TWI405630B - Mixed processing saws - Google Patents
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- TWI405630B TWI405630B TW99106834A TW99106834A TWI405630B TW I405630 B TWI405630 B TW I405630B TW 99106834 A TW99106834 A TW 99106834A TW 99106834 A TW99106834 A TW 99106834A TW I405630 B TWI405630 B TW I405630B
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Description
本發明係有關一種混合加工線鋸，特別是指一種具有反應磨料之混合式加工線鋸，其兼具減少次表面之破壞、切削磨料不易脫落及形成較粗糙之切割表面等優點及功效。The invention relates to a mixed processing wire saw, in particular to a hybrid processing wire saw with reactive abrasives, which has the advantages and functions of reducing the damage of the secondary surface, the cutting abrasive is not easy to fall off and forming a rough cutting surface.
複合式線鋸切削製程(multi-wire sawing process)為現今鋸切脆硬材料之主要應用製程。複合式線鋸切割技術其加工模式主要是利用高速的鋼線帶動具有高強硬度與尖銳刃角的磨料對工件進行移除，而此技術有可依磨料固定的方式分成游離磨線切割(free abrasive)與固定磨料線切割(fixed abrasive)兩類，固定磨料一般係為鑽石。The multi-wire sawing process is the main application process for cutting hard and brittle materials today. The composite wire saw cutting technology mainly uses high-speed steel wire to drive the workpiece with high hardness and sharp edge angle to remove the workpiece. This technology can be divided into free wire cutting according to the way of abrasive fixing (free abrasive ) and fixed abrasive, the fixed abrasive is generally diamond.
但這兩種製程本身皆以機械加工的機制移除材料，會使得矽表面產生次表面破壞(Subsurface Damage)的缺陷，可能造成基本破裂和良率下降；其原因為矽晶錠本身為一高硬度材料，利用各種磨料移除時，會於矽基板表面上產生次表面破壞等缺陷。However, both processes themselves remove the material by a mechanical mechanism, which causes subsurface damage defects in the surface of the crucible, which may cause basic cracking and a decrease in yield. The reason is that the ingot itself is a high hardness. When the material is removed by various abrasives, defects such as subsurface damage are generated on the surface of the crucible substrate.
另外，目前鑽石線是將鑽石以樹脂、電鍍或硬焊等方式固定於鋼線上，且鑽石線在使用上係採取高硬度磨料(如鑽石)對硬脆材料(如矽晶錠)之靭性切削(ductile cutting)模式對材料作移除之動作，易造成鑽石磨料脫落，使切割效率及品質降低。In addition, the current diamond line is to fix the diamond on the steel wire by resin, electroplating or brazing, and the diamond wire is used to adopt high-hardness abrasive (such as diamond) toughness cutting of hard and brittle materials (such as twin ingot). The (ductile cutting) mode removes the material and causes the diamond abrasive to fall off, which reduces the cutting efficiency and quality.
因此，有必要研發新產品，以解決上述缺點及問題。Therefore, it is necessary to develop new products to solve the above shortcomings and problems.
本發明之目的在於提供一種混合式加工線鋸，其兼具減少次表面之破壞、切削磨料不易脫落及形成較粗糙之切割表面等優點及功效，用以解決習知技術會產生次表面破壞及鑽石磨粒易脫落等問題。The object of the present invention is to provide a hybrid processing wire saw which has the advantages and functions of reducing the damage of the secondary surface, the cutting abrasive not falling off and forming a rough cutting surface, etc., to solve the subsurface damage caused by the prior art and Diamond abrasive particles are easy to fall off and other issues.
本發明解決上述問題之技術手段係提供一種混合式加工線鋸，其包括：一線芯、複數反應磨料、複數切削磨料及一黏固層，複數反應磨料及複數切削磨料係藉由該黏固層而固定於該線芯上，用以切割一預定材料；其中，該切削磨料之硬度係大於該預定材料之硬度，該反應磨料之硬度係小於等於該預定材料之硬度；該反應磨料係用以與該預定材料產生固相化學反應，形成一固相化學反應層，而該複數切削磨料係用以移除該預定材料之部份體積及部份固相化學反應層；其中，該預定材料係為矽晶錠，而該反應磨料係為碳酸鹽類之物質，其係選自碳酸鈣、碳酸鋇、碳酸鎂其中之一。The technical means for solving the above problems is to provide a hybrid processing wire saw, which comprises: a wire core, a plurality of reactive abrasives, a plurality of cutting abrasives and a cementing layer, and the plurality of reactive abrasives and the plurality of cutting abrasives are supported by the bonding layer And being fixed on the core for cutting a predetermined material; wherein the hardness of the cutting abrasive is greater than the hardness of the predetermined material, the hardness of the reactive abrasive is less than or equal to the hardness of the predetermined material; Forming a solid phase chemical reaction layer with the predetermined material to form a solid phase chemical reaction layer, wherein the plurality of cutting abrasives are used to remove a portion of the predetermined material and a portion of the solid phase chemical reaction layer; wherein the predetermined material system It is a bismuth ingot, and the reaction abrasive is a carbonate-based substance selected from one of calcium carbonate, barium carbonate, and magnesium carbonate.
本發明又包括一種混合式加工線鋸，其包括：一線芯、複數反應磨料、複數切削磨料及一黏固層，複數反應磨料及複數切削磨料係藉由該黏固層而固定於該線芯上，用以切割一預定材料；其中，該切削磨料之硬度係大於該預定材料之硬度，該反應磨料之硬度係小於等於該預定材料之硬度；該反應磨料係用以與該預定材料產生固相化學反應，形成一固相化學反應層，而該複數切削磨料係用以移除該預定材料之部份體積及部份固相化學反應層；其中，該預定材料係為藍寶石，而該反應磨料係為二氧化矽及三氧化二鐵其中之一。The invention further includes a hybrid processing wire saw comprising: a core, a plurality of reactive abrasives, a plurality of cutting abrasives, and a cement layer, the plurality of reactive abrasives and the plurality of cutting abrasives being fixed to the core by the bonding layer The cutting abrasive is used to cut a predetermined material; wherein the hardness of the cutting abrasive is greater than the hardness of the predetermined material, the hardness of the reactive abrasive is less than or equal to the hardness of the predetermined material; and the reactive abrasive is used to produce solid with the predetermined material. a phase chemical reaction to form a solid phase chemical reaction layer, wherein the plurality of cutting abrasives are used to remove a portion of the predetermined material and a portion of the solid phase chemical reaction layer; wherein the predetermined material is sapphire, and the reaction The abrasive system is one of cerium oxide and ferric oxide.
本發明之上述目的與優點，不難從下述所選用實施例之詳細說明與附圖中，獲得深入瞭解。The above objects and advantages of the present invention will be readily understood from the following detailed description of the preferred embodiments illustrated herein.
茲以下列實施例並配合圖式詳細說明本發明於後：The invention will be described in detail in the following examples in conjunction with the drawings:
如第一、第二及第三圖所示，本發明係為一種混合式加工線鋸100，其包括：一線芯10、複數反應磨料20、複數切削磨料30及一黏固層40，複數反應磨料20及複數切削磨料30係藉由該黏固層40而固定於該線芯10上，用以切割一預定材料70；如第三圖所示，此實施例中，複數反應磨料20及複數切削磨料30係部份體積露出該黏固層40外；其中，該切削磨料30之硬度係大於該預定材料70之硬度，該反應磨料20之硬度係小於等於該預定材料70之硬度；該反應磨料20係用以與該預定材料70產生固相化學反應(Solid Phase Chemical Reaction，SPCR)，形成一固相化學反應層70A，而該複數切削磨料30係用以移除該預定材料70之部份體積及部份固相化學反應層70A(請參閱第四及第五圖)。As shown in the first, second and third figures, the present invention is a hybrid machining wire saw 100 comprising: a core 10, a plurality of reactive abrasives 20, a plurality of cutting abrasives 30 and a bonding layer 40, the complex reaction The abrasive 20 and the plurality of cutting abrasives 30 are fixed to the core 10 by the adhesive layer 40 for cutting a predetermined material 70; as shown in the third figure, in this embodiment, the plurality of reactive abrasives 20 and plural The portion of the cutting abrasive 30 is exposed outside the bonding layer 40; wherein the hardness of the cutting abrasive 30 is greater than the hardness of the predetermined material 70, and the hardness of the reactive abrasive 20 is less than or equal to the hardness of the predetermined material 70; The abrasive 20 is configured to generate a solid phase chemical reaction (SPCR) with the predetermined material 70 to form a solid phase chemical reaction layer 70A, and the plurality of cutting abrasives 30 are used to remove the predetermined material 70. Part by volume and part of the solid phase chemical reaction layer 70A (see Figures 4 and 5).
關於該切削磨料30，其係可為鑽石、立方氮化硼(CBN)、碳化矽(SiC )或氧化鋁(Al 2 O 3 )等硬度較高之材料，而該線芯10係可為鋼線；該反應磨料20及該切削磨料30係可以樹脂、電鍍或硬焊之方式固定於該線芯10上(如第三圖所示，利用該樹脂、電鍍或硬焊之方式於該線芯10之外表面形成該黏固層40，進而固定該反應磨料20及該切削磨料30，而該黏固層40係可為樹脂、鎳金屬、鎳鉻合金或其他可結合該線芯10、該反應磨料20及該切削磨料30之材料)。The cutting abrasive 30 may be a material having a higher hardness such as diamond, cubic boron nitride (CBN), tantalum carbide ( SiC ) or alumina ( Al 2 O 3 ), and the core 10 may be steel. The reaction abrasive 20 and the cutting abrasive 30 can be fixed to the core 10 by resin, electroplating or brazing (as shown in the third figure, using the resin, electroplating or brazing to the core) The outer surface of the 10 forms the adhesive layer 40, thereby fixing the reaction abrasive 20 and the cutting abrasive 30, and the adhesive layer 40 may be a resin, a nickel metal, a nickel-chromium alloy or the like, which may be combined with the core 10, Reactive abrasive 20 and the material of the cutting abrasive 30).
由於該反應磨料20需與該預定材料70進行固相化學反應，且該反應磨料20之硬度需小於或等於該預定材料70之應度，因此，該反應磨料20在材料的選擇上，係依據待切割之該預定材料70材質而定，而本發明係以下列兩種應用作為說明：Since the reaction abrasive 20 needs to undergo a solid phase chemical reaction with the predetermined material 70, and the hardness of the reaction abrasive 20 needs to be less than or equal to the predetermined material 70, the reaction abrasive 20 is selected based on the material. The predetermined material 70 to be cut is made of a material, and the present invention is described by the following two applications:
[a]預定材料70係為矽晶錠時，該反應磨料20係可為碳酸鹽類，如碳酸鈣(CaCO 3 )、碳酸鋇(BaCO 3 )、碳酸鎂(MgCO 3 )等，而碳酸鹽類與矽晶錠之化學反應式係為：Si +2XCO 3 +O 2 →X 2 SiO 4 +2CO 2 ；其中，X為2A族，如鋇(Ba)、鈣(Ca)、鎂(Mg)等；X 2 SiO 4 為固相化學反應層之生產物(如Ba 2 SiO 4 、Ca 2 SiO 4 、Mg 2 SiO 4 )；舉例來說，碳酸鎂(MgCO 3 )與矽晶錠之化學反應式係為：Si +2MgCO 3 +O 2 →Mg 2 SiO 4 +2CO 2 。[a] When the predetermined material 70 is a twin ingot, the reaction abrasive 20 may be a carbonate such as calcium carbonate ( CaCO 3 ), barium carbonate ( BaCO 3 ), magnesium carbonate ( MgCO 3 ), or the like, and carbonate. The chemical reaction formula of the class and the ingot is: Si + 2 XCO 3 + O 2 → X 2 SiO 4 + 2 CO 2 ; wherein X is a group 2A, such as barium (Ba), calcium (Ca), magnesium ( Mg) or the like; X 2 SiO 4 is a product of a solid phase chemical reaction layer (e.g., Ba 2 SiO 4 , Ca 2 SiO 4 , Mg 2 SiO 4 ); for example, magnesium carbonate ( MgCO 3 ) and a crystal ingot The chemical reaction formula is: Si + 2 MgCO 3 + O 2 → Mg 2 SiO 4 + 2 CO 2 .
[b]預定材料70係為藍寶石(Al 2 O 3 )時，該反應磨料20係可為二氧化矽(SiO 2 )、三氧化二鐵(Fe 2 O 3 )及其他可產生固相化學反應之材料；二氧化矽與藍寶石之化學反應式係為：Al 2 O 3 +SiO 2 →Al 2 Si 2 O 7 ；Al 2 Si 2 O 7 為固相化學反應層之生成產物。[b] When the predetermined material 70 is sapphire ( Al 2 O 3 ), the reaction abrasive 20 may be a solid phase chemical reaction of cerium oxide ( SiO 2 ), ferric oxide ( Fe 2 O 3 ), and others. The chemical reaction formula of cerium oxide and sapphire is: Al 2 O 3 + SiO 2 → Al 2 Si 2 O 7 ; Al 2 Si 2 O 7 is a product of a solid phase chemical reaction layer.
而三氧化二鐵與藍寶石之化學反應式係為：Al 2 O 3 +Fe 2 O 3 →FeAl 2 O 4 ；FeAl 2 O 4 為固相化學反應層之生成產物。The chemical reaction formula of ferric oxide and sapphire is: Al 2 O 3 + Fe 2 O 3 → FeAl 2 O 4 ; FeAl 2 O 4 is a product of a solid phase chemical reaction layer.
更詳細的說，本發明之混合式加工線鋸100在高速帶動下進行切割時，該反應磨料20係不斷的與該預定材料70產生固相化學反應，形成一固相化學反應層70A，同時該切削磨料30亦不斷的對該預定材料70及該固相化學反應層70A進行部份體積之移除，形成一機械化學加工機制；該固相化學反應層70A可減少該切削磨料30對該預定材料70之次表面破壞，且藉由對該預定材料70之切割表面反覆反應、移除之動作，可使切割表面達到較不規則之平面，可增加線鋸製程及光電轉換效率。In more detail, when the hybrid processing wire saw 100 of the present invention performs cutting at a high speed, the reactive abrasive 20 continuously undergoes a solid phase chemical reaction with the predetermined material 70 to form a solid phase chemical reaction layer 70A. The cutting abrasive 30 also continuously removes a portion of the predetermined material 70 and the solid phase chemical reaction layer 70A to form a mechanochemical processing mechanism; the solid phase chemical reaction layer 70A can reduce the cutting abrasive 30 to The secondary surface of the predetermined material 70 is destroyed, and by repeatedly reacting and removing the cut surface of the predetermined material 70, the cut surface can be made to a more irregular plane, and the wire saw process and photoelectric conversion efficiency can be increased.
如第四圖所示，以本發明進行切割時，該反應磨料20係與該預定材料70產生固相化學反應，形成一固相化學反應層70A，同時由該切削磨料30進行該預定材料70及該固相化學反應層70A之部份體積移除動作；如第五圖所示，在切割過程中，該反應磨料20與該切削磨料30係反覆進行固相反應、加工移除之動作，使該預定材料70產生不規則之切割表面，且部份區域係殘留固相化學反應層70A。As shown in the fourth figure, when the cutting is performed by the present invention, the reactive abrasive 20 is subjected to a solid phase chemical reaction with the predetermined material 70 to form a solid phase chemical reaction layer 70A, and the predetermined material 70 is carried out from the cutting abrasive 30. And a part of the volume removal action of the solid phase chemical reaction layer 70A; as shown in the fifth figure, during the cutting process, the reaction abrasive 20 and the cutting abrasive 30 are repeatedly subjected to solid phase reaction and processing removal. The predetermined material 70 is caused to have an irregular cut surface, and a portion of the region remains of the solid phase chemical reaction layer 70A.
由以上說明可知，本發明在進行切割時，係利用該反應磨料20不斷的與該預定材料70進行固相反應，同時以切削磨料30進行移除之動作，而利用該固相化學反應層70之保護效果，係可減少該切削磨料30於移除時對該預定材料70之次表面破壞。As apparent from the above description, in the present invention, when the dicing is performed, the reaction abrasive 20 is continuously subjected to a solid phase reaction with the predetermined material 70, and at the same time, the cutting abrasive 30 is removed, and the solid phase chemical reaction layer 70 is utilized. The protective effect is to reduce the secondary surface damage of the predetermined abrasive 70 when the cutting abrasive 30 is removed.
如第六圖所示，本發明在設計上，該反應磨料20之外徑(第二外徑D2)係可略大於該切削磨料30之外徑(第一外徑D1)，使本發明之混合式加工線鋸100在高速帶動下進行切割時，可由該反應磨料20先與該預定材料70接觸而產生固相化學反應，形成該固相化學反應層70A，再由該切削磨料30進行移除之動作；當然，以上說明僅為本發明之其中一種實施方式，在實際之使用上，該反應磨料20之外徑亦可等於或小於該切削磨料30之外徑，同樣可於切削過程中產生所需要之固相化學反應。As shown in the sixth figure, the present invention is designed such that the outer diameter (second outer diameter D2) of the reaction abrasive 20 can be slightly larger than the outer diameter (first outer diameter D1) of the cutting abrasive 30, so that the present invention When the hybrid machining wire saw 100 is cut at a high speed, the reaction abrasive 20 may first contact the predetermined material 70 to generate a solid phase chemical reaction to form the solid phase chemical reaction layer 70A, and then the cutting abrasive 30 is moved. In addition, the above description is only one of the embodiments of the present invention. In actual use, the outer diameter of the reaction abrasive 20 may also be equal to or smaller than the outer diameter of the cutting abrasive 30, and may also be used in the cutting process. Produce the required solid phase chemical reaction.
如第七圖所示，其係為本發明之第二實施例，其中，複數反應磨料20和複數切削磨料30係被該黏固層40(可為樹脂、鎳金屬、鎳鉻合金或其他可結合該線芯10、該反應磨料20及該切削磨料30之材料)包覆於該線芯10上，而複數反應磨料20係可同時包括多種外徑尺寸(可能大於、等於或小於該切削磨料30)，在此實施例中，該化學磨料20之外徑係大體上分為略等於及明顯小於該切削磨料30外徑兩種，而該黏固層40係為樹脂；如第八及第九圖所示，於切割時，該黏固層40(樹脂)產生剝落使外徑明顯小於該切削磨料30之該反應磨料20沉積於該預定材料70之表面上產生固相化學反應層70A，而該切削磨料30部份體積露出該黏固層40外，用以移除該預定材料70之部分體積及部分固相化學反應層70A；當然，外徑略等於該切削磨料30之化學磨料20，部份體積亦露出該黏固層40外，與該預定材料70之表面產生固相化學反應。As shown in the seventh figure, it is a second embodiment of the present invention, wherein the plurality of reactive abrasives 20 and the plurality of cutting abrasives 30 are adhered to the adhesive layer 40 (which may be resin, nickel metal, nickel-chromium alloy or the like) The wire core 10, the reaction abrasive 20 and the material of the cutting abrasive 30 are coated on the core 10, and the plurality of reactive abrasives 20 can simultaneously include a plurality of outer diameter sizes (possibly greater than, equal to, or less than the cutting abrasive). 30), in this embodiment, the outer diameter of the chemical abrasive 20 is generally divided into two equal to and significantly smaller than the outer diameter of the cutting abrasive 30, and the adhesive layer 40 is a resin; As shown in FIG. 9 , during the cutting, the adhesive layer 40 (resin) is peeled off so that the reaction abrasive 20 having an outer diameter significantly smaller than the cutting abrasive 30 is deposited on the surface of the predetermined material 70 to produce a solid phase chemical reaction layer 70A. The portion of the cutting abrasive 30 is exposed outside the bonding layer 40 for removing a portion of the predetermined material 70 and a portion of the solid phase chemical reaction layer 70A; of course, the outer diameter is slightly equal to the chemical abrasive 20 of the cutting abrasive 30. a part of the volume is also exposed outside the adhesive layer 40, and the pre- Generating a surface material 70 of solid phase chemical reactions.
關於該線芯10，其係可為一金屬材質，在通入電流後，供使用者係可依電流之導通情形而判斷該線芯10之使用情況；當該線芯10於正常狀態下，電流係為導通，而當該線芯10產生斷裂時，則電流係為斷路，故，使用者係可藉由電流之導通情形而判斷該線芯10之使用情況。The core 10 can be made of a metal material. After the current is applied, the user can judge the use of the core 10 according to the conduction state of the current; when the core 10 is in a normal state, The current is turned on, and when the core 10 is broken, the current is broken, so the user can judge the use of the core 10 by the conduction of the current.
另外，假設該切削磨料30係為鑽石，該預定材料70係為矽晶錠，本發明藉由該反應磨料20不斷的與該矽晶錠表面進行固相反應，即可達到表面處理之效果(即固相化學反應層70A)，可減少鑽石與矽晶錠兩種硬性材料於加工時之直接接觸，有效降低鑽石之磨損及脫落機率。In addition, it is assumed that the cutting abrasive 30 is a diamond, and the predetermined material 70 is a twin ingot. The present invention can achieve the surface treatment effect by continuously reacting the reaction abrasive 20 with the surface of the twin ingot. That is, the solid phase chemical reaction layer 70A) can reduce the direct contact between the hard materials of the diamond and the twin ingot during processing, and effectively reduce the wear and tear off probability of the diamond.
綜上所述，本發明之優點及功效可歸納為：In summary, the advantages and effects of the present invention can be summarized as follows:
[1] 減少次表面之破壞。現今應用於產線上的製程可分為游離磨料及鑽石磨料兩種，但矽晶錠本身為一高硬度材料，利用這兩種機械加工的機制移除材料，會使得矽表面產生次表面破壞(Subsurface Damage)的缺陷，可能造成基本破裂和良率下降；而本發明係以一種機械化學加工機制，同時進行固相化學反應及加工，於加工過程產生該固相化學反應層70A，達到保護之效果，降低材料次表面破壞。[1] Reduce damage to subsurfaces. Nowadays, the process applied to the production line can be divided into two types: free abrasive and diamond abrasive. However, the twin ingot itself is a high hardness material. Using these two mechanical processing mechanisms to remove the material will cause subsurface damage on the surface of the crucible ( The defect of Subsurface Damage may cause basic cracking and yield reduction; while the present invention uses a mechanochemical processing mechanism to simultaneously perform solid phase chemical reaction and processing, and the solid phase chemical reaction layer 70A is produced during the process to achieve the protection effect. Reduce the secondary surface damage of the material.
[2] 切削磨料不易脫落。傳統鑽石線在使用上係採取高硬度磨料(即鑽石)對硬脆材料(即矽晶錠)之靭性切削模式對材料作移除之動作，易造成鑽石磨料脫落；而本發明藉由該反應磨料20不斷的與該預定材料70表面進行固相反應，達到表面處理，可減少該切削磨料30與該預定材料70兩種硬性材料於加工時之直接接觸，該切削磨料30也較不易脫落。[2] Cutting abrasives are not easy to fall off. The use of a high-hardness abrasive (ie diamond) on the use of a high-hardness abrasive (ie diamond) to remove the material from the toughness of the hard and brittle material (ie, the ingot) is likely to cause the diamond abrasive to fall off; and the present invention relies on the reaction. The abrasive 20 continuously reacts with the surface of the predetermined material 70 to achieve a surface treatment, which can reduce the direct contact between the cutting abrasive 30 and the predetermined material 70 during processing, and the cutting abrasive 30 is also less likely to fall off.
[3] 形成較粗糙之切割表面。本發明同時以機械、化學兩種機制進行加工，可使矽晶錠之切割表面達到較不規則之粗糙平面，可增加線鋸製程及光電轉換效率，適合應用於太陽能板及光電產業。[3] Form a rougher cutting surface. The invention simultaneously processes by mechanical and chemical mechanisms, can make the cutting surface of the twin ingot reach a relatively irregular rough plane, can increase the wire sawing process and photoelectric conversion efficiency, and is suitable for the solar panel and the photoelectric industry.
以上僅是藉由較佳實施例詳細說明本發明，對於該實施例所做的任何簡單修改與變化，皆不脫離本發明之精神與範圍。The present invention has been described in detail with reference to the preferred embodiments of the present invention, without departing from the spirit and scope of the invention.
由以上詳細說明，可使熟知本項技藝者明瞭本發明的確可達成前述目的，實已符合專利法之規定，爰提出發明專利申請。From the above detailed description, it will be apparent to those skilled in the art that the present invention can achieve the foregoing objects, and the invention has been in accordance with the provisions of the patent law.
100．．．混合式加工線鋸100. . . Hybrid machining line saw
10．．．線芯10. . . Core
20．．．反應磨料20. . . Reaction abrasive
30．．．切削磨料30. . . Cutting abrasive
40．．．黏固層40. . . Adhesive layer
70．．．預定材料70. . . Scheduled material
70A．．．固相化學反應層70A. . . Solid phase chemical reaction layer
D1．．．第一外徑D1. . . First outer diameter
D2．．．第二外徑D2. . . Second outer diameter
第一圖係本發明之混合式加工線鋸進行切割之示意圖The first figure is a schematic diagram of the cutting of the hybrid processing wire saw of the present invention.
第二圖係本發明之混合式加工線鋸之示意圖The second figure is a schematic view of the hybrid processing wire saw of the present invention.
第三圖係沿Ⅲ-Ⅲ剖面線之剖視示意圖The third figure is a schematic cross-sectional view along the III-III section line.
第四圖係本發明之切割過程一之示意圖The fourth figure is a schematic diagram of the cutting process of the present invention.
第五圖係本發明之切割過程二之示意圖The fifth figure is a schematic diagram of the cutting process 2 of the present invention.
第六圖係本發明之磨料外徑之示意圖Figure 6 is a schematic view of the outer diameter of the abrasive of the present invention.
第七圖係本發明之第二實施例之示意圖Figure 7 is a schematic view of a second embodiment of the present invention
第八圖係本發明之第二實施例之切割過程一之示意圖The eighth drawing is a schematic view of the cutting process of the second embodiment of the present invention.
第九圖係本發明之第二實施例之切割過程二之示意圖Figure 9 is a schematic view showing the second cutting process of the second embodiment of the present invention.
100．．．混合式加工線鋸100. . . Hybrid machining line saw
10．．．線芯10. . . Core
20．．．反應磨料20. . . Reaction abrasive
30．．．切削磨料30. . . Cutting abrasive
40．．．黏固層40. . . Adhesive layer
Claims (7)
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| TWI405630B true TWI405630B (en) | 2013-08-21 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200500162A (en) * | 2003-06-20 | 2005-01-01 | jian-min Song | Brazing abrasive wire saw and method for producing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200500162A (en) * | 2003-06-20 | 2005-01-01 | jian-min Song | Brazing abrasive wire saw and method for producing the same |
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