TWI401975B - Fabrication method of polymer-based vibrating membrane for capacitance micromachined ultrasonic transducers - Google Patents
Fabrication method of polymer-based vibrating membrane for capacitance micromachined ultrasonic transducers Download PDFInfo
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Description
本發明關於一種超音波換能器,尤指一種具高分子基振盪薄膜之電容式超音波換能器的製作方法。The invention relates to an ultrasonic transducer, in particular to a method for manufacturing a capacitive ultrasonic transducer with a polymer-based oscillating film.
超音波,泛指其振動頻率超出人耳所能聽見範圍的音波,高頻的特性使其被廣泛地應用於軍事、醫療、工業等領域,且較常作為檢測用途。超音波檢測技術主要使用一超音波換能器(Ultrasonic Transducer)達成,利用音波的發射與接收進行如位置、速度等物理量之量測。Ultrasonic waves refer to sound waves whose vibration frequency exceeds the range that can be heard by the human ear. The high-frequency characteristics make them widely used in military, medical, industrial and other fields, and are often used for detection purposes. Ultrasonic detection technology is mainly achieved by using an ultrasonic transducer (Ultrasonic Transducer), which uses the transmission and reception of sound waves to measure physical quantities such as position and velocity.
習知超音波換能器多為壓電式超音波換能器,但由於其感測環境多所受限,故已逐漸由電容式超音波換能器取代。電容式超音波換能器主要利用一固定電極以及一具有可震盪薄膜之電極形成電容式結構,加入交流電壓時可驅動薄膜高頻震動,從而產生超音波。Conventional ultrasonic transducers are mostly piezoelectric ultrasonic transducers, but due to their limited sensing environment, they have gradually been replaced by capacitive ultrasonic transducers. Capacitive ultrasonic transducers mainly use a fixed electrode and an electrode with a oscillating film to form a capacitive structure. When an AC voltage is applied, the high-frequency vibration of the film can be driven to generate ultrasonic waves.
中華民國專利發明公告第1260940號「高分子基電容式超音波換能器製作方法」中,係提出一種於一次程序中製造出電容式超音波換能器的製程方法,可大幅降低微加工製程時間,並改善傳統電容式超音波換能器製法之加工溫度、高殘餘應力、製程特性不易掌握且高成本的問題。In the method of manufacturing a polymer-based capacitive ultrasonic transducer according to the Patent Publication No. 1260940 of the Republic of China, a method for manufacturing a capacitive ultrasonic transducer in a single program is proposed, which can greatly reduce the micromachining process. Time, and improve the processing temperature, high residual stress, and process characteristics of the conventional capacitive ultrasonic transducer manufacturing method is difficult to grasp and high cost.
然而此種製程方法必須於製造過程中先形成金屬犧牲層,再利用濕式蝕刻方式移除該金屬犧牲層以構成振動空腔,而提供蝕刻液流通的孔洞卻不易封孔,使其作為電極之導電層容易受到水氣氧化,故使用環境仍受限於大氣狀態下,無法擴及水中環境,致使該製程方法仍有待進一步解決此問題之方案。However, such a process method must first form a metal sacrificial layer in the manufacturing process, and then remove the metal sacrificial layer by wet etching to form a vibrating cavity, and provide a hole through which the etching liquid flows, but it is not easy to seal the hole and serve as an electrode. The conductive layer is easily oxidized by water vapor, so the use environment is still limited by the atmospheric state, and cannot be extended to the underwater environment, so that the process method still needs to further solve the problem.
由上述說明可知,習知技術雖有可於一次程序製造電容式超音波換能器之方法,但此種方式存在有透過犧牲層製作空腔結構後,蝕刻孔洞不易封孔的問題,使高分子基電容式超音波換能器之使用範圍受到限制。It can be seen from the above description that although the prior art has a method for manufacturing a capacitive ultrasonic transducer in a single program, there is a problem in that the etching hole is not easily sealed after the cavity structure is formed through the sacrificial layer, so that the etching hole is not easy to be sealed. The range of use of molecular-based capacitive ultrasonic transducers is limited.
有鑑於此,本發明之主要目的在於提供一種具高分子基振盪薄膜之電容式超音波換能器的製作方法,其藉由薄膜黏合方式製作超音波換能器的振動薄膜,不需製作蝕刻孔洞,故不存在蝕刻孔洞不易封孔的問題,使得高分子基電容式超音波換能器應用範圍可擴及水中環境。In view of the above, the main object of the present invention is to provide a method for fabricating a capacitive ultrasonic transducer having a polymer-based oscillating film, which comprises a film bonding method for fabricating a vibrating film of an ultrasonic transducer without etching. Holes, so there is no problem that the etching holes are not easy to seal, so that the application range of the polymer-based capacitive ultrasonic transducer can be extended to the underwater environment.
欲達上述目的,本發明所採用的技術手段係主要令此具高分子基振盪薄膜之電容式超音波換能器的製作方法包含數道流程:一高分子基薄膜製作流程,係包含步驟:提供一透明基材;於該透明基材上塗佈一高分子材料層;及透過溫度控制持續使該高分子材料層呈現可黏著狀態;一支撐座製作流程,係包含步驟:提供一基板;於該基板上設一下導電層;及於該下導電層上形成支撐座;以及一換能器製作流程,係包含步驟:將前述高分子材料層與前述支撐座壓黏一起;固化鏈結該高分子材料層與支撐座;移除透明基材;及於高分子材料層上形成一上導電層。In order to achieve the above object, the technical means adopted by the present invention mainly comprises the method for manufacturing the capacitive ultrasonic transducer having the polymer-based oscillating film, comprising a plurality of processes: a polymer-based film production process, comprising the steps of: Providing a transparent substrate; coating a polymer material layer on the transparent substrate; and continuously maintaining the polymer material layer in an adhesive state by temperature control; and a support base manufacturing process comprising the steps of: providing a substrate; a conductive layer is disposed on the substrate; and a support base is formed on the lower conductive layer; and a transducer manufacturing process includes the steps of: pressing the polymer material layer and the support seat together; curing the chain a polymer material layer and a support; removing the transparent substrate; and forming an upper conductive layer on the polymer material layer.
透過上述數道流程即可完成電容式超音波換能器的製作,由於本製作方法係透過分別製作高分子基薄膜與支撐座,再藉由黏壓方式結合兩者構成空腔結構,故不需製作蝕刻孔洞,自然不存在有蝕刻孔洞不易封孔的問題。Through the above-mentioned several processes, the fabrication of the capacitive ultrasonic transducer can be completed. Since the manufacturing method separately forms the polymer-based film and the support base, and then combines the two to form a cavity structure by the pressure-bonding method, It is necessary to make an etched hole, and naturally there is no problem that the etched hole is difficult to seal.
請參考第一圖所示,本發明具高分子基振盪薄膜之電容式超音波換能器的製作方法係包含一高分子基薄膜製作流程(1)、一支撐座製作流程(2)以及一換能器製作流程(3)等數道流程,其中高分子基薄膜製作流程(1)與支撐座製作流程(2)係各自獨立進行之流程而無先後順序限制。Referring to the first figure, the manufacturing method of the capacitive ultrasonic transducer with the polymer-based oscillating film of the present invention comprises a polymer-based film production process (1), a support base production process (2), and a The transducer production process (3) and the like are several processes, wherein the polymer-based film production process (1) and the support base production process (2) are independently performed without any order limitation.
關於高分子基薄膜製作流程(1),同時配合第二圖所示,該製作流程係包含下列步驟:提供一透明基材(10)(100),該透明基材(10)可由選自透明玻璃、矽膠、樹脂、塑膠、聚酯類、光阻劑以及高分子材料等材料擇一所製成;於該透明基材(10)上塗佈一高分子材料層(11)(101),該高分子材料層(11)之厚度為10μm以下,本實施例中,該高分子材料層(11)係為感光型高分子材料層,可為SU-8光阻劑;及透過溫度控制持續使該高分子材料層(11)呈現可黏著狀態(102),其中,以控制該高分子材料層(11)溫度介於攝氏60度至100度為較佳,可在未達玻璃轉換溫度之條件下使高分子材料層(11)的溶劑揮發。Regarding the polymer-based film production process (1), as shown in the second figure, the production process includes the following steps: providing a transparent substrate (10) (100), which can be selected from transparent A glass, a silicone resin, a resin, a plastic, a polyester, a photoresist, and a polymer material are alternatively prepared; a polymer material layer (11) (101) is coated on the transparent substrate (10), The polymer material layer (11) has a thickness of 10 μm or less. In the present embodiment, the polymer material layer (11) is a photosensitive polymer material layer, which can be a SU-8 photoresist; and the temperature control continues. The polymer material layer (11) is brought into an adhesive state (102), wherein it is preferable to control the temperature of the polymer material layer (11) to be between 60 degrees Celsius and 100 degrees Celsius, and the glass transition temperature is not reached. The solvent of the polymer material layer (11) is volatilized under the conditions.
關於該支撐座製作流程(2),請同時配合參考第三圖及第四圖所示,該製作流程係包含下列步驟:提供一基板(20)(200),本實施例中,該基板(20)可由選自玻璃、矽膠、樹脂、塑膠、聚酯類、光阻劑、高分子材料等所構成之群組中至少一種材料所製成;於該基板(20)上形成一下導電層(21)(201),該下導電層(21)係由選自金、銅、鋁、鉑、銀、銦錫氧化物等導電材料中擇其一所製成;於該下導電層(21)上形成支撐座(22)(202),該支撐座(22)可透過感光型高分子材料塗佈微影製程、高分子塗佈壓印或膠框印刷(Screen Printing)等方法形成。關於該換能器製作流程(3),同時配合參考第五至七圖所示,該製作流程係包含下列步驟:將前述高分子材料層(11)與前述支撐座(22)壓黏一起(300);固化鏈結該高分子材料層(11)與支撐座(22)(301),本實施例中,係選用紫外光曝光方式、加熱烘烤方式或者兩方式一起使用以固化鏈結該高分子材料層(11)與支撐座(22);移除透明基材(10)(302);於高分子材料層(11)上形成一上導電層(30)(303),本實施例中,係由選自膠框印刷(Screen Printing)、噴墨(Ink-Jet Printer)、光阻剝落法(Lift-Off)或微影蝕刻技術等方法中擇其一而形成該上導電層(30),且該上導電層(30)可由選自金、銅、鋁、鉑、銀、銦錫氧化物等導電材料中擇其一所製成。Regarding the support manufacturing process (2), please refer to the third and fourth figures at the same time, the production process includes the following steps: providing a substrate (20) (200), in the embodiment, the substrate ( 20) may be made of at least one material selected from the group consisting of glass, silicone, resin, plastic, polyester, photoresist, polymer material, etc.; forming a conductive layer on the substrate (20) 21) (201), the lower conductive layer (21) is made of a conductive material selected from the group consisting of gold, copper, aluminum, platinum, silver, indium tin oxide, etc.; and the lower conductive layer (21) A support base (22) (202) is formed thereon, and the support base (22) can be formed by a photosensitive polymer material coating lithography process, polymer coating embossing, or screen printing. Regarding the transducer manufacturing process (3), and referring to the fifth to seventh figures, the manufacturing process includes the following steps: pressing the polymer material layer (11) and the support base (22) together ( 300); curing the polymer layer (11) and the support base (22) (301), in this embodiment, the ultraviolet light exposure method, the heating baking method or the two methods are used together to solidify the chain. a polymer material layer (11) and a support base (22); removing the transparent substrate (10) (302); forming an upper conductive layer (30) (303) on the polymer material layer (11), this embodiment The upper conductive layer is formed by one of a method selected from the group consisting of: Screen Printing, Ink-Jet Printer, Lift-Off, or lithography etching. 30), and the upper conductive layer (30) may be made of one of conductive materials selected from the group consisting of gold, copper, aluminum, platinum, silver, indium tin oxide, and the like.
前述高分子材料層(11)在黏壓於支撐座(22)之後,即可作為電容式超音波換能器的高分子基振動薄膜,待上導電層(30)完成,即可完成電容式超音波換能器的製作。After the polymer material layer (11) is adhered to the support base (22), it can be used as a polymer-based vibration film of a capacitive ultrasonic transducer. After the conductive layer (30) is completed, the capacitive type can be completed. The production of ultrasonic transducers.
由於本製作方法係透過分別製作高分子基薄膜與支撐座,再藉由黏壓方式結合兩者構成空腔結構,故不需製作蝕刻孔洞,自然不存在有蝕刻孔洞不易封孔的問題,使得本發明具高分子基振盪薄膜之電容式超音波換能器可將使用範圍擴展至水中環境。Since the manufacturing method separately forms the polymer-based film and the support base, and then combines the two to form a cavity structure by adhesive bonding, it is not necessary to make an etched hole, and naturally there is no problem that the etched hole is not easy to be sealed. The capacitive ultrasonic transducer with the polymer-based oscillating film of the invention can extend the use range to the underwater environment.
(10)...透明基材(10). . . Transparent substrate
(11)...高分子材料層(11). . . Polymer layer
(20)...基板(20). . . Substrate
(21)...下導電層(twenty one). . . Lower conductive layer
(22)...支撐座(twenty two). . . Support base
(30)...上導電層(30). . . Upper conductive layer
第一圖:係本發明一較佳實施例之流程圖。First Figure: A flow chart of a preferred embodiment of the present invention.
第二圖:係本發明之高分子基薄膜製作流程的階段製品示意圖。The second figure is a schematic diagram of the stage product of the polymer-based film production process of the present invention.
第三~第四圖:係本發明之支撐座製作流程的示意圖。Third to fourth figures are schematic views showing the manufacturing process of the support of the present invention.
第五~第七圖:係本發明之換能器製作流程的示意圖。Fifth to seventh figures are schematic views showing the flow of the transducer manufacturing process of the present invention.
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