TWI419852B - Separating device and separation method for plane display body substrate - Google Patents
Separating device and separation method for plane display body substrate Download PDFInfo
- Publication number
- TWI419852B TWI419852B TW098106310A TW98106310A TWI419852B TW I419852 B TWI419852 B TW I419852B TW 098106310 A TW098106310 A TW 098106310A TW 98106310 A TW98106310 A TW 98106310A TW I419852 B TWI419852 B TW I419852B
- Authority
- TW
- Taiwan
- Prior art keywords
- panel
- platforms
- flat display
- separating
- platform
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008051245 | 2008-02-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200946469A TW200946469A (en) | 2009-11-16 |
TWI419852B true TWI419852B (zh) | 2013-12-21 |
Family
ID=41016179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098106310A TWI419852B (zh) | 2008-02-29 | 2009-02-27 | Separating device and separation method for plane display body substrate |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5178814B2 (ja) |
KR (1) | KR101171875B1 (ja) |
CN (1) | CN101959813B (ja) |
TW (1) | TWI419852B (ja) |
WO (1) | WO2009107794A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109437536B (zh) * | 2018-11-30 | 2021-01-15 | 武汉华星光电技术有限公司 | 切割裂片装置及切割裂片方法 |
CN109531829B (zh) * | 2019-01-28 | 2021-06-15 | 林华勇 | 一种拉伸型led灯丝灯的陶瓷基板条拆分器 |
CN109968283B (zh) * | 2019-03-25 | 2024-04-02 | 林华勇 | 一种拉伸顶压型led灯丝灯的基板条拆分器及其拆分方法 |
CN110789004B (zh) * | 2019-11-20 | 2021-10-29 | 苏州科韵激光科技有限公司 | 一种自适应精准定位可移动切割平台及切割设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003089538A (ja) * | 2001-06-28 | 2003-03-28 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板のブレイク装置及びブレイク方法 |
US20040040997A1 (en) * | 2001-01-17 | 2004-03-04 | Hiroki Ueyama | Scribing and breaking apparatus, system therefor, and scribing and breaking method |
CN1646282A (zh) * | 2002-04-01 | 2005-07-27 | 三星钻石工业股份有限公司 | 脆性材料基板的分断方法以及采用该方法的分断装置 |
CN1735489A (zh) * | 2002-11-22 | 2006-02-15 | 三星钻石工业股份有限公司 | 基板分断***、基板制造装置、基板切割方法以及基板分断方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3792508B2 (ja) * | 2000-12-19 | 2006-07-05 | 三星ダイヤモンド工業株式会社 | 貼り合わせ脆性基板の分断方法 |
JP4482328B2 (ja) * | 2001-06-28 | 2010-06-16 | 三星ダイヤモンド工業株式会社 | ブレイク装置及びマザー貼合基板の分断システム |
JP3887394B2 (ja) * | 2004-10-08 | 2007-02-28 | 芝浦メカトロニクス株式会社 | 脆性材料の割断加工システム及びその方法 |
-
2009
- 2009-02-27 WO PCT/JP2009/053725 patent/WO2009107794A1/ja active Application Filing
- 2009-02-27 JP JP2010500778A patent/JP5178814B2/ja not_active Expired - Fee Related
- 2009-02-27 CN CN2009801066978A patent/CN101959813B/zh not_active Expired - Fee Related
- 2009-02-27 TW TW098106310A patent/TWI419852B/zh not_active IP Right Cessation
- 2009-02-27 KR KR1020107017662A patent/KR101171875B1/ko not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040040997A1 (en) * | 2001-01-17 | 2004-03-04 | Hiroki Ueyama | Scribing and breaking apparatus, system therefor, and scribing and breaking method |
JP2003089538A (ja) * | 2001-06-28 | 2003-03-28 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板のブレイク装置及びブレイク方法 |
CN1646282A (zh) * | 2002-04-01 | 2005-07-27 | 三星钻石工业股份有限公司 | 脆性材料基板的分断方法以及采用该方法的分断装置 |
CN1735489A (zh) * | 2002-11-22 | 2006-02-15 | 三星钻石工业股份有限公司 | 基板分断***、基板制造装置、基板切割方法以及基板分断方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101959813B (zh) | 2013-11-20 |
TW200946469A (en) | 2009-11-16 |
KR101171875B1 (ko) | 2012-08-07 |
CN101959813A (zh) | 2011-01-26 |
JP5178814B2 (ja) | 2013-04-10 |
KR20100118981A (ko) | 2010-11-08 |
JPWO2009107794A1 (ja) | 2011-07-07 |
WO2009107794A1 (ja) | 2009-09-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4965632B2 (ja) | 基板分断システム、基板製造装置、基板スクライブ方法および基板分断方法 | |
JP4373980B2 (ja) | 基板分断システムおよび基板分断方法 | |
JP4739024B2 (ja) | 基板加工方法、基板加工装置および基板搬送機構、基板分離装置 | |
US9021837B2 (en) | Method of cleaving and separating a glass sheet and apparatus for cleaving and separating a glass sheet | |
US7699200B2 (en) | Scribing and breaking apparatus and system therefor | |
KR101152221B1 (ko) | 보호시트 분리방법 및 보호시트 분리장치 | |
TWI410313B (zh) | Substrate breaking device | |
TWI400203B (zh) | 切割裝置、及使用該切割裝置之基板切斷裝置與方法 | |
TWI419852B (zh) | Separating device and separation method for plane display body substrate | |
JP2004348111A (ja) | 表示装置の製造方法及び製造装置 | |
JP6364789B2 (ja) | スクライブ装置 | |
CN107151091B (zh) | 划片设备 | |
JP5447992B2 (ja) | 基板分断装置 | |
CN105313227A (zh) | 脆性材料基板的端材分离方法及端材分离装置 | |
WO2018016038A1 (ja) | 切断装置及び切断方法 | |
JP2020075381A (ja) | ブレイク装置 | |
JP2007099553A (ja) | 板ガラスの加工方法及びその装置 | |
TW201921422A (zh) | 粉塵飛散防止裝置及具備此粉塵飛散防止裝置的基板加工裝置 | |
TW202032702A (zh) | 基板移送及切斷裝置與利用其之基板移送及切斷方法 | |
TW201920018A (zh) | 帶電防止裝置及具備此帶電防止裝置的基板加工裝置 | |
TW202120392A (zh) | 玻璃板捆包體及其製造方法 | |
TW201919836A (zh) | 粉塵飛散防止裝置及具備此粉塵飛散防止裝置的基板加工裝置 | |
TW201910282A (zh) | 裂斷裝置 | |
JP2004106416A (ja) | スクライブ装置 | |
KR20100055771A (ko) | 기판 이송 장치 및 기판 이송 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |