TWI414204B - Light source device, light-emitting component package and power supplier - Google Patents

Light source device, light-emitting component package and power supplier Download PDF

Info

Publication number
TWI414204B
TWI414204B TW96136229A TW96136229A TWI414204B TW I414204 B TWI414204 B TW I414204B TW 96136229 A TW96136229 A TW 96136229A TW 96136229 A TW96136229 A TW 96136229A TW I414204 B TWI414204 B TW I414204B
Authority
TW
Taiwan
Prior art keywords
light emitting
unit
package structure
emitting element
primary
Prior art date
Application number
TW96136229A
Other languages
Chinese (zh)
Other versions
TW200915921A (en
Inventor
Ming Te Lin
Original Assignee
Epistar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epistar Corp filed Critical Epistar Corp
Priority to TW96136229A priority Critical patent/TWI414204B/en
Publication of TW200915921A publication Critical patent/TW200915921A/en
Application granted granted Critical
Publication of TWI414204B publication Critical patent/TWI414204B/en

Links

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

A light source device includes a light-emitting component package and a power supplier. In the light-emitting component package, electrodes of a light emitting component are coupled to a secondary coil, and the secondary coil wraps a secondary magnetic inductive unit. The secondary magnetic inductive unit is coupled to a primary magnetic inductive unit of the power supplier to form a closed magnetic field loop. An electromotive force for lighting the light-emitting component is induced in the secondary coil by sensing the variation of a induced magnetic field induced by the current passed through the primary magnetic inductive unit.

Description

光源裝置、發光元件封裝結構與供電單元Light source device, light emitting device package structure and power supply unit

本發明是有關於一種光源裝置、發光元件封裝結構與供電單元。The present invention relates to a light source device, a light emitting device package structure, and a power supply unit.

圖1為習知技術之感應式發光二極體封裝結構的示意圖,是日本特開2005-71867號專利資料。感應式發光二極體封裝結構100是由發光二極體4、二次線圈5、與一次線圈6所構成。發光二極體4的兩個電極電性耦合至二次線圈5,二次線圈5係感應於一次線圈6之磁場源而產生二次電流,二次電流供應發光二極體4發光用。FIG. 1 is a schematic diagram of a conventional inductive light-emitting diode package structure according to the prior art, and is disclosed in Japanese Laid-Open Patent Publication No. 2005-71867. The inductive LED package structure 100 is composed of a light-emitting diode 4, a secondary coil 5, and a primary coil 6. The two electrodes of the light-emitting diode 4 are electrically coupled to the secondary coil 5, and the secondary coil 5 is induced to generate a secondary current by the magnetic field source of the primary coil 6, and the secondary current is supplied to the light-emitting diode 4 for illumination.

一次線圈6圍繞在一個本體31外部,本體31中心提供一個插孔30,燈具2由發光二極體4以兩隻導電引腳21安置在基材8所構成;當燈具2***插孔30以後,發光二極體4便可以接受感應之二次電流而發光;花型外觀20係做為裝飾用。The primary coil 6 is disposed outside the body 31, and a cavity 30 is provided in the center of the body 31. The lamp 2 is formed by the LEDs 4 disposed on the substrate 8 with two conductive pins 21; when the lamp 2 is inserted into the jack 30 The light-emitting diode 4 can receive the secondary current of the induction and emit light; the flower-shaped appearance 20 is used as a decoration.

此一習知技術的缺點為一次線圈6與二次線圈5所產生的磁場係開放式磁場,其磁力線散佈至產品外部,且會依據供電量之增大而增加磁力線功率,如圖1虛線所示。由於燈具深入人類的生活場所,因此這些散佈在燈具外部的磁場隨著燈具之照明使用,長期影響使用人,電磁場影響累積的結果可能造成使用人健康上的危害。另外一種可能的危害便是會影響一些電子元件的運作,例如當某些人攜帶有心律調整器之電子裝置於體內時,這些人靠近此一習知技術的燈具時,可能受到開放式磁場的干擾,導致其心律調整器運作錯誤或是運作停止,如此可能造成生命危險。The disadvantage of this prior art is that the magnetic field generated by the primary coil 6 and the secondary coil 5 is an open magnetic field, and the magnetic lines of force are distributed to the outside of the product, and the magnetic line power is increased according to the increase of the power supply amount, as shown by the dotted line in FIG. Show. Since the luminaire penetrates into the human life, these magnetic fields scattered outside the luminaire are used with the illumination of the luminaire, which affects the user for a long time. The cumulative effect of the electromagnetic field may cause harm to the health of the user. Another possible hazard is that it affects the operation of some electronic components. For example, when someone carries an electronic device with a heart rate adjuster in the body, these people may be exposed to an open magnetic field when approaching this conventional lamp. Interference, which causes the heart rhythm adjuster to malfunction or stop working, may cause life-threatening.

本發明提供一種光源裝置,可避免開放式電磁場危害人體健康。The invention provides a light source device, which can avoid the open electromagnetic field from endangering human health.

本發明又提供一種發光元件封裝結構,可避免開放式電磁場危害人體健康。The invention further provides a light-emitting component package structure, which can avoid the open electromagnetic field harming human health.

本發明另提供一種供電單元,適於為發光元件封裝結構供電,且可避免開放式電磁場危害人體健康。The invention further provides a power supply unit, which is suitable for supplying power to the light-emitting component package structure, and can avoid the open electromagnetic field from endangering human health.

本發明一實施例之光源裝置包括一供電單元以及一發光元件封裝結構。供電單元包括一一次線圈以及一一次導磁單元。一次線圈受電以後產生一交流電磁場。一次導磁單元具有兩個端點且被一次線圈所環繞,用以導引交流電磁場。發光元件封裝結構包括一發光元件、一二次線圈以及一二次導磁單元。發光元件具有至少二電極。二次線圈具有兩個端點,電性耦合至電極。二次導磁單元具有兩個端點,磁性耦合於一次導磁單元的兩個端點,以構成一封閉式磁迴路。二次導磁單元用以感應一次導磁單元所導引的交流電磁場,且二次導磁單元被二次線圈所環繞。交流電磁場使二次線圈感應產生感應電動勢。A light source device according to an embodiment of the invention includes a power supply unit and a light emitting element package structure. The power supply unit includes a primary coil and a primary magnetic guiding unit. An alternating electromagnetic field is generated after the primary coil is powered. The primary magnetic conducting unit has two end points and is surrounded by a primary coil for directing an alternating electromagnetic field. The light emitting device package structure includes a light emitting element, a secondary coil, and a secondary magnetic conductive unit. The light emitting element has at least two electrodes. The secondary coil has two end points that are electrically coupled to the electrodes. The secondary magnetic conducting unit has two end points that are magnetically coupled to the two end points of the primary magnetic conducting unit to form a closed magnetic circuit. The secondary magnetic conducting unit is configured to sense an alternating electromagnetic field guided by the primary magnetic conducting unit, and the secondary magnetic conducting unit is surrounded by the secondary coil. The alternating electromagnetic field causes the secondary coil to induce an induced electromotive force.

本發明再一實施例之發光元件封裝結構適於由一供電單元供電。供電單元包括一一次線圈以及一一次導磁單元。一次線圈受電以後產生一交流電磁場。一次導磁單元具有兩端點且被一次線圈所環繞,用以導引交流電磁場。發光元件封裝結構包括一發光元件、一二次線圈以及一二次導磁單元。發光元件具有至少二電極。二次線圈具有兩端點,電性耦合至電極。二次導磁單元具有兩端點,磁性耦合於一次導磁單元的兩端點,以構成一封閉式磁迴路。二次導磁單元用以感應一次導磁單元所導引的交流電磁場,且二次導磁單元被二次線圈所環繞。交流電磁場使二次線圈感應產生感應電動勢。The light emitting device package structure according to still another embodiment of the present invention is adapted to be powered by a power supply unit. The power supply unit includes a primary coil and a primary magnetic guiding unit. An alternating electromagnetic field is generated after the primary coil is powered. The primary magnetic conducting unit has two end points and is surrounded by the primary coil for guiding the alternating electromagnetic field. The light emitting device package structure includes a light emitting element, a secondary coil, and a secondary magnetic conductive unit. The light emitting element has at least two electrodes. The secondary coil has two ends and is electrically coupled to the electrodes. The secondary magnetic conducting unit has two end points and is magnetically coupled to the two end points of the primary magnetic conducting unit to form a closed magnetic circuit. The secondary magnetic conducting unit is configured to sense an alternating electromagnetic field guided by the primary magnetic conducting unit, and the secondary magnetic conducting unit is surrounded by the secondary coil. The alternating electromagnetic field causes the secondary coil to induce an induced electromotive force.

本發明一實施例之供電單元適於為一發光元件封裝結構供電。發光元件封裝結構包括一發光元件、一二次線圈以及一二次導磁單元。發光元件具有至少二電極。二次線圈具有兩端點,電性耦合至電極。二次導磁單元具有兩端點且被二次線圈所環繞。供電單元包括一一次線圈以及一一次導磁單元。一次線圈受電以後產生一交流電磁場。一次導磁單元具有兩端點且被一次線圈所環繞,用以導引交流電磁場。二次導磁單元的兩端點磁性耦合於一次導磁單元的兩端點以構成一封閉式磁迴路。二次導磁單元用以感應一次導磁單元所導引的交流電磁場,交流電磁場使二次線圈感應產生感應電動勢。The power supply unit of one embodiment of the present invention is adapted to supply power to a light emitting element package structure. The light emitting device package structure includes a light emitting element, a secondary coil, and a secondary magnetic conductive unit. The light emitting element has at least two electrodes. The secondary coil has two ends and is electrically coupled to the electrodes. The secondary magnetic conducting unit has two end points and is surrounded by the secondary coil. The power supply unit includes a primary coil and a primary magnetic guiding unit. An alternating electromagnetic field is generated after the primary coil is powered. The primary magnetic conducting unit has two end points and is surrounded by the primary coil for guiding the alternating electromagnetic field. The two ends of the secondary magnetic conducting unit are magnetically coupled to the two ends of the primary magnetic conducting unit to form a closed magnetic circuit. The secondary magnetic conducting unit is configured to sense an alternating electromagnetic field guided by the primary magnetic conducting unit, and the alternating electromagnetic field causes the secondary coil to induce an induced electromotive force.

在本發明的一實施例中,供電單元更包括一凹杯基座,發光元件***定位於凹杯基座的一凹杯中。In an embodiment of the invention, the power supply unit further includes a concave cup base, and the light emitting element is inserted into a concave cup positioned in the base of the concave cup.

在本發明的一實施例中,發光元件封裝結構更包括:一導熱件,具有至少二導熱部與一承載部,其中承載部連接導熱部且承載發光元件。In an embodiment of the invention, the light emitting device package structure further includes: a heat conducting member having at least two heat conducting portions and a carrying portion, wherein the carrying portion is connected to the heat conducting portion and carries the light emitting element.

在本發明的一實施例中,供電單元更包括一凹杯基座,發光元件經由導熱部而卡固於凹杯基座的一凹杯中。In an embodiment of the invention, the power supply unit further includes a concave cup base, and the light emitting element is locked in a concave cup of the concave cup base via the heat conducting portion.

在本發明的一實施例中,導熱部接觸凹杯基座的一散熱部,使得發光元件的熱量經由導熱件傳導至散熱部,以將熱量散出。In an embodiment of the invention, the heat conducting portion contacts a heat dissipating portion of the concave cup base such that heat of the light emitting element is conducted to the heat dissipating portion via the heat conducting member to dissipate heat.

在本發明的一實施例中,二次導磁單元與一次導磁單元呈U字型。In an embodiment of the invention, the secondary magnetic conducting unit and the primary magnetic conducting unit are U-shaped.

在本發明的一實施例中,二次導磁單元呈E字型而具有一中間延伸部,二次線圈環繞二次導磁單元的中間延伸部;以及一次導磁單元呈E字型而具有一中間延伸部,一次導磁單元的中間延伸部的端點與所述之二次導磁單元的中間延伸部的端點相耦合,一次線圈環繞一次導磁單元的中間延伸部。In an embodiment of the invention, the secondary magnetic conducting unit has an E-shaped portion and has an intermediate extending portion, the secondary coil surrounds the intermediate extending portion of the secondary magnetic conductive unit; and the primary magnetic conducting unit has an E-shape and has An intermediate extension, the end of the intermediate extension of the primary magnetically conductive unit is coupled to the end of the intermediate extension of the secondary magnetically conductive unit, and the primary coil surrounds the intermediate extension of the primary magnetically conductive unit.

在本發明的一實施例中,發光元件封裝結構更包括:一電容器,並聯至發光元件的電極。In an embodiment of the invention, the light emitting device package structure further includes: a capacitor connected to the electrode of the light emitting element.

在本發明的一實施例中,發光元件封裝結構更包括:一突波吸收器,並聯至發光元件的電極。In an embodiment of the invention, the light emitting device package structure further includes: a surge absorber connected in parallel to the electrodes of the light emitting element.

在本發明的一實施例中,發光元件封裝結構更包括:一整流器,串聯在發光元件的電極以及二次線圈之間。In an embodiment of the invention, the light emitting device package structure further includes: a rectifier connected in series between the electrode of the light emitting element and the secondary coil.

在本發明的一實施例中,整流器為橋式整流電路或二極體整流電路。In an embodiment of the invention, the rectifier is a bridge rectifier circuit or a diode rectifier circuit.

在本發明的一實施例中,發光元件為發光二極體。In an embodiment of the invention, the light emitting element is a light emitting diode.

綜上所述,本發明之光源裝置、發光元件封裝結構與供電單元採感應式供電,因此不會有接點接觸不良或漏電的問題,且產生之電磁場為封閉的而不會危害人體健康。In summary, the light source device, the light emitting device package structure and the power supply unit of the present invention are inductively powered, so that there is no problem of poor contact or leakage of the contacts, and the generated electromagnetic field is closed without jeopardizing human health.

為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下。The above and other objects, features and advantages of the present invention will become more <RTIgt;

圖2為本發明一實施例之光源裝置的示意圖。光源裝置200,其包括供電單元200a以及發光元件封裝結構200b。發光元件封裝結構200b包括一發光元件51。發光元件51例如為一發光二極體,但並不以此為限。供電單元200a電性耦合至外部電源50,並與發光元件封裝結構200b互相配合,以提供電力給發光元件51發光用。2 is a schematic view of a light source device according to an embodiment of the present invention. The light source device 200 includes a power supply unit 200a and a light emitting element package structure 200b. The light emitting element package structure 200b includes a light emitting element 51. The light-emitting element 51 is, for example, a light-emitting diode, but is not limited thereto. The power supply unit 200a is electrically coupled to the external power source 50 and mates with the light emitting element package structure 200b to provide power for the light emitting element 51 to emit light.

供電單元200a包括一次線圈531以及一次導磁單元541。一次線圈531為供電線圈,具有兩個端點561、562,電性耦合至外部電源50。一次導磁單元541具有兩端點5411、5412,且被一次線圈531所環繞包裹,用以導引一次線圈531受電以後產生的交流電磁場。The power supply unit 200a includes a primary coil 531 and a primary magnetic guiding unit 541. The primary coil 531 is a power supply coil having two terminals 561, 562 electrically coupled to the external power source 50. The primary magnetic guiding unit 541 has two end points 5411, 5412, and is surrounded by the primary coil 531 for guiding the alternating electromagnetic field generated after the primary coil 531 is powered.

發光元件封裝結構200b更包括一個二次導磁單元542以及二次線圈532。二次導磁單元542具有兩端點5421、5422,分別磁性耦合一次導磁單元541的兩端點5411、5412,以構成一個封閉式磁迴路。二次導磁單元542被二次線圈532所環繞。當二次導磁單元542感應一次導磁單元541所產生的交流電磁場時,二次線圈532感應二次導磁單元542上的交流磁場而產生二次電流。The light emitting element package structure 200b further includes a secondary magnetic conductive unit 542 and a secondary coil 532. The secondary magnetic conducting unit 542 has two end points 5421, 5422 which are magnetically coupled to the two end points 5411, 5412 of the primary magnetic conducting unit 541 to form a closed magnetic circuit. The secondary magnetic conducting unit 542 is surrounded by the secondary coil 532. When the secondary magnetic conducting unit 542 senses the alternating electromagnetic field generated by the primary magnetic conducting unit 541, the secondary coil 532 induces an alternating magnetic field on the secondary magnetic conducting unit 542 to generate a secondary current.

二次線圈532具有兩個端點,發光元件51則具有對應的兩個電極。二次線圈532的兩個端點分別以導線521、522電性耦合至發光元件51的兩個電極。當二次線圈532產生二次電流時,發光元件51受電而點亮。The secondary coil 532 has two end points, and the light-emitting element 51 has two corresponding electrodes. The two ends of the secondary coil 532 are electrically coupled to the two electrodes of the light-emitting element 51 by wires 521, 522, respectively. When the secondary coil 532 generates a secondary current, the light-emitting element 51 is powered and lit.

本實施例雖然使用具有兩個電極的發光元件51作為範例說明,但在實際實施時,也可以使用覆晶(flip chip)技術之發光元件,或是也可以使用具有一個上電極與一個下電極的發光元件。In this embodiment, although the light-emitting element 51 having two electrodes is used as an example, in actual implementation, a light-emitting element of a flip chip technique may be used, or an upper electrode and a lower electrode may be used. Light-emitting elements.

此外,一次線圈531的匝數N1與二次線圈532的匝數N2之比值通常為一固定比值。然而,一般發光元件晶片在生產時,不同批次產品間的順向電壓可能有差異。因此,在一次線圈531的匝數N1固定的情形下,可配合發光元件51之晶片的順向電壓分級,藉由改變二次線圈532的匝數N2來調整二次線圈532之輸出電壓,以解決順向偏壓差異的問題。Further, the ratio of the number of turns N1 of the primary coil 531 to the number of turns N2 of the secondary coil 532 is usually a fixed ratio. However, in general, a light-emitting element wafer may have a difference in forward voltage between different batches of products. Therefore, in the case where the number of turns N1 of the primary coil 531 is fixed, the forward voltage of the wafer of the light-emitting element 51 can be matched, and the output voltage of the secondary coil 532 can be adjusted by changing the number of turns N2 of the secondary coil 532. Solve the problem of the difference in forward bias.

在本實施例中,供電單元200a更可包括凹杯基座551。凹杯基座551可將一次線圈531與一次導磁單元541封裝固定於特定位置。發光元件封裝結構200b更可包括電性絕緣基座552。電性絕緣基座552可將二次線圈532與二次導磁單元542封裝固定於特定位置。In this embodiment, the power supply unit 200a may further include a concave cup base 551. The concave cup base 551 can seal the primary coil 531 and the primary magnetic guiding unit 541 to a specific position. The light emitting element package structure 200b may further include an electrically insulating base 552. The electrically insulating base 552 can encapsulate the secondary coil 532 and the secondary magnetically conductive unit 542 in a specific position.

凹杯基座551上端例如具有一個凹杯58,用以將發光元件封裝結構200b安置於凹杯58中。當發光元件51隨電性絕緣基座552插固定位於凹杯基座551的凹杯58中時,一次導磁單元541的兩個端點5411、5412分別與二次導磁單元542兩個端點5421、5422相對,恰好構成一個封閉式磁迴路,使得交流電磁場束縛在一次導磁單元541與二次導磁單元542之間而運作。The upper end of the concave cup base 551 has, for example, a concave cup 58 for arranging the light emitting element package structure 200b in the concave cup 58. When the light-emitting element 51 is inserted into the concave cup 58 of the concave cup base 551 with the electrically insulating base 552, the two end points 5411 and 5412 of the primary magnetic conductive unit 541 and the secondary magnetic conductive unit 542 are respectively ended. The dots 5421 and 5422 are opposite to each other and constitute a closed magnetic circuit, so that the alternating electromagnetic field is bound to operate between the primary magnetic conducting unit 541 and the secondary magnetic guiding unit 542.

在本實施例中,發光元件51周邊及上方可以加上封裝膠體511。封裝膠體511可封裝保護導線521、522以及發光元件51,用以提高產品可靠度。In the present embodiment, an encapsulant 511 may be added around and above the light-emitting element 51. The encapsulant 511 can encapsulate the protective wires 521, 522 and the light-emitting element 51 for improved product reliability.

圖3為圖2中沿A-A線的剖面分解圖。發光元件封裝結構200b準備插固於供電單元200a的凹杯基座551的凹杯58中。插固以後,發光元件封裝結構200b中的二次導磁單元542的兩個端點5421、5422(見圖2)會分別靠近或是接觸於供電單元200a中的一次導磁單元541的兩個端點5411、5412(見圖2)。藉此,可束縛一次導磁單元541產生的一次磁場與二次導磁單元542產生的二次磁場,以構成一個封閉式磁迴路。Figure 3 is an exploded cross-sectional view taken along line A-A of Figure 2; The light emitting element package structure 200b is prepared to be inserted into the concave cup 58 of the concave cup base 551 of the power supply unit 200a. After the insertion, the two end points 5421, 5422 (see FIG. 2) of the secondary magnetic conducting unit 542 in the light emitting element package structure 200b are respectively close to or in contact with the two primary magnetic conducting units 541 in the power supply unit 200a. Endpoints 5411, 5412 (see Figure 2). Thereby, the primary magnetic field generated by the primary magnetic conducting unit 541 and the secondary magnetic field generated by the secondary magnetic conducting unit 542 can be restrained to form a closed magnetic circuit.

圖4為本發明另一實施例之光源裝置的示意圖,請對照參考圖2與圖4,本實施例與前一實施例相似,其差異在於:本實施例之光源裝置300更包括一個導熱件57,用來承載發光元件51並進行導熱。4 is a schematic diagram of a light source device according to another embodiment of the present invention. Referring to FIG. 2 and FIG. 4, the present embodiment is similar to the previous embodiment, and the difference is that the light source device 300 of the embodiment further includes a heat conductive member. 57, used to carry the light-emitting element 51 and conduct heat.

圖5為圖4中沿A-A線的剖面分解圖。請參考圖5,導熱件57具有導熱部57a,其延伸至發光元件51外部以將發光元件51所產生的熱量傳導至外部。在本實施例中,光源裝置200的凹杯基座551除了位於中央的電性絕緣基材外,還包括披覆於電性絕緣基材外部的散熱部59,兩者並共同形成凹杯58。當發光元件51隨電性絕緣基座552插固於供電單元300a的凹杯58中時,導熱件57的導熱部57a可以做為元件卡固用,以將發光元件51經由導熱部57a而卡固於凹杯基座551的凹杯58中。Figure 5 is an exploded cross-sectional view taken along line A-A of Figure 4; Referring to FIG. 5, the heat conductive member 57 has a heat conductive portion 57a that extends to the outside of the light emitting element 51 to conduct heat generated by the light emitting element 51 to the outside. In the present embodiment, the concave cup base 551 of the light source device 200 includes, in addition to the central electrically insulating substrate, a heat dissipating portion 59 that is coated on the outside of the electrically insulating substrate, and together form a concave cup 58. . When the light-emitting element 51 is inserted into the concave cup 58 of the power supply unit 300a with the electrically insulating base 552, the heat-conducting portion 57a of the heat-conducting member 57 can be used as a component to fix the light-emitting element 51 via the heat-transfer portion 57a. It is fixed in the concave cup 58 of the concave cup base 551.

當發光元件51隨電性絕緣基座552插固於凹杯58中定位以後,導熱件57與供電單元300a之散熱部59相接觸,以將發光元件51所產生的熱量藉由導熱件57傳導至散熱部59,而可加大散熱的面積,使得整個產品之散熱效果增強。此外,在另一未繪示的實施例中,散熱部59的外部可以增加散熱鳍片(圖未示),更提高散熱效果。After the light-emitting element 51 is positioned in the concave cup 58 with the electrically insulating base 552, the heat-conducting member 57 is in contact with the heat-dissipating portion 59 of the power supply unit 300a to conduct the heat generated by the light-emitting element 51 through the heat-conducting member 57. Up to the heat dissipating portion 59, the heat dissipating area can be increased, so that the heat dissipation effect of the entire product is enhanced. In addition, in another embodiment, the heat dissipating fins (not shown) may be added to the outside of the heat dissipating portion 59 to further improve the heat dissipating effect.

在本實施例中,圖4所示的二次導磁單元542可呈弧型開口向下,而一次導磁單元541可呈弧型開口向上。一次導磁單元541與二次導磁單元542相耦合,以構成一個封閉環。實際實施時,一次導磁單元541可以設計成為U字型開口向下,二次導磁單元542可以設計成為U字型開口向上,組合以後構成圓弧形或矩形封閉環,但亦不以此為限。In the present embodiment, the secondary magnetic conductive unit 542 shown in FIG. 4 may have an arc-shaped opening downward, and the primary magnetic conductive unit 541 may have an arc-shaped opening upward. The primary magnetic conducting unit 541 is coupled to the secondary magnetic conducting unit 542 to form a closed loop. In actual implementation, the primary magnetic guiding unit 541 can be designed to have a U-shaped opening downward, and the secondary magnetic conductive unit 542 can be designed to be a U-shaped opening upward, and after combining, form a circular arc or a rectangular closed ring, but not Limited.

圖6為本發明另一實施例之光源裝置的示意圖。圖6之光源裝置400的發光元件封裝結構400b包括發光元件51、二次線圈632以及二次導磁單元642。發光元件51具有兩個電極。二次線圈632具有兩個端點,分別以導線521、522電性耦合至發光元件51的兩個電極。二次導磁單元642電性耦合至二次線圈632。二次導磁單元642可呈E字型,具有兩端點6421、6422與中間延伸部6423。二次線圈632環繞中間延伸部6423。電性絕緣基座652可將二次線圈632與二次導磁單元642封裝固定於特定位置。FIG. 6 is a schematic diagram of a light source device according to another embodiment of the present invention. The light emitting element package structure 400b of the light source device 400 of FIG. 6 includes a light emitting element 51, a secondary coil 632, and a secondary magnetic conductive unit 642. The light emitting element 51 has two electrodes. The secondary coil 632 has two end points that are electrically coupled to the two electrodes of the light-emitting element 51 by wires 521, 522, respectively. The secondary magnetic permeability unit 642 is electrically coupled to the secondary coil 632. The second magnetic conductive unit 642 may have an E shape and have two end points 6421, 6422 and an intermediate extension 6423. The secondary coil 632 surrounds the intermediate extension 6423. The electrically insulating base 652 can encapsulate the secondary coil 632 and the secondary magnetically conductive unit 642 in a specific position.

光源裝置400之供電單元400a包括一次線圈4631以及一次導磁單元641。一次線圈631受電以後產生交流電磁場。一次導磁單元641電性耦合至一次線圈631,用以導引交流電磁場。一次導磁單元641可呈E字型,具有兩端點6411、6412與中間延伸部6413。一次線圈631環繞中間延伸部6413。一次導磁單元641的兩端點6411、6412與中間延伸部6413分別磁性耦合於二次導磁單元642的兩端點6421、6422與中間延伸部6423。一次導磁單元641與二次導磁單元642二者呈相對的E字型,而構成一個封閉式磁迴路。二次線圈632感應交流磁場,產生感應電動勢與二次電流,提供發光元件51發光用。The power supply unit 400a of the light source device 400 includes a primary coil 4631 and a primary magnetic guiding unit 641. The primary coil 631 is energized to generate an alternating electromagnetic field. The primary magnetic guiding unit 641 is electrically coupled to the primary coil 631 for guiding the alternating electromagnetic field. The primary magnetic guiding unit 641 may have an E-shape with two end points 6411, 6412 and an intermediate extending portion 6413. The primary coil 631 surrounds the intermediate extension 6413. The two end points 6411, 6412 and the intermediate extending portion 6413 of the primary magnetic conducting unit 641 are magnetically coupled to the two end points 6421, 6422 and the intermediate extending portion 6423 of the secondary magnetic conductive unit 642, respectively. The primary magnetic conducting unit 641 and the secondary magnetic conducting unit 642 are in opposite E-shapes to form a closed magnetic circuit. The secondary coil 632 senses an alternating magnetic field, generates an induced electromotive force and a secondary current, and provides illumination for the light-emitting element 51.

本實施例的之供電單元400a還可包括凹杯基座651。凹杯基座651可將一次線圈631與一次導磁單元641封裝固定於特定位置。一次線圈631為供電線圈,具有兩個端點661、662,電性耦合至外部電源50。凹杯基座651上端具有一個凹杯58,提供發光元件封裝結構400b安置用。當發光元件封裝結構400b插固於凹杯58中定位時,一次導磁單元641的兩端點6411、6412與中間延伸部6413分別與二次導磁單元642的兩端點6421、6422與中間延伸部6423相接近或是相接觸。當一次線圈631受電時,交流電磁場在一次導磁單元641與二次導磁單元642的束縛磁力線中構成一個封閉式磁迴路。The power supply unit 400a of the present embodiment may further include a concave cup base 651. The concave cup base 651 can seal the primary coil 631 and the primary magnetic guiding unit 641 to a specific position. The primary coil 631 is a power supply coil having two terminals 661, 662 electrically coupled to the external power source 50. The upper end of the concave cup base 651 has a concave cup 58 for providing the light emitting element package structure 400b for placement. When the light emitting element package structure 400b is inserted and fixed in the concave cup 58, the two end points 6411, 6412 and the intermediate extending portion 6413 of the primary magnetic conductive unit 641 and the two end points 6421, 6422 and the middle of the secondary magnetic conductive unit 642 are respectively intermediate The extensions 6423 are close to each other or in contact. When the primary coil 631 is energized, the alternating electromagnetic field forms a closed magnetic circuit in the bound magnetic field lines of the primary magnetic conducting unit 641 and the secondary magnetic conducting unit 642.

圖7為本發明另一實施例之光源裝置的示意圖。本實施例與圖2之實施例相似,其差異在於:本實施例之光源裝置500更可包括一個電容器60,藉由將電容器60並聯於發光元件51的兩個電極改善功率因素。FIG. 7 is a schematic diagram of a light source device according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 2, and the difference is that the light source device 500 of the present embodiment further includes a capacitor 60, and the power factor is improved by connecting the capacitor 60 in parallel with the two electrodes of the light-emitting element 51.

圖8為本發明另一實施例之光源裝置的示意圖。本實施例與圖2之實施例相似,其差異在於:本實施例之光源裝置600更可包括一個突波吸收器70。突波吸收器70可並聯於發光元件51的兩個電極,用以吸收突波電壓而提高產品可靠度。FIG. 8 is a schematic diagram of a light source device according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 2, and the difference is that the light source device 600 of the embodiment may further include a surge absorber 70. The surge absorber 70 can be connected in parallel to the two electrodes of the light-emitting element 51 for absorbing the surge voltage to improve product reliability.

圖9為本發明另一實施例之光源裝置的示意圖。本實施例與圖2之實施例相似,其差異在於:本實施例之光源裝置700更可包括一個整流器80。整流器80可串聯於發光元件51與二次線圈532之間。二次線圈532的兩個端點分別電性耦合至整流器80的第一接點W與第二接點X。發光元件51的兩個電極分別電性耦合至整流器80的第三接點Y與第四接點Z。整流器80將交流電轉換成為直流電提供發光元件51點亮用。整流器80可以用橋式整流器或是二極體整流器。FIG. 9 is a schematic diagram of a light source device according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 2, and the difference is that the light source device 700 of the embodiment may further include a rectifier 80. The rectifier 80 may be connected in series between the light emitting element 51 and the secondary coil 532. The two ends of the secondary coil 532 are electrically coupled to the first contact W and the second contact X of the rectifier 80, respectively. The two electrodes of the light-emitting element 51 are electrically coupled to the third junction Y and the fourth junction Z of the rectifier 80, respectively. The rectifier 80 converts the alternating current into direct current to provide illumination for the light-emitting element 51. The rectifier 80 can be a bridge rectifier or a diode rectifier.

上述各實施例之光源裝置至少具有下列優點:一、供電單元中的一次導磁單元與發光元件封裝結構中的二次導磁單元構成一個封閉式磁迴路,使得磁力線不會溢散到外部,而可避免使用者受到磁場的影響。The light source device of each of the above embodiments has at least the following advantages: 1. The primary magnetic conductive unit in the power supply unit and the secondary magnetic conductive unit in the light emitting device package structure form a closed magnetic circuit, so that the magnetic lines of force do not overflow to the outside. It is possible to prevent the user from being affected by the magnetic field.

二、發光元件封裝結構藉由感應供電單元產生之電磁場的變化來產生感應電動勢,使得發光二極體發光。因此,發光元件封裝結構與供電單元之間無需電性接點,所以可避免因灰塵、振動而造成接點接觸不良,或是在高電壓下使接點間產生漏電的問題。2. The light emitting device package structure generates an induced electromotive force by inducing a change in an electromagnetic field generated by the power supply unit, so that the light emitting diode emits light. Therefore, no electrical contact is required between the light-emitting element package structure and the power supply unit, so that contact failure due to dust or vibration can be avoided, or leakage between the contacts can be caused at a high voltage.

三、可配合發光元件晶片的順向偏壓分級來調整二次線圈的匝數。因此,在同樣的供電單元之下,不同順向偏壓分級的發光元件晶片皆可適用,相當具有彈性。3. The number of turns of the secondary coil can be adjusted in accordance with the forward bias grading of the light-emitting element wafer. Therefore, under the same power supply unit, different directional bias grading illuminating element wafers are applicable and quite flexible.

雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100...感應式發光二極體封裝100. . . Inductive LED package

2...燈具2. . . Lamp

4...發光二極體4. . . Light-emitting diode

5...受電線圈5. . . Power receiving coil

6...供電線圈6. . . Power supply coil

8...基材8. . . Substrate

20...花型外觀20. . . Flower appearance

21...金屬腳twenty one. . . Metal foot

31...本體31. . . Ontology

30...插孔30. . . Jack

200、300、400、500、600、700...光源裝置200, 300, 400, 500, 600, 700. . . Light source device

200a、300a、400a...供電單元200a, 300a, 400a. . . Power supply unit

200b、300b、400b...發光元件封裝結構200b, 300b, 400b. . . Light-emitting element package structure

51...發光二極體51. . . Light-emitting diode

57...導熱件57. . . Heat conductive member

58...凹杯58. . . Concave cup

59...散熱部59. . . Heat sink

60...電容器60. . . Capacitor

70...突波吸收器70. . . Surge absorber

80...整流器80. . . Rectifier

511...封裝膠體511. . . Encapsulant

521、522...導線521, 522. . . wire

531、631...一次線圈531, 631. . . Primary coil

532、632...二次線圈532, 632. . . Secondary coil

541、641...一次導磁單元541, 641. . . Primary magnetic unit

542、642...二次導磁單元542, 642. . . Secondary magnetic unit

551、651...凹杯基座551, 651. . . Concave base

552、652...電性絕緣基座552, 652. . . Electrically insulated base

561、562...一次線圈端點561, 562. . . Primary coil end

5411、5412、5421、5422...導磁單元端點5411, 5412, 5421, 5422. . . Magnetic unit end point

6411、6412、6413、6421、6422、6423...導磁單元端點6411, 6412, 6413, 6421, 6422, 6423. . . Magnetic unit end point

W、X、Y、Z...整流器接點W, X, Y, Z. . . Rectifier contact

圖1為習知技術之感應式發光二極體封裝結構的示意圖。FIG. 1 is a schematic diagram of a conventional inductive LED package structure of the prior art.

圖2為本發明一實施例之光源裝置的示意圖。2 is a schematic view of a light source device according to an embodiment of the present invention.

圖3為圖2中沿A-A線的剖面分解圖。Figure 3 is an exploded cross-sectional view taken along line A-A of Figure 2;

圖4為本發明另一實施例之光源裝置的示意圖。4 is a schematic view of a light source device according to another embodiment of the present invention.

圖5為圖4中沿A-A線的剖面分解圖。Figure 5 is an exploded cross-sectional view taken along line A-A of Figure 4;

圖6為本發明另一實施例之光源裝置的示意圖。FIG. 6 is a schematic diagram of a light source device according to another embodiment of the present invention.

圖7為本發明另一實施例之光源裝置的示意圖。FIG. 7 is a schematic diagram of a light source device according to another embodiment of the present invention.

圖8為本發明另一實施例之光源裝置的示意圖。FIG. 8 is a schematic diagram of a light source device according to another embodiment of the present invention.

圖9為本發明另一實施例之光源裝置的示意圖。FIG. 9 is a schematic diagram of a light source device according to another embodiment of the present invention.

200...光源裝置200. . . Light source device

200a...供電單元200a. . . Power supply unit

200b...發光元件封裝結構200b. . . Light-emitting element package structure

51...發光二極體51. . . Light-emitting diode

58...凹杯58. . . Concave cup

511...封裝膠體511. . . Encapsulant

521、522...導線521, 522. . . wire

531...一次線圈531. . . Primary coil

532...二次線圈532. . . Secondary coil

541...一次導磁單元541. . . Primary magnetic unit

542...二次導磁單元542. . . Secondary magnetic unit

551...凹杯基座551. . . Concave base

552...電性絕緣基座552. . . Electrically insulated base

561、562...一次線圈端點561, 562. . . Primary coil end

5411、5412、5421、5422...導磁單元端點5411, 5412, 5421, 5422. . . Magnetic unit end point

Claims (13)

一種發光元件封裝結構,適於由一供電單元供電,其中該供電單元包括一一次線圈以及一一次導磁單元,該一次線圈受電以後產生一第一交流電磁場,該一次導磁單元具有兩端點且被該一次線圈所環繞,用以導引該第一交流電磁場,該發光元件封裝結構包括:一發光元件,具有至少二電極;一二次線圈,具有兩端點,電性耦合至該些電極;以及一二次導磁單元,具有兩端點,耦合於該一次導磁單元的兩端點,以構成一封閉式導磁結構,該二次導磁單元用以感應該第一交流電磁場以產生一第二交流電磁場,且該二次導磁單元被該二次線圈所環繞,該第二交流電磁場使該二次線圈感應產生感應電動勢。 A light emitting device package structure is adapted to be powered by a power supply unit, wherein the power supply unit comprises a primary coil and a primary magnetic guiding unit, and the primary coil generates a first alternating electromagnetic field after being powered, the primary magnetic guiding unit has two An end point and surrounded by the primary coil for guiding the first alternating electromagnetic field, the light emitting element package structure comprising: a light emitting element having at least two electrodes; and a secondary coil having two ends and electrically coupled to And a second magnetic conductive unit having two end points coupled to the two ends of the primary magnetic conductive unit to form a closed magnetic conductive structure, wherein the second magnetic conductive unit is configured to sense the first The electromagnetic field is exchanged to generate a second alternating electromagnetic field, and the secondary magnetic conducting unit is surrounded by the secondary coil, and the second alternating electromagnetic field causes the secondary coil to induce an induced electromotive force. 如申請專利範圍第1項所述之發光元件封裝結構,其中該供電單元更包括一凹杯基座,該發光元件***定位於該凹杯基座的一凹杯中。 The light emitting device package structure according to claim 1, wherein the power supply unit further comprises a concave cup base, and the light emitting element is inserted into a concave cup positioned in the concave cup base. 如申請專利範圍第1項所述之發光元件封裝結構,更包括:一導熱件,具有至少二導熱部與一承載部,其中該承載部連接該些導熱部且承載該發光元件。 The light emitting device package structure of claim 1, further comprising: a heat conducting member having at least two heat conducting portions and a carrying portion, wherein the carrying portion connects the heat conducting portions and carries the light emitting elements. 如申請專利範圍第3項所述之發光元件封裝結構,其中該供電單元更包括一凹杯基座,該發光元件經由該些導熱部而卡固於該凹杯基座的一凹杯中。 The light emitting device package structure of claim 3, wherein the power supply unit further comprises a concave cup base, and the light emitting element is locked in a concave cup of the concave cup base via the heat conducting portions. 如申請專利範圍第4項所述之發光元件封裝結構,其中該些導熱部接觸該凹杯基座的一散熱部,使得該發光元件的熱量經由該導熱件傳導至該散熱部,以將熱量散出。 The light emitting device package structure of claim 4, wherein the heat conducting portions contact a heat dissipating portion of the concave cup base, so that heat of the light emitting element is conducted to the heat dissipating portion via the heat conducting member to heat shed. 如申請專利範圍第1項所述之發光元件封裝結構,其中該二次導磁單元與該一次導磁單元呈U字型。 The light emitting device package structure according to claim 1, wherein the secondary magnetic conductive unit and the primary magnetic conductive unit are U-shaped. 如申請專利範圍第1項所述之發光元件封裝結構,其中該二次導磁單元呈E字型而具有一中間延伸部,該二次線圈環繞該二次導磁單元的該中間延伸部;以及該一次導磁單元呈E字型而具有一中間延伸部,該一次導磁單元的該中間延伸部的端點與所述之二次導磁單元的該中間延伸部的端點相耦合,該一次線圈環繞該一次導磁單元的該中間延伸部。 The light emitting device package structure according to claim 1, wherein the secondary magnetic conductive unit has an E-shaped portion and has an intermediate extending portion, the secondary coil surrounding the intermediate extending portion of the secondary magnetic conductive unit; And the primary magnetic conducting unit has an E-shaped portion and has an intermediate extending portion, and an end point of the intermediate extending portion of the primary magnetic conducting unit is coupled to an end of the intermediate extending portion of the secondary magnetic conducting unit, The primary coil surrounds the intermediate extension of the primary magnetically permeable unit. 如申請專利範圍第1項所述之發光元件封裝結構,更包括:一電容器,並聯至該發光元件的該些電極。 The light emitting device package structure of claim 1, further comprising: a capacitor connected in parallel to the electrodes of the light emitting element. 如申請專利範圍第1項所述之發光元件封裝結構,更包括:一突波吸收器,並聯至該發光元件的該些電極。 The light emitting device package structure according to claim 1, further comprising: a surge absorber connected to the electrodes of the light emitting element. 如申請專利範圍第1項所述之發光元件封裝結構,更包括:一整流器,串聯在該發光元件的該些電極以及該二次線圈之間。 The light emitting device package structure of claim 1, further comprising: a rectifier connected in series between the electrodes of the light emitting element and the secondary coil. 如申請專利範圍第10項所述之發光元件封裝結構,其中該整流器為橋式整流電路或二極體整流電路。 The light emitting device package structure according to claim 10, wherein the rectifier is a bridge rectifier circuit or a diode rectifier circuit. 如申請專利範圍第1項所述之發光元件封裝結構,其中該發光元件為發光二極體。 The light emitting device package structure according to claim 1, wherein the light emitting element is a light emitting diode. 一種光源裝置,包含如申請專利範圍1~12項其中之一所述之發光元件封裝結構。 A light source device comprising the light emitting device package structure according to any one of claims 1 to 12.
TW96136229A 2007-09-28 2007-09-28 Light source device, light-emitting component package and power supplier TWI414204B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96136229A TWI414204B (en) 2007-09-28 2007-09-28 Light source device, light-emitting component package and power supplier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96136229A TWI414204B (en) 2007-09-28 2007-09-28 Light source device, light-emitting component package and power supplier

Publications (2)

Publication Number Publication Date
TW200915921A TW200915921A (en) 2009-04-01
TWI414204B true TWI414204B (en) 2013-11-01

Family

ID=44725870

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96136229A TWI414204B (en) 2007-09-28 2007-09-28 Light source device, light-emitting component package and power supplier

Country Status (1)

Country Link
TW (1) TWI414204B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113231344B (en) * 2021-05-08 2022-12-06 广东荣诚食品有限公司 Food contains deoxidier check out test set

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005071867A (en) * 2003-08-26 2005-03-17 Riso Kagaku Corp Illumination device
TW200705476A (en) * 2005-05-12 2007-02-01 Fdk Corp Current balancing transformer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005071867A (en) * 2003-08-26 2005-03-17 Riso Kagaku Corp Illumination device
TW200705476A (en) * 2005-05-12 2007-02-01 Fdk Corp Current balancing transformer

Also Published As

Publication number Publication date
TW200915921A (en) 2009-04-01

Similar Documents

Publication Publication Date Title
JP5266075B2 (en) Light bulb-type lighting device
US8410699B2 (en) Heat dissipation enhanced LED lamp
JP2008034140A (en) Led lighting device
TWI470163B (en) Illuminating device
JP4866975B2 (en) LED lamp and lighting fixture
US20100320902A1 (en) Heat dissipation enhanced LED lamp
JP2011146353A (en) Lighting apparatus
TWI575785B (en) Light emitting device
JP2011192703A (en) Light emitting device, and illumination apparatus
CN103050602B (en) Light-emitting device
JP5831153B2 (en) Switching power supply device and lighting device
US9018662B2 (en) Multichip package structure
JP5849238B2 (en) Lamp and lighting device
US20110199021A1 (en) Light-emitting device and lighting apparatus provided with the same
TWI414204B (en) Light source device, light-emitting component package and power supplier
JP2012009379A (en) Led lamp and lighting fixture
JP2011181252A (en) Lighting fixture
TW201128756A (en) Semiconductor package structure
US9581319B2 (en) LED bulb using heat dissipating LED driver
JP2018032501A (en) Light-emitting device, and illuminating device
JP2012094661A (en) Light-emitting device and lighting device
US8633639B2 (en) Multichip package structure and light bulb of using the same
JP2011003516A (en) Structure for led luminaire
KR20130054864A (en) The light emitting system
JP5669136B2 (en) Lamp and lighting device