TWI380466B - Solid illuminating element, solid illuminator, and method for manufacturing the solid illuminating element - Google Patents
Solid illuminating element, solid illuminator, and method for manufacturing the solid illuminating element Download PDFInfo
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- TWI380466B TWI380466B TW096151140A TW96151140A TWI380466B TW I380466 B TWI380466 B TW I380466B TW 096151140 A TW096151140 A TW 096151140A TW 96151140 A TW96151140 A TW 96151140A TW I380466 B TWI380466 B TW I380466B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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Description
13804661380466
1100年.11月24日梭正替換頁I 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及光學領域，尤其涉及一種固態發光元件，使 用該固態發光元件之固態發光器件及該固態發光元件之 製造方法。 【先前技術】 [0002] 目前，發光二極體（Light Emitting Diode, LED)作 為一種固態發光元件，因其具高亮度、長使用壽命、廣 色域（Wide Color Gamut)等特性而被廣泛應用於多種 領域之中。 [0003] 習知之發光二極體組件一般包括一發光二極體及一用於 插設所述發光二極體之固持座。 [0004] 所述發光二極體包括一基座、一透明封裝體、—發光二 極體晶片、及一對極性相反之電極。所述基座與透明封 裝體共同圍成一收容腔。所述發光二極體晶片設於基座 上並位於該收容腔内，且與所述電極之第—端部電性連 接。所述電極之第二端部貫穿基座並插設於固持座内， 與固持座内之一對供電電極電性連接以實現發光二極體 晶片與供電電極間之電性連接。 [0005] 上述發光二極體組件之組裝過程中，由於其發光二極體 之電極有正負極性之區分’故’操作人員在細裝該發光 二極體組件時需増加電極極性判別時間，導致人工成本 較高。 【發明内容】1100. November 24th Shuttle Replacement Page I VI. Description of the Invention: [Technical Field] [0001] The present invention relates to the field of optics, and more particularly to a solid state light emitting device, a solid state light emitting device using the solid state light emitting device, and A method of manufacturing the solid state light emitting device. [Prior Art] [0002] At present, a Light Emitting Diode (LED) is widely used as a solid-state light-emitting element because of its high brightness, long life, and Wide Color Gamut. In a variety of fields. [0003] A conventional light-emitting diode assembly generally includes a light-emitting diode and a holder for inserting the light-emitting diode. [0004] The light emitting diode includes a pedestal, a transparent package, a light emitting diode chip, and a pair of opposite polarity electrodes. The base and the transparent package together form a receiving cavity. The LED chip is disposed on the pedestal and located in the receiving cavity, and is electrically connected to the first end of the electrode. The second end of the electrode penetrates the base and is inserted into the holder, and is electrically connected to one of the holders to electrically connect the LED and the power supply electrode. [0005] In the assembly process of the above-mentioned light-emitting diode assembly, since the electrodes of the light-emitting diode have a distinction between positive and negative polarity, the operator needs to increase the polarity of the electrode when assembling the light-emitting diode assembly, resulting in an electrode polarity discrimination time. Labor costs are higher. [Summary of the Invention]
096151140 表單编號A0101 第4頁/共20頁 1003436627-0 1380466 [0006] 100年11月24日修正替換頁 下面將以實施例說明一種可快速判別正負極之固態發光 元件、一種採用該固態發光元件之固態發光器件，以及 一種該固態發光元件之製造方法。096151140 Form No. A0101 Page 4 / Total 20 Page 1003436627-0 1380466 [0006] Correction Replacement Page November 24, 100 A solid state light-emitting element capable of quickly discriminating between positive and negative electrodes will be described by way of example, and a solid-state light-emitting element is used. A solid state light emitting device of an element, and a method of manufacturing the solid state light emitting element.
[0007] 一種固態發光元件，包括封裝體、發光晶片、以及第一 及第二電極，所述發光晶片封裝於封裝體内，所述第一 及第二電極分別具有封裝於封裝體内且與發光晶片電性 連接之第一端部以及暴露於封裝體外之第二端部，所述 第一及第二電極其中之一之第二端部設有凸塊，使所述 第一及第二電極具有不同之外形。 [0008] 一種固態發光器件，其包括一固態發光元件及一固持座 ，所述固態發光元件包括封裝體、發光晶片、以及第一 及第二電極，所述發光晶片封裝於封裝體内，所述第一 及第二電極具有封裝於封裝體内且與發光晶片電性連接 之第一端部、以及暴露於封裝體外且插設於固持座内之 第二端部，所述固持座包括本體、位;^本體内且分別與 所述第一及第二電極相對應之第一及第二容置孔、以及 與所述第一及第二電極電性連接之供電電極，所述第一 及第二電極其中之一之第二端部設有可區分所述第一及 第二電極之凸塊，所述固持座之本體上設有與所述凸塊 相對應凹槽。 [0009] 一種固態發光元件之製造方法，包括：提供複數導線架 ，每一導線架包括第一及第二電極，所述各導線架之第 一及第二電極藉由-根連接桿連接成一整體，所述連接 桿包括位於單個導線架之第一及第二電極之間之第一桿 部、以及位於相鄰導線架之第一及第二電極之間之第二 096151140 表單编號 A0101 第 5 頁/共 20 頁 1003436627-0 .* · · 1380466 I loo年.11 月 zTj 桿部；將發光晶片固定至所述導線架上；打線，使所述 發光晶片分別與對應導線架之第一及第二電極電性連接 ;將所述發光晶片、以及第一及第二電極之與發光晶片 相連之端部封裝至封裝體内；部分切除所述連接桿，保 留第一桿部或第二桿部中與第一或第二電極相連之一部 分連接桿，在所述第一及第二電極其中之一上形成凸塊 ，使第一及第二電極具有不同之外形，得到所述固態發 光元件。[0007] A solid state light emitting device includes a package, a light emitting chip, and first and second electrodes, wherein the light emitting chip is packaged in a package, and the first and second electrodes are respectively packaged in a package body and a first end of the illuminating chip electrically connected and a second end exposed to the outside of the package, wherein the second end of one of the first and second electrodes is provided with a bump, so that the first and second The electrodes have different shapes. [0008] A solid state light emitting device comprising a solid state light emitting device and a holder, the solid state light emitting device comprising a package, a light emitting chip, and first and second electrodes, the light emitting chip being packaged in the package body The first and second electrodes have a first end portion that is encapsulated in the package and electrically connected to the light emitting chip, and a second end portion that is exposed outside the package and is inserted into the holder. The holder includes the body. And a first and second receiving holes respectively corresponding to the first and second electrodes, and a power supply electrode electrically connected to the first and second electrodes, the first And the second end of the second electrode is provided with a protrusion that can distinguish the first and second electrodes, and the body of the holding seat is provided with a groove corresponding to the protrusion. [0009] A method of manufacturing a solid state light emitting device, comprising: providing a plurality of lead frames, each lead frame comprising first and second electrodes, wherein the first and second electrodes of the lead frames are connected by a connecting rod Integrally, the connecting rod comprises a first rod portion between the first and second electrodes of the single lead frame, and a second 096151140 between the first and second electrodes of the adjacent lead frame. Form No. A0101 5 pages / total 20 pages 1003436627-0 .* · · 1380466 I loo years. November zTj rods; fixed illuminating wafers to the lead frame; wire, so that the illuminating wafer and the corresponding lead frame respectively And electrically connecting the second electrode; encapsulating the light emitting chip and the end of the first and second electrodes connected to the light emitting chip into the package; partially cutting the connecting rod to retain the first rod or the second a portion of the rod portion connected to the first or second electrode is connected to the rod, and a bump is formed on one of the first and second electrodes, so that the first and second electrodes have different shapes, and the solid state light is obtained element.
[0010] 所述固態發光元件中’由於凸k之設置’使得所述固態 發光元件之第一及第二電極具有不同之外形，從而使得 該固態發光元件之第一及第二電極可被快速地分別出來 ，進一步地，由於所述固態發光器件之固持座上設有對 應所述凸塊之凹槽，使得所述凸塊只能夠被安裝在對應 之凹槽内，可防止由於無法分辨第一及第二電極之極性 而產生之誤裝現象。 [實施方式】[0010] in the solid-state light-emitting element, 'the arrangement of the protrusions k' causes the first and second electrodes of the solid-state light-emitting element to have different shapes, so that the first and second electrodes of the solid-state light-emitting element can be quickly Further, since the recess of the solid-state light-emitting device is provided with a groove corresponding to the bump, the bump can only be installed in the corresponding groove, thereby preventing the inability to distinguish Misfit phenomenon caused by the polarity of the first and second electrodes. [Embodiment]
[0011] 下面將結合附圖對本發明實施例作進一步之詳細說明。 [0012] 本發明提供一種具有發光晶片之固態發光元件，以及具 有該固態發光元件之固態發光器件。該固態發光元件可 為半導體發光二極體（light emitting diode, LED) 、有機發光二極體（organic light emitting diode, OLED)等，相應地，該固態發光器件可為發光二極體組件 、有機發光二極體组件等。 [0013] 下面以發光二極體組件為例對該固態發光器件進行說明 〇 096151140 表單编號A0101 第6頁/共20頁 1003436627-0 1380466 100年.11月24日梭正替换頁 [0014] 圖1及圖2所示為一種發光二極體組件10，其包括：一發 光二極體12及一固持座14。 [0015] 所述發光二極體12包括封裝體122、發光二極體晶片124 、以及第一及第二電極125、126。 [0016] 所述封裝體122由環氧樹脂等透明塑膠製成。所述第一及’ 第二電極125、126由銅、鐵或金屬合金等導電材料製成 。其中，第一電極125之上端形成一碗杯127，該碗杯 127與第一電極125—體成型，所述發光二極體晶片124 • 設於該碗杯127内，可藉由銀膠128固定至該碗杯Ϊ27之 底部，並與發光二極體晶片124—起藉由射出成型之方式 被封裝至封裝體122内。所述第一及苐二電極125、126 之第一端部125a、126a埋設於封裝體122内，且分別通 過打線連接之方式與發光二極體12電i連接。所述第一 及第二電極125、126之第二端部125b、126b暴露於封裝 體122之外部，並延伸至所述固持座14内。 [0017] • 進一步地，為減少判別第一及第二電極125、126之極性 之時間，所述第一電極125在位於封裝體122下方且靠近 封裝體122之位置設有一凸塊125c，所述凸塊125c由第 一電極125向第二電極126凸伸且與第一電極125—體成 型，該凸塊125c沿第一電極125橫向之截面為矩形，即該 凸塊125c之橫截面為矩形。 [0018] 所述固持座14包括一本體142、一扣環143、第一及第二 容置孔145、146、以及一對供電電極147。 [0019] 所述扣環143為一裝設於固持座14之本體142上部之軟管 096151140 表單編號A0101 第7.頁/共20頁 1003436627-0 1380466 100年.11月24日核正替換頁 扣環，由塑膠、橡膠等彈性材料製成。可以理解地，所 述扣環143亦可以與固持座14之本體142 —體成型，由固 持座14之本體142之上端向上延伸形成^該扣環143之外 表面之上部向内凹陷，從而在扣環143之内表面之上部形 成一環狀之凸部143a，該凸部143a之直徑小於扣環143 之内表面之下端之直徑。可以理解地，該凸部143a可設 於扣環143之下部或扣環143之中部》 [0020][0011] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. The present invention provides a solid state light emitting device having a light emitting chip, and a solid state light emitting device having the solid state light emitting device. The solid state light emitting device may be a semiconductor light emitting diode (LED), an organic light emitting diode (OLED), or the like. Accordingly, the solid state light emitting device may be a light emitting diode component, organic Light-emitting diode components, etc. [0013] Hereinafter, the solid-state light emitting device will be described by taking a light-emitting diode assembly as an example. 〇096151140 Form No. A0101 Page 6/Total 20 Page 1003436627-0 1380466 100. November 24 Shuttle Replacement Page [0014] FIG. 1 and FIG. 2 show a light emitting diode assembly 10 including a light emitting diode 12 and a holding base 14. [0015] The light emitting diode 12 includes a package body 122, a light emitting diode chip 124, and first and second electrodes 125, 126. [0016] The package body 122 is made of a transparent plastic such as epoxy resin. The first and second electrodes 125, 126 are made of a conductive material such as copper, iron or a metal alloy. The upper end of the first electrode 125 forms a cup 127. The cup 127 is integrally formed with the first electrode 125. The LED chip 124 is disposed in the cup 127 and can be made of silver glue 128. It is fixed to the bottom of the cup holder 27 and is packaged into the package body 122 by injection molding together with the LED wafer 124. The first end portions 125a and 126a of the first and second electrodes 125 and 126 are embedded in the package body 122, and are electrically connected to the LEDs 12 by wire bonding. The second ends 125b, 126b of the first and second electrodes 125, 126 are exposed to the exterior of the package 122 and extend into the holder 14. [0017] Further, in order to reduce the time for determining the polarity of the first and second electrodes 125, 126, the first electrode 125 is provided with a bump 125c at a position below the package body 122 and close to the package body 122. The bump 125c protrudes from the first electrode 125 toward the second electrode 126 and is formed integrally with the first electrode 125. The protrusion 125c has a rectangular cross section along the lateral direction of the first electrode 125, that is, the cross section of the bump 125c is rectangle. [0018] The holder 14 includes a body 142, a buckle 143, first and second receiving holes 145, 146, and a pair of power supply electrodes 147. [0019] The buckle 143 is a hose 096151140 installed on the upper portion of the body 142 of the holding seat 14. Form No. A0101 Page 7. Total 20 pages 1003436627-0 1380466 100 years. November 24th nuclear replacement page The buckle is made of elastic material such as plastic or rubber. It can be understood that the buckle 143 can also be integrally formed with the body 142 of the retaining seat 14 , and the upper end of the body 142 of the retaining seat 14 extends upwardly to form an upper portion of the outer surface of the retaining ring 143 recessed inwardly. An upper portion of the inner surface of the buckle 143 is formed with an annular convex portion 143a having a diameter smaller than a diameter of a lower end of the inner surface of the buckle 143. It can be understood that the convex portion 143a can be disposed at the lower portion of the buckle 143 or the middle of the buckle 143" [0020]
請一併參閱圖3 ’所述第一及第二容置孔145、146設置在 本體142上’其分別對應發光二極體丨2之第一及第二電極 125、126,用以容置所述第一及第二電極125、126之第 二端部125b、126b。其中，第一容置孔145之上端還設 有一與第一電極125之凸塊125c相對應之凹槽145a (如 圖2所示），所述凹槽145a之深度不小於凸塊125c之高 度’且所述凹槽145a之橫截面之形狀與第一電極125之凸 部143a之橫截面之形狀大致相同。優選之，該凹槽i45a 之橫截面尺寸應略小於第一電極125之凸部143a之橫截面 尺寸，使第一電極125之凸部143a可藉由緊配合之方式收 容於凹槽145a内。 [0021] 所述供電電極147包括兩個夾持件147a，以及與該兩個夾 持件147a分別電性連接之電源線147b ;該供電電極147 經由部分暴露於本體142外之電源線147b與外部電源相連 以向發光二極體12供電。該兩個夾持件147a均可產生一 彈性夾持力’用以固持並電性連接分別插設於所述第一 及第二容置孔145、146内之發光二極體12之第一及第二 電極125、126 »該供電電極147埋設於本體142内，所述 096151140 表單编號A0101 第8頁/共20頁 1003436627-0 1380466 100年11月24日修正替換頁 供電電極147之夹持件147a之一部分分別延伸至所述第一 及第二容置孔145、146内，而其他部分則埋設於本體 142内。可以理解地，該兩個夾持件147a亦可全部嵌設於 所述第一及第二容置孔145、146内，其同樣可實現固持 並電性連接插設於所述第一及第二容置孔145、146内之 第一及第二電極125、126之目的。Referring to FIG. 3 together, the first and second receiving holes 145 and 146 are disposed on the body 142 and respectively correspond to the first and second electrodes 125 and 126 of the LED 丨2 for receiving Second ends 125b, 126b of the first and second electrodes 125, 126. The upper end of the first receiving hole 145 is further provided with a recess 145a (shown in FIG. 2) corresponding to the bump 125c of the first electrode 125. The depth of the recess 145a is not less than the height of the bump 125c. And the shape of the cross section of the groove 145a is substantially the same as the shape of the cross section of the convex portion 143a of the first electrode 125. Preferably, the cross-sectional dimension of the recess i45a is slightly smaller than the cross-sectional dimension of the convex portion 143a of the first electrode 125, so that the convex portion 143a of the first electrode 125 can be received in the recess 145a by a tight fit. [0021] The power supply electrode 147 includes two clamping members 147a, and a power supply line 147b electrically connected to the two clamping members 147a respectively; the power supply electrode 147 is via a power line 147b partially exposed to the outside of the body 142. An external power source is connected to supply power to the light emitting diode 12. The two clamping members 147a can generate an elastic clamping force for holding and electrically connecting the first of the LEDs 12 respectively inserted into the first and second receiving holes 145, 146. And the second electrode 125, 126 » the power supply electrode 147 is embedded in the body 142, the 096151140 form number A0101 page 8 / total 20 pages 1003436627-0 1380466 November 24, 2014 correction replacement page power supply electrode 147 clip One portion of the holder 147a extends into the first and second receiving holes 145, 146, respectively, while other portions are embedded in the body 142. It can be understood that the two clamping members 147a can also be fully embedded in the first and second receiving holes 145, 146, which can also be fixed and electrically connected to the first and the first The purpose of the first and second electrodes 125, 126 in the holes 145, 146 is accommodated.
[0022] 該發光二極體組件10之組裝過程中，首先，將該發光二 極體12置於所述固持座14之扣環143上，同時使該發光二 極體12之第一及第二電極125、126之一部分分别收容於 所述固持座14之第一及第二容置孔145、146内；其次， 按壓所述發光二極體12，使該發光二極體12沿固持座14 之扣環143向下滑動，直至該發光二極體12之封裝體122 之下表面與所述固持座14之本體142之上表面相接觸。此 時，發光二極體12之第一電極125之凸塊125c剛好收容 於固持座14之凹槽145a内；發光二極體12之第一電極 125之第二端部125b與第二電極126之第二端部126b剛好 在供電電極147之夾持件147a之彈性夾持力之作甩下被固 持於固持座14之第一及第二容置孔145、146内：，而該發 光二極體12之發光二極體晶片124則位於扣環143之最上 端之上方，以防止固持座14之扣環143遮擋發光二择體晶 片124所發出之可見光。 [0023] 在該發光二極體12沿固持座14之扣環143向下滑動之過程 中，該發光二極體12之封裝體122之外表面擠壓該固持座 14之凸部143a發生彈性變形而向外擴張，產生一沿徑向 之彈性變形力向内壓緊該發光二極體12之封裝體122，防 096151140 表單編號A0101 第9頁/共20頁 1003436627-0 1380466 100年11月24日梭正替換頁 止該發光二極體12由固持座14中脫落。該施加於封裝體 122上之彈性壓緊力配合固持座14之供電電極147對所述 第一及第二電極125、126之彈性夾持力、以及所述固持 座14之凹槽145a與第一電極125之凸塊125c之間之緊配 合力’將發光二極體12牢牢之裝設於固持座14上，防止 發光二極體12由固持座14中脫落。另外，由於所述固持 座14之扣環143與發光二極體12之封裝體122之外表面緊 密貼合，可防止外部之水汽進入該固持座14，與第一及 第二電極125 ' 126接觸而損壞第一及第二電極125、126 [0024] 上述發光二極體組件10中，由於凸塊125c之設置，使得 所述發光二極體12之第一及第二電極125、126具有不同 之外形’從而使得該發光二極體12之第一及第二電極125 、126可被快速地區分出來，進一步地，由於所述發光二 極體組件10之固持座14上設有對應所述凸塊125c之凹槽 145a ’使得所述凸塊125c只能夠被安裝在對應之凹槽 145a内’可防止由於無法分辨第一及第二電極丨25、126 · 之極性而產生之誤裝現象。 [0025] 本實施例中，凸塊125c由所述第一電極125處向第二電極 126凸伸。可以理解地，該凸塊丨25c亦可沿其他方向延伸 ’如由第一電極125處沿背離第二電極126之方向延伸， 或由第一電極125處沿與第一及第二電極125、126之連 線呈一定夾角之方向延伸。該凸塊125c之橫截面之形狀 不限於本實施例所示之矩形，其亦可以為其他形狀，如 圓形、半圓形、三角形、星形、正多邊形以及不規則形 096151140 表單編號A0101 第10頁/共20頁 1003436627-0 100年.11月24日按正替換頁 狀。當然’所述凸塊125c之數量亦不限於一個，其亦可 設置為多個凸塊125c。而且，所述凸塊125c亦不限於僅 設置在第一電極125上，其亦可設置在第二電極126上， 從而使第一及第二電極125、126具有不同之外形，以達 到判別第一及第二電極125、126之極性之目的。 本發明還提供一種固態發光元件之製造方法，下面參照 如圖4’以圖1及圖2中所示之發光二極體12之製造方法為 例對該固態發光元件之製造方法進行說明。 所述發光二極體12之製造方法包括： 提供一導線架模組20，該導線架模組20上設有複數導線 架22，各導線架22均包括一碗杯127、與該碗杯127—體 相連之第一電極125、以及與所述第一電極125相對且與 所述碗杯127相分離之第二電極126，所述第二電極126 與第一電極125相互平行且間隔一定距離，所述複數導線 架22藉由垂直於所述第一及第二電極125、126且與所述 第一及第二電極125、126之第二端部125b、126b相連之 第一連接桿24，以及平行於所述第一連接桿24且與所述 第一及第二電極125、126底端相連之第二連接桿26連接 成一整體，構成所述導線架模組20。其中，第一連接桿 24包括位於單個導線架22之第一及第二電極125、126間 之第一桿部24a、以及位於相鄰導線架22之第一及第二電 極125、126間之第二桿部24b ; 固晶’將舞數發光二極體晶片124藉由銀膠128分別固定 至所述複數導線架22之碗杯127之底部； 表單编號A0101 第1丨頁/共20頁 1003436627-0 1380466 100年11月24日修正替換頁 [0030] 打線’使所述複數發光二極體12分別與對應之第一及第 二電極125、126電性連接； [0031]封裝’將所述碗杯丨27、發光二極體晶片124、以及第一 及第二電極125、126之第一端部即第一及第二電極125 、126之位於第一連接桿24上方之部分藉由射出成型之方 式封裝至複數封裝體122内；[0022] In the assembly process of the LED assembly 10, first, the LED 12 is placed on the buckle 143 of the holder 14, and the first and the second of the LED 12 are simultaneously One of the two electrodes 125, 126 is respectively received in the first and second receiving holes 145, 146 of the holding seat 14; secondly, the light emitting diode 12 is pressed to make the light emitting diode 12 along the holding seat The buckle 143 of the 14 slides downward until the lower surface of the package 122 of the LED 12 is in contact with the upper surface of the body 142 of the holder 14. At this time, the bump 125c of the first electrode 125 of the LED 12 is just received in the recess 145a of the holder 14; the second end 125b and the second electrode 126 of the first electrode 125 of the LED 12 The second end portion 126b is held in the first and second receiving holes 145, 146 of the holding seat 14 just under the elastic clamping force of the clamping member 147a of the power supply electrode 147: The LED body 124 of the polar body 12 is located above the uppermost end of the buckle 143 to prevent the buckle 143 of the holding seat 14 from blocking the visible light emitted by the light-emitting diode 124. [0023] During the sliding of the LED 12 along the buckle 143 of the holder 14, the outer surface of the package 122 of the LED 12 is pressed against the convex portion 143a of the holder 14 to be elastic. Deformed and expanded outward to produce a package 122 that presses the LED 12 inwardly in a radial direction. 096151140 Form No. A0101 Page 9 of 20 1003436627-0 1380466 November 100 The 24th shuttle is replacing the page and the light-emitting diode 12 is detached from the holder 14. The elastic pressing force applied to the package body 122 cooperates with the elastic clamping force of the power supply electrode 147 of the holder 14 to the first and second electrodes 125, 126, and the groove 145a of the holder 14 The tight fitting force between the bumps 125c of the one electrode 125 securely mounts the light-emitting diode 12 on the holder 14, preventing the light-emitting diode 12 from coming off the holder 14. In addition, since the buckle 143 of the holding seat 14 and the outer surface of the package 122 of the LED 12 are in close contact, the external moisture can be prevented from entering the holder 14 and the first and second electrodes 125 126 Contacting and damaging the first and second electrodes 125, 126. [0024] In the above-described light emitting diode assembly 10, the first and second electrodes 125, 126 of the light emitting diode 12 have the arrangement of the bumps 125c. Different shapes" such that the first and second electrodes 125, 126 of the LED 12 can be quickly distinguished, and further, since the holder 14 of the LED assembly 10 is provided with a corresponding portion The recess 145a' of the bump 125c enables the bump 125c to be mounted only in the corresponding recess 145a' to prevent misassembly caused by the inability to distinguish the polarities of the first and second electrodes 丨25, 126. phenomenon. In the embodiment, the bump 125c protrudes from the first electrode 125 toward the second electrode 126. It can be understood that the bumps 25c can also extend in other directions as extending from the first electrode 125 in a direction away from the second electrode 126, or from the first electrode 125 along the first and second electrodes 125, The connection of 126 extends in a certain angle. The shape of the cross section of the bump 125c is not limited to the rectangular shape shown in this embodiment, and may be other shapes such as a circle, a semicircle, a triangle, a star, a regular polygon, and an irregular shape 096151140. Form No. A0101 10 pages / total 20 pages 1003436627-0 100 years. On November 24th, the page is replaced by positive. Of course, the number of the bumps 125c is not limited to one, and it may be set as a plurality of bumps 125c. Moreover, the bumps 125c are not limited to being disposed only on the first electrode 125, and may be disposed on the second electrode 126, so that the first and second electrodes 125, 126 have different shapes to achieve the discrimination. The purpose of the polarity of the first and second electrodes 125, 126. The present invention also provides a method of manufacturing a solid-state light-emitting device, and a method of manufacturing the solid-state light-emitting device will be described below with reference to a manufacturing method of the light-emitting diode 12 shown in Figs. 1 and 2 as an example. The manufacturing method of the LED 12 includes: providing a lead frame module 20, wherein the lead frame module 20 is provided with a plurality of lead frames 22, each lead frame 22 includes a bowl 127, and the cup 127 a first electrode 125 connected to the body, and a second electrode 126 opposite to the first electrode 125 and separated from the cup 127, the second electrode 126 and the first electrode 125 are parallel to each other and spaced apart by a certain distance The plurality of lead frames 22 are connected to the first connecting rod 24 perpendicular to the first and second electrodes 125, 126 and connected to the second ends 125b, 126b of the first and second electrodes 125, 126 And the second connecting rod 26 parallel to the first connecting rod 24 and connected to the bottom ends of the first and second electrodes 125, 126 are integrally connected to form the lead frame module 20. The first connecting rod 24 includes a first rod portion 24a between the first and second electrodes 125, 126 of the single lead frame 22, and between the first and second electrodes 125, 126 of the adjacent lead frame 22. The second rod portion 24b; the solid crystal 'fixes the dance light-emitting diode wafer 124 to the bottom of the cup 127 of the plurality of lead frames 22 by silver glue 128; Form No. A0101 Page 1 of 20 </ RTI> <RTIgt; a portion of the first end portion of the first and second electrodes 125, 126, the first and second electrodes 125, 126 of the first and second electrodes 125, 126, above the first connecting rod 24 Packaged into the plurality of packages 122 by injection molding;
[0032] 切除，完全切除第一連接桿24之各第二桿部24b，並部分 切除第一連接桿24之各第一桿部24a，保留各第一桿部 .24a之與第一電極125相連之一部分連接桿，同時切斷各 第一及第二電極125、126與第二連接桿26之間之連接， 使第二連接桿26由所述導線架模組2〇上脫離，並得到相 互分離之複數發光二極體12 » [0033] 可以理解地，切除之步驟中，亦可以保留各第一桿部24a 之與第二電極126相連之一部分連接桿。另外，亦可以完 全切除第一連接桿24之各第一桿部24a，而部分切除各第 一連接桿24之各第二桿部24b，保留第二桿部24b與第一 電極125或第二電極126相連的一部分。 [0034] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0035] 圖1係本發明一較佳實施例之固態發光器件之分解示意圖 096151140 表單编號A0101 第12頁/共20頁 1003436627-0 1380466 [0036] [0037] [0038] [0039][0032] cutting, completely cutting the second rod portions 24b of the first connecting rod 24, and partially cutting the first rod portions 24a of the first connecting rods 24, and retaining the first rod portions .24a and the first electrodes 125 One of the connecting rods is connected, and the connection between the first and second electrodes 125, 126 and the second connecting rod 26 is cut off, so that the second connecting rod 26 is detached from the lead frame module 2, and The plurality of light-emitting diodes 12 are separated from each other. [0033] It is understood that in the step of cutting, a portion of the connecting rods of the first rod portions 24a connected to the second electrode 126 may be retained. In addition, each of the first rod portions 24a of the first connecting rod 24 may be completely cut off, and the second rod portions 24b of the first connecting rods 24 are partially cut off, and the second rod portion 24b and the first electrode 125 or the second portion are retained. A portion of the electrode 126 is connected. [0034] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0035] FIG. 1 is an exploded perspective view of a solid state light emitting device according to a preferred embodiment of the present invention. 096151140 Form No. A0101 Page 12 of 20 1003436627-0 1380466 [0036] [0038] [0038] [0039]
[0040] [0041] [0042] [0043] [0044] [0045] [0046] [0047] [0048] [0049] [0050] [0051] 096151140 100年11月24日核正替換頁 圖2係圖1所示之固態發光器件之组裝示意圖。 圖3係本發明另一較佳實施例之固態發光器件之組裝示意 圖。 圖4係用於製造圖1之固態發光器件中一固態發光元件之 一導線架模組之示意圖。 【主要元件符號說明】 發光二極體組件：10 發光二極體：12 封裝體：122 發光二極體晶片：124 第一電極：125 第二電極：126 第一端部：125a、126a 第二端部：125b、126b 凸塊：125c 碗杯：127 銀膠：128 固持座：14 本體：142 表單編號A0101 第13頁/共20頁 1003436627-0 1380466 100年.11·月24日梭正替換頁 [0052] [0053] [0054] [0055] [0056] [0057] [0058] [0059] [0060] [0061] [0062] [0063] [0064] [0065] 扣環：143 凸部：143a 第一容置孔：145 凹槽：145a 第二容置孔：146 供電電極：147 爽持件.14 7 a 電源線：147b 導線架模組：20 導線架：22 第一連接桿：24 第一桿部：24a 第二桿部：24b 第二連接桿：26[0040] [0044] [0044] [0046] [0046] [0046] [0046] [0050] [0051] 096151140 November 24, 100 nuclear replacement page Figure 2 Figure 1 is a schematic view showing the assembly of the solid state light emitting device shown in Fig. 1. Fig. 3 is a schematic view showing the assembly of a solid state light emitting device according to another preferred embodiment of the present invention. Figure 4 is a schematic illustration of a leadframe module for fabricating a solid state light emitting device of the solid state light emitting device of Figure 1. [Main component symbol description] LED assembly: 10 LED: 12 Package: 122 LED: 124 First electrode: 125 Second electrode: 126 First end: 125a, 126a Second End: 125b, 126b Bump: 125c Bowl: 127 Silver: 128 Holder: 14 Body: 142 Form No. A0101 Page 13 of 20 1003436627-0 1380466 100.11. [0058] [0058] [0058] [0058] [0064] [0064] [0065] buckle: 143 convex: 143a First accommodating hole: 145 Groove: 145a Second accommodating hole: 146 Power supply electrode: 147 Saturation part. 14 7 a Power cord: 147b Lead frame module: 20 Lead frame: 22 First connecting rod: 24 First pole: 24a Second pole: 24b Second connecting rod: 26
096151140 表單编號A0101 第14頁/共20頁 1003436627-0096151140 Form No. A0101 Page 14 of 20 1003436627-0
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096151140A TWI380466B (en) | 2007-12-31 | 2007-12-31 | Solid illuminating element, solid illuminator, and method for manufacturing the solid illuminating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096151140A TWI380466B (en) | 2007-12-31 | 2007-12-31 | Solid illuminating element, solid illuminator, and method for manufacturing the solid illuminating element |
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| Publication Number | Publication Date |
|---|---|
| TW200929607A TW200929607A (en) | 2009-07-01 |
| TWI380466B true TWI380466B (en) | 2012-12-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109755220A (en) * | 2017-11-05 | 2019-05-14 | 新世纪光电股份有限公司 | Light emitting device and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109755220A (en) * | 2017-11-05 | 2019-05-14 | 新世纪光电股份有限公司 | Light emitting device and preparation method thereof |
| CN109755220B (en) * | 2017-11-05 | 2022-09-02 | 新世纪光电股份有限公司 | Light emitting device and method for manufacturing the same |
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| Publication number | Publication date |
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| TW200929607A (en) | 2009-07-01 |
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