TWI416646B - Device and method for cleansing a substrate - Google Patents
Device and method for cleansing a substrate Download PDFInfo
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- TWI416646B TWI416646B TW097142567A TW97142567A TWI416646B TW I416646 B TWI416646 B TW I416646B TW 097142567 A TW097142567 A TW 097142567A TW 97142567 A TW97142567 A TW 97142567A TW I416646 B TWI416646 B TW I416646B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
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- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Liquid Crystal (AREA)
Abstract
Description
本發明是有關於一種基板處理裝置及其方法，更具體而言是有關於一種對用於製造平板顯示元件的基板進行洗淨的基板洗淨裝置及其方法。The present invention relates to a substrate processing apparatus and method thereof, and more particularly to a substrate cleaning apparatus and method for cleaning a substrate for manufacturing a flat panel display element.
最近，資訊處理設備正朝向功能的多樣化及資訊處理速度的高速化迅速發展。如此之資訊處理裝置具有顯示運行資訊的顯示面板(Panel)。迄今為止，於顯示面板中主要是使用陰極射線管(Cathode Ray Tube)監視器，但是最近，隨著技術的迅速發展，重量輕且占空間小的液晶顯示(LCD，Liquid Crystal Display)之類的平板顯示面板的使用正在急遽增加。Recently, information processing equipment is rapidly developing toward the diversification of functions and the speed of information processing. Such an information processing device has a display panel that displays operational information. So far, cathode ray tube monitors have been mainly used in display panels, but recently, with the rapid development of technology, liquid crystal displays (LCD) such as light weight and small space have been used. The use of flat panel displays is rapidly increasing.
為了製造平板顯示面板，需要實施各種製程。在相關製程中洗淨製程是去除附著在基板上的微粒(particle)等的污染物質的製程，且是為了使薄膜電晶體(thin-film transistor)等的元件損耗最小化而提高良率所進行的。通常，洗淨製程是向基板供給水來去除基板上的污染物質，或者使用毛刷來物理性地去除基板上的污染物質。In order to manufacture a flat panel display panel, various processes need to be implemented. The cleaning process in the related process is a process of removing contaminants such as particles adhering to the substrate, and is for improving the yield loss of a thin film transistor or the like to improve the yield. of. Generally, the cleaning process is to supply water to the substrate to remove contaminants on the substrate, or to use a brush to physically remove contaminants on the substrate.
使用毛刷來對基板進行洗淨的毛刷洗淨裝置中，於利用基板移送單元在製程腔室(chamber)內朝向一個方向移動基板的期間中，藉由毛刷洗淨單元而對基板進行洗淨處理。毛刷洗淨單元包括毛刷、對毛刷提供旋轉力的毛刷軸(brush shaft)及驅動構件，毛刷軸的兩端部由軸承(bearing)構件等所支撐著。In a brush cleaning device for cleaning a substrate by using a brush, the substrate is cleaned by a brush cleaning unit while the substrate transfer unit moves the substrate in one direction in a process chamber. Washed. The brush cleaning unit includes a brush, a brush shaft that supplies a rotational force to the brush, and a driving member, and both ends of the brush shaft are supported by a bearing member or the like.
因此，本發明是鑒於上述先前的基板處理裝置及其方法中的問題而研製成的，本發明的目的在於，提供一種在使用毛刷的基板洗淨製程中能夠提高基板的洗淨效率的基板洗淨裝置及其方法。Accordingly, the present invention has been made in view of the above problems in the substrate processing apparatus and the method thereof, and an object of the present invention is to provide a substrate capable of improving the cleaning efficiency of a substrate in a substrate cleaning process using a brush. Cleaning device and method therefor.
又，本發明的另一目的在於，提供一種在使用毛刷的基板洗淨製程中能夠提高基板的移動安全性的基板洗淨裝置及其方法。Further, another object of the present invention is to provide a substrate cleaning apparatus and a method thereof capable of improving the movement safety of a substrate in a substrate cleaning process using a brush.
為了達成上述目的而研製成的本發明的基板洗淨裝置是對基板進行洗淨的裝置，其特徵在於包括：製程腔室，其提供進行洗淨製程的空間；基板移送單元，其設於上述製程腔室內以使基板移動；以及毛刷洗淨單元，其包括相對於與上述基板的移動方向正交的方向而傾斜地設置以對上述基板進行洗淨的毛刷。The substrate cleaning apparatus of the present invention developed to achieve the above object is a device for cleaning a substrate, comprising: a processing chamber that provides a space for performing a cleaning process; and a substrate transfer unit that is disposed above The processing chamber moves the substrate; and the brush cleaning unit includes a brush that is obliquely disposed to wash the substrate with respect to a direction orthogonal to a moving direction of the substrate.
上述基板移送單元包括移送軸，該移送軸上設有相互並排排列且與基板接觸的多個移送輥(roller)，較好的是，上述移送軸以相對於水平具有一定傾斜角度的方式而傾斜地配置著。The substrate transfer unit includes a transfer shaft provided with a plurality of transfer rollers arranged side by side and in contact with the substrate. Preferably, the transfer shaft is inclined at a certain inclination angle with respect to the horizontal Configured.
較好的是，上述毛刷與在相對於水平而傾斜的方向上移動的上述基板的距離在長度方向上相同。Preferably, the distance between the brush and the substrate moving in a direction inclined with respect to the horizontal direction is the same in the longitudinal direction.
較好的是，上述毛刷相對於上述基板的移動方向而向逆時針(CCW，Counter-Clockwise)方向傾斜地配置著。較好的是，上述毛刷相對於上述基板的移動方向而向順時針(CW，Clockwise)方向傾斜地配置著。Preferably, the brush is disposed obliquely in a counterclockwise (CCW, Counter-Clockwise) direction with respect to a moving direction of the substrate. Preferably, the brush is disposed obliquely in a clockwise (CW) direction with respect to a moving direction of the substrate.
較好的是，上述毛刷配置為相對於上述基板移動方向的正交方向而具有5°～10°的範圍的傾斜角度。Preferably, the brush is disposed to have an inclination angle in a range of 5 to 10 with respect to an orthogonal direction of the moving direction of the substrate.
較好的是，上述毛刷洗淨單元包括：上部毛刷洗淨單元，配置於藉由上述移送軸而移動的基板的上部；以及下部毛刷洗淨單元，配置於藉由上述移送軸而移動的基板的下部。Preferably, the brush cleaning unit includes: an upper brush cleaning unit disposed on an upper portion of the substrate that is moved by the transfer shaft; and a lower brush cleaning unit disposed on the transfer shaft by the transfer shaft The lower part of the moving substrate.
又，為了達成上述目的而研製成的本發明的基板洗淨方法是對基板進行洗淨的方法，其特徵在於，使毛刷的洗淨力作用在相對於與上述基板的移動方向正交的方向而傾斜的方向，來對上述基板進行洗淨處理。Moreover, the substrate cleaning method of the present invention developed to achieve the above object is a method of cleaning a substrate, wherein the cleaning force of the brush is applied to the direction orthogonal to the moving direction of the substrate. The substrate is subjected to a cleaning process in a direction oblique to the direction.
較好的是，上述基板洗淨方法是使上述基板在相對於水平而傾斜預定角度的狀態下進行移動。Preferably, the substrate cleaning method is such that the substrate is moved in a state of being inclined by a predetermined angle with respect to the horizontal.
較好的是，上述基板洗淨方法是使上述毛刷的洗淨力向下傾斜地作用於上述基板的移動方向的相反方向。Preferably, the substrate cleaning method is such that the cleaning force of the brush acts downward in a direction opposite to the moving direction of the substrate.
[發明的效果][Effects of the Invention]
本發明具有防止已自基板去除的污染物質重新附著於毛刷的效果。The present invention has an effect of preventing re-attachment of contaminants that have been removed from the substrate to the brush.
又，根據本發明，可減少順著毛刷及毛刷軸流動而漏出至腔室外部的洗淨液的量。Moreover, according to the present invention, it is possible to reduce the amount of the cleaning liquid that leaks out to the outside of the chamber along the flow of the brush and the brush shaft.
又，根據本發明，可防止已自基板去除的污染物質重新附著於基板上所形成的電極或配線之類的階差部。Moreover, according to the present invention, it is possible to prevent the contaminant removed from the substrate from reattaching to the step portion such as the electrode or the wiring formed on the substrate.
又，根據本發明，可提高基板的移動安全性。Moreover, according to the present invention, the movement safety of the substrate can be improved.
其次，一方面參照圖式，一方面對用以實施本發明的基板洗淨裝置及其方法的最佳形態的具體例進行說明。Next, a specific example of the best mode for carrying out the substrate cleaning apparatus and method of the present invention will be described with reference to the drawings.
各圖式的符號中，對於相同的構成要素，即便顯示在其他圖式上亦儘可能地附上相同的符號。並且，在本發明的說明中，當判斷為對於相關的公知構成或功能的具體說明有可能使本發明的要旨含糊不清時，則省略其詳細說明。In the symbols of the respective drawings, the same components are attached as much as possible to the same components. Further, in the description of the present invention, when it is determined that the detailed description of the related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.
<實施形態><Embodiment>
於實施形態中，以用於製造平板顯示面板的基板S為例來說明基板S。但是，基板S亦可是用於製造半導體晶片的晶圓。In the embodiment, the substrate S is described by taking the substrate S for manufacturing a flat display panel as an example. However, the substrate S may also be a wafer for manufacturing a semiconductor wafer.
圖1是表示本發明的基板處理裝置的一實施形態的剖面圖。Fig. 1 is a cross-sectional view showing an embodiment of a substrate processing apparatus according to the present invention.
參照圖1，實施形態中的基板處理裝置10包括製程腔室100、100'、100"以及基板移送單元200、200'、200"。Referring to Fig. 1, a substrate processing apparatus 10 in an embodiment includes process chambers 100, 100', 100" and substrate transfer units 200, 200', 200".
製程腔室100、100'、100"提供進行基板S處理製程的空間。於製程腔室100、100'、100"內分別設有基板移送單元200、200'、200"，該些基板移送單元200、200'、200"使基板S於製程腔室100、100'、100"間、或者於製程腔室100、100'、100"內朝向一個方向移動。The process chambers 100, 100', 100" provide a space for performing the substrate S processing process. The substrate transfer units 200, 200', 200" are respectively disposed in the process chambers 100, 100', 100", and the substrate transfer units are respectively provided. 200, 200', 200" causes the substrate S to move in one direction between the process chambers 100, 100', 100" or within the process chambers 100, 100', 100".
製程腔室100、100'、100"具有大致長方體形狀，且彼此相鄰地配置著。於製程腔室100、100'、100"的一側壁上，提供著用於使基板S流入至製程腔室100、100'、100"的流入口110a、110a"，且在與該一側壁相向的另一側壁上，提供著用於使基板S自製程腔室100、100'、100"流出的流出口110b、110b'。The process chambers 100, 100', 100" have a substantially rectangular parallelepiped shape and are disposed adjacent to each other. On one side wall of the process chambers 100, 100', 100", a substrate S is provided for flowing into the process chamber The flow inlets 110a, 110a" of the chambers 100, 100', 100", and on the other side wall facing the one side wall, provide a flow for the substrate S to self-process the chambers 100, 100', 100" Exits 110b, 110b'.
於各製程腔室100、100'、100"內，對基板S實施預定製程。於製程腔室100、100'、100"中的製程腔室100內實施洗淨製程。在位於實施洗淨製程的製程腔室100的前方的製程腔室100'內實施蝕刻(etching)製程，在位於實施洗淨製程的製程腔室100的後方的製程腔室100"內實施乾燥製程。A predetermined process is performed on the substrate S in each of the process chambers 100, 100', 100". A cleaning process is performed in the process chamber 100 in the process chambers 100, 100', 100". An etching process is performed in the process chamber 100' located in front of the process chamber 100 in which the cleaning process is performed, and a drying process is performed in the process chamber 100" behind the process chamber 100 in which the cleaning process is performed. .
於實施洗淨製程的製程腔室100內，設有洗淨構件300、400，該洗淨構件300、400對正在藉由基板移送單元200而移動著的基板S進行洗淨。In the process chamber 100 in which the cleaning process is performed, cleaning members 300 and 400 are provided, and the cleaning members 300 and 400 clean the substrate S that is being moved by the substrate transfer unit 200.
圖2是圖1的實施洗淨製程的製程腔室的俯視圖，圖3是圖2的基板移送單元的側視圖，圖4是圖2的毛刷洗淨單元的側視圖。2 is a plan view of the process chamber of the cleaning process of FIG. 1, FIG. 3 is a side view of the substrate transfer unit of FIG. 2, and FIG. 4 is a side view of the brush cleaning unit of FIG.
參照圖1、圖2至圖4，基板移送單元200包括移送軸210、動力傳遞構件220、驅動構件230、以及引導構件240。Referring to FIGS. 1 , 2 to 4 , the substrate transfer unit 200 includes a transfer shaft 210 , a power transmission member 220 , a drive member 230 , and a guide member 240 .
移送軸210在形成於製程腔室100的側壁上的流入口110a及流出口110b所對應的高度上並排配置著。移送軸210如圖3所示，以其中一端高於另一端的方式而以傾斜角度θ2 傾斜地配置著。此時，於配置在較低位置上的移送軸210的另一端一側上，配置著下述的引導構件240，該引導構件240支撐以傾斜的狀態移動的基板的側面。通常是一邊移送基板，一邊進行噴射藥液或者去離子水等來對基板進行處理的製程，此時，為了自基板容易地去除對基板進行處理後的處理液，在傾斜固定角度的狀態下移送基板。The transfer shaft 210 is arranged side by side at a height corresponding to the inflow port 110a and the outflow port 110b formed on the side wall of the process chamber 100. As shown in FIG. 3, the transfer shaft 210 is disposed obliquely at an inclination angle θ 2 so that one end thereof is higher than the other end. At this time, on the other end side of the transfer shaft 210 disposed at the lower position, a guide member 240 that supports the side surface of the substrate that moves in an inclined state is disposed. Usually, the substrate is processed by spraying a chemical solution or deionized water while transferring the substrate. In this case, in order to easily remove the processing liquid after the substrate is processed from the substrate, the processing liquid is transferred at a fixed angle. Substrate.
移送軸210的兩端由軸承等旋轉支撐構件(未圖示)所支撐著。於移送軸210的長度方向上在多個地點設有移送輥212。移送輥212設為與***至其中的移送軸210一同旋轉。Both ends of the transfer shaft 210 are supported by a rotary support member (not shown) such as a bearing. A transfer roller 212 is provided at a plurality of locations in the longitudinal direction of the transfer shaft 210. The transfer roller 212 is set to rotate together with the transfer shaft 210 inserted therein.
移送軸210上連結著動力傳遞構件220。動力傳遞構件220將驅動構件230的旋轉力傳遞至移送軸210。動力傳遞構件220包括皮帶輪(pulley)222及皮帶(belt)224。皮帶輪222可分別設於移送軸210的兩端，且可設於移送軸210的兩端中的任一端。多個皮帶輪222藉由皮帶224而相互連結著。設於相鄰的移送軸210上的皮帶輪222藉由皮帶224而相互連結成對。A power transmission member 220 is coupled to the transfer shaft 210. The power transmitting member 220 transmits the rotational force of the driving member 230 to the transfer shaft 210. The power transmitting member 220 includes a pulley 222 and a belt 224. The pulleys 222 may be respectively disposed at two ends of the transfer shaft 210 and may be disposed at either one of both ends of the transfer shaft 210. The plurality of pulleys 222 are coupled to each other by a belt 224. The pulleys 222 provided on the adjacent transfer shafts 210 are coupled to each other by a belt 224.
除此以外，動力傳遞構件220中可使用齒輪(gear)。於移送軸210的兩端或者任一端連結著齒輪，以多個齒輪相互嚙合的方式來配置該移送軸210。又，為了選擇性地防止因機械摩擦而產生微粒，動力傳遞構件220可使用利用磁力來傳遞旋轉力的磁鐵構件(未圖示)。In addition to this, a gear can be used in the power transmission member 220. A gear is coupled to both ends or either end of the transfer shaft 210, and the transfer shaft 210 is disposed such that a plurality of gears mesh with each other. Further, in order to selectively prevent generation of particles due to mechanical friction, the power transmission member 220 may use a magnet member (not shown) that transmits a rotational force by a magnetic force.
驅動構件230連結著多個皮帶輪222中的任一個，以對動力傳遞構件220中的至少一個提供旋轉力。驅動構件230中可使用馬達。當驅動構件230的旋轉力藉由動力傳遞構件220而傳遞至移送軸210時，載置於移送軸210的移送輥212的上側的基板S將藉由移送輥212的旋轉而朝向一個方向移動。The drive member 230 is coupled to any one of the plurality of pulleys 222 to provide a rotational force to at least one of the power transmitting members 220. A motor can be used in the drive member 230. When the rotational force of the drive member 230 is transmitted to the transfer shaft 210 by the power transmission member 220, the substrate S placed on the upper side of the transfer roller 212 of the transfer shaft 210 is moved in one direction by the rotation of the transfer roller 212.
引導構件240包括引導軸242、軸承構件244以及引導輥(guide roller)246。引導軸242沿著移送軸210的排列方向而在移送軸210的一端附近配置成一排。於引導軸242上設有軸承構件244，於軸承構件244上設有包圍著軸承構件244的引導輥246。具體而言，引導輥246由中空型的圓筒構件所構成，軸承構件244***至引導輥246的內側。引導輥246由聚醚醚酮(PEEK，Poly Ether Ether Ketone)等的合成樹脂材質等所構成。The guiding member 240 includes a guiding shaft 242, a bearing member 244, and a guide roller 246. The guide shafts 242 are arranged in a row in the vicinity of one end of the transfer shaft 210 along the direction in which the transfer shafts 210 are arranged. A bearing member 244 is disposed on the guide shaft 242, and a guide roller 246 surrounding the bearing member 244 is disposed on the bearing member 244. Specifically, the guide roller 246 is constituted by a hollow cylindrical member, and the bearing member 244 is inserted into the inner side of the guide roller 246. The guide roller 246 is made of a synthetic resin material such as polyether ether ketone (PEEK, Poly Ether Ether Ketone) or the like.
又，參照圖1，基板S是在製程腔室100內藉由基板移送單元200而移動的期間中，藉由洗淨構件300、400而進行洗淨。該些洗淨構件300、400包括蒸汽洗淨單元300及毛刷洗淨單元400。1 , the substrate S is cleaned by the cleaning members 300 and 400 during the movement of the substrate transfer unit 200 in the process chamber 100. The cleaning members 300 and 400 include a steam cleaning unit 300 and a brush cleaning unit 400.
蒸汽洗淨單元300是對基板S噴射高溫及高壓的蒸汽來對基板S進行一次洗淨。藉由蒸汽，而將附著於基板S上的微粒等的污染物質自基板S去除，或者使污染物質對基板S的附著力降低。The steam cleaning unit 300 sprays the high-temperature and high-pressure steam on the substrate S to wash the substrate S once. The contaminant such as fine particles adhering to the substrate S is removed from the substrate S by steam, or the adhesion of the contaminant to the substrate S is lowered.
毛刷洗淨單元400是使用毛刷的物理性接觸力，來對藉由蒸汽洗淨單元300而洗淨後的基板S進行二次洗淨。藉由毛刷而將殘留於基板S上的污染物質自基板S去除。藉由蒸汽洗淨而使數微米以下大小的微粒相對於基板S的附著力降低，然後藉由毛刷洗淨而將該微粒自基板S去除。The brush cleaning unit 400 cleans the substrate S cleaned by the steam cleaning unit 300 by using the physical contact force of the brush. The contaminant remaining on the substrate S is removed from the substrate S by a brush. The adhesion of the particles having a size of several micrometers or less to the substrate S is lowered by steam washing, and then the particles are removed from the substrate S by washing with a brush.
又，參照圖2及圖4，毛刷洗淨單元400包括第1毛刷洗淨單元420及第2毛刷洗淨單元440。第1毛刷洗淨單元420及第2毛刷洗淨單元440於製程腔室100內並排配置著。第1毛刷洗淨單元420及第2毛刷洗淨單元440具有相同構成，因此下面以第1毛刷洗淨單元420為例來進行說明，對於第2毛刷洗淨單元440則不作詳細說明。2 and 4, the brush cleaning unit 400 includes a first brush cleaning unit 420 and a second brush cleaning unit 440. The first brush cleaning unit 420 and the second brush cleaning unit 440 are arranged side by side in the process chamber 100. Since the first brush cleaning unit 420 and the second brush cleaning unit 440 have the same configuration, the first brush cleaning unit 420 will be described below as an example, and the second brush cleaning unit 440 will not be described in detail. Description.
第1毛刷洗淨單元420如圖4所示，包括對基板S的上表面進行洗淨的上部毛刷洗淨單元420a、以及對基板S的下表面進行洗淨的下部毛刷洗淨單元420b。上部毛刷洗淨單元420a具有毛刷422、毛刷軸424以及馬達426，下部毛刷洗淨單元420b具有毛刷422'、毛刷軸424'以及馬達426'。毛刷422、422'與基板S接觸而物理性地自基板S去除污染物質。毛刷422、422'具有與基板S的寬度相對應的長度，分別配置於製程腔室100內的基板S的上部及下部。毛刷軸424、424'與配置於基板S的上部及下部的毛刷422、422'的兩端相結合，且由軸承構件425a、425b、425'a、425'b支撐著兩端。於由軸承構件425a、425b、425'a、425'b支撐著的毛刷軸424、424'的一端上分別連結著馬達426、426'。As shown in FIG. 4, the first brush cleaning unit 420 includes an upper brush cleaning unit 420a that cleans the upper surface of the substrate S, and a lower brush cleaning unit that cleans the lower surface of the substrate S. 420b. The upper brush cleaning unit 420a has a brush 422, a brush shaft 424, and a motor 426. The lower brush cleaning unit 420b has a brush 422', a brush shaft 424', and a motor 426'. The brushes 422, 422' are in contact with the substrate S to physically remove contaminants from the substrate S. The brushes 422, 422' have lengths corresponding to the width of the substrate S, and are disposed at upper and lower portions of the substrate S in the process chamber 100, respectively. The brush shafts 424, 424' are coupled to both ends of the brushes 422, 422' disposed on the upper and lower portions of the substrate S, and are supported by the bearing members 425a, 425b, 425'a, 425'b. Motors 426, 426' are coupled to one ends of the brush shafts 424, 424' supported by the bearing members 425a, 425b, 425'a, 425'b, respectively.
如圖3所示，移送軸210以其中一端高於另一端的方式而以傾斜角度θ2 傾斜地配置著，因此藉由移送軸210而移動的基板S亦是在以傾斜角度θ2 傾斜的狀態下進行移動。因此，如圖4所示，上部毛刷洗淨單元420a的毛刷422以及下部毛刷洗淨單元420b的毛刷422'亦是以傾斜角度θ2 而傾斜地配置著。並且，為了使毛刷422、422'與基板S之間的接觸面積維持均等，較好的是，毛刷422、422'與移動基板S的距離在長度方向上相同。As shown in FIG. 3, the transfer shaft 210 is disposed obliquely at an inclination angle θ 2 so that one end thereof is higher than the other end, and therefore the substrate S moved by the transfer shaft 210 is also inclined at an inclination angle θ 2 . Move under. Thus, as shown in FIG. 4, the brush cleaning unit 420a of the upper brush 422 and the lower brush cleaning unit 420b of the brush 422 'is also the inclination angle θ 2 is obliquely disposed. Further, in order to maintain the contact area between the brushes 422, 422' and the substrate S uniform, it is preferable that the distance between the brushes 422, 422' and the moving substrate S is the same in the longitudinal direction.
又，參照圖2，對基板S進行洗淨的毛刷422設在相對於基板S的移動方向而傾斜的方向上。亦即，將毛刷422設為毛刷422的長度方向與基板S的移動方向相交。例如，將毛刷422配置為毛刷422的長度方向相對於基板S的移動方向而向逆時針(CCW)方向傾斜。與此相反，毛刷422可配置為毛刷422的長度方向相對於基板S的移動方向而向順時針(CW)方向傾斜。此時，毛刷422配置為毛刷422的長度方向相對於基板移動方向的垂直方向以5°～10°的傾斜角度θ1 而傾斜著。Further, referring to Fig. 2, the brush 422 for cleaning the substrate S is provided in a direction inclined with respect to the moving direction of the substrate S. That is, the brush 422 is set such that the longitudinal direction of the brush 422 intersects with the moving direction of the substrate S. For example, the brush 422 is disposed such that the longitudinal direction of the brush 422 is inclined in the counterclockwise (CCW) direction with respect to the moving direction of the substrate S. In contrast, the brush 422 can be configured such that the longitudinal direction of the brush 422 is inclined in the clockwise (CW) direction with respect to the moving direction of the substrate S. At this time, the brush 422 is disposed such that the longitudinal direction of the brush 422 is inclined at an inclination angle θ 1 of 5° to 10° with respect to the vertical direction of the substrate moving direction.
如上所述，當將毛刷422配置在向基板S的移動方向傾斜的方向上而使毛刷422的洗淨力作用於基板S上時，與將毛刷422配置在基板S的移動方向的垂直方向的先前情形相比，可對基板進行更有效的洗淨處理。以下，參照圖5A至圖8B來對此進行說明。As described above, when the brush 422 is disposed in a direction inclined to the moving direction of the substrate S and the cleaning force of the brush 422 is applied to the substrate S, the brush 422 is disposed in the moving direction of the substrate S. The substrate can be more effectively cleaned compared to the previous case in the vertical direction. This will be described below with reference to FIGS. 5A to 8B.
圖5A及圖5B是表示先前技術與本發明的使用毛刷洗淨單元的基板洗淨製程時自基板去除的微粒的移動路徑的示圖。5A and 5B are views showing movement paths of fine particles removed from the substrate at the time of the substrate cleaning process using the brush cleaning unit of the prior art and the present invention.
如上所述，基板S是在相對於水平而傾斜著傾斜角度θ2 的狀態下進行移動。因此，進行洗淨製程時供給至基板S上的洗淨液(例如去離子水(DIW，deionized water)等)會朝向相對於水平而向下傾斜的方向流動。於上述狀態下使毛刷422的洗淨力作用於基板S上，來去除基板S上的殘留污染物質。As described above, the substrate S is moved in a state where the inclination angle θ 2 is inclined with respect to the horizontal direction. Therefore, the cleaning liquid (for example, deionized water (DIW)) supplied to the substrate S during the cleaning process flows in a direction inclined downward with respect to the horizontal direction. In the above state, the cleaning power of the brush 422 is applied to the substrate S to remove residual contaminants on the substrate S.
然而，於將毛刷422配置於基板S的移動方向的垂直方向上的先前的情形時，如圖5A所示，已利用毛刷422自基板S去除的污染物質會一邊順著洗淨液的流動而移動，一邊重新附著於毛刷422上。上述現象是因為洗淨液的流動方向與毛刷422的長度方向相同而產生的。但是，本發明的毛刷422如圖5B所示，是以毛刷422的長度方向相對於基板S的移動方向傾斜的狀態而設置的，因此已自基板S去除的污染物質會順著洗淨液的流動而移動，不會重新附著於毛刷422上。However, when the brush 422 is disposed in the previous direction in the vertical direction of the moving direction of the substrate S, as shown in FIG. 5A, the contaminant which has been removed from the substrate S by the brush 422 will follow the cleaning liquid. The flow moves and reattaches to the brush 422. The above phenomenon occurs because the flow direction of the cleaning liquid is the same as the longitudinal direction of the brush 422. However, as shown in FIG. 5B, the brush 422 of the present invention is provided in a state where the longitudinal direction of the brush 422 is inclined with respect to the moving direction of the substrate S, so that the contaminant removed from the substrate S is washed down. The liquid moves and does not reattach to the brush 422.
圖6A及圖6B是表示先前技術與本發明的使用毛刷洗淨單元的基板洗淨製程時毛刷的洗淨液的洩漏(Leakage)狀態的圖。6A and 6B are views showing a leaking state of the cleaning liquid of the brush at the time of the substrate cleaning process using the brush cleaning unit of the prior art and the present invention.
於先前的情形時，如圖6A所示，洗淨液會順著毛刷422與毛刷軸424流動而漏出至製程腔室(圖1的圖式參照編號100)的外部。於本發明的情形時，亦與先前情形時相同，洗淨液可能順著毛刷422與毛刷軸424流動而漏出至製程腔室100的外部。但是，於本發明的情形時，如圖6B所示，順著毛刷422而流動的洗淨液會在因重力而產生的其自身的自重以及沿著基板S向下移動的洗淨液所施加的力的作用下而自毛刷422掉離一部分。藉由上述作用，可減少順著毛刷422與毛刷軸424流動而漏出至腔室外部的洗淨液的量。In the previous case, as shown in FIG. 6A, the cleaning liquid flows along the brush 422 and the brush shaft 424 and leaks out to the outside of the process chamber (pattern reference numeral 100 of FIG. 1). In the case of the present invention, as in the previous case, the cleaning liquid may flow along the brush 422 and the brush shaft 424 to leak out to the outside of the process chamber 100. However, in the case of the present invention, as shown in Fig. 6B, the cleaning liquid flowing along the brush 422 will be in its own weight due to gravity and the cleaning liquid moving downward along the substrate S. A portion of the brush 422 is removed by the applied force. By the above action, the amount of the cleaning liquid that flows along the brush 422 and the brush shaft 424 and leaks out of the chamber can be reduced.
圖7A及圖7B是表示先前技術與本發明的使用毛刷洗淨單元的基板洗淨製程時微粒有無重新附著於基板上所形成的階差部的示圖。7A and 7B are views showing a step portion formed by re-attaching the particles to the substrate during the substrate cleaning process using the brush cleaning unit of the prior art and the present invention.
基板S上積層著各種電極及配線，藉由所積層的電極及配線而於基板S上形成階差部P。於先前的情形時，如圖7A所示，階差部P的長度方向與毛刷422的長度方向平行，因此毛刷422的洗淨力會作用於階差部P的垂直方向。因此，將有已自基板S去除的污染物質中附著於毛刷422上的污染物質會重新附著於階差部P的下部邊緣的問題。然而，如圖7B所示，本發明的毛刷422配置在毛刷422的長度方向相對於階差部P的長度方向傾斜的方向上，因此，毛刷422的洗淨力會向下傾斜地作用於階差部P。如此，當毛刷422的洗淨力作用於階差部P時，即便污染物質流入至階差部P的下部，亦可藉由向下傾斜地起作用的毛刷422的洗淨力而去除污染物質。因此，本發明可防止已自基板S去除的污染物質中附著於毛刷422上的污染物質重新附著於階差部P的下部。Various electrodes and wirings are laminated on the substrate S, and a step portion P is formed on the substrate S by the laminated electrodes and wiring. In the former case, as shown in FIG. 7A, the longitudinal direction of the step portion P is parallel to the longitudinal direction of the brush 422, and therefore the cleaning force of the brush 422 acts on the vertical direction of the step portion P. Therefore, there is a problem that the contaminant adhering to the brush 422 among the contaminants removed from the substrate S reattaches to the lower edge of the step portion P. However, as shown in FIG. 7B, the brush 422 of the present invention is disposed in a direction in which the longitudinal direction of the brush 422 is inclined with respect to the longitudinal direction of the step portion P, and therefore, the washing power of the brush 422 is inclined downward. In the step part P. As described above, when the detergency of the brush 422 acts on the step portion P, even if the contaminant flows into the lower portion of the step portion P, the contamination can be removed by the cleaning force of the brush 422 acting downwardly obliquely. substance. Therefore, the present invention can prevent the contaminant adhering to the brush 422 among the contaminants removed from the substrate S from reattaching to the lower portion of the step portion P.
圖8A及圖8B是表示先前技術與本發明的使用毛刷洗淨單元的基板洗淨製程時利用毛刷支撐著基板的狀態的示圖。8A and 8B are views showing a state in which the substrate is supported by the brush in the substrate cleaning process using the brush cleaning unit of the prior art and the present invention.
於先前的情形時，如圖8A所示，毛刷422配置於基板S的移動方向的垂直方向上，因此，移動基板S與毛刷422相接觸的區域非常有限。亦即，僅僅是與基板S的移動方向平行的一邊的長度中、短於毛刷422的直徑的長度所對應的基板區域與毛刷422相接觸。然而，於本發明的情形時，則如圖8B所示，與基板S的移動方向平行的一邊的長度中、毛刷422兩端的對蹠點之間的基板移動方向的距離所對應的基板區域與毛刷422相接觸。如上所述，本發明的毛刷與先前的情形相比，與毛刷422接觸的基板S區域更廣，因此可更穩定地支撐移動著的基板S。並且，藉此可提高藉由移送軸210而移動的基板S的移動安全性。In the former case, as shown in FIG. 8A, the brush 422 is disposed in the vertical direction of the moving direction of the substrate S, and therefore, the area where the moving substrate S contacts the brush 422 is very limited. That is, only the length of the side parallel to the moving direction of the substrate S and the length of the substrate shorter than the diameter of the brush 422 are in contact with the brush 422. However, in the case of the present invention, as shown in FIG. 8B, the substrate area corresponding to the distance in the substrate moving direction between the opposite ends of the brush 422 in the length of one side parallel to the moving direction of the substrate S is as shown in FIG. 8B. Contact with the brush 422. As described above, the brush of the present invention has a wider area of the substrate S in contact with the brush 422 than in the prior art, so that the moving substrate S can be supported more stably. Further, by this, the movement safety of the substrate S moved by the transfer shaft 210 can be improved.
再者，本發明並不限定於上述實施形態。於未脫離本發明技術範圍的範圍內可實施各種變更。Furthermore, the present invention is not limited to the above embodiment. Various changes can be made without departing from the scope of the invention.
10．．．基板處理裝置10. . . Substrate processing device
100、100'、110"．．．製程腔室100, 100', 110"... process chamber
110a、110a"．．．流入口110a, 110a"...flow entrance
110b、110b'．．．流出口110b, 110b'. . . Outflow
200、200'、200"．．．基板移送單元200, 200', 200"... substrate transfer unit
210．．．移送軸210. . . Transfer axis
212．．．移送輥212. . . Transfer roller
220．．．動力傳遞構件220. . . Power transmission member
222．．．皮帶輪222. . . Pulley
224．．．皮帶224. . . Belt
230．．．驅動構件230. . . Drive member
240．．．引導構件240. . . Guide member
242．．．引導軸242. . . Guide axis
244．．．軸承構件244. . . Bearing member
246．．．引導輥246. . . Guide roller
300．．．蒸汽洗淨單元300. . . Steam cleaning unit
400．．．毛刷洗淨單元400. . . Brush cleaning unit
420．．．第1毛刷洗淨單元420. . . 1st brush cleaning unit
420a．．．上部毛刷洗淨單元420a. . . Upper brush cleaning unit
420b．．．下部毛刷洗淨單元420b. . . Lower brush cleaning unit
422、422'．．．毛刷422, 422'. . . brush
424、424'．．．毛刷軸424, 424'. . . Brush shaft
425a、425b、425'a、425'b．．．軸承構件425a, 425b, 425'a, 425'b. . . Bearing member
426、426'．．．馬達426, 426'. . . motor
440．．．第2毛刷洗淨單元440. . . 2nd brush cleaning unit
DIW．．．去離子水DIW. . . Deionized water
P．．．階差部P. . . Step difference
S．．．基板S. . . Substrate
θ1 、θ2 ．．．傾斜角度θ 1 , θ 2 . . . slope
圖1是表示本發明的實施形態的基板洗淨裝置的一例的剖面圖。Fig. 1 is a cross-sectional view showing an example of a substrate cleaning apparatus according to an embodiment of the present invention.
圖2是圖1的進行洗淨製程的製程腔室的俯視圖。2 is a top plan view of the process chamber of FIG. 1 for performing a cleaning process.
圖3是圖2的基板移送單元的側視圖。3 is a side view of the substrate transfer unit of FIG. 2.
圖4是圖2的毛刷洗淨單元的側視圖。Figure 4 is a side elevational view of the brush cleaning unit of Figure 2;
圖5A是表示先前技術的使用毛刷洗淨單元的基板洗淨製程時自基板去除的微粒的移動路徑的示圖。Fig. 5A is a view showing a movement path of particles removed from a substrate at the time of the substrate cleaning process using the brush cleaning unit of the prior art.
圖5B是表示本發明的使用毛刷洗淨單元的基板洗淨製程時自基板去除的微粒的移動路徑的示圖。Fig. 5B is a view showing a movement path of fine particles removed from the substrate at the time of the substrate cleaning process using the brush cleaning unit of the present invention.
圖6A是先前技術的使用毛刷洗淨單元的基板洗淨製程時毛刷的洗淨液的洩漏狀態的示圖。Fig. 6A is a view showing a state of leakage of the cleaning liquid of the brush at the time of the substrate cleaning process using the brush cleaning unit of the prior art.
圖6B是本發明的使用毛刷洗淨單元的基板洗淨製程時毛刷的洗淨液的洩漏狀態的示圖。Fig. 6B is a view showing a state of leakage of the cleaning liquid of the brush at the time of the substrate cleaning process using the brush cleaning unit of the present invention.
圖7A是先前技術的使用毛刷洗淨單元的基板洗淨製程時微粒有無重新附著於基板上所形成的階差部的示圖。Fig. 7A is a view showing a step portion formed by the presence or absence of re-attachment of particles on a substrate during a substrate cleaning process using a brush cleaning unit of the prior art.
圖7B是表示本發明的使用毛刷洗淨單元的基板洗淨製程時微粒有無重新附著於基板上所形成的階差部的示圖。Fig. 7B is a view showing a step portion formed by re-attaching the particles to the substrate during the substrate cleaning process using the brush cleaning unit of the present invention.
圖8A是表示先前技術的使用毛刷洗淨單元的基板洗淨製程時利用毛刷支撐著基板的狀態的示圖。Fig. 8A is a view showing a state in which a substrate is supported by a brush in a substrate cleaning process using a brush cleaning unit of the prior art.
圖8B是表示本發明的使用毛刷洗淨單元的基板洗淨製程時利用毛刷支撐著基板的狀態的示圖。Fig. 8B is a view showing a state in which the substrate is supported by the brush at the time of the substrate cleaning process using the brush cleaning unit of the present invention.
100．．．製程腔室100. . . Process chamber
210．．．移送軸210. . . Transfer axis
212．．．移送輥212. . . Transfer roller
220．．．動力傳遞構件220. . . Power transmission member
222．．．皮帶輪222. . . Pulley
224．．．皮帶224. . . Belt
230．．．驅動構件230. . . Drive member
240．．．驅動構件240. . . Drive member
400．．．毛刷洗淨單元400. . . Brush cleaning unit
420．．．第1毛刷洗淨單元420. . . 1st brush cleaning unit
422．．．毛刷422. . . brush
424．．．毛刷軸424. . . Brush shaft
425a、425b．．．軸承構件425a, 425b. . . Bearing member
426．．．馬達426. . . motor
440．．．第2毛刷洗淨單元440. . . 2nd brush cleaning unit
S．．．基板S. . . Substrate
θ1 ．．．傾斜角度θ 1 . . . slope
Claims (8)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070118400A KR20090051930A (en) | 2007-11-20 | 2007-11-20 | Apparatus and method for cleaning substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200933791A TW200933791A (en) | 2009-08-01 |
| TWI416646B true TWI416646B (en) | 2013-11-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097142567A TWI416646B (en) | 2007-11-20 | 2008-11-04 | Device and method for cleansing a substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2009128910A (en) |
| KR (1) | KR20090051930A (en) |
| CN (1) | CN101441987B (en) |
| TW (1) | TWI416646B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101342616B1 (en) * | 2013-04-26 | 2013-12-20 | 창성 주식회사 | Vertical substrate detachment system |
| US10192757B2 (en) | 2013-07-03 | 2019-01-29 | Ebara Corporation | Substrate cleaning apparatus and substrate cleaning method |
| KR102232662B1 (en) * | 2014-12-30 | 2021-03-30 | 세메스 주식회사 | Apparatus for treating substrate and Shaft assembly |
| CN108067447B (en) | 2017-12-13 | 2020-01-17 | 武汉华星光电技术有限公司 | Wiping mechanism and substrate cleaning device |
| JP7068631B2 (en) * | 2018-09-13 | 2022-05-17 | 日本電気硝子株式会社 | Glass plate manufacturing method |
| JP2020049431A (en) * | 2018-09-27 | 2020-04-02 | 広和株式会社 | Brush type washing device |
| CN110860509B (en) * | 2019-11-28 | 2021-05-04 | 湖南凯通电子有限公司 | Substrate cleaning device and cleaning method thereof |
| CN111009482B (en) * | 2019-12-18 | 2022-06-07 | 福建北电新材料科技有限公司 | Wafer cleaning device and wafer cleaning equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI223850B (en) * | 2000-02-23 | 2004-11-11 | Tokyo Electron Ltd | Substrate cleaning apparatus and substrate cleaning method |
| TW200810846A (en) * | 2006-08-25 | 2008-03-01 | Ind Tech Res Inst | Apparatus for cleaning a substrate |
| TWM330131U (en) * | 2007-09-29 | 2008-04-11 | Yu Cheng Machinery Co Ltd | Cleaning apparatus for board |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60165084U (en) * | 1984-04-09 | 1985-11-01 | 株式会社 富士電機総合研究所 | Brush cleaning device |
| JPS60254789A (en) * | 1984-05-31 | 1985-12-16 | 日本電気ホームエレクトロニクス株式会社 | Cleaning device |
| JPH06170340A (en) * | 1992-12-09 | 1994-06-21 | Matsushita Electric Ind Co Ltd | Cleaning device |
| JPH081103A (en) * | 1994-06-20 | 1996-01-09 | Shimada Phys & Chem Ind Co Ltd | Cleaning apparatus for plate body |
| JP4287551B2 (en) * | 1999-09-27 | 2009-07-01 | 芝浦メカトロニクス株式会社 | Brush cleaning device |
| JP2004074021A (en) * | 2002-08-19 | 2004-03-11 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and substrate cleaning unit |
| JP2005081297A (en) * | 2003-09-10 | 2005-03-31 | Yodogawa Medekku Kk | Substrate surface cleaning apparatus |
| JP4450724B2 (en) * | 2004-11-08 | 2010-04-14 | 東京エレクトロン株式会社 | Substrate processing apparatus, loader apparatus, and unloader apparatus |
| JP4476101B2 (en) * | 2004-11-09 | 2010-06-09 | 東京エレクトロン株式会社 | Substrate processing apparatus and flat flow type substrate transfer apparatus |
| JP4504839B2 (en) * | 2005-03-01 | 2010-07-14 | 芝浦メカトロニクス株式会社 | Substrate processing equipment |
| JP2007165654A (en) * | 2005-12-14 | 2007-06-28 | Sharp Corp | Substrate processing device |
-
2007
- 2007-11-20 KR KR1020070118400A patent/KR20090051930A/en not_active Application Discontinuation
-
2008
- 2008-10-24 JP JP2008274036A patent/JP2009128910A/en active Pending
- 2008-10-28 CN CN2008101725065A patent/CN101441987B/en active Active
- 2008-11-04 TW TW097142567A patent/TWI416646B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI223850B (en) * | 2000-02-23 | 2004-11-11 | Tokyo Electron Ltd | Substrate cleaning apparatus and substrate cleaning method |
| TW200810846A (en) * | 2006-08-25 | 2008-03-01 | Ind Tech Res Inst | Apparatus for cleaning a substrate |
| TWM330131U (en) * | 2007-09-29 | 2008-04-11 | Yu Cheng Machinery Co Ltd | Cleaning apparatus for board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090051930A (en) | 2009-05-25 |
| JP2009128910A (en) | 2009-06-11 |
| TW200933791A (en) | 2009-08-01 |
| CN101441987A (en) | 2009-05-27 |
| CN101441987B (en) | 2011-07-20 |
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