TWI417676B - Drawing apparatus data, processing apparatus for drawing apparatus, and method of producing drawing data for drawing apparatus - Google Patents
Drawing apparatus data, processing apparatus for drawing apparatus, and method of producing drawing data for drawing apparatus Download PDFInfo
- Publication number
- TWI417676B TWI417676B TW099101254A TW99101254A TWI417676B TW I417676 B TWI417676 B TW I417676B TW 099101254 A TW099101254 A TW 099101254A TW 99101254 A TW99101254 A TW 99101254A TW I417676 B TWI417676 B TW I417676B
- Authority
- TW
- Taiwan
- Prior art keywords
- data
- substrate
- mesh
- area
- image
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本發明係以印刷電路基板、半導體基板、液晶基板等為描繪對象之直接描繪裝置，特別係針對描繪時對描繪資料進行之補正處理。 The present invention relates to a direct drawing device in which a printed circuit board, a semiconductor substrate, a liquid crystal substrate, or the like is a drawing object, and particularly relates to a correction process for drawing data at the time of drawing.
迄今為止，眾所周知有一種直接描繪裝置(直描裝置)，其係藉由掃描且照射雷射光等曝光用光，而對印刷電路基板、半導體基板、液晶基板等描繪對象(以下亦單稱之為基板)連續進行局部曝光，藉而描繪期望之電路圖案。 Heretofore, a direct drawing device (a direct drawing device) for drawing a printed circuit board, a semiconductor substrate, a liquid crystal substrate, or the like by scanning and irradiating exposure light such as laser light is known (hereinafter also referred to as a single drawing device). The substrate is continuously subjected to partial exposure to thereby depict a desired circuit pattern.
利用直描裝置之電路圖案之描繪，係根據自電路圖案之設計資料變換成之具有直描裝置可處理之描述形式之資料的描繪資料而進行。但，如上述之基板中，雖有時會產生翹曲、扭曲、或伴隨先前步驟之處理之應變等變形，但由於設計資料通常不考慮該等變形而作成，因此即使直接使用變換成之描繪資料描繪電路圖案，亦無法獲得充分之描繪品質，從而無法提高成品率。因此，利用直描裝置之描繪係藉由預先測定作為描繪對象之基板之形狀，將所得之測定結果加入控制因子，再控制曝光用光之照射機構之動作，或基於該測定結果補正描繪資料本身，而使用補正後之描繪資料進行。 The drawing of the circuit pattern by the direct drawing device is performed based on the drawing data converted from the design data of the circuit pattern into the description form which can be processed by the direct drawing device. However, in the above-mentioned substrate, warpage, distortion, or strain accompanying the processing of the previous step may be generated, but the design data is usually created without considering the deformation, and therefore, even if it is directly used for transformation, it is drawn. The data is drawn to the circuit pattern, and sufficient drawing quality cannot be obtained, so that the yield cannot be improved. Therefore, the drawing by the direct drawing device is performed by measuring the shape of the substrate to be drawn in advance, adding the obtained measurement result to the control factor, controlling the operation of the irradiation mechanism for the exposure light, or correcting the drawing data based on the measurement result. And use the corrected data after the correction.
前者之情形下，例如，係在曝光用光之掃描時，測定掃描方向前方之基板之形狀，再按照該測定結果控制曝光處理時之光源之移動動作或保持基板之台座之移動動作。 In the former case, for example, when scanning for exposure light, the shape of the substrate in front of the scanning direction is measured, and according to the measurement result, the movement of the light source during the exposure processing or the movement of the pedestal of the substrate is controlled.
另，已知有各種實現後者之補正處理者。例如已眾所周知，以四角形之分割區域為單位，將該分割區域內之所有像素之座標利用FFD(Free Form Deformation，自由形式變形)法或仿射變換等進行變換，藉而補正描繪資料之處理(例如參照專利文獻1)。 In addition, various correction processors for implementing the latter are known. For example, it is known that the coordinates of all pixels in the divided area are converted by FFD (Free Form Deformation) method or affine transformation in units of divided areas of a quadrangle, thereby correcting the processing of drawing data ( For example, refer to Patent Document 1).
或是，眾所周知的另有一種態樣，其係基於各個圖案之定位座標，單獨進行附有多面之複數之圖案之定位，再對每個圖案進行描繪資料之補正(例如參照專利文獻2及專利文獻3)。 Or, in another well-known manner, based on the positioning coordinates of each pattern, the positioning of the multi-faceted plural pattern is separately performed, and the correction of the drawing data is performed for each pattern (for example, refer to Patent Document 2 and Patent). Document 3).
[專利文獻1]日本特開2005-37911號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-37911
[專利文獻2]日本特開2005-300628號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2005-300628
[專利文獻3]日本特開2000-122303號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2000-122303
將基板之形狀測定結果作為控制因子而控制曝光用光之照射機構之動作之態樣，對描繪對象整體之全部相同的扭曲或翹曲有效。但，基板有不規則之變形時，除合適之動作控制較困難外，又有即使可控制亦會產生必須降低描繪速度等問題。 The shape of the substrate is used as a control factor to control the operation of the irradiation mechanism for exposure light, and it is effective for all the same distortion or warpage of the entire object to be drawn. However, when the substrate has irregular deformation, it is difficult to control the movement, and even if it is controllable, there is a problem that the drawing speed must be lowered.
另，在直描裝置於裝置製造步驟等中係採線上使用，且對複數之基板連續進行描繪時，被要求能儘量縮短直描裝置獲取定位座標後至開始描繪動作為止之等待時間。尤其，由於基於形狀測定結果補正描繪資料本身之處理係一種會使該等待時間增大之處理，因此該補正處理乃被要求 補正能以盡可能短的時間進行。 Further, when the direct drawing device is used in the device manufacturing step or the like and the plurality of substrates are continuously drawn, it is required to shorten the waiting time until the drawing operation is started after the direct drawing device acquires the positioning coordinates. In particular, since the processing of correcting the drawing data itself based on the shape measurement result is a process which increases the waiting time, the correction processing is required. Correction can be done in as short a time as possible.
針對該點，專利文獻1所揭示之方法之情形下，由於係以分割區域內之所有像素之座標為對象而進行複雜之運算處理，因此，在座標點較多之描繪資料(例如，表現描繪尺寸大之電路圖案之圖像資料，或表現微小複雜之電路圖案之描繪資料)之情形下，會有用以變換座標之運算處理需要時間之問題。 In this case, in the case of the method disclosed in Patent Document 1, since the complicated arithmetic processing is performed on the coordinates of all the pixels in the divided region, the drawing data having a large number of coordinate points (for example, expression rendering) In the case of image data of a circuit pattern having a large size or a depiction of a circuit pattern of a small and complicated circuit pattern, there is a problem that it takes time to perform arithmetic processing for transforming the coordinates.
另，根據專利文獻2及專利文獻3所揭示之方法時，基於各個定位座標補正所對應之圖案之座標此點與專利文獻1之情形亦屬相同，因此運算處理仍需要時間。並且，補正各個圖案之座標之結果，會使各個圖案之邊界位置之補正內容產生矛盾，從而無法進行適切之補正。 Further, according to the methods disclosed in Patent Document 2 and Patent Document 3, the coordinates of the pattern corresponding to each of the positioning coordinates are corrected in the same manner as in Patent Document 1, and therefore the arithmetic processing still takes time. Moreover, the result of correcting the coordinates of each pattern causes contradictions in the correction contents of the boundary positions of the respective patterns, so that it is impossible to make appropriate corrections.
本發明係鑑於上述問題而完成者，其目的在於提供一種可以簡易之處理進行對應基板變形之描繪資料之補正處理的直接描繪裝置。 The present invention has been made in view of the above problems, and an object thereof is to provide a direct drawing device capable of performing a correction process for drawing data corresponding to a substrate deformation in a simple manner.
為解決上述問題，技術方案1之發明之特徵為，其係藉由從光源照射曝光用光而於基板形成圖像之描繪裝置，且包含：台座，其用以載置作為描繪對象之基板；攝像機構，其係將載置於前述台座之前述基板之被描繪面予以攝像；變換機構，其係獲取以向量形式描述之圖案資料，且將前述圖案資料變換成網格(raster)形式之初期描繪資料；分割機構，其係將包含前述初期描繪資料所表現之描繪對象圖像之描繪區域假想地分割成複數之網狀區域，且針對 前述複數之網狀區域之各個，產生將前述描繪區域之配置位置與該配置位置之描繪內容關連化之分割描繪資料；配置位置特定機構，其係基於由前述攝像機構攝像前述基板所得之攝像圖像所特定之設於前述基板之對準標記的位置，特定出對應前述基板之形狀而對前述複數之網狀區域予以再配置時的配置位置；及合成機構，其係在將前述複數之網狀區域再配置於藉由前述位置特定機構所特定之配置位置的狀態下，合成前述分割描繪資料中與前述複數之網狀區域關連化之前述描繪內容，產生一個描繪資料。 In order to solve the above problems, the invention of claim 1 is characterized in that the image forming apparatus is formed by irradiating exposure light from a light source to form an image on a substrate, and includes a pedestal for placing a substrate to be drawn; An imaging mechanism that images an image to be drawn on a surface of the substrate on which the pedestal is placed; and a conversion mechanism that acquires pattern data described in a vector form and converts the pattern data into an initial form of a raster a drawing unit that divides a drawing area including a drawing target image represented by the initial drawing data into a plurality of mesh regions, and Each of the plurality of mesh regions generates divided drawing data that relates the arrangement position of the drawing region to the drawing content of the arrangement position; and the position specifying mechanism is based on an image obtained by imaging the substrate by the imaging device. a position at which the plurality of mesh regions are rearranged corresponding to the shape of the substrate, and a synthesizing mechanism for the plurality of nets The image region is further disposed in a state in which the position is specified by the position specifying means, and the drawing content associated with the plurality of mesh regions in the divided drawing data is synthesized to generate one drawing material.
技術方案2之發明係技術方案1之描繪裝置，其特徵在於：前述資料分割機構係根據基於藉由前述曝光用光形成圖像時之曝光分辨度，與預先特定之對前述基板形成圖像時所容許之最大變形程度所決定之分割尺寸，而分割前述描繪區域。 According to a second aspect of the invention, in the drawing device of the first aspect, the data dividing mechanism is configured to form an image on the substrate in advance based on an exposure resolution when an image is formed by the exposure light. The above-described drawing area is divided by the division size determined by the maximum degree of deformation allowed.
技術方案3之發明係技術方案2之描繪裝置，其特徵在於：前述描繪區域被定為矩形區域，且藉由表示前述矩形區域之邊所容許之最大傾斜之資訊，特定出前述基板所容許之最大變形程度。 The invention of claim 2 is characterized in that the drawing area is defined as a rectangular area, and the information indicating the maximum inclination allowed by the side of the rectangular area is specified by the substrate. The maximum degree of deformation.
技術方案4之發明係技術方案1之描繪裝置，其特徵在於：前述資料分割機構係以分割尺寸不同之複數之分割態樣，而將前述描繪區域分割成前述複數之網狀區域，且產生將前述分割尺寸與前述描繪區域之配置位置與該配置位置之描繪內容關連化之分割描繪資料；前述配置位置特定機構係對應由設於前述基板之對準標記之位置所特定之針 對前述描繪區域中特定之各部份區域的變位等級，而在特定出前述部份區域中利用於再配置之前述分割態樣後，再特定出就各個前述部份區域再配置前述複數之網狀區域時的配置位置。 According to a fourth aspect of the invention, in the drawing device of the first aspect of the invention, the data dividing unit divides the drawing area into the plurality of mesh areas by a plurality of divided patterns of different sizes, and generates a divided drawing data in which the divided size and the arrangement position of the drawing area are related to the drawing content of the arrangement position; the arrangement position specifying mechanism corresponds to a needle specified by the position of the alignment mark provided on the substrate For the displacement level of each of the specific partial regions in the drawing area, and after the partial segmentation of the relocation is used in the specific partial region, the plurality of the partial regions are further configured to be reconfigured. The location of the mesh area.
技術方案5之發明係技術方案1至技術方案4中任一種之描繪裝置，其特徵在於：前述資料分割機構係以使前述複數之網狀區域之各個與鄰接之網狀區域交疊之方式，將前述描繪區域假想地分割成前述複數之網狀區域。 The invention according to any one of claims 1 to 4, wherein the data dividing mechanism is configured such that each of the plurality of mesh regions overlaps with an adjacent mesh region. The aforementioned drawing area is virtually divided into the plurality of mesh areas.
技術方案6之發明係藉由從光源照射曝光用光而於基板形成圖像之描繪裝置用之資料處理裝置，其特徵在於具備：變換機構，其係獲取以向量形式描述之圖案資料，且將前述圖案資料變換成網格形式之初期描繪資料；分割機構，其係將包含前述初期描繪資料所表現之描繪對象圖像之描繪區域假想地分割成複數之網狀區域，且針對前述複數之網狀區域之各個，產生將前述描繪區域之配置位置與該配置位置之描繪內容關連化之分割描繪資料；配置位置特定機構，其係基於由攝像作為描繪對象之基板所得之攝像圖像所特定之設於前述基板之對準標記的位置，特定出對應前述基板之形狀而對前述複數之網狀區域予以再配置時的配置位置；及合成機構，其係在將前述複數之網狀區域再配置於藉由前述位置特定機構所特定之配置位置的狀態下，合成前述分割描繪資料中與前述複數之網狀區域關連化之前述描繪內容，產生一個描繪資料。 The invention of claim 6 is a data processing device for a drawing device for forming an image on a substrate by irradiating light for exposure from a light source, characterized by comprising: a conversion mechanism for acquiring pattern data described in a vector form, and The pattern data is converted into an initial drawing data in a grid form, and the dividing unit is configured to virtually divide the drawing area of the drawing target image represented by the initial drawing data into a plurality of mesh regions, and for the plurality of meshes Each of the shaped regions generates divided drawing data that relates the arrangement position of the drawing region to the drawing content of the arrangement position, and the arrangement position specifying mechanism is based on a captured image obtained by imaging the substrate to be drawn. Positioning the alignment mark on the substrate, specifying an arrangement position when the plurality of mesh regions are rearranged corresponding to the shape of the substrate; and synthesizing means for reconfiguring the plurality of mesh regions Synthesizing the above-described split depiction in a state in which the position is specified by the position-specific mechanism The aforementioned depiction of the data associated with the aforementioned plurality of mesh regions produces a depiction material.
技術方案7之發明係藉由從光源照射曝光用光而於基板 形成圖像之描繪裝置用之描繪資料產生方法，其特徵在於具備：變換步驟，其係獲取以向量形式描述之圖案資料，且將前述圖案資料變換成網格形式之初期描繪資料；分割步驟，其係將包含前述初期描繪資料所表現之描繪對象圖像之描繪區域假想地分割成複數之網狀區域，且針對前述複數之網狀區域之各個，產生將前述描繪區域之配置位置與該配置位置之描繪內容關連化之分割描繪資料；攝像步驟，其將作為描繪對象之基板予以攝像；對準標記位置特定步驟，其係由前述攝像步驟中所得之攝像圖像特定設於前述基板之對準標記的位置；配置位置特定步驟，其係基於前述對準標記位置特定步驟之特定結果，特定出將前述複數之網狀區域對應於前述基板之形狀予以再配置時的配置位置；及合成步驟，其係在將前述複數之網狀區域再配置於在前述位置特定步驟中所特定之配置位置的狀態下，合成前述分割描繪資料中與前述複數之網狀區域關連化之前述描繪內容，產生一個描繪資料。 The invention of claim 7 is for irradiating the exposure light from the light source to the substrate A drawing data generating method for forming an image drawing device, comprising: a converting step of acquiring pattern data described in a vector form, and converting the pattern data into an initial drawing material in a grid form; and a dividing step, The virtual region including the drawing region of the image to be rendered represented by the initial drawing data is divided into a plurality of mesh regions, and the arrangement position of the drawing region and the arrangement are generated for each of the plurality of mesh regions. a segmentation drawing data in which the drawing content is related; an imaging step of capturing a substrate as a drawing target; and an alignment mark position specifying step of specifically arranging the image obtained by the image capturing step on the substrate a position of a quasi-marking; a step of arranging a position based on a specific result of the step of specifying the position of the alignment mark, specifying a position at which the plurality of mesh regions are reconfigured corresponding to the shape of the substrate; and a synthesizing step Relocating the plurality of mesh regions to the aforementioned location Step under the particular configuration of the position, the split synthesis depicted the profile of the related content and drawing the plurality of network region, generating a drawing data.
根據技術方案1至技術方案7之發明，只要將以向量形式描述之圖案資料一次變換成網格形式之資料的初期描繪資料，其後僅須對應於基板之變形再配置網狀區域，即可獲得已考慮基板之變形而補正之描繪資料。藉此，無需重複進行由向量形式之資料朝向量形式之資料之變換，或由向量形式之資料朝網格形式之資料之變換，因此用以產生對應於基板之描繪資料所需要之時間比先前顯著縮短。 According to the inventions of the first aspect to the seventh aspect, the pattern data described in the vector form is once transformed into the initial drawing data of the data in the grid form, and then the mesh area is only required to be corresponding to the deformation of the substrate. The drawing data that has been corrected by considering the deformation of the substrate is obtained. Thereby, there is no need to repeat the transformation of the data in the vector form by the vector form, or the transformation of the data in the vector form into the data in the grid form, so that the time required to generate the corresponding data for the substrate is earlier than Significantly shortened.
尤其，根據技術方案2或技術方案3之發明，係基於曝光分辨度與對基板形成圖像時所容許之最大變形程度而規定網狀區域之分割尺寸，藉此設定網狀區域，以在假定之變形範圍內以實質之充分的描繪精度描繪電路圖案。藉此，可以供產生描繪資料之運算處理時間與描繪精度以適切平衡的態樣而產生描繪資料。 In particular, according to the invention of claim 2 or 3, the division size of the mesh region is defined based on the exposure resolution and the maximum degree of deformation allowed when forming an image on the substrate, thereby setting the mesh region to assume Within the range of deformation, the circuit pattern is drawn with substantially sufficient rendering accuracy. Thereby, the drawing data can be generated in such a manner that the calculation processing time and the drawing accuracy of the drawing data are appropriately balanced.
尤其，根據技術方案4之發明，由於係對應局部變形之程度而區別使用分割尺寸不同之網狀區域，因此可產生高精度對應於基板之變形之描繪資料。 In particular, according to the invention of claim 4, since the mesh regions having different split sizes are used in accordance with the degree of local deformation, it is possible to produce a drawing material with high precision corresponding to the deformation of the substrate.
圖1係顯示本發明之第1實施形態之描繪裝置1之概要構成之圖。描繪裝置1係藉由掃描且照射曝光用光之雷射光LB，對印刷電路基板、半導體基板、液晶基板等作為描繪對象之基板S連續進行局部曝光，藉此在基板S上描繪針對期望之電路圖案之曝光圖像的直接描繪裝置(直描裝置)。 Fig. 1 is a view showing a schematic configuration of a drawing device 1 according to a first embodiment of the present invention. The drawing device 1 continuously exposes the substrate S as a drawing target such as a printed circuit board, a semiconductor substrate, or a liquid crystal substrate by scanning and irradiating the laser light LB for exposure light, thereby drawing a desired circuit on the substrate S. Direct drawing device (straight drawing device) of the exposed image of the pattern.
描繪裝置1主要係包含產生描繪資料DD之資料處理裝置2、及基於描繪資料DD而進行實際描繪(曝光)之曝光裝置3。再者，無需一體設置資料處理裝置2與曝光裝置3，只要兩者間可收發資料，二者物理上分離也可。 The drawing device 1 mainly includes a data processing device 2 that generates drawing data DD, and an exposure device 3 that performs actual drawing (exposure) based on the drawing data DD. Furthermore, it is not necessary to integrally provide the data processing device 2 and the exposure device 3, as long as the data can be transmitted and received between the two, the two can be physically separated.
資料處理裝置2係例如基於藉由CAD等圖案設計裝置4而作成之電路圖案之作為設置資料的圖案資料DP，產生曝光裝置3之作為處理資料的描繪資料DD之裝置。圖案資料DP 通常係作為多邊形等之向量資料而描述。另一方面，由於曝光裝置3係基於作為網格資料而描述之描繪資料DD進行曝光，因此資料處理裝置2需要至少將圖案資料DP變換成網格資料。再者，本實施形態之描繪裝置1之情形下，係在以後述之態樣進行補正處理後產生描繪資料DD。藉此，即使基板S產生變形，亦可將如期望之電路圖案描繪於基板S。 The data processing device 2 is a device that creates a drawing data DD as processing material of the exposure device 3, for example, based on the pattern data DP of the circuit pattern created by the pattern designing device 4 such as CAD. Pattern data DP It is usually described as vector data such as polygons. On the other hand, since the exposure device 3 performs exposure based on the drawing material DD described as the mesh material, the material processing device 2 needs to at least convert the pattern data DP into mesh data. Further, in the case of the drawing device 1 of the present embodiment, the drawing data DD is generated after the correction processing is performed in a later manner. Thereby, even if the substrate S is deformed, a desired circuit pattern can be drawn on the substrate S.
資料處理裝置2主要具備資料變換機構21、資料分割機構22、基準位置特定機構23、及資料合成機構24。再者，資料處理裝置2亦可具備該等資料變換機構21、資料分割機構22、基準位置特定機構23、及資料合成機構24作為專用之電路元件，或者亦可將對包含CPU、ROM、RAM等之控制部(未圖示)讀入特定之程式並執行該程式，藉而將各個機構作為假想之構成要素而實現之電腦，作為資料處理裝置2而發揮機能之態樣。 The data processing device 2 mainly includes a data conversion unit 21, a data division unit 22, a reference position specifying unit 23, and a material synthesizing unit 24. Further, the data processing device 2 may include the data conversion unit 21, the data dividing unit 22, the reference position specifying unit 23, and the material synthesizing unit 24 as dedicated circuit elements, or may include a CPU, a ROM, and a RAM. The control unit (not shown) reads a specific program and executes the program, and the computer realized by using each unit as a imaginary component functions as the data processing device 2.
資料變換機構21係從圖案設計裝置4獲取圖案資料DP，且將其以曝光裝置3變換成可處理之網格形式之資料的初期描繪資料D1。該變換處理可利用眾所周知之技術。 The data conversion means 21 acquires the pattern data DP from the pattern designing apparatus 4, and converts it into the initial drawing material D1 of the material of the form which can be processed by the exposure apparatus 3. This transformation process can utilize well-known techniques.
資料分割機構22，係按照預先賦與之分割條件資料DC，將包含初期描繪資料D1所表現之電路圖案(描繪對象圖像)之描繪區域假想地分割成複數之矩形區域(網狀區域)RE(參照圖5)，而產生各個網狀區域RE之描繪區域之配置位置與描繪內容關連化之分割描繪資料D2。 The data dividing unit 22 virtually divides the drawing area including the circuit pattern (drawing target image) represented by the initial drawing data D1 into a plurality of rectangular areas (mesh areas) RE in accordance with the division condition data DC assigned in advance. (Refer to FIG. 5), the divided drawing data D2 in which the arrangement position of the drawing area of each mesh area RE is associated with the drawing content is generated.
基準位置特定機構23，首先係對設於基板S之被描繪面 Sa之對準標記(定位標記)Ma(參照圖7)之位置，基於藉由後述之攝像機構34所得之作為其攝像圖像之標記攝像資料DM而予以特定。然後，基於特定之該對準標記Ma之位置，特定出進行描繪時之複數之網狀區域RE之各個基準位置Ms(參照圖5)。然後，產生將各個網狀區域與基準位置Ms對應之基準位置資料DS。 The reference position specifying mechanism 23 first pairs the surface to be drawn on the substrate S The position of the alignment mark (positioning mark) Ma of Sa (refer to FIG. 7) is specified based on the mark imaging material DM which is obtained as the captured image by the imaging means 34 which will be described later. Then, based on the position of the alignment mark Ma, the respective reference positions Ms of the plurality of mesh regions RE at the time of drawing are specified (see FIG. 5). Then, a reference position data DS corresponding to each of the mesh regions and the reference position Ms is generated.
資料合成機構24係基於分割描繪資料D2與基準位置資料DS，在根據描述於基準位置資料DS之基準位置而配置複數之網狀區域RE的狀態下，合成各網狀區域RE之描述內容，產生描繪資料DD。 The data synthesizing unit 24 synthesizes the description contents of the respective mesh regions RE in a state in which the plurality of mesh regions RE are arranged based on the reference position data DS and the reference position data DS. Describe the data DD.
資料處理裝置2中，該等資料變換機構21、資料分割機構22、基準位置特定機構23、及資料合成機構24所進行之處理之細節。 Details of the processing performed by the data conversion means 21, the data division means 22, the reference position specifying means 23, and the material synthesizing means 24 in the data processing device 2.
曝光裝置3係根據從資料處理裝置2所賦與之描繪資料DD而對基板S進行描繪之裝置。 The exposure device 3 is a device that draws the substrate S based on the drawing data DD given from the material processing device 2.
曝光裝置3主要具備：控制各部分之動作之描繪控制器31、用以載置基板S之台座32、射出雷射光LB之光源33、及將載置於台座32之基板S之被描繪面Sa予以攝像之攝像機構34。 The exposure device 3 mainly includes a drawing controller 31 that controls the operation of each portion, a pedestal 32 on which the substrate S is placed, a light source 33 that emits the laser light LB, and a drawn surface Sa on which the substrate S is placed on the pedestal 32. The imaging mechanism 34 to be imaged.
曝光裝置3中，台座32與光源33中至少一方係可移動於互相正交之水平二軸方向之主掃描方向與副掃描方向。藉此，在將基板S載置於台座32之狀態下，可使台座32與光源33於主掃描方向相對移動且可從光源33照射雷射光LB。或者進而台座32亦可在水平面內旋轉移動，光源33亦可設 置成於垂直方向移動。 In the exposure apparatus 3, at least one of the pedestal 32 and the light source 33 is movable in the main scanning direction and the sub-scanning direction in the horizontal two-axis direction orthogonal to each other. Thereby, in a state where the substrate S is placed on the pedestal 32, the pedestal 32 and the light source 33 can be relatively moved in the main scanning direction, and the laser light LB can be irradiated from the light source 33. Or the pedestal 32 can also be rotated in a horizontal plane, and the light source 33 can also be set. Set to move in the vertical direction.
使用之雷射光LB之種類可對應作為掃描對象之基板S之種類等而適當地規定。 The type of the laser light LB to be used can be appropriately determined in accordance with the type of the substrate S to be scanned, and the like.
另，光源33備有例如DMD(數位式鏡裝置)等調制機構33a，且於接受調制機構33a之調制下從光源33射出之雷射光LB，係照射於台座32上之基板S。更具體言之，在描繪之前，首先，藉由描繪控制器31，根據設定各像素位置之曝光有無的描繪資料DD之描述內容，進行調制機構33a之各調制單位之雷射光LB之照射開/關的設定。光源33相對台座32(相對載置於其上之基板S)於主掃描方向相對移動之期間，係藉由根據該開/關設定而從光源33射出雷射光LB，而對台座32上之基板S照射基於描繪資料DD接受調制之雷射光LB。 Further, the light source 33 is provided with a modulation mechanism 33a such as a DMD (Digital Mirror Device), and the laser light LB emitted from the light source 33 under the modulation of the modulation mechanism 33a is irradiated onto the substrate S on the pedestal 32. More specifically, before the drawing, first, the drawing controller 31 performs illumination of the laser light LB of each modulation unit of the modulation mechanism 33a based on the description content of the drawing data DD for setting the exposure of each pixel position. Off setting. During the relative movement of the light source 33 with respect to the pedestal 32 (the substrate S placed thereon) in the main scanning direction, the laser light LB is emitted from the light source 33 according to the ON/OFF setting, and the substrate on the pedestal 32 is applied. The S-irradiation receives the modulated laser light LB based on the drawing data DD.
若雷射光LB掃描於某位置之主掃描方向，而結束該位置之曝光後，則光源33將於副掃描方向以特定距離相對移動，而再次對該位置之主掃描方向掃描雷射光LB。藉由重複如此動作，於基板S上形成基於掃描資料DD之圖像(曝光圖像)。 If the laser light LB is scanned in the main scanning direction of a certain position, and the exposure of the position is ended, the light source 33 will relatively move at a certain distance in the sub-scanning direction, and the laser light LB will be scanned again in the main scanning direction of the position. By repeating such an operation, an image (exposure image) based on the scanned material DD is formed on the substrate S.
攝像機構34主要是為攝像載置於台座32之基板S之被受光面上所形成之對準標記Ma而準備。該定位標記之攝像圖像係作為標記攝像資料DM，而如上述供給至資料處理裝置2之基準位置特定機構23。當然，攝像機構34亦可為為達其他目的之可進行攝像之態樣。 The imaging unit 34 is mainly prepared for imaging the alignment mark Ma formed on the light receiving surface of the substrate S placed on the pedestal 32. The captured image of the positioning mark is supplied to the reference position specifying means 23 of the data processing device 2 as described above as the mark imaging material DM. Of course, the camera mechanism 34 can also be used for imaging purposes for other purposes.
再者，基板S之對準標記之形成態樣，只要可正確地特 定其位置，並無特別限定。例如，亦可為利用貫通孔等之由機械加工所形成之對準標記之態樣，亦可以是使用印刷製程或藉由光微影製程等而圖案化之對準標記之態樣。 Furthermore, the alignment marks of the substrate S are formed as long as they are correct There is no particular limitation on the location. For example, an alignment mark formed by machining using a through hole or the like may be used, or an alignment mark patterned by a printing process or a photolithography process may be used.
以下，接著針對產生描繪資料DD時進行之補正處理，說明其基本概念。 Hereinafter, the basic concept will be described with respect to the correction processing performed when the drawing material DD is generated.
一般而言，圖案資料DP係假想不變形、被描繪畫面為平坦之理想形狀之基板而作成，但實際之基板會產生翹曲、扭曲、或伴隨先前步驟之處理之應變等之變形等。因此，即使直接在以圖案資料DP設定之配置位置而於基板S描繪電路圖案，亦無法獲得期望之電路圖案，因此需要對應基板S之形狀而變換電路圖案之形成位置座標之處理，以形成適合基板S形狀之電路圖案。本實施形態中，產生描繪資料DD時所進行之補正處理，明確而言係座標變換處理。 In general, the pattern data DP is created by a substrate that is not deformed and has a flat image, but the actual substrate is warped, twisted, or deformed by strain or the like accompanying the processing of the previous step. Therefore, even if the circuit pattern is drawn on the substrate S directly at the arrangement position set by the pattern data DP, the desired circuit pattern cannot be obtained. Therefore, it is necessary to convert the formation coordinate of the circuit pattern in accordance with the shape of the substrate S to form a suitable one. A circuit pattern of the shape of the substrate S. In the present embodiment, the correction processing performed when the data DD is drawn is clearly described as the coordinate conversion processing.
本實施形態之特徵在於係在考慮曝光裝置3之曝光分辨度下進行該補正處理，而謀求其單純化。 The present embodiment is characterized in that the correction processing is performed in consideration of the exposure resolution of the exposure device 3, and the simplification is performed.
圖2係用以說明曝光裝置3之曝光分辨度與所描繪之圖形之關係的圖。再者，圖2中，X軸方向為主掃描方向，Y軸方向為副掃描方向。 Figure 2 is a diagram for explaining the relationship between the exposure resolution of the exposure device 3 and the depicted figure. In addition, in FIG. 2, the X-axis direction is the main scanning direction, and the Y-axis direction is the sub-scanning direction.
曝光裝置3中，如上述，係藉由台座32與光源33於主掃描方向之相對移動而進行曝光。因此，圖2(a)所示之如圖形F1之相對X軸方向以傾斜角α1傾斜之邊，係在實際之描繪資料DD中，以近似如圖2(b)所示之階梯狀圖形F2而描 述。此時，階梯狀圖形F2之階差相當於曝光裝置3之副掃描方向之曝光分辨度。以下，令該曝光分辨度為δ。然後，如圖2(b)之(1)~(8)之箭頭所示，於主掃描方向分階段描繪。 In the exposure device 3, as described above, exposure is performed by the relative movement of the pedestal 32 and the light source 33 in the main scanning direction. Therefore, the side of the graph F1 shown in Fig. 2(a) which is inclined at an inclination angle α1 with respect to the X-axis direction is in the actual drawing data DD to approximate the step-like pattern F2 as shown in Fig. 2(b). And depict Said. At this time, the step difference of the step pattern F2 corresponds to the exposure resolution of the sub-scanning direction of the exposure device 3. Hereinafter, the exposure resolution is δ. Then, as indicated by the arrows of (1) to (8) of FIG. 2(b), the drawing is performed in stages in the main scanning direction.
此意味著，用以產生將圖形F1包含於描繪對象之描繪資料DD之補正處理中，無需產生將圖形F1如實地表現之座標值，直接產生表現階梯狀圖形F2之座標值即可。 This means that the correction processing for generating the drawing data DD for including the graphic F1 in the drawing object does not need to generate a coordinate value for expressing the graphic F1 as it is, and directly generates the coordinate value representing the stepped graphic F2.
再者，圖2(c)係顯示使具有小於圖形F1之傾斜角α1之傾斜角α2之圖形F3，與圖形F1相同地以δ為曝光分辨度，而以階梯狀圖形F4近似之情況。若使階梯狀圖形F2之階寬為w1，階梯狀圖形F2之階寬為W2，則w2>w1。 Further, Fig. 2(c) shows a pattern F3 having an inclination angle α2 smaller than the inclination angle α1 of the pattern F1, and similarly to the pattern F1, δ is the exposure resolution, and is approximated by the step pattern F4. If the step width of the stepped pattern F2 is w1 and the step width of the step pattern F2 is W2, then w2>w1.
另一方面，圖2(d)亦與圖2(c)相同，係顯示使圖形F3基於相同之副掃描方向之曝光分辨度δ而近似之情況。其中，圖2(d)中，使近似圖形F3之階梯狀圖形F5之階寬為w3時，令w3=2w1。此時，與圖1(c)相比雖近似之精度低，但若δ足夠小，則實用上可實現充分精度之近似。 On the other hand, Fig. 2(d) is also the same as Fig. 2(c), showing a case where the pattern F3 is approximated based on the exposure resolution δ of the same sub-scanning direction. In FIG. 2(d), when the step width of the step pattern F5 of the approximate pattern F3 is w3, let w3 = 2w1. At this time, although the accuracy of the approximation is lower than that of FIG. 1(c), if δ is sufficiently small, the approximation of sufficient accuracy can be practically achieved.
利用此，假設圖形F1之傾斜係原來沿著主掃描方向實際描繪電路圖案於基板S時該電路圖案所容許之最大傾斜(即沿著主掃描方向線段之最大變形誤差)，則描繪於基板S之各種電路圖案(小於圖形F1之傾斜之電路圖案)將必定可以具有δ之整數倍之階差與w1之整數倍之階寬的階梯狀圖形近似。另，相同之論述係於副掃描方向亦成立(但此時之曝光分辨度係以調制機構33a之調制單位之尺寸規定)。 With this, it is assumed that the tilt of the pattern F1 is the maximum tilt allowed by the circuit pattern when the circuit pattern is actually drawn on the substrate S along the main scanning direction (ie, the maximum deformation error along the line in the main scanning direction), and is depicted on the substrate S. The various circuit patterns (the circuit pattern smaller than the slope of the pattern F1) will necessarily have a step-like pattern approximation of the step width of the integer multiple of δ and the step width of the integer multiple of w1. In addition, the same discussion is also true in the sub-scanning direction (but the exposure resolution at this time is defined by the size of the modulation unit of the modulation mechanism 33a).
此意味著，進行考慮基板S之變形之補正處理(座標變換 處理)時，變換後之電路圖案，在主掃描方向係以基於副掃描方向之曝光分辨度而定之寬度為單位，在副掃描方向係以基於主掃描方向之曝光分變度而定之寬度為單位而被描繪。 This means that the correction processing (coordinate transformation) in consideration of the deformation of the substrate S is performed. In the case of processing, the converted circuit pattern is in units of width in the main scanning direction based on the exposure resolution in the sub-scanning direction, and in the sub-scanning direction in units of widths based on the exposure degree of the main scanning direction. It is depicted.
因此，本實施形態中，係預先將藉由自圖案資料DP而得之作為網格資料之初期描繪資料D1所表現之電路圖案全體，對應曝光分辨度與所容許之圖案變形程度，分割成各個縱橫長度決定之複數之矩形區域(網狀區域)，就各個網狀區域進行座標變換，而獲得描繪資料DD。該等一連串處理相當於本實施形態之補正處理。 Therefore, in the present embodiment, the entire circuit pattern represented by the initial drawing data D1 which is obtained from the pattern data DP as the mesh data is divided into the respective exposure resolutions and the degree of pattern deformation allowed. The rectangular area (mesh area) of the plural number determined by the vertical and horizontal lengths is coordinate-transformed for each mesh area, and the drawing data DD is obtained. These series of processes correspond to the correction process of this embodiment.
接著，針對實際在資料處理裝置2中所進行之處理詳細說明。本實施形態中，資料處理裝置2中所進行之處理大致分為前處理與後處理2種。前處理係欲對複數之基板S描繪相同之電路圖案時，預先對此進行一次之處理。其處理結果係共通地利用於相對各個基板S之電路圖案之描繪。另一方面，後處理係對各個基板S進行描繪時每次進行之處理。 Next, the processing actually performed in the data processing device 2 will be described in detail. In the present embodiment, the processing performed by the data processing device 2 is roughly classified into two types, pre-processing and post-processing. When the pre-processing is to draw the same circuit pattern for the plurality of substrates S, this is processed once in advance. The processing results are commonly used for the depiction of the circuit patterns of the respective substrates S. On the other hand, the post-processing is performed each time the respective substrates S are drawn.
首先說明前處理。圖3係顯示在資料處理裝置2中所進行之前處理之流程之圖。 First, the pre-processing will be explained. FIG. 3 is a diagram showing the flow of the previous processing performed in the material processing device 2.
首先，資料變換機構21自圖案設計裝置4獲取以向量形式描述之電路圖案之圖案資料DP(步驟S1)，將此變換成網格形式資料之初期描繪資料D1(步驟S2)。以下，圖案資料DP所表現之電路圖案係在設定於基板S之被描繪面Sa之矩 形描繪區域內描繪。再者，初期描繪資料D1之描述形式並無特別限定。 First, the material conversion means 21 acquires the pattern data DP of the circuit pattern described in vector form from the pattern designing means 4 (step S1), and converts this into the initial drawing material D1 of the mesh form data (step S2). Hereinafter, the circuit pattern represented by the pattern data DP is set at the moment of the drawn surface Sa of the substrate S. Depicted in the area of the depiction. Furthermore, the description form of the initial drawing data D1 is not particularly limited.
若獲得初期描繪資料D1，則資料分割機構22將根據分割條件資料DC之描述內容，求得用以從初期描繪資料D1產生分割描繪資料D2之網狀區域之基本尺寸(步驟S3)。再者，分割條件資料DC作為資料要素係包含：補正處理時特定電路圖案所容許之最大變形程度之資訊、及用於電路圖案之描繪之曝光裝置3之主掃描方向及副掃描方向的曝光分辨度。 When the initial drawing data D1 is obtained, the data dividing unit 22 obtains the basic size of the mesh region for generating the divided drawing data D2 from the initial drawing data D1 based on the description content of the dividing condition data DC (step S3). Further, the division condition data DC as the data element includes: information on the maximum degree of deformation allowed by the specific circuit pattern at the time of the correction processing, and exposure discrimination in the main scanning direction and the sub-scanning direction of the exposure device 3 for drawing the circuit pattern. degree.
圖4係用以說明資料分割機構22所進行之處理之圖。再者，圖4中，X軸方向設為主掃描方向，Y軸方向設為副掃描方向。另，圖4中包含以實線表示之各頂點A、B、C、D所構成之矩形，係表示圖案資料DP或初期描繪資料D1中電路圖案之描繪區域ABCD。此時，設頂點A之座標為(X1,Y1)，頂點B之座標為(X2,Y1)，頂點C之座標為(X2,Y2)，頂點D之座標為(X1,Y2)。另，若X2-X1=Lx、Y2-Y1=Ly，則Lx、Ly係表示主掃描方向及副掃描方向之描繪區域ABCD之尺寸。 FIG. 4 is a diagram for explaining processing performed by the data dividing unit 22. In addition, in FIG. 4, the X-axis direction is set as the main scanning direction, and the Y-axis direction is set as the sub-scanning direction. In addition, FIG. 4 includes a rectangle formed by solid lines indicating the vertices A, B, C, and D, and indicates a drawing area ABCD of the circuit pattern in the pattern data DP or the initial drawing material D1. At this time, let the coordinates of the vertex A be (X1, Y1), the coordinates of the vertex B be (X2, Y1), the coordinates of the vertex C be (X2, Y2), and the coordinates of the vertex D be (X1, Y2). Further, when X2-X1=Lx and Y2-Y1=Ly, Lx and Ly represent the size of the drawing area ABCD in the main scanning direction and the sub-scanning direction.
另，具有以虛線所示之該描繪區域ABCD之各個頂點A、B、C、及D為中心之4個矩形(分別包含A1~A4、B1~B4、C1~C4、D1~D4之矩形)，係表示補正處理時各頂點所容許之誤差範圍。該誤差範圍相當於電路圖案之構成單位所容許之最大誤差範圍。此處為了簡單論述，使任一矩形之X軸方向之尺寸為pLx、Y軸方向之尺寸為qLy(其中 0<p、q<<1)。 In addition, there are four rectangles (including rectangles of A1 to A4, B1 to B4, C1 to C4, and D1 to D4, respectively) having respective vertices A, B, C, and D of the drawing area ABCD indicated by broken lines. Is the tolerance range allowed by each vertex during the correction process. This error range corresponds to the maximum error range allowed by the constituent elements of the circuit pattern. For the sake of simplicity, the size of the X-axis direction of any rectangle is pLx, and the dimension of the Y-axis direction is qLy (where 0<p, q<<1).
該情形下，連結矩形A1A2A3A4內任意之點與矩形B1B2B3B4內任意之點之線段，係表現對應基板S之變形而邊AB可採取之變形後的狀態。此時，邊AB變成線段A3B1(或線段A2B4)之變形，將成為賦與邊AB所容許之最大傾斜之變形。相對此時之線段AB之邊A3B1之傾斜角α係表示邊AB所容許之最大傾斜。再者，傾斜角α滿足下式。 In this case, a line segment connecting any point in the rectangle A1A2A3A4 and an arbitrary point in the rectangle B1B2B3B4 is a state in which the deformation of the substrate S is performed and the side AB can be deformed. At this time, the side AB becomes a deformation of the line segment A3B1 (or the line segment A2B4), and becomes a deformation which gives the maximum inclination allowed by the side AB. The inclination angle α of the side A3B1 of the line segment AB at this time represents the maximum inclination allowed by the side AB. Furthermore, the inclination angle α satisfies the following formula.
tanα=qLy/(X2-X1-pLx)=qLy/(L-p)Lx≒qLy/Lx…式(1) Tanα=qLy/(X2-X1-pLx)=qLy/(L-p)Lx≒qLy/Lx...(1)
另，該論述對平行於邊AB之邊CD亦同樣成立，邊CD亦容許變形至具有相同傾斜角α之線段C4D2或線段C1D3。即，主掃描方向上，容許由水平狀態至傾斜角α之變形。再者，雖圖4中作為邊CD之變形例而顯示線段C3D1，但因邊CD至線段C3D1之變形所造成之傾斜角α'係小於傾斜角α，因此該變形在算出網狀區域之基本尺寸時不考慮。 In addition, the discussion is also true for the CD parallel to the side AB, and the side CD is also allowed to be deformed to the line segment C4D2 or the line segment C1D3 having the same inclination angle α. That is, the deformation from the horizontal state to the inclination angle α is allowed in the main scanning direction. Further, although the line segment C3D1 is displayed as a modification of the side CD in FIG. 4, the inclination angle α' due to the deformation of the side CD to the line segment C3D1 is smaller than the inclination angle α, so the deformation is basically calculated in the calculation of the mesh region. Size is not considered.
此處，若使副掃描方向之曝光分辨度為δy，則主掃描方向之網狀區域之基本尺寸wx可由下式求得。 Here, if the exposure resolution in the sub-scanning direction is δy, the basic size wx of the mesh region in the main scanning direction can be obtained by the following equation.
wx=δy/tanα=δ yLx/qLy…式(2) Wx=δy/tanα=δ yLx/qLy...(2)
同樣，副掃描方向上，邊BC及邊DA之變形所容許之最大傾斜角β滿足：tanβ=pLx/(Y2-Y1-qLy)=pLx/(1-q)Ly≒pLx/Ly…式(3)若使主掃描方向之曝光分辨度為δx，則副掃描方向之網狀區域之基本尺寸wy可由下式求得。 Similarly, the maximum tilt angle β allowed for the deformation of the side BC and the side DA in the sub-scanning direction satisfies: tan β = pLx / (Y2 - Y1 - qLy) = pLx / (1 - q) Ly ≒ pLx / Ly (... 3) If the exposure resolution in the main scanning direction is δx, the basic size wy of the mesh region in the sub-scanning direction can be obtained by the following equation.
wy=δx/tanβ=δ xLy/pLx…式(4) Wy=δx/tanβ=δ xLy/pLx...(4)
曝光裝置3之曝光分辨度δx、δy及頂點A、B、C、及D之誤 差範圍係作為分割條件DC而預先被賦與。另，Lx及Ly係由初期描繪資料D1特定之已知之值。或者亦可作為分割條件資料DC之資料要素而被賦與。無論如何，該等皆為已知之值。資料分割機構22基於該等值，根據式(3)及式(4)所示之運算式，求得網狀區域之基本尺寸wx、wy。 Exposure resolution δx, δy of the exposure device 3 and errors of the vertices A, B, C, and D The difference range is previously assigned as the division condition DC. Further, Lx and Ly are values known from the initial drawing data D1. Alternatively, it may be assigned as a data element of the division condition data DC. In any case, these are known values. Based on the equivalent values, the data dividing unit 22 obtains the basic dimensions wx and wy of the mesh regions based on the arithmetic expressions shown in the equations (3) and (4).
例如，若使描繪區域之尺寸為Lx=Ly=500mm，曝光分辨度為δx=δy=1μm，描繪區域之各頂點之誤差容許範圍為pLx=qLy=500μm(即，誤差容許範圍為描繪區域之尺寸的0.1%)，則wx、wy為約1μm。 For example, if the size of the drawing area is Lx=Ly=500 mm, the exposure resolution is δx=δy=1 μm, and the error tolerance range of each vertex of the drawing area is pLx=qLy=500 μm (that is, the error tolerance range is the drawing area. For 0.1% of the size, wx and wy are about 1 μm.
再者，頂點A、B、C、及D之誤差範圍各不相同之情形，亦可以相同之考慮方法求得基本尺寸wx及wy。若使頂點A、B、C、及D之X軸方向與Y軸方向之誤差範圍之組分別為(2axLx,2ayLy)、(2bxLx,2byLy)、(2cxLx,2cyLy)、(2dxLx,2dyLy)，則網狀區域RE之基本尺寸wx、wy分別成為如下。 Furthermore, in the case where the error ranges of the vertices A, B, C, and D are different, the basic dimensions wx and wy can be obtained by the same consideration method. If the error ranges of the X-axis direction and the Y-axis direction of the vertices A, B, C, and D are (2axLx, 2ayLy), (2bxLx, 2byLy), (2cxLx, 2cyLy), (2dxLx, 2dyLy), respectively, Then, the basic dimensions wx and wy of the mesh region RE are as follows.
wx≒Min{δ yLx/(ay+by)ly，δ yLx/(cy+dy)Ly} Wx≒Min{δ yLx/(ay+by)ly,δ yLx/(cy+dy)Ly}
wy≒Min{δ xLy/(bx+cx)lx，δ xLy/(dx+ax)Lx} Wy≒Min{δ xLy/(bx+cx)lx,δ xLy/(dx+ax)Lx}
若求得基本尺寸wx、wy，則資料分割機構22將包含初期描繪資料D1所表現之電路圖案之描繪區域分割成複數之網狀區域RE，而產生分割描繪資料D2(步驟S4)。 When the basic size wx and wy are obtained, the data dividing unit 22 divides the drawing area including the circuit pattern represented by the initial drawing data D1 into a plurality of mesh areas RE, and generates divided drawing data D2 (step S4).
圖5係模式化表示描繪區域之朝網狀區域RE分割之情況之圖。資料分割機構22在產生分割描繪資料D2時，不僅單單是就各個基本尺寸wx、wy區劃描繪區域(將藉此區劃之區域稱作基本區域RE0)，亦將於基本區域RE0周圍增加相 當於主掃描方向及副掃描方向之曝光分辨度δx、δy之寬度之附加區域RE1而成者，作為各個網狀區域RE，並且，在相鄰之網狀區域RE之間，以交疊附加區域RE1之方式決定網狀區域RE。圖5中，以虛線區劃之矩形為基本區域RE0，以斜線例示之基本區域RE0周圍所具備之區域為附加區域RE1，以實線區劃之區域為網狀區域RE。以使如此之將附加區域RE1以交疊之態樣進行分割此舉，係為避免最終獲得之描繪資料DD中原本雖應存在圖案但仍會產生空白之區域之故。 Fig. 5 is a view schematically showing a state in which the drawing area is divided toward the mesh area RE. When the divided information D2 is generated, the data dividing unit 22 not only simply draws the area for each basic size wx, wy (the area in which the area is divided is referred to as the basic area RE0), but also increases the phase around the basic area RE0. The additional area RE1 of the widths of the exposure resolutions δx and δy in the main scanning direction and the sub-scanning direction is formed as the respective mesh regions RE and overlapped between the adjacent mesh regions RE. The mode of the area RE1 determines the mesh area RE. In Fig. 5, the rectangle indicated by the broken line is the basic area RE0, the area around the basic area RE0 illustrated by the oblique line is the additional area RE1, and the area marked by the solid line is the mesh area RE. In order to divide the additional region RE1 in an overlapping manner, it is necessary to avoid an area in which the pattern DD which is originally obtained should have a pattern but still blank.
再者，作為特定各個網狀區域RE之資料要素，資料分割機構22實際作為分割描繪資料D2進行描繪者，係各個網狀區域RE之基準位置Ms之座標、該網狀區域RE之電路圖案之資訊、及網狀區域RE之主掃描方向與副掃描方向之尺寸mx、my。其中，由於mx=wx+2δx、my=wy+2δy，因此亦可為取代mx、my，而將wx、wy、δx、δy作為資料要素進行描述之態樣。另，網狀區域RE之基準位置Ms可任意設定，本實施形態係將如圖5所示之網狀區域RE之中心作為基準位置Ms處理。 Further, as the data element of the specific mesh area RE, the data dividing means 22 actually draws as the divided drawing material D2, and is the coordinate of the reference position Ms of each mesh area RE, and the circuit pattern of the mesh area RE. Information, and the size of the main scanning direction and the sub-scanning direction of the mesh area RE, mx, my. Among them, since mx=wx+2δx and my=wy+2δy, it is also possible to describe wx, wy, δx, and δy as data elements instead of mx and my. Further, the reference position Ms of the mesh region RE can be arbitrarily set. In the present embodiment, the center of the mesh region RE shown in Fig. 5 is treated as the reference position Ms.
若產生分割描繪資料D2，則前處理結束。 If the divided drawing data D2 is generated, the pre-processing ends.
接著，針對資料處理裝置2中所進行之後處理進行說明。後處理係即將對各個基板進行實際描繪之前每次進行之處理。 Next, the post-processing performed in the data processing device 2 will be described. The post-processing is the processing that will be performed each time before the actual drawing of each substrate.
圖6係顯示資料處理裝置2中所進行之後處理之流程之圖。圖7係顯示電路圖案設計時假想之理想狀態之對準標 記Ma之配置位置之圖。再者，本實施形態中，係以如圖7所示般之以複數之對準標記Ma在水平二軸方向分別等間隔設置之情形為例進行說明。另，圖7中，為參考而亦合併顯示網狀區域RE之基準位置Ms之配置。如上述般之等間隔配置對準標記Ma時，通常亦等間隔配置網狀區域RE之基準位置Ms。再者，圖7所示之實線及虛線係用以幫助圖之理解者，未必將如此之實線及虛線作為電路圖案而描述，並在基板S上觀察。 Fig. 6 is a view showing the flow of post processing performed in the material processing device 2. Figure 7 shows the alignment of the ideal state of the imaginary circuit design. Record the map of the location of Ma. In the present embodiment, a case where the plurality of alignment marks Ma are equally spaced in the horizontal two-axis direction as shown in FIG. 7 will be described as an example. In addition, in FIG. 7, the arrangement of the reference position Ms of the mesh area RE is also shown for reference. When the alignment marks Ma are arranged at equal intervals as described above, the reference positions Ms of the mesh regions RE are usually arranged at equal intervals. Further, the solid line and the broken line shown in FIG. 7 are used to assist the understanding of the figure, and such solid lines and broken lines are not necessarily described as circuit patterns, and are observed on the substrate S.
後處理中，首先將基板S載置於曝光裝置3之台座32(步驟S11)，且藉由攝像機構34進行設於基板S之被描繪面Sa之對準標記Ma的攝像(步驟S12)。再者，對準標記Ma之攝像方法，只要是接續於此之處理中可特定對準標記Ma之位置之態樣，並無特別限制。例如亦可以是一次即攝像基板S整體之態樣，或是與基板S之尺寸相比對準標記Ma之尺寸較小時，為確保攝像圖像之分辨度，亦可對一部份之對準標記Ma分別進行複數次攝像，而獲得複數之攝像圖像。 In the post-processing, first, the substrate S is placed on the pedestal 32 of the exposure apparatus 3 (step S11), and the imaging means 34 performs imaging of the alignment mark Ma provided on the drawing surface Sa of the substrate S (step S12). In addition, the imaging method of the alignment mark Ma is not particularly limited as long as it is a position at which the alignment mark Ma can be specified in the process. For example, the imaging substrate S may be used as a whole, or when the size of the alignment mark Ma is smaller than the size of the substrate S, in order to ensure the resolution of the captured image, a part of the image may be The quasi-marker Ma performs a plurality of times of imaging, respectively, to obtain a plurality of captured images.
藉由攝像機構34獲得之作為攝像圖像之標記攝像資料DM，係經由描繪控制器31而被賦與至基準位置特定機構23。 The marker imaging material DM as a captured image obtained by the imaging unit 34 is assigned to the reference position specifying unit 23 via the drawing controller 31.
基準位置特定機構23若獲取標記攝像資料DM，則將基於此而特定設於基板S之對準標記Ma之位置座標(步驟S13)。該位置座標之特定，較佳的一例係例如藉由對攝像圖像實施二進制化處理等眾所周知之圖像處理而進行。 When the reference position specifying means 23 acquires the mark imaging material DM, the positional coordinates of the alignment mark Ma provided on the substrate S are specified based on this (step S13). A preferred example of the position coordinates is, for example, a well-known image processing such as binarization processing on a captured image.
若攝像機構34所攝像之基板S無變形，則如圖7所示，雖對準標記Ma係以等間隔位置，但通常由於基板S變形，因此對準標記Ma之位置亦由理想之位置偏離。由於其變形方式因不同之基板S而不同，因此曝光裝置3中為對各個基板S形成期望之圖案，需要藉由對各個基板S之實際測量而特定作為基板S之變形指標之對準標記Ma的位置。圖8係顯示實際之基板S之對準標記Ma之位置之圖。圖8中，係以虛線圓形記號一併記載圖7所示之理想配置之對準標記Ma。 When the substrate S imaged by the imaging unit 34 is not deformed, the alignment marks Ma are equally spaced as shown in FIG. 7. However, since the substrate S is usually deformed, the position of the alignment mark Ma is also deviated from the ideal position. . Since the deformation mode differs depending on the substrate S, the exposure device 3 forms a desired pattern for each of the substrates S, and it is necessary to specify the alignment mark Ma as the deformation index of the substrate S by actual measurement of each substrate S. s position. Fig. 8 is a view showing the position of the alignment mark Ma of the actual substrate S. In Fig. 8, the alignment mark Ma of the ideal configuration shown in Fig. 7 is collectively shown by a dotted circular mark.
若特定全部對準標記Ma之位置座標，則接著基準位置特定機構23將特定各個網狀區域RE之配置位置，以使各個網狀區域RE之配置對應於基板S之變形。具體言之，係基於周圍之對準標記Ma之位置座標，特定各個網狀區域RE之基準位置Ms之位置座標(步驟S14)。即，在理想狀態下，進行如圖5所示之井然配置之網狀區域RE對應於基板S之形狀再配置時之特定配置位置之處理。 If the position coordinates of the mark Ma are all aligned, the reference position specifying mechanism 23 then positions the specific mesh regions RE so that the arrangement of the respective mesh regions RE corresponds to the deformation of the substrate S. Specifically, the position coordinates of the reference position Ms of each of the mesh regions RE are specified based on the position coordinates of the surrounding alignment marks Ma (step S14). That is, in an ideal state, the processing of the specific arrangement position when the mesh region RE of the well-arranged configuration shown in FIG. 5 is reconfigured corresponding to the shape of the substrate S is performed.
例如，圖8所示之基準位置Ms1、Ms2、Ms3及Ms4之位置座標，係基於位於其周圍之對準標記Ma1、Ma2、Ma3及Ma4(或其一部份)之位置座標而特定。圖8中，例示藉由該處理而特定位置座標之基準位置Ms。再者，基準位置Ms之位置座標之特定可利用眾所周知之座標變換方法。作為其一例，有以下態樣等：在考慮對準標記Ma1、Ma2、Ma4所構成之三角形時，求得表示從圖7所示之理想配置時之該三角形朝基於圖8所示之實際配置之三角形的仿射 變換之行列，使用該行列進行基準位置Ms之座標變換。 For example, the position coordinates of the reference positions Ms1, Ms2, Ms3, and Ms4 shown in FIG. 8 are specified based on the position coordinates of the alignment marks Ma1, Ma2, Ma3, and Ma4 (or a part thereof) located around them. In Fig. 8, the reference position Ms of the specific position coordinates by this processing is exemplified. Furthermore, the specificity of the position coordinates of the reference position Ms can be determined by a well-known coordinate transformation method. As an example, there is a case where, when considering a triangle formed by the alignment marks Ma1, Ma2, and Ma4, the triangle from the ideal arrangement shown in FIG. 7 is obtained toward the actual configuration based on FIG. Affinity of the triangle The row of the transformation is used to perform the coordinate transformation of the reference position Ms using the row and column.
基準位置特定機構23，係以如此之態樣求得各網狀區域RE之基準位置Ms之位置座標，產生將各個網狀區域RE之位置座標與描述於分割描繪資料D2之該網狀區域RE之描繪內容關連化之基準位置資料DS。 The reference position specifying mechanism 23 obtains the position coordinates of the reference position Ms of each of the mesh regions RE in such a manner, and generates the position coordinates of the respective mesh regions RE and the mesh region RE described in the divided drawing data D2. The reference location data DS that depicts the content is related.
若產生基準位置資料DS，則資料合成機構24將基於該基準位置資料DS而產生描繪資料DD(步驟S15)。具體言之，使各網狀區域RE之配置位置從描述於分割描繪資料D2之理想位置，對應描述於基準位置資料DS之基準位置Ms之配置位置而移位後，合成各個網狀區域RE之描繪內容，產生對描繪區域整體表現描繪內容之一個描繪資料DD。再者，網狀區域RE之移位，係藉由對應基準位置Ms之座標移動(平移)，使構成各網狀區域RE之像素之座標移動而實現。 When the reference position data DS is generated, the material synthesizing unit 24 generates the drawing material DD based on the reference position data DS (step S15). Specifically, the arrangement positions of the respective mesh regions RE are shifted from the ideal positions described in the divided drawing data D2, corresponding to the arrangement positions of the reference positions Ms described in the reference position data DS, and the respective mesh regions RE are synthesized. The content is drawn, and a drawing material DD that expresses the content of the entire rendering area is generated. Further, the displacement of the mesh region RE is achieved by shifting (translation) the coordinates corresponding to the reference position Ms and moving the coordinates of the pixels constituting each of the mesh regions RE.
圖9係顯示根據基準位置資料DS之描述內容而配置各個網狀區域RE之狀態之圖。如圖9所示，雖相鄰之網狀區域RE間會產生描繪內容交疊之部位，但此可藉由實行採取兩者相乘等特定之邏輯運算而調整。 Fig. 9 is a view showing a state in which the respective mesh regions RE are arranged in accordance with the description contents of the reference position data DS. As shown in FIG. 9, although the portions where the drawing contents overlap are formed between the adjacent mesh regions RE, this can be adjusted by performing a specific logical operation such as multiplication of the two.
圖10係例示配置如圖9所示之網狀區域RE時，藉由資料合成機構24產生之描繪資料DD所規定之描繪區域RE2之圖。圖10中，為參考而一併圖示對準標記Ma。再者，圖10雖省略圖示，但實際在該描繪區域RE2內，基於描述於分割描繪資料D2之內容而配置電路圖案。 FIG. 10 is a view showing a drawing area RE2 defined by the drawing material DD generated by the material synthesizing unit 24 when the mesh area RE shown in FIG. 9 is arranged. In Fig. 10, the alignment mark Ma is collectively shown for reference. Although not shown in FIG. 10, the circuit pattern is actually arranged in the drawing area RE2 based on the content described in the divided drawing material D2.
藉由描繪資料DD之產生，資料處理裝置2之後處理結 束。所產生之描繪資料DD係賦與至曝光裝置3。曝光裝置3係基於獲取之描繪資料資料DD，而實行對基板S之描繪處理。然後，該描繪處理結束後，將新的基板S作為針對相同電路圖案之描繪對象時，資料處理裝置2將再次重複後處理。 By drawing the data DD, the data processing device 2 processes the knot bundle. The generated drawing data DD is assigned to the exposure device 3. The exposure device 3 performs a drawing process on the substrate S based on the acquired drawing data DD. Then, when the new substrate S is drawn as the same circuit pattern after the drawing process is completed, the material processing device 2 repeats the post-processing again.
根據以上說明之本實施形態，在先於對基板描繪進行前處理之時點，係預先根據曝光裝置3之曝光分辨度與電路圖案所容許之最大變形程度(具體言之為邊之傾斜程度)，將描繪區域分割成複數之網狀區域RE。然後，在實際對各個基板S進行描繪時，對應由設於該基板S之對準標記Ma之配置所特定之該基板S之變形，使各個網狀區域RE之配置位置移位(即對應基板S之變形再配置網狀區域RE)，藉此產生對應該基板S之變形之描繪資料DD。 According to the present embodiment described above, the pre-processing of the substrate drawing is performed in advance according to the exposure resolution of the exposure device 3 and the maximum degree of deformation allowed by the circuit pattern (specifically, the degree of inclination of the side). The drawing area is divided into a plurality of mesh areas RE. Then, when actually drawing the respective substrates S, the arrangement positions of the respective mesh regions RE are shifted corresponding to the deformation of the substrate S specified by the arrangement of the alignment marks Ma provided on the substrate S (ie, the corresponding substrate The deformation of S reconfigures the mesh region RE), thereby producing a depiction data DD corresponding to the deformation of the substrate S.
該情形下，以向量形式描述之圖案資料DP，在前處理時僅為一次變換成網格形式資料之初期描繪資料D1。即，不重複進行對應各個基板S之變形而由向量形式之資料至網格資料之變換。另，不將向量形式之資料變換為不同向量形式之資料。取代於此，本實施形態係藉由網狀區域之再配置而實現補正。因此，用以產生對應基板S之描繪資料DD所需要之時間比先前顯著縮短。例如，即使是變化點較多之複雜之圖案資料或描繪區域較大之圖案資料，亦可實現不需要長時間即可有效產生描繪資料。 In this case, the pattern data DP described in vector form is only transformed into the initial drawing data D1 of the grid form data in the pre-processing. That is, the transformation from the vector form of the data to the grid data is not repeated for the deformation of the respective substrates S. In addition, the data in vector form is not transformed into data in different vector forms. Instead of this, the present embodiment achieves correction by relocation of the mesh region. Therefore, the time required to generate the drawing material DD corresponding to the substrate S is significantly shorter than before. For example, even a complicated pattern data having a large number of change points or a pattern material having a large drawing area can realize that the drawing data can be efficiently generated without a long time.
另，網狀區域越細地設定，用以使各個網狀區域移位之演算越需要時間，若較粗地設定則難以使描繪資料充分對 應基板S之變形，而使電路圖案之描繪精度變差。本實施形態係基於曝光裝置3之曝光分辨度與電路圖案所容許之最大變形程度而決定，藉此以設定網狀區域，以在假想之變形範圍內以實質上充分之描繪精度描繪電路圖案，因此可以運算處理時間與描繪精度適切平衡的態樣產生描繪資料。 In addition, the finer the mesh area is set, the more time it takes to calculate the displacement of each mesh area, and if it is set coarsely, it is difficult to make the drawing data sufficiently The deformation of the substrate S is deteriorated, and the drawing accuracy of the circuit pattern is deteriorated. This embodiment is determined based on the exposure resolution of the exposure device 3 and the maximum degree of deformation allowed by the circuit pattern, thereby setting the mesh region to draw the circuit pattern with substantially sufficient drawing accuracy within the virtual deformation range. Therefore, the drawing data can be generated by calculating the processing time and the drawing accuracy.
實現縮短描繪處理時間之態樣不限於第1實施形態所示者。以下針對以不同於第1實施形態之態樣實現描繪時間之縮短的態樣進行說明。再者，本實施形態中，針對可發揮與第1實施形態所說明者相同之作用效果之構成要素，於此僅附加與第1實施形態相同之符號，省略其詳細說明。 The aspect in which the drawing processing time is shortened is not limited to those shown in the first embodiment. Hereinafter, an aspect in which the drawing time is shortened in a different manner from the first embodiment will be described. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted.
圖11係顯示本發明之第2實施形態之描繪裝置101之概要構成之圖。描繪裝置101亦與第1實施形態之描繪裝置1相同，係藉由掃描且照射曝光用光之雷射光LB，連續對基板S進行局部曝光，藉此在基板S上描繪期望之電路圖案之曝光圖像的直接描繪裝置。 Fig. 11 is a view showing a schematic configuration of a drawing device 101 according to a second embodiment of the present invention. Similarly to the drawing device 1 of the first embodiment, the drawing device 101 continuously exposes the substrate S by scanning and irradiating the laser light LB for exposure light, thereby drawing an exposure of a desired circuit pattern on the substrate S. A direct rendering device for images.
描繪裝置101主要係包含產生描繪資料DD之資料處理裝置102、及基於描繪資料DD實際進行描繪(曝光)之曝光裝置3而構成。再者，無須一體設置資料處理裝置102與曝光裝置3，只要兩者間可收發資料，則二者亦可物理性分離。 The drawing device 101 mainly includes a data processing device 102 that generates drawing data DD and an exposure device 3 that actually draws (exposures) based on the drawing data DD. Furthermore, it is not necessary to integrally provide the data processing device 102 and the exposure device 3, and the two can be physically separated as long as data can be transmitted and received between the two.
資料處理裝置102與第1實施形態之描繪裝置1所具備之資料處理裝置相同，係例如基於藉由CAD等圖案設計裝置4所製作成之電路圖案之設計資料的圖案資料DP，產生曝光裝置3之處理資料之描繪資料DD的裝置。 Similarly to the data processing device included in the drawing device 1 of the first embodiment, the data processing device 102 generates the exposure device 3 based on, for example, the pattern data DP of the design data of the circuit pattern created by the pattern design device 4 such as CAD. A device for processing data DD for processing data.
資料處理裝置102與資料處理裝置2相同，係具備資料變換機構21、資料分割機構22、及資料合成機構24。另，資料處理裝置102又具備取代基準位置特定機構23之區域配置機構25。再者，資料處理裝置102亦可具備該等資料變換機構21、資料分割機構22、資料合成機構24、及區域配置機構25作為專用之電路元件，或者亦可為對包含CPU、ROM、RAM等之控制部(未圖示)讀入特定之程式，並藉由將其執行而將各個機構作為假想之構成要素而實現之電腦作為資料處理裝置102而發揮機能的態樣。 Similarly to the data processing device 2, the data processing device 102 includes a data conversion unit 21, a data dividing unit 22, and a material synthesizing unit 24. Further, the data processing device 102 further includes an area arrangement mechanism 25 that replaces the reference position specifying unit 23. Furthermore, the data processing device 102 may include the data conversion unit 21, the data dividing unit 22, the data synthesizing unit 24, and the area arrangement unit 25 as dedicated circuit elements, or may include a CPU, a ROM, a RAM, etc. A control unit (not shown) reads a specific program, and a computer realized by using each of the mechanisms as a imaginary component to function as the data processing device 102 functions as a function.
本實施形態之描繪裝置101，係預先準備將描繪區域分割成複數之網狀區域RE時之基本尺寸對應於變位等級(後述)而分別不同之複數之分割描繪資料D2，且對基板S描繪時，就各描繪區域之特定部份區域適用具有對應該部份區域之變位等級之尺寸的網狀區域RE，再使該等與第1實施形態相同地移位。然後，藉由合成其移位之結果，產生描繪資料DD。換言之，本實施形態中，係使對應基板S之變形而再配置之網狀區域RE之尺寸因局部變形之程度而不同。藉此，本實施形態無需實施第1實施形態之資料分割機構22所進行之用以特定基本尺寸的運算處理。因此，本實施形態之情形亦無需將曝光裝置3之曝光分辨度作為分 割條件資料DC而保持。 The drawing device 101 of the present embodiment prepares a plurality of divided drawing materials D2 whose basic sizes are different from the displacement level (described later) when the drawing region is divided into a plurality of mesh regions RE, and the substrate S is drawn. In the case of a specific partial region of each drawing region, a mesh region RE having a size corresponding to the displacement level of the partial region is applied, and these are shifted in the same manner as in the first embodiment. Then, by synthesizing the result of the shift, the drawing data DD is generated. In other words, in the present embodiment, the size of the mesh region RE rearranged corresponding to the deformation of the substrate S is different depending on the degree of local deformation. Therefore, in the present embodiment, it is not necessary to perform the arithmetic processing for specifying the basic size by the data dividing unit 22 of the first embodiment. Therefore, in the case of the present embodiment, it is not necessary to take the exposure resolution of the exposure device 3 as a point. The condition data DC is cut and kept.
為實現上述處理，本實施形態係對應變位等級而預先設定主掃描方向及副掃描方向各者之複數之基本尺寸。此處，所謂變位等級，係分階段表示描繪區域之變位程度之任意指標。變位等級與對應於此之基本尺寸之關係，係描述於預先設定之分割條件資料DC。然後，資料分割機構22產生對應該等複數之基本尺寸之複數種分割描繪資料D2。 In order to realize the above processing, in the present embodiment, the basic size of each of the main scanning direction and the sub-scanning direction is set in advance in accordance with the displacement level. Here, the displacement level is an arbitrary index indicating the degree of displacement of the drawing area in stages. The relationship between the displacement level and the basic size corresponding thereto is described in the predetermined division condition data DC. Then, the data dividing unit 22 generates a plurality of pieces of divided drawing data D2 corresponding to the basic size of the plural.
另，區域配置機構25係就描繪區域中預先決定之各部份區域，特定適用之網狀區域RE之種類(尺寸)，且對應該部份區域之變形而使各網狀區域RE移位。區域配置機構25係產生描述該結果之區域配置資料DA。 Further, the area arrangement unit 25 specifies the type (size) of the mesh area RE to be applied in advance in each of the predetermined partial areas in the drawing area, and shifts the respective mesh areas RE in response to the deformation of the partial areas. The area configuration mechanism 25 generates an area configuration data DA describing the result.
資料合成機構24係根據區域配置資料DA之描述內容而合成網狀區域RE之描繪內容，且產生描繪資料DD。 The data synthesizing unit 24 synthesizes the rendered content of the mesh area RE based on the description content of the area allocation data DA, and generates the drawing material DD.
針對以本實施形態之資料處理裝置102進行之處理，大致分為前處理與後處理。首先就前處理進行說明。圖12係顯示以資料處理裝置102進行之前處理之流程之圖。 The processing performed by the data processing device 102 of the present embodiment is roughly classified into pre-processing and post-processing. First, explain the pre-processing. FIG. 12 is a diagram showing the flow of the previous processing by the data processing apparatus 102.
本實施形態係與第1實施形態相同，亦進行利用資料變換機構21之圖案資料DP之獲取(步驟S21)、與將此變換成網格形式之資料之初期描繪資料D1之處理(步驟S22)。 In the present embodiment, as in the first embodiment, the acquisition of the pattern data DP by the material conversion unit 21 (step S21) and the processing of converting the initial image data D1 into the data in the grid form are performed (step S22). .
若獲得初期描繪資料D1，則藉由資料分割機構22，根據描述於分割條件資料DC之基本尺寸之設定值，產生複數之分割描繪資料D2(步驟S23)。再者，只要所使用之基本 尺寸之設定方法不同，即可使相鄰之網狀區域RE具有重疊之點與第1實施形態相同。 When the initial drawing data D1 is obtained, the data dividing unit 22 generates a plurality of divided drawing data D2 based on the setting values described in the basic size of the dividing condition data DC (step S23). Again, as long as the basics used The method of setting the size is different, and the point where the adjacent mesh regions RE overlap can be made the same as in the first embodiment.
若產生分割描繪資料D2，則前處理結束。 If the divided drawing data D2 is generated, the pre-processing ends.
接著，針對資料處理裝置102中進行之後處理進行說明。圖13係顯示資料處理裝置102中進行之後處理之流程之圖。 Next, the post-processing in the data processing device 102 will be described. FIG. 13 is a diagram showing the flow of post processing in the material processing device 102.
首先，將基板S載置於台座32(步驟S31)，且藉由攝像機構34對準標記Ma(步驟S32)攝像，再根據所得之標記攝像資料DM特定對準標記Ma之位置，至此之處理係與第1實施形態相同地進行。 First, the substrate S is placed on the pedestal 32 (step S31), and the image is detected by the image pickup mechanism 34 (step S32), and the position of the alignment mark Ma is specified based on the obtained mark image data DM. This is carried out in the same manner as in the first embodiment.
針對各對準標記Ma，若基板S之實際位置已特定，則區域配置機構25將基於從曝光裝置3以同於第1實施形態之方式獲得之標記攝像資料DM，而特定實際之基板S之各部份區域符合之變位等級。再者，若將分割條件資料DC之與該變位等級關連化之網狀區域Re之種類予以特定，則與第1實施形態相同，就各該部份區域，對應於基板S之變形而移位各網狀區域RE之基準位置Ms之位置，並特定其配置(步驟S34)。區域配置機構25係產生描述該結果之區域配置資料DA。 For each alignment mark Ma, if the actual position of the substrate S is specified, the area arrangement mechanism 25 specifies the actual substrate S based on the mark imaging material DM obtained from the exposure device 3 in the same manner as the first embodiment. Each part of the area meets the displacement level. Further, when the type of the mesh region Re in which the division condition data DC is related to the displacement level is specified, as in the first embodiment, each of the partial regions is shifted corresponding to the deformation of the substrate S. The position of the reference position Ms of each of the mesh regions RE is set and its configuration is specified (step S34). The area configuration mechanism 25 generates an area configuration data DA describing the result.
圖14係用以概念上說明藉由區域配置機構25實現之處理之圖。如圖14(a)所示，特定對準標記Ma之位置之結果為，就部份區域AR1與部份區域AR4之變位量相對較小，而就部份區域AR2與部份區域AR3之變位量相對較大的情形下，如圖14(b)所示，對應於後者之區域中係配置有基本 尺寸相對較小之網狀區域REα，對應於前者之區域中係配置有基本尺寸相對較大之網狀區域REβ。雖圖14為簡單起見而例示變位等級為2種水準之情形，但設定更多水準之變位等級之情形下，考慮方法亦屬相同。 FIG. 14 is a diagram for conceptually explaining the processing realized by the area arrangement mechanism 25. As shown in FIG. 14(a), the position of the specific alignment mark Ma is such that the displacement amount of the partial area AR1 and the partial area AR4 is relatively small, and the partial area AR2 and the partial area AR3 are In the case where the amount of displacement is relatively large, as shown in FIG. 14(b), the basic configuration is corresponding to the latter. The mesh region REα having a relatively small size corresponds to the mesh region REβ having a relatively large basic size in the region corresponding to the former. Although FIG. 14 exemplifies the case where the displacement level is two levels for the sake of simplicity, the case is considered to be the same in the case of setting a level of displacement of more levels.
若產生區域配置資料DA，則資料合成機構24將基於該區域配置資料DA而產生描繪資料DD(步驟S35)。具體言之，與第1實施形態相同，就各部份區域將各網狀區域RE之配置位置從描述於分割描繪資料D2之理想位置，對應描述於區域配置資料DA之基準位置MS之配置位置而移位後，合成各個網狀區域RE之描繪內容，產生表現對於描繪區域整體之描繪內容的一個描繪資料DD。 When the area allocation data DA is generated, the material synthesizing unit 24 generates the drawing material DD based on the area allocation data DA (step S35). Specifically, in the same manner as in the first embodiment, the arrangement position of each mesh area RE is set from the ideal position described in the divided drawing data D2 to the position of the reference position MS of the area configuration data DA. After the shift, the drawing contents of the respective mesh regions RE are combined to generate one drawing material DD representing the drawing content of the entire drawing region.
本實施形態之情形亦與第1實施形態相同，以向量形式描述之圖案資料DP僅在前處理時一次變換成網格形式資料之初期描繪資料D1。因此，用以產生對應基板S之描繪資料DD所需要之時間比先前顯著縮短。 Also in the case of the present embodiment, as in the first embodiment, the pattern data DP described in the vector form is converted into the initial drawing material D1 of the mesh type data at a time only in the pre-processing. Therefore, the time required to generate the drawing material DD corresponding to the substrate S is significantly shorter than before.
另，本實施形態之情形中，係區別使用尺寸因局部變形之程度而不同之網狀區域RE，因此可產生比第1實施形態更高精度對應基板變形之描繪資料。 Further, in the case of the present embodiment, the mesh region RE having a different size depending on the degree of local deformation is used. Therefore, it is possible to produce a drawing material in which the substrate is deformed with higher precision than the first embodiment.
1、101‧‧‧描繪裝置 1, 101‧‧‧ depicting device
2、102‧‧‧資料處理裝置 2, 102‧‧‧ data processing device
3‧‧‧曝光裝置 3‧‧‧Exposure device
32‧‧‧台座 32‧‧‧ pedestal
33‧‧‧光源 33‧‧‧Light source
33a‧‧‧調制機構 33a‧‧‧ Modulation
34‧‧‧攝像機構 34‧‧‧ camera organization
Ma、Ma1、Ma2、Ma3、Ma4‧‧‧對準標記 Ma, Ma1, Ma2, Ma3, Ma4‧‧‧ alignment marks
Ms、Ms1、Ms2、Ms3、Ms4‧‧‧(網狀區域之)基準位置 Ms, Ms1, Ms2, Ms3, Ms4‧‧‧ (network area) reference position
RE、REα、REβ‧‧‧網狀區域 RE, REα, REβ‧‧‧ mesh area
RE0‧‧‧基本區域 RE0‧‧‧ basic area
RE1‧‧‧附加區域 RE1‧‧‧Additional area
RE2‧‧‧描繪區域 RE2‧‧‧ depicting area
S‧‧‧基板 S‧‧‧Substrate
Sa‧‧‧被描繪面 Sa‧‧‧ is depicted
圖1係顯示第1實施形態之描繪裝置1之概要構成之圖。 Fig. 1 is a view showing a schematic configuration of a drawing device 1 according to the first embodiment.
圖2(a)~(d)係用以說明曝光裝置3之曝光分辨度與所描繪之圖形之關係之圖。 2(a) to (d) are diagrams for explaining the relationship between the exposure resolution of the exposure device 3 and the drawn figure.
圖3係顯示資料處理裝置2中所進行之前處理之流程之圖。 Fig. 3 is a view showing the flow of the previous processing performed in the material processing device 2.
圖4係用以說明資料分割機構22中所進行之處理之圖。 FIG. 4 is a diagram for explaining processing performed in the data dividing unit 22.
圖5係模式化顯示網狀區域RE之分割情況之圖。 Fig. 5 is a view schematically showing the division of the mesh region RE.
圖6係顯示資料處理裝置2中進行之後處理之流程之圖。 Fig. 6 is a view showing the flow of post processing in the material processing device 2.
圖7係顯示理想狀態之對準標記Ma之配置位置之圖。 Fig. 7 is a view showing the arrangement position of the alignment mark Ma in an ideal state.
圖8係顯示基板S之對準標記Ma之位置之圖。 Fig. 8 is a view showing the position of the alignment mark Ma of the substrate S.
圖9係顯示根據基準位置資料DS之描述內容配置各個網狀區域RE之狀態之圖。 Fig. 9 is a view showing a state in which the respective mesh regions RE are arranged in accordance with the description contents of the reference position data DS.
圖10係例示由資料合成機構24產生之描繪資料DD之描繪區域RE2之圖。 FIG. 10 is a view showing a drawing area RE2 of the drawing material DD generated by the material synthesizing unit 24.
圖11係顯示本發明之第2實施形態之描繪裝置101之概要構成之圖。 Fig. 11 is a view showing a schematic configuration of a drawing device 101 according to a second embodiment of the present invention.
圖12係顯示資料處理裝置102中進行之前處理之流程之圖。 FIG. 12 is a diagram showing the flow of the previous processing in the material processing device 102.
圖13係顯示資料處理裝置102中進行之後處理之流程之圖。 FIG. 13 is a diagram showing the flow of post processing in the material processing device 102.
圖14(a)、(b)係用以概念上說明由區域配置機構25所實現之處理之圖。 14(a) and (b) are diagrams for conceptually explaining the processing realized by the area arrangement unit 25.
1‧‧‧描繪裝置 1‧‧‧Drawing device
2‧‧‧資料處理裝置 2‧‧‧ data processing device
3‧‧‧曝光裝置 3‧‧‧Exposure device
4‧‧‧圖案設計裝置 4‧‧‧pattern design device
21‧‧‧資料變換機構 21‧‧‧Data Conversion Agency
22‧‧‧資料分割機構 22‧‧‧Information Division
23‧‧‧基準位置特定機構 23‧‧‧Base location specific institutions
24‧‧‧資料合成機構 24‧‧‧Data synthesis agency
31‧‧‧描繪控制器 31‧‧‧Drawing controller
32‧‧‧台座 32‧‧‧ pedestal
33‧‧‧光源 33‧‧‧Light source
33a‧‧‧調制機構 33a‧‧‧ Modulation
34‧‧‧攝像機構 34‧‧‧ camera organization
D1‧‧‧初期描繪資料 D1‧‧‧ initial description
D2‧‧‧分割描繪資料 D2‧‧‧Split data
DC‧‧‧分割條件資料 DC‧‧‧Division data
DD‧‧‧描繪資料 DD‧‧‧ depicting information
DM‧‧‧標記攝像資料 DM‧‧‧ mark camera data
DP‧‧‧圖案資料 DP‧‧‧ pattern data
DS‧‧‧基準位置資料 DS‧‧‧Base location data
LB‧‧‧雷射光 LB‧‧‧Laser light
S‧‧‧基板 S‧‧‧Substrate
Sa‧‧‧被描繪面Sa‧‧‧ is depicted
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009050388A JP5209544B2 (en) | 2009-03-04 | 2009-03-04 | Drawing apparatus, data processing apparatus for drawing apparatus, and drawing data generation method for drawing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201033755A TW201033755A (en) | 2010-09-16 |
| TWI417676B true TWI417676B (en) | 2013-12-01 |
Family
ID=42965968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099101254A TWI417676B (en) | 2009-03-04 | 2010-01-18 | Drawing apparatus data, processing apparatus for drawing apparatus, and method of producing drawing data for drawing apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5209544B2 (en) |
| KR (1) | KR101151494B1 (en) |
| TW (1) | TWI417676B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI728344B (en) * | 2018-07-20 | 2021-05-21 | 日商斯庫林集團股份有限公司 | Drawing apparatus and drawing method |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5496041B2 (en) | 2010-09-30 | 2014-05-21 | 大日本スクリーン製造株式会社 | Displacement calculation method, drawing data correction method, drawing method, and drawing apparatus |
| JP5752967B2 (en) * | 2011-03-29 | 2015-07-22 | 株式会社Ｓｃｒｅｅｎホールディングス | Pattern drawing method, pattern drawing apparatus, and computer program |
| JP5435747B2 (en) * | 2011-03-30 | 2014-03-05 | 富士フイルム株式会社 | Pattern forming method and pattern forming apparatus |
| KR20130006919A (en) * | 2011-06-27 | 2013-01-18 | 삼성전기주식회사 | System for exposure and method for the same |
| JP6013097B2 (en) * | 2012-09-14 | 2016-10-25 | 株式会社Ｓｃｒｅｅｎホールディングス | Pattern drawing apparatus and pattern drawing method |
| JP6150560B2 (en) * | 2013-03-01 | 2017-06-21 | 株式会社Ｓｃｒｅｅｎホールディングス | Data conversion method, drawing system, and program |
| JP2014178536A (en) | 2013-03-15 | 2014-09-25 | Dainippon Screen Mfg Co Ltd | Drawing data generation method, drawing method, drawing data generation apparatus, and drawing apparatus |
| JP6228382B2 (en) * | 2013-03-22 | 2017-11-08 | ビアメカニクス株式会社 | Drawing method and drawing apparatus |
| JP7210991B2 (en) * | 2018-10-11 | 2023-01-24 | 株式会社ニューフレアテクノロジー | Multi-charged particle beam writing apparatus and multi-charged particle beam writing method |
| JP7463154B2 (en) | 2020-03-24 | 2024-04-08 | 株式会社Ｓｃｒｅｅｎホールディングス | Drawing device, data processing device, drawing method, and drawing data generating method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999045439A1 (en) * | 1998-03-02 | 1999-09-10 | Micronic Laser Systems Ab | Improved pattern generator |
| JP2005037911A (en) * | 2003-07-02 | 2005-02-10 | Fuji Photo Film Co Ltd | Image recording apparatus, image recording method and program |
| JP2008003504A (en) * | 2006-06-26 | 2008-01-10 | Orc Mfg Co Ltd | Drawing system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000122303A (en) * | 1998-10-20 | 2000-04-28 | Asahi Optical Co Ltd | Plotting device |
| JP4478496B2 (en) * | 2004-04-07 | 2010-06-09 | 株式会社オーク製作所 | Exposure apparatus having local alignment function |
| JP2008058797A (en) * | 2006-09-01 | 2008-03-13 | Fujifilm Corp | Drawing device and drawing method |
-
2009
- 2009-03-04 JP JP2009050388A patent/JP5209544B2/en active Active
-
2010
- 2010-01-18 TW TW099101254A patent/TWI417676B/en active
- 2010-02-26 KR KR1020100017834A patent/KR101151494B1/en active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999045439A1 (en) * | 1998-03-02 | 1999-09-10 | Micronic Laser Systems Ab | Improved pattern generator |
| JP2005037911A (en) * | 2003-07-02 | 2005-02-10 | Fuji Photo Film Co Ltd | Image recording apparatus, image recording method and program |
| JP2008003504A (en) * | 2006-06-26 | 2008-01-10 | Orc Mfg Co Ltd | Drawing system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI728344B (en) * | 2018-07-20 | 2021-05-21 | 日商斯庫林集團股份有限公司 | Drawing apparatus and drawing method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101151494B1 (en) | 2012-05-31 |
| KR20100100626A (en) | 2010-09-15 |
| TW201033755A (en) | 2010-09-16 |
| JP2010204421A (en) | 2010-09-16 |
| JP5209544B2 (en) | 2013-06-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI417676B (en) | Drawing apparatus data, processing apparatus for drawing apparatus, and method of producing drawing data for drawing apparatus | |
| US10429742B2 (en) | Stitchless direct imaging for high resolution electronic patterning | |
| KR101480589B1 (en) | Drawing Data Correction Apparatus and Drawing Apparatus | |
| JP5852374B2 (en) | Drawing apparatus and drawing method | |
| KR101689964B1 (en) | Data amending apparatus, drawing apparatus, inspecting apparatus, data amending method, drawing method, inspecting method and recording medium storing a program | |
| TWI648603B (en) | Drawing apparatus and drawing method | |
| JP2014178536A (en) | Drawing data generation method, drawing method, drawing data generation apparatus, and drawing apparatus | |
| JP7133379B2 (en) | Drawing device and drawing method | |
| JP6466277B2 (en) | Data correction apparatus, drawing apparatus, inspection apparatus, data correction method, drawing method, inspection method, and program | |
| TWI792211B (en) | Drawing apparatus, data processing apparatus, drawing method, and drawing data generating method | |
| JP6114151B2 (en) | Drawing apparatus, substrate processing system, and drawing method | |
| TWI647984B (en) | Data correcting apparatus, drawing apparatus, data correcting method, drawing method and program product | |
| JP6109692B2 (en) | Data correction method, data conversion method, data correction device, data conversion device, drawing system, and program | |
| JP2023032758A (en) | Drawing apparatus, drawing method, and program | |
| JP4904301B2 (en) | Data conversion method, drawing system, and program | |
| JP2022052111A (en) | Substrate position detecting method, drawing method, substrate position detecting device, and drawing device | |
| JP6131108B2 (en) | Exposure drawing apparatus, exposure drawing method, and program |