所示。接著，執行步驟S108，於封膠層14上形成一薄膜18，如第4圖(E)所示。最後，執行步驟S110，固化液晶材料16。藉此，即完成上述板材1之製作。於此實施例中，上述之透鏡結構10包含封膠層14、液晶材料16以及薄膜18。於此實施例中，薄膜18可為聚酯薄膜(PET)，但不以此為限。Please refer to FIG. 3 and FIG. 4, FIG. 3 is a detailed flowchart of step S10 of FIG. 1, and FIG. 4 is a schematic diagram of a process with FIG. First, step S100 is performed to provide the substrate 12 as shown in Fig. 4(A). Next, in step S102, a glue layer 14 is formed on the substrate 12 as shown in FIG. 4(B). Next, in step S104, a plurality of grooves 140 and alignment marks 102 are formed on the sealant layer 14, as shown in FIG. 4(C). Next, in step S106, a liquid crystal material 16 is filled in each of the grooves 140, as shown in FIG. 4(D). Next, in step S108, a film 18 is formed on the sealant layer 14, as shown in FIG. 4(E). Finally, step S110 is performed to cure the liquid crystal material 16. Thereby, the production of the above-mentioned sheet material 1 is completed. In this embodiment, the lens structure 10 described above includes a sealant layer 14, a liquid crystal material 16, and a film 18. In this embodiment, the film 18 can be a polyester film (PET), but is not limited thereto.
請參閱第5圖，第5圖為根據本發明一實施例之顯示裝置4的示意圖。如第5圖所示，光學模組1'可藉由上述製程而形成。本發明可將光學模組1'設置於一液晶模組40上，並且將液晶模組40設置在一顯示模組42上。藉此，即完成顯示裝置4之製作。需說明的是，在將光學模組1'設置於液晶模組40上之前，上述之薄膜18會先被移除。於此實施例中，液晶模組40可為一扭曲向列型液晶模組，但不以此為限。於實際應用中，液晶模組40可包含上下兩片玻璃基板，並且於兩片玻璃基板之間設置透明電極(如氧化銦錫)、配向層以及液晶層等元件；顯示模組42可包含上下兩片玻璃基板，於兩片玻璃基板之間設置複數個畫素(例如複數個紅色畫素、綠色畫素以及藍色畫素)以及於上下兩片玻璃基板上設置偏光板等元件。Please refer to FIG. 5. FIG. 5 is a schematic diagram of a display device 4 according to an embodiment of the invention. As shown in Fig. 5, the optical module 1' can be formed by the above process. In the present invention, the optical module 1' can be disposed on a liquid crystal module 40, and the liquid crystal module 40 can be disposed on a display module 42. Thereby, the production of the display device 4 is completed. It should be noted that the film 18 is removed first before the optical module 1' is disposed on the liquid crystal module 40. In this embodiment, the liquid crystal module 40 can be a twisted nematic liquid crystal module, but is not limited thereto. In practical applications, the liquid crystal module 40 can include two upper and lower glass substrates, and a transparent electrode (such as indium tin oxide), an alignment layer, and a liquid crystal layer are disposed between the two glass substrates; the display module 42 can include upper and lower Two glass substrates are provided with a plurality of pixels (for example, a plurality of red pixels, green pixels, and blue pixels) between the two glass substrates, and elements such as a polarizing plate are disposed on the upper and lower glass substrates.
請參閱第6圖，第6圖為根據本發明另一實施例之顯示裝置4'的示意圖。如第6圖所示，顯示裝置4'與上述之顯示裝置4的主要不同之處在於顯示裝置4'之液晶模組40設置於光學模組1'與顯示模組42之間。Please refer to FIG. 6. FIG. 6 is a schematic diagram of a display device 4' according to another embodiment of the present invention. As shown in FIG. 6, the main difference between the display device 4' and the display device 4 described above is that the liquid crystal module 40 of the display device 4' is disposed between the optical module 1' and the display module 42.
請參閱第7圖以及第8圖，第7圖為根據本發明另一實施例之光學模組之製造方法的流程圖，第8圖為搭配第7圖的製程示意圖。首先，執行步驟S30，提供一板材5，其中板材5包含一透鏡結構50、一第一基板51、一第二基板52以及一第一液晶材料53，第一基板51位於透鏡結構50與第二基板52之間，且第一液晶材料53設置於第一基板51與第二基板52之間，如第8圖(A)所示。於此實施例中，第一基板51與第二基板52可為玻璃基板，但不以此為限。接著，執行步驟S32，以一雷射6在透鏡結構50上切割出一溝槽500，並且使第一基板51顯露於溝槽500，如第8圖(B)與第8圖(C)所示。接著，執行步驟S34，以一刀具7通過溝槽500在第一基板51上切割出一第一切割線510，如第8圖(C)所示。接著，執行步驟S36，將板材5翻面，並且以刀具7在第二基板52上切割出一第二切割線520，其中第二切割線520與第一切割線510相對，更明確地說，第二切割線520實質上係對準於第一切割線510，如第8圖(D)所示。最後，執行步驟S38，將板材5自第一切割線510與第二切割線520處裂開。根據上述的切割方式，即可將板材5切割成多個由透鏡結構50、第一基板51、第二基板52以及第一液晶材料53構成的光學模組。於此實施例中，第一液晶材料53可為一扭曲向列型液晶材料，但不以此為限。Please refer to FIG. 7 and FIG. 8 . FIG. 7 is a flow chart of a method for manufacturing an optical module according to another embodiment of the present invention, and FIG. 8 is a schematic diagram of a process with FIG. 7 . First, in step S30, a plate 5 is provided. The plate 5 includes a lens structure 50, a first substrate 51, a second substrate 52, and a first liquid crystal material 53. The first substrate 51 is located at the lens structure 50 and the second. Between the substrates 52, and the first liquid crystal material 53 is disposed between the first substrate 51 and the second substrate 52, as shown in Fig. 8(A). In this embodiment, the first substrate 51 and the second substrate 52 may be glass substrates, but not limited thereto. Next, step S32 is performed to cut a trench 500 on the lens structure 50 by a laser 6 and expose the first substrate 51 to the trench 500, as shown in FIGS. 8(B) and 8(C). Show. Next, in step S34, a first cutting line 510 is cut on the first substrate 51 by a cutter 7 through the groove 500, as shown in Fig. 8(C). Next, step S36 is performed to turn the sheet 5 over, and a second cutting line 520 is cut on the second substrate 52 by the cutter 7, wherein the second cutting line 520 is opposite to the first cutting line 510, more specifically, The second cutting line 520 is substantially aligned with the first cutting line 510 as shown in Fig. 8(D). Finally, step S38 is performed to split the sheet 5 from the first cutting line 510 and the second cutting line 520. According to the above-described cutting method, the sheet material 5 can be cut into a plurality of optical modules composed of the lens structure 50, the first substrate 51, the second substrate 52, and the first liquid crystal material 53. In this embodiment, the first liquid crystal material 53 can be a twisted nematic liquid crystal material, but is not limited thereto.
如第8圖所示，經由雷射6切割透鏡結構50所形成的溝槽500大致上呈梯形。於此實施例中，溝槽500之底部寬度W3介於150至400微米之間，且溝槽500之頂部寬度W4介於1200至1800微米之間。此外，由於溝槽500是經由雷射6切割形成，若以電子顯微鏡觀察溝槽500之四周，會發現有燒焦的痕跡產生。As shown in Fig. 8, the groove 500 formed by the laser 6-cut lens structure 50 is substantially trapezoidal. In this embodiment, the bottom width W3 of the trench 500 is between 150 and 400 microns, and the top width W4 of the trench 500 is between 1200 and 1800 microns. Further, since the groove 500 is formed by cutting by the laser 6, if the periphery of the groove 500 is observed by an electron microscope, a burnt mark is found.
於實際應用中，可在透鏡結構50中形成一對位標記502，在執行步驟S32與S36的切割程序之前，先利用影像感測器，如CCD影像感測器或互補式金氧半導體CMOS影像感測器，讀取對位標記502以進行對位。藉此，雷射6與刀具7即可準確地將溝槽500、第一切割線510與第二切割線520切割在相對位置。此外，於實際應用中，第一基板51與第二基板52可為玻璃基板，雷射60可為離焦雷射(defocus laser)，且刀具7可為鑽石刀輪，但不以此為限。In a practical application, a pair of bit marks 502 may be formed in the lens structure 50, and an image sensor such as a CCD image sensor or a complementary MOS film CMOS image may be used before the cutting process of steps S32 and S36 is performed. The sensor reads the alignment mark 502 for alignment. Thereby, the laser 6 and the cutter 7 can accurately cut the groove 500, the first cutting line 510 and the second cutting line 520 in opposite positions. In addition, in practical applications, the first substrate 51 and the second substrate 52 may be glass substrates, the laser 60 may be a defocus laser, and the tool 7 may be a diamond cutter wheel, but not limited thereto.
請參閱第9圖以及第10圖，第9圖為第7圖之步驟S30的詳細流程圖，第10圖為搭配第9圖的製程示意圖。首先，執行步驟S300，組合第一基板51與第二基板52，其中第一液晶材料53設置於第一基板51與第二基板52之間，如第10圖(A)所示。如第10圖(A)所示，第一基板51與第二基板52之間可更包含透明電極55(例如氧化銦錫)與配向層57。接著，執行步驟S302，於第一基板51上形成一封膠層54，如第10圖(B)所示。接著，執行步驟S304，於封膠層54上形成複數個凹槽540以及對位標記502，如第10圖(C)所示。接著，執行步驟S306，於每一個凹槽540中填充一第二液晶材料56，如第10圖(D)所示。接著，執行步驟S308，於封膠層54上形成一薄膜58，如第10圖(E)所示。最後，執行步驟S310，固化第二液晶材料56。藉此，即完成上述板材5之製作。於此實施例中，上述之透鏡結構50包含封膠層54、第二液晶材料56以及薄膜58。於此實施例中，薄膜58可為聚酯薄膜(PET)，但不以此為限。Please refer to FIG. 9 and FIG. 10, FIG. 9 is a detailed flowchart of step S30 of FIG. 7, and FIG. 10 is a schematic diagram of a process with FIG. First, step S300 is performed to combine the first substrate 51 and the second substrate 52, wherein the first liquid crystal material 53 is disposed between the first substrate 51 and the second substrate 52, as shown in FIG. 10(A). As shown in FIG. 10(A), a transparent electrode 55 (for example, indium tin oxide) and an alignment layer 57 may be further included between the first substrate 51 and the second substrate 52. Next, in step S302, a glue layer 54 is formed on the first substrate 51 as shown in FIG. 10(B). Next, in step S304, a plurality of grooves 540 and alignment marks 502 are formed on the sealant layer 54, as shown in FIG. 10(C). Next, in step S306, a second liquid crystal material 56 is filled in each of the grooves 540, as shown in FIG. 10(D). Next, in step S308, a film 58 is formed on the sealant layer 54, as shown in FIG. 10(E). Finally, step S310 is performed to cure the second liquid crystal material 56. Thereby, the production of the above-mentioned sheet 5 is completed. In this embodiment, the lens structure 50 described above includes a sealant layer 54, a second liquid crystal material 56, and a film 58. In this embodiment, the film 58 may be a polyester film (PET), but is not limited thereto.
請參閱第11圖，第11圖為根據本發明另一實施例之顯示裝置8的示意圖。如第11圖所示，光學模組5'可藉由上述製程而形成。本發明可將光學模組5'設置於一顯示模組82上。藉此，即完成顯示裝置8之製作。需說明的是，在將光學模組5'設置於顯示模組82上之前，上述之薄膜58會先被移除。於實際應用中，顯示模組82可包含上下兩片玻璃基板，並且於兩片玻璃基板之間設置複數個畫素(例如複數個紅色畫素、綠色畫素以及藍色畫素)以及於上下兩片玻璃基板上設置偏光板等元件。Referring to FIG. 11, FIG. 11 is a schematic diagram of a display device 8 according to another embodiment of the present invention. As shown in Fig. 11, the optical module 5' can be formed by the above process. The optical module 5' can be disposed on a display module 82. Thereby, the production of the display device 8 is completed. It should be noted that the film 58 is removed first before the optical module 5' is disposed on the display module 82. In practical applications, the display module 82 can include two upper and lower glass substrates, and a plurality of pixels (for example, a plurality of red pixels, green pixels, and blue pixels) are disposed between the two glass substrates. Components such as a polarizing plate are disposed on the two glass substrates.
請參閱第12圖，第12圖為根據本發明另一實施例之顯示裝置8'的示意圖。如第12圖所示，顯示裝置8'與上述之顯示裝置8的主要不同之處在於顯示裝置8'之光學模組5'是以第二基板52貼設於顯示模組82上。Please refer to FIG. 12, which is a schematic diagram of a display device 8' according to another embodiment of the present invention. As shown in FIG. 12, the main difference between the display device 8' and the display device 8 described above is that the optical module 5' of the display device 8' is attached to the display module 82 by the second substrate 52.
相較於先前技術，由於本發明是先利用雷射在透鏡結構上切割出溝槽，使基板顯露於溝槽，之後再利用刀具在基板上對應溝槽的位置處切割出切割線，因此在沿切割線進行裂片時，可確保透鏡結構不會與基板分離，進而提高光學模組的生產良率。Compared with the prior art, since the present invention firstly uses a laser to cut a groove on the lens structure, the substrate is exposed to the groove, and then the cutting line is cut at a position corresponding to the groove on the substrate by the cutter. When the lobes are cut along the cutting line, it is ensured that the lens structure is not separated from the substrate, thereby improving the production yield of the optical module.
以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
1、5．．．板材1, 5. . . Plate
1'、5'．．．光學模組1', 5'. . . Optical module
2、6．．．雷射2, 6. . . Laser
3、7．．．刀具3, 7. . . Tool
4、4'、8、8'．．．顯示裝置4, 4', 8, 8'. . . Display device
10、50．．．透鏡結構10, 50. . . Lens structure
12．．．基板12. . . Substrate
14、54．．．封膠層14, 54. . . Sealing layer
16．．．液晶材料16. . . Liquid crystal material
18、58．．．薄膜18, 58. . . film
40．．．液晶模組40. . . LCD module
42、82．．．顯示模組42, 82. . . Display module
51．．．第一基板51. . . First substrate
52．．．第二基板52. . . Second substrate
53．．．第一液晶材料53. . . First liquid crystal material
55．．．透明電極55. . . Transparent electrode
56．．．第二液晶材料56. . . Second liquid crystal material
57．．．配向層57. . . Alignment layer
100、500．．．溝槽100, 500. . . Trench
102、502．．．對位標記102, 502. . . Alignment mark
120．．．第一表面120. . . First surface
122．．．第二表面122. . . Second surface
124．．．切割線124. . . Cutting line
140、540．．．凹槽140, 540. . . Groove
510．．．第一切割線510. . . First cutting line
520．．．第二切割線520. . . Second cutting line
W1、W3．．．底部寬度W1, W3. . . Bottom width
W2、W4．．．頂部寬度W2, W4. . . Top width
S10-S16、S100-S110、S30-S38、S300-S310．．．步驟S10-S16, S100-S110, S30-S38, S300-S310. . . step
第1圖為根據本發明一實施例之光學模組之製造方法的流程圖。1 is a flow chart of a method of fabricating an optical module in accordance with an embodiment of the present invention.
第2圖為搭配第1圖的製程示意圖。Figure 2 is a schematic diagram of the process with the first figure.
第3圖為第1圖之步驟S10的詳細流程圖。Fig. 3 is a detailed flowchart of step S10 of Fig. 1.
第4圖為搭配第3圖的製程示意圖。Figure 4 is a schematic diagram of the process with the third drawing.
第5圖為根據本發明一實施例之顯示裝置的示意圖。Figure 5 is a schematic diagram of a display device in accordance with an embodiment of the present invention.
第6圖為根據本發明另一實施例之顯示裝置的示意圖。Figure 6 is a schematic diagram of a display device in accordance with another embodiment of the present invention.
第7圖為根據本發明另一實施例之光學模組之製造方法的流程圖。Figure 7 is a flow chart of a method of fabricating an optical module in accordance with another embodiment of the present invention.
第8圖為搭配第7圖的製程示意圖。Figure 8 is a schematic diagram of the process with Figure 7.
第9圖為第7圖之步驟S30的詳細流程圖。Fig. 9 is a detailed flowchart of step S30 of Fig. 7.
第10圖為搭配第9圖的製程示意圖。Figure 10 is a schematic diagram of the process with the Figure 9.
第11圖為根據本發明另一實施例之顯示裝置的示意圖。Figure 11 is a schematic view of a display device in accordance with another embodiment of the present invention.
第12圖為根據本發明另一實施例之顯示裝置的示意圖。Figure 12 is a schematic view of a display device in accordance with another embodiment of the present invention.
S10-S16．．．步驟S10-S16. . . step
Claims (20)
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| TW200303296A (en) * | 2001-11-08 | 2003-09-01 | Sharp Kk | Method and apparatus for cutting apart a glass substrate, liquid crystal panel, and apparatus for fabricating a liquid crystal panel |
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| TW200626275A (en) * | 2004-10-05 | 2006-08-01 | Koninkl Philips Electronics Nv | Method for laser dicing of a substrate |
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