TWI419787B - Apparatus for punching stiffener and stiffener-attaching system using the same - Google Patents
Apparatus for punching stiffener and stiffener-attaching system using the same Download PDFInfo
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- TWI419787B TWI419787B TW099123235A TW99123235A TWI419787B TW I419787 B TWI419787 B TW I419787B TW 099123235 A TW099123235 A TW 099123235A TW 99123235 A TW99123235 A TW 99123235A TW I419787 B TWI419787 B TW I419787B
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- reinforcing member
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- pcb
- module
- hole
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
- B21D28/12—Punching using rotatable carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
- B21D35/001—Shaping combined with punching, e.g. stamping and perforating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/04—Movable or exchangeable mountings for tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Tyre Moulding (AREA)
Description
本發明專利申請案是主張已向韓國智慧財產局所申請之韓國發明專利申請案之優先權，該申請案之申請案號為：10-2009-0065330；申請日為：2009年7月17日，本發明專利申請案所揭露之內容是參照並結合該韓國發明專利申請案之全部內容。The patent application of the present invention claims the priority of the Korean invention patent application filed by the Korea Intellectual Property Office. The application number of the application is: 10-2009-0065330; the application date is: July 17, 2009. The disclosure of the present patent application is hereby incorporated by reference in its entirety in its entirety in its entirety in the the the the the the the the
本發明是有關於一種用於沖壓一補強件之裝置及使用該補強件沖壓裝置之補強件黏著系統，更特別的是，有關於一種用於沖壓一補強件之裝置，根據一產品之需求規格，可隨意提供該補強件在需求的方向產生毛邊，以及使用該補強件沖壓裝置之補強件黏著系統。The present invention relates to a device for stamping a reinforcing member and a reinforcing member bonding system using the reinforcing member pressing device, and more particularly to a device for pressing a reinforcing member according to a product specification The reinforcing member can be freely provided with a burr in the direction of demand, and a reinforcing member adhesion system using the reinforcing member pressing device.
一般而言，補強件(stiffeners)，例如在基板製程中，該補強件係用於保護在印刷電路版(printed circuit board，PCB)上成型之圖案，而該補強件係黏著在該圖案上。在該補強件之一側表面上具有一層膠著劑(adhesive)，該膠著劑具有一種特性，也就是當加熱該膠著劑時，該膠著劑便會溶化並黏著。In general, stiffeners, such as in a substrate process, are used to protect a pattern formed on a printed circuit board (PCB) to which the reinforcement is attached. An adhesive layer is provided on one side surface of the reinforcing member, and the adhesive has a characteristic that the adhesive dissolves and adheres when the adhesive is heated.
通常使用者是利用手工黏著該補強件，使用者是利用鐵將該經沖壓後之補強件並加壓黏著在該PCB上。Usually, the user manually attaches the reinforcing member, and the user presses the stamped reinforcing member to the PCB by using iron.
然而，使用者藉由手工來黏著該補強件，會需要額 外的人力資源及時間。However, the user will need to add the reinforcement by hand. Human resources and time outside.
為了解決上述問題，因而提出了可自動化黏著補強件之補強件黏著裝置。補強件黏著裝置沖壓該補強件，並在此階段吸附該經沖壓後之補強件，再轉運該被吸附之補強件至PCB上，然後黏著該補強件於該PCB上。然而，當沖壓補強件時，提供在該PCB上之補強件產品中往往只能在一個方向產生毛邊，所以，當沖壓補強件時，在補強件產品的另一個方向產生毛邊，便會造成該補強件無法使用。In order to solve the above problems, a reinforcing member adhesion device capable of automatically bonding the reinforcing members is proposed. The reinforcing member adhesive device punches the reinforcing member, and at this stage, adsorbs the stamped reinforcing member, and then transports the adsorbed reinforcing member to the PCB, and then adheres the reinforcing member to the PCB. However, when the reinforcing member is punched, the reinforcing member provided on the PCB can only produce burrs in one direction, so when the reinforcing member is punched, burrs are generated in the other direction of the reinforcing member product, which causes The reinforcement cannot be used.
本發明係提供一種補強件沖壓裝置，根據一PCB產品之需求規格，其可隨意提供該補強件在所需求的方向產生毛邊；以及一使用該補強件沖壓裝置之補強件黏著系統。The present invention provides a reinforcing member stamping device which can optionally provide a burr in a desired direction according to a required specification of a PCB product; and a reinforcing member adhesive system using the reinforcing member stamping device.
根據本發明之一實施態樣，其係提供一種補強件沖壓裝置，該裝置包括：一模件，其係具有一成孔形成在其中；一沖壓機，其係設置在該模件之較下側，可在該成孔中升降，並用於沖壓該補強件；及一旋轉單元，其係設置在該成孔之較上側，用以翻轉經沖壓後之補強件的上下表面。According to an embodiment of the present invention, there is provided a reinforcing member pressing device, comprising: a module having a hole formed therein; and a punching machine disposed at a lower portion of the module The side may be raised and lowered in the hole and used to punch the reinforcing member; and a rotating unit is disposed on the upper side of the hole for inverting the upper and lower surfaces of the stamped reinforcing member.
該旋轉單元可包括：一偏心連桿(eccentric link)，當該偏心連桿連接至一驅動馬達之傳動軸時便可以被轉動；一旋轉桿，其係垂直連接至該偏心連桿之一端，其另一端則設置在該成孔之較上端處；及一吸附墊，其 係形成在該旋轉桿之一端，用以吸附該形成之補強件。The rotating unit may include: an eccentric link that can be rotated when the eccentric link is connected to a drive shaft of a drive motor; and a rotary lever that is vertically connected to one end of the eccentric link, The other end is disposed at the upper end of the hole; and an adsorption pad, It is formed at one end of the rotating rod for adsorbing the formed reinforcing member.
一第一元件座空間，其係用以容納該旋轉單元之一端於其中，形成在該模件成孔之較上方處；及一第二元件座空間，其係成形在該第一元件座空間之一側，當該旋轉單元旋轉時，便可用以容納該旋轉單元之一端於其中。該補強件沖壓裝置更可包含一感測器，該感測器係設置在該第二元件座空間之下表面，用以偵測該被旋轉及轉運的旋轉單元是否置入在該第二單元座空間內；及一控制器，其係用以控制該旋轉單元，根據該感測器於執行偵測時所測得之數值，來決定該補強件之轉運是否有藉由該旋轉單元而執行運作。a first component seating space for accommodating one end of the rotating unit therein, formed at an upper portion of the module, and a second component seating space formed in the first component housing space One side, when the rotating unit rotates, can be used to accommodate one of the rotating units therein. The reinforcing member stamping device may further include a sensor disposed on a lower surface of the second component housing space for detecting whether the rotated and transported rotating unit is placed in the second unit And a controller for controlling the rotating unit to determine whether the transport of the reinforcing member is performed by the rotating unit according to the value measured by the sensor when performing the detecting Operation.
根據本發明之另一個實施態樣，其係提供一種補強件黏著系統，該系統包括：一補強件供應裝置，其係用以提供一纏繞成捲狀之輔助材料；一補強件沖壓裝置，其係用於沖壓藉由補強件供應裝置所提供之補強件，並隨意地旋轉該補強件；一補強件轉運裝置，其係用於轉運經由補強件沖壓裝置所沖壓後之補強件；及一補強件黏著裝置，其係用以黏著經由該補強件轉運裝置所轉運之補強件至PCB上。According to another embodiment of the present invention, there is provided a reinforcing member adhesion system, the system comprising: a reinforcing member supply device for providing an auxiliary material wound in a roll shape; and a reinforcing member pressing device, It is used for stamping the reinforcing member provided by the reinforcing member supply device and rotating the reinforcing member arbitrarily; a reinforcing member transfer device for transferring the reinforcing member punched by the reinforcing member punching device; and a reinforcing member An adhesive device for adhering a reinforcing member transported through the reinforcing member transfer device to the PCB.
該補強件供應裝置，包括有：一補強件捲繞滾軸，其係用以纏繞一補強件原物料，並持續地提供該被纏繞補強件原物料至該補強件沖壓裝置；以及一料帶捲繞滾軸，其係用以纏繞一經由補強件沖壓裝置所沖壓後之補強件料帶。該補強件沖壓裝置，包括有：一模件，其係具有成孔形成於其中；一沖壓機，其係設置在該模件之 較下側，可在該成孔中升降，並沖壓該補強件；以及一旋轉單元，其係設置在該成孔之較上側，用以翻轉經過沖壓後之補強件的上下表面。該補強件轉運裝置，包括有：一往復轉運單元，其係用以在該補強件沖壓裝置之較上側及該PCB座單元之較上側之間，進行往復運動；以及一吸附墊，其係形成在該往復轉運單元之較下側，用以吸附該經由補強件沖壓裝置所沖壓後之補強件，並轉運該補強件至該置入在PCB座單元中之PCB上。The reinforcing member supply device comprises: a reinforcing member winding roller for winding a reinforcing member raw material, and continuously providing the wrapped reinforcing member raw material to the reinforcing member pressing device; and a feeding belt A winding roller for winding a reinforcing material strip stamped by a reinforcing member stamping device. The reinforcing member pressing device comprises: a module having a hole formed therein; and a punching machine disposed on the module On the lower side, the reinforcing member may be lifted and lowered in the hole, and a rotating unit is disposed on the upper side of the hole for inverting the upper and lower surfaces of the punched reinforcing member. The reinforcing member transfer device comprises: a reciprocating transfer unit for reciprocating between an upper side of the reinforcing member stamping device and an upper side of the PCB holder unit; and an adsorption pad formed On the lower side of the reciprocating unit, the reinforcing member stamped by the reinforcing member stamping device is adsorbed, and the reinforcing member is transported to the PCB placed in the PCB holder unit.
該補強件黏著系統更包括有：一沖壓機真空管線，其係形成並穿過該沖壓機之內部空間之中；一沖壓機真空裝置，其係藉由該沖壓機真空管線提供一真空壓力，以吸附置入在該沖壓機上表面之補強件；以及一控制器，當該補強件經沖壓時，其係用以控制該沖壓機真空裝置以進行運作，因此，該沖壓機真空裝置便可以吸附該補強件，並且，當該補強件就定位在該第一單元座空間時，該控制器便會控制該沖壓機真空裝置，以解除該沖壓機真空裝置之運作，因此，該旋轉單元便可以轉運該補強件至該PCB上。The reinforcing member adhesion system further comprises: a punch vacuum line formed and passed through the internal space of the punching machine; and a punch vacuum device that provides a vacuum pressure by the press vacuum line. a reinforcing member placed on the upper surface of the press; and a controller for controlling the press vacuum device to operate when the reinforcing member is stamped, so that the press vacuum device can Adsorbing the reinforcing member, and when the reinforcing member is positioned in the first unit housing space, the controller controls the press vacuum device to release the operation of the press vacuum device, and therefore, the rotating unit The reinforcement can be transferred to the PCB.
該補強件黏著系統更包括有一模件清潔單元，其係設置在該補強件轉運裝置之一側，該模件清潔單元包括有複數個清潔刷，當該補強件轉運裝置移動時，該模件清潔單元係用以清潔該模件之上表面，以及該補強件之上表面及側表面。該模件清潔單元更包括有一外來基板吸附部件，其係用以吸附該經由清潔刷所清潔後之外來基板，並卸下該外來基板。該補強件黏著裝置包括有： 一升降單元，其係設置在該補強件轉運裝置之一側，用以升降該補強件轉運裝置，並提供該補強件至該PCB上，並黏著該補強件至該PCB上；以及一PCB座單元，其係形成在該補強件轉運裝置之下方，其中該PCB是置入在該PCB座單元之上表面。The reinforcing member adhesive system further includes a module cleaning unit disposed on one side of the reinforcing member transfer device, the module cleaning unit including a plurality of cleaning brushes, the module is moved when the reinforcing member transfer device moves The cleaning unit is for cleaning the upper surface of the module, and the upper surface and the side surface of the reinforcing member. The module cleaning unit further includes an external substrate adsorbing member for adsorbing the external substrate cleaned by the cleaning brush and detaching the foreign substrate. The reinforcing member adhesive device comprises: a lifting unit disposed on one side of the reinforcing member transfer device for lifting and lowering the reinforcing member transfer device, and providing the reinforcing member to the PCB, and bonding the reinforcing member to the PCB; and a PCB seat A unit is formed below the reinforcement transfer device, wherein the PCB is placed on an upper surface of the PCB mount unit.
底下藉由具體實施例配合所附的圖式詳加說明，當更容易瞭解本發明的目的、技術內容、特點及其所達成的功效。The objects, technical features, features and effects achieved by the present invention will become more apparent from the detailed description of the embodiments and the accompanying drawings.
第1圖是根據本發明具體實施例中一補強件黏著系統之前視圖；第2圖是根據本發明具體實施例中一用於補強件沖壓裝置之平面示意圖；第3圖是根據第2圖中之A-A線剖面後之剖面示意圖；第4圖是根據第2圖中所說明之補強件沖壓裝置之立體圖；第5圖是根據本發明具體實施例中一旋轉單元之平面示意圖；第6圖是第5圖中所說明該旋轉單元之前視圖；第7圖是第1圖中所說明該補強件黏著系統之側視圖；以及第8圖是第1圖中A部分之放大示意圖。1 is a front view of a reinforcing member adhesive system according to an embodiment of the present invention; FIG. 2 is a plan view schematically showing a punching device for a reinforcing member according to an embodiment of the present invention; and FIG. 3 is a view according to FIG. FIG. 4 is a perspective view of a reinforcing member pressing device according to FIG. 2; FIG. 5 is a plan view of a rotating unit according to an embodiment of the present invention; FIG. 6 is a schematic view of a rotating unit according to a specific embodiment of the present invention; The front view of the rotary unit is illustrated in Fig. 5; the seventh view is a side view of the reinforcing member adhesion system illustrated in Fig. 1; and Fig. 8 is an enlarged schematic view of the portion A in Fig. 1.
請參閱第2圖至第6圖，根據本發明之具體實施例，該補強件沖壓裝置200包括有一模件210、一沖壓機220、及一旋轉單元230。Referring to FIGS. 2-6, the reinforcing member stamping apparatus 200 includes a module 210, a punch 220, and a rotating unit 230, in accordance with an embodiment of the present invention.
該模件210係以下列方式而形成，一成孔211係形成在該模件210中間，該沖壓機220係***至該成孔211之中，以沖壓該補強件。一第一單元座空間212，其係 具有一矩形的外形，形成在該成孔211之較上方，用以容納該旋轉單元230之一端於其中。一第一狹長槽214，其係形成在該第一單元座空間212之一側，用以容納該旋轉單元230之旋轉桿233於其中。The module 210 is formed in the following manner, a hole 211 is formed in the middle of the mold 210, and the punch 220 is inserted into the hole 211 to punch the reinforcing member. a first unit space 212, the system A rectangular outer shape is formed above the hole 211 for receiving one end of the rotating unit 230 therein. A first elongated slot 214 is formed on one side of the first unit seating space 212 for receiving the rotating rod 233 of the rotating unit 230 therein.
一第二單元座空間213，其係形成在該第一單元座空間212之後方(第2圖之右側)，當該旋轉單元230轉動時，該旋轉單元230之一端便會容納至該第二單元座空間213之中。該第二單元座空間213係具有一矩形的外形，以符合該旋轉單元230之一端；以及一第二狹長槽215，其係形成在該第二單元座空間213之一側，以容納該旋轉單元230之旋轉桿233於其中。a second unit seating space 213 is formed behind the first unit seating space 212 (on the right side of FIG. 2). When the rotating unit 230 rotates, one end of the rotating unit 230 is accommodated to the second In the unit seat space 213. The second unit housing space 213 has a rectangular outer shape to conform to one end of the rotating unit 230, and a second elongated slot 215 formed on one side of the second unit housing space 213 to accommodate the rotation. The rotating rod 233 of unit 230 is therein.
一感測器241，其係設置在該第二單件空間213之下表面，用以偵測該補強件是否已置入在該第二單元座空間213之中。在本發明具體實施例中，其係利用一光纖作為該感測器241。該感測器係用以偵測該補強件是否已置入在該第二單元座空間213之中，並將所測得之訊號傳送至一控制器250。一種偵測該補強件是否已置入在該第二單元座空間213之中之結構，其係藉由附著一壓力感測器至一輔助材料吸附線236上或該旋轉單元230之吸附墊234上，而且，其結構還利用了光纖作為感測器241。A sensor 241 is disposed on a lower surface of the second single-piece space 213 for detecting whether the reinforcing member has been placed in the second unit housing space 213. In a specific embodiment of the invention, an optical fiber is used as the sensor 241. The sensor is configured to detect whether the reinforcing member has been placed in the second unit housing space 213 and transmit the measured signal to a controller 250. A structure for detecting whether the reinforcing member has been placed in the second unit housing space 213 by attaching a pressure sensor to an auxiliary material adsorption line 236 or the adsorption pad 234 of the rotating unit 230 In addition, the structure also utilizes an optical fiber as the sensor 241.
該控制器250係根據該感測器241於偵測運作時所測得之數值，來控制藉由該旋轉單元230執行該補強件之翻運操作。換言之，當提供該補強件至第二單元座空間213未正常地轉運至一PCB時，該控制器250便會停 止該旋轉單元230之運作，因此，該控制器250可避免該補強件與該第二單元座空間213重疊的情況發生。The controller 250 controls the rewinding operation of the reinforcing member by the rotating unit 230 according to the value measured by the sensor 241 during the detecting operation. In other words, when the reinforcing member is provided until the second unit housing space 213 is not normally transferred to a PCB, the controller 250 stops. The operation of the rotating unit 230 is stopped, and therefore, the controller 250 can prevent the reinforcing member from overlapping with the second unit housing space 213.
該沖壓機220係設置在該模件210之較下側，其係在該成孔211中升降，並沖壓該補強件。The punch 220 is disposed on a lower side of the module 210, and is lifted and lowered in the hole 211, and the reinforcing member is punched.
一沖壓機真空管線221，其係形成並穿過該沖壓機220之內部空間中；一沖壓機真空裝置222，其係設置在該沖壓機220之一側，並藉由該沖壓機真空管線221來提供一真空壓力至該沖壓機220之較上方，該沖壓機真空裝置222提供一真空壓力以吸附置入在該沖壓機220之上表面之補強件。A press vacuum line 221 is formed and passed through the interior space of the press 220; a punch vacuum unit 222 is disposed on one side of the press 220 and is passed through the press vacuum line 221 To provide a vacuum pressure to the upper side of the press 220, the press vacuum unit 222 provides a vacuum pressure to adsorb the reinforcing member placed on the upper surface of the press 220.
當沖壓該補強件時，該控制器250係控制該沖壓機真空裝置222進行運作，以便該沖壓機真空裝置222可吸附該補強件。並且，當該經沖壓後之補強件被定位在該第一單元座空間212時，該控制器250係控制該沖壓機真空裝置222，以解除該沖壓機真空裝置222之運作，因此，該旋轉單元230便可轉運該補強件至該PCB上。When the reinforcing member is stamped, the controller 250 controls the press vacuum device 222 to operate so that the press vacuum device 222 can adsorb the reinforcing member. Moreover, when the stamped reinforcing member is positioned in the first unit housing space 212, the controller 250 controls the punch vacuum device 222 to release the operation of the punch vacuum device 222, and therefore, the rotation Unit 230 can transport the reinforcement to the PCB.
該旋轉單元230係設置在該模件210之一側，並用以翻轉經由沖壓機220沖壓後之補強件的上下表面。The rotating unit 230 is disposed on one side of the module 210 and is used to reverse the upper and lower surfaces of the reinforcing member punched by the punch 220.
該旋轉單元230包括一旋轉驅動單元231、一偏心連桿(eccentric link)232、一旋轉桿233、及一吸附墊234。當該偏心連桿232連接至一旋轉驅動單元231時，也就是一可轉動之旋轉圓缸，便可轉動該偏心連桿232。該旋轉桿233為一桿狀，其係垂直連接至該偏心連桿232之一端，並可依據其轉動而隨意地容納至該第 一狹長槽237及第二狹長槽238。而該旋轉桿233之一端則是任意地容納至該成孔211之第一元件座空間212及第二元件座空間213。該吸附墊234係形成在該旋轉桿233之一端，並用以吸附所形成的補強件。The rotating unit 230 includes a rotary driving unit 231, an eccentric link 232, a rotating rod 233, and an adsorption pad 234. When the eccentric link 232 is coupled to a rotary drive unit 231, that is, a rotatable rotary cylinder, the eccentric link 232 can be rotated. The rotating rod 233 is a rod shape which is vertically connected to one end of the eccentric link 232 and can be arbitrarily accommodated to the first according to the rotation thereof. An elongated slot 237 and a second elongated slot 238. One end of the rotating rod 233 is arbitrarily received into the first component space 212 and the second component space 213 of the hole 211. The adsorption pad 234 is formed at one end of the rotating rod 233 and is used for adsorbing the formed reinforcing member.
此外，一輔助材料真空產生器235(subsidiary material vacuum ejector)係設置在該旋轉驅動單元231之一側，該輔助材料吸附線236係形成在該旋轉桿233上，並使該輔助材料真空產生器235及該吸附墊234兩者相互連接。In addition, a subsidiary material vacuum ejector 235 is disposed on one side of the rotary driving unit 231, and the auxiliary material adsorption line 236 is formed on the rotating rod 233, and the auxiliary material vacuum generator is Both 235 and the adsorption pad 234 are connected to each other.
該補強件沖壓裝置200係具有上述之結構，如第2圖中所示，其運作方式將說明如下。The reinforcing member pressing device 200 has the above-described structure, as shown in Fig. 2, and its operation will be described below.
如第2圖中所述之補強件沖壓裝置200，當提供該補強件至該模件210及該沖壓機220之間時，該沖壓機220上升並沖壓該補強件。藉由該沖壓機220所沖壓之補強件具有毛邊產生在該補強件之較下側，並且被定位在該沖壓機220之上表面。The reinforcing member pressing device 200 as described in FIG. 2, when the reinforcing member is provided between the module 210 and the punching machine 220, the punching machine 220 ascends and punches the reinforcing member. The reinforcing member stamped by the punch 220 has burrs on the lower side of the reinforcing member and is positioned on the upper surface of the punch 220.
當需要在該補強件之較下側產生毛邊之補強件時，一補強件轉運裝置300轉運並吸附該補強件至該PCB，稍後將加以說明該補強件轉運裝置300。When it is desired to produce a burr reinforcement on the lower side of the reinforcing member, a reinforcing member transfer device 300 transports and adsorbs the reinforcing member to the PCB, which will be described later.
同時，當需要在該補強件之較下側產生毛邊之補強件時，該旋轉單元230便開始運作，並且該旋轉單元230之該吸附墊234移動至該第一單元座空間212。Meanwhile, when a reinforcing member for generating a burr on the lower side of the reinforcing member is required, the rotating unit 230 starts to operate, and the adsorption pad 234 of the rotating unit 230 moves to the first unit housing space 212.
該補強件係定位在該沖壓機220之上表面，藉由該旋轉單元230之吸附墊234所吸附，而且該旋轉單元230吸附該補強件，然後運作該旋轉驅動單元231以轉動該 偏心連桿232，因此，該旋轉桿233及該吸附墊234也可以被轉動。所以，藉由該吸附墊234吸附並翻轉該補強件之上下表面，而補強件向上的方向係具有毛邊產生的方向。The reinforcing member is positioned on the upper surface of the punch 220, adsorbed by the adsorption pad 234 of the rotating unit 230, and the rotating unit 230 adsorbs the reinforcing member, and then operates the rotary driving unit 231 to rotate the The eccentric link 232, therefore, the rotating rod 233 and the suction pad 234 can also be rotated. Therefore, the upper surface of the reinforcing member is adsorbed and inverted by the adsorption pad 234, and the upward direction of the reinforcing member has a direction in which the burrs are generated.
當該旋轉單元230轉運該補強件至第二單元座空間213時，吸附墊234之真空因而被釋放，並且該補強件轉運裝置300轉運並黏著該補強件至該PCB上。When the rotating unit 230 transports the reinforcing member to the second unit housing space 213, the vacuum of the adsorption pad 234 is thereby released, and the reinforcing member transfer device 300 transports and adheres the reinforcing member to the PCB.
根據本發明之一具體實施例之補強件黏著系統，將說明如下。A reinforcing member adhesive system according to an embodiment of the present invention will be described below.
請參閱第1圖、第7圖及第8圖，根據本發明具體實施例之補強件黏著系統，係包含有一補強件供應裝置100、一補強件沖壓裝置200、一補強件轉運裝置300、及一補強件黏著裝置400。Referring to FIG. 1 , FIG. 7 and FIG. 8 , a reinforcing member adhesive system according to an embodiment of the present invention includes a reinforcing member supply device 100 , a reinforcing member pressing device 200 , a reinforcing member transfer device 300 , and A reinforcing member is attached to the device 400.
該補強件供應裝置100，係用以提供一纏繞成捲狀輔助材料之裝置，包括有一補強件捲繞滾軸110及一料帶捲繞滾軸120。The reinforcing member supply device 100 is for providing a device for winding a roll-shaped auxiliary material, comprising a reinforcing member winding roller 110 and a tape winding roller 120.
該補強件捲繞滾軸110係用以纏繞一補強件原物料，並持續地供應該被纏繞之補強件原物料至該補強件沖壓裝置200。該補強件沖壓裝置200沖壓持續供應至該補強件沖壓裝置200之該補強件原物料，除了被該補強件沖壓裝置200沖壓後之補強件外，還供應一補強件料帶至該料帶捲繞滾軸120並且回繞。The reinforcing member winding roller 110 is configured to wind a reinforcing member raw material and continuously supply the wound reinforcing member raw material to the reinforcing member pressing device 200. The reinforcing member pressing device 200 is continuously supplied to the reinforcing member raw material of the reinforcing member pressing device 200, and a reinforcing member is supplied to the feeding tape in addition to the reinforcing member punched by the reinforcing member pressing device 200. Wrap around roller 120 and wrap around.
該補強件沖壓裝置200包括有：該模件210，具有一成孔211形成於其中；該沖壓機220，設置在該模件210之較下側，在該成孔211中升降，並沖壓該補強件 10；及該旋轉單元230，其係設置在該成孔211之較上側，並翻轉經由沖壓機220沖壓後之補強件10的上下表面。The reinforcing member pressing device 200 includes: the module 210 having a hole 211 formed therein; the punch 220 disposed on the lower side of the module 210, lifting and lowering in the hole 211, and punching Reinforcement 10; and the rotating unit 230 is disposed on the upper side of the hole 211, and flips the upper and lower surfaces of the reinforcing member 10 punched by the punch 220.
該補強件轉運裝置300包括有一往復轉運單元310以及一吸附墊320。該往復轉運單元310係在該補強件沖壓裝置200的較上方及該PCB座單元410之較上方之間進行往復運動。該往復轉運單元310具有一普遍的結構，該結構包含一伺服馬達(servo motor)、一線性導軌(LM guide)及類似構件。The reinforcement transfer device 300 includes a reciprocating unit 310 and an adsorption pad 320. The reciprocating unit 310 reciprocates between the upper portion of the reinforcing member pressing device 200 and the upper portion of the PCB housing unit 410. The reciprocating unit 310 has a general structure including a servo motor, a LM guide, and the like.
該吸附墊320係形成在該往復轉運單元310之較下側，當該往復轉運單元310移動至該經沖壓後之補強件10時，藉由形成一真空狀態以吸附該補強件10；當該往復轉運單元310轉運該補強件10至該PCB之較上側時，該吸附墊320便會釋放該真空狀態，因此該補強件10便會被黏著在該PCB上。The adsorption pad 320 is formed on the lower side of the reciprocating unit 310. When the reciprocating unit 310 is moved to the stamped reinforcing member 10, the reinforcing member 10 is adsorbed by forming a vacuum state; When the reciprocating unit 310 transports the reinforcing member 10 to the upper side of the PCB, the adsorption pad 320 releases the vacuum state, so that the reinforcing member 10 is adhered to the PCB.
一模件清潔單元330設置在該補強件轉運裝置300之一側。該模件清潔單元330包括有複數個清潔刷331及一外來基板吸附部件332，該外來基板吸附部件332係設置在該模件清潔單元330之下表面。當在該模件210之上表面及該輔助原料之上表面之間進行往復運動時，也就是該補強件轉運裝置300進行往復運動時，該複數個清潔刷331因而可清潔該模件210之上表面，以及該輔助原料之上表面及側表面。A module cleaning unit 330 is disposed on one side of the reinforcing member transfer device 300. The module cleaning unit 330 includes a plurality of cleaning brushes 331 and an external substrate adsorption member 332 disposed on a lower surface of the module cleaning unit 330. The plurality of cleaning brushes 331 can thereby clean the module 210 when reciprocating between the upper surface of the module 210 and the upper surface of the auxiliary material, that is, when the reinforcing member transfer device 300 reciprocates. The upper surface, and the upper surface and the side surface of the auxiliary material.
該外來基板吸附部件332係在真空的狀態下吸附經由該清潔刷331所清潔之外來基板，並擷取(capture) 及移除該外來基板。The foreign substrate adsorbing member 332 adsorbs the substrate cleaned by the cleaning brush 331 in a vacuum state, and captures the substrate. And removing the foreign substrate.
該補強件黏著裝置400包括有一升降單元420，用以升降該補強件轉運裝置300。該升降單元420係定位在該補強件轉運裝置300之一側，並包括有該線性導軌(LM guide)，以引導該補強件轉運裝置300之垂直升降；以及一驅動圓缸，用以升降該補強件轉運裝置300。該線性導軌及驅動圓缸為普遍所使用，因此，此處不再加以詳細描述。The reinforcing member bonding device 400 includes a lifting unit 420 for lifting and lowering the reinforcing member transfer device 300. The lifting unit 420 is positioned on one side of the reinforcing member transfer device 300, and includes the linear guide (LM guide) to guide the vertical lifting of the reinforcing member transfer device 300; and a driving circular cylinder for lifting and lowering Reinforcement transfer device 300. The linear guide and drive cylinder are commonly used and therefore will not be described in detail herein.
該PCB座單元410係形成在該補強件轉運裝置300之下方，且該PCB是置入在該PCB座單元410之上表面。The PCB holder unit 410 is formed below the reinforcement transfer device 300, and the PCB is placed on the upper surface of the PCB holder unit 410.
該補強件黏著系統係具有上述結構，如第1圖中所述示，其運作方式說明如下。The reinforcing member adhesive system has the above structure, as shown in Fig. 1, and its operation mode is explained as follows.
首先，該補強件10是被纏繞在該補強件供應裝置100之補強件捲繞滾軸上，並持續地供應至該補強件沖壓裝置200。當該補強件10之規格係需要具有毛邊產生在該補強件10之較下側時，該補強件10提供至該補強件沖壓裝置200，同時一膠著劑層形成在該補強件10之較下側。First, the reinforcing member 10 is wound around the reinforcing member winding roller of the reinforcing member supply device 100, and is continuously supplied to the reinforcing member pressing device 200. When the specification of the reinforcing member 10 is required to have a burr generated on the lower side of the reinforcing member 10, the reinforcing member 10 is provided to the reinforcing member pressing device 200, and a adhesive layer is formed at the lower side of the reinforcing member 10. side.
該補強件10係提供至該沖壓機220及該補強件沖壓裝置200之模件210之間，該沖壓機220上升並沖壓該補強件10。該經沖壓後之補強件10被吸附在該補強件轉運裝置300之吸附墊320上，並被轉運至該補強件黏著裝置400。The reinforcing member 10 is provided between the punch 220 and the module 210 of the reinforcing member pressing device 200, and the punch 220 is raised and punched. The stamped reinforcing member 10 is adsorbed on the adsorption pad 320 of the reinforcing member transfer device 300 and transported to the reinforcing member bonding device 400.
當補強件10被轉運至該補強件黏著裝置400時， 該補強件黏著裝置400之升降單元420將該吸附墊320下降，因而該補強件10可被黏著至設置在該PCB座單元410中之PCB上表面。When the reinforcing member 10 is transferred to the reinforcing member bonding device 400, The lifting unit 420 of the reinforcing member bonding device 400 lowers the adsorption pad 320, and thus the reinforcing member 10 can be adhered to the upper surface of the PCB disposed in the PCB holder unit 410.
同時，當該補強件10需要具有毛邊產生在該補強件10之較上側時，該補強件10提供至該補強件沖壓裝置200，同時一膠著劑層形成在該補強件10之較上側。該補強件10係提供至該沖壓機220及該補強件沖壓裝置200之模件210之間，且該沖壓機220上升並沖壓該補強件10。該經沖壓後之補強件10係藉由該旋轉單元230被旋轉180°，並被移動至該第二單元座空間213。隨後，該被轉運至第二單元座空間213之補強件10係被吸附在該補強件轉運裝置300之吸附墊320上，再被轉運至該補強件黏著裝置400。Meanwhile, when the reinforcing member 10 needs to have a burr generated on the upper side of the reinforcing member 10, the reinforcing member 10 is supplied to the reinforcing member punching device 200, and a glue layer is formed on the upper side of the reinforcing member 10. The reinforcing member 10 is provided between the punching machine 220 and the module 210 of the reinforcing member pressing device 200, and the punching machine 220 ascends and punches the reinforcing member 10. The stamped reinforcing member 10 is rotated by 180° by the rotating unit 230 and moved to the second unit housing space 213. Subsequently, the reinforcing member 10 that is transported to the second unit seating space 213 is adsorbed on the adsorption pad 320 of the reinforcing member transfer device 300 and then transported to the reinforcing member bonding device 400.
當補強件10被轉運至該補強件黏著裝置400時，該補強件黏著裝置400之升降單元420下降該補強件轉運裝置300之吸附墊320，因此該補強件10可被吸附在設置在該PCB座單件410中之PCB上表面上。When the reinforcing member 10 is transferred to the reinforcing member bonding device 400, the lifting unit 420 of the reinforcing member bonding device 400 lowers the adsorption pad 320 of the reinforcing member transfer device 300, so that the reinforcing member 10 can be adsorbed on the PCB. The single piece 410 is on the upper surface of the PCB.
以上所描述係根據本發明所使用在同一補強件沖壓裝置及一補強件黏著系統中，根據一產品的規格需求，一補強件可在需要的方向產生毛邊，並任意提供至一PCB上。The above description is based on the same reinforcing member pressing device and a reinforcing member bonding system according to the present invention. According to the specification requirements of a product, a reinforcing member can generate a burr in a desired direction and is arbitrarily provided to a PCB.
此外，該補強件可被黏著在該PCB上，同時又可清潔用於沖壓之補強件之模件。In addition, the reinforcing member can be adhered to the PCB while cleaning the module for the reinforcing member for stamping.
本發明中所運用之所有專有名詞及措辭不應該僅使用一般字典中的意思來詮釋，而應該以符合本發明係 基於發明人為了以最佳的方式來描述其發明而實際界定其專有名詞之概念為宗旨之技術精神背景的意義或概念來詮釋。All proper nouns and wording used in the present invention should not be interpreted using only the meaning of the general dictionary, but should be in accordance with the present invention. The inventors interpret the meaning or concept of the technical spirit background for the purpose of describing the invention in an optimal way and actually defining the concept of its proper noun.
以上所述係藉由較佳實施例來顯示並說明本發明之特點，其目的在使熟習該技術者能瞭解本發明之內容並據以實施，而非限定本發明之專利範圍，故凡其他未脫離本發明所揭示之精神及範圍而完成之等效修飾或修改，仍應包含在以下所述之申請專利範圍中。The above description of the preferred embodiments of the present invention is intended to be illustrative of the embodiments of the invention Equivalent modifications or variations made without departing from the spirit and scope of the invention are intended to be included in the appended claims.
10‧‧‧補強件10‧‧‧Reinforcement
100‧‧‧補強件供應裝置100‧‧‧Reinforcing parts supply device
110‧‧‧補強件捲繞滾軸110‧‧‧Reinforcement winding roller
120‧‧‧料帶捲繞滾軸120‧‧‧Material winding roller
200‧‧‧補強件沖壓裝置200‧‧‧Reinforcement stamping device
210‧‧‧模件210‧‧‧Modular
211‧‧‧成孔211‧‧‧ hole
212‧‧‧第一元件座空間212‧‧‧First component space
213‧‧‧第二元件座空間213‧‧‧Second component space
214‧‧‧第一狹長槽214‧‧‧First long slot
215‧‧‧第二狹長槽215‧‧‧Second long slot
220‧‧‧沖壓機220‧‧‧ punching machine
221‧‧‧沖壓機真空管線221‧‧‧Press vacuum line
222‧‧‧沖壓機真空裝置222‧‧ ‧ press vacuum device
230‧‧‧旋轉單元230‧‧‧Rotating unit
231‧‧‧旋轉驅動單元231‧‧‧Rotary drive unit
232‧‧‧偏心連桿232‧‧‧eccentric connecting rod
233‧‧‧旋轉桿233‧‧‧Rotary rod
234‧‧‧吸附墊234‧‧‧Adsorption pad
235‧‧‧輔助材料真空產生器235‧‧‧Auxiliary material vacuum generator
236‧‧‧輔助材料吸附線236‧‧‧Auxiliary material adsorption line
237‧‧‧第一狹長槽237‧‧‧First long slot
238‧‧‧第二狹長槽238‧‧‧Second long slot
241‧‧‧感測器241‧‧‧ sensor
250‧‧‧控制器250‧‧‧ Controller
300‧‧‧補強件沖壓裝置300‧‧‧Reinforcement stamping device
310‧‧‧往復轉運單元310‧‧‧Reciprocating transport unit
320‧‧‧吸附墊320‧‧‧Adsorption pad
330‧‧‧模件清潔單元330‧‧‧Modular cleaning unit
331‧‧‧清潔刷331‧‧‧ Cleaning brush
332‧‧‧外來基板吸附部件332‧‧‧External substrate adsorption parts
400‧‧‧補強件黏著裝置400‧‧‧Reinforcement Adhesive Device
410‧‧‧PCB座單元410‧‧‧PCB unit
420‧‧‧升降單元420‧‧‧ Lifting unit
第1圖是根據本發明具體實施例中一補強件黏著系統之前視圖；第2圖是根據本發明具體實施例中一用於補強件沖壓裝置之平面示意圖；第3圖是根據第2圖中之A-A線剖面後之剖面示意圖；第4圖是根據第2圖中所說明之補強件沖壓裝置之立體圖；第5圖是根據本發明具體實施例中一旋轉單元之平面示意圖；第6圖是第5圖中所說明該旋轉單元之前視圖；第7圖是第1圖中所說明該補強件黏著系統之側視圖；及第8圖是第1圖中A部分之放大示意圖。1 is a front view of a reinforcing member adhesive system according to an embodiment of the present invention; FIG. 2 is a plan view schematically showing a punching device for a reinforcing member according to an embodiment of the present invention; and FIG. 3 is a view according to FIG. FIG. 4 is a perspective view of a reinforcing member pressing device according to FIG. 2; FIG. 5 is a plan view of a rotating unit according to an embodiment of the present invention; FIG. 6 is a schematic view of a rotating unit according to a specific embodiment of the present invention; The front view of the rotary unit is illustrated in Fig. 5; the seventh view is a side view of the reinforcing member adhesion system illustrated in Fig. 1; and Fig. 8 is an enlarged schematic view of the portion A in Fig. 1.
10‧‧‧補強件10‧‧‧Reinforcement
100‧‧‧補強件供應裝置100‧‧‧Reinforcing parts supply device
110‧‧‧補強件捲繞滾軸110‧‧‧Reinforcement winding roller
120‧‧‧料帶捲繞滾軸120‧‧‧Material winding roller
200‧‧‧補強件沖壓裝置200‧‧‧Reinforcement stamping device
210‧‧‧模件210‧‧‧Modular
220‧‧‧沖壓機220‧‧‧ punching machine
300‧‧‧補強件轉運裝置300‧‧‧Reinforcement transfer device
310‧‧‧往復轉運單元310‧‧‧Reciprocating transport unit
320‧‧‧吸附墊320‧‧‧Adsorption pad
330‧‧‧模件清潔單元330‧‧‧Modular cleaning unit
400‧‧‧補強件黏著裝置400‧‧‧Reinforcement Adhesive Device
410‧‧‧PCB座單元410‧‧‧PCB unit
Claims (11)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090065330A KR100967422B1 (en) | 2009-07-17 | 2009-07-17 | Apparatus for punching cover-lay and cover lay attach system using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201103742A TW201103742A (en) | 2011-02-01 |
| TWI419787B true TWI419787B (en) | 2013-12-21 |
Family
ID=42645106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099123235A TWI419787B (en) | 2009-07-17 | 2010-07-15 | Apparatus for punching stiffener and stiffener-attaching system using the same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100967422B1 (en) |
| CN (1) | CN101954402B (en) |
| TW (1) | TWI419787B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101195938B1 (en) * | 2011-04-25 | 2012-11-05 | (주)우리엔지니어링 | Apparatus for adhering cover-lay |
| KR101187265B1 (en) | 2011-04-25 | 2012-10-11 | (주)우리엔지니어링 | Apparatus for adhering cover-lay |
| KR101227048B1 (en) * | 2011-04-25 | 2013-01-29 | (주)우리엔지니어링 | Apparatus for adhering cover-lay |
| CN102202465B (en) * | 2011-05-24 | 2012-12-12 | 陈良华 | Automatic reinforcement laminating machine for flexible printed circuit |
| CN102333416B (en) * | 2011-06-03 | 2013-05-22 | 珠海紫翔电子科技有限公司 | Unidirectional reinforcement material laminating system and method |
| CN103008436A (en) * | 2012-12-28 | 2013-04-03 | 苏州米达思精密电子有限公司 | Automatic regular array production device used after stamping of non-hole plane reinforced sheet steel |
| AT514324B1 (en) * | 2013-07-11 | 2014-12-15 | Trumpf Maschinen Austria Gmbh | Cleaning device for a bending machine |
| CN103851047A (en) * | 2014-03-25 | 2014-06-11 | 常州市金铃摩擦材料有限公司 | Spliced paper patching method and spliced paper patching machine |
| CN104353726B (en) * | 2014-10-23 | 2016-08-24 | 苏州米达思精密电子有限公司 | A kind of two-way conveying production method of reinforcing chip |
| CN104353725B (en) * | 2014-10-23 | 2016-06-29 | 苏州米达思精密电子有限公司 | A kind of two-way conveying production equipment of reinforcing chip |
| CN111014450A (en) * | 2019-11-19 | 2020-04-17 | 宝德塑胶金属零部件(深圳)有限公司 | Method for transferring and loading metal heat dissipation subassembly in heat dissipation module of mobile phone display screen |
| CN110834361B (en) * | 2019-12-29 | 2024-06-11 | 温州市皓丰机械有限公司 | Breathable film blanking device |
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| GB1138931A (en) * | 1966-03-02 | 1969-01-01 | Karlsruhe Augsburg Iweka | Apparatus for punching sheet material |
| KR20050032465A (en) * | 2004-04-07 | 2005-04-07 | (주)포틱스테크놀로지 | Cover-lay film lamination method of flexible pcb for semiconductor package and this same cover-lay film lamination system |
| US20050118447A1 (en) * | 2003-09-19 | 2005-06-02 | Sumitomo Electric Industries, Ltd. | Stiffener, a method of manufacturing a stiffener, and a semiconductor device with a stiffener |
| WO2008002044A1 (en) * | 2006-06-27 | 2008-01-03 | Seho Robot Industries Co., Ltd | System and methode for attaching coverlay |
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|---|---|---|---|---|
| JPH05228547A (en) * | 1992-02-19 | 1993-09-07 | Amada Co Ltd | Vertical punch press |
| JP4297621B2 (en) * | 2001-03-07 | 2009-07-15 | ヤマハファインテック株式会社 | Punching device and workpiece processing method |
| JP2002346989A (en) * | 2001-05-29 | 2002-12-04 | Uht Corp | Multi-spindle punching device of tape-like material |
| KR101021337B1 (en) * | 2007-09-06 | 2011-03-14 | 이문효 | Film attaching apparatus for flexible printed circuit board |
| JP4998332B2 (en) * | 2008-03-07 | 2012-08-15 | トヨタ自動車株式会社 | Press machine |
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2009
- 2009-07-17 KR KR1020090065330A patent/KR100967422B1/en active IP Right Grant
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2010
- 2010-07-15 TW TW099123235A patent/TWI419787B/en not_active IP Right Cessation
- 2010-07-16 CN CN2010102335158A patent/CN101954402B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1138931A (en) * | 1966-03-02 | 1969-01-01 | Karlsruhe Augsburg Iweka | Apparatus for punching sheet material |
| US20050118447A1 (en) * | 2003-09-19 | 2005-06-02 | Sumitomo Electric Industries, Ltd. | Stiffener, a method of manufacturing a stiffener, and a semiconductor device with a stiffener |
| KR20050032465A (en) * | 2004-04-07 | 2005-04-07 | (주)포틱스테크놀로지 | Cover-lay film lamination method of flexible pcb for semiconductor package and this same cover-lay film lamination system |
| WO2008002044A1 (en) * | 2006-06-27 | 2008-01-03 | Seho Robot Industries Co., Ltd | System and methode for attaching coverlay |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101954402A (en) | 2011-01-26 |
| TW201103742A (en) | 2011-02-01 |
| KR100967422B1 (en) | 2010-07-01 |
| CN101954402B (en) | 2013-06-19 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |