CN101447445B - Workpiece supporting device - Google Patents
Workpiece supporting device Download PDFInfo
- Publication number
- CN101447445B CN101447445B CN2008101617060A CN200810161706A CN101447445B CN 101447445 B CN101447445 B CN 101447445B CN 2008101617060 A CN2008101617060 A CN 2008101617060A CN 200810161706 A CN200810161706 A CN 200810161706A CN 101447445 B CN101447445 B CN 101447445B
- Authority
- CN
- China
- Prior art keywords
- gas
- work
- workpiece
- porous chips
- installation component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
Abstract
A workpiece supporting device is capable of transferring without damage and blemish through floating the workpiece using gas. An air permeability multihole sheet (14) is supported by mounting components (13) arranged at intervals of a prescribed distance, the bottom side of the air permeability multihole sheet (14) is divided to a close space (15) which is connected with a source (16) for supplying the pressure gas. The air permeability multihole sheet (14) is projected at each position mounting the mounting components (13) in convexity, and ensures gas holdup in a space (17) formed on the mounting components (13).
Description
Technical field
The present invention relates to the supporting arrangement of workpiece such as a kind of semiconductor substrate, crystal liquid substrate, thereby relate to a kind of work-supporting means that utilizes gas to make workpiece suspend and not carry with damaged and flaw ground.
Background technology
In production processes such as for example precision equipment field, also can become underproof essential factor even draw flaw or make dirty to workpiece minutely, therefore do not allow, thereby the general mode of utilizing gas to carry with the contactless state holding workpieces that adopts.
For example disclosed a kind of air floating carrier in the patent documentation 1, but, this air floating carrier is from being configured in the air floating unit injection air of planar substrates below, make the planar substrates suspension and utilize feed mechanism forwards to transfer, near the downstream of the air floating unit of the throughput direction front end that is positioned at planar substrates, the mechanism that increases planar substrates suspension amount is set, breakage takes place so that planar substrates and air floating unit can not be interfered, draw and go up flaw.
Patent documentation 1: the spy opens communique 2006-No. 222209
In addition; disclosed a kind of substrate conveyance system that is adopted in the device of the film of being with diaphragm that on large substrate, added in the patent documentation 2; from following air substrate is suspended thereby utilize the substrate suspension board to produce by boasting, use to sandwich the substrate end along the conveying of substrate transport path setting with roller and carry to substrate.
Patent documentation 2: the spy opens communique 2002-No. 151571
In addition, also have a kind of formation work-supporting means 1 as shown in Figure 4, by means of the head space 3 that is full of temporarily, utilizing on the one side has the support plate 4 of a plurality of aperture h to send into gas-pressurized, holding workpieces W from the supply source 2 of gas-pressurized.
This mode is to obtain stability by the balance of regulating workpiece W quality and gas flow.
Like this, because above-mentioned work-supporting means 1 utilizes the pressure of gas to come holding workpieces W, therefore be considered to be suitable for use as the supporting of the precision workpiece that needs the noncontact mode especially.
Because the precision workpiece thin and light plate shape that is wafer, substrate, glass plate etc., thus control gaseous flow subtly, the support plate 4 main porous materials (with reference to Fig. 6, Fig. 7) such as antivibration metal Pm and sintered plate Ps that adopt.Has the aperture h about the diameter 5mm that forms at interval with 10mm on the antivibration metal Pm one side.In addition, sintered plate Ps utilizes the coated porous material S of glass material G surface, forms the aperture h of diameter 30mm on one side at interval with 50mm.
But, in recent years, along with the development of the densification of accurate goods, the workpiece W of processing thinning even become film like workpiece W more.In order stably to support such workpiece W, require the adjusting of more exquisite gas flow, and relative with it, antivibration metal Pm and sintered plate Sp structurally, be limited in the control of flow, be difficult to corresponding with it.
Present situation is for example when applying the pressure of foundation of 0.1MPa, the gas flow from such support plate 4 ejections of antivibration metal Pm and sintered plate Sp is set at 0.5NL/min/cm
2Below, this is very difficult, under this flow, among thickness 10 other film like workpiece of μ m level W in recent years, the quality of workpiece W and the balance of gas flow are destroyed, and produce so-called wrinkling and bulge etc., supporting posture become unstable (with reference to Fig. 5).
In addition, bearing-surface is antivibration metal Pm and sintered plate Sp, when touching posture and become unsettled workpiece W, might make workpiece W surface have flaw.
For this reason, seek a kind of can support light weight more and thinning with stable posture film like workpiece W and also can not have the supporting arrangement of flaw when having contacted workpiece W.
Summary of the invention
The present invention is based on above background and proposes, its purpose is to provide a kind of work-supporting means, it is to adopt the bigger aeration porous chips of aeration resistance to use as bearing-surface, thereby the gas of the tiny flow quantity that is controlled from the discharging of whole bearing-surface can carry out the stable support of light weight thinning workpiece.
In order to solve above-mentioned problem, the work-supporting means of technical scheme 1 described invention is characterized in that, comprising: matrix (11); Be configured in the frame member (12) on the matrix (11); Be configured at least one installation component (13) on the inboard matrix (11) of frame member (12); By frame member (12) and installation component (13) support ventilation porous chips (14); To by aeration porous chips (14), the confined space (15) that frame member (12) and matrix (11) mark off is supplied with the pressurized gas supply source (16) of gas-pressurized, when utilizing pressurized gas supply source (16) to supply with gas-pressurized, dependence is from the gas holding workpieces (W) of aeration porous chips (14) ejection, and, described aeration porous chips (14) bloats in the support interdigit convex by described installation component (13) supporting, so that from the space (17) of gas hold-up on the position of being supported by described installation component (13) of described aeration porous chips (14) ejection.
Thereby, supply with gas-pressurized if utilize pressurized gas supply source (16), then rely on the high aeration resistance in the aeration porous chips (14), the gas of the tiny flow quantity that is controlled from aeration porous chips (14) ejection, and be positioned between the workpiece (W) above the aeration porous chips (14) and form gas blanket.
When this, the gas hold-up that is sprayed is gone up in the space (17) that forms at the installation component (13) of aeration porous chips (14), even thereby workpiece (W) is thin film like sheet, integral body also is supported under the gas pressure of regulation, stably holding workpieces (W).
Thereby, go up the space that forms gas that delay sprays at the installation component (13) of the rib portion shape that supports aeration porous chips (14).
Thereby, go up the space that forms gas that delay sprays at the installation component (13) of the column that supports aeration porous chips (14).
Thereby, can make gas spread all over whole confined spaces (15) ubiquitously.
Technical scheme 5 described inventions is characterized in that aeration porous chips (14) is made of fluorine-type resin.
Thereby,,, do not worry that therefore the surface can damage because fluorine-type resin is the resin with characteristic of low frictional properties even workpiece (W) touches aeration porous chips (14) yet.
Technical scheme 6 described inventions is characterized in that, are provided with Work transfer device (21), and this Work transfer device (21) contacts near workpiece (W) bearing-surface on the aeration porous chips (14) and with workpiece (W), along throughput direction guiding workpiece (W).
Thereby, can therefore utilize the power of Work transfer device (21) conveying workpieces (W) only to need small power to get final product at the state lower support workpiece (W) that makes workpiece (W) rely on gas pressure above aeration porous chips (14), to suspend.
In addition, the symbol in parantheses of above-mentioned each device is an example of the corresponding relation of expression and the described concrete device of aftermentioned execution mode.
Description of drawings
Fig. 1 is the model utility vertical view of the major part of expression work-supporting means of the present invention.
Fig. 2 is the cross-sectional illustration figure of work-supporting means shown in Figure 1.
Fig. 3 is that the major part of work-supporting means shown in Figure 2 is amplified cross-sectional illustration figure.
Fig. 4 is that on the installation component that is illustrated on the matrix of work-supporting means of the present invention other are arranged the model utility vertical view that constitutes.
Fig. 5 is that on the installation component that is illustrated on the matrix of work-supporting means of the present invention other are arranged the model utility vertical view that constitutes.
Fig. 6 is the model utility major part cross-sectional illustration figure of existing work-supporting means one example of expression.
Fig. 7 is the model utility major part cross-sectional illustration figure that expression utilizes the un-reasonable phenomenon when the work-supporting means shown in Figure 6 supporting thinning film like workpiece.
Fig. 8 is illustrated in the model utility key diagram as the antivibration metal of support plate that uses in the existing work-supporting means.
Fig. 9 is illustrated in the model utility key diagram as the sintered plate of support plate that uses in the existing work-supporting means.
Among the figure, 10-supporting arrangement, 11-matrix, 12-frame member, 13-installation component, 14-aeration porous chips, 15-confined space, 16-pressurized gas supply source, 17-recess, 18-compressed component, 19-supply hole, 20-connecting elements, 21-Work transfer device, 21a-rotary pulley, 21b-rotating band, W-workpiece, H-connected entrance.
Embodiment
Below, about work-supporting means example of the present invention an execution mode, describe in detail with reference to the accompanying drawings.
Model utility is represented the major part as the supporting arrangement 10 of the thinning film like workpiece W of workpiece among Fig. 1, Fig. 2.
At least one installation component 13 on the matrix 11 that this supporting arrangement 10 comprises the airtight shape frame member 12 that is configured on the matrix 11, be configured in these frame member 12 inboards, supply with the pressurized gas supply source 16 of gas-pressurizeds by these frame members 12 and installation component 13 support ventilation porous chipses 14, to the confined space 15 that is divided into by aeration porous chips 14, frame member 12 and matrix 11.
Matrix 11 is smooth shape member, and the square shape member that is had the area that can place the workpiece W integral body that will support conveying described later by bottom area at least constitutes, the outstanding frame member 12 that is provided with of the airtight shape of the most peripheral on matrix 11.
Aeration porous chips 14 can adopt for example have low frictional properties, the fluorine-type resin of non-cementability characteristic.In this case, aeration porous chips 14 thickness are for example 0.5mm.
Side forms the confined space 15 that is divided into by matrix 11, frame member 12 and each installation component 13 below aeration porous chips 14.This confined space 15 connecting can be from the pressurized gas supply source the 16 pipe arrangement L that supply with gas-pressurizeds.Also have, each confined space 15 is communicated with by the connected entrance H that is arranged on each installation component 13.
And, aeration porous chips 14 is when being supported by frame member 12, rib shape installation component 13, position convex by the support interdigit of installation component 13 supporting bloats so that from the gas hold-up of aeration porous chips 14 ejections by the space 17 on the position of installation component 13 supportings (with reference to Fig. 3).
In this case, aeration porous chips 14 and installation component 13 can be fixed by enough suitable fixing means.That is, aeration porous chips 14 and installation component 13 both can also can utilize bonding, deposited fixing by means of suitable mechanical fixation such as compressed component 18 usefulness bolts.
These fixed positions come specified altitude according to the height dimension of installation component 13, because aeration porous chips 14 convexs beyond these fixed positions bloat, so form the space 17 of delay gas of the state of the position depression that bloats as the bottom, than convex with fixed position.
Also have, this supporting arrangement 10, when installing on the installation component 13 of aeration porous chips 14 on matrix 11 of thickness for for example 0.5mm, the top interbody spacer of the aeration porous chips 14 that bloats with the convex of adjacency is made as 30mm as supporting spacing P.
Supply with the pressurized gas supply source 16 of gas-pressurizeds to confined space 15, is connected via pipe arrangement L by means of connecting elements 20 with supply hole 19, with the supply gas-pressurized at matrix 11 bottom center openings.
Also have, well-known formation can be adopted in pressurized gas supply source 16.
Have, supporting arrangement 10 as above is provided with suitable Work transfer device 21 as shown in Figure 1 and Figure 2 in both sides again.That is, Work transfer device 21 possesses the rotary pulley 21a that for example is configured in both ends, matrix 11 both sides and is wrapped in rotating band 21b between rotary pulley 21a, the 21a at both ends, both sides respectively.
Next work-supporting means 10 of the present invention as above formation illustrate its effect.
About the object that utilizes 10 supportings of this supporting arrangement to carry, be that workpiece W describes.This workpiece W is the circuitous pattern that is made of copper that forms thickness 30 μ m on the resin of for example thickness 50 μ m, and the quality of per unit area is 0.02g/cm
2
If on the aeration porous chips 14 on the installation component 13 on the matrix 11 that is installed on supporting arrangement 10, place this workpiece W, drive pressurized gas supply source 16, the supply hole 19 of gas-pressurized by matrix 11 bottom center then, supply in the confined space 15 that separates by matrix 11 and installation component 13 of side to aeration porous chips 14 below.Gas-pressurized can spread all over all confined spaces 15 ubiquitously by the connected entrance H that forms on installation component 13, can traverse whole aeration porous chips 14 ground and spray gas above aeration porous chips 14.
Possess minute aperture on 14 whole of the aeration porous chipses, thus gas by when have big aeration resistance.Thereby in confined space 15, the gas that flow is suppressed to trace sprays above aeration porous chips 14.
Along with the ejection of gas, gassy on aeration porous chips 14 and between the workpiece W, on aeration porous chips 14 position of depression, be to accumulate gas in the space 17, form gas blanket.
Workpiece W can be supported by these gas pressures.In this case, owing to possess minute aperture on 14 whole of the aeration porous chipses, on the other hand, space 17 does not spray the gas that the position sprays that bloats that gas but is detained to be had from the supporting position on every side, thereby, forming the whole roughly gas blanket of certain pressure, workpiece W is supported with stable status.
Also have, in the execution mode, workpiece W be a kind ofly on the resin of for example thickness 50 μ m, form the circuitous pattern that constitutes by copper of thickness 30 μ m, the quality of per unit area is 0.02g/cm
2Thin-film material, the gas-pressurized that utilizes 16 supplies of pressurized gas supply source is with pressure 0.1Mp feeding, porous materials such as antivibration metal Pm that adopts gas flow that sprays above aeration porous chips 14 and the existing apparatus and sintered plate Ps are that it roughly is 0.05NL/min/cm below 1/10 relatively
2, can carry out stable supporting with the support height T of 1.5mm.
Then, under this state, during conveying workpieces W, make the rotating band 21b that between rotary pulley 21a, 21a on the Work transfer device 21 that is disposed at both ends, matrix 11 both sides, twines respectively, as long as a little power just can be sent workpiece W along throughput direction work.
Also have, even workpiece W touches above the aeration porous chips 14 for some reason sometimes, because aeration porous chips 14 usefulness are soft and the fluorine-type resin of low frictional properties constitutes, thereby workpiece W can not have flaw yet.
Claims (6)
1. a work-supporting means is characterized in that, comprising:
Matrix (11);
Be configured in the frame member (12) on the matrix (11);
Be configured at least one installation component (13) on the inboard described matrix (11) of described frame member (12);
By described frame member (12) and described installation component (13) support ventilation porous chips (14);
To the pressurized gas supply source (16) of confined space (15) the supply gas-pressurized that marks off by described aeration porous chips (14), described frame member (12) and described matrix (11),
When utilizing described pressurized gas supply source (16) to supply with gas-pressurized, rely on from the gas holding workpieces (W) of described aeration porous chips (14) ejection, and,
Described aeration porous chips (14) bloats in the support interdigit convex by described installation component (13) supporting, so that from the space (17) of gas hold-up on the position of being supported by described installation component (13) of described aeration porous chips (14) ejection.
2. work-supporting means according to claim 1 is characterized in that,
Described installation component (13) is gone up at described matrix (11) and is constituted as rib portion.
3. work-supporting means according to claim 1 is characterized in that,
Described installation component (13) is gone up at described matrix (11) and is constituted as cylindrical portion.
4. according to any described work-supporting means in the claim 1～3, it is characterized in that,
Described confined space (15) is interconnected.
5. according to any described work-supporting means in the claim 1～3, it is characterized in that,
Described aeration porous chips (14) is made of fluorine-type resin.
6. according to any described work-supporting means in the claim 1～3, it is characterized in that,
Be provided with Work transfer device (21), this Work transfer device (21) contacts near workpiece (W) bearing-surface on the described aeration porous chips (14) and with workpiece (W), guides described workpiece (W) along throughput direction.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-310915 | 2007-11-30 | ||
| JP2007310915A JP4442685B2 (en) | 2007-11-30 | 2007-11-30 | Work support device |
| JP2007310915 | 2007-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101447445A CN101447445A (en) | 2009-06-03 |
| CN101447445B true CN101447445B (en) | 2010-09-29 |
Family
ID=40743012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101617060A Expired - Fee Related CN101447445B (en) | 2007-11-30 | 2008-09-22 | Workpiece supporting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4442685B2 (en) |
| KR (1) | KR101059617B1 (en) |
| CN (1) | CN101447445B (en) |
| TW (1) | TWI389240B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102923480A (en) * | 2011-08-12 | 2013-02-13 | 大银微***股份有限公司 | Pipeline integration structure of air-floating platform |
| JP6368508B2 (en) * | 2014-03-17 | 2018-08-01 | 東レエンジニアリング株式会社 | Substrate floating device |
| CN104150181B (en) * | 2014-07-24 | 2017-02-15 | 昆山龙腾光电有限公司 | Supporting seat and supporting device |
| CN110255189A (en) * | 2019-06-10 | 2019-09-20 | 安徽鸿玻玻璃科技有限公司 | A kind of loading attachment of special-shaped glass |
| CN111924541B (en) * | 2020-07-01 | 2021-12-07 | 山东聊城华阳医药辅料有限公司 | Pneumatic pipeline conveying device based on photosensitive resistance value characteristics |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000007151A (en) | 1998-06-17 | 2000-01-11 | Tabai Espec Corp | Work levitating structure |
| JP4543794B2 (en) | 2004-07-09 | 2010-09-15 | 国立大学法人東北大学 | Flat member conveying device |
| JP4414856B2 (en) | 2004-09-30 | 2010-02-10 | 大日本スクリーン製造株式会社 | Substrate storage device |
| JP2006264891A (en) | 2005-03-24 | 2006-10-05 | Shinko Electric Co Ltd | Noncontact substrate conveying device |
-
2007
- 2007-11-30 JP JP2007310915A patent/JP4442685B2/en not_active Expired - Fee Related
-
2008
- 2008-08-26 KR KR1020080083340A patent/KR101059617B1/en not_active IP Right Cessation
- 2008-08-29 TW TW097133366A patent/TWI389240B/en not_active IP Right Cessation
- 2008-09-22 CN CN2008101617060A patent/CN101447445B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090056797A (en) | 2009-06-03 |
| CN101447445A (en) | 2009-06-03 |
| KR101059617B1 (en) | 2011-08-25 |
| TWI389240B (en) | 2013-03-11 |
| TW200929424A (en) | 2009-07-01 |
| JP4442685B2 (en) | 2010-03-31 |
| JP2009135307A (en) | 2009-06-18 |
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