TWI389240B - The support of the workpiece - Google Patents
The support of the workpiece Download PDFInfo
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- TWI389240B TWI389240B TW097133366A TW97133366A TWI389240B TW I389240 B TWI389240 B TW I389240B TW 097133366 A TW097133366 A TW 097133366A TW 97133366 A TW97133366 A TW 97133366A TW I389240 B TWI389240 B TW I389240B
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- porous sheet
- permeable porous
- mounting member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
Description
本發明係關於半導體基板、液晶基板等的工件的支承裝置，更詳細而言，關於藉由以氣體來浮起，能夠不會產生破損、傷痕等地進行搬送之工件的支承裝置者。The present invention relates to a support device for a workpiece such as a semiconductor substrate or a liquid crystal substrate, and more specifically, a support device for a workpiece that can be transported without being damaged by scratches or the like by floating with a gas.
例如，在精密機器領域等的生產製程，由於即使為微小，只要在工件少產生傷痕、髒污就會成為不良原因，故不被允許，因此，一般採用使用氣體，在非接觸狀態支承工件加以搬送之方式。For example, in a production process such as a precision machine, even if it is small, it is not allowed to cause scratches and dirt in the workpiece, and it is not allowed. Therefore, it is generally used to support the workpiece in a non-contact state by using a gas. The way to move.
例如，在專利文獻1，揭示有氣體浮起搬送裝置，此氣體浮起搬送裝置，一邊藉由從配置於平面基板的下方之氣體浮起單元噴出氣體用以使平面基板浮起，一邊藉由輸送機構朝前方移送者，在位於平面基板的搬送方向的前端之氣體浮起單元的下游端附近，設有大幅增大平面基板的浮起量之機構，使得平面基板與氣體浮起單元不會相互干涉造成破損、產生傷痕者。For example, Patent Document 1 discloses a gas floating and conveying device that discharges a flat substrate by floating gas from a gas floating unit disposed below a planar substrate. The transport mechanism is forward-transferred, and a mechanism for greatly increasing the floating amount of the planar substrate is provided in the vicinity of the downstream end of the gas floating unit located at the tip end of the transport direction of the planar substrate, so that the planar substrate and the gas floating unit do not Interference with each other to cause damage or scars.
[專利文獻1]日本特開2006－222209號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-222209
另外，在專利文獻2，揭示有用於對大型基板附加具光阻劑薄膜的裝置之基板搬送系統，利用以基板浮起板對基板噴出來自於下面的氣體，使其浮起，藉由沿著基板的搬送路徑所設置之搬送用滾子挾持基板端部加以搬送。Further, Patent Document 2 discloses a substrate transfer system for attaching a device having a photoresist film to a large substrate, and the substrate from which the gas from the lower surface is ejected by the substrate floating plate is floated by the substrate. The transfer roller provided on the substrate transport path holds the end portion of the substrate and transports it.
[專利文獻2]特開2002－151571號公報[Patent Document 2] JP-A-2002-151571
又，如圖4所示的工件支承裝置1所示，從加壓氣體的供給源2，將加壓氣體經由暫時充滿用之頭空間3，由在一面具有多數個小孔h之支承板4送入，用以支承工件W者。Further, as shown in the workpiece supporting device 1 shown in Fig. 4, the pressurized gas is supplied from the supply source 2 of the pressurized gas to the support plate 4 having a plurality of small holes h on one side via the head space 3 for temporary filling. Feeding to support the workpiece W.
在此方式，藉由調整工件W的質量與氣體的流量的平衡，獲得穩定性。In this manner, stability is obtained by adjusting the balance between the mass of the workpiece W and the flow rate of the gas.
如此，因前述工件支承裝置1為藉由氣體的壓力來支承工件W者，故，可稱為特別適合於需要非接觸方式之精密工件的支承用者。As described above, since the workpiece supporting device 1 supports the workpiece W by the pressure of the gas, it can be referred to as a supporter particularly suitable for a precision workpiece requiring a non-contact method.
由於精密工件為晶圓、基板、玻璃板等薄且輕之板形狀，故，需要微小地控制氣體的流量，支承板4主要使用衝孔金屬Pm、燒結板Ps等的多孔質材(參照圖6、圖7)。衝孔金屬Pm係在一面，具有以10mm間隔所形成之孔徑5mm左右的小孔h。又，在燒結板Ps，以玻璃材G被覆多孔質材S表面，在一面以50mm間隔形成有徑30mm之小孔h。Since the precision workpiece is a thin and light plate shape such as a wafer, a substrate, or a glass plate, it is necessary to minutely control the flow rate of the gas, and the support plate 4 mainly uses a porous material such as a punched metal Pm or a sintered plate Ps (see the figure). 6, Figure 7). The punched metal Pm is provided on one surface, and has a small hole h having a hole diameter of about 5 mm formed at intervals of 10 mm. Further, in the sintered plate Ps, the surface of the porous material S was covered with the glass material G, and a small hole h having a diameter of 30 mm was formed at intervals of 50 mm on one surface.
但，近年，精密製品的高密度化行進，所處理之工件W更薄化，成為薄膜狀工件W。為了穩定地支承這樣之工件W，對被要求更微妙之氣體流量的調整，衝孔金屬Pm、燒結板Sp等，在構造上、流量的控制上存有界限，不易對應。However, in recent years, the density of the precision product has progressed, and the workpiece W to be processed has become thinner and becomes a film-like workpiece W. In order to stably support such a workpiece W, there is a limit in the control of the structure and the flow rate for the adjustment of the gas flow rate, which is required to be more delicate, and it is difficult to cope with the control of the flow rate of the metal Pm, the sintered plate Sp, and the like.
例如，在現狀，當施加0.1MPa之原壓時，從衝孔金屬Pm、燒結板Sp這樣的支承板4，將所噴出之氣體的流量作成為0.5NL/min/cm2 一事極為困難，在此流量，在近年之厚度10μm級之薄膜狀工件W，工件W的質量與氣體流量之平衡崩潰，引起所謂之波紋、膨脹鼓起，造成支承姿勢不穩定(參照圖5)。For example, in the present state, when a raw pressure of 0.1 MPa is applied, it is extremely difficult to reduce the flow rate of the gas to be ejected to 0.5 NL/min/cm 2 from the support plate 4 such as the punched metal Pm or the sintered plate Sp. At this flow rate, in the film-like workpiece W having a thickness of 10 μm in recent years, the balance between the mass of the workpiece W and the gas flow rate collapses, causing so-called corrugation and expansion, and the support posture is unstable (refer to FIG. 5).
又，在支承面為衝孔金屬Pm、燒結板Sp之情況，當姿勢變成為不穩定之工件W接觸時，會有在工件W表面產生傷痕之虞。Further, when the support surface is the punched metal Pm or the sintered plate Sp, when the workpiece W whose posture is unstable is in contact, there is a flaw in the surface of the workpiece W.
因此，被要求即使更輕量、薄型化之薄膜狀工件W也能以穩定的姿勢支承，且，即使在工件W接觸之情況，也不會產生傷痕之支承裝置。Therefore, it is required that the film-like workpiece W which is lighter and thinner can be supported in a stable posture, and the support device which does not cause scratches even when the workpiece W is in contact with each other.
本發明是有鑑於以上這樣之背景所開發完成的發明，其目的在於提供，藉由使用作為支承面之通氣阻抗更大的通氣性多孔薄片，從支承面全體，釋出所控制之微小流量的氣體，能夠進行輕量薄化之工件的穩定支承之工件的支承裝置。The present invention has been made in view of the above circumstances, and an object of the invention is to provide a gas having a small flow rate controlled from the entire support surface by using a permeable porous sheet having a larger venting resistance as a support surface. A support device for a workpiece capable of stably supporting a lightweight and thinned workpiece.
為了解決前述課題，在第1發明之工件的支承裝置，其特徵為：具備有：基體(11)；配設於基體(11)上之框構件(12)；配設於框構件(12)內側的基體(11)上之至少一個安裝構件(13)；藉由框構件(12)與安裝構件(13)所支承的通氣性多孔薄片(14)；及對通氣性多 孔薄片(14)與框構件(12)、和基體(11)所區劃之密閉空間(15)供給加壓氣體之加壓氣體供給源(16)，當藉由加壓氣體供給源(16)供給加壓氣體時，藉由從通氣性多孔薄片(14)所噴出之氣體來支承工件(W)，並且使由通氣性多孔薄片(14)所噴出之氣體滯留於形成在安裝構件(13)上之空間(17)。In order to solve the above problems, the support device for a workpiece according to the first aspect of the invention includes: a base body (11); a frame member (12) disposed on the base body (11); and a frame member (12) At least one mounting member (13) on the inner base body (11); a permeable porous sheet (14) supported by the frame member (12) and the mounting member (13); The hole sheet (14) and the frame member (12) and the sealed space (15) partitioned by the base body (11) supply a pressurized gas supply source (16) of the pressurized gas by the pressurized gas supply source (16) When the pressurized gas is supplied, the workpiece (W) is supported by the gas ejected from the permeable porous sheet (14), and the gas ejected from the permeable porous sheet (14) is retained in the mounting member (13). Space above (17).
藉此，當藉由加壓氣體供給源(16)供給加壓氣體時，從通氣性多孔薄片(14)，以通氣性多孔薄片(14)之高的通氣阻抗，噴出已被控制之微小流量的氣體，在與已被載置於通氣性多孔薄片(14)上面之工件(W)之間，形成氣體層。Thereby, when the pressurized gas is supplied by the pressurized gas supply source (16), the controlled small flow rate is ejected from the permeable porous sheet (14) by the high ventilating resistance of the permeable porous sheet (14). The gas is formed between the workpiece (W) which has been placed on the permeable porous sheet (14) to form a gas layer.
此時，由於所噴出之氣體滯留於形成在通氣性多孔薄片(14)的安裝構件(13)上的空間(17)，故，即使工件(W)為薄型之薄膜狀薄片，也能以預定的氣體壓支承其全體，能夠穩定地支承工件(W)。At this time, since the ejected gas stays in the space (17) formed on the mounting member (13) of the permeable porous sheet (14), even if the workpiece (W) is a thin film-like sheet, it can be predetermined The gas pressure is supported by the entire body, and the workpiece (W) can be stably supported.
在第2發明，其特徵為，安裝構件(13)係作為稜部構成於基體(11)上。According to a second aspect of the invention, the attachment member (13) is formed as a ridge portion on the base (11).
藉此，在支承通氣性多孔薄片(14)之稜部狀的安裝構件(13)上，形成使所噴出的氣體滯留之空間。Thereby, a space in which the gas to be ejected is retained is formed in the rib-shaped mounting member (13) that supports the permeable porous sheet (14).
在第3發明，其特徵為，安裝構件(13)係作為柱狀部形成於基體(11)上。According to a third aspect of the invention, the attachment member (13) is formed as a columnar portion on the base (11).
藉此，在支承通氣性多孔薄片(14)之柱狀的安裝構件(13)上，形成使所噴出的氣體滯留之空間。Thereby, a space for trapping the discharged gas is formed in the columnar mounting member (13) supporting the permeable porous sheet (14).
在第4發明，其特徵為，密閉空間(15)係相互地連 通。According to a fourth aspect of the invention, the sealed space (15) is connected to each other through.
藉此，可使氣體遍及於所有的密閉空間(15)。Thereby, the gas can be spread over all the sealed spaces (15).
在第5發明，其特徵為，通氣性多孔薄片(14)係以氟系樹脂所構成。According to a fifth aspect of the invention, the air permeable porous sheet (14) is made of a fluorine resin.
藉此，即使工件(W)與通氣性多孔薄片(14)接觸，由於氟樹脂為具有低摩擦性特性的樹脂，不會有表面產生損傷之虞。Thereby, even if the workpiece (W) is in contact with the permeable porous sheet (14), since the fluororesin is a resin having low friction properties, there is no possibility of damage to the surface.
在第6發明，其特徵為，設有接近於通氣性多孔薄片(14)上的工件(W)支承面，與工件(W)接觸來將工件(W)朝搬送方向導引之工件搬送手段(21)。According to a sixth aspect of the invention, there is provided a workpiece transporting means for guiding a workpiece (W) in contact with a workpiece (W) in proximity to a workpiece (W) supporting surface on the permeable porous sheet (14) (twenty one).
藉此，因工件(W)在藉由氣體壓由通氣性多孔薄片(14)上面浮起之狀態下被支承，所以，藉由工件搬送手段(21)來搬送工件(W)之力為微小之力即可達到。Thereby, since the workpiece (W) is supported by the gas pressure on the upper surface of the permeable porous sheet (14), the force of transporting the workpiece (W) by the workpiece transfer means (21) is minute. The power can be achieved.
再者，前述各手段的括弧內之符號為顯示後述的實施形態所記載的具體手段之對應關係的一例。In addition, the symbol in the parentheses of each of the above means is an example of the correspondence relationship of the specific means described in the embodiment described later.
以下，針對本發明之工件的支承裝置，顯示一實施形態，根據圖面進行詳細說明。Hereinafter, an embodiment of the support device for a workpiece according to the present invention will be described, and will be described in detail based on the drawings.
圖1、圖2係示意地顯示作為工件之薄化薄膜狀工件W的支承裝置10的局部。1 and 2 schematically show a part of the support device 10 as a thinned film-like workpiece W of a workpiece.
此支承裝置10具備有：配設於基體11上之氣密狀的框構件12；配設於此框構件12內側的基體11上之至少一個安裝構件13；藉由這些框構件12與安裝構件13所支承的通氣 性多孔薄片14；及對通氣性多孔薄片14、框構件12、與基體11所區劃之密閉空間15，供給加壓氣體之加壓氣體供給源16。The support device 10 includes: an airtight frame member 12 disposed on the base 11; at least one mounting member 13 disposed on the base 11 inside the frame member 12; and the frame member 12 and the mounting member 13 supported ventilation The porous sheet 14 and the pressurized gas supply source 16 for supplying pressurized gas to the air permeable porous sheet 14, the frame member 12, and the sealed space 15 partitioned by the base 11.
基體11為平坦狀的構件，以底部面積為具有至少可載置後述的欲進行支承搬送之工件W全體的面積之方形的構件所構成，在基體11上的最外周，呈氣密狀地突設有框構件12。The base 11 is a flat member, and has a bottom portion having a square shape having at least an area of a workpiece W to be supported and transported as described later, and is airtightly formed on the outermost periphery of the base 11. A frame member 12 is provided.
安裝構件13係在框構件12的內側，於與框構件12相同的高度，以每預定間隔呈稜狀地突設著。其排列的方式為適宜，亦可為相互平行或格子狀地排列的結構(參照圖4)。且，安裝構件13亦可購成為柱狀物(參照圖5)。The mounting member 13 is formed on the inner side of the frame member 12 at a same height as the frame member 12, and is protruded at a predetermined interval. The arrangement may be appropriate, or may be a structure in which they are arranged in parallel or in a lattice pattern (see FIG. 4). Further, the mounting member 13 can also be purchased as a column (refer to FIG. 5).
通氣性多孔薄片14，可使用具有例如低摩擦性、非黏著性的特性之氟系樹脂。在此情況，通氣性多孔薄片14之厚度為例如0.5mm。As the permeable porous sheet 14, a fluorine-based resin having characteristics such as low friction and non-adhesive properties can be used. In this case, the thickness of the air permeable porous sheet 14 is, for example, 0.5 mm.
在通氣性多孔薄片14下面側，形成有藉由基體11、框構件12與各安裝構件13所區劃之密閉空間15。在此密閉空間15，連接有可從加壓氣體供給源16供給加壓氣體之配管L。再者，各自的密閉空間15係藉由設置於各安裝構件13的連通口H連通著。On the lower surface side of the permeable porous sheet 14, a sealed space 15 partitioned by the base member 11, the frame member 12, and the respective mounting members 13 is formed. In the sealed space 15, a pipe L through which the pressurized gas can be supplied from the pressurized gas supply source 16 is connected. Further, the respective sealed spaces 15 are connected by the communication port H provided in each of the mounting members 13.
又，通氣性多孔薄片14，當藉由框構件12、與稜狀的安裝構件13支承時，利用安裝構件13之支承部位間的部位呈凸狀突出，在利用安裝構件13之支承部位上的空間17，使由通氣性多孔薄片14所噴出的氣體滯留(參照圖3)。Further, when the frame member 12 and the prismatic mounting member 13 are supported by the frame member 12 and the prismatic mounting member 13, the portion between the support portions of the mounting member 13 protrudes convexly, and the support portion of the mounting member 13 is used. In the space 17, the gas ejected from the permeable porous sheet 14 is retained (see Fig. 3).
在此情況，通氣性多孔薄片14與安裝構件13係能藉由適宜的固定手段加以固定。即，通氣性多孔薄片14與安裝構件13，亦可經由適宜的抵接構件18，以螺栓等進行機械式固定，亦可藉由接著、熔接來進行固定。In this case, the permeable porous sheet 14 and the mounting member 13 can be fixed by a suitable fixing means. In other words, the permeable porous sheet 14 and the attachment member 13 may be mechanically fixed by bolts or the like via a suitable abutting member 18, or may be fixed by welding or welding.
這些的固定部位係依據安裝構件13的高度尺寸來規定高度，這些固定部位以外的通氣性多孔薄片14，由於呈凸狀突出，故，在以固定部位作為底部之呈凸狀突出的部位，以較該部位凹陷的狀態形成使氣體滯留之空間17。These fixed portions are fixed in height according to the height dimension of the attachment member 13, and the permeable porous sheet 14 other than the fixed portions protrudes in a convex shape, so that the portion having the convex portion protruding as a bottom portion at the fixed portion is A state in which the gas is trapped is formed in a state in which the portion is recessed.
再者，在此支承裝置10，將厚度例如0.5mm之通氣性多孔薄片14裝設於基體11上的安裝構件13時，將隣接之凸狀突出的通氣性多孔薄片14之頂部間的間隔作為支承間距P，設為30mm。Further, in the support device 10, when the permeable porous sheet 14 having a thickness of, for example, 0.5 mm is attached to the mounting member 13 on the base 11, the interval between the tops of the permeable porous sheets 14 projecting in a convex shape is defined as The support pitch P was set to 30 mm.
對密閉空間15供給加壓氣體之加壓氣體供給源16係經由連接構件20，以配管L連接於開口在基體11底部中央之供給孔19，來供給加壓氣體。The pressurized gas supply source 16 that supplies the pressurized gas to the sealed space 15 is connected to the supply hole 19 opened at the center of the bottom of the base 11 via the connecting member 20 via the connecting member 20 to supply the pressurized gas.
再者，加壓氣體供給源16能夠使用習知結構者。Further, the pressurized gas supply source 16 can use a conventional structure.
且在以上這樣的支承裝置10，如圖1、圖2所示，在兩側部設有適宜的工件搬送手段21。即，工件搬送手段21例如具備有：配置於基體11兩側兩端部之轉動滑輪21a；及分別掛設於兩側部兩端部之轉動滑輪21a、21a間的驅動帶21b。Further, in the above-described support device 10, as shown in Figs. 1 and 2, suitable workpiece transporting means 21 are provided on both side portions. In other words, the workpiece transporting means 21 includes, for example, a rotating pulley 21a disposed at both end portions of the base member 11 and a driving belt 21b that is hung between the rotating pulleys 21a and 21a at both end portions of the both side portions.
本發明之工件的支承裝置10，為以上這種結構所構成者。其次，說明其作用。The support device 10 of the workpiece of the present invention is constructed by the above structure. Second, explain its role.
針對藉由此支承裝置10進行支承搬送之對象物的工件 W進行說明。此工件W為例如，在厚度50μm之樹脂上，形成厚度30μm之銅的電路圖案，每單位面積的質量設為0.02g/cm2 。The workpiece W that is supported and transported by the support device 10 will be described. This workpiece W is, for example, a circuit pattern of copper having a thickness of 30 μm on a resin having a thickness of 50 μm, and the mass per unit area is 0.02 g/cm 2 .
當將該工件W載置於裝設在支承裝置10之基體11上的安裝構件13之通氣性多孔薄片14上，驅動加壓氣體供給源16時，加壓氣體透過基體11底部中央的供給孔19，被供給至受到通氣性多孔薄片14下面側之基體11與安裝構件13所區劃的密閉空間15內。加壓氣體可透過形成於安裝構件13之連通口H，無遺漏地遍及所有的密閉空間15，由通氣性多孔薄片14上面，將氣體噴出於通氣性多孔薄片14全體範圍。When the workpiece W is placed on the permeable porous sheet 14 of the mounting member 13 mounted on the base 11 of the support device 10, and the pressurized gas supply source 16 is driven, the pressurized gas is transmitted through the supply hole at the center of the bottom of the base 11. 19 is supplied into the sealed space 15 partitioned by the base 11 and the mounting member 13 on the lower side of the permeable porous sheet 14. The pressurized gas is transmitted through the communication port H formed in the mounting member 13, and passes through all the sealed spaces 15 without fail, and the gas is sprayed from the upper surface of the permeable porous sheet 14 to the entire range of the permeable porous sheet 14.
通氣性多孔薄片14，由於在全面上存在有微細孔，故當氣體通過之際，會有大的通氣阻抗。因此，從密閉空間15內，流量被抑制成為微少量之氣體從通氣性多孔薄片14上面噴出。Since the permeable porous sheet 14 has fine pores in its entirety, it has a large ventilating resistance when the gas passes. Therefore, from the inside of the sealed space 15, the flow rate is suppressed so that a small amount of gas is ejected from the upper surface of the permeable porous sheet 14.
藉由氣體的噴出，使得在通氣性多孔薄片14上面與工件W之間充滿氣體，氣體聚集於通氣性多孔薄片14之凹陷部位的空間17，形成氣體層。By the ejection of the gas, a gas is filled between the upper surface of the permeable porous sheet 14 and the workpiece W, and the gas is collected in the space 17 of the recessed portion of the permeable porous sheet 14 to form a gas layer.
工件W係能夠藉由這些氣體壓加以支承。在此情況，由於通氣性多孔薄片14之全面存在有微細孔，另外，空間17雖氣體不會噴出，但從支承部位周圍所突出之部位噴出的氣體會滯留，故，全體形成為大致一定氣壓之氣體層，工件W在穩定的狀態下被支承。The workpiece W can be supported by these gas pressures. In this case, since the gas permeable porous sheet 14 has fine pores in its entirety, the gas in the space 17 is not ejected, but the gas ejected from the portion protruding around the support portion is retained, so that the entire gas is formed at a substantially constant pressure. The gas layer, the workpiece W is supported in a stable state.
再者，在實施形態，工件W係為在厚度50μm之樹脂 上形成有厚度30μm之銅的電路圖案，每單位面積的質量為0.02g/cm2 之薄膜材，藉由加壓氣體供給源16所供給的加壓氣體係以壓力0.1Mp被輸送，從通氣性多孔薄片14上面所噴出的氣體的流量，比起在以往的裝置所使用的衝孔金屬Pm、燒結板Ps等的多孔質材，成為大致1/10以下之0.05NL/min/cm2 ，能成為以1.5mm之支承高度T所進行之穩定的支承。Further, in the embodiment, the workpiece W is a circuit pattern in which copper having a thickness of 30 μm is formed on a resin having a thickness of 50 μm, and a film material having a mass per unit area of 0.02 g/cm 2 is supplied from the pressurized gas supply source 16 . The supplied pressurized gas system is transported at a pressure of 0.1 Mp, and the flow rate of the gas ejected from the upper surface of the permeable porous sheet 14 is larger than that of the punched metal Pm and the sintered plate Ps used in the conventional apparatus. It is 0.05 NL/min/cm 2 which is approximately 1/10 or less, and can be stably supported by the support height T of 1.5 mm.
又，為了在此狀態搬送工件W，能夠使分別掛設於配置在基體11兩側兩端部的件搬送手段21之轉動滑輪21a、21a間之驅動帶21b朝搬送方向作動，藉由微小的力，即可送出工件W。Moreover, in order to convey the workpiece W in this state, the driving belt 21b which is hung between the rotating pulleys 21a and 21a of the member conveying means 21 which are disposed at both end portions of the base 11 can be moved in the conveying direction by the minute Force, you can send the workpiece W.
再者，即使有因某種原因造成工件W與通氣性多孔薄片14上面接觸，也因通氣性多孔薄片14為軟質、低摩擦性的氟系樹脂所構成，故不會造成在工件W上產生傷痕。Further, even if the workpiece W comes into contact with the upper surface of the permeable porous sheet 14 for some reason, the permeable porous sheet 14 is made of a soft, low-friction fluororesin, so that it does not occur on the workpiece W. Scars.
10‧‧‧支承裝置10‧‧‧Support device
11‧‧‧基體11‧‧‧ base
12‧‧‧框構件12‧‧‧Box components
13‧‧‧安裝構件13‧‧‧Installation components
14‧‧‧通氣性多孔薄片14‧‧‧Aerable porous sheets
15‧‧‧密閉空間15‧‧‧Confined space
16‧‧‧加壓氣體供給源16‧‧‧Compressed gas supply
17‧‧‧凹部17‧‧‧ recess
18‧‧‧抵接構件18‧‧‧Abutment components
19‧‧‧供給孔19‧‧‧Supply hole
20‧‧‧連接構件20‧‧‧Connecting members
21‧‧‧工件搬送手段21‧‧‧Working methods
21a‧‧‧轉動滑輪21a‧‧‧Rotating pulley
21b‧‧‧驅動帶21b‧‧‧ drive belt
W‧‧‧工件W‧‧‧Workpiece
H‧‧‧連通口H‧‧‧Connecting port
圖1是顯示本發明之工件的支承裝置的局部之模式平面圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic plan view showing a part of a supporting device of a workpiece of the present invention.
圖2是圖1所示的工件的支承裝置之斷面説明圖。Fig. 2 is a cross-sectional explanatory view of the supporting device of the workpiece shown in Fig. 1;
圖3是圖2所示的工件的支承裝置的局部放大斷面説明圖。Fig. 3 is a partially enlarged cross-sectional explanatory view showing the supporting device of the workpiece shown in Fig. 2;
圖4是顯示本發明之工件的支承裝置之基體上的安裝構件之其他排列結構的模式平面圖。Fig. 4 is a schematic plan view showing another arrangement of the mounting members on the base of the supporting device of the workpiece of the present invention.
圖5是顯示本發明之工件的支承裝置之基體上的安裝構件之其他排列結構的模式平面圖。Figure 5 is a schematic plan view showing another arrangement of mounting members on the base of the supporting device of the workpiece of the present invention.
圖6是顯示以往的工件支承裝置的一例之模式局部斷面説明圖。Fig. 6 is a schematic partial cross-sectional explanatory view showing an example of a conventional workpiece supporting device.
圖7是使用圖6所示的工件支承裝置，在支承薄化薄膜狀工件時的缺失之模式局部斷面説明圖。Fig. 7 is a partial cross-sectional explanatory view showing a state in which a thin film-like workpiece is supported by the workpiece supporting device shown in Fig. 6;
圖8是顯示在以往的工件支承裝置中，用於作為支承板之衝孔金屬的模式説明圖。Fig. 8 is a schematic explanatory view showing a punching metal used as a support plate in a conventional workpiece supporting device.
圖9是顯示在以往的工件支承裝置中，用於作為支承板之燒結板的模式説明圖。Fig. 9 is a schematic explanatory view showing a sintered plate used as a support plate in a conventional workpiece supporting device.
10‧‧‧支承裝置10‧‧‧Support device
11‧‧‧基體11‧‧‧ base
13‧‧‧安裝構件13‧‧‧Installation components
14‧‧‧通氣性多孔薄片14‧‧‧Aerable porous sheets
15‧‧‧密閉空間15‧‧‧Confined space
16‧‧‧加壓氣體供給源16‧‧‧Compressed gas supply
17‧‧‧凹部17‧‧‧ recess
18‧‧‧抵接構件18‧‧‧Abutment components
19‧‧‧供給孔19‧‧‧Supply hole
20‧‧‧連接構件20‧‧‧Connecting members
W‧‧‧工件W‧‧‧Workpiece
H‧‧‧連通口H‧‧‧Connecting port
P‧‧‧支承間距P‧‧‧Support spacing
L‧‧‧配管L‧‧‧ piping
Claims (6)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007310915A JP4442685B2 (en) | 2007-11-30 | 2007-11-30 | Work support device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200929424A TW200929424A (en) | 2009-07-01 |
| TWI389240B true TWI389240B (en) | 2013-03-11 |
Family
ID=40743012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097133366A TWI389240B (en) | 2007-11-30 | 2008-08-29 | The support of the workpiece |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4442685B2 (en) |
| KR (1) | KR101059617B1 (en) |
| CN (1) | CN101447445B (en) |
| TW (1) | TWI389240B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102923480A (en) * | 2011-08-12 | 2013-02-13 | 大银微***股份有限公司 | Pipeline integration structure of air-floating platform |
| JP6368508B2 (en) * | 2014-03-17 | 2018-08-01 | 東レエンジニアリング株式会社 | Substrate floating device |
| CN104150181B (en) * | 2014-07-24 | 2017-02-15 | 昆山龙腾光电有限公司 | Supporting seat and supporting device |
| CN110255189A (en) * | 2019-06-10 | 2019-09-20 | 安徽鸿玻玻璃科技有限公司 | A kind of loading attachment of special-shaped glass |
| CN111924541B (en) * | 2020-07-01 | 2021-12-07 | 山东聊城华阳医药辅料有限公司 | Pneumatic pipeline conveying device based on photosensitive resistance value characteristics |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000007151A (en) | 1998-06-17 | 2000-01-11 | Tabai Espec Corp | Work levitating structure |
| JP4543794B2 (en) | 2004-07-09 | 2010-09-15 | 国立大学法人東北大学 | Flat member conveying device |
| JP4414856B2 (en) | 2004-09-30 | 2010-02-10 | 大日本スクリーン製造株式会社 | Substrate storage device |
| JP2006264891A (en) | 2005-03-24 | 2006-10-05 | Shinko Electric Co Ltd | Noncontact substrate conveying device |
-
2007
- 2007-11-30 JP JP2007310915A patent/JP4442685B2/en not_active Expired - Fee Related
-
2008
- 2008-08-26 KR KR1020080083340A patent/KR101059617B1/en not_active IP Right Cessation
- 2008-08-29 TW TW097133366A patent/TWI389240B/en not_active IP Right Cessation
- 2008-09-22 CN CN2008101617060A patent/CN101447445B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090056797A (en) | 2009-06-03 |
| CN101447445A (en) | 2009-06-03 |
| CN101447445B (en) | 2010-09-29 |
| KR101059617B1 (en) | 2011-08-25 |
| TW200929424A (en) | 2009-07-01 |
| JP4442685B2 (en) | 2010-03-31 |
| JP2009135307A (en) | 2009-06-18 |
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