TWI387488B - Apparatus for jetting fluid - Google Patents
Apparatus for jetting fluid Download PDFInfo
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- TWI387488B TWI387488B TW096142825A TW96142825A TWI387488B TW I387488 B TWI387488 B TW I387488B TW 096142825 A TW096142825 A TW 096142825A TW 96142825 A TW96142825 A TW 96142825A TW I387488 B TWI387488 B TW I387488B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
- B05B3/02—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
- B05B3/10—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements discharging over substantially the whole periphery of the rotating member, i.e. the spraying being effected by centrifugal forces
- B05B3/1035—Driving means; Parts thereof, e.g. turbine, shaft, bearings
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- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
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- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Spray Control Apparatus (AREA)
- ing And Chemical Polishing (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
本發明涉及一種流體噴射裝置，尤其涉及一種適用於利用噴射流體而製造平板顯示面板基板之技術(etching、strip)中的流體噴射裝置，特別是基於噴嘴擺動(swing)動作的可變式噴射方式，而均勻供給流體之流體噴射裝置。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a fluid ejecting apparatus, and more particularly to a fluid ejecting apparatus suitable for use in a technique of manufacturing a flat panel display panel substrate by using a jetting fluid, in particular, a variable jetting method based on a nozzle swinging motion. And a fluid ejection device that uniformly supplies the fluid.
LCD等液晶顯示裝置一般利用隨著基於電信號之施加電壓而發生變化的液晶透射率來顯示影像信號，該液晶顯示裝置一般包括背光模組、液晶顯示面板及外殼。A liquid crystal display device such as an LCD generally displays a video signal by a liquid crystal transmittance that changes in accordance with an applied voltage of an electric signal. The liquid crystal display device generally includes a backlight module, a liquid crystal display panel, and a casing.
該液晶顯示面板使用具有多層結構的功能性薄膜的基板。該基板藉由薄膜蒸鍍製程、照相平版印刷製程、以及蝕刻及剝離製程而製造。其中，該照相平版印刷製程則對鍍膜進行曝光及顯影作業後形成光刻膠掩膜(photorrkask)圖案；該蝕刻及剝離製程則用於在基板上形成真正的薄膜圖案。The liquid crystal display panel uses a substrate having a functional film of a multilayer structure. The substrate is fabricated by a thin film evaporation process, a photolithography process, and an etching and stripping process. Wherein, the photolithography process forms a photoresist pattern after exposure and development of the coating; the etching and stripping process is used to form a real film pattern on the substrate.
在各該製程中，蝕刻及剝離製程為直接將具有預定圖案的功能性薄膜真正形成在基板上的製程，該製程則採用向基板噴射蝕刻液或剝離液等流體的公知方式。In each of the processes, the etching and stripping process is a process of directly forming a functional film having a predetermined pattern on a substrate, and the process employs a known method of ejecting a fluid such as an etching solution or a stripping liquid onto the substrate.
亦即，該蝕刻製程藉由蝕刻液的化學反應作用而在基板上留下薄膜的必要部分，並選擇性地去除不必要部分；而該剝離製程則利用剝離液去除蝕刻製程後殘留在基板蝕刻層上的光刻膠掩膜。That is, the etching process leaves a necessary portion of the film on the substrate by the chemical reaction of the etching solution, and selectively removes unnecessary portions; and the stripping process is performed by using a stripping solution to remove the etching process and remaining on the substrate. A photoresist mask on the layer.
因此，該蝕刻及剝離製程則在具有用於噴射蝕刻液或剝離液等流體的噴射裝置(噴射管及噴嘴)的作業槽內進行。其中，該噴射裝置的噴嘴位置或噴射角度對基板的蝕刻及剝離品質產生較大的影響。Therefore, the etching and peeling process is performed in a working tank having an ejection device (ejection tube and nozzle) for ejecting a fluid such as an etching liquid or a peeling liquid. Among them, the nozzle position or the ejection angle of the ejection device has a large influence on the etching and peeling quality of the substrate.
但是，絕大部分的噴射裝置採用的是固定噴嘴噴射流體的方式。這種結構在進行基板製造製程中蝕刻或剝離作業時存在以下缺點。However, most of the injection devices employ a means of injecting fluid from a fixed nozzle. This structure has the following disadvantages in etching or peeling work in the substrate manufacturing process.
首先，向基板噴射流體時，會使流體集中供給到各噴嘴的噴射角度所覆蓋的區域中。First, when a fluid is ejected to a substrate, the fluid is concentratedly supplied to a region covered by the ejection angle of each nozzle.
因此，在對基板進行蝕刻或剝離作業時，難以對基板的整個表面均勻噴射流體，因此在蝕刻或剝離作業後會產生過多的不良品。Therefore, when the substrate is etched or peeled off, it is difficult to uniformly eject the entire surface of the substrate, so that excessive defects are generated after the etching or peeling operation.
例如，若對基板的整個表面噴射的流體不均勻，則會使基板的蝕刻面呈不規則狀，或者難以從基板的整個表面順利去除殘留的光刻膠。For example, if the fluid ejected on the entire surface of the substrate is not uniform, the etched surface of the substrate may be irregular, or it may be difficult to smoothly remove the residual photoresist from the entire surface of the substrate.
而且，在該固定噴嘴之相隔配置狀態下，會導致相鄰噴嘴的噴射角度在基板上重疊的區域中供給過多流體的現象。Further, in the state in which the fixed nozzles are arranged, the phenomenon that the injection angle of the adjacent nozzles is supplied with excessive fluid in the region where the substrates overlap is caused.
因此，如果利用該固定式噴射裝置對基板進行蝕刻或剝離作業，則由於流體的供給不均勻，故難以獲得令人滿意的作業及生產效率。Therefore, if the substrate is etched or peeled off by the fixed ejection device, it is difficult to obtain satisfactory work and production efficiency due to uneven supply of the fluid.
鑒於現有技術中所存在的上述問題，本發明提供一種可對基板的整個表面上均勻供給流體的流體噴射裝置。該裝置通過噴嘴擺動動作，而實現可變式噴射方式。In view of the above problems in the prior art, the present invention provides a fluid ejecting apparatus which can uniformly supply a fluid to the entire surface of a substrate. The device realizes a variable injection mode by a nozzle swinging motion.
為了實現上述目的，本發明採取以下技術手段。本發明的流體噴射裝置包括：具有作業空間的作業槽；具有用於噴射流體的噴嘴且相隔配置在該作業空間的多個噴射管；與該噴射管相連接且藉由連桿運動使該噴嘴的噴射姿勢發生變化的動力傳遞機構；為使該動力傳遞機構進行連桿運動而產生動力的驅動源。In order to achieve the above object, the present invention adopts the following technical means. The fluid ejecting apparatus of the present invention includes: a working tank having a working space; a plurality of injection pipes having nozzles for ejecting fluid and disposed apart from the working space; and the nozzle is connected to the injection pipe and moved by the link A power transmission mechanism that changes a spray posture; a drive source that generates power for causing the power transmission mechanism to perform a link motion.
本發明的流體噴射裝置具備能夠在基板的製造技術中如蝕刻或剝離等需要噴灑流體之製程中，向基板的某一個表面的全部區域均勻噴射流體的機構，因此，可進一步提高作業效率。The fluid ejecting apparatus according to the present invention is provided with a mechanism capable of uniformly ejecting a fluid to all areas of one surface of a substrate in a process of spraying a fluid such as etching or peeling in a substrate manufacturing technique, so that work efficiency can be further improved.
特別是，該機構可使噴嘴在橫越基板的輸送方向上改變姿勢，並產生連續的擺動動作，從而藉由可變噴射方式來均勻噴射流體，因而，解決現有技術中利用固定噴嘴的固定式噴射方式所導致的品質問題。In particular, the mechanism can change the posture of the nozzle in the conveying direction across the substrate, and generate a continuous oscillating motion, thereby uniformly spraying the fluid by the variable injection method, thereby solving the prior art fixed type using the fixed nozzle. Quality problems caused by the spray method.
以下，參照附圖說明本發明的較佳具體實施例，並在本領域的技術人員能夠容易實施本發明的範圍內進行說明。由於本發明的具體實施例可以用多種形式加以實施，因此，本發明的申請專利範圍並不局限於下述具體實施例。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, and the description will be made within the scope of the present invention. Since the specific embodiments of the present invention can be implemented in various forms, the scope of the present invention is not limited to the specific embodiments described below.
圖1是本發明的一具體實施例所涉及的流體噴射裝置的整體結構示意圖。圖中元件符號2表示作業槽。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the overall configuration of a fluid ejecting apparatus according to an embodiment of the present invention. The symbol 2 in the figure indicates a work slot.
該作業槽2由常規結構構成，其內部具有作業空間S，可進行用於製造平板顯示器面板基板G(以下稱為基板)製程中的蝕刻(etching)或剝離(strip)作業。The working tank 2 is constituted by a conventional structure and has a working space S therein, and can perform an etching or stripping operation in a process for manufacturing a flat panel display panel substrate G (hereinafter referred to as a substrate).
該作業槽2的內部設有用於輸送基板G的輸送裝置4。A conveying device 4 for conveying the substrate G is provided inside the working tank 2.
該輸送裝置4採用包括多個輸送輥R的常規結構的輥筒式輸送機。The conveying device 4 employs a roller conveyor of a conventional structure including a plurality of conveying rollers R.
該輸送裝置4，可通過常規方法從電機(未圖示)接收動力以使該輸送輥R旋轉，並藉此從該作業空間S的左側向右側輸送基板G(以圖1為基準時)。The conveying device 4 can receive power from a motor (not shown) by a conventional method to rotate the conveying roller R, and thereby convey the substrate G from the left side to the right side of the working space S (when based on FIG. 1).
該基板G在其接受蝕刻或剝離處理的某一個被處理面G1朝上的狀態下，按照如圖1所示方式沿著該輸送裝置4移動。The substrate G is moved along the transport device 4 in a state as shown in FIG. 1 in a state in which one of the processed surfaces G1 subjected to etching or peeling treatment is directed upward.
另外，該本發明的一具體實施例所涉及的流體噴射裝置包括用於在該作業槽2的內部噴射流體W的多個噴射管P。Further, a fluid ejecting apparatus according to an embodiment of the present invention includes a plurality of ejecting tubes P for ejecting a fluid W inside the working tank 2.
該多個噴射管P中每一個分別具有一個以上噴嘴N，且如圖1所示，該噴射管P位於該作業空間S中該輸送裝置4的上方。Each of the plurality of injection pipes P has one or more nozzles N, and as shown in FIG. 1, the injection pipe P is located above the conveying device 4 in the working space S.
如圖2所示，該噴射管P在基板G輸送區的前後兩處地點相隔一定距離，並在基板G的移動方向上按照圖中所示方式進行排列。As shown in Fig. 2, the injection pipe P is spaced apart from each other at the front and rear positions of the substrate G transporting zone, and is arranged in the moving direction of the substrate G in the manner shown in the drawing.
這種結構與該噴射管P例如以橫越基板G移動方向之狀態而進行配置的結構(未圖示)相比，即使在基板G的輸送過程中發生時間差，也可在最大限度內減少流體W在基板G上之分佈不均勻現象。Such a configuration can reduce the fluid to the maximum extent even if a time difference occurs during the conveyance of the substrate G, compared with a configuration (not shown) in which the injection pipe P is disposed in a state of traversing the moving direction of the substrate G. The distribution of W on the substrate G is uneven.
該噴射管P，其內部具有流體流動通道，並且如圖3所示，與供給管L相連接。The injection pipe P has a fluid flow passage inside thereof, and is connected to the supply pipe L as shown in FIG.
而且，該供給管L與裝有流體W的儲存槽T相連接，從而，使得用於常規蝕刻或剝離作業的流體W從該儲存槽T供給到該噴射管P。Moreover, the supply pipe L is connected to the storage tank T containing the fluid W, so that the fluid W for the conventional etching or peeling operation is supplied from the storage tank T to the injection pipe P.
該噴嘴N在與該噴射管P的內部通道連通的狀態下結合在噴射管P的外表面，從而以預定壓力噴射供給到該噴射管P的流體W。The nozzle N is coupled to the outer surface of the injection pipe P in a state of being in communication with the internal passage of the injection pipe P, thereby injecting the fluid W supplied to the injection pipe P at a predetermined pressure.
如圖2所示，一個以上的噴嘴N結合於各該噴射管P上，且以呈“之”字型排列。該噴嘴N以可向沿該輸送裝置4移動的基板G上面噴射流體W的狀態下位在該作業空間S內部。As shown in FIG. 2, one or more nozzles N are coupled to the respective ejecting tubes P, and are arranged in a zigzag pattern. The nozzle N is positioned inside the working space S in a state where the fluid W can be ejected onto the substrate G moving along the conveying device 4.
雖然未圖示，結合於該噴射管P的噴嘴N具有能夠以輻射狀噴灑流體W的噴嘴孔。Although not shown, the nozzle N coupled to the injection pipe P has a nozzle hole capable of spraying the fluid W in a radial manner.
如圖1所示，該多個噴射管P的兩端分別***並固定於設置在該作業槽2內部的支架6之支承孔H內，使得噴射管P可以以其中心軸線為基準而旋轉。As shown in Fig. 1, both ends of the plurality of injection pipes P are inserted and fixed in the support holes H of the bracket 6 provided inside the work tank 2, so that the injection pipe P can be rotated with reference to its center axis.
各該支架6，其一端分別固定於該作業空間S上方，從而將各噴射管P以水平懸掛於該作業空間S上方的狀態進行固定及支承。Each of the brackets 6 is fixed to the upper side of the work space S, and each of the spray pipes P is fixed and supported in a state of being horizontally suspended above the work space S.
而且，如圖4所示，該支承孔H內可進一步安裝有軸承8。Further, as shown in FIG. 4, a bearing 8 can be further mounted in the support hole H.
該軸承8可使用常規的徑向軸承(radial bearing)，其用於支承該噴射管中被***的端部，以使該噴射管P的旋轉更為順利。The bearing 8 can use a conventional radial bearing for supporting the inserted end of the injection pipe to make the rotation of the injection pipe P smoother.
各該噴射管P在該作業空間S內部以其兩端分別***該支架6的狀態下獲得固定及支承，並且以其軸線為基準而旋轉。Each of the injection pipes P is fixed and supported in the working space S with its both ends inserted into the holder 6, and is rotated about the axis thereof.
本發明的一具體實施例所涉及的該流體噴射裝置包括動力傳遞機構10。The fluid ejection device according to an embodiment of the present invention includes a power transmission mechanism 10.
該動力傳遞機構10可傳遞動力，以使該多個噴射管P藉由連桿運動以其中心軸線為基準而旋轉。The power transmission mechanism 10 can transmit power to rotate the plurality of injection pipes P by the movement of the link with reference to the center axis thereof.
為此，如圖5所示，本具體實施例中設置有藉由該連桿14而與各該噴射管P的一端相連接的移動桿12，從而藉由該連桿14和移動桿12的連桿運動而傳遞動力。To this end, as shown in FIG. 5, in the present embodiment, a moving rod 12 connected to one end of each of the injection pipes P by the connecting rod 14 is provided, so that the connecting rod 14 and the moving rod 12 are The link moves to transmit power.
該移動桿12在該作業槽2中，橫越設置在於該基板G的輸送區域中前後配置的噴射管P之間。In the working tank 2, the moving rod 12 is placed between the injection pipes P disposed in the front and rear of the conveyance region of the substrate G.
而且，該連桿14的一端與該移動桿12鉸接，另一端與該噴射管P的一端固定連接。Further, one end of the link 14 is hinged to the moving rod 12, and the other end is fixedly coupled to one end of the injection pipe P.
以圖6為基準，在該移動桿12進行左右方向往返運動時，該連桿14的連接姿勢發生變化，從而進行連桿運動。而該動力傳遞機構10則藉由該連桿運動而使該每個噴射管P以其中心為基準而旋轉。With reference to Fig. 6, when the moving rod 12 reciprocates in the left-right direction, the connection posture of the link 14 changes, and the link motion is performed. The power transmission mechanism 10 rotates each of the injection pipes P based on the center thereof by the movement of the link.
本發明之一具體實施例所涉及的該流體噴射裝置包括驅動源M，其產生能夠驅使該動力傳遞機構10進行連桿運動的動力。The fluid ejection device according to an embodiment of the present invention includes a drive source M that generates power that can drive the power transmission mechanism 10 to perform link motion.
該驅動源M可使用常規的電機，並且如圖3所示，為了把動力傳遞到該移動桿12，該驅動源M與該移動桿12的某一端相連接並設置在該作業槽2的外側。The driving source M can use a conventional motor, and as shown in FIG. 3, in order to transmit power to the moving rod 12, the driving source M is connected to one end of the moving rod 12 and disposed outside the working tank 2. .
如圖6所示，該驅動源M可藉由旋轉盤16和聯結部件18，而向該移動桿12傳遞動力。As shown in FIG. 6, the drive source M can transmit power to the travel bar 12 by rotating the disk 16 and the coupling member 18.
該旋轉盤16的中心與該驅動源M的電機軸相連，而該聯結部件18的一端則固定連接於偏離該旋轉盤16中心的位置處。The center of the rotating disk 16 is connected to the motor shaft of the driving source M, and one end of the coupling member 18 is fixedly coupled to a position deviated from the center of the rotating disk 16.
而且，該聯結部件18的另一端固定連接在該移動桿12的一端。Moreover, the other end of the coupling member 18 is fixedly coupled to one end of the moving rod 12.
該聯結部件18可使用能夠改變連接角度之常規的萬向接頭(universal joint)，其兩端分別與該旋轉盤16和該移動桿12鉸接。The coupling member 18 can use a conventional universal joint capable of changing the connection angle, and its both ends are hinged to the rotary disk 16 and the moving rod 12, respectively.
該聯結部件18用於變換該旋轉盤16和該移動桿12的連接角度，從而順利傳遞動力。The coupling member 18 is used to change the connection angle of the rotating disk 16 and the moving rod 12, thereby smoothly transmitting power.
該旋轉盤16起到偏心盤作用，其根據該驅動源M所產生的旋轉動力，以其中心為基準而旋轉，從而向一個方向推拉該聯結部件18的一端。The rotary disk 16 functions as an eccentric disk that rotates in accordance with the center of the rotary member according to the rotational power generated by the drive source M to push and pull one end of the coupling member 18 in one direction.
亦即，以圖6為基準，當該驅動源M驅動時，該移動桿12藉由該聯結部件18的推拉力，而向左右方向進行一定位移之往返運動。That is, with reference to Fig. 6, when the driving source M is driven, the moving rod 12 performs a reciprocating movement of a certain displacement in the left-right direction by the pushing and pulling force of the coupling member 18.
而且，如上述，當該移動桿12進行直線往返運動時，該噴射管P藉由該連桿14的連桿運動而接收動力，從而以其中心軸線為基準而左右轉動，如圖7所示般。Further, as described above, when the moving rod 12 performs a linear reciprocating motion, the injection pipe P receives power by the link movement of the link 14, thereby rotating left and right with reference to its center axis, as shown in FIG. Like.
因此，該噴嘴N可藉由該噴射管P的轉動，而在一定的可變角度A範圍內改變其姿勢，以完成連續擺動動作。Therefore, the nozzle N can change its posture within a certain variable angle A by the rotation of the injection pipe P to complete the continuous swinging motion.
因此，可利用藉由結合於該噴射管P的多個噴嘴N的擺動動作所實現的可變式噴射方式，而對該作業空間S中所移動的基板G上表面進行蝕刻或剝離作業。Therefore, the upper surface of the substrate G moved in the work space S can be etched or peeled off by the variable injection method realized by the swing operation of the plurality of nozzles N coupled to the ejection tube P.
這種可變式噴射結構可解決利用具有多個固定噴嘴的現有噴射裝置進行蝕刻或剝離作業時，由於流體W對基板G的噴射量不均勻而引起的諸多問題。Such a variable ejection structure can solve various problems caused by the uneven injection amount of the fluid W to the substrate G when etching or peeling is performed by a conventional ejection device having a plurality of fixed nozzles.
而且，根據基板G的尺寸或作業環境，可適當調節該噴嘴N的可變噴射角度A，並在此狀態下進行噴射作業，因此可進一步提高作業相容性。Further, depending on the size of the substrate G or the working environment, the variable injection angle A of the nozzle N can be appropriately adjusted, and the ejection operation can be performed in this state, so that the work compatibility can be further improved.
另外，根據該移動桿12的往返移動間距，可適當調節該噴嘴N的可變角度A。Further, the variable angle A of the nozzle N can be appropriately adjusted in accordance with the reciprocating pitch of the moving rod 12.
例如，如果該移動桿12的往返移動間距設定得較長，該噴嘴N可變角度A就變大，反之亦然。For example, if the reciprocating movement pitch of the moving rod 12 is set longer, the nozzle N variable angle A becomes larger, and vice versa.
另外，該移動桿12的移動間距可藉由連接該聯結部件18的一端與該旋轉盤16而以調節偏心距離等方式而加以改變。In addition, the moving pitch of the moving rod 12 can be changed by connecting one end of the coupling member 18 and the rotating disk 16 to adjust the eccentric distance or the like.
上述內容中以驅動源M採用電機並藉由該電機的旋轉動力來使該動力傳遞機構10進行連桿運動的方式係為進行說明之例示，並把這種結構表現在圖中，但本發明並不局限於此。In the above description, the driving source M uses a motor and the power transmission mechanism 10 performs the link motion by the rotational power of the motor as an example for explanation, and the structure is shown in the figure, but the present invention Not limited to this.
例如，如圖8所示，該驅動源M1也可使用常規的氣缸。For example, as shown in FIG. 8, the drive source M1 can also use a conventional cylinder.
亦即，本發明也可以按照圖8所示方式連接氣缸的活塞桿及該動力傳遞機構10之移動桿12的一端，從而，藉由驅動氣缸而實現連桿運動。That is, the present invention can also connect the piston rod of the cylinder and one end of the moving rod 12 of the power transmission mechanism 10 in the manner shown in Fig. 8, thereby effecting the link movement by driving the cylinder.
這種動力傳遞方式直接連接氣缸的活塞桿，從而直接把直線移動動力傳遞到動力傳遞機構10。This power transmission mode directly connects the piston rod of the cylinder, thereby directly transmitting the linear moving power to the power transmission mechanism 10.
另外，雖然未圖示，除了電機或氣缸以外，還可以使用能夠滿足本發明目的的各種動力產生裝置。Further, although not shown, in addition to the motor or the cylinder, various power generating devices that can satisfy the object of the present invention can be used.
2．．．作業槽2. . . Job slot
4．．．輸送裝置4. . . Conveyor
6．．．支架6. . . support
8．．．軸承8. . . Bearing
10．．．動力傳遞機構10. . . Power transmission mechanism
12．．．移動桿12. . . Moving rod
14．．．連桿14. . . link
16．．．旋轉盤16. . . Rotating disk
18．．．聯結部件18. . . Coupling component
A．．．可變角度A. . . Variable angle
G(G1)．．．基板G(G1). . . Substrate
H．．．支承孔H. . . Support hole
L．．．供給管L. . . Supply tube
M(M1)．．．驅動源M(M1). . . Drive source
P．．．噴射管P. . . Jet tube
N．．．噴嘴N. . . nozzle
R．．．輸送輥R. . . Conveyor roller
S．．．作業空間S. . . Working space
T．．．儲存槽T. . . Storage tank
W．．．流體W. . . fluid
圖1是本發明的流體噴射裝置的整體結構示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the overall configuration of a fluid ejecting apparatus of the present invention.
圖2是用以說明本發明流體噴射裝置的噴射管排列狀態的示意圖。Fig. 2 is a schematic view for explaining an arrangement state of the injection pipes of the fluid ejecting apparatus of the present invention.
圖3是圖1所示流體噴射裝置的側剖視圖。Figure 3 is a side cross-sectional view of the fluid ejection device of Figure 1.
圖4是用以說明本發明流體噴射裝置的噴射管固定狀態的示意圖。Fig. 4 is a schematic view for explaining a state in which the injection pipe of the fluid ejecting apparatus of the present invention is fixed.
圖5是用以說明本發明流體噴射裝置的動力傳遞機構結構的示意圖。Fig. 5 is a schematic view for explaining the structure of a power transmission mechanism of the fluid ejection device of the present invention.
圖6是用以說明圖5所示動力傳遞機構作用之示意圖。Fig. 6 is a schematic view for explaining the action of the power transmission mechanism shown in Fig. 5.
圖7是用以說明在圖5所示動力傳遞機構作用下噴射管擺動狀態的示意圖。Fig. 7 is a schematic view for explaining a state in which the injection pipe is swung under the action of the power transmission mechanism shown in Fig. 5.
圖8是用以說明本發明流體噴射裝置之驅動源的另一具體實施例之示意圖。Fig. 8 is a schematic view showing another embodiment of a driving source of the fluid ejecting apparatus of the present invention.
2．．．作業槽2. . . Job slot
4．．．輸送裝置4. . . Conveyor
6．．．支架6. . . support
12．．．移動桿12. . . Moving rod
14．．．連桿14. . . link
G(G1)．．．基板G(G1). . . Substrate
N．．．噴嘴N. . . nozzle
P．．．噴射管P. . . Jet tube
R．．．輸送輥R. . . Conveyor roller
S．．．作業空間S. . . Working space
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070001069A KR20080064314A (en) | 2007-01-04 | 2007-01-04 | Apparatus for jetting fluid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200829338A TW200829338A (en) | 2008-07-16 |
| TWI387488B true TWI387488B (en) | 2013-03-01 |
Family
ID=39623124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096142825A TWI387488B (en) | 2007-01-04 | 2007-11-13 | Apparatus for jetting fluid |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20080064314A (en) |
| CN (1) | CN101216672B (en) |
| TW (1) | TWI387488B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101872953B1 (en) * | 2011-11-22 | 2018-08-02 | 세메스 주식회사 | Apparatus for spary |
| CN103207540A (en) * | 2012-01-13 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Developing machine spraying device realizing uniform and stable development |
| KR101338491B1 (en) * | 2012-04-27 | 2013-12-10 | (주)하나에프엠케이 | Apparatus to inject fluid for cleaning machine parts |
| CN106807563A (en) * | 2017-02-22 | 2017-06-09 | 南通市广益机电有限责任公司 | Atomization multidirectional rotary shower nozzle |
| CN109225713A (en) * | 2017-04-28 | 2019-01-18 | 均豪精密工业股份有限公司 | Platform-type flusher |
| CN109549589B (en) * | 2017-09-26 | 2021-10-26 | 青岛海尔洗碗机有限公司 | Spraying system and dish washing machine |
| CN108262208A (en) * | 2018-03-29 | 2018-07-10 | 蚌埠抒阳自动化设备制造有限公司 | One kind is used for door-plate machining production line |
| CN111085369A (en) * | 2020-01-17 | 2020-05-01 | 浙江万木新材料科技股份有限公司 | PVC is shower nozzle device for coated fabric |
| CN112091710A (en) * | 2020-08-11 | 2020-12-18 | 珠海格力电器股份有限公司 | Cleaning device and machine tool |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100451843C (en) * | 2000-01-21 | 2009-01-14 | 友达光电股份有限公司 | Liquid sprayer |
| JP3518676B2 (en) * | 2000-05-11 | 2004-04-12 | 東京化工機株式会社 | Surface treatment equipment for printed wiring board materials |
| JP4849199B2 (en) * | 2000-08-02 | 2012-01-11 | 永田醸造機械株式会社 | Cleaning device with nozzle moving in an arc |
| JP2003084125A (en) * | 2001-07-04 | 2003-03-19 | Seiko Epson Corp | Method and device for manufacturing color filter, method and device for manufacturing liquid crystal display device, method and device for manufacturing substrate for installing el (electroluminescence) light emitting layer, method and device for manufacturing el light emitting device, method and device for film forming |
| JP3922177B2 (en) * | 2002-02-12 | 2007-05-30 | セイコーエプソン株式会社 | Film forming method, film forming apparatus, droplet discharge apparatus, color filter manufacturing method, display apparatus manufacturing method |
| JP4244176B2 (en) * | 2002-10-25 | 2009-03-25 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| KR100618577B1 (en) * | 2002-11-13 | 2006-08-31 | 엘지.필립스 엘시디 주식회사 | Dispenser of liquid crystal display panel and dispensing method using the same |
| JP2004273984A (en) * | 2003-03-12 | 2004-09-30 | Dainippon Screen Mfg Co Ltd | Method and device for substrate processing |
| KR200404745Y1 (en) * | 2005-10-20 | 2005-12-27 | 주식회사 거송시스템 | Two-Fluid Injection Nozzle |
-
2007
- 2007-01-04 KR KR1020070001069A patent/KR20080064314A/en not_active Application Discontinuation
- 2007-11-13 TW TW096142825A patent/TWI387488B/en active
- 2007-11-29 CN CN2007101947352A patent/CN101216672B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101216672A (en) | 2008-07-09 |
| KR20080064314A (en) | 2008-07-09 |
| TW200829338A (en) | 2008-07-16 |
| CN101216672B (en) | 2011-12-28 |
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