TWI402453B - Luminescence conversion element, light module and projector using same - Google Patents
Luminescence conversion element, light module and projector using same Download PDFInfo
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本發明涉及一種光轉換組件、光源模組及使用該光源模組的投影機。 The invention relates to a light conversion component, a light source module and a projector using the same.
現有部分投影機採用藍色鐳射激發螢光物質發光來代替綠色發光二極體發光。但是在這種投影機的設計中，通常利用膠將螢光物質塗在一個由馬達高速轉動的轉盤上，再通過鐳射照射螢光物質發光。然而，由於鐳射能量很高，所以轉盤上的膠容易在鐳射的高溫照射下氣化，導致螢光粉從高速的轉盤上脫離，從而影響投影機的使用。 In some existing projectors, a blue laser is used to excite the fluorescent substance to emit light instead of the green light emitting diode. However, in the design of such a projector, the phosphor is usually coated with a fluorescent material on a turntable that is rotated by a motor at a high speed, and then irradiated with a fluorescent substance by laser irradiation. However, due to the high laser energy, the glue on the turntable is easily vaporized under the high temperature of the laser, which causes the phosphor to detach from the high-speed turntable, thereby affecting the use of the projector.
有鑒於此，有必要提供一種耐高溫的光轉換組件、光源模組及使用該光源模組的投影。 In view of the above, it is necessary to provide a high temperature resistant light conversion component, a light source module, and a projection using the same.
一種光轉換組件，其包括基板及光轉換層。所述基板由金屬陶瓷材料製成，所述基板包括一個被照射面，所述光轉換層通過燒結覆蓋於所述被照射面上，所述光轉換層在一特定波長的外部鐳射照射下發出另一特定波長的光。 A light conversion assembly includes a substrate and a light conversion layer. The substrate is made of a cermet material, the substrate includes an illuminated surface, the light conversion layer is covered on the illuminated surface by sintering, and the light conversion layer is emitted by external laser irradiation at a specific wavelength. Another specific wavelength of light.
一種光源模組，該光源模組包括至少一個鐳射發射元件及一個光轉換組件。所述至少一個鐳射發射元件用於發射第一波長的鐳射，所述光轉換組件與所述至少一個鐳射發射元件相對設置。所述光轉換組件包括基板及光轉換層。所述基板由金屬陶瓷材料製成，所述基板包括一 個被照射面，所述被照射面面向所述至少一個鐳射發射元件，所述光轉換層通過燒結覆蓋於所述被照射面上，所述光轉換層在所述第一波長的鐳射照射下激發出第二波長的光。 A light source module includes at least one laser emitting component and a light converting component. The at least one laser emitting element is configured to emit a laser of a first wavelength, the light converting component being disposed opposite the at least one laser emitting element. The light conversion assembly includes a substrate and a light conversion layer. The substrate is made of a cermet material, and the substrate includes a Irradiated faces facing the at least one laser emitting element, the light converting layer covering the illuminated surface by sintering, the light converting layer being irradiated by the first wavelength of laser light The second wavelength of light is excited.
一種投影機，其包括光源模組、第二光源、第三光源、光學元件、成像元件及鏡頭。所述光源模組、第二光源及第三光源發出的光束通過所述光學元件投射到所述成像元件上，所述成像元件通過反射所述光學元件透射的光，將光通過所述鏡頭投射出去。第二光源發出藍色光，第三光源發出紅色光，所述光源模組包括至少一個藍光鐳射發射元件及一個光轉換組件，所述至少一個藍光鐳射發射元件發射藍色鐳射，所述光轉換組件與所述至少一個藍光鐳射發射元件相對設置，所述光轉換組件包括基板及光轉換層，所述基板由金屬陶瓷材料製成，所述基板包括一個被照射面，所述被照射面面向所述至少一個藍光鐳射發射元件，所述光轉換層由螢光材料製成、通過燒結覆蓋於所述被照射面上，所述光轉換層在所述藍色鐳射的照射下激發出綠光。 A projector includes a light source module, a second light source, a third light source, an optical component, an imaging component, and a lens. Light beams emitted by the light source module, the second light source, and the third light source are projected onto the imaging element through the optical element, and the imaging element projects light through the lens by reflecting light transmitted by the optical element Go out. The second light source emits blue light, the third light source emits red light, the light source module includes at least one blue laser emitting element and a light converting component, and the at least one blue laser emitting element emits blue laser, the light converting component Opposite the at least one blue laser emitting element, the light converting component comprising a substrate and a light converting layer, the substrate being made of a cermet material, the substrate comprising an illuminated surface, the illuminated surface facing At least one blue light emitting element is described, the light converting layer being made of a fluorescent material and covering the illuminated surface by sintering, the light converting layer exciting green light under the illumination of the blue laser.
由於本發明提供的光轉換組件係通過燒結的方式將光轉換層結合在所述基板上的，所以能夠在鐳射的高溫照射下正常工作，避免脫落。 Since the light conversion module provided by the present invention bonds the light conversion layer to the substrate by sintering, it can be normally operated under high-temperature irradiation of laser light to avoid falling off.
下面將結合附圖，對本發明作進一步的詳細說明。 The invention will be further described in detail below with reference to the accompanying drawings.
請參閱圖1，為本發明提供的一種光轉換組件12。所述光轉換組件12包括基板120、光轉換層121及散熱件122。 所述基板120由高導熱性能的金屬陶瓷(Cermet)製成，有利於散熱。所述基板120可以係氮化鋁(Aluminum Nitride，AlN)、氮化矽(Si3N4)、氧化鋁(Aluminium Oxide，Al2O3)等材料製成。所述基板120包括相對設置的被照射面120a及散熱面120b。 Please refer to FIG. 1 , which is a light conversion component 12 provided by the present invention. The light conversion component 12 includes a substrate 120, a light conversion layer 121, and a heat sink 122. The substrate 120 is made of a high thermal conductivity cermet (Cermet) to facilitate heat dissipation. The substrate 120 may be made of materials such as aluminum nitride (AlN), tantalum nitride (Si 3 N 4 ), aluminum oxide (Aluminium Oxide, Al 2 O 3 ). The substrate 120 includes oppositely disposed illuminated surfaces 120a and heat dissipation surfaces 120b.
所述光轉換層121在外部鐳射照射下發光。本實施方式中，所述光轉換層121採用黃色稀土螢光粉(Phosphor)，該黃色稀土螢光粉在藍色激發下發出綠光。所述光轉換層121通過低溫燒結(Sintering)工藝結合在所述被照射面120a上。具體地，在製作所述光轉換層121時，先將黃色稀土螢光粉與樹脂膠混合，再將混合物塗在基板120的被照射面120a上，而後放入烤箱中以180攝氏度烘烤，將樹脂膠氣化，並將稀土螢光粉燒結在被照射面120a上形成光轉換層121。由於樹脂膠在烘烤過程中已被氣化，所述光轉換層121通過燒結黏到所述被照射面120a上，所以當利用高能量的鐳射照射光轉換層121時，不會產生黏膠氣化導致光轉換層121脫落的現象。 The light conversion layer 121 emits light under external laser irradiation. In the embodiment, the light conversion layer 121 is made of yellow rare earth fluorescent powder (Phosphor), and the yellow rare earth fluorescent powder emits green light under blue excitation. The light conversion layer 121 is bonded to the illuminated surface 120a by a low-temperature sintering process. Specifically, in the production of the light conversion layer 121, the yellow rare earth fluorescent powder is first mixed with the resin glue, and then the mixture is applied onto the illuminated surface 120a of the substrate 120, and then baked in an oven at 180 degrees Celsius. The resin paste is vaporized, and the rare earth fluorescent powder is sintered on the irradiated surface 120a to form the light conversion layer 121. Since the resin glue has been vaporized during the baking process, the light conversion layer 121 is adhered to the irradiated surface 120a by sintering, so that when the light conversion layer 121 is irradiated with high-energy laser light, no adhesive is generated. The gasification causes the light conversion layer 121 to fall off.
所述散熱件122固設於所述基板120的散熱面120b上，且與所述基板120熱耦合，用於為所述基板120散熱。本實施方式中，所述散熱件122採用散熱片，並在所述散熱面120b及散熱件122之間填充散熱膏9。所述散熱膏9用於消除所述散熱面120b及散熱件122之間的空氣間隙，降低熱阻。所述散熱膏9採用導熱矽脂(Silicone Grease)。當然，所述散熱件122也可以採用致冷器或風扇等散熱裝置。 The heat sink 122 is fixed on the heat dissipation surface 120 b of the substrate 120 and thermally coupled to the substrate 120 for dissipating heat from the substrate 120 . In the embodiment, the heat sink 122 is a heat sink, and the heat dissipation paste 9 is filled between the heat dissipation surface 120 b and the heat sink 122 . The heat dissipation paste 9 is used to eliminate an air gap between the heat dissipation surface 120b and the heat dissipation member 122 to reduce thermal resistance. The heat-dissipating paste 9 is made of a thermal grease (Silicone Grease). Of course, the heat sink 122 can also be a heat sink such as a refrigerator or a fan.
請參閱圖2，為本發明提供的具有光轉換組件12的光源模組10，所述光源模組10還包括鐳射發射元件11，所述鐳射發射元件11發射第一波長的鐳射L0。本實施方式中，所述鐳射發射元件11為發射藍光的鐳射二極體。當然，為了提高亮度，所述光源模組10也可以包含複數個鐳射發射元件11。所述光轉換組件12的光轉換層121在所述第一波長的鐳射L0照射下激發出第二波長的光L1，即綠光。 Please refer to FIG. 2 , which is a light source module 10 having a light conversion component 12 . The light source module 10 further includes a laser emitting component 11 , and the laser emitting component 11 emits a laser L0 of a first wavelength. In this embodiment, the laser emitting element 11 is a laser diode that emits blue light. Of course, in order to increase the brightness, the light source module 10 may also include a plurality of laser emitting elements 11. The light conversion layer 121 of the light conversion component 12 excites the light L1 of the second wavelength, that is, green light, under the irradiation of the laser light of the first wavelength.
請參閱圖3，為本發明提供的投影機100。該投影機100包括光源模組10、第一雙色鏡20、第二光源30、第二雙色鏡40、第三光源50、第一中繼透鏡組60、反射鏡70、第二中繼透鏡80、TIR棱鏡系統90、成像元件110、鏡頭130及光機底座140。所述光源模組10、第一雙色鏡20、第二光源30、第二雙色鏡40、第三光源50、第一中繼透鏡組60、反射鏡70、第二中繼透鏡80、TIR棱鏡系統90、成像元件110、鏡頭130沿光路方向依次固定於光機底座140內。 Please refer to FIG. 3, which is a projector 100 provided by the present invention. The projector 100 includes a light source module 10, a first dichroic mirror 20, a second light source 30, a second dichroic mirror 40, a third light source 50, a first relay lens group 60, a mirror 70, and a second relay lens 80. The TIR prism system 90, the imaging element 110, the lens 130, and the optomechanical base 140. The light source module 10, the first dichroic mirror 20, the second light source 30, the second dichroic mirror 40, the third light source 50, the first relay lens group 60, the mirror 70, the second relay lens 80, and the TIR prism The system 90, the imaging element 110, and the lens 130 are sequentially fixed in the optical base 140 in the optical path direction.
所述光機底座140沿光路方向包括依次貫通的第一容置腔141、第二容置腔142及第三容置腔143。所述第一容置腔141包括第一側壁141a、第二側壁141b及第三側壁141c。所述第一側壁141a與所述第二側壁141b相對，所述第三側壁141c連接於第一側壁141a及第二側壁141b之間。所述鐳射發射元件11及第三光源50固定於所述第一側壁141a上，所述第二光源30固定於所述第二側壁141b上。所述光轉換組件12相對所述鐳射發射元件11固定於 所述第三側壁141c上，且所述光轉換組件12的光轉換層121面向所述鐳射發射元件11。 The illuminator base 140 includes a first accommodating cavity 141, a second accommodating cavity 142 and a third accommodating cavity 143 which are sequentially penetrated in the optical path direction. The first accommodating cavity 141 includes a first sidewall 141a, a second sidewall 141b, and a third sidewall 141c. The first sidewall 141a is opposite to the second sidewall 141b, and the third sidewall 141c is connected between the first sidewall 141a and the second sidewall 141b. The laser emitting element 11 and the third light source 50 are fixed on the first sidewall 141a, and the second light source 30 is fixed on the second sidewall 141b. The light conversion component 12 is fixed to the laser emitting element 11 The third side wall 141c is disposed, and the light conversion layer 121 of the light conversion component 12 faces the laser emitting element 11.
所述第一雙色鏡20固設於所述鐳射發射元件11及光轉換組件12之間，且所述第一雙色鏡20的法線OO’與所述第一波長的鐳射L0的光路呈45度夾角。所述第一雙色鏡20可以透過所述鐳射發射元件11發射出的第一波長的鐳射L0，但是反射所述光轉換層121由鐳射L0激發出第二波長的光L1。 The first dichroic mirror 20 is fixed between the laser emitting element 11 and the light converting component 12, and the normal line OO' of the first dichroic mirror 20 and the optical path of the laser L0 of the first wavelength are 45. Degree of angle. The first dichroic mirror 20 can transmit the laser light L0 of the first wavelength emitted by the laser emitting element 11, but reflects the light converting layer 121 to excite the light L1 of the second wavelength by the laser L0.
所述第二光源30發出的光L2的方向與第二波長的光L1反射後的出射方向相同。所述第二光源30發出的光L2能夠穿過所述第一雙色鏡20。本實施方式中，所述第二光源30採用藍色發光二極體。 The direction of the light L2 emitted by the second light source 30 is the same as the direction of the light after the light L1 of the second wavelength is reflected. The light L2 emitted by the second light source 30 can pass through the first dichroic mirror 20. In this embodiment, the second light source 30 is a blue light emitting diode.
所述第二雙色鏡40位於所述第二波長的光L1經所述第一雙色鏡20反射後的出射光路上，且所述第二雙色鏡40的法線MM’與反射後的所述第二波長的光L1的光路呈45度夾角。所述第二雙色鏡40用於透過所述第三光源50的光L3，反射所述第二波長的光L1及第二光源30發出的光L2。 The second dichroic mirror 40 is located on the outgoing optical path of the second wavelength of light L1 reflected by the first dichroic mirror 20, and the normal MM' of the second dichroic mirror 40 and the reflected The optical path of the light L1 of the second wavelength is at an angle of 45 degrees. The second dichroic mirror 40 is configured to reflect the light L1 of the second wavelength and the light L2 emitted by the second light source 30 through the light L3 of the third light source 50.
所述第三光源50發出的光L3的方向與經所述第二雙色鏡40反射後第二波長的光L1的出射方向相同。所述第三光源50發出的光L3能夠穿過所述第二雙色鏡40。本實施方式中，所述第三光源50採用紅色發光二極體。 The direction of the light L3 emitted by the third light source 50 is the same as the direction of the light L1 of the second wavelength reflected by the second dichroic mirror 40. The light L3 emitted by the third light source 50 can pass through the second dichroic mirror 40. In the embodiment, the third light source 50 is a red light emitting diode.
所述第一中繼透鏡組60、反射鏡70及第二中繼透鏡80沿光路方向固設於所述第二容置腔142內。所述第二容置腔 142包括入光口142a、第四側壁142b及出光口142c。所述入光口142a與所述第一容置腔141連通。所述出光口142c與所述第三容置腔143連通。所述第四側壁142b位於所述入光口142a及出光口142c之間。所述第一中繼透鏡組60收容於所述入光口142a內，用於將所述第二波長的光L1、第二光源30發出的光L2及第三光源50發出的光L3轉換成平行光。 The first relay lens group 60, the mirror 70, and the second relay lens 80 are fixed in the second accommodating cavity 142 along the optical path. The second accommodating cavity The 142 includes an entrance 142a, a fourth sidewall 142b, and a light exit 142c. The light entrance port 142a is in communication with the first receiving cavity 141. The light exit port 142c is in communication with the third receiving cavity 143. The fourth sidewall 142b is located between the light entrance 142a and the light exit 142c. The first relay lens group 60 is received in the light entrance port 142a for converting the light L1 of the second wavelength, the light L2 emitted by the second light source 30, and the light L3 emitted by the third light source 50 into Parallel light.
所述反射鏡70設置於所述第四側壁142b上，且所述反射鏡70的法線NN’與經第一中繼透鏡組60出射後的所述第二波長的光L1的光路呈45度夾角。所述反射鏡70用於反射所述第二波長的光L1、第二光源30發出的光L2及第三光源50發出的光L3。 The mirror 70 is disposed on the fourth sidewall 142b, and the normal line NN' of the mirror 70 and the light path of the second wavelength light L1 emitted through the first relay lens group 60 are 45 Degree of angle. The mirror 70 is configured to reflect the light L1 of the second wavelength, the light L2 emitted by the second light source 30, and the light L3 emitted by the third light source 50.
所述第二中繼透鏡80收容於所述出光口142c內，用於將經所述反射鏡70反射出的所述第二波長的光L1、第二光源30發出的光L2及第三光源50發出的光L3的平行光進行彙聚，並出射到所述TIR棱鏡系統90。 The second relay lens 80 is received in the light exit port 142c for the light L1 of the second wavelength reflected by the mirror 70, the light L2 emitted by the second light source 30, and the third light source. The parallel light of the emitted light L3 50 is concentrated and exits to the TIR prism system 90.
所述TIR棱鏡系統90及成像元件110收容於所述第三容置腔143內。所述TIR棱鏡系統90由兩塊棱鏡組成。所述TIR棱鏡系統90可使進入其內部的光束不斷的發生反射及折射，從而改變光束的方向。當從所述第二中繼透鏡80射出的光束進入所述TIR棱鏡系統90之後，光束的方向就被改變成成像元件110工作所需的方向和角度。且當從成像元件110中射出的光束再次進入所述TIR棱鏡系統90之後，光束的方向就被改變，使光束可進入所述鏡頭130中。 The TIR prism system 90 and the imaging element 110 are received in the third accommodating cavity 143. The TIR prism system 90 is comprised of two prisms. The TIR prism system 90 allows the beam entering its interior to be constantly reflected and refracted, thereby changing the direction of the beam. When the light beam emerging from the second relay lens 80 enters the TIR prism system 90, the direction of the light beam is changed to the direction and angle required for the imaging element 110 to operate. And when the light beam emerging from the imaging element 110 re-enters the TIR prism system 90, the direction of the beam is changed so that the beam can enter the lens 130.
所述成像元件110係數位微鏡裝置。所述鏡頭130用於接收從TIR棱鏡系統90中射出的光線，然後在螢幕(未圖示)上成像。 The imaging element 110 is a coefficient micro-mirror device. The lens 130 is for receiving light emitted from the TIR prism system 90 and then imaging on a screen (not shown).
由於本發明提供的光轉換組件係通過燒結的方式將光轉換層結合在所述基板上的，所以能夠在鐳射的高溫照射下正常工作，避免脫落。 Since the light conversion module provided by the present invention bonds the light conversion layer to the substrate by sintering, it can be normally operated under high-temperature irradiation of laser light to avoid falling off.
另外，本領域技術人員可在本發明精神內做其他變化，但是，凡依據本發明精神實質所做的變化，都應包含在本發明所要求保護的範圍之內。 In addition, those skilled in the art can make other changes in the spirit of the invention, and all changes that are made according to the spirit of the invention should be included in the scope of the invention.
100‧‧‧投影機 100‧‧‧Projector
10‧‧‧光源模組 10‧‧‧Light source module
11‧‧‧鐳射發射元件 11‧‧‧Laser emitting components
12‧‧‧光轉換組件 12‧‧‧Light conversion components
120‧‧‧基板 120‧‧‧Substrate
120a‧‧‧被照射面 120a‧‧‧Improved surface
120b‧‧‧散熱面 120b‧‧‧heating surface
121‧‧‧光轉換層 121‧‧‧Light conversion layer
122‧‧‧散熱件 122‧‧‧ Heat sink
9‧‧‧散熱膏 9‧‧‧ Thermal paste
20‧‧‧第一雙色鏡 20‧‧‧First dichroic mirror
30‧‧‧第二光源 30‧‧‧second light source
40‧‧‧第二雙色鏡 40‧‧‧Second dichroic mirror
50‧‧‧第三光源 50‧‧‧ Third light source
60‧‧‧第一中繼透鏡組 60‧‧‧First relay lens group
70‧‧‧反射鏡 70‧‧‧Mirror
80‧‧‧第二中繼透鏡 80‧‧‧Second relay lens
90‧‧‧TIR棱鏡系統 90‧‧‧TIR prism system
110‧‧‧成像元件 110‧‧‧ imaging components
130‧‧‧鏡頭 130‧‧‧ lens
140‧‧‧光機底座 140‧‧‧Light machine base
141‧‧‧第一容置腔 141‧‧‧First accommodation cavity
141a‧‧‧第一側壁 141a‧‧‧First side wall
141b‧‧‧第二側壁 141b‧‧‧second side wall
141c‧‧‧第三側壁 141c‧‧‧ third side wall
142‧‧‧第二容置腔 142‧‧‧Second accommodating chamber
142a‧‧‧入光口 142a‧‧‧Into the light port
142b‧‧‧第四側壁 142b‧‧‧fourth side wall
142c‧‧‧出光口 142c‧‧‧Light outlet
143‧‧‧第三容置腔 143‧‧‧ third cavity
圖1為本發明提供的光轉換組件的示意圖；圖2為本發明提供的光源模組的示意圖；圖3為本發明提供的投影機的示意圖。 1 is a schematic diagram of a light conversion component provided by the present invention; FIG. 2 is a schematic diagram of a light source module provided by the present invention; and FIG. 3 is a schematic diagram of a projector provided by the present invention.
12‧‧‧光轉換組件 12‧‧‧Light conversion components
120‧‧‧基板 120‧‧‧Substrate
120a‧‧‧被照射面 120a‧‧‧Improved surface
120b‧‧‧散熱面 120b‧‧‧heating surface
121‧‧‧光轉換層 121‧‧‧Light conversion layer
122‧‧‧散熱件 122‧‧‧ Heat sink
9‧‧‧散熱膏 9‧‧‧ Thermal paste
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99111189A TWI402453B (en) | 2010-04-09 | 2010-04-09 | Luminescence conversion element, light module and projector using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99111189A TWI402453B (en) | 2010-04-09 | 2010-04-09 | Luminescence conversion element, light module and projector using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201135118A TW201135118A (en) | 2011-10-16 |
| TWI402453B true TWI402453B (en) | 2013-07-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99111189A TWI402453B (en) | 2010-04-09 | 2010-04-09 | Luminescence conversion element, light module and projector using same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI402453B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI681246B (en) * | 2018-11-05 | 2020-01-01 | 揚明光學股份有限公司 | Heat dissipation device and projector |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1441499A (en) * | 2001-12-19 | 2003-09-10 | 松下电器产业株式会社 | Optical module |
| US20040033307A1 (en) * | 1999-05-14 | 2004-02-19 | Ifire Technology, Inc. | Method of forming a thick film dielectric layer in an electroluminescent laminate |
| JP2006503418A (en) * | 2002-10-18 | 2006-01-26 | アイファイア テクノロジー コーポレーション | Color electroluminescence display device |
| TW200727467A (en) * | 2005-11-23 | 2007-07-16 | Ifire Technology Corp | Colour conversion and optical enhancement layers for electroluminescent displays |
-
2010
- 2010-04-09 TW TW99111189A patent/TWI402453B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040033307A1 (en) * | 1999-05-14 | 2004-02-19 | Ifire Technology, Inc. | Method of forming a thick film dielectric layer in an electroluminescent laminate |
| CN1441499A (en) * | 2001-12-19 | 2003-09-10 | 松下电器产业株式会社 | Optical module |
| JP2006503418A (en) * | 2002-10-18 | 2006-01-26 | アイファイア テクノロジー コーポレーション | Color electroluminescence display device |
| TW200727467A (en) * | 2005-11-23 | 2007-07-16 | Ifire Technology Corp | Colour conversion and optical enhancement layers for electroluminescent displays |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201135118A (en) | 2011-10-16 |
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