TWI398306B - Method for coating fluorescence material - Google Patents
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- TWI398306B TWI398306B TW98144694A TW98144694A TWI398306B TW I398306 B TWI398306 B TW I398306B TW 98144694 A TW98144694 A TW 98144694A TW 98144694 A TW98144694 A TW 98144694A TW I398306 B TWI398306 B TW I398306B
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Description
本發明係關於一種螢光材料塗佈方法及其所製備之基板，尤指一種可於基板上均勻塗佈螢光材料之方法，以製得具有性質均一且折射率佳之塗佈有螢光材料之基板。The invention relates to a method for coating a fluorescent material and a substrate prepared thereby, in particular to a method for uniformly coating a fluorescent material on a substrate, to obtain a coated fluorescent material having uniform properties and good refractive index. The substrate.
近年來，因發光二極體(LED)具有發光效率高、耗電量少、使用壽命長、及元件體積小等優點，已廣泛應用於各種發光裝置中，並取代數種照明設備。In recent years, light-emitting diodes (LEDs) have been widely used in various light-emitting devices because of their high luminous efficiency, low power consumption, long service life, and small component size, and have replaced several types of lighting devices.
然而，LED卻難以應用於民生照明市場，除了發光二極體具有散熱、亮度不足和亮度遞減等問題外，更具有無法直接激發出白光的問題。因此，已有許多研究企圖發展出高效率之白光LED，以取代現有的照明設備。However, LEDs are difficult to apply to the people's livelihood lighting market. In addition to the problems of heat dissipation, insufficient brightness, and diminishing brightness, the LEDs have the problem of not directly stimulating white light. Therefore, many studies have attempted to develop high-efficiency white LEDs to replace existing lighting equipment.
目前主流之白光LED，係利用藍光發光二極體晶片配合黃光之YAG螢光粉體，以做為白光光源。雖然以此互補色原理所產生白光，其光譜波長分布之連續性不如太陽光，而有色彩不均的情形，故色彩飽和度較低。因此，以此方式產生之白光光源僅可用於簡單的照明用，並無法廣泛應用於民生照明市場。At present, the mainstream white light LED uses a blue light emitting diode chip to match the yellow light YAG fluorescent powder as a white light source. Although the white light generated by this complementary color principle is not as continuous as the sunlight, and the color is uneven, the color saturation is low. Therefore, the white light source generated in this way can be used only for simple lighting, and cannot be widely applied to the market of the people's livelihood lighting.
此外，亦可利用紫外光發光二極體晶片配合紅光、綠光、以及藍光三色螢光粉，藉由紅藍綠三原色之混光機制，可混合成白光。由於使用的紫外光LED晶片激發強度及轉換效率較高，因此可得強度更高之白光。In addition, the ultraviolet light emitting diode chip can be combined with the red, green, and blue three-color fluorescent powder, and the white light can be mixed by the light mixing mechanism of the red, blue, and green primary colors. Since the ultraviolet light LED chip used has higher excitation intensity and conversion efficiency, white light with higher intensity can be obtained.
目前，形成可發出白光之發光二極體係採用下述方法進行封裝。首先，依預定色溫秤取一適當比例之一種以上之螢光粉。接著，將螢光粉加入至樹脂(如：矽氧樹脂或環氧樹脂)並攪拌，使螢光粉可均勻分散於樹脂中。而後，將分散有螢光粉之樹脂與固化劑混合，以點膠機將分散有螢光粉之膠體102覆蓋於LED晶片101上，經烘乾及封裝製程，可製得一LED元件10，如圖1所示。At present, a light-emitting diode system that emits white light is formed by the following method. First, an appropriate proportion of one or more types of phosphor powder is taken according to a predetermined color temperature scale. Next, the phosphor powder is added to a resin (for example, a silicone resin or an epoxy resin) and stirred to uniformly disperse the phosphor powder in the resin. Then, the resin in which the phosphor powder is dispersed is mixed with the curing agent, and the colloid 102 in which the phosphor powder is dispersed is coated on the LED wafer 101 by a dispenser, and an LED component 10 can be obtained by drying and packaging processes. As shown in Figure 1.
然而，依照上述方法所製得之LED元件，由於螢光粉之外型及尺寸不規則，故螢光粉層容易因螢光粉材質性質不統一，而導致色溫不準與混光不均等問題。因此，目前亟需發展出一種螢光粉塗佈方法，其可製作出混光均勻且折射率佳之基板，以應用於LED發光照明設備中。However, according to the LED element produced by the above method, since the shape and size of the phosphor powder are irregular, the phosphor powder layer is liable to be inconsistent in color temperature and uneven color mixing due to the non-uniform nature of the phosphor powder material. . Therefore, there is an urgent need to develop a phosphor powder coating method which can produce a substrate with uniform light mixing and good refractive index for use in an LED lighting device.
本發明之主要目的係在提供一種螢光材料塗佈方法，其可以簡便之方法將螢光粉形成於基板上。SUMMARY OF THE INVENTION A primary object of the present invention is to provide a method of coating a fluorescent material which can form a phosphor powder on a substrate in a simple manner.
本發明之另一目的係在提供一種塗佈有螢光材料之基板，其表面具有性質均一之螢光粉，而可做為發光二極體之發光元件。Another object of the present invention is to provide a substrate coated with a fluorescent material having a uniform fluorescent powder on its surface and which can be used as a light-emitting element of a light-emitting diode.
為達成上述目的，本發明係提供一種螢光材料塗佈方法，包括下列步驟：(A)將一螢光材料分散於一第一溶劑中，以形成一螢光材料溶液；(B)將一基板置於一容器，並注入一第二溶劑，且第二溶劑係覆蓋基板之表面；(C)將螢光材料溶液添加至第二溶劑，以於第二溶劑表面形成一螢光材料薄膜；以及(D)移除容器中之第二溶劑，使螢光材料薄膜形成於基板表面。In order to achieve the above object, the present invention provides a method for coating a fluorescent material, comprising the steps of: (A) dispersing a phosphor material in a first solvent to form a phosphor material solution; (B) The substrate is placed in a container and a second solvent is injected, and the second solvent covers the surface of the substrate; (C) the fluorescent material solution is added to the second solvent to form a thin film of the fluorescent material on the surface of the second solvent; And (D) removing the second solvent in the container to form a film of the phosphor material on the surface of the substrate.
於本發明之螢光材料塗佈方法中，當將螢光材料溶液緩慢滴入第二溶劑中，而可形成一螢光材料薄膜。同時，藉由緩慢移除第二溶劑，而可使螢光材料薄膜良好形成在基板表面。In the method of coating a fluorescent material of the present invention, a film of a fluorescent material can be formed by slowly dropping a solution of the fluorescent material into the second solvent. At the same time, the phosphor material film can be formed well on the surface of the substrate by slowly removing the second solvent.
於本發明之螢光材料塗佈方法中，於步驟(D)後，可更包括一步驟(E)：乾燥形成有螢光材料薄膜之基板，以去除懸浮螢光材料之第一溶劑。同時，於步驟(E)後，可更包括一步驟(F)：重複該步驟(A)至步驟(E)，以形成複數層螢光材料薄膜。In the fluorescent material coating method of the present invention, after the step (D), the method further includes a step (E) of drying the substrate on which the fluorescent material film is formed to remove the first solvent of the suspended fluorescent material. Meanwhile, after the step (E), a step (F) may be further included: the step (A) to the step (E) are repeated to form a plurality of layers of the phosphor material film.
於本發明之螢光材料塗佈方法中，第一溶劑與第二溶劑並無特殊限制，只要第二溶劑比重與張力均大於第一溶劑即可。較佳地，第一溶劑係選自由水、乙醇、丙醇、及其混合物所組成之群組；該第二溶劑係選自由水、乙醇、丙醇、及其混合物所組成之群組。In the method for coating a fluorescent material of the present invention, the first solvent and the second solvent are not particularly limited as long as the specific gravity and the tension of the second solvent are both greater than the first solvent. Preferably, the first solvent is selected from the group consisting of water, ethanol, propanol, and mixtures thereof; the second solvent is selected from the group consisting of water, ethanol, propanol, and mixtures thereof.
此外，為使螢光材料薄膜可更加牢靠的形成在基板表面，可更利用溶膠凝膠法於螢光材料薄膜表面形成有一填充層，以使螢光材料薄膜具有理想之折射率。因此，於本發明之螢光材料塗佈方法中，於步驟(E)後，可更包括下列步驟：(G)提供一醇鹽溶液以及一酸性溶液；(H)混合醇鹽溶液及酸性溶液，以得到一混合溶液；以及(I)將此混合溶液塗佈於螢光材料薄膜上，以形成一填充層。同時，於步驟(I)後，可更包括一步驟(J)：熱處理形成有填充層之基板，再退火處理形成有填充層之基板。In addition, in order to make the fluorescent material film more firmly formed on the surface of the substrate, a filling layer may be formed on the surface of the fluorescent material film by a sol-gel method to make the fluorescent material film have a desired refractive index. Therefore, in the method for coating a fluorescent material of the present invention, after the step (E), the method further comprises the steps of: (G) providing an alkoxide solution and an acidic solution; (H) mixing the alkoxide solution and the acidic solution. To obtain a mixed solution; and (I) apply the mixed solution to the phosphor material film to form a filled layer. Meanwhile, after the step (I), a step (J) may be further included: heat-treating the substrate on which the filling layer is formed, and annealing the substrate on which the filling layer is formed.
於本發明之螢光材料塗佈方法中，醇鹽可為一矽醇鹽、或一金屬醇鹽，且金屬醇鹽之金屬係選自由Al、Zn、Zr、Y、Ti、Co、Mn、Ni、Cu、Pb、及其組合所組成之群組。此外，酸性溶液可為硝酸、鹽酸、氫氟酸、硫酸、磷酸、或檸檬酸溶液。再者，酸性溶液可更包含YAG、Y2 O3 、AlN、或其混合物。同時，酸性溶液可再更包含至少一選自由Ce、Nd、La、Eu、Tb、Gd、Dy、Er、Tm、Yb、Lu、Li、Mg、Ca、Sr、Ba、及其他鑭系元素(Pr、Pm、Sm、Ho、Er)所組成之群組之金屬離子。In the method for coating a fluorescent material of the present invention, the alkoxide may be a monoterpoxide or a metal alkoxide, and the metal of the metal alkoxide is selected from the group consisting of Al, Zn, Zr, Y, Ti, Co, Mn, A group consisting of Ni, Cu, Pb, and combinations thereof. Further, the acidic solution may be a solution of nitric acid, hydrochloric acid, hydrofluoric acid, sulfuric acid, phosphoric acid, or citric acid. Further, the acidic solution may further contain YAG, Y 2 O 3 , AlN, or a mixture thereof. Meanwhile, the acidic solution may further comprise at least one selected from the group consisting of Ce, Nd, La, Eu, Tb, Gd, Dy, Er, Tm, Yb, Lu, Li, Mg, Ca, Sr, Ba, and other actinides ( Metal ions of a group consisting of Pr, Pm, Sm, Ho, and Er).
另一方面，本發明更提供一種利用上述方法所製備之塗佈有螢光材料之基板，其包括：一基板、以及一位於基板上之螢光材料薄膜。其中，螢光材料係包括一球型載體、以及一螢光粉體；或是螢光材料係為一螢光粉體。此外，本發明之塗佈有螢光材料之基板中，可更包括一填充層，係位於螢光材料薄膜上，且螢光材料薄膜位於基板及填充層間。In another aspect, the present invention further provides a substrate coated with a fluorescent material prepared by the above method, comprising: a substrate; and a fluorescent material film on the substrate. The fluorescent material comprises a spherical carrier and a phosphor powder; or the fluorescent material is a phosphor powder. In addition, the substrate coated with the fluorescent material of the present invention may further comprise a filling layer on the fluorescent material film, and the fluorescent material film is located between the substrate and the filling layer.
因此，利用本發明之螢光材料塗佈方法所製作之塗佈有螢光材料之基板，由於螢光材料粒徑及性質均一，而可於基板表面形成均勻之螢光材料薄膜。同時，透過螢光材料薄膜上之填充層，除了可保護螢光奈材料薄膜不會輕易從基板上剝離，更可提升所形成基板之折射率。Therefore, the substrate coated with the phosphor material produced by the phosphor coating method of the present invention can form a uniform phosphor film on the surface of the substrate because the particle size and properties of the phosphor material are uniform. At the same time, through the filling layer on the fluorescent material film, in addition to protecting the fluorescent nano material film from being easily peeled off from the substrate, the refractive index of the formed substrate can be improved.
於本發明之螢光材料塗佈方法及塗佈有螢光材料之基板中，螢光材料係包括一球型載體、以及一螢光粉體。其中，螢光粉體可覆蓋球型載體表面；螢光粉體可包含於球型載體內部；或部分螢光粉體係覆蓋球型載體表面，而部分螢光粉體係包含於球型載體內部。同時，球型載體之材料可為SiOx 、TiOx 、PS、PMMA、或三聚氰胺樹脂。螢光粉體之材料可為一般習知之螢光粉，如：選自由ZnO、ZrO2 、PbO、Y2 O3 、Y2 O2 、Zn2 SiO4 、Y3 Al5 O12 、Y3 (AlGa)5 O12 Y2 SiO5 、LaOCl、InBO3 、ZnGa2 O4 、ZnS、PbS、CdS、CaS、SrS、Znx Cd1-x S、Y2 O2 S、AlN、及Gd2 O2 S所組成之群組之化合物，且做為螢光粉體之化合物可更摻雜至少一選自由Cu、Ag、Eu、Yb、La、Cl、Tb、Al、Ce、Er、Zn、Mn、及其他鑭系元素(Pr、Pm、Sm、Ho、Er)所組成之群組之元素。再者，球型載體之粒徑較佳係介於350nm至10μm之間，更佳係介於350nm至5μm之間；而螢光粉體之粒徑較佳係介於10nm至5000nm之間，更佳係介於10nm至100nm之間，最佳係介於10nm至30nm之間。In the method for coating a fluorescent material of the present invention and the substrate coated with the fluorescent material, the fluorescent material comprises a spherical carrier and a phosphor powder. The fluorescent powder may cover the surface of the spherical carrier; the fluorescent powder may be contained inside the spherical carrier; or part of the fluorescent powder system covers the surface of the spherical carrier, and part of the fluorescent powder system is contained inside the spherical carrier. Meanwhile, the material of the spherical carrier may be SiO x , TiO x , PS, PMMA, or melamine resin. The material of the phosphor powder may be a conventionally known phosphor powder, such as selected from the group consisting of ZnO, ZrO 2 , PbO, Y 2 O 3 , Y 2 O 2 , Zn 2 SiO 4 , Y 3 Al 5 O 12 , Y 3 (AlGa) 5 O 12 Y 2 SiO 5 , LaOCl, InBO 3 , ZnGa 2 O 4 , ZnS, PbS, CdS, CaS, SrS, Zn x Cd 1-x S, Y 2 O 2 S, AlN, and Gd 2 a compound of the group consisting of O 2 S, and the compound as a phosphor powder may be more doped with at least one selected from the group consisting of Cu, Ag, Eu, Yb, La, Cl, Tb, Al, Ce, Er, Zn, An element of a group consisting of Mn and other lanthanides (Pr, Pm, Sm, Ho, Er). Furthermore, the particle size of the spherical carrier is preferably between 350 nm and 10 μm, more preferably between 350 nm and 5 μm, and the particle size of the phosphor powder is preferably between 10 nm and 5000 nm. More preferably, the system is between 10 nm and 100 nm, and the optimum is between 10 nm and 30 nm.
再者，於本發明之螢光材料塗佈方法及塗佈有螢光材料之基板中，基板可為任何LED晶片或LED元件半成品，較佳為一藍寶石基板、一形成有磊晶層之藍光磊晶片、或覆晶LED晶片。Furthermore, in the method for coating a fluorescent material of the present invention and the substrate coated with the fluorescent material, the substrate may be any LED chip or semi-finished LED element, preferably a sapphire substrate and a blue light having an epitaxial layer formed thereon. Epitaxial wafer, or flip chip LED chip.
此外，於本發明之塗佈有螢光材料之基板中，填充層之材料可為SiO2 、Al2 O3 、ZnO、ZrO、Y2 O3 、TiO2 、CoO、MnO2 、NiO、CuO、PbO、及其複合物所組成之群組。同時，填充層可更包括YAG、Y2 O3 、AlN、或其混合物，且YAG或Y2 O3 可更摻雜選自由Ce、Nd、La、Eu、Tb、Gd、Dy、Er、Tm、Yb、Lu、Li、Mg、Ca、Sr、Ba、及其他鑭系元素(Pr、Pm、Sm、Ho、Er)所組成之群組之元素。Further, in the substrate coated with the fluorescent material of the present invention, the material of the filling layer may be SiO 2 , Al 2 O 3 , ZnO, ZrO, Y 2 O 3 , TiO 2 , CoO, MnO 2 , NiO, CuO. , a group of PbOs, and their complexes. Meanwhile, the filling layer may further include YAG, Y 2 O 3 , AlN, or a mixture thereof, and YAG or Y 2 O 3 may be more doped from Ce, Nd, La, Eu, Tb, Gd, Dy, Er, Tm. An element of a group consisting of Yb, Lu, Li, Mg, Ca, Sr, Ba, and other lanthanides (Pr, Pm, Sm, Ho, Er).
圖2A至圖2F係本發明實施例1之螢光材料塗佈於基板表面之步驟示意圖。2A to 2F are schematic views showing the steps of applying the phosphor material of the embodiment 1 of the present invention to the surface of the substrate.
配製螢光粉溶液Preparing a phosphor powder solution
首先，取螢光粉做為一螢光材料，其中螢光粉之球型載體係採用粒徑為500nm且材料為SiO2 之奈米球，而螢光粉體則採用粒徑約30nm之Y2 O3 :La3+ 、YAG:La3+ 、以及CdSe:ZnS之混合物，且螢光粉體係透過矽烷分子(APTMS)鍵結在球型載體表面。藉由調整各種螢光粉體之比例，經藍光發光二極體激發後，此螢光粉可於其表面進行混光而發出白光。First, the fluorescent powder is used as a fluorescent material, wherein the spherical carrier of the fluorescent powder is a nanosphere having a particle diameter of 500 nm and the material is SiO 2 , and the fluorescent powder is a Y having a particle diameter of about 30 nm. 2 O 3 : a mixture of La 3+ , YAG:La 3+ , and CdSe:ZnS, and the phosphor powder system is bonded to the surface of the spherical carrier via a decane molecule (APTMS). By adjusting the ratio of various phosphor powders, after being excited by the blue light emitting diode, the phosphor powder can be mixed on the surface to emit white light.
而後，將螢光粉210混合於具有高分散性之第一溶劑211中，得到一螢光粉混合溶液，如圖2A所示。在此，係採用乙醇做為第一溶劑。Then, the phosphor powder 210 is mixed in the first solvent 211 having high dispersibility to obtain a phosphor powder mixed solution as shown in Fig. 2A. Here, ethanol is used as the first solvent.
形成螢光粉薄膜Forming a phosphor film
如圖2B所示，取一基板20，並將其置於容器24底部，其中，此基板係為一覆晶LED晶片。而後，於容器24中注入第二溶劑23，在此，係採用純水做為第二溶劑。接著，於第二溶劑23表面緩慢滴加螢光粉混合溶液，由於純水之比重及張力高於乙醇，且更因由SiO2 所形成之螢光粉210具有多孔洞，故螢光粉210可排列在純水表面，而形成一螢光粉薄膜21，如圖2C所示。As shown in FIG. 2B, a substrate 20 is taken and placed at the bottom of the container 24, wherein the substrate is a flip chip LED wafer. Then, a second solvent 23 is injected into the container 24, and here, pure water is used as the second solvent. Then, the phosphor powder mixing solution is slowly added dropwise on the surface of the second solvent 23, since the specific gravity and the tension of the pure water are higher than that of the ethanol, and the phosphor powder 210 formed of the SiO 2 has a porous hole, the phosphor powder 210 can be Arranged on the surface of pure water to form a phosphor powder film 21 as shown in Fig. 2C.
而後，緩慢將第二溶劑23自容器24內抽出或自容器24底端洩出，直至螢光粉薄膜21貼近基板20表面，如圖2D所示。接著，將容器24置於乾燥處理設備(圖中未示)中，以蒸發除去具高分散性之乙醇(圖中未示)。待乾燥完全後，則可得到一形成於基板20表面之螢光粉薄膜21，如圖2E所示。Thereafter, the second solvent 23 is slowly withdrawn from the container 24 or discharged from the bottom end of the container 24 until the phosphor powder film 21 is in close proximity to the surface of the substrate 20, as shown in Fig. 2D. Next, the container 24 is placed in a drying treatment apparatus (not shown) to evaporate the ethanol having high dispersibility (not shown). After the drying is completed, a phosphor powder film 21 formed on the surface of the substrate 20 is obtained, as shown in Fig. 2E.
此外，更可重複如圖2B至圖2E等所示之上述步驟，形成具有多層結構之螢光粉薄膜，以使所形成之螢光粉薄膜混光效果達到預期之色溫以及演色性。Further, the above-described steps as shown in FIG. 2B to FIG. 2E and the like can be repeated to form a phosphor powder film having a multilayer structure, so that the light-mixing effect of the formed phosphor powder film can reach a desired color temperature and color rendering property.
將上述製得之塗佈有螢光粉薄膜之覆晶LED晶片，經試點亮後，所發出的混光色溫為5400K。The above-prepared flip-chip LED wafer coated with the phosphor powder film was subjected to trial lighting, and the mixed color temperature was 5400K.
形成填充層Fill layer
首先，提供一醇鹽溶液，其中，此醇鹽溶液可為矽醇鹽類溶液、或單一或複合金屬醇鹽溶液。於本實施例中，係採用矽醇鹽(如：TEOS)之水溶液做為溶膠凝膠前趨溶液。First, an alkoxide solution is provided, wherein the alkoxide solution may be a decyl alkoxide solution, or a single or complex metal alkoxide solution. In the present embodiment, an aqueous solution of a decyl alkoxide (e.g., TEOS) is used as a sol-gel precursor solution.
同時，亦提供一種酸性溶液，其中，此酸性溶液係透過將YAG、及La3+ 鹽類溶解於一硝酸所配製而成。At the same time, an acidic solution is also provided, wherein the acidic solution is prepared by dissolving YAG and La 3+ salts in mononitrate.
接著，將上述所配製之醇鹽溶液與酸性溶液混合均勻後，以旋轉塗佈法將混合溶液塗佈於螢光粉薄膜21上，而形成一填充層22，如圖2F所示。藉由溶膠凝膠法，本實施例所製得填充層則為含有YAG:La3+ 之SiO2 材料層。Next, after the above-prepared alkoxide solution is uniformly mixed with the acidic solution, the mixed solution is applied onto the phosphor powder film 21 by spin coating to form a filling layer 22 as shown in Fig. 2F. By the sol-gel method, the packed layer obtained in this example is a layer of SiO 2 material containing YAG:La 3+ .
靜置後，將具有螢光粉薄膜21及填充層22之基板20進行熱處理，再進行退火處理，則完成本實施例之塗佈有螢光材料之基板。After standing, the substrate 20 having the phosphor powder film 21 and the filling layer 22 is heat-treated and then annealed to complete the substrate coated with the fluorescent material of the present embodiment.
藉由熱處理及退火處理，可使填充層22中之YAG再結晶，可提升螢光粉薄膜之材質均一性，且更可使螢光粉薄膜達到所預定之均一折射率。同時，由於填充層22係形成在螢光粉薄膜上及螢光粉間的間隙中，故更可保護螢光粉不會從基板上剝離。By heat treatment and annealing treatment, YAG in the filling layer 22 can be recrystallized, the material uniformity of the phosphor powder film can be improved, and the fluorescent powder film can be made to have a predetermined uniform refractive index. At the same time, since the filling layer 22 is formed on the phosphor powder film and the gap between the phosphors, it is possible to protect the phosphor powder from peeling off from the substrate.
本實施例之製作方法係如實施例1所述。其中，本實施例所使用之螢光粉，係採用粒徑為500nm且材料為SiO2 之奈米球做為球型載體，而螢光粉體則採用粒徑約50nm之Y2 O3 :Eu3+ 、Y2 O3 :Yb3+ 、Y2 O3 :Ce3+ 、YAG:Ce3+ 、以及CdSe:ZnS之混合物，且螢光粉體之混合物係包含於球型載體內部。此外，本實施例待塗佈之基板係使用藍寶石基板。再者，使用Al及Ti複合金屬醇鹽溶液做為溶膠凝膠前驅溶液，並使用添加有La3+ 之Y2 O3 硝酸溶液，進行溶膠凝膠反應以形成填充層。因此，本實施例之填充層係為含有Y2 O3 :La3+ 之Al2 O3 -TiO2 材料層。The manufacturing method of this embodiment is as described in Embodiment 1. The phosphor powder used in the present embodiment uses a nanosphere having a particle diameter of 500 nm and a material of SiO 2 as a spherical carrier, and the phosphor powder is a Y 2 O 3 having a particle diameter of about 50 nm: A mixture of Eu 3+ , Y 2 O 3 :Yb 3+ , Y 2 O 3 :Ce 3+ , YAG:Ce 3+ , and CdSe:ZnS, and a mixture of phosphor powders is contained inside the spherical carrier. Further, the substrate to be coated in this embodiment is a sapphire substrate. Further, an Al and Ti composite metal alkoxide solution was used as a sol-gel precursor solution, and a La 3+-doped Y 2 O 3 nitric acid solution was used to carry out a sol-gel reaction to form a packed layer. Therefore, the filling layer of this embodiment is a layer of Al 2 O 3 -TiO 2 material containing Y 2 O 3 :La 3+ .
本實施例之製作方法係如實施例1所述。其中，本實施例所使用之螢光粉，係採用粒徑為1000nm且材料為SiO2 之奈米球做為球型載體，且球型載體內部係包含CdSe:ZnS量子點；而螢光粉體則採用粒徑約50nm之Y2 O3 :La3+ 、以及YAG:La3+ 之混合物，且螢光粉體係透過矽烷分子鍵結在球型載體表面。The manufacturing method of this embodiment is as described in Embodiment 1. The phosphor powder used in the present embodiment uses a nanosphere having a particle diameter of 1000 nm and a material of SiO 2 as a spherical carrier, and the spherical carrier internally contains a CdSe:ZnS quantum dot; and the phosphor powder The mixture is a mixture of Y 2 O 3 :La 3+ and YAG:La 3+ having a particle size of about 50 nm, and the phosphor powder system is bonded to the surface of the spherical carrier via a decane molecule.
上述實施例僅係為了方便說明而舉例而已，本發明所主張之權利範圍自應以申請專利範圍所述為準，而非僅限於上述實施例。The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.
10．．．LED元件10. . . LED component
101．．．LED晶片101. . . LED chip
102．．．膠體102. . . colloid
20．．．基板20. . . Substrate
210．．．螢光粉210. . . Fluorescent powder
211．．．第一溶劑211. . . First solvent
21．．．螢光粉薄膜twenty one. . . Fluorescent powder film
22．．．填充層twenty two. . . Fill layer
23．．．第二溶劑twenty three. . . Second solvent
24．．．容器twenty four. . . container
圖1係習知發光二極體之示意圖。Figure 1 is a schematic diagram of a conventional light-emitting diode.
圖2A至圖2F係本發明實施例1之螢光材料塗佈於基板表面之步驟示意圖。2A to 2F are schematic views showing the steps of applying the phosphor material of the embodiment 1 of the present invention to the surface of the substrate.
20．．．基板20. . . Substrate
21．．．螢光粉薄膜twenty one. . . Fluorescent powder film
22．．．填充層twenty two. . . Fill layer
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| CN102109382B (en) * | 2009-12-28 | 2013-01-02 | 李威汉 | Method and system for detecting color temperature of mixed light of fluorescent powder |
| TW201403878A (en) * | 2012-07-06 | 2014-01-16 | Formosa Epitaxy Inc | Illuminating assembly |
| TWI484669B (en) * | 2012-09-11 | 2015-05-11 | Brightek Optoelectronic Co Ltd | Method of package illuminant elecment |
| TWI484664B (en) * | 2012-09-11 | 2015-05-11 | Brightek Optoelectronic Co Ltd | Method for spreading fluorescent particles |
| TWI613011B (en) * | 2016-09-30 | 2018-02-01 | 漢邦普淨節能科技有限公司 | Device for coating phosphors and coating method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002226846A (en) * | 2001-02-06 | 2002-08-14 | Matsushita Electric Ind Co Ltd | Illuminating fluorescent substance, light-emitting diode using the same illuminating fluorescent substance and method for coating fluorescent substance |
| JP2003298116A (en) * | 2002-03-29 | 2003-10-17 | Stanley Electric Co Ltd | White light emitting diode and method of manufacturing the same |
| TW200916557A (en) * | 2007-09-03 | 2009-04-16 | Showa Denko Kk | Phosphor, production method thereof, and light-emitting apparatus using phosphor |
| TW200943372A (en) * | 2008-04-11 | 2009-10-16 | Hectotek Corp | A method for applying fluorescent agent on LED chip |
-
2009
- 2009-12-24 TW TW98144694A patent/TWI398306B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002226846A (en) * | 2001-02-06 | 2002-08-14 | Matsushita Electric Ind Co Ltd | Illuminating fluorescent substance, light-emitting diode using the same illuminating fluorescent substance and method for coating fluorescent substance |
| JP2003298116A (en) * | 2002-03-29 | 2003-10-17 | Stanley Electric Co Ltd | White light emitting diode and method of manufacturing the same |
| TW200916557A (en) * | 2007-09-03 | 2009-04-16 | Showa Denko Kk | Phosphor, production method thereof, and light-emitting apparatus using phosphor |
| TW200943372A (en) * | 2008-04-11 | 2009-10-16 | Hectotek Corp | A method for applying fluorescent agent on LED chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI710129B (en) * | 2020-02-10 | 2020-11-11 | 台灣愛司帝科技股份有限公司 | Led chip package structure and method of manufacturing the same |
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